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Intel Drops Xe-HP Server GPU Plans, to Stick with HPC and Client Graphics

Intel has dropped plans to build Xe-HP server GPUs commercially. This line of products would have powered cloud-based graphics rendering instances, for cloud-gaming or cloud-rendering applications. An announcement to this effect came from Raja Koduri, overseeing the development and monetization of Xe. Koduri stated that Xe-HP based instances were originally set up to power Intel's oneAPI devcloud as a software development vehicle for oneAPI and the upcoming Aurora supercomputer of the Argonne National Laboratory.

The company will now focus on Xe as a compute accelerator in the form of Xe-HPC "Ponte Vecchio," and discrete graphics in the client segment, leveraging the Xe-HPG graphics architecture. The smallest derivatives, the Xe-LP, powers integrated graphics solutions found in the company's Core processors (11th Gen and later). Back in the August 2021 Architecture Day presentation, Intel's technical brief for Xe HPC revealed that the silicon itself features certain on-die hardware relevant to graphics rendering (more here). This would have gone on to power the Xe-HP server GPU solutions.

Intel Aurora Supercomputer Will Touch 2 ExaFLOPs of Computational Power

Intel's Aurora supercomputer is a $500 million contract with the US Department of Energy to deliver an exascale supercomputer for Argonne National Laboratory. The project aims to build a machine capable of cranking over one ExaFLOP of computing at sustained workloads. The supercomputer aims to reach two ExaFLOPs of computing power once the installation system is completed and powered. The contract bound Intel to create accelerators that are powerful enough to achieve this magical number. However, they left Intel with room to do a little bit extra. With Ponte Vecchio GPU behind the project, it seems like the GPU is performing better than expected.

According to Intel's CEO, Pat Gelsinger, the system will reach over 2 ExaFLOPs at peak and a bit below in sustained workloads. As per preliminary calculations done by The Next Platform, the system's estimations point towards 2.43 ExaFLOPs peak and around 1.7 ExaFLOPs in sustained workloads at Double-precision floating-point format math, aka FP64. The system will utilize Intel Xeon Sapphire Rapids processors with HBM memory and the powerful Ponte Vecchio GPU with 47 tiles and over 100 billion transistors.

SiPearl Partners With Intel to Deliver Exascale Supercomputer in Europe

SiPearl, the designer of the high computing power and low consumption microprocessor that will be the heart of European supercomputers, has entered into a partnership with Intel in order to offer a common offer dedicated to the first exascale supercomputers in Europe. This partnership will offer their European customers the possibility of combining Rhea, the high computing power and low consumption microprocessor developed by SiPearl, with Intel's Ponte Vecchio accelerator, thus creating a high performance computing node that will promote the deployment of the exascale supercomputing in Europe.

To enable this powerful combination, SiPearl plans to use and optimize for its Rhea microprocessor the open and unified programming interface, oneAPI, created by Intel. Using this single solution across the entire heterogeneous compute node, consisting of Rhea and Ponte Vecchio, will increase developer productivity and application performance.

Intel Xe-HPG Arc Alchemist Graphics Card Alleged Pricing Points Towards $650-$825 Range

Intel's Arc Alchemist lineup of graphics cards, based on Xe-HPG GPU configuration, is nearing the launch. With the current situation with AMD and NVIDIA GPUs outputting graphics card prices over the default MSRP, we wonder how Intel would place pricing of its upcoming GPUs and fit inside the market. And today, we got the first round of speculations based on Intel's Arc Alchemist GPU giveaway called Xe-HPG Scavenger Hunt. There are two principal bundles: one worth $900 that includes Intel Arc merchandise, Xbox Game Pass PC for six months, Intel Premium Arc Alchemist graphics card, and one worth $700 that consists of three months of Xbox Game Pass PC, Intel Arc merchandise, and Intel Performance Arc Alchemist graphics card.

According to some preliminary calculations from Tom's Hardware, we assume that with the $900 bundle containing one Premium Arc Alchemist GPU and other prizes, the card will cost as much as $825 when all things get removed. Going down the ladder, Intel has paired a bundle worth $700 with a Performance Arc GPU, which is roughly worth $650 on its own. It indicates that the two Intel Performance and Premium Arch Alchemist graphics cards are respectfully worth $650 and $825. What will the final pricing look like? We don't know. However, we assume that it could be very similar to this. For more information we have to wait for the official launch.

Intel Reports Third-Quarter 2021 Financial Results

Intel Corporation today reported third-quarter 2021 financial results. "Q3 shone an even greater spotlight on the global demand for semiconductors, where Intel has the unique breadth and scale to lead. Our focus on execution continued as we started delivering on our IDM 2.0 commitments. We broke ground on new fabs, shared our accelerated path to regain process performance leadership, and unveiled our most dramatic architectural innovations in a decade. We also announced major customer wins across every part of our business," said Pat Gelsinger, Intel CEO. "We are still in the early stages of our journey, but I see the enormous opportunity ahead, and I couldn't be prouder of the progress we are making towards that opportunity."

In the third quarter, the company generated $9.9 billion in cash from operations and paid dividends of $1.4 billion. Intel CFO George Davis announced plans to retire from Intel in May 2022. He will continue to serve in his current role while Intel conducts a search for a new CFO and until his successor is appointed. Third-quarter revenue was led by strong recovery in the Enterprise portion of DCG and in IOTG, which saw higher demand amid recovery from the economic impacts of COVID-19. The Client Computing Group (CCG) was down due to lower notebook volumes due to industry-wide component shortages, and on lower adjacent revenue, partially offset by higher average selling prices (ASPs) and strength in desktop.

TerraMaster Launches 8-Bay RackMount NAS for Business and Government Use

TerraMaster, a professional brand that specializes in providing innovative storage products for home, businesses and enterprises, presents its line-up of 8-bay storage servers designed to meet the needs of modern businesses for enterprise virtualization, data-intensive applications, and service continuity. TerraMaster's Rackmount NAS Series is equipped with the latest technologies and advanced securities to deliver efficient performance with excellent data security making it ideal for business and government use.

The TerraMaster 8-Bay Rackmount NAS Series support up to 1000 user accounts with RBAC rights management and Windows ACL. This allows easy user and access rights management. The 8-Bay Rackmount NAS Series supports 2.5" and 3.5" drives and comes fitted with four RJ-45 1 GbE LAN ports. All models also come with one PCIe 3.0 X16 slot and two PCIe 3.0 x8 slots offering expansion flexibility for 10GbE NIC cards or dedicated RAID cards.

MSI Also Unveils PRO DP130 Desktop

MSI, a world leader in high-performance and innovative computing solutions, has announced the PRO DP130 11th Business & Productivity PC. Featuring a powerful processor, MSI external graphics card, exclusive software, and various IO ports, the PRO DP130 11th is designed with efficiency and productivity in mind.

The MSI PRO DP130 Series was inspired by natural bamboo's perseverance, transformation & refinement. A bamboo tree lies dormant for four years only to grow exponentially in the fifth. The little plant was growing underground, developing a root system strong enough to support its potential outward growth in the fifth year and beyond. It sustained its life by growing slowly at the start to develop a strong foundation, then it will grow a hundred feet tall. This is the MSI PRO DP130 Series.

Another AMD GPU Designer Joins Intel

Intel is apparently taking its GPU business seriously, at the expense of AMD, as according to an article from CRN, Intel has hired Vineet Goel, former Corporate Vice President GPU architecture, graphics, machine learning and mobile platform at AMD. His new title at Intel is almost as longwinding, as he joined Intel as Vice President and General Manager, GPU architecture and IP engineering.

Goel spent his past five years at AMD and prior to that he was the Director of GPU compute solution and Adreno architecture at Qualcomm, although his first job listed on LinkedIn was as a fellow at AMD. His new position at Intel will have him lead the Xe GPU IP roadmap, or in other words, he'll be the person that decides what kind of tech Intel will be putting in its future GPUs.

Kubuntu Focus Team Announces the 3rd Gen M2 Linux Mobile Workstation

The Kubuntu Focus Team announces the availability of the third-generation M2 Linux mobile workstation with multiple performance enhancements. RTX 3080 and RTX 3070 models are in stock now. RTX 3060 models can be reserved now and ship in the first week of November. The thin-and-light M2 laptop is a superb choice for anyone looking for the best out-of-the-box Linux experience with the most powerful mobile hardware. Customers include ML scientists, developers, and creators. Improvements to the third generation include:
  • Cooler and faster Intel 11th generation Core i7-11800H. Geekbench scores improve 19 and 29%.
  • Double the iGPU performance with Intel Iris Xe 32EU Graphics.
  • Increased RAM speed from 2933 to 3200 MHz, up to 64 GB dual-channel.
  • BIOS switchable USB-C GPU output.
  • Upgrade from Thunderbolt 3 to version 4.

Intel Alder Lake-P Appears in Leaked Roadmap Featuring DDR5 & PCIe 5.0 Support

Intel is expected to announce their desktop Alder Lake processors later this month on October 28th and it would appear that laptop processors could enter production as early as November. These revelations come from a leaked roadmap published by Wccftech that lists the Alder Lake-P and Alder Lake-M processor families for launch in Q4 2021 and Q1 2022 respectively. The production window for Alder Lake-P opens November 8th and closes March 13th while for Alder Lake-M that period is from January 17th to April 17th.

The roadmap lists Alder Lake-P processors as featuring a TDP between 12 W to 45 W and Alder Lake-M covering 7 W to 15 W. The two platforms will both feature up to 96 Xe graphics Execution units along with Thunderbolt 4 and WiFi 6E connectivity. Alder Lake-P will include PCIe 5.0 and DDR5 support with no mention of DDR4 compatibility while Alder Lake-M will get PCIe 4.0 and LPDDR4X/LPDDR5. The mobile lineup is divided into 3 groups of which the flagship H55 was not mentioned in the roadmap indicating a post Q1 2022 release.

Intel Processors Selected to Power Next-Gen DOE Supercomputers

The U.S. Department of Energy's (DOE's) National Nuclear Security Administration (NNSA) selected next-generation Intel Xeon Scalable processors (code-named "Sapphire Rapids") to power the supercomputers used within NNSA's Life Extension Program for mission-critical efforts in stockpile stewardship. The NNSA's Lawrence Livermore National Laboratory awarded a subcontract to Dell Technologies to supply the Intel-powered computing systems that will be deployed at the NNSA's Tri-Labs (Lawrence Livermore National Laboratory, Los Alamos National Laboratory and Sandia National Laboratories).

Today's news supports the NNSA's Advanced Simulation and Computing (ASC) program operated at the NNSA's Tri-Labs. The Commodity Technology Systems contract (CTS-2) awarded today will enable these three national laboratories to build more powerful, energy-efficient computing systems that will focus on performing extensive modeling and simulation capabilities in support of NNSA's stockpile stewardship program.

XMG Announces APEX Laptop Family with up to Ryzen 9 5900HX and GeForce RTX 3070 Processors

With the 15.6 and 17.3 inch XMG APEX gaming laptops, XMG is positioning a new model series below its own high-end range consisting of the NEO and PRO series. These new laptops combine mobile AMD eight-core processors up to the Ryzen 9 5900HX with NVIDIA GeForce RTX graphics cards up to the RTX 3070. The company is simultaneously introducing the XMG FOCUS, a new product series in the entry-level segment. Intel's Core i7-11800H and an NVIDIA GeForce RTX 3050 Ti offer decent gaming performance, while good connectivity and memory round off the overall package. All four new models feature an IPS display with 144 Hz.

Until now, the XMG APEX 15 in the older E20 generation represented uncompromising desktop CPU performance, with processors up to the Ryzen 9 3950X in a laptop. Although XMG is already working on a direct successor under a slightly different name, it is unleashing the XMG APEX 15 and APEX 17 of the M21 generation for the time being with the currently fastest eight-core mobile processors from AMD. The laptops are available with an AMD Ryzen 7 5800H as well as with the slightly faster Ryzen 9 5900HX from the 54 watt TDP class, as well as with an NVIDIA GeForce RTX 3070 or RTX 3060 in the respective maximum TGP configuration (RTX 3070: 125 watts plus 15 watts Dynamic Boost 2.0; RTX 3060: 115 watts plus 15 watts Dynamic Boost 2.0).

Intel "Alder Lake" Silicon Variants Detailed—Reunification of the Product Lines

The 12th Gen Core "Alder Lake" microarchitecture will see Intel unify its desktop- and mobile processor IP, back to the way things were up to the 9th Gen. With its post-14 nm silicon fabrication nodes in their infancy, Intel had diverged the client processor IP across its 10th and 11th Gen Core. With 10th Gen, the company introduced "Ice Lake" for ultra-portable platforms (28 W and below), while retaining 14 nm "Comet Lake" for mainstream notebooks (28 W to 45 W); while keeping desktop exclusively with 14 nm "Comet Lake." For 11th Gen, the story is mostly similar. Cutting-edge 10 nm "Tiger Lake" now covers all mobile categories, while desktop receives an IPC upgrade, thanks to the 14 nm "Rocket Lake." The 12th Gen will see a common microarchitecture, "Alder Lake," span across all client segments, from 7 W ultra mobile, to 125 W enthusiast desktop.

This, however, doesn't mean that Intel has a one-size fits all silicon that it can carve SKUs out of. The company has developed as many as three physical dies based on "Alder Lake," which vary in CPU core counts, the size of the iGPU, and other on-die components. "Alder Lake" is a hybrid processor with a combination of larger "Golden Cove" P-cores, and smaller "Gracemont" E-cores. The P-cores are spatially large, and along with their L3 cache slices, take up a large share of the compute portion of the silicon. The E-cores come in clusters of 4 cores each.

Intel's DLSS-rivaling AI-accelerated Supersampling Tech is Named XeSS, Doubles 4K Performance

Intel plans to go full tilt with gaming graphics, with its newly announced Arc line of graphics processors designed for high-performance gaming. The top Arc "Alchemist" part meets all requirements for DirectX 12 Ultimate logo, including real-time raytracing. The company, during the technology's reveal, earlier this week, also said that it's working on an AI-accelerated supersampling technology. The company is calling it XeSS (Xe SuperSampling). It likely went with Xe in the name, as it possibly plans to extend the technology to even its Xe LP-based iGPUs and the entry-level Iris Xe MAX discrete GPU.

Intel claims that XeSS cuts down 4K frame render-times by half. By all accounts, 1440p appears to be the target use case of the top Arc "Alchemist" SKU. XeSS would make 4K possible (i.e., display resolution set at 4K, rendering at a lower resolution, with AI-accelerated supersampling restoring detail). The company revealed that XeSS will use a neural network-based temporal upscaling technology that incorporates motion vectors. In the rendering pipeline, XeSS sits before most post-processing stages, similar to AMD FSR.

While AMD's FSR technology is purely shader based, the Intel algorithm can either use XMX hardware units (new in Intel Xe HPG), or DP4a instructions (available on nearly all modern AMD and NVIDIA GPUs). XMX stands for Xe Matrix Extensions and is basically Intel's version of NVIDIA's Tensor Cores, to speed up matrix math, which is used in many AI-related tasks. The Intel XeSS SDK will be available this month, in open source, using XMX hardware, the DP4a version will be available "later this year".

Durabook Introduces New Advanced Z14I Fully-Rugged Laptop

Durabook, the global rugged mobile solutions brand owned by Twinhead International Corporation, announced today the introduction of its dramatically upgraded Z14I fully-rugged laptop. The unit includes a slew of remarkable features, including an 11th Gen. Intel Core processor, latest Thunderbolt 4, NVMe PCIe SSD drive, 14" FHD 1,000 nits display with proprietary DynaVue sunlight-readable technology, fanless and hot-swappable battery design, MIL-STD-810H and MIL-STD-461G certifications, and ANSI/ISA 12.12.01-2000, CI/D2 classification. In addition, the newly upgraded Z14I delivers 1.6x faster CPU performance than its predecessor. When combined, its feature package makes the Durabook Z14I the world's toughest fully-rugged laptop.

"Our new advanced Z14I laptop goes above and beyond the standard requirements to elevate the user experience," stated Twinhead CEO Fred Kao. "This fully rugged laptop solution with its endless customization capability through its unique expansion box design fits perfectly in professional services and military/government applications such as mapping/dispatching, recording systems, CAD, assets management, and maintenance diagnostics. Additionally, as strong as they come, the unit is the best laptop in the market for outdoor usage."

Intel Accelerates Packaging and Process Innovations

Intel Corporation today revealed one of the most detailed process and packaging technology roadmaps the company has ever provided, showcasing a series of foundational innovations that will power products through 2025 and beyond. In addition to announcing RibbonFET, its first new transistor architecture in more than a decade, and PowerVia, an industry-first new backside power delivery method, the company highlighted its planned swift adoption of next-generation extreme ultraviolet lithography (EUV), referred to as High Numerical Aperture (High NA) EUV. Intel is positioned to receive the first High NA EUV production tool in the industry.

"Building on Intel's unquestioned leadership in advanced packaging, we are accelerating our innovation roadmap to ensure we are on a clear path to process performance leadership by 2025," Intel CEO Pat Gelsinger said during the global "Intel Accelerated" webcast. "We are leveraging our unparalleled pipeline of innovation to deliver technology advances from the transistor up to the system level. Until the periodic table is exhausted, we will be relentless in our pursuit of Moore's Law and our path to innovate with the magic of silicon."

Intel Teases Xe HPG Graphics Architecture

On the sidelines of its 2021 International Supercomputing Conference announcements that mostly covered the HPC-relevant portions of the company's Xe scalar compute architecture, the company also put out a couple of nuggets on Xe HPG, the gaming-grade consumer graphics architecture by Intel, which is expected to power graphics cards capable of AAA gaming at high resolutions. Without mentioning dates, the company announced that Xe HPG will see the light of the day soon.

It's a long march for Intel to break into the gaming graphics card business, and Intel is calling this project "Odyssey." A select few (Intel employees, ISVs, hardware partners, etc.,), have access to greater information and merchandise, as they hold the "Odyssey Card." The company called for them to "redeem" this card for the goodies. "We are soon heading toward a milestone moment, the pending release of the Xe HPG microarchitecture from Intel. Some of you received an Odyssey card and were the first to engage with Intel on this journey. Now is the time to redeem this card, which is one in many steps we hope to formally take forward with you. We have a few required fields here to confirm you have received a card from us," stated Intel.

Intel DG2 GPU with 256 Execution Units Offers GTX 1050 Performance

We have been receiving several leaks for Intel's upcoming DG2 GPUs with a 256 Execution Unit model recently appearing on Geekbench paired with a 14-core Alder Lake mobile CPU. The Alder Lake mobile processor featured an integrated Xe GPU with 96 Execution Units which were also benchmarked. The 256 Execution Unit graphics card tested is likely derived from the mid-range DG2-384 GPU. The 96 EU DG2 iGPU featured a maximum frequency of 1.2 GHz while the 256 EU variant increased that to 1.4 GHz. The DG2-256 scored an OpenCL score of 18,450 points in the Geekbench 5 benchmark which places it at GTX 1050 performance level. The DG2-96 integrated GPU scored 6,500 points which is comparable to a GTX 460. While these performance numbers are low it is important to keep in mind that these are just early results from a mid-range mobile offering and Intel is planning to release cards with 512 Execution Units which should compete with the RTX 3070 Ti and 6700 XT.

Intel Makes Changes to Executive Team, Raja got Promoted

Intel CEO Pat Gelsinger announced the addition of two new technology leaders to its executive leadership team, as well as several changes to Intel business units. Current Intel executives Sandra Rivera and Raja Koduri will each take on new senior leadership roles, and technology industry veterans Nick McKeown and Greg Lavender will join the company.

"Since re-joining Intel, I have been impressed with the depth of talent and incredible innovation throughout the company, but we must move faster to fulfill our ambitions," said Gelsinger. "By putting Sandra, Raja, Nick and Greg - with their decades of technology expertise - at the forefront of some of our most essential work, we will sharpen our focus and execution, accelerate innovation, and unleash the deep well of talent across the company."

Intel DG2 Graphics Card Leakers Suggest Performance Similar to NVIDIA RTX 3070 Ti, AMD RX 6700

Intel's foray into the discrete GPU market is inching ever closer, and with that diminishing time to market, leaks are getting more common. Renowned leaker TUM_APISAK has shared some performance numbers for Intel's upcoming DG2 graphics card, part of the company's Xe HPG (High Performance Gaming) architecture. In the leak, he also confirmed that Intel is working on a cut-down version of their top offering (which features 4,096 shading units spread across 512 EUs) in the form of a new SKU that offers 448 EUs and 3584 shading units running at 1.8 GHz. That is the actual chip whose relative performance was shared.

According to TUM_APISAK, users should expect the Intel DG2 448 EU graphics card to offer performance that's around the NVIDIA RTX 3070 (5% lower performance for the Intel part) and AMD's RX 6700 XT (8% lower performance for the Intel part). As for the performance of the full-fat 512 EU chip, another leaker, Moore's Law is Dead, expects its performance to fall very slightly lower than the performance offered by NVIDIA's RTX 3080 and AMD's RX 6800/6800 XT. The 512-EU DG2 should also feature higher Boost clocks up to 2.2 GHz. Intel's launch of their Xe HPG graphics architecture is expected to occur before the end of the year, likely starting with the highest performance/highest margin parts, trickling down the product stack through the beginning of 2022. Intel's launch should help in alleviating the lack of available graphics cards, whilst simultaneously breaking a duopoly market.

Dynabook Rolls Out Next-Generation Tecra Laptops

Dynabook Americas, Inc., formerly the Toshiba PC Company, today announced the next-generation of its Tecra A Series laptops with the 14-inch Tecra A40-J and 15-inch Tecra A50-J. Dynabook completely redesigned these new professional grade laptops to address the needs of the modern, flexible worker while reducing the strain on IT managers. Reliable, secure, and easy to manage, this lightweight and stylish duo are the latest additions to Dynabook's well-established Tecra product line.

"The new modern designs of the Tecra A40 and A50 truly stand out from the crowd," said Philip Osako, vice president, marketing and engineering, Dynabook Americas, Inc. "These new laptops incorporate the power and performance of a professional-grade laptop with a premium style that looks great in any work environment."

Intel Ponte Vecchio GPU to Be Liquid Cooled Inside OAM Form Factor

Intel's upcoming Ponte Vecchio graphics card is set to be the company's most powerful processor ever designed, and the chip is indeed looking like an engineering marvel. From Intel's previous teasers, we have learned that Ponte Vecchio is built using 47 "magical tiles" or 47 dies which are responsible either for computing elements, Rambo Cache, Xe links, or something else. Today, we are getting a new piece of information coming from Igor's LAB, regarding the Ponte Vecchio and some of its design choices. For starters, the GPU will be a heterogeneous design that consists out of many different nodes. Some parts of the GPU will be manufactured on Intel's 10 nm SuperFin and 7 nm technologies, while others will use TSMC's 7 nm and 5 nm nodes. The smaller and more efficient nodes will probably be used for computing elements. Everything will be held together by Intel's EMIB and Foveros 3D packaging.

Next up, we have information that this massive Intel processor will be accountable for around 600 Watts of heat output, which is a lot to cool. That is why in the leaked renders, we see that Intel envisioned these processors to be liquid-cooled, which would make the cooling much easier and much more efficient compared to air cooling of such a high heat output. Another interesting thing is that the Ponte Vecchio is designed to fit inside OAM (OCP Accelerator Module) form factor, an alternative to the regular PCIe-based accelerators in data centers. OAM is used primarily by hyper scalers like Facebook, Amazon, Google, etc., so we imagine that Intel already knows its customers before the product even hits the market.

Intel Announced 5G-ready Additions to its 11th Gen Core Processors

Today at Computex 2021, Intel announced two new additions to the lineup of 11th Gen Intel Core processors. These new processors, combined with Intel's co-engineering work with independent software vendors (ISVs) and original equipment manufacturers (OEMs), continue Intel's leadership in mobile compute—delivering the world's best processors for thin-and-light Windows-based laptops. Intel also introduced its first 5G product for the next generation of PC experiences, Intel 5G Solution 5000, following the previously announced collaboration with MediaTek and Fibocom.

"We've taken the world's best processor for thin-and-light Windows laptops and made the experience even better with the addition of our two new 11th Gen Intel Core processors with Intel Iris Xe graphics. In addition, we know real-world performance and connectivity are vital to our partners and the people who rely on PCs every day, so we're continuing that momentum with more platform capabilities and choice in the market with the launch of our first 5G product for PCs: the Intel 5G Solution 5000," said Chris Walker, Intel corporate vice president and general manager of Mobility Client Platforms.

Marvell Announces Bravera, World's First PCIe 5.0 SSD Controllers

Marvell today announced its new Bravera SC5 controller family, bringing unprecedented performance, best-in-class efficiency, and leading security features to address ever-expanding workloads in the cloud. The massive amount of data to be processed in cloud data centers is driving demand for faster and higher bandwidth storage in these environments. Marvell's Bravera SC5 SSD controllers address the critical requirements for scalable, containerized cloud storage infrastructure. By enabling the highest performing flash storage solutions, Marvell's controllers are poised to be the foundation for data centers that offer ultra-low latency, real-time applications while also providing cost-optimized, cloud-scale capacity.

As the industry's first SSD controllers to support PCIe 5.0 and NVMe 1.4b, Marvell's Bravera SC5 doubles the performance compared to PCIe 4.0 SSDs. This contributes to accelerated workloads and reduced latency, dramatically improving the user experience. In order to meet cloud service providers' stringent security requirements to ensure users' data is safe and protected, the controllers offer FIPS-compliant root of trust (RoT), AES 256-bit encryption and multi-key revocation. The new controllers are the first with a hardware-based Elastic SLA Enforcer to assure quality of service (QoS) and provide metering capabilities per customer to increase overall storage efficiency and utilization while lowering total cost of ownership (TCO).

MAINGEAR Launches New ELEMENT Lite Notebook Featuring 11th Gen Intel Processor and Iris Xe Graphics

MAINGEAR—an award-winning PC system integrator of custom gaming desktops, notebooks, and workstations—today launched the MAINGEAR ELEMENT Lite, a 15" ultra-premium notebook designed in collaboration with Intel. Featuring Intel Iris Xe Graphics and up to an 11th Gen Intel Core i7 processor, the MAINGEAR ELEMENT Lite pairs next-generation hardware with a sleek and minimal machined aluminium alloy chassis for maximum power, speed, and portability. The new MAINGEAR ELEMENT Lite is the perfect Windows laptop for work and play on the go.

Custom designed and engineered in collaboration with Intel, this uncompromising notebook PC comes equipped with up to an Intel Core i7-1165G7 Processor running at 2.8 GHz with a Max Turbo Frequency of 4.7 GHz on 4 cores / 8 threads. Integrated Intel Iris Xe Graphics make multimedia viewing, content creation, and even light gaming a breeze. ELEMENT Lite systems can be equipped with 16 GB of DDR4 memory and up to 2 TB of user-replaceable PCI-E Gen4 M.2 NVMe SSD storage. MAINGEAR optimized the ELEMENT Lite to pack exceptional performance and cooling into its frame without sacrificing on battery life or upgradeability. It weighs in at just 3.64 lbs (1.65 kg) and is 14.9 mm thin—making it the thinnest notebook that MAINGEAR has ever offered.
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