GEIL is yet another company to undertake a green initiative with an appropriately branded product that appeals to the environment-conscious computer enthusiast (apparently the species does exist). After a similar line of memory kits with its DDR2 segment, GEIL announced four new dual-channel DDR3 memory kits based on capacity and speeds. The two come in 4 GB (2x 2 GB) and 2 GB (2x 1 GB) capacities, and two speeds each: PC3-8500 (DDR3 1066 MHz) and PC3-10660 (DDR3 1333 MHz). The biggest USP of these kits are that they offer JEDEC standard memory timings at module voltages 10~20 percent lower than JEDEC specifications. The PC3-10660 kits runs at 9-9-9-24, while the PC3-8500 ones do 8-8-8-20, both at a mere 1.3 V. This allows GEIL to do away with a heatspreader. The modules go through GEIL's rigorous quality-assurance testings and hence carry lifetime warranties. Another part of the green initiative is the product packing, which makes use of recycled paper, a trend which is catching up. GEIL will deck up shelves with these kits shortly, so you could know the price. Model number details follow:

• GG32GB1066C8DC - 2x 1 GB, PC3-8500, 8-8-8-20, 1.3 V
• GG34GB1066C8DC - 2x 2 GB, PC3-8500, 8-8-8-20, 1.3 V
• GG32GB1333C9DC - 2x 1 GB, PC3-10660, 9-9-9-24, 1.3 V
• GG32GB1333C9DC - 2x 2 GB, PC3-10660, 9-9-9-24, 1.3 V

Transcend Information (Transcend), a worldwide leader in storage and multimedia products, today released a new line of server-grade DDR3 ECC DIMM and Registered DIMM premium memory modules equipped with thermal sensors. This advanced innovation in thermal monitoring technology can greatly enhance memory reliability, efficiency, and overall system stability, making these new modules perfect for use in dedicated servers as well as workstations.
For high-end systems that constantly process huge amounts of data under non-stop operating conditions, CPU speed regulation and various other techniques to prevent overheating have become increasingly important in hardware design. In order to provide increased performance, Transcend now offers server-grade DDR3 modules that come equipped with an advanced thermal sensor. This allows motherboard chipsets to monitor the exact temperature of each memory module and adjust the memory load accordingly, ensuring the best possible system performance while at the same time protecting the DRAM modules from potentially catastrophic failure and compromised system stability.

Micron Technology today announced mass production of new NAND flash memory products using its award-winning 34-nanometer (nm) process technology. As consumers demand increased capacity to store more music, videos, photos, and applications in ever smaller portable electronic devices, manufacturers need a storage solution that delivers on capacity, performance, and size. Micron's new 16- and 32-gigabit (Gb) NAND chips pair large capacity with performance, providing a compelling solution for today's demanding portable storage requirements that are tailored to end-customer product dimensions.
The newly architected 32Gb multi-level cell (MLC) NAND chip is 17 percent smaller than Micron's first-generation 32Gb chip. The 16Gb MLC NAND chip, at just 84mm², provides high-capacity in an ultra tiny package. Micron is also now sampling 8- and 16Gb single-level cell (SLC) NAND chips using the 34nm process.

Samsung Electronics, the world leader in advanced memory technology, announced today that it has developed the world's first 32 Gigabyte (GB) DDR3 module - for use in server systems. The new module operates at 1.35-volts, in support of the global trend to cut power usage in mass storage computing environments.
"Compared to the 8GB memory modules used in today's servers, our new module packs an eco-sensitive wallop with four times the density at significantly reduced power levels and no increase in the overall footprint," said Jim Elliott, vice president, memory marketing, Samsung Semiconductor, Inc. "For data centers, it's a powerhouse in energy efficiency and performance," he added.

Modern portable USB flash drives tend to become equal in capacity to solid-state drives, as Patriot Memory is today introducing its highest-capacity flash drive yet, the 128 GB Xporter Magnum. With more than twice the capacity of most USB drives, the Xporter Magnum features a USB 2.0 high speed interface, is Windows ReadyBoost ready, and provides read speed of up to 31 MB/s. Constructed with a durable water and shock resistant housing and backed by a lifetime warranty, the Xporter XT Boost ranks among the best offerings users can find. The 128 GB Patriot Xporter Magnum drive is yet to be priced.

Corsair, a worldwide leader in high-performance computer memory, power supplies and flash memory products, including solid-state drives, today announced the launch of Corsair Extended Cooling Fins for triple-channel Dominator and Dominator GT memory kits using Corsair's DHX+ technology.
Corsair memory modules using DHX+ (Dual-path Heat eXchange) technology - a patent-pending cooling approach that uniquely removes heat from both the memory ICs and print circuit board - feature removal cooling fins that allow for modular cooling accessories to be fitted. These include the recently-announced Hydro Series H30 water-block and Ice Series T30 thermo-electric cooler, which are now joined by the extended cooling fins.

We got a good look at the new Colossus SSD from OCZ today. It is a 3.5 inch version, which is available with up to an one TB capacity. It combines two identical SSDs in a RAID 0 array with up to 256MB/s read and write performance and a hefty price tag.

Taipei-based Team Group has just announced the addition of two new triple channel memory kits to its Xtreem series product line-up. The upcoming 3 and 6GB PC3-16000 overclocking-ready kits are made up of modules equipped with black aluminum heatsinks with a exquisite texture and a distinctive X-logo design. They are rated at 2000 MHz with 7-8-7-20 latencies at 1.65V. The kits support XMP (Extreme Memory Profiles) and are backed by a lifetime warranty.

The current No. 3 global memory maker Micron Technology is said to enter the graphics memory business, fighting against Samsung and Hynix. Micron will make the chips mainly for NVIDIA and ATI video cards.
"Our upcoming 50-nanometer technology is very competitive when it comes to power consumption and performance," Robert Feurle, Micron's VP of DRAM marketing said. "I think it's a good point in time to begin discussions with big enablers NVIDIA and AMD and get started with some design-ins," Feurle said. "No decision has been made yet but we're looking into that very seriously," he added.
Plans are to start production of GDDR3 memory with speeds of 1600 MHz and up. After that a possible transition to GDDR5 manufacturing will be made. Unfortunately, that's all there is to know for now, Micron is mum on all other details.

Patriot Memory today starts offering high-performance unbuffered DDR3 DIMMs with ECC for servers. Designed to compliment the triple channel technology of Intel's Core i7 platform, Patriot's new products offer both single channel and triple-channel kits that range from 2 GB on a single module and exceed 12 GB on three 4 GB modules. All modules are also covered by a lifetime warranty and free technical support.

OCZ Technology Group, a worldwide leader in innovative, ultra-high performance and high reliability memory, today expanded their lineup of DDR2 to include new high-speed 4 GB kits qualified to operate and excel at a low voltages. These new OCZ solutions are designed to be the ultimate upgrade for users who not only want to reap the benefits of performance memory, but want a future-proof choice for their system.
"Though enthusiasts are known for applying increased voltage to modules in order to obtain higher performance, our newest modules offer exceptional speeds at lower voltages improving overall performance and stability," commented Eugene Chang, Vice President of Product Management at the OCZ Technology Group. "By engineering modules with both high speed and reduced voltage requirements we are able to offer enthusiasts and gamers memory with increased headroom and overall better stability and performance over the long term."

Corsair, the worldwide leader in high performance computer and flash memory products, today announced the new Corsair Cooling range of advanced cooling solutions for Dominator and Dominator GT modules, including the world's first sub-ambient cooler for PC memory.

The new cooling solutions include the Corsair Cooling Hydro Series H30 water-block and Ice Series T30 thermo-electric cooler, which is capable of cooling memory to below room temperature for enhanced overclocking performance and reliability.

Samsung Electronics Co., Ltd., the world leader in advanced semiconductor technology solutions, announced shipment of its 32-Gigabyte (GB) moviNAND, the highest density embedded memory card utilizing advanced 30-nanometer (nm) class process technology. Use of high-density embedded memory improves the performance of high-end phones and other mobile consumer electronics when processing and storing large amounts of multimedia content such as videos, video games and TV broadcasts.

The 32 GB moviNAND is the first embedded memory card to use 32 Gigabit (Gb) NAND devices produced with 30nm-class process technology. The new Samsung card doubles the density of the previous generation of moviNAND that is now being produced with 16 Gb 40nm-class NAND chips.

Patriot Memory, a global pioneer in high performance memory, NAND flash and computer technology, today announced their DDR2 4GB and 8GB SODIMM mobile solutions to answer the need of extreme mobile computing.

"The performance gap between mobile and desktop computing has reduced significantly over the recent introduction of more powerful mobile platforms," commented Les Henry, Director of Engineering at Patriot, "By adding Patriot's DDR2 4GB module or 8GB in dual channel mode, mobile systems can eliminate that gap and perform like a true desktop replacement."

OCZ Technology Group, a worldwide leader in innovative, ultra-high performance and high reliability memory, today expanded their memory lineup for AMD enthusiasts and power users with new DDR3 kits qualified and optimized specifically for the AM3 platform. The new low-voltage kits were designed exclusively for AMD's transition to DDR3 and are tailored to make full use of the latest computing environments as well as establish a future-proof system with restricted voltage requirements.

"AMD's new AM3 architecture is designed specifically for the gaming community, with emphasis on high data transfer rates between the system memory and the graphics subsystem," commented Dr. Michael Schuette, VP of Technology Development at OCZ. "The key improvement over the AM2 platform is the embracing of DDR3 technology where OCZ has a track record of being a market leader. These new AMD kits further establish our leading role in this category and show our commitment to both industry partners and the gaming community by complementing AMD's gaming platform with future-oriented, low voltage memory technology."

A-DATA Technology Co., Ltd., a worldwide leader in high performance memory products, today introduced its newly speed of XPG Gaming Series DRAM module in DDR2-1066, as dual channel 2GBx2/1GBx2 and single channel kits up to 2GB. Designed for consumers who want to enhance their gaming ability, the XPG Gaming Series DDR2-1066G DRAM module provide CL6-6-6-18 timing at 2.0V±0.1V to delivering outstanding performance, speed, and gamer experience.

Optimized for the latest gaming platform, the XPG Gaming Series DDR2-1066G DRAM module delivers the perfect blend of performance, durability, and stability with low power consumption. It is an affordable midrange offering for gamer of all levels and the professionals demanding the latest DDR2 technology.

OCZ Technology Group, a worldwide leader in innovative, ultra-high performance and high reliability memory, is pleased to be one of the first to offer Intel Extreme SODIMM modules to the enthusiast market. These memory solutions implement a high-performance specification optimized and predefined for platforms utilizing Intel Core 2 Extreme mobile processors. Extending beyond a traditional capacity upgrade for high-end gaming and professional laptops, OCZ's XMP SODIMMs offer superior performance qualified by Intel for ultimate compatibility and stability.

Patriot Memory, a global provider of premium quality memory modules and flash memory solutions, today announced their DDR3 12 GB Tri-Channel Viper kit.

Designed specifically for the Intel Core i7 processor/Intel X58 Express Chipset, the Patriot Viper 12 GB kit has been built to excel for the Core i7 triple channel tehcnology. The Patriot Viper 12 GB are hand tested extensively on X58 motherboards to ensure maximum compatibility and supreme quality. The kits will be offered in 1333 MHz and come in both CL7 and CL9. "With all memory slots utilized in all three channels, the Core i7 brings the effectiveness of a server to mainstream desktops, and for a fraction of the price, says Benny Chea, Patriot Memory's Applications Engineer. Mr. Chea went on to say, "Multi-applications users will appreciate the increased bandwidth."

Micron Technology, today announced that its suite of DDR3 server memory modules are validated with Intel's next-generation Intel Xeon processor chips. Micron's validated 1, 2, 4 and 8-gigabyte (GB) DDR3 modules are performance-driven, delivering speeds of 1066 megabits per second (Mb/s) and 1333 Mb/s, greatly increasing server throughput. Additionally, Lexar Media, a wholly-owned subsidiary of Micron, has validated its corresponding Crucial-branded modules, leveraging Micron's award-winning DDR3 memory.

Rambus Inc., one of the world's premier technology licensing companies specializing in high-speed memory architectures, today announced it has acquired a number of patents from Inapac Technology, Inc. to broaden its offerings for the mobile memory market. These patented innovations complement the high-bandwidth, low-power memory technologies developed by Rambus as part of its Mobile Memory Initiative, announced earlier this year. Specific terms of the deal are not disclosed.
These newly acquired patented innovations are key enablers for achieving high manufacturing yields in System-in-Package (SiP) implementations. SiP consists of a number of stacked integrated circuits (IC) - such as a media processor, DRAM, and Flash memory device - enclosed in a single package or module. This technology allows designers to achieve high functionality in a very compact space, ideal for mobile products such as mobile phones and mobile gaming devices. Given its performance characteristics, SiP has applicability in computing and consumer electronics products as well.

Geil has announced the launch of its EVO ONE DDR3 gaming memory series. Both dual and triple channel memory kits will be available, ranging from 2 GB (2x 1GB sticks) in dual channel to 6 GB (3x 2GB sticks) in triple channel.

All memory kits feature Geil's EVO One Heatspreader with MTCD technology.

Elpida Memory (Elpida), Japan's leading global supplier of Dynamic Random Access Memory (DRAM), today announced that it has begun mass production of the industry's highest density 2-gigabit Mobile RAM using 50 nm process technology at its Hiroshima fab.
Mobile RAM is an ultra low-power memory that is ideal for use in mobile phones and other portable devices and requires extremely advanced technology for development and production. As a leading supplier of mobile DRAM, Elpida has managed to quickly establish a full-scale 50 nm Mobile RAM production system using ArF immersion lithography and copper interconnect technology.

ATI Radeon specialist Sapphire is preparing a new SKU based on its recently unveiled cooler design based on its Vapor-Chamber technology. In an attempt to step up performance and spicing up specifications sheets, the company plans to load 2 GB of GDDR5 memory on an HD 4870 accelerator. To hold that much memory, GDDR5 chips are populated on both sides of the PCB. The chips on the back of the card are cooled by a heatsink, while the ones in the front are subjected to the fan's air-flow. The card uses reference AMD clock speeds of 750/900 MHz (core/memory). DVI, D-Sub and DisplayPort make for the card's connectivity. It is expected to be priced at 258 EUR.

Swayed by all the recently released "Green" products, GeIL today launched a series of green DDR2 memory modules rated to work at 1.6V, lower than the standard 1.8V. Also, the packaging of the Green Series is said to be made of recycled paper pulp. All modules are enhanced with a lifetime warranty as well.

Patriot Memory, a global provider of premium memory module and flash memory solutions, announced today the release of their DDR2 Quad Channel 8GB Kits.

In today's complex, multi-task world, it is becoming increasingly important to be able to switch between scenerios, and still maintain enough memory to run multiple applications," says Saeed Arash Far, Patriot Memory's Technical Marketing Engineering Manager.