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Samsung Announces World's First 8GB LPDDR4 Memory Package

Samsung Electronics, announced today that it is introducing the industry's first 8-gigabyte (GB) LPDDR4 (low power, double data rate 4) mobile DRAM package, which is expected to greatly improve mobile user experiences, especially for those using Ultra HD, large-screen devices. The 8GB mobile DRAM package utilizes four of the newest 16 gigabit (Gb) LPDDR4 memory chips and advanced 10-nanometer (nm)-class process technology.

"The advent of our powerful 8GB mobile DRAM solution will enable more capable next-generation, flagship mobile devices around the world," said Joo Sun Choi, executive vice president of Memory Sales and Marketing at Samsung Electronics. "We will continue to provide advanced memory solutions offering the highest values and leading-edge benefits to meet the escalating needs of devices having dual camera, 4K UHD and VR features."

AMD's ZEN to Implement Advanced Security Features not found in Intel's solutions

Thanks to AMD's incorporation of an ARM-based "AMD Secure Processor" in their upcoming ZEN micro-architecture, the company is poised to offer something competitor Intel's microprocessors yet don't: memory encryption. This processor, and its underlying technologies, could prove to be a stepping-stone for AMD towards regaining lost server market share. Essentially, because in a market ever more steered by cloud computing considerations, it allows for the client's data to be encrypted at every moment of the work chain. Assuming all works as intended, for the first time not even cloud providers, with either hypervisor-level privileges or even physical access to the servers, will be able to carry out any malicious actions against their clients.

One only has to consider the writing on the wall: Morgan Stanley predicts that by 2018, 30% of Microsoft's revenue will stem from its cloud services; Amazon Web Services (AWS) generated $7.88B in revenue on Q4 2015, up 69% over 2014; and worldwide spending on public cloud services by itself will grow from $70B in 2015 to an estimated $141B in 2019. Cloud computing is here to stay, and with security being as important as it is for some businesses, this is an important area of investment for AMD. This "AMD Secure Processor" will work on essentially two fronts: SME (Secure Memory Encryption) and SEV (Secure Encrypted Virtualization), backed by an hardware-based SHA (Secure Hash Algorithm).

Team Group Announces T-Force Premium DDR4 Memory Series

The global gaming market is booting up dramatically, which will also widely increase the demand of high performance computer peripherals. Team Group has been continuously dedicated to satisfy the needs of our consumers in every aspect, and now it will integrate its gaming memory modules into T-Force product line which is specifically designed for people who pursuit extreme high speed and excellent performance. It is also the best and only choice for professional gamers as well as overclockers.

T-FORCE series line up with XTREEM, DARK, VULCAN, and NIGHT HAWK with breathing lights (LED) as sharp as hawk eyes, and the industry's first patented gaming combo package with T-FORCE DARK PRO and DARK 2.5" SSD inside. Leading the trend of high speed gaming, T-FORCE brings you the latest and top notch high speed experience. Whether it's the memory with ultimate performance or the LED memory with a cool look, they are definitely the best choices for gamers and modders.

ADATA Launches XPG Flame DDR4 Memory Modules

ADATA Technology, a leading manufacturer of high performance DRAM modules and NAND Flash products, today launched XPG FlameDDR4 memory modules. Featuring a sleek heatsink emblazoned with a flame design, XPG Flame DDR4 is available in 288-pin U-DIMM and 260-pin SO-DIMM. This marks the first XPG memory for notebooks, and makes XPG Flame an appealing choice for gamers, overclocking, and competitive benchmarkers on desktops, notebooks, and small form factor (SFF) PCs. XPG Flame uses the most carefully-sorted and assembled boards and chips for assured quality and stability. Customers can choose modules in 4 GB, 8 GB, and 16 GB densities, with speeds up to 3000 MHz on U-DIMM and 2800 MHz on SO-DIMM. All XPG Flame modules support Intel XMP 2.0 (Extreme Memory Profile) specifications and ship with a lifetime ADATA product warranty.

Following the launch of bestselling XPG Z1 DDR4 memory and lucrative XPG Dazzle LED DDR4, XPG Flame brings a highly attractive option for desktop gamers, overclockers, and tuners. With a sleek low profile heatsink, XPG Flame U-DIMM modules use a 10-layer black PCB with 2oz of copper. All of these ensure stable performance and a long module lifespan in every situation, from the most system-stressing games to competitive overclocking and benchmarking. Stock clocks range from 2400 MHz to 3000 MHz, driven by 1.2V to 1.35V. Higher speeds are quite readily possible thanks to the premium chips, circuitry, and PCB materials employed. Intel XMP 2.0 support means users have more ways to access memory overclocking, including directly from the operating system rather than via more complex BIOS settings.

VIA to Unveil its Latest SSD Controllers at FMS 2016

VIA Technologies, Inc, today announced that it be will demonstrating its latest VIA NVMe PCIe Gen III & SATA III SSD controllers in Booth#818 of the 2016 Flash Memory Summit being held from August 9th to 11th in the Santa Clara Convention Center, California, USA. Featuring the VIA LDPC PLUS ECC decoding engine with Gear-Shifting technology, the second generation VIA SSD controllers offer best-in-class error correction capability and ensure high-throughput performance without overheating issues.

"VIA Gear-Shifting technology leverages our unique dual hardware decoding architecture to maximize data integrity and longevity," said Richard Brown, VP International Marketing, VIA Technologies, Inc. "Our second generation VIA SSD controllers are the ideal choice for computing devices that require superior SSD performance with high cost-efficiency."

Patriot Memory Announces DDR4-3733 Variants of Viper 4 and Viper Elite Series

Patriot, a leading manufacturer of high performance computer memory, SSDs, gaming peripherals, consumer flash storage solutions and mobile accessories, today announced the immediate release of its new extreme performance Viper 4 and high performance Viper Elite DDR4 in 3733 MHz dual kits.

Expanding Patriot's extreme performance and high performance DDR4 memory lines, the 3733 MHz Viper 4 and Viper Elite dual channel kits are designed for optimal use with the latest Intel X99 and 100 series motherboards. With consumers utilizing more taxing professional applications, large capacity PC games and having a need for higher memory optimization, the Viper 4 and Viper Elite will present unsurpassed performance and reliability that only 30 years of DRAM experience can deliver.

SK Hynix to Ship HBM2 Memory by Q3-2016

Korean memory and NAND flash giant SK Hynix announced that it will have HBM2 memory ready for order within Q3-2016 (July-September). The company will ship 4 gigabyte HBM2 stacks in the 4 Hi-stack (4-die stack) form-factor, in two speeds - 2.00 Gbps (256 GB/s per stack), bearing model number H5VR32ESM4H-20C; and 1.60 Gbps (204 GB/s per stack), bearing model number H5VR32ESM4H-12C. With four such stacks, graphics cards over a 4096-bit HBM2 interface, graphics cards with 16 GB of total memory can be built.

Source: SK Hynix Q3 Catalog

Samsung Introduces World's First Universal Flash Storage (UFS) Memory Card

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today unveiled the industry's first removable memory cards based on the JEDEC Universal Flash Storage (UFS) 1.0 Card Extension Standard, for use in high-resolution mobile shooting devices such as DSLRs, 3D VR cameras, action cams and drones. Coming in a wide range of storage capacities including 256, 128, 64 and 32 gigabyte (GB), Samsung's UFS cards are expected to bring a significant performance boost to the external memory storage market, allowing much more satisfying multimedia experiences.

"Our new 256GB UFS card will provide an ideal user experience for digitally-minded consumers and lead the industry in establishing the most competitive memory card solution," said Jung-bae Lee, senior vice president, Memory Product Planning & Application Engineering, Samsung Electronics "By launching our new high-capacity, high-performance UFS card line-up, we are changing the growth paradigm of the memory card market to prioritize performance and user convenience above all."

Western Digital Launches World's Fastest 256GB microSD Card

Western Digital Corporation, a global storage technology and solutions leader, today introduced a new suite of 256 gigabyte (GB) microSD cards, which includes the new 256GB SanDisk Extreme microSDXC UHS-I card - the fastest microSD card in its class. The new suite of cards also includes 256GB SanDisk Ultra microSDXC UHS-I card, Premium Edition, the first 256GB card optimized for mainstream consumers. The new additions deliver leading speed and capacity in a fingernail-sized card, giving smartphone, drone and action camera users the performance and capacity they need to capture professional-grade videos and photos without worrying about running out of space on their device.

"Our microSD cards are now at the center of many consumer devices, and we're excited to not only raise the bar with the launch of the world's fastest microSD card, but to also offer a family of 256GB microSD cards that give consumers the flexibility they need to capture life at its fullest," said Dinesh Bahal, vice president of SanDisk product marketing, Western Digital. "As a leading global storage provider with one of the most trusted flash brands, we take pride in transforming the way consumers capture, store and share their content."

GeIL EVO X Memory With Split PCB Pictured

Here are some of the first pictures of GeIL EVO-X memory with its HILM (hybrid independent light module) active. GeIL essentially split the module into two PCBs, one being the more expensive, multi-layer DIMM PCB, and the other being a fewer-layered PCB holding the RGB LED lighting, with its independent power input. That's right, EVO-X is one of the first memory modules that don't use DIMM voltage to power lighting. They instead feature a tiny power input on the lighting PCB, which draws power from any vacant USB 2.0 header you may have on your motherboard (and also interfacing with your OS to let you configure the color. The EVO-X is available in reasonably high speeds such as DDR4-3866, and in densities of up to 8 GB per module.

G.Skill Intros Trident Z DDR4-4500 Memory in 8GB and DDR4-3466 128GB Kit

G.Skill introduced one of the fastest 8 GB density memory modules, with the Trident Z DDR4-4500. Available in 16 GB kits of two 8 GB modules, this DIMM achieves its advertised speeds at timings of 16-16-16-36, although its voltage is still under the wraps. The company also showed off a gargantuan 128 GB quad-channel memory kit with eight 16 GB DDR4-3466 modules (one of the highest speeds for the 16 GB density). This kit too is timed at 16-16-16-36 to achieve its rated speeds.

ZADAK511 Unveils its First DDR4 Memory Kit

ZADAK511 is a new enthusiast hardware brand that's taking flight from Computex 2016. The company partnered with HWBot to launch a new memory overclocking challenge. At Computex, the company launched its first enthusiast memory kit, the ZADAK511 Shield DDR4-3000. You see a characteristic silver-on-black neo-Gothic stylic on all the company's products launched. The memory does DDR4-3000 at timings of 16-18-18-38, although its voltage is unknown. The company apparently also has a DDR4-4266 kit, which it's giving away in the HWBot contest. So far, we've only seen 4 GB densities on these modules.

ADATA XPG Z1 DDR4-4400 Memory Pictured

ADATA is ready with its flagship XPG Z1 memory module that belts out DDR4-4400 speeds. The modules achieve DDR4-4400 at timings of 17-19-19-39, although its DRAM voltage is not known. The module was demonstrated running at its marketed speeds. It's also interesting to note that the module doesn't use heatsinks or elaborate cooling to run at these speeds, and makes to with a rather thin heatspreader.

GALAX Unveils Gamer Series DDR4 Memory

The Hall of Fame DDR4-4000 is just the tip of the iceberg, with the company giving finishing touches to a broader line of performance-segment memory kits addressing various price-points, under the colorful Gamer series. The module consists of a black PCB with a single-color crown, and its matching color LEDs glowing with a "breathing" effect. The modules come in speeds of DDR4-2133, DDR4-2400, DDR4-2666, DDR4-2800, and DDR4-3000; and in densities of 4 GB, 8 GB, and 16 GB (16 GB not available on some of the higher clocked models); making up 8 GB, 16 GB, and 32 GB dual-channel kits, respectively. The DDR4-2133, DDR4-2400, and DDR4-2666 modules are timed at 15-15-15-35 @1.2V; the DDR4-2800 module at 16-16-16-36 @1.2V; and the DDR4-3000 module at 16-16-16-36 @1.35V.

GALAX Hall of Fame DDR4-4000 Memory Pictured, Too

It looks like GALAX is also kicking the door in with enthusiast memory. The company showed off its top of the line Hall of Fame (HOF) DDR4-4000 memory, which features the company's signature white PCB, and design language along the white+chrome heatspreaders. The module comes in densities of 4 GB and 8 GB (making up 8 GB and 16 GB dual-channel kits, respectively). It achieves its marketed speed of DDR4-4000 with timings of 19-25-25-45, and module voltage of 1.4 Volts. The heatspreaders feature white LEDs with "breathing" effect.

GeIL Announces the EVO Forza DDR4 Memory Series

GeIL, a leading global manufacturer of PC components and peripherals, presents its latest addition to the EVO hardcore gaming memory product family - the DDR4 EVO FORZA Series. Developed with GeIL's MTCD - Maximum Thermal Conduction & Dissipation technology, the FORZA heat-spreader provides superior cooling performance.

Available in Hot-rod Red and Racing Yellow, the EVO FORZA Series is designed to be compatible with the latest Z170 and/or X99 platforms with frequency of up to 3866 MHz. In order to ensure the highest quality and reliability, the EVO FORZA Series are thoroughly tested and burned-in by GeIL's own DYNA4 SLT & DYNA4 DIMM SLT fully- automatic testers.

Team Group Readies New T-Force Line of Memory and SSDs

Team Group is giving finishing touches to its new T-Force line of high-performance DDR4 memory targeted at enthusiast PC builds. T-Force will be an umbrella-brand for Team Group, and the company will launch Dark, Dark Pro, and Xtreem sub-branded products under it. Below is a render of the first T-Force DDR4 memory module, with Dark Pro sub-branding. The company is said to be preparing a T-Force Xtreem module that runs at DDR4-4266 MHz with timings of 18-22-22-40, and DRAM voltage of 1.4V. Team Group is also launching solid-state drives (SSDs) under the T-Force brand, which will initially include the Dark and Dark Pro sub-brands. Below is a render of a 960 GB T-Force Dark SSD.

CORSAIR Announces Dominator Platinum ROG Edition Memory

CORSAIR, a world leader in enthusiast memory, PC components and high-performance gaming hardware today announced the latest addition to its industry leading range of XMP 2.0 certified DDR4 memory kits, the CORSAIR Dominator Platinum ROG Edition. Developed in collaboration with the ASUS Republic of Gamers team, the 16GB 4 x 4GB DDR4 kit is fitted with a unique Republic of Gamers Red and Black brushed aluminium finish, to perfectly compliment the celebrated ASUS Republic of Gamers line of motherboards.

Clocked at 3,200MHz for blistering high-bandwidth performance on Intel 100-series motherboards, CORSAIR Dominator Platinum ROG Edition also boasts a custom overclocked ROG XMP 2.0 memory profile only accessible with ASUS Z170 Republic of Gamers motherboards*, pushing the kit to an even faster 3,333MHz with just a single setting.

GeIL Announces the EVO-X Series Memory with HILM Technology

GeIL, a leading global manufacturer of PC components and peripherals, presents the all new DDR4 EVO X Hardcore Gaming Memory with GeIL's latest innovation of HILM - Hybrid-Independent-Light-Module enabling dynamic RGB LED illumination. The EVO X Seires not only excels from the Super Luce Series asthetically, the technological breakthrough in high performance memory illumination transcends even further.

HILM - Hybrid-Independent-Light-Module (Figure A) fuses LEDs, micro processor, circuits, switch and dual-power-source in one modular solution, separating the entire lighting solution and circuitry from the memory module. Thus, allowing high performance DDR4 memory module to perform at its full potential and stability.

G.Skill Introduces 5 New Color Schemes to Trident Z Series DDR4 Memory

G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory and gaming peripherals, is introducing 5 new color schemes to the highly popular extreme performance Trident Z series to select specifications. Aside from the classic Trident Z design of silver and black brushed aluminum heatspreader with a red top-bar highlight, the new color schemes include a black brushed aluminum body paired with orange, yellow, or white top-bar or a silver brushed aluminum body with white or black top-bar.

With a rise in popularity of modding and cases with window designs, these 5 new Trident Z color schemes are developed for enthusiasts, gamers, and modders who not only wish to include high performance memory in their systems, but also to add attractive visual appeal and show off their unique selection of hardware. Available in yellow, orange, white, and black highlights, these new color schemes pair exceedingly well with modern motherboard designs based on the X99 and Z170 chipsets.

ADATA Launches XPG Dazzle LED DDR4 Memory Modules

ADATA Technology, a leading manufacturer of highperformance DRAM modules and NAND Flash products, today launched XPG Dazzle,itsfirst line of LED DDR4 memory modules. The modules feature illuminated LED strips and DDR4 specificationsforan exciting look that complements their high performance and power efficiency. Utilizing patented LED memory module technology by AVEXIR, XPG Dazzle makes PCs much more eye-catching to meet growing demand by case modders, PC enthusiasts, and gamers for unique, colorful, and vibrant system builds.

XPG Dazzle LED DDR4 memory modules maintain and evolve the aggressive but sleek style of XPG products, featuring a tough outline, cool color combinations, and their own unique highlight in the form of a shining LED strip built into the heatsink. With a special design and alluring red LED, XPG Dazzle accentuates chassis appearance and revitalizes performance PCs, whether for overclocking, gaming, or pure case modding showcases. XPG Dazzle memory modules are available in different kits: 8GBx2, 8GB x4, 16GBx2, and 16GBx4, giving users greater flexibility when assembling high-end systems.

Crucial Announces New, High-Density DDR4 Server Memory

Crucial, a leading global brand of memory and storage upgrades, today announced the availability of two new offerings in its server memory product portfolio: 32 GB DDR4 VLP RDIMMs and 64 GB DDR4 LRDIMMs. With speeds of 2400 MT/s and engineered to enable higher densities by implementing a dual stack of 8 Gb DDR4 DRAM die to engineer a single 16 Gb component, these new DDR4 server memory modules allow for increased memory density, performance and bandwidth.

The 32 GB VLP RDIMMs are the highest density server memory modules Crucial offers for that module form factor, and are almost half the height (40 percent shorter) of a standard RDIMM module. These high density modules help enable memory dense systems like blade servers and microservers without compromising performance. Additionally, they can be installed at a 90-degree angle to the motherboard in these height-constrained systems, which enables better airflow to keep the system cool..

G.SKILL Announces DDR4 3600 MHz CL15 16 GB Low Latency Memory Kit

G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory and gaming peripherals, is announcing a new DDR4 memory kit at DDR4 3600 MHz CL15-15-15-35 1.35V under its legendary Trident Z flagship series! This memory kit will be made available in 8 GBx2 configuration for a total of 16 GB, making this Trident Z kit an essential part of any high performance system builds.

High Performance, High Efficiency
Utilizing specially selected high performance memory components, G.SKILL has continued to improve upon the specifications of DDR4 to maintain a latency of CL15 at 3600 MHz, a high frequency that typically could only be achieved with slower latencies. Designed with XMP 2.0 profiles, achieving a highly efficient system is now easier than ever. A stress testing screenshot of the high efficiency memory kit with ASUS Z170-DELUXE motherboard and Intel Core i5 6600K processor can be found below.

Worldwide Availability
The Trident Z DDR4 3600 MHz CL15 16 GB (8 GBx2) memory kit will be available via authorized G.SKILL worldwide distribution partners at the end of April 2016.

Samsung Starts Mass Producing Industry's First 10-Nanometer Class DRAM

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, announced today that it has begun mass producing the industry's first 10-nanometer (nm) class, 8-gigabit (Gb) DDR4 (double-data-rate-4) DRAM chips and the modules derived from them. DDR4 is quickly becoming the most widely produced memory for personal computers and IT networks in the world, and Samsung's latest advancement will help to accelerate the industry-wide shift to advanced DDR4 products.

Samsung opened the door to 10nm-class DRAM for the first time in the industry after overcoming technical challenges in DRAM scaling. These challenges were mastered using currently available ArF (argon fluoride) immersion lithography, free from the use of EUV (extreme ultra violet) equipment. Samsung's roll-out of the 10nm-class (1x) DRAM marks yet another milestone for the company after it first mass produced 20-nanometer (nm) 4Gb DDR3 DRAM in 2014.

Giada Launches the Super-Compact i80

Giada Technology, the industry leader in embedded systems and expert in server technology, today officially announced the release of the i80 high-performance super-compact PC. The i80 embodies the core principles of Intel's NUC (Next Unit of Computing) concept, offering great power, connectivity and adaptability, but with a tiny footprint. Powered by a 6th generation Intel Core CPU and the Skylake-U platform, the i80 provides a balanced system that's powerful and versatile when you need it to be, but also very compact and energy efficient.

Despite its diminutive size, the i80 features dual independent monitor support, at up to 4K (4096 x 2304) resolution, via the HDMI and Mini-DP sockets. There's efficient integrated Intel HD Graphics 520 built-in to drive video and graphics. Memory is expandable up to 16GB via two SO-DIMM sockets for DDR3L-1600 MHz memory modules, providing great support for today's applications and far into the future. The dual channel capability significantly improves system and video performance. This core hardware offers great office and media benchmark performance.
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