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Toshiba Memory and Western Digital Celebrate the Opening of Fab 6

Toshiba Memory Corporation and Western Digital Corporation today celebrated the opening of a new state-of-the-art semiconductor fabrication facility, Fab 6, and the Memory R&D Center, at Yokkaichi operations in Mie Prefecture, Japan. Toshiba Memory started construction of Fab 6, a dedicated 3D flash memory fabrication facility, in February 2017. Toshiba Memory and Western Digital have installed cutting-edge manufacturing equipment for key production processes including deposition and etching. Mass production of 96-layer 3D flash memory utilizing the new fab began earlier this month.

Demand for 3D flash memory is growing for enterprise servers, data centers and smartphones, and is expected to continue to expand in the years ahead. Further investments to expand its production will be made in line with market trends. The Memory R&D Center, located adjacent to Fab 6, began operations in March of this year, and will explore and promote advances in the development of 3D flash memory. Toshiba Memory and Western Digital will continue to cultivate and extend their leadership in the memory business by actively developing initiatives aimed at strengthening competitiveness, advancing joint development of 3D flash memory, and making capital investments according to market trends.

Micron Announces Its Initial Launch Partner Status for NVIDIA RTX 20-Series GDDR6 Implementation

Memory subsystems are an important part of graphics workloads, and both AMD and NVIDIA have always been looking to cross the cutting-edge of tech in both GPU production and memory fabrication technologies. AMD has been hitching itself to the HBM bandwagon with much more fervor than NVIDIA, albeit with somewhat lukewarm results - at least from a consumer, gaming GPU perspective. NVIDIA has been more cautious: lock HBM's higher costs and lower availability to higher-margin products that can leverage the additional bandwidth, and leave GDDR to muscle its way through consumer products - a strategy that has likely helped in keeping BOM costs for its graphics cards relatively low.

As it stands, Micron was the only company with both the roadmap and production volume to be NVIDIA's partner in launching the RTX 20-series, with products above (and including) the GTX 2070 all carrying the new high-performance memory subsystem. Micron has already announced GDDR6 memory as a product back in 2017, with sampling by the beginning of 2018 and mass volume production by June - just enough time to spool up a nice inventory for new, shiny graphics cards to come out in September. Of course, this ramp-up and initial Micron leadership doesn't mean they will be the only suppliers for NVIDIA - however, it's safe to say they'll be the most relevant one for at least a good while.

Samsung 16Gb GDDR6 Memory Powers Latest NVIDIA Quadro Professional Graphics Solution

Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today announced that its 16-gigabit (Gb) Graphics Double Data Rate 6 (GDDR6) memory is being used in NVIDIA's new Turing architecture-based Quadro RTX GPUs.

Thanks to Samsung's industry-leading 16Gb GDDR6 memory, end users can expect improved performance and energy efficiency in the widest array of graphics-intensive applications, including computer-aided design (CAD), digital content creation (DCC) and scientific visualization applications. Samsung's 16Gb GDDR6 can also be used in rapidly growing fields such as 8K Ultra HD video processing, virtual reality (VR), augmented reality (AR) and artificial intelligence (AI).

ADATA XPG Unveils SPECTRIX D41 TUF Gaming Edition DDR4 RGB Memory

ADATA Technology, a leading manufacturer of high-performance DRAM modules and NAND Flash products, today announces the launch of the XPG SPECTRIX D41 TUF Gaming Edition DDR4 RGB memory module. The special edition memory module is TUF Gaming Alliance-certified, which means it has passed rigorous testing to meet the stringent standards of the alliance. While this memory module offers the same great performance and dazzling programmable RGB lighting as the original model, it sports a more combative look via its black heat spreaders with yellow trimming.

SK Hynix to Build New $3.5B Plant for Future Memory Technologies

SK Hynix Inc. today announced that the Company will construct a new semiconductor fabrication plant (or 'the FAB') at its headquarters in Icheon, Gyeonggi-do, to respond to growing demand for memory chips and to secure a future growth engine.

Construction on the 53,000 m² site in Icheon will begin late 2018 and is slated to be completed in October 2020. SK Hynix will invest 3.5 trillion won in the FAB. The production portfolio of the FAB shall be decided considering future market conditions as well as the Company's technology capability.

Samsung Begins Mass Producing 2nd-Gen 10nm-Class, 16Gb LPDDR4X Mobile DRAM

Samsung Electronics, the world leader in advanced memory technology, today announced that it has begun mass producing the industry's first 2nd-generation of 10-nanometer-class (1y-nm), LPDDR4X (Low Power, Double Data Rate, 4X) DRAM to improve the efficiency and lower the battery drain of today's premium smartphones and other mobile applications. Compared to the mobile DRAM memory chips most used in current flagship mobile devices (1x-nm 16Gb LPDDR4X), the 2nd- generation LPDDR4X DRAM features up to a 10 percent power reduction while maintaining the same data rate of 4,266 megabits per second (Mb/s).

"The advent of 10nm-class mobile DRAM will enable significantly enhanced solutions for next-generation, flagship mobile devices that should first hit the market late this year or the first part of 2019." said Sewon Chun, senior vice president of Memory Sales & Marketing at Samsung Electronics. "We will continue to grow our premium DRAM lineup to lead the 'high-performance, high capacity, and low power' memory segment to meet the market demand and strengthen our business competitiveness."

ATP Miniature Storage Powerhouses Take Center Stage at FMS 2018

The volume of data traffic is growing by the minute, and ATP Electronics, a leading manufacturer of high-performance industrial memory and storage solutions, is meeting colossal storage demands with its latest portfolio built for space-restricted embedded, industrial, and automotive systems. ATP shows off its extensive array of flash memory and storage products at the Flash Memory Summit 2018 in Sta. Clara, USA from August 7 to 9.

"We are seeing data propelling the transformation of cities and nations, and we need effective solutions of handling, storing and analyzing data to deliver rapid, actionable insights that will improve the way we live and do business," noted Marco Mezger, ATP Vice President of Global Marketing. "As the Internet of Things (IoT) adoption gains momentum, systems are diminishing in size so memory and storage solutions have to adapt. ATP is thoroughly amplifying reliability, endurance, performance and capacity in its embedded and removable flash products while keeping them compact and portable," he added.

Crucial Ballistix Sport AT Gaming Memory Now Available

Ballistix, a leading global brand of gaming memory, today announced the immediate availability of Ballistix Sport AT memory in support of ASUS' TUF Gaming Alliance. Developed as a collaboration between ASUS, Ballistix, and other trusted industry partners, TUF Gaming Alliance ensures easier building, the best compatibility, and complementary aesthetics from components to cases.

"Our TUF Gaming Alliance relationship with Ballistix, the memory brand of choice for so many gamers, offers customers and partners an exciting new product for PC builds," said Sharon Pan, Division Director of the ASUS Motherboard Channel PM Department. "On the heels of all the positive feedback at Computex 2018, we're looking forward to a successful collaboration with Ballistix as we continue to create products that excel in both performance and aesthetics."

Micron and Intel go Separate Ways for 3D XPoint Program After 2019

Micron and Intel today announced an update to their 3D XPoint joint development partnership, which has resulted in the development of an entirely new class of non-volatile memory with dramatically lower latency and exponentially greater endurance than NAND memory.

The companies have agreed to complete joint development for the second generation of 3D XPoint technology, which is expected to occur in the first half of 2019. Technology development beyond the second generation of 3D XPoint technology will be pursued independently by the two companies in order to optimize the technology for their respective product and business needs.

The two companies will continue to manufacture memory based on 3D XPoint technology at the Intel-Micron Flash Technologies (IMFT) facility in Lehi, Utah.

GIGABYTE Lights Up DRAM Market With AORUS RGB Memory

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards and graphics cards, announced its first XMP supported DRAM, the AORUS RGB Memory. With DDR4 XMP 3200 16GB(8GB*2)memory modules and exclusive 2* RGB Infused Demo Modules, AORUS RGB Memory delivers outstanding value to anyone seeking a combination of high-end performance and glowing aesthetics. GIGABYTE RGB Fusion or RGB Fusion Link software allows users to easily control over 5 new lighting effects available only for DDR so they can enjoy the most impressive RGB lighting effects memory kits have to offer.

GIGABYTE introduced its AORUS RGB Memory at Computex 2018, garnering much praise among the media and receiving Best Product awards from U.S. based Tom's Hardware as well as U.K. based TechRadar. AORUS RGB Memory Modules feature aluminum heatsinks with anodized hairline surface for a sleek, metallic look. A standout feature of AORUS RGB Memory is the addition of 2 brand exclusive RGB Infused Demo Modules for pure RGB illumination and lighting effects. This feature makes it completely unnecessary for the user to purchase a completely different set of memory modules with RGB functionality to fill out the DIMM slots of the memory configuration, without affecting their budget. Users can now add RGB Infused Demo Modules to their boards to enjoy a full memory configuration packed with RGB brilliance.

New Phase Change Memory Uses Antimony, Wants To Compete with DRAM

Researchers at IBM Zurich and Germany University of RTWH Aachen have developed a new non-volatile phase change memory with monoatomic glassy antimony, which unlike conventional phase-change-materials uses just a single element: antimony (Sb). Traditional phase-change memories use a mix of different materials, which makes things complicated when you try to shrink them down for higher storage densities, as impurities and composition differences negatively affect yields.

The novel approach is based on pure antimony films that are between 3 and 10 nanometers thick, confined between Silicon layers of 40-200 nm thickness. For their prototypes the engineers achieved a switching rate of 50 nanoseconds (20 MHz). While this doesn't sound very fast, the researchers are optimistic that this can be optimized further, their next goal is 10 nanoseconds, which is getting in the region of DRAM speeds.

Micron Begins Volume Production of GDDR6 High Performance Memory

Micron Technology, Inc. today announced volume production on its 8 GB GDDR6 memory. Built on experience and execution for several generations of GDDR memory, GDDR6 - Micron's fastest and most powerful graphics memory designed in Micron's Munich Development Center - is optimized for a variety of applications that require high performance memory, including artificial intelligence (AI), networking, automotive and graphics processing units (GPUs). Additionally, Micron has worked with core ecosystem partners to ramp GDDR6 documentation and interoperability, enabling faster time to market for designs.

"Micron is a pioneer in developing advanced high bandwidth memory solutions and continues that leadership with GDDR6. Micron demonstrated this leadership by recently achieving throughput up to 20 GB/s on our GDDR6 solutions," said Andreas Schlapka, director, Compute Networking Business Unit, Micron. "In addition to performance increases, Micron has developed a deep partner ecosystem to enable rapid creation of GDDR6 designs, enabling faster time to market for customers looking to leverage this powerful new memory technology."

Ballistix Shows Off TUF Gaming Alliance Sport Memory

Ballistix announced its ASUS TUF Gaming Allinace co-branded Sport DDR4 memory module, and we got a chance to go hands on. These modules are essentially the company Sport series mid-range sticks with a ruggedized heat-spreader, and style elements from the TUF Gaming Alliance - black with sharp golden-yellow lines. The module comes in 8 GB (single-rank) and 16 GB (dual-rank) densities, which each come in two speed variants - DDR4-2666 and DDR4-3000, making up dual-channel kits of 16 GB and 32 GB, respectively.

Team Group Reveals T-Force Xcalibur RGB Memory

Team Group showcased their long-expected T-Force Xcalibur RGB memory at their Computex booth this year. Staying true to its name, the Xcalibur RGB memory modules feature a unique design with totem elements combined with a heat spreader that resembles a sword's handle. Height of the modules is 88 mm. Team Group will be initially launching the T-Force Xcalibur RGB memory in 16 GB (2 x 8 GB) kits available in 3600 MHz and 4000 MHz configurations. Xcalibur RGB memory modules employ Samsung IC chips, which have been carefully selected and tested to provide the best performance, stability, and compatibility.

ADATA Unveils XPG Gammix D50 Line of Performance-segment DDR4 Memory

ADATA this Computex showed off its new XPG Gammix D50 line of performance-segment DDR4 memory modules. The Gammix D50 is positioned a notch below the enthusiast-segment Gammign D80 series. It lacks the "hybrid air+liquid" cooling heatspreaders from its pricier sibling, but still gives you chunky aluminium heatspreaders crowned by an acrylic diffuser, which interestingly, lacks any underlying LEDs. The Gammix D50 will come in a variety of speeds ranging from DDR4-2666 all the way to DDR4-4500, and in 8 GB single-rank and 16 GB dual-rank densities. The top-dog DDR4-4500 SKU sustains its clocks with timings of 19-19-18-39. It comes in both dual-channel (16 GB) and quad-channel (32 GB) kits.

G.SKILL Showcases Extreme DDR4 Memory Kits up to DDR4-5066MHz at Computex 2018

(Editor's Note: We took some risks in getting these pictures for you guys at COMPUTEX, hitting the show floor as we did, so enjoy them. G.SKILL took the opportunity to showcase a series of ultra-high speed DDR4 kits on various platforms at Computex 2018. Their 5066 MHz, dual-channel kit really is the highest-performing memory on display, but there are some notorious trade-offs, as there would obviously need to be - namely, when it comes to timings. That said, it remains a very impressive showing that helps cement G.Skill's status as one of the best memory companies currently in business.)

DDR4-5066MHz 2x8GB -The Highest Frequency in Dual Channel Memory Configuration
Chasing after the fastest possible memory speed, G.SKILL once again breaks the limits and presents the Trident Z RGB DDR4-5066MHz extreme dual-channel kit built with Samsung 8Gb ICs, which is the highest frequency dual-channel memory on live demo display at Computex 2018. This extremely high memory speed live demo system is built with the latest Intel Core i7-8700K processor and MSI Z370I Gaming PRO CARBON AC motherboard.

Colorful Readies its First DDR4 Memory Modules, and They're Colorful

Colorful is on a diversification drive, and its latest expansion in PC hardware is memory. The company showed off its first DDR4 memory modules under the iGame brand, and they're, well, colorful. The common theme is a die cast metal heatspreader with a silicone diffuser on top for either RGB or fixed color illumination. The modules come in both 8 GB and 16 GB densities, making up dual-channel kits. Among the first is a 16 GB DDR4-3600 module, which will be ready for the overseas market by the end of the year.

GALAX Hall of Fame Extreme Series Limited Edition DDR4 Memory Pictured

GALAX unveiled its Hall of Fame (HOF) Extreme series limited edition DDR4 memory with a staggering speed rating of DDR4-5000. Featuring a gold-plated heatspreader, this 16 GB (8 GB x2) dual-channel kit ticks at DDR4-5000 with timings of 21-36-36-46, and at 1.50V. If that's a little too much to handle, there's also an identical-looking kit with DDR4-4700 speeds, with tighter timings of 19-26-26-46, at 1.50V.

There's also chrome/silver colored kit clocked at DDR4-4500, with 19-19-19-39 timings and 1.40V DRAM voltage, though it lacks the limited edition tag. Getting into the mid-range of this series, we find the HOF Extreme DDR4-3600 kit, with a similar design, but matte-white heatspreaders, 17-18-18-38 timings, and safer voltages of 1.35V. The gateway to this series is the HOF Extreme DDR4-3200, with 16-18-18-38 timings, at 1.35V, and a matte-black heatspreader.

Antec Enters the PC Memory Market with AntecMemory Brand

While Corsair began as a memory maker and branched out into cases and power-supplies, Antec is taking the opposite route, starting out as a case and PSU maker. The company set up the new AntecMemory brand, complete with a new logo. Its first product is the mid-range "5-series," with the possibility of the entry-level 3-series, and high-end 7-series, for sheer driving computing pleasure. The 5-series DDR4 module features either an all-white or black+white heatspreader, with an RGB LED diffuser at a corner. For now, it only comes in 8 GB single-module kits. The module ticks at DDR4-3000, with timings of 16-18-18-36, at 1.35V. There's also an ASUS TUF Gaming Alliance co-branded kit, complete with the urban camo pattern.

KLEVV Unveils New Cras X RGB, Cras II RGB, Bolt X and Bolt Memory Modules

Boutique yet high-end memory maker KLEVV unveiled a plethora of RGB LED-lit variants of its popular memory modules. The star attractions at the company's Computex booth are the Cras II RGB and Cras X RGB. Both are studded with addressable RGB LEDs. The Cras X RGB features a soft diffuser along its top, besides a chunkier heatspreader, while the Cras II RGB has an intricately designed heatspreader, with cutouts through which the lighting is diffused. The Cras II RGB comes in DDR4-3200 speed, and in 2x 8 GB dual-channel kit, while the Cras X RGB comes in both DDR4-3200 and DDR4-3466 speeds, and 2x 8 GB and 2x 16 GB densities. The Bolt and Bolt X are the company's standard-height modules, with simpler heatspreader designs. The Bolt comes in DDR4-2400, and DDR4-3000 speeds, in 4 GB, 8 GB, and 16 GB densities, while the Bolt X, with a more premium design, ticks at DDR4-2666 and DDR4-3200, in the same densities.

INNOVENTIONS Launches Memory Testers for DDR4

INNOVENTIONS, Inc., the leading manufacturer of portable computer memory testers, is now shipping the RAMCHECK LX DDR4 and the RAMCHECK LX DDR4 Pro for testing and identifying industry standard DDR4 ECC and non-ECC SDRAM modules.

"DDR4 memory is now the standard for servers and PCs," said Dr. David Y. Feinstein, President of INNOVENTIONS. "With these new RAMCHECK LX memory testers, data centers, memory dealers and repair techs have a great tool to test and identify DDR4 DIMMs quickly and reliably. Considering the price of these big server DIMMs, the RAMCHECK LX pays for itself pretty quickly."

Patriot Viper Launches Brand New RGB DDR4 Series Memory Kits

PATRIOT, a global leader in performance memory, SSDs, gaming peripherals and flash storage solutions today announced the immediate availability of its new VIPER RGB Series Performance DDR4 Memory Kits. PATRIOT's VIPER RGB Series memory modules are designed for users who are obsessed with maximizing hardware performance without compromising stability. The VIPER RGB series are fully optimized for the latest Intel and AMD platforms and matched with a stunning heat shield design. VIPER RGB series offers RGB illumination control through a software application without additional cables to maintain an aesthetic look and stunning visuals.

The new heat spreader design is made from high-quality aluminum and designed to offer excellent thermal dissipation to maintain greater stability under heavy loads. In addition, VIPER RGB series memory is built with a customized PCB to guarantee good signal integrity for stable gaming while also offering increased overclocking potential. The memory ICs featured in VIPER RGB Series undergo a proprietary sorting process to retain strict quality standards and reliability on the latest Intel and AMD platform motherboards.

Kingmax Intros Zeus Dragon RGB DDR4 Memory Series

Kingmax expanded its Zeus Dragon line of DDR4 memory kits, with the new Zeus Dragon RGB. The new module looks significantly different from the Zeus Dragon, with a polygonal heatspreader shape with RGB LED diffusers, which borrows some design ideas from G.Skill Trident-Z RGB. You have RGB diffusers not just along the top of the module, but also through cutouts on the surface, illuminating the logos. The modules support ASUS Aura Sync RGB software control.

The Kingmax Zeus Dragon RGB series comes in four speed-based variants - DDR4-2666, DDR4-3000, DDR4-3200, and DDR4-3466; and in module densities of 8 GB and 16 GB, making up 16 GB (2x 8 GB) and 32 GB (2x 16 GB) kits, respectively. For whatever reason, the slowest variant also has the loosest timings, with CAS latency of 17T, while the other three variants are CL 16T. You enable the advertised speeds at the click of a button thanks to XMP 2.0 support.

DFI Group Releases Initial Version of the DFI 5.0 Specification for High-Speed Memory

The DDR PHY Interface (DFI) Group today released version 5.0 of the specification for interfaces between high-speed memory controllers and physical (PHY) interfaces to support the requirements of future mobile and server memory standards. The DFI specifications, widely adopted throughout the memory industry, enable greater interoperability.

The DFI Group included several interface improvements in this newest specification. The new version of the specification adds protocol support for the newest DDR and low-power memory technologies. Previous versions of the specification defined memory training across the interface between the memory controller and the PHY. The new specification completely transitions to PHY-independent training mode where the PHY trains the memory interface without involving the controller. Other interface improvements include lower power enhancements, providing a PHY-independent boot sequence, expanding frequency change support, and defining new controller-to-PHY interface interactions.

"The industry is beginning to embrace new low-power and DDR memory technologies, including high-performance devices such as servers, storage, and networking; autonomous vehicles; and low-power handheld devices and IoT," stated John MacLaren, DFI Group chairman and Cadence design engineering architect. "The DFI Group, consisting of experts from leading companies in the industry, is enthusiastic to contribute to enabling this transition with the latest release of the DFI specification. Beyond supporting the latest DDR and LPDDR memory technologies, we have introduced significant improvements to the interface to improve low power, interoperability, and interface interactions."
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