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GeIL Launches Actively Cooled DDR5 Memory with Dual RGB Fans

GeIL, is excited to announce the market launch of its EVO V DDR5 RGB Hardcore Gaming Memory kits providing high-frequency modules ranging from 4800 MHz to 6600 MHz and available in large kit capacities of 32 GB to 64 GB. The unique heatspreader design features active cooling and fascinating RGB lighting effects and is available in titanium gray or glacier white color themes.

GeIL EVO V DDR5 RGB Hardcore Gaming Memory offers unparalleled memory performance and stability to meet the intensive demand of hardcore gamers and overclockers across Intel's latest platforms. GeIL has crafted a break-through cooling solution for EVO V modules that integrates a stunning RGB light bar and two micro cooling fans into a single molded aluminium heatshield. Most importantly, the physical height of the heatspreader allows it to be compatible with most CPU coolers on the market without any mechanical interference.

Lexar Announces ARES DDR5 OC Memory & ARES DDR4 RGB Memory

Lexar, is excited to announce the launch of the new Lexar ARES DDR5 OC Desktop Memory and ARES DDR4 RGB Desktop Memory. ARES DDR5 OC Memory is designed for PC enthusiasts, gamers, overclockers and creatives while optimized on the latest Intel Core processor. ARES DDR4 RGB Memory enhances your PC with vibrant RGB lighting and blazing-fast DDR4 overclocked performance for an elevated gaming experience.

The Lexar ARES DDR5 OC Desktop Memory leverages next-gen DDR5 technology designed for the latest Intel Core processors platform and supports Intel XMP 3.02. With speeds of 5200, it provides more than 1.6x the bandwidth than that of DDR4. So whether you're operating speed-demanding video games, video editing software, or processing intensive workloads, the Lexar ARES DDR5 OC Memory enables you to experience superior DDR5 performance.

Sabrent Announces High-Performance, Low-Latency DDR5 Memory Modules

Sabrent Rocket 8 GB, 16 GB, and 32 GB DDR5-UDIMM's 4800 MHz Memory Modules for PC's. It seems like DDR4 has ruled the roost forever. Finally, new motherboards and architectures have allowed memory to grow wings with the advent of DDR5. Improved clock speeds promise up to twice the bandwidth of DDR4, all with lower voltage for better efficiency. To further help with that last bit, DDR5 has on-board power management to reduce motherboard cost and complexity. Sabrent's new DDR5 kits simply plug and play, install your memory kits of choice, enter the BIOS and hit AUTO, and reboot. For those that want to OC these kits, there is plenty of headroom to advance speeds if you want.

Reliability has also been improved by the introduction of on-die error-correction technology. Memory availability is improved by splitting the internal 64-bit (72-bit with ECC) channel into two independent, 32-bit channels (40-bit with ECC) and the addition of the same bank refresh. Combined with other features, including those that allow for up to four times the module capacity with consumer DRAM, DDR5 ensures your multi-core CPU won't be memory starved.

TrendForce: Demand for Consumer Electronics Sluggish, NAND Flash Wafer Pricing Leads Downturn in May

According to TrendForce research, looking at NAND Flash wafers, the pricing of which more sensitively reflects the market, suppliers are increasingly motivated to cut prices in exchange for sales due to weak retail demand since March and a more conservative outlook for shipments of other end products. The price of NAND Flash wafers is expected to begin falling in May and the supply of NAND Flash will gradually overtake demand in 2H22. The price decline of NAND Flash wafers in 3Q22 may reach 5~10%.

At the same time, TrendForce indicates that February's contamination incident at Kioxia was expected to tighten the market in 2Q22 and 3Q22. However, as a consequence of rising inflation and the war between Russia and Ukraine, market demand for consumer products in the traditional peak season of the second half of the year is trending conservative and the prices of client SSD, eMMC, and UFS in 3Q22 will be flat compared to 2Q22, breaking from the original expectation that prices may rise. In terms of enterprise SSDs, as demand for data centers remains strong, no significant correction in demand has yet been observed. However, as the overall NAND Flash market gradually moves into oversupply, prices will only grow slightly by approximately 0~5% in 3Q22.

Samsung Electronics Introduces Industry's First 512GB CXL Memory Module

Samsung Electronics, the world leader in advanced memory technology, today announced its development of the industry's first 512-gigabyte (GB) Compute Express Link (CXL) DRAM, taking an important step toward the commercialization of CXL which will enable extremely high memory capacity with low latency in IT systems. Since introducing the industry's first CXL DRAM prototype with a field-programmable gate array (FPGA) controller in May 2021, Samsung has been working closely with data center, enterprise server and chipset companies to develop an improved, customizable CXL device.

The new CXL DRAM is built with an application-specific integrated circuit (ASIC) CXL controller and is the first to pack 512 GB of DDR5 DRAM, featuring four times the memory capacity and one-fifth the system latency over the previous Samsung CXL offering. "CXL DRAM will become a critical turning point for future computing structures by substantially advancing artificial intelligence (AI) and big data services, as we aggressively expand its usage in next-generation memory architectures including software-defined memory (SDM)," said Cheolmin Park, Vice President of Memory Global Sales & Marketing at Samsung Electronics, and Director of the CXL Consortium. "Samsung will continue to collaborate across the industry to develop and standardize CXL memory solutions, while fostering an increasingly solid ecosystem."

PNY Intros XLR8 DDR5-6000 MAKO RGB Memory Kits

PNY released the top-spec model of the XLR8 MAKO RGB series, with the XLR8 DDR5-6000 MAKO RGB. Designed for enthusiast PC builds, the memory modules are characterized by an aluminium heatspreader crowned by a frost-white lighting diffuser with addressable-RGB LEDs underneath, dubbed EPIC-X RGB lighting. Available in 16 GB single-module and 32 GB two-module kits, these sticks pack an Intel XMP 3.0 profile that runs them at DDR5-6000 (PC5-48000) with CL38 latency, and 1.3 V module voltage. The company didn't reveal pricing.

G.SKILL Announces Ripjaws DDR5 SO-DIMM Memory Kits

G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory and gaming peripherals, is pleased to announce the launch of Ripjaws DDR5 SO-DIMM memory kits for laptops and small form factor PC systems, with available memory speeds up to DDR5-5200 or kit capacity up to 64 GB (32 GB x2).

Built with specially screened IC chips and hand-tested with G.SKILL's rigorous and highly selective binning process, each Ripjaws DDR5 SO-DIMM memory kit is constructed for high performance and reliability. Shaping the industry standard for memory performance, G.SKILL is launching low-latency specifications with the Ripjaws DDR5 SO-DIMM memory series, including DDR5-4800 CL34-34-34-76 and DDR5-5200 CL38-38-38-83. For a list of specifications at launch, please see the chart below.

Patriot Memory Announces VIPER VENOM RGB and non-RGB DDR5 Kits

Viper, the trademarked gaming brand of PATRIOT and a global leader in performance memory, solid-state drives, and flash storage solutions today is proud to announce the market launch of their new VIPER VENOM RGB and non-RGB DDR5 high-performance DRAM memory kits. These brand-new VIPER VENOM DDR5 memory kits are available with and without the RGB illumination, it provides enhanced speeds ranging up to 6200 MHz with kit capacities of 16 GB-32 GB to meet the harsh demand for PC enthusiasts and hardcore gamers.

"Our VIPER Gaming fans waited quite a while for quality DDR5. The VIPER VENOM DDR5 is the first DDR5 DRAM that we distributed for hardware enthusiasts, hardcore gamers, and case modders addicted to unparalleled system performance and stability. VIPER's engineering team has put countless efforts to guarantee excellent compatibility and higher reliability across Intel 's latest platforms, currently." said Roger Shinmoto, Vice President of VIPER GAMING. "Our first launch of Venom DDR5 on 4/28 will feature the highest frequency version at 6200 MHz. We hope the enthusiasts or overclockers be able to experience the physical power of Viper Venom DDR5 at the market launch. However, due to the global shortage of memory chips, we have decided to launch the mainstream frequency models like 5200/5600/6000 MHz sometime in the coming months." He added.

AMD Ryzen 7000 "Raphael" to Ship with DDR5-5200 Native Support

AMD's upcoming Socket AM5 Ryzen 7000-series "Raphael" desktop processors will ship with native support for DDR5-5200 memory speed, according to a marketing slide by memory maker Apacer (which also owns the overclocking memory brand ZADAK). The "Zen 4" based desktop processors will feature a dual-channel DDR5 (4 sub-channel) interface, just like the 12th Gen Core "Alder Lake," but with no backwards compatibility with DDR4.

AMD already stated that Ryzen 7000 processors have a design focus on memory overclocking capabilities, including AMD EXPO, a custom memory module SPD extension standard rivaling Intel XMP 3.0, which will come with fine-grained settings specific to the AMD memory controller architecture. Until now, AMD relied on A-XMP, a motherboard vendor-enabled feature based in the UEFI firmware setup program, which translates Intel XMP SPD profiles of memory modules into AMD-approximate settings.

TEAMGROUP Announces ELITE U-DIMM DDR5 Standard Memory with 5600 MHz Speed

TEAMGROUP, has announced today the upgrade of TEAMGROUP ELITE U-DIMM DDR5 Standard Memory in response to the evolution of future DDR5 memory specifications and development trends. Developed from TEAMGROUP's outstanding R&D capabilities and excellent product quality, the TEAMGROUP ELITE U-DIMM DDR5 Standard Memory complies with JEDEC standards and supports high-performance specifications of frequency 5600 MHz and 1.1 V voltage. The TEAMGROUP ELITE U-DIMM DDR5 Standard Memory has also been sent to major motherboard manufacturers for verification. As the world welcomes the advent of the DDR5 era, TEAMGROUP will continue to launch memory products with comprehensive compatibility and upgraded specifications.

TEAMGROUP is making an early play in the field of DDR5s. Last year, the company launched the TEAMGROUP ELITE U-DIMM DDR5 4800 MHz 1.1 V Standard Memory ahead of the industry and is now announcing an increased frequency from 4,800 MHz to 5,600 MHz with the same 1.1 V voltage, ensuring users can enjoy high-performance experiences while still conserving energy. The latest TEAMGROUP ELITE U-DIMM DDR5 Standard Memory will also be available in different storage capacities, including 2X8GB, 2X16GB, and 2X32GB, to deliver smooth multi-tasking and an outstanding product that is stable, high-performance, and energy-efficient.

AMD RAMP is Now Called EXPO

A little over three months ago, leaks suggested AMD was going to introduce its own competitor to Intel's XMP profiles called RAMP or Ryzen Accelerated Memory Profile. However, it seems like the company has decided to change the name of its XMP competitor and according to VideoCardz, the standard will be known as EXPO or Extended Profiles for Overclocking. AMD filed for a trademark for EXPO back in the middle of February, although it's unclear if it has been granted as yet.

According to information that VideoCardz has been given, EXPO is said to be able to store two profiles for memory overclocking and it'll be exclusively for DDR5 memory. AMD has gone for a novel approach compared to XMP, with the first profile being for high-bandwidth optimised settings and the second for low-latency. The second profile is apparently optional, which makes sense since not all memory modules can do low-latency. EXPO is also said to be compatible with all types of memory modules, so it might also appear in SO-DIMM modules in the future.

MSI Wins Three Coveted iF DESIGN Awards 2022

The dust from Red Dot Design Award 2022 starts to settle. MSI, a world-leading brand in gaming, content creation and commercial hardware, announced that they earn another three prizes in the prestigious iF DESIGN AWARD in Gaming Hardware/VR/AR category. "To be recognized by the prestigious Red Dot Product Design Awards for our relentless pursuit of innovative design is truly an honor and is also the best encouragement to MSI's design teams. MSI's design capability to commit "Tech meets Aesthetic" is unquestionable. We're continuing to deliver cutting-edge design for all customers," said Sam Chern, MSI Marketing Vice President.

This year, the winning products are the top-tier Stealth GS77 gaming laptop, MEG Z690 GODLIKE, and MPG Z690 FORCE WIFI motherboards. The iF DESIGN AWARD is recognized as an arbiter of quality for exceptional design and is one of the most celebrated design competitions in the world. Being awarded is definitely a seal of outstanding quality for MSI's product design quality. "We are honored to be acknowledged by iF DESIGN jurors, which is a further testament to our commitment to making our products with design quality, functionality, and innovation in mind. We're continuing to deliver edgy design for gamers and content creators, " says Sam Chern, MSI Marketing Vice President.

G.SKILL Announces New Ultra Low-Latency DDR5-6600 CL34 Memory Kit

G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory and gaming peripherals, is pleased to announce the launch of an ultra-low latency, high-speed DDR5-6600 CL34 32 GB (2x 16 GB) memory kit under the Trident Z5 RGB series DDR5 memory, for the latest 12th Gen Intel Core desktop processors and Intel Z690 chipset motherboards.

Fully committed to develop extreme performance overclocking memory kits, G.SKILL is releasing a new ultra-low latency, high-speed DDR5-6600 CL34-40-40-105 memory kit in 32 GB (2x16GB) kit capacity. The screenshot below shows this memory kit validated with the Intel Core i7-12700K processor and ASUS ROG Maximus Z690 Hero motherboard.

ASML Reports Q1 2022 Financial Results

Our first-quarter net sales came in at €3.5 billion which is at the high end of our guidance. The gross margin of 49.0%, is as guided. Our first-quarter net bookings came in at €7.0 billion, including €2.5 billion from 0.33 NA and 0.55 NA EUV systems as well as very strong DUV bookings, reflecting the continued high demand for advanced and mature nodes.

"We continue to see that the demand for our systems is higher than our current production capacity. We accommodate our customers through offering high-productivity upgrades and reducing cycle time in our factories, and we continue to offer a fast shipment process. In addition, we are actively working to significantly expand capacity together with our supply chain partners. In light of the demand and our plans to increase capacity, we expect to revisit our scenarios for 2025 and growth opportunities beyond. We plan to communicate updates in the second half of the year.

Dell Will Have Custom DDR5 Memory Module for its Upcoming Laptops

A leak with details about upcoming Dell notebooks has revealed that Dell's upcoming notebooks with DDR5 memory will feature a custom memory module that Dell calls CAMM, or Compression Attached Memory Module. The CAMM can support up to 128 GB RAM according to the leak and initial modules will support memory speeds of 4800 MHz. It's unclear if notebooks with CAMM support will have soldered down memory as well, but what is clear is that Dell is not looking at using traditional SO-DIMM type modules.

The first notebooks from Dell to feature the new module appears to be the Precision 7-series, which will also feature an Intel 55 W Alder Lake-HX series CPU, a choice of an NVIDIA RTX A5000 GPU or Intel Arc DG2 based graphics with a 90 W TDP, as well as up to 12 TB of NVMe storage over PCIe 4.0. Apparently Dell has developed what it calls DGFF or Dell Graphics Form Factor for these laptops, which suggests that they'll feature some kind of modular graphics solution. Considering that at least some models in Precision 7-series will sport 16-inch displays, there should be plenty of space for a GPU module, although it'll be interesting to see exactly what Dell is bringing to the table that's new here.

Kioxia and Western Digital Jointly Invest in New Flash Memory Manufacturing Facility in Yokkaichi Plant

Kioxia Corporation and Western Digital Corp. (NASDAQ: WDC) have finalized a formal agreement to jointly invest in the first phase of the Fab 7 (Y7) manufacturing facility at Kioxia's industry-leading Yokkaichi Plant in the Mie Prefecture of Japan. With construction of the first phase of Y7 completed, the joint-venture investment will enable initial production output beginning in the fall of this year. This marks another important milestone in the 20-year strategic joint-venture partnership between the two companies.

"We are very pleased to further deepen our strategic partnership with Western Digital through this joint investment in Y7," said Nobuo Hayasaka, President and CEO of Kioxia. "The rapid digitization of societies underpins accelerating use of memory products. We will continue to leverage our technological partnership and economies of scale to develop and produce cutting-edge semiconductor products and achieve organic corporate growth."

AMD Ryzen 7000 "Zen 4" Processors Have DDR5 Memory Overclocking Design-Focus

AMD's first desktop processor with DDR5 memory support, the Ryzen 7000 series "Raphael," based on the "Zen 4" microarchitecture, will come with a design focus on DDR5 memory overclocking capabilities, with the company claiming that the processors will be capable of handling DDR5 memory clock speeds "you maybe thought couldn't be possible," according to Joseph Tao who is a Memory Enabling Manager at AMD.

Tao stated: "Our first DDR5 platform for gaming is our Raphael platform and one of the awesome things about Raphael is that we are really gonna try to make a big splash with overclocking and I'll just kinda leave it there but speeds that you maybe thought couldn't be possible, may be possible with this overclocking spec." We are hearing reports of AMD innovating a new overclocking standard for DDR5 memory, which it calls RAMP (Ryzen Accelerated Memory Profile), which it is positioning as a competing standard to Intel's XMP 3.0 spec.

Micron GDDR6X Increases Bandwidth and Capacity

Micron Technology, Inc., today announced the volume production of its new 16Gb GDDR6X memory, which is now shipping in the NVIDIA GeForce RTX 3090 Ti graphics card. The latest GDDR6X memory, available only from Micron, features twice the capacity and up to 15% higher performance over the previous 8Gb version. These additional capabilities mean end users can experience razor-sharp visuals, higher frame rates and outstanding performance in memory-intensive applications like gaming and content creation. Today Micron extends its performance leadership by providing a new graphics memory with 16Gb capacity and running at an industry-best 21 Gb/s in the GeForce RTX 3090 Ti. With a performance roadmap up to 24 Gb/s, GDDR6X is ready for data-hungry applications of the future. Additionally, Micron's innovative use of PAM4 signal techniques in GDDR6X make it more power efficient than any of the GDDR6 products publicly available.

"The industry-leading capabilities of Micron's GDDR6X memory help bring new levels of realism and performance to the most demanding applications," said Mark Montierth, vice president and general manager of High-Performance Memory and Networking at Micron. "Micron is once again at the forefront of the memory innovation powering today's highest bandwidth solutions and built with the advanced process and interface technology to enable continued graphics performance leadership."

SMART Modular Announces the SMART Kestral PCIe Optane Memory Add-in-Card to Enable Memory Expansion and Acceleration

SMART Modular Technologies, Inc. ("SMART"), a division of SGH and a global leader in memory solutions, solid-state drives, and hybrid storage products, announces its new SMART Kestral PCIe Optane Memory Add-in-Card (AIC), which is able to add up to 2 TB of Optane Memory expansion on a PCIe-Gen4-x16 or PCIe-Gen3-x16 interface independent of the motherboard CPU. SMART's Kestral AICs accelerate selected algorithms by offloading software-defined storage functions from the host CPU to the Intel FPGA on the AIC. SMART's Kestral memory AICs are ideal for hyperscale, data center, and other similar environments that run large memory applications, and would benefit from memory acceleration or system acceleration through computational storage.

"With the advancement of new interconnect standards such as CXL and OpenCAPI, SMART's new family of SMART Kestral AICs addresses the industry's need for a variety of new memory module form factors and interfaces for memory expansion and acceleration," stated Mike Rubino, SMART Modular's vice president of engineering. "SMART is able to leverage our many years of experience in developing and productizing controller-based memory solutions to meet today's emerging and continually evolving memory add-on needs of server and storage system customers."

Sabrent Announces High-Performance SO-DIMM DDR4-3200 CL22 Memory Modules

Sabrent Rocket 8 GB, 16 GB, and 32 GB DDR4 SO-DIMM 3200 MHz Memory Module for laptop, Ultrabook, and mini-PC. Expand your horizons with Sabrent Rocket DDR4 memory. Your favorite SSD company wants to make sure the rest of your system feels responsive, too. We provide affordable, high-capacity DRAM options to make sure you never feel left behind. Our passion for memory matches your desire to exceed the limits of your imagination. Our design is tight and cool, making sure never to get in the way of your dreams.

Running out of memory? Providing up to 32 GB of memory per stick, Sabrent's Rocket DDR4 has all your needs covered. You're just a single upgrade away from a lag-free experience. Don't let your lack of memory slow you down - realize the potential to multi-task like never before. Our DRAM will improve your productivity and your gaming experience, all at the same time.

Kioxia Introduces UFS Ver. 3.1 Embedded Flash Memory Devices for Automotive Applications

Kioxia Corporation, a world leader in memory solutions, today announced that it has started sampling new Automotive Universal Flash Storage (UFS) Ver. 3.1 embedded flash memory devices. The new line-up utilizes the company's BiCS FLASH 3D flash memory and is available in capacities from 64 gigabytes (GB) to 512 GB to support the various requirements of evolving automotive applications that elevate driver experiences.

The storage requirement for automotive applications continue to increase as infotainment systems and ADAS in cars become more sophisticated. UFS is well-suited to support the high-performance and density needs of these applications. The new devices support a wide temperature range (-40°C to +105°C), meet AEC-Q100 Grade 2 requirements and offer enhanced reliability capabilities that increasingly complex automotive applications require.

G.Skill Announces DDR5-6000 CL30 64GB (32GB x2) Memory Kit

G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory and gaming peripherals, is delighted to announce the launch of a high-capacity, ultra-low-latency DDR5-6000 CL30 64 GB (32 GB x2) overclocked performance memory kit under the Trident Z5 family, designed for the latest 12th Gen Intel Core desktop processors and Intel Z690 chipset motherboard.

As the leader in developing high performance memory products, G.SKILL launches an all new high-capacity, ultra-low-latency dual-channel memory kit, rated at a blistering DDR5-6000 CL30-40-40-96 in 64 GB (32 GB x2) kit capacity. Using only the best-in-class memory components to achieve high-speeds with 32 GB module capacity, this extreme overclocked memory specification represents the next step in high-capacity DDR5 performance. The screenshot below shows this memory kit validated with the Intel Core i7-12700K processor and ASUS ROG Maximus Z690 Hero motherboard.

Memtest86+ 6.00 Update Promised for This Summer

Memtest86+, the spiritual successor of MemTest86, has been somewhat stuck in development hell, but now the developer behind the memory testing software has promised to deliver version 6.00 sometime this summer. Version 5.31b was released in April 2020, some six years after the previous release and still not released as a final build, largely due to the pandemic. Version 6.00 promises a host of new features and the developers are already now asking for people that want to pitch in and help out with the project, since it's an open-source project.

The goal of version 6.00 is to deliver 64-bit support, UEFI and DDR5 with XMP support, as well as support for up to 256 CPU cores. Other features that are said to come include PXE and native USB boot. The goal is to provide a beta build sometime in April, but for those that don't mind compiling their own version of the code, can give it a try now, although the developers are warning that the code is going to be buggy at this point. The base code is said to have been re-written from scratch compared to prior versions and a lot of features are still missing and some features from the older versions are said to have been dropped, at least for the time being.

Top 10 Foundries Post Record 4Q21 Performance for 10th Consecutive Quarter at US$29.55B, Says TrendForce

The output value of the world's top 10 foundries in 4Q21 reached US$29.55 billion, or 8.3% growth QoQ, according to TrendForce's research. This is due to the interaction of two major factors. One is limited growth in overall production capacity. At present, the shortage of certain components for TVs and laptops has eased but there are other peripheral materials derived from mature process such as PMIC, Wi-Fi, and MCU that are still in short supply, precipitating continued fully loaded foundry capacity. Second is rising average selling price (ASP). In the fourth quarter, more expensive wafers were produced in succession led by TSMC and foundries continued to adjust their product mix to increase ASP. In terms of changes in this quarter's top 10 ranking, Nexchip overtook incumbent DB Hitek to clinch 10th place.

TrendForce believes that the output value of the world's top ten foundries will maintain a growth trend in 1Q22 but appreciation in ASP will still be the primary driver of said growth. However, since there are fewer first quarter working days in the Greater China Area due to the Lunar New Year holiday and this is the time when some foundries schedule an annual maintenance period, 1Q22 growth rate will be down slightly compared to 4Q21.

Apple M1 Ultra Chip Uses Multi-Chip Module Design to Create a Massive Software Agnostic Processor

Apple yesterday announced its M1 Ultra processor. It is designed to be one of the most powerful solutions ever envisioned for desktop users, and it leverages some of the already existing technologies. Essentially, the M1 Ultra chip combines two monolithic dies containing M1 Max designs. They are stitched together to create one massive chip behaving in a rather exciting way. To pair the two M1 Max dies together, Apple has designed a package called UltraFusion, which is a die-to-die interposer with more than 10,000 signals. It provides 2.5 TB/s low latency inter-processor bandwidth and enables seamless sharing of information across two dies.

What is more interesting is that this approach, called multi-chip module (MCM) design philosophy, allows the software to view these two dies as a single, unified processor. Memory is shared across a vast pool of processor cache and system memory in a single package. This approach is software agnostic and allows hardware to function efficiently with loads of bandwidth. Apple notes that no additional developer optimization is required for the new processor, and the already-existing stack of applications for M1 Max works out-of-the-box. Talking about numbers, the M1 Ultra chip has a potential main memory bandwidth of 800 GB/s, with up to 128 GB of unified system memory. We are yet to see how this design behaves as the first Mac Studio units start shipping, so we have to wait for more tests to check these claims out.
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