IBASE Technology Inc. (TPEx: 8050), IBASE, a leading provider of industrial motherboards and embedded systems, launches its latest 3.5" SBC IB953 powered by 11th Gen Intel Core processors (codenamed Tiger Lake). Measuring 146 x 102 mm in a compact footprint, the single board computer offers impressive I/O and computing performance, making it an ideal platform for a broad range of demanding applications in factory automation, machine vision, healthcare, as well as retail environments.

The IB953 features a 5G compatible M.2 3052 socket and the latest 11th Gen. Intel Core and Celeron processors built on 10 nm SuperFin process, delivering up to 25% faster performance and greater AI acceleration. With the Intel Core i7-1185G7 (IBASE model IB953AF-I7) comes the new Iris Xe (Xe-LP) graphics architecture supporting 96 EUs (Execution Units) which equals 768 cores and runs at 1.35 GHz, an increase of 250 MHz over the previous 11-gen graphics to provide up to twice the performance and improved power efficiency. The graphics engine's hardware acceleration can drive up to four simultaneous 4K HDR displays (via 2x DisplayPort + eDP and LVDS).

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices today, announces the latest B560MX-E PRO and B560MH-E PRO motherboards. Designed to support Intel's 10th/11th Generation Intel Core Processors and professional graphics cards, the new B560 series motherboards are highly versatile. Powered by Intel's B560 chipset, these two new motherboards are efficient and robust in any use case.

PCI-e 4.0 and PCIe M.2 4.0 & M.2 Cooling, among other cutting-edge technology, adds up to a great platform, tailor-made for business or even casual use. The two new motherboards support up to 128 GB of DDR4 memory across 4 DIMM with an overclocking capability of up to 4000+(OC)MHz. Backed by BIOSTAR's proprietary Digital PWM technology, the new B560MX-E PRO, and B560MH-E PRO motherboards are safe and long-lasting, capable of supporting the best hardware with ease. Both motherboards pack all the essentials in their rear I/O panel with almost identical layouts on a Micro-ATX form factor.

Intel has just launched its Ice Lake-SP lineup of Xeon Scalable processors, featuring the new Sunny Cove CPU core design. Built on the 10 nm node, these processors represent Intel's first 10 nm shipping product designed for enterprise. However, there is another 10 nm product going to be released for enterprise users. Intel is already preparing the Sapphire Rapids generation of Xeon processors and today we get to see more details about it. Thanks to the anonymous tip that VideoCardz received, we have a bit more details like core count, memory configurations, and connectivity options. And Sapphire Rapids is shaping up to be a very competitive platform. Do note that the slide is a bit older, however, it contains useful information.

The lineup will top at 56 cores with 112 threads, where this processor will carry a TDP of 350 Watts, notably higher than its predecessors. Perhaps one of the most interesting notes from the slide is the department of memory. The new platform will make a debut of DDR5 standard and bring higher capacities with higher speeds. Along with the new protocol, the chiplet design of Sapphire Rapids will bring HBM2E memory to CPUs, with up to 64 GBs of it per socket/processor. The PCIe 5.0 standard will also be present with 80 lanes, accompanying four Intel UPI 2.0 links. Intel is also supposed to extend the x86_64 configuration here with AMX/TMUL extensions for better INT8 and BFloat16 processing.

The 11th Gen Intel Core S-series desktop processors (code-named "Rocket Lake-S") launched worldwide today, led by the flagship Intel Core i9-11900K. Reaching speeds of up to 5.30 GHz with Intel Thermal Velocity Boost, the Intel Core i9-11900K delivers even more performance to gamers and PC enthusiasts.

Engineered on the new Cypress Cove architecture, 11th Gen Intel Core S-series desktop processors are designed to transform hardware and software efficiency and increase raw gaming performance​. The new architecture brings up to 19% gen-over-gen instructions per cycle (IPC) improvement for the highest frequency cores and adds Intel UHD graphics featuring the Intel Xe graphics architecture for rich media and intelligent graphics capabilities. That matters because games and most applications continue to depend on high-frequency cores to drive high frame rates and low latency.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices today, announces that their Z490 series motherboards are ready to support the latest Intel 11th gen Rocket Lake processors.

In anticipation of the imminent launch of Intel's 11th gen processors, BIOSTAR has wasted no time in preparing their products to support the new chips. The Z490 series motherboards, which consists of 5 models (RACING Z490GTA EVO, RACING Z490GTA, RACING Z490GTN, Z490A-SILVER and Z490T-SILVER) have received optimized BIOS updates (ME 14.1) to support the 11th gen Intel processors and can be easily updated just by downloading and installing the new BIOS patch from the official product page.

As we are getting closer to the launch of Intel's next-generation Alder Lake processors, more information is getting leaked. Today, thanks to the leaked presentation slide, we have some more details regarding Intel's Alder Lake offerings in the laptop sector. As a reminder, Alder Lake uses a hybrid approach to core configuration with the similar mindset Arm's big.LITTLE works. There are a few smaller cores for processing smaller tasks that don't need much power and, of course, there are a few big cores that are used for heavyweight processing as some advanced applications require. The small cores are going to be based on the Gracemont microarchitecture, while the big one will use the Golden Cove design.

Thanks to @9550pro on Twitter, we have a slide that showcases 19 different Alder Lake configurations for the laptop segment. At the very bottom, there are configurations with a TDP of just five Watts. That is achieved by having just one big, four smaller cores, 48 EU Gen 12 GPU and that is meant for the tablet segment. Going up, we have different ranges depending on the application device, and the highest end is a chip with 55 Watts of power. That model has eight small and eight big cores, combined with 32 EUs of Gen 12 graphics. All models include integrated graphics. The variations of big and small cores have allowed Intel to have as many as 19 different SKUs, that cover every segment needed, by simply balancing the core count. You can check out the rest of the models below for yourself.

AMD today announced that its 3rd generation EPYC enterprise processors will launch on March 15, 2021. Codenamed "Milan," these processors are expected to leverage the company's latest "Zen 3" CPU microarchitecture to significantly increase IPC (single-threaded performance), and retain compatibility with the the SP3 socket. AMD set up a micro-site where it will stream the 3rd Gen EPYC processor launch event on March 15, at 11 ET (16:00 UTC). "Milan" is rumored to be AMD's final processor architecture on this socket, before transitioning to SP5 and the next-gen processor codenamed "Genoa," sometime in 2022. "Genoa" marks a switch to next-gen I/O such as DDR5 memory and PCIe gen 5.0, along with an increase in CPU core counts.

Back in February, NVIDIA has announced its GPU SKUs dedicated to the cryptocurrency mining task, without any graphics outputs present on the chips. Today, we are getting information that AMD is rumored to introduce its own lineup of graphics cards dedicated to cryptocurrency mining. In the latest patch for AMD Direct Rendering Manager (DRM), a subsystem of the Linux kernel responsible for interfacing with GPUs, we see the appearance of the Navi 12. This GPU SKU was not used for anything except Apple's Mac devices in a form of Radeon Pro 5600M GPU. However, it seems like the Navi 12 could join forces with Navi 10 GPU SKU and become a part of special "blockchain" GPUs.

Way back in November, popular hardware leaker, KOMACHI, has noted that AMD is preparing three additional Radeon SKUs called Radeon RX 5700XTB, RX 5700B, and RX 5500XTB. The "B" added to the end of each name is denoting the blockchain revision, made specifically for crypto-mining. When it comes to specifications of the upcoming mining-specific AMD GPUs, we know that both use first-generation RDNA architecture and have 2560 Stream Processors (40 Compute Units). Memory configuration for these cards remains unknown, as AMD surely won't be putting HBM2 stacks for mining like it did with Navi 12 GPU. All that remains is to wait and see what AMD announces in the coming months.

AMD is readying its upcoming EPYC processors based on the refined Zen 3 core. Codenamed "Milan", the processor generation is supposed to bring the same number of PCIe lanes and quite possibly similar memory support. The pricing, along with the specifications, has been leaked and now we have information on every model ranging from eight cores to the whopping 64 cores. Thanks to @momomo_us on Twitter, we got ahold of Canadian pricing leaked on the Dell Canada website. Starting from the cheapest design listed here (many are missing here), you would be looking at the EPYC 7543 processor with 32 cores running at 2.8 GHz speed, 256 MB of L3 cache, and a TDP of 225 Watts. Such a processor will set you back as much as 2579.69 CAD, which is cheaper compared to the previous generation EPYC 7542 that costs 3214.70 CAD.

Whatever this represents more aggressive pricing to position itself better against the competition, we do not know. The same strategy is applied with the 64 core AMD EPYC 7763 processor (2.45 GHz speed, 256 MB cache, 280 W TDP) as the new Zen 3 based design is priced at 8069.69 CAD, which is cheaper than the 8180.10 CAD price tag of AMD EPYC 7762 CPU.

Today, AMD (NASDAQ: AMD) announced the full portfolio of AMD Ryzen 5000 Series Mobile Processors, bringing the highly-efficient and extremely powerful "Zen 3" core architecture to the laptop market. New AMD Ryzen 5000 Series Mobile Processors provide unprecedented levels of performance and incredible battery life for gamers, creators, and professionals. New laptops powered by Ryzen 5000 Series Mobile processors will be available from major PC manufacturers including ASUS, HP and Lenovo, starting in Q1 2021. Expanding its leadership client computing product portfolio featuring the "Zen 3" core, AMD also announced the AMD Ryzen PRO 5000 Series Mobile Processors, delivering enterprise-grade security and seamless manageability to commercial users. Throughout the course of 2021, AMD expects a broad portfolio of more than 150 consumer and commercial notebooks based on the Ryzen 5000 Series Mobile Processors.

"As the PC becomes an even more essential part of how we work, play and connect, users demand more performance, security and connectivity," said Saeid Moshkelani, senior vice president and general manager, Client business unit, AMD. "The new AMD Ryzen 5000 Series Desktop and Mobile Processors bring the best innovation AMD has to offer to consumers and professionals as we continue our commitment to delivering best-in-class experiences with instant responsiveness, incredible battery life and fantastic designs. With our PC partners, we are delivering top-quality performance and no-compromise solutions alongside our record-breaking growth in the notebook and desktop space in the previous year."

AMD is expected to announce its upcoming EPYC lineup of processors for server applications based on the new Zen 3 architecture. Codenamed "Milan", AMD is continuing the use of Italian cities as codenames for its processors. Being based on the new Zen 3 core, Milan is expected to bring big improvements over the existing EPYC "Rome" design. Bringing a refined 7 nm+ process, the new EPYC Milan CPUs are going to feature better frequencies, which are getting paired with high core counts. If you are wondering how Zen 3 would look like in server configuration, look no further because we have the upcoming AMD EPYC 7543 32-core processor benchmarked in Geekbench 4 benchmark.

The new EPYC 7543 CPU is a 32 core, 64 thread design with a base clock of 2.8 GHz, and a boost frequency of 3.7 GHz. The caches on this CPU are big, and there is a total of 2048 KB (32 times 32 KB for instruction cache and 32 times 32 KB for data cache) of L1 cache, 16 MB of L2 cache, and as much as 256 MB of L3. In the GB4 test, a single-core test produced 6065 points, while the multi-core run resulted in 111379 points. If you are wondering how that fairs against something like top-end Intel Xeon Platinum 8280 Cascade Lake 28-core CPU, the new EPYC Milan 7543 CPU is capable of fighting two of them at the same time. In a single-core test, the Intel Xeon configuration scores 5048 points, showing that the new Milan CPU has 20% higher single-core performance, while the multi-core score of the dual Xeon setup is 117171 points, which is 5% faster than AMD CPU. The reason for the higher multi-core score is the sheer number of cores that a dual-CPU configuration offers (32 cores vs 56 cores).

Designing a custom processor can be a rewarding thing. You can control your ecosystem surrounding it and get massive rewards in terms of application-specific performance uplift, or lower total cost of ownership. It seems like cloud providers have figured out that at their scale, designing a custom processor can get all of the above with the right amount of effort put into it. If you remember, in 2018, Amazon has announced its Graviton processor based on Arm instruction set architecture. Today, the company has almost 10% of its AWS instances based on the Graviton 1 or 2 processors, which is a massive win for a custom design.

Following Amazon's example, the next company to join the custom server processor race is going to be Microsoft. The Redmond based giant is looking to build a custom lineup of processors that are meant to satisfy Microsoft's most demanding sector - server space. The company's Azure arm is an important part where it has big and increasing revenue. By building a custom processor, it could satisfy the market needs better while delivering higher value. The sources of Bloomberg say that Microsoft is planning to use Arm ISA, and start building independence from the x86 vendors like Intel and AMD. Just like we saw with AWS, the industry cloud giants are starting to get silicon-independent and with their scale, they can drive the ecosystem surrounding the new processors forward rapidly. The sources are also speculating that the company is building custom processors for Surface PCs, and with Windows-on-Arm (WoA) project, Microsoft has laid the groundwork in that field as well.

With the launch of the Ryzen 5000 series of processors, AMD has set a goal to put its Zen 3 cores everywhere. Starting from desktop, mobile, and soon server space, AMD is delivering its best products. However, AMD is also preparing to satisfy another segment. The OEMs are in need of processors that are specifically designed for their purposes and their clients, that don't require as many features as the desktop segment does. Usually, that means some overclocking capability is cut off. Today, thanks to the two hardware leakers Patrick Schur and Momomo_US we get to see the first sightings of AMD's upcoming Zen 3 offerings for OEMs.

The first in the lineup is the Ryzen 9 5900 processor. It features 12 cores with 24 threads, running at unknown frequencies for now. All we know is that the CPU is a bit lower-clocked than its 105 W "X" Ryzen 9 5900X variant. Unlike the "X" variant, this CPU is supposed to bring TDP down to 65 Watts. Another differentiator is the cache configuration. The Ryzen 9 5900 features 64 MB of L3 cache and 2 MB of L2 cache. The "X" version for desktops features 64 MB of L3, however, there is 6 MB of L2 cache present there. Next up comes the smaller eight-core variant - Ryzen 7 5800. Featuring 8 cores and 16 threads running at an also unknown frequency. The chip features a TDP of 65 Watts and cache configuration with 32 MB of L3 cache and 4 MB of L2, with the only difference from the Ryzen 7 5800X being the lower frequency.

AMD has launched its RDNA 2 based graphics cards, codenamed Navi 21. These GPUs are set to compete with NVIDIA's Ampere offerings, with the lineup covering the Radeon RX 6800, RX 6800 XT, and RX 6900 XT graphics cards. Until now, we have had reviews of the former two, but not the Radeon RX 6900 XT. That is because the card is coming at a later date, specifically on December 8th, in just a few days. As a reminder, the Radeon RX 6900 XT GPU is a Navi 21 XTX model with 80 Compute Units that give a total of 5120 Stream Processors. The graphics card uses a 256-bit bus that connects the GPU with 128 MB of its Infinity Cache to 16 GB of GDDR6 memory. When it comes to frequencies, it has a base clock of 1825 MHz, with a boost speed of 2250 MHz.

Today, in a GeekBench 5 submission, we get to see the first benchmarks of AMD's top-end Radeon RX 6900 XT graphics card. Running an OpenCL test suite, the card was paired with AMD's Ryzen 9 5950X 16C/32T CPU. The card managed to pass the OpenCL test benchmarks with a score of 169779 points. That makes the card 12% faster than RX 6800 XT GPU, but still slower than the competing NVIDIA GeForce RTX 3080 GPU, which scores 177724 points. However, we need to wait for a few more benchmarks to appear to jump to any conclusions, including the TechPowerUp review, which is expected to arrive once NDA lifts. Below, you can compare the score to other GPUs in the GeekBench 5 OpenCL database.

Today at AWS re:Invent 2020, AWS CEO Andy Jassy announced EC2 instances that will leverage up to eight Habana Gaudi accelerators and deliver up to 40% better price performance than current graphics processing unit-based EC2 instances for machine learning workloads. Gaudi accelerators are specifically designed for training deep learning models for workloads that include natural language processing, object detection and machine learning training, classification, recommendation and personalization.

"We are proud that AWS has chosen Habana Gaudi processors for its forthcoming EC2 training instances. The Habana team looks forward to our continued collaboration with AWS to deliver on a roadmap that will provide customers with continuity and advances over time." -David Dahan, chief executive officer at Habana Labs, an Intel Company.

AMD today launched a new product in its high-performance Embedded processor family, the AMD Ryzen Embedded V2000 Series processor. Built on the innovative 7 nm process technology, "Zen 2" cores and high-performance AMD Radeon graphics, the AMD Ryzen Embedded V2000 Series provides a new class of performance with 7 nm technology, incredible power efficiency and continues to deliver enterprise-class security features for embedded customers.

The AMD Embedded Ryzen V2000 family is designed for embedded applications such as Thin Client, MiniPC and Edge systems. Equipped with up to eight CPU cores and seven GPU compute units, a single AMD Ryzen Embedded V2000 Series processor provides 2x the multi-threaded performance-per-watt, up to 30 percent better single-thread CPU performance and up to 40 percent better graphics performance over the previous generation. For customers and applications that need high-performance display capabilities, the Ryzen Embedded V2000 series can power up to four independent displays in 4K resolution.

Intel 10 nm products have seen massive delays over the years, and Intel has built many IPs on the new node, however, not many of them have seen the light of the day due to problems the company has experienced with the manufacturing of the new node. That has caused delays in product shipments in the past, meaning that the time for 10 nm is just ahead. According to the latest DigiTimes Taiwan report, we have information that Intel is going to delay its Ice Lake-SP server processors manufactured on a 10 nm node. And it is going to be a whole quarter late according to the report. Instead of launching in Q4 this year, we can expect to see new processors in Q1 of 2021. It is yet unknown whatever the launch will happen at the beginning of Q1 or its end, however, we will report on it as we hear more information.

Update: DigiTimes has also released another report regarding server shipments. It is reported that server vendors are decelerating the shipments as they are making fewer orders in Q4 to wait for the new Intel CPUs. Judging by this move, the demand for these new processors is going to be rather high and the supply chain is preparing slowly for it.

We previously reported on the leaked listings for the upcoming Intel KA series processors from a Vietnamese retailer. Intel has now officially unveiled the chips and provided some extra details on the collaboration. The Intel KA series of processors are identical to their K series siblings apart from the Marvel Avengers box branding. Intel is reportedly launching five models from their i5, i7, and i9 lineups the Intel Core i5-10600KA, i7-10700KA, i9-10850KA, and i9-10900KA. The box artwork was designed by painter/muralist Tristan Eaton, Intel didn't announce pricing or availability for the lineup.

Intel is preparing to launch its next-generation for server processors and the next in line is the Ice Lake-SP 10 nm CPU. Featuring a Golden Cove CPU and up to 28 cores, the CPU is set to bring big improvements over the past generation of server products called Cascade Lake. Today, thanks to the sharp eye of TUM_APISAK, we have a new benchmark of the Ice Lake-SP platform, which is compared to AMD's EPYC Rome offerings. In the latest GeekBench 4 score, appeared an engineering sample of unknown Ice Lake-SP model with 28 cores, 56 threads, a base frequency of 1.5 GHz, and a boost of 3.19 GHz.

This model was put in a dual-socket configuration that ends up at a total of 56 core and 112 threads, against a single 64 core AMD EPYC 7442 Rome CPU. The dual-socket Intel configuration scored 3424 points in the single-threaded test, where AMD configuration scored notably higher 4398 points. The lower score on Intel's part is possibly due to lower clocks, which should improve in the final product, as this is only an engineering sample. When it comes to the multi-threaded test, Intel configuration scored 38079 points, where the AMD EPYC system did worse and scored 35492 points. The reason for this higher result is unknown, however, it shows that Ice Lake-SP has some potential.

Ampere today announced further roadmap details of its Ampere Altra server processor family. In March the company announced Ampere Altra, the world's first cloud native processor, featuring 80 cores. Today, Ampere unveiled preliminary details of the expansion of the cloud-native processor family by adding Ampere Altra Max, which has 128 cores, providing customers with another cloud-optimized processor to maximize overall performance and cores-per-rack density.

Ampere Altra Max is ideal for applications that take advantage of scale-out and elastic cloud architectures. Compatible with the 80-core Ampere Altra and also supporting 2-socket platforms, Ampere Altra Max offers the industry's highest socket-level performance and I/O scalability. It will be sampling in the fourth quarter and additional details will be provided later this year.

NVIDIA is leveraging the 128-lane PCI-Express gen 4.0 root complex of AMD 2nd generation EPYC "Rome" enterprise processors in building its DGX-A100 super scalar compute systems that leverage the new A100 "Ampere" compute processors. Each DGX-A100 block is endowed with two AMD EPYC 7742 64-core/128-thread processors in a 2P setup totaling 128-cores/256-threads, clocked up to 3.40 GHz boost.

This 2P EPYC "Rome" processor setup is configured to feed PCIe gen 4.0 connectivity to eight NVIDIA A100 GPUs, and 8-port Mellanox ConnectX 200 Gbps InfiniBand NIC. Six NVSwitches provide NVLink connectivity complementing PCI-Express gen 4.0 from the AMD sIODs. The storage and memory subsystem is equally jaw-dropping: 1 TB of hexadeca-channel (16-channel) DDR4 memory, two 1.92 TB NVMe gen 4.0 SSDs, and 15 TB of U.2 NVMe drives (4x 3.84 TB units). The GPU memory of the eight A100 units add up to 320 GB (that's 8x 40 GB, 6144-bit HBM2E). When you power it up, you're greeted with the Ubuntu Linux splash screen. All this can be yours for USD $199,000.

Intel is preparing lots of interesting designs for the future and it is slowly shaping their vision for the next generation of computing devices. Following the big.LITTLE design principle of Arm, Intel decided to try and build its version using x86-64 cores instead of Arm ones, called Lakefield. And we already have some information about the new Alder Lake CPUs based on Lakefield design that are set to be released in the future. Thanks to a report from Chrome Unboxed, who found the patches submitted to Chromium open-source browser, used as a base for many browsers like Google Chrome and new Microsoft Edge, there is a piece of potential information that suggests Alder Lake CPUs could arrive very soon.

Rumored to feature up to 16 cores, Alder Lake CPUs could present an x86 iteration of the big.LITTLE design, where one pairs eight "big" and eight "small" cores that are activated according to increased or decreased performance requirements, thus bringing the best of both worlds - power efficiency and performance. This design would be present on Intel's 3D packaging technology called Foveros. The Alder Lake CPU support patch was added on April 27th to the Chrome OS repository, which would indicate that Intel will be pushing these CPUs out relatively quickly. The commit message titled "add support for ADL gpiochip" contained the following: "On Alderlake platform, the pinctrl (gpiochip) driver label is "INTC105x:00", hence declare it properly." The Chrome Unboxed speculates that Alder Lake could come out in mid or late 2021, depending on how fast Intel could supply OEMs with enough volume.

Intel today launched its 10th generation Core desktop processor family and its companion Intel 400-series chipsets. Based on the 14 nm++ silicon fabrication process and built in the new LGA1200 package, the processors are based on the "Comet Lake" microarchitecture. The core design of "Comet Lake" and its IPC are identical to those of "Skylake," however Intel brought significant enhancements to the processor's clock-speed boosting algorithm, increased core- or thread counts across the board, and introduced new features that could interest enthusiasts and overclockers. The uncore component remains largely unchanged from the previous-generation, with support for DDR4 memory and PCI-Express gen 3.0. Use of these processors requires a new socket LGA1200 motherboard, they won't work on older LGA1151 motherboards. You can install any LGA115x-compatible cooler on LGA1200, provided it meets the thermal requirements of the processor you're using.

At the heart of the 10th generation Core processor family is a new 10-core monolithic processor die, which retains the same basic structure as the previous-generation 8-core "Coffee Lake Refresh" die, and 4-core "Skylake." The cores are arranged in two rows, sandwiched by the processor's uncore and iGPU blocks. A ring-bus interconnect binds the various components. The cache hierarchy is unchanged from previous generations as well, with 32 KB each of L1I and L1D caches; 256 KB of dedicated L2 cache per core, and 20 MB of shared L3 cache. The iGPU is the same Gen 9.5 based UHD 630 graphics. As we mentioned earlier, much of Intel's innovation for the 10th generation is with the processor's microcode (boosting algorithms).

Marvell today announced OCTEON TX2, the latest family of infrastructure processors targeting a wide variety of wired and wireless networking equipment including switches, routers, secure gateways, firewall, network monitoring, 5G base stations, and smart network interface controllers (NICs). Massive increases in data traffic coupled with escalating requirements for end-to-end security are intensifying the need for highly scalable compute platforms with integrated workload-optimized hardware accelerators to meet performance, power and total cost of ownership requirements. Building on five generations of the industry's most scalable and widely adopted infrastructure processor platform, the OCTEON TX2 family is enabled by a broad software ecosystem including a feature-rich software development kit (SDK) and virtualization support, delivering a unique combination of performance and programmability. The OCTEON TX2 portfolio extends Marvell's industry-leading performance and scalability, delivering a 2.5x improvement over the previous generation and scaling up to 200 Gbps of packet processing throughput.

Another day, another speculative execution vulnerability found inside Intel processors. This time we are getting a new vulnerability called "CacheOut", named after the exploitation's ability to leak data stored inside CPU's cache memory. Dubbed CVE-2020-0549: "L1D Eviction Sampling (L1Des) Leakage" in the CVE identifier system, it is rated with a CVSS score of 6.5. Despite Intel patching a lot of similar exploits present on their CPUs, the CacheOut attack still managed to happen.

The CacheOut steals the data from the CPU's L1 cache, and it is doing it selectively. Instead of waiting for the data to become available, the exploit can choose which data it wants to leak. The "benefit" of this exploit is that it can violate almost every hardware-based security domain meaning that the kernel, co-resident VMs, and SGX (Software Guard Extensions) enclaves are in trouble. To mitigate this issue, Intel provided a microcode update to address the shortcomings of the architecture and they recommended possible mitigations to all OS providers, so you will be protected once your OS maker releases a new update. For a full list of processors affected, you can see this list. Additionally, it is worth pointing out that AMD CPUs are not affected by this exploit.