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G.Skill Releases AMD Ryzen-optimized Trident Z RGB DDR4 Memory

G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory and gaming peripherals, announces a new lineup of Trident Z RGB DDR4 memory kits with enhanced compatibility on the latest AMD platforms. Specifically designed for AMD Ryzen and Ryzen Threadripper platforms, now there are vibrant options up to the popular DDR4-3200MHz CL14 or the massive 128GB (8x16GB) kits at up to 2933MHz. For a full range of memory kit capacity options, the new Trident Z RGB memory kit models are available at DDR4-2400MHz in 2-, 4-, and 8-module kit configurations with 8GB and 16GB modules, which allows for 16GB, 32GB, 64GB, or 128GB memory kits for your AMD system.

AMD currently has two platform offerings, where Ryzen supports dual-channel with 2 or 4 memory modules and Threadripper supports quad-channel memory with 4 or 8 memory modules. To give a boost in memory performance to AMD number-crunching workstations and high-end graphic rendering systems, G.SKILL offers several selections for each AMD platform, including memory speeds of up to DDR4-2933MHz or ultra-high capacity at 128GB (8x16GB).

EVGA Announces GeForce GTX 1080 Ti FTW3 ELITE Graphics Card

The EVGA GeForce GTX 1080 Ti FTW3 ELITE cards are now available with 12 GHz of GDDR5X memory, giving it 528 GB/s of memory bandwidth! These cards are available with either the ELITE Black or White shroud, and of course comes with EVGA's exclusive iCX technology, giving you 9 thermal sensors, onboard thermal LED indicators and incredible cooling with quiet operation.

Features
  • Includes EVGA iCX Technology
  • 12 GHz GDDR5X Memory
  • 528 GB/s of Memory Bandwidth
  • Available in ELITE Black and White Colors

Toshiba Elects Bain Capital as Preferred Bidder for its Entire Memory Business

The light is being seen at the end of the tunnel for one of the tech world's most recent debacles. A series of questionable investments and accounting scandals saw Toshiba facing losses in the billions of dollars and see its stock pricing plummet by more than 40%. As such, to staunch the bleeding, the company was looking to only spin-off a 20% stake in its memory business; however, as its finances continued to take a turn to the worse, it then decided on selling a majority, 60% stake to the highest bidder. That would seemingly still not be enough, however, as the company will now sell 100% of its memory semiconductor business to investment consortium Bain Capital.

GeIL Intros Super Luce RGB Lite DDR4 Memory

GeIL today introduced the Super Luce RGB Lite DDR4 memory series. These modules are practically identical to the Super Luce RGB Sync, which the company launched earlier this month, with a few key differences. The Super Luce RGB Lite lacks software-based RGB LED management, and has a preset combination of multi-color lighting that's put out from its diffuser. It lacks any cabling to the RGB header of your motherboard or RGB controller. This is in contrast to the Super Luce RGB Sync, which comes with a thin RGB cable, and supports software such as ASUS Aura Sync, giving you control over the lighting.

Under the illuminated heatspreaders, however, the Super Luce RGB Lite is identical to its sibling. Available in speeds ranging from DDR4-2133 to DDR4-3000, these modules come in densities of 4 GB, 8 GB, and 16 GB, making up single-module and dual-channel kits of 4 GB, 8 GB (2x 4 GB), 16 GB (2x 8 GB), and 32 GB (2x 16 GB). There are also AMD Edition variants of these modules, which are individually tested by GeIL to work at their advertised speeds with AMD Ryzen processors. The modules are backed by lifetime warranties, and are expected to be about 10 to 15 percent cheaper than comparable Super Luce RGB Sync kits.

Toshiba to Sell Memory Production Sector to WD-led Consortium for $18.3 billion

It's been an interesting time if you're an avid reader of memory-related news pieces. Between increasing prices, Toshiba's debacle and subsequent spin-off of their memory division, to Toshiba and Western Digital butting heads regarding acquisition of said spin-off, and today's news, little was left to thread. Now, reports are surfacing that place Western Digital's consortium as being the (as of yet unofficial) winner in the bid for Toshiba's partial spin-off of their memory division. The deal is being valued at $18.3 billion, Japanese news outlet Nikkan Kogyo says, with Toshiba planning to make a formal decision on Wednesday, with the signing of an agreement to come on Sept. 20.

GeIL Announces Super Luce RGB Sync DDR4 Memory

Golden Emperor International Ltd. - one of the world's leading PC components & peripheral manufacturers announced SUPER LUCE RGB SYNC Series Gaming Memory featuring RGB LED illumination. Inheriting the stylish design from the previous generation, SUPER LUCE RGB SYNC Series Gaming Memory upgrades the LED lighting effect from single color LED to RGB LED, providing the fanciest lighting effect for gamers looking for RGB memory products without cable management. Heat spreaders are available in black and white color themes to match different gaming PC build preferences.

With the demand for RGB illuminated PC components rapidly growing, not only hardcore gamers but also mainstream users are looking for fancy RGB gaming memory. Perfectly supporting ASUS AURA lighting control app, SUPER LUCE RGB SYNC allows users to enjoy the seamless synchronization of RGB lighting effects from the motherboard, graphics card, light strips, and memory kits. The cable-less design is a great plus to simplify the cable management.

Intel Announces Xeon-W Workstation CPUs - Skylake-SP and ECC Memory

In a response to AMD's current uptake in the consumer, HEDT and server markets with its vertical slice of the Zen architecture, Intel has started rebranding their products and image, changing product names and placement in a bid to increase the "freshness" factor of its offerings. E5 and E7 Xeons are gone, with the introduction of a metallic naming scheme: Bronze, Silver, Gold and Platinum are now Intel's Xeon products, and Xeon-W takes the spot as Intel's workstation-oriented product stack. They do this by being - essentially - a conversion of Intel's Core i9 X299 family of processors towards the professional market with inclusion of professional-geared features. And as is usual with Intel, a new chipset - C422 - is needed in order for these to properly function.

The new Xeon-W product family will still make use of the LGA 2066 socket, bringing with them ECC and vPro support. The Xeon-W CPU family will feature 4 to 18 cores, support up to 512GB of ECC RDIMM/LRDIMM memory, support dual 512-bit FMAs, and peak clocks of 4 GHz base and 4.5 GHz Turbo. All the parts will support 48 PCIe 3.0 lanes from the processor,and CPUs in the Xeon-W stack are rated at 140W TDP: with exception of the quad cores, which come in at at 120W. Xeon-W processors only support Turbo Boost 2.0, instead of their Core i9 counterparts' Turbo 3.0.

SanDisk Announces a 400GB microSDXC Card

Western Digital Corporation, a global data storage technology and solutions leader, today announced its 400 GB SanDisk Ultra microSDXC UHS-I card, the world's highest-capacity microSD card for use in mobile devices. Two years after introducing its record-breaking 200 GB SanDisk Ultra microSDXC card, Western Digital has doubled the capacity within the same tiny form factor. Keeping up with the demands of today's mobile-centric lifestyle, the new SanDisk microSD card provides consumers with the freedom to capture, save and share photos, videos and apps, and enjoy offline content - all without worrying about storage limitations.

"Mobile devices have become the epicenter of our lives, and consumers are now accustomed to using their smartphones for anything from entertainment to business. We are collecting and sharing massive amounts of data on smartphones, drones, tablets, PCs, laptops and more. We anticipate that storage needs will only continue to grow as people continue to expect more sophisticated features on their devices and desire higher quality content," Jeff Janukowicz, research vice president, IDC. "We estimate mobile device users worldwide will install over 150 billion applications alone this year, which require a ton of memory on all of our favorite devices."

GALAX HOF Extreme Limited Edition Chrome-Plated DDR4 Modules Now Available

GALAX has seemingly found itself in a profitable market position with its products marketed for the premium enthusiast, with their (perspective depending) bold good looks and out of the ordinary propositions for new products. Now, the company has announced an extremely limited edition kit (really; there are just 50 of these) of DDR4 memory, aptly named the HOF Extreme Limited Edition. The "Extreme Performance" engraving on the aluminum heat spreaders serves as a psychological reminder for the kits that they just "gotta go fast", and should put to rest concerns regarding memory performance.

Under the heatspreaders rest handpicked Samsung B-die chips, which should guarantee better performance and stability compared to other memory dies (particularly in the AMD Ryzen platform). The modules are available for direct purchase from the GALAX store, and the company is currently offering a 20% discount for users who have previously acquired one of the company's GALAX GTX 1080Ti OC Lab Edition. The kits are available in 16 GB (2x 8GB) dual-channel pairs, and orders will receive free shipping with an estimated shipping date towards the end of the month. The kits run at particularly impressive speeds of 4133MHz, with CL 19-21-21-41 timings, at 1.35V. Pricing is slightly less limited in this product, though; a dual-channel kit will set you back some $368 (around $294 if you have previously bought the OC Lab Edition GTX 1080 Ti.)

Sources: ETeknix, GALAX Store

GALAX Announces GPU Overclocking Products - Power Board and LN2 Memory Pot

GALAX is apparently on the verge of launching two GPU overclocking-specific products, materialized in the HOF Power Board and an LN2 memory pot kit. Built to increase overclockability in your graphics card of choice, the GALAX power board will allow you to feed the GPU with way more power than it is designed to receive - provided you have decent cooling for the increased temperatures and operating voltages. And with the caveat of whether or not your GPU manufacturer of choice allows such changes in voltage.

Toshiba Introduces World's First Enterprise-Class SSDs with 64-Layer 3D Flash Me

Toshiba America Electronic Components, Inc. (TAEC), a committed technology leader, today unveiled the development of two new flagship enterprise solid state drive (SSD) solutions, the TMC PM5 12 Gbit/s SAS series and the CM5 NVM Express (NVMe) series. Development is expected to be completed in the fourth quarter. Both product lines are built with TMC's latest 64 layer, 3-bit-per-cell enterprise-class TLC (triple-level cell) BiCS FLASH2, making it possible for today's demanding storage environments to expand the use of flash with cost-optimized 3D flash memory. With all-new, advanced features, the innovative CM5 and PM5 series raise the bar in performance capabilities and create new opportunities for businesses to leverage the power of flash storage.

Offering up to 30.72TB in a 2.5-inch form factor, the TMC PM5 series introduces a full range of endurance and capacity SAS SSDs enabling data centers to effectively address big data demands while streamlining storage deployments. With the industry's first MultiLink SAS architecture, the PM5 series is able to deliver the fastest performance the market has seen from a SAS-based SSD with up to 3,350 MB/s of sequential read and 2,720 MB/s of sequential write6 in MultiLink mode and up to 400,000 random read IOPS in narrow or MultiLink mode. The PM5 series' 4-port MultiLink design is an additional technology to achieve high performance, close to PCI EXPRESS (PCIe)8 SSDs, enabling legacy infrastructures to increase productivity without having to be re-architected from the ground up. Furthermore, PM5 SSDs support multi-stream write technology, a feature that intelligently manages and groups data types to minimize write amplification and minimize garbage collection, translating into reduced latency, improved endurance, increased performance and Quality of Service (QoS).

Western Digital Announces Four-Bits-Per-Cell (X4) Technology on 3D NAND

Western Digital Corp. today announced its successful development of four bits per cell, X4, flash memory architecture offering on 64-layer 3D NAND, BiCS3, technology. Building on its pioneering innovation of X4 for 2D NAND technology and past success in commercializing it, the company has now developed X4 for 3D NAND by leveraging its deep vertical integration capabilities. These include silicon wafer processing, device engineering to provide sixteen distinct data levels in every storage node, and system expertise for overall flash management. BiCS3 X4 technology delivers an industry-leading storage capacity of 768 gigabits on a single chip, a 50 percent increase from the prior 512 gigabit chip that was enabled with the three bits per cell (X3) architecture. Western Digital will showcase removable products and solid-state drives built with BiCS3 X4 and systems capabilities in August at the Flash Memory Summit in Santa Clara, California.

"The implementation of X4 architecture on BiCS3 is a significant development for Western Digital as it demonstrates our continued leadership in NAND flash technology, and it also enables us to offer an expanded choice of storage solutions for our customers," said Dr. Siva Sivaram, executive vice president, Memory Technology, Western Digital. "The most striking aspect in today's announcement is the use of innovative techniques in the X4 architecture that allows our BiCS3 X4 to deliver performance attributes comparable to those in BiCS3 X3. The narrowing of the performance gap between the X4 and X3 architectures is an important and differentiating capability for us, and it should help drive broader market acceptance of X4 technology over the next several years."

GEIL Announces EVO Spear Series of DDR4 Memory Kits

GEIL's EVO Spear joins the company's DDR4 memory line-up with some inconspicuous looks and lack of LED lighting. The new series from GEIL also features something that's not all that common nowadays - a standard DIMM-sized heat spreader, which doesn't add much volume to the parts. This means these kits shouldn't pose many clearance problems (if any), which is a good thing in some smaller form-factor builds.

The new Kits from GEIL are available in both Intel and AMD-compatibility kits, and the new series is fully compatible with the Intel X299 HEDT platofrm (it remains to be see if the AMD-compatible parts will have the same compatibility towards the company's X399 Threadripper platform.). GEIL offers the module in speeds of 2133MHz up to 3466MHz, in single, dual or quad-channel kits. GEIL didn't release pricing information as of yet, but says that "EVO Spear Series is designed for PC gamers looking for well-performed standard-height gaming memory without high price tag." This probably means these kits will sell for less than comparable GEIL kits from other series. Expect these to hit the streets this July.

Sources: GEIL, via ETeknix

TechPowerUp and Patriot Memory 4th of July Giveaway: The Winners!

TechPowerUp and Patriot Memory brought you the 4th of July Giveaway to celebrate America's 241st Independence Day. Up for grabs were three of Patriot's finest Viper Gaming peripherals, including the latest Viper Gaming V770 gaming keyboard, V570 gaming mouse, V370 gaming headset, V530 gaming mouse, and V361 gaming headset with stand. Open to residents of the US and Canada, the giveaway concluded today, and without further ado, here are the winners:
  • 1st prize - Sam from Worcester MA: Wins a Viper Gaming V770 keyboard + Viper V570 mouse + Viper V370 headset
  • 2nd prize - Colton from Pittston PA: Wins a Viper V361 headset with headset stand and USB 3.0 hub
  • 3rd prize - Victor from Machias ME: Wins a Viper V530 mouse
A huge congrats to you guys! TechPowerUp and Patriot Memory Viper Gaming will return with more such interesting giveaways!

GIGABYTE Releases First Wave Of Products Based On Skylake Purley Architecture

GIGABYTE today announced its latest generation of servers based on Intel's Skylake Purley architecture. This new generation brings a wealth of new options in scalability - across compute, network and storage - to deliver solutions for any application, from the enterprise to the data center to HPC. (Jump ahead to system introductions).

This server series adopts Intel's new product family - officially named the 'Intel Xeon Scalable family' and utilizes its ability to meet the increasingly diverse requirements of the industry, from entry-level HPC to large scale clusters.. The major development in this platform is around the improved features and functionality at both the host and fabric levels. These enable performance improvements - both natively on chip and for future extensibility through compute, network and storage peripherals. In practical terms, these new CPUs will offer up to 28 cores, and 48 PCIe lanes per socket.

Patriot Announces Memory Compatibility with AMD Ryzen and AM4 Platforms

Patriot, a global leader in performance memory, SSDs, gaming peripherals and flash storage solutions, announces the compatibility of its Viper 4, Viper Elite and Signature Line DDR4 with the new AMD Ryzen and AM4 platforms. After extensive compatibility testing on X370 and B350 chipsets, using the AMD Ryzen R5 and R7 processors, and in partnership with key motherboard vendors, Patriot has developed a list of Ryzen compatible DDR4 parts.

"After working closely with our motherboard partners, these compatible kits will deliver maximum performance at factory-tested speeds," said Victor Chiu, DRAM Product Manager for Patriot. Offering compatible dual, quad and single configurations, with capacities ranging from 4GB to 64GB and speeds between 2133MHz and 3400MHz, Patriot Viper Elite, Viper 4 and Signature Line DDR4 Memory will provide both the every-day consumer as well as the PC enthusiast looking to upgrade their system to the new AMD Ryzen platform with reliable, award-winning, memory.

Toshiba and WD Power Struggle Continues - WD Bid for Toshiba's Business 6 Times

You must remember the ongoing house of horrors that is Toshiba's financial situation. Granted, it isn't that bad - the company is still managing to push the envelope on its semiconductor production business. Still, I'm sure the company would have liked to not be on the verge of selling out 20% of its memory business production stake - which is one of the company's most profitable divisions to begin with.

Team Group Announces T-FORCE DELTA RGB Luminous Memory Modules

TEAMGROUP's gaming brand T-FORCE has once again shined with the launch of the all-new luminous DDR4 memory module: the DELTA RGB. Making its debut at COMPUTEX 2017, the DELTA RGB has captured everyone's attention during the exhibition with its dazzling ultra wide angle and full-range spectrum lighting effect. The DELTA RGB memory module features black or white heat spreaders, created by the TEAMGROUP design team with all new concepts. The heat spreaders are made with improved, high-quality metal that creates better dissipation and now are lighter and thinner than anything before it. The R on the DELTA RGB represents not only RGB but also revolution which symbolizes the company's creative concept with uncompromised spirit. To further highlight this symbolism, the effect of R is also amazingly showcasing the excellent illumination of DELTA RGB.

The DELTA RGB's unibody, geometric design gives the metal heat spreader a simple yet aggressive look. The embossed lines on the surface not only increase the heat dissipation area and also effectively enhance cooling of the memory module, so the quality of the operation can be finely stabilized. DELTA RGB is using full color, dazzling ultra wide angle RGB LED lighting with Force Flow effect. Moreover, the full range, 120° ultra wide angle luminous area at the top emits colorful bright light. It offers a vibrant array of colors that dazzle onlookers. Like a beam saber, it's a weapon to cut through the gaming world wielded by the player.

MIT, Stanford Partner Towards Making CPU-Memory BUSes Obsolete

Graphene has been hailed for some time now as the next natural successor to silicon, today's most used medium for semiconductor technology. However, even before such more exotic solutions to current semiconductor technology are employed (and we are still way off that future, at least when it comes to mass production), engineers and researchers seem to be increasing their focus in one specific part of computing: internal communication between components.

Typically, communication between a computer's Central Processing Unit (CPU) and a system's memory (usually DRAM) have occurred through a bus, which is essentially a communication highway between data stored in the DRAM, and the data that the CPU needs to process/has just finished processing. The fastest CPU and RAM is still only as fast as the bus, and recent workloads have been increasing the amount of data to be processed (and thus transferred) by orders of magnitude. As such, engineers have been trying to figure out ways of increasing communication speed between the CPU and the memory subsystem, as it is looking increasingly likely that the next bottlenecks in HPC will come not through lack of CPU speed or memory throughput, but from a bottleneck in communication between those two.

PNY to Launch XLR8 Series Gaming Hardware in Asian Markets from 2H-2017

PNY Technologies (PNY) considered one of the worldwide leaders in consumer electronics market and flash memory products, is ready to take on the gaming industry by storm with the launch of the Gaming Series to Asia market. The PNY Gaming Series offers best-in-class PC components to deliver gaming performance ranging from affordable to the most intense for die-hard gamers. Scheduled to be released in the 2nd half of 2017, the product categories will include gaming grade graphics cards, SSDs, and PC memory products that promise to deliver the competitive edge advantage in PC gaming.

Toshiba Develops World's First 4-bit Per Cell QLC NAND Flash Memory

Toshiba America Electronic Components, Inc. (TAEC) today announced the latest generation of its BiCS FLASH three-dimensional (3D) flash memory. The newest BiCS FLASH device features 4-bit-per-cell, quadruple-level cell (QLC) technology and is the first 3D flash memory device to do so. Toshiba's QLC technology enables larger (768 gigabit) die capacity than the company's third-generation 512Gb 3-bit-per-cell, triple-level cell (TLC), and pushes the boundaries of flash memory technology.

Toshiba's new QLC BiCS FLASH device features a 64-layer stacked cell structure and achieves the world's largest die capacity (768Gb/96GB). QLC flash memory also enables a 1.5-terabyte (TB) device with a 16-die stacked architecture in a single package - featuring the industry's largest capacity. This is a fifty percent increase in capacity per package when compared to Toshiba's earlier announcement of a 1TB device with a 16-die stacked architecture in a single package - which also offered the largest capacity in the industry at the time.

MSI X299 Breaks DDR4 Memory World Record With 5500-DDR4 Speeds

Toppc Pushes the X299 Gaming Pro Carbon AC Motherboard to Reach New DDR4 Frequency Milestone
One year ago, MSI's in-house overclocker, Toppc, broke the DDR4 5GHz barrier using G.SKILL memory and the MSI Z170I GAMING PRO AC motherboard. Today, 1 year later, he raises the bar once again and became the first ever to push DDR4 speeds to 5.5GHz under liquid nitrogen cooling using the new MSI X299 GAMING PRO CARBON AC motherboard. With the MSI X299 GAMING PRO CARBON AC, MSI's most customizable high-performance Intel X299 based motherboard, Toppc was running G.SKILL DDR4 memory with an unbelievable DDR4-SDRAM clock speed of 5500MHz. This world record shows MSI's dominant position on performance for X299 by using MSI's unique and patented DDR4 Boost technology. The MSI X299 GAMING PRO CARBON AC is not only feature packed for gamers and great for case modding, it is also perfectly suited to deliver power for heavy gaming & overclocking sessions.

Micron Announces 16 Gbps Memory Speeds Achieved Over GDDR5X

Micron, who has been at the forefront in graphics memory production, has recently announced in a blog post their commitment to achieving ever increasing speeds and performance gains with their products (which isn't all that uncommon.) What this announcement has that better carves it as different and newsworthy, though, is that the company has seemingly achieved 16 Gbps speeds on GDDR5X memory - which up to now, ticked at up to 12Gbps. Some NVIDIA cards you probably know about actually had their GDDR5X memory clocked up to 12.4 Gbps.

The new achievements under GDDR5X will aid the company in better executing their vision for GDDR6 and its speed goals. Micron expects to have functional silicon of their G6 program very soon, being confident they can push products to market on early 2018. GDDR6 will bring some specific differences in regards to GDDR5X, such as dual-channel memory (GDDR5X is single-channel) and the introduction of a FBGA180 ball package with increased pitch, to accommodate these fundamental differences.

Source: Micron

TechPowerUp G.Skill Flare X Giveaway: The Winners!

G.Skill Memory and TechPowerUp brought you a chance to win a kit of arguably the best memory for AMD Ryzen processors, with our Game Faster with Flare X Giveaway. Three lucky winners chosen at random stand a chance to win a G.Skill Flare X DDR4-3200 16 GB (2x 8 GB) dual-channel memory kit, each. We're thrilled to announce the winners:
  • Jason from The Philippines
  • Kevin from Halen, Belgium
  • Amanda from Bloomington, United States
A huge congrats to you, Jason, Kevin, and Amanda! TechPowerUp and G.Skill will return with more such interesting giveaways!

GeIL EVO-X Series AMD Edition DDR4 Memory Pictured

GeIL showed off its AMD Ryzen-optimized EVO-X AMD Edition DDR4 memory, with integrated RGB LED lighting. The modules feature Ryzen-friendly DRAM chips (although we're not sure if they're Samsung b-die), coupled with an SPD profile that's readable by prominent third-party one-click optimization standards such as ASUS DOCP, MSI A-XMP, and XMP-translation. The modules have been tested for stability in sustaining their advertised clocks and timings on motherboards of various brands.

The RGB LED lighting on the EVO-X series supports various RGB LED control software such as ASUS/ASRock Aura Sync, MSI Mystic Light RGB, BIOSTAR Vivid LED DJ, and GIGABYTE RGB Fusion. You can also manually set the color and brightness physically on the module itself, using a slider button-set called "Sliding Hot Switch." The EVO-X AMD Edition runs at DDR4-3466 MHz, with timings of 16-18-18-38. They are available in module densities of 8 GB, and in dual-channel kits of 16 GB. The modules are available in white and black heatspreader colors. The company could launch quad-channel kits in the wake of the Ryzen Threadripper TR4 platform.
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