Wednesday, May 29th 2019

G.SKILL Showcases Extreme DDR4 at Computex 2019, Up to DDR4-4000 384GB & DDR4-5200 16GB

G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory and gaming peripherals, is showcasing several ultra-high speed and low latency DDR4 memory kits on Intel and AMD platforms at Computex 2019. These live demo systems feature motherboards from ASUS, ASRock, EVGA, Gigabyte, and MSI, as well as multiple memory kits made with Samsung B-die ICs.

DDR4-4000 384GB (32GBx12) - Massive Capacity DDR4 Beast of a Kit

Any experienced overclocker knows two factors that make achieving high-speed RAM more difficult - high module capacity and increased module count. This mystical beast of a memory kit runs at DDR4-4000MHz with an enormously massive total capacity of 384GB with 12 modules of 32GB each. While earlier 32GB modules were constructed with 8Gb components, these modules use higher density 16Gb ICs. This extremely high-capacity, high-performance live demo system is built with the Intel Xeon W-3175X processor and ASUS ROG Dominus Extreme motherboard.
DDR4-5200 2x8GB - The Highest Frequency in Dual-Channel Configuration]

Always pursuing the fastest possible memory speed, G.SKILL presents a kit of Trident Z Royal running at a staggering DDR4-5200MHz with a low timing of CL18-22-22-42. This set of system RAM is the fastest dual-channel memory on live display at Computex 2019, and the live demo system is built with the Intel Core i7-9700KF processor and MSI MPG Z390I GAMING EDGE AC motherboard.
DDR4-5000 CL17 2x8GB - The Perfect Balance of High Frequency & Low Latency

Imbued with the best of both worlds, G.SKILL also has on display a kit of Trident Z RGB at an ultra-high-speed DDR4-5000MHz with extremely low latency at CL17-17-17-37. This live demo system is built with the latest high-end Intel Core i9-9900K desktop processor and ASUS ROG MAXIMUS XI APEX motherboard.
High Frequency & Low Latency 64GB Capacity Kits on the Intel X299 Platform

Being the fastest 8-module memory kit in the show, this 64GB (8x8GB) Trident Z Royal memory kit is running at DDR4-4300MHz on the ASUS ROG RAMPAGE VI EXTREME OMEGA motherboard. With 4 modules of 16GB modules in quad-channel configuration for a total of 64GB, this Trident Z Royal memory kit operates at DDR4-4000MHz with an awesomely low latency of CL16-18-18-38 on the MSI MEG X299 CREATION motherboard with Intel Core i9-9990XE.
High Performance DDR4 Memory on the AMD X570 Chipset

On the latest motherboards featuring the AMD X570 chipset and paired with 2nd generation AMD Ryzen processors, G.SKILL shows off a high speed DDR4-4000MHz CL18 memory kit on the ASUS ROG CROSSHAIR VIII HERO. And on the other end of the spectrum, G.SKILL also exhibited a DDR4-3600MHz 32GB (4x8GB) kit with a very efficient timing of CL14-14-14-34 on the Gigabyte X570 AORUS MASTER motherboard, as well as a DDR4-3600MHz 16GB (2x8GB) kit with a matching efficient timing of CL14-14-14-34 on the MSI MEG X570 GODLIKE motherboard.
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12 Comments on G.SKILL Showcases Extreme DDR4 at Computex 2019, Up to DDR4-4000 384GB & DDR4-5200 16GB

#1
madness777
AMD demo with 2nd gen RYZEN chips! Loving it!
Posted on Reply
#2
TheMadDutchDude
Can't use Ryzen 3000 chips yet - it's under NDA still.
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#3
dicktracy
Isn't b-dies discontinued? These will never make it to the market LMAO
Posted on Reply
#4
NdMk2o1o
dicktracy, post: 4056698, member: 173119"
Isn't b-dies discontinued? These will never make it to the market LMAO
there will still be existing inventory to sell, they didn't just magically disappear out of existence :laugh:
Posted on Reply
#5
Tomorrow
dicktracy, post: 4056698, member: 173119"
Isn't b-dies discontinued? These will never make it to the market LMAO
No that was misrepresented news. Only one configuration of B-Dies was EOL'd. The rest remain in production.
Posted on Reply
#6
Bones
Tomorrow, post: 4056728, member: 136792"
No that was misrepresented news. Only one configuration of B-Dies was EOL'd. The rest remain in production.
This is true, it's the 20nm B-die that's being phased out, 10nm is in production.

This is the artice many of us read earlier on this:
https://www.techpowerup.com/forums/threads/samsung-kills-production-of-famed-b-die-ddr4-memory-in-favor-of-higher-densities.255165/

I can say I'm well stocked on B-die, just bought another set the other day and it was the very last ones Newegg had in stock of this particular set, showed as sold out once I paid for them.
https://www.newegg.com/p/N82E16820232438

They may or may not get more of this set in, who knows but I have enough now to go from here and not worry about it.

It's nice to see progress being made but unfortunately it also means what's used and sold today won't be available brandnew tomorrow.
Posted on Reply
#7
Vycyous
Wow, I wonder how much the asking price will be for the DDR4-5000 CL17 and DDR4-5200 CL18 memory. Somewhat ironically, the 5000 MT/s memory is faster, at least in terms of calculated latency (6.8 ns and 6.92 ns, respectively). It's also impressive that, as far as I know, these will have to be rated for those speeds and timings at just 1.5V or less in order to comply with XMP standards. Currently, the fastest memory on the market is DDR4-4800 CL18 (calculated latency of 7.5 ns), so these two kits are a significant improvement. They must have been binning those Samsung B-die ICs for quite a while.
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#8
nemesis.ie
It looks like X570 boards alone increase the RAM compatibility for Zen+.

4000MHz on a 2700X is pretty incredible.

There has been talk of better board quality for X570 and tweaked traces layout, or do they just have some magical new UEFI that has yet to be released to us mortals? A combination of both maybe.

It would have been nice to see at least one AMD machine with a Radeon card.

@Vycyous Or maybe they are the mentioned (new?) 10nm B-die?
Posted on Reply
#9
Vycyous
nemesis.ie, post: 4056828, member: 22637"
Or maybe they are the mentioned (new?) 10nm B-die?
I think that's still just speculation, although I hope we'll eventually see it. I was incorrect when I thought 10 nm B-die was being produced (although, it might be and we just don't know about it). Samsung updated their website and now shows our much beloved B-die is no longer EOL and is being mass produced, which I was discussing here. Of course, it might just be an error.
Posted on Reply
#10
Th3pwn3r
Holy smokes! And I thought quad channel was crazy. I do love the symmetry that's for sure but totally unnecessary.
Posted on Reply
#11
AMX85
nemesis.ie, post: 4056828, member: 22637"
It looks like X570 boards alone increase the RAM compatibility for Zen+.

4000MHz on a 2700X is pretty incredible.

There has been talk of better board quality for X570 and tweaked traces layout, or do they just have some magical new UEFI that has yet to be released to us mortals? A combination of both maybe.

It would have been nice to see at least one AMD machine with a Radeon card.

@Vycyous Or maybe they are the mentioned (new?) 10nm B-die?
the chipset does´nt affect memory controller since its in the processor, new BIOS has better RAM support, if you check, even AMD300 series chipset BIOS updates says "memory compatibility improvements" in change log, maybe by new AGESA codes

greetings
Posted on Reply
#12
nemesis.ie
No, it's not the chipset, it's the build quality (PCB layers, trace quality etc.) and the way the slots are being routed.

The new UEFIs have better RAM support (speed) listed, but reports are that X570 boards with e.g. 2700X are seeing better RAM speeds than an X470 (also with new AGESA).

I hope to be moving from 1.0.0.72 (which is terrible and did not allow any better RAM speed) to 1.0.0.1 soon (the UEFI is out for X470 but not X470 Ultimate yet (!)) so I will be testing any improvement.

What they both do with a Ryzen 3000 (with the I/O die IMC) is pretty much unknown at this point. I am hoping I can get a bit more from my kits with a 3900X or whatever.
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