News Posts matching "Memory"

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Thermaltake Pacific R1 Plus Memory Lighting a Smarter Alternative to Dummy Modules

Earlier today we brought you the story of the Corsair Vengeance Pro RGB Lighting Enhancement kit, a $40 pair of dummy modules that fill up your vacant DIMM slots, a solution that polarized our readers to call it both genius and dumb. Thermaltake has a saner solution to fix your memory lighting woes - the Pacific R1 Plus Memory Lighting kit. This accessory latches on to your DIMM 4-slot cluster much like memory air coolers, but instead provides four LED diffusers that gives the appearance of four RGB LED illuminated modules. The best part is you can have any type of standard-height memory underneath, DDR2-thru-DDR4.

The top with four diffusers plugs into a single addressable RGB header. Each diffuser has 9 LEDs underneath, totaling 36. If you don't have an aRGB-capable motherboard, Thermaltake is also including an RGB controller module that lets you plug the kit into a USB 2.0 header and control via the company's own TT RGB Plus app. Measuring 156 mm x 51.1 mm x 43 mm (WxHxD), it weighs about 168 g. The company didn't reveal pricing.

Inno3D Launches iChill High Performance DDR4 Gaming Memory

INNO3D, a leading manufacturer of pioneering high-end multimedia components and various innovations including the recent addition high performance gaming iCHILL Memory. Its introduction to the market has been very well received due to the various capacities that the iCHILL memory series offers including 4GB to 16GB at speeds of 2400MHz to 4000MHz and with ultra-low latencies up to 15CL.

INNO3D has done wonders with the iCHILL series over the last decade in the graphics department so wanted to apply the same principles, intricacies and devotion to creating a series of performance gaming memory with the ice cool touch. The iCHILL memory modules are equipped with a unique heat spreader design that optimizes system performance for smoother gaming experience with that extra kick to your PC.

Patriot Launches Viper Steel DDR4 16GB 4400MHz Extreme Performance Memory

PATRIOT , a global leader in performance memory, SSDs, gaming peripherals, and flash storage solutions, has announced the release of their fastest kit ever of DDR4 memory today, VIPER STEEL SERIES DDR4 16GB (2x 8 GB) 4400 MHz. Built for the latest Intel and AMD platforms, the VIPER STEEL SERIES provides extreme performance and stability for the most demanding computer environments. The VIPER STEEL SERIES DDR4 memory kit brings Intel XMP 2.0 performance to new heights and is able to achieve up to 4400 MHz with a simple setting on supporting Intel's latest processors and motherboards.

The VIPER STEEL SERIES utilizes a custom designed high-performance aluminum heatshield for providing optimal heat dissipation when overclocking and foregoing high-performance tasks. These hand-tested memory modules feature the highest quality memory chips and are running performance timings of CL19-19-19-39 at 1.45 V. VIPER STEEL SERIES DDR4 4400 MHz is optimized for PC enthusiasts, overclockers, or those who want to push their system's performance to the limit through the use of extremely fast components.

GeIL Launches New Additions to its SUPER LUCE RGB Sync DDR4 Lineup

GeIL - Golden Emperor International Ltd. - one of the world's leading PC components and peripheral manufacturers today announced the new additions to their SUPER LUCE RGB SYNC Series DDR4 memory. The new modules are available in three capacities and speeds: 4133 MHz 16 GB (8 GB x2) CL19-19-19-39 1.40 V, 3600 MHz 16GB (8 GB x2) CL16-18-18-36 1.35 V, and 3200 MHz 16 GB (8 GB x2) CL14-14-14-34 1.35V

The 4133 MHz 16 GB (8 GB x2) CL19-19-19-39 1.40 V DDR4 kits can be the overclocker's new favorite with support for most ASUS, GIGABYTE, MSI and ASROCK Z390 and Z370 motherboards as well as giving enthusiasts the room to push their systems to the limit without exception. The 3600 MHz 16GB (8 GB x2) CL16-18-18-36 1.35 V DDR4 kits meets the memory needs for any gaming system using the latest Intel platforms and is an excellent solution for first time overclockers. The 3200 MHz 16 GB (8GBx2) CL14-14-14-34 1.35 V DDR4 kits are compatible with both Intel and AMD AM4 platforms and feature a low latency design to enhance performance and offer the most affordable upgrade option for users.

G.SKILL Launches Trident Z Royal Series DDR4 RGB Memory Kits

G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory and gaming peripherals, is launching Trident Z Royal series DDR4 RGB memory kits, featuring a patent-pending full-length crystalline light bar upon a polished heatspreader in gold or silver with stunning 8-zone RGB lighting. The patent of the crystalline design on PC components has been applied for across major countries. Available in high-speed specifications, the Trident Z Royal is first available from DDR4-3000MHz to DDR4-4600MHz at launch. With the perfect marriage of RGB lighting and speed, the Trident Z Royal is the ideal memory kit for any high-class system build.

Trident Z Royal is the latest addition to the Trident Z flagship family, featuring a crown jewel design. Meticulously crafted to display just the right amount of light refraction, the crystalline light bar scatters the RGB colors in a magnificent display of LED lighting. Complementing the patented high-class light bar design, polished aluminum heatspreaders of gold or silver colors cools the memory modules in the award-winning classic Trident Z tri-fin design. And to help maintain the pristine shine of the heatspreaders, each Trident Z Royal memory kit comes with a piece of microfiber cloth to let you wipe away fingerprints and dust.

Micron and Achronix Deliver Next-Generation FPGAs Powered by GDDR6 Memory

Micron Technology, Inc., today announced that its GDDR6 memory, Micron's fastest and most powerful graphics memory, will be the high-performance memory of choice supporting Achronix's next-generation stand-alone FPGA products built on TSMC 7nm process technology. GDDR6 is optimized for a variety of demanding applications, including machine learning, that require multi-terabit memory bandwidth and will enable Achronix to offer FPGAs at less than half the cost of FPGAs with comparable memory solutions.

Achronix's high-performance FPGAs, combined with GDDR6 memory, are the industry's highest-bandwidth memory solution for accelerating machine learning workloads in data center and automotive applications.

This new joint solution addresses many of the inherent challenges in deep neural networks, including storing large data sets, weight parameters and activations in memory. The underlying hardware needs to store, process and rapidly move data between the processor and memory. In addition, it needs to be programmable to allow more efficient implementations for constantly changing machine learning algorithms. Achronix's next-generation FPGAs have been optimized to process machine learning workloads and currently are the only FPGAs that offer support for GDDR6 memory.

Micron Announces Mass Production of Industry's Highest-Capacity Monolithic Memory

Micron Technology, Inc., today announced that it has begun mass production of the industry's highest-capacity and first monolithic 12Gb low-power double data rate 4x (LPDDR4x) DRAM for mobile devices and applications. This latest generation of Micron's LPDDR4 memory brings key improvements in power consumption while maintaining the industry's fastest LPDDR4 clock speeds, thereby delivering advanced performance for next-generation mobile handsets and tablets. In addition, Micron's 12Gb LPDDR4x doubles memory capacity to offer the industry's highest-capacity monolithic LPDDR4 without increasing the footprint compared to the previous generation product.

The exponential increase in usage of compute and data-intensive mobile applications such as artificial intelligence (AI), augmented reality (AR) and 4K video has been accompanied with demands by mobile users to maximize battery life and performance and increase capacity. Next-generation mobile devices that integrate multiple high-resolution cameras and increasingly use AI for image optimization also require higher DRAM capacities to support these features.

As the industry transitions towards deployment of 5G mobile technology, the memory subsystem in mobile handsets will have to support these dramatically higher data rates and the associated processing of data in real-time. New applications built upon 5G technology will also be able to leverage the increased capabilities of the memory subsystem to enable new and immersive user experiences.

Samsung Unveils 256-Gigabyte 3DS DDR4 RDIMM, Other Datacenter Innovations

Samsung Electronics, a world leader in advanced semiconductor technology, today announced several groundbreaking additions to its comprehensive semiconductor ecosystem that encompass next-generation technologies in foundry as well as NAND flash, SSD (solid state drive) and DRAM. Together, these developments mark a giant step forward for Samsung's semiconductor business.

"Samsung's technology leadership and product breadth are unparalleled," said JS Choi, President, Samsung Semiconductor, Inc. "Bringing 7 nm EUV into production is an incredible achievement. Also, the announcements of SmartSSD and 256GB 3DS RDIMM represent performance and capacity breakthroughs that will continue to push compute boundaries. Together, these additions to Samsung's comprehensive technology ecosystem will power the next generation of datacenters, high-performance computing (HPC), enterprise, artificial intelligence (AI) and emerging applications."

Silicon Power Launches New Gaming Solutions

Silicon Power (SP) introduced the XPOWER line of gaming DDR4 memory modules today. The XPOWER AirCool and Turbine DDR4 are designed and engineered to handle complex computing tasks with ease and ensure the most realistic picture quality, higher resolutions, and smoother 3D renders and transitions for gamers and modders. With the rising popularity of role-playing, first-person shooter, and massively multiplayer online games like PUBG and StarCraft, SP aims to give its customers the best memory upgrade user experience.

The high-quality RAMs feature speeds up to 4133 MHz at a low 1.4V power consumption. Designed to support the most dedicated gamers and modders, the XPOWER AirCool and Turbine DDR4 are the premier choices for a powerful and affordable memory upgrade. Both The XPOWER AirCool and Turbine DDR4 combine performance with compatibility and are both 100% tested for stability, durability, and compatibility in a range of rigs. As an added plus to kickstart a bold new direction for the memory storage company, SP has added a cool blue heat sink to the Turbine memory module to keep gamers safe from overheating complications.

GIGABYTE Intros DDR4 Memory Modules with Chunkier Heatspreaders

GIGABYTE expanded its teething DDR4 memory lineup with a new 16 GB (2x 8 GB) dual-channel DDR4 memory kit, called simply "GIGABYTE Memory 2666MHz." These modules lack the Aorus branding featured on the company's very first DDR4 modules. You instead get 32 mm tall, 7 mm-thick modules with a restrained design, and plain GIGABYTE branding.

One area where the company refined its design is the heatspreaders, which are thicker, and have more mass to them, even if they lack finnage. GIGABYTE's module does what it says on the tin - DDR4-2666 with 16-16-16-35 timings, at 1.2 Volts. Out of the box, it packs both JEDEC and XMP SPD profiles. Memory controllers that support DDR4-2666 (such as Intel "Coffee Lake" and later), should run it at the advertised speeds without any user intervention. For older platforms, an XMP 2.0 profile helps achieve the advertised settings. The modules are backed by lifetime warranty.

DRAM Calculator for Ryzen v1.4.0 by 1usmus Released: Memory Settings Made Easy

Ukrainian PC enthusiast and software developer 1usmus today released DRAM Calculator for Ryzen version 1.4.0. This utility was formerly known as "Ryzen DRAM Calculator," which has since been voluntarily renamed by the author in the interest of avoiding any future trademark conflict with AMD, or giving users the impression that the software has been made by AMD. The change in name doesn't change the fact this could be your go-to app to figure out the best memory settings for your AMD Ryzen-powered machine.

PC enthusiasts usually only remember 4 or 5 DRAM timing settings besides DRAM clock and voltage, letting the motherboard BIOS figure out the rest of the stable values, which could often be looser than needed. DRAM Calculator for Ryzen figures out nearly every under-the-hood timing, voltage, clock-speed, and other setting needed to make the most out of your memory overclock. You can also make the app work out "safe," "stable," and "extreme" variations of its own calculations. Version 1.4.0 isn't just a name-change for the application. It introduces a large number of critical updates to the app that improve accuracy and functionality.

DOWNLOAD: DRAM Calculator for Ryzen v1.4.0
The change-log follows.

Memory, not smartphones, is what is really working at Samsung

Smartphones or TVs may be Samsung's most popular products, but they are certainly not the most profitable for the company. The South Korea electronics giant has announced its estimates for the third quarter of the year, and that data points to the company achieving the highest operating profit in its entire history. Samsung is set to reach 17.5 trillion won ($15.8 billion), up 20% from the same period last year. Not only that: revenues will also reach a record 65 trillion won ($57.3 billion), almost 5% more than last year.

The surprise of these results lies precisely in the products that have been the main protagonists of these revenues and profits. It wasn't smartphones, and in fact in the second quarter those lost more market share than any other manufacturer with a Galaxy S9 and a Galaxy S9+ whose sales haven't been as good as expected. TVs weren't that succesful either.

COLORFUL Announces New iGame D-RAM DDR4 Gaming Memory

Colorful Technology Company Limited, professional manufacturer of graphics cards, motherboards and high-performance storage solutions is proud to announce the launch of its latest product to be part of its illustrious iGame series of high-performance parts. The new iGame DDR4 memory features speeds up to DDR4-3200 and sports the new, custom heatspreader from COLORFUL which fits in the iGame series theme. The new iGame memory features RGB lighting and supports for ASUS AURA Sync controls so you can customize the lighting to your personal style.

COLORFUL has designed the iGame DDR4 memory to compliment the full line of COLORFUL iGame products. Its heatspreaders feature an aggressive, gamer styling featuring the new iGame logo. Across the top is the lighting module capable of RGB lighting to give users full control of what they want their memories to look. The heatspreaders also add great cooling to the product ensuring consistent and reliable performance even in under instense gaming load.

Toshiba Memory and Western Digital Celebrate the Opening of Fab 6

Toshiba Memory Corporation and Western Digital Corporation today celebrated the opening of a new state-of-the-art semiconductor fabrication facility, Fab 6, and the Memory R&D Center, at Yokkaichi operations in Mie Prefecture, Japan. Toshiba Memory started construction of Fab 6, a dedicated 3D flash memory fabrication facility, in February 2017. Toshiba Memory and Western Digital have installed cutting-edge manufacturing equipment for key production processes including deposition and etching. Mass production of 96-layer 3D flash memory utilizing the new fab began earlier this month.

Demand for 3D flash memory is growing for enterprise servers, data centers and smartphones, and is expected to continue to expand in the years ahead. Further investments to expand its production will be made in line with market trends. The Memory R&D Center, located adjacent to Fab 6, began operations in March of this year, and will explore and promote advances in the development of 3D flash memory. Toshiba Memory and Western Digital will continue to cultivate and extend their leadership in the memory business by actively developing initiatives aimed at strengthening competitiveness, advancing joint development of 3D flash memory, and making capital investments according to market trends.

Micron Announces Its Initial Launch Partner Status for NVIDIA RTX 20-Series GDDR6 Implementation

Memory subsystems are an important part of graphics workloads, and both AMD and NVIDIA have always been looking to cross the cutting-edge of tech in both GPU production and memory fabrication technologies. AMD has been hitching itself to the HBM bandwagon with much more fervor than NVIDIA, albeit with somewhat lukewarm results - at least from a consumer, gaming GPU perspective. NVIDIA has been more cautious: lock HBM's higher costs and lower availability to higher-margin products that can leverage the additional bandwidth, and leave GDDR to muscle its way through consumer products - a strategy that has likely helped in keeping BOM costs for its graphics cards relatively low.

As it stands, Micron was the only company with both the roadmap and production volume to be NVIDIA's partner in launching the RTX 20-series, with products above (and including) the GTX 2070 all carrying the new high-performance memory subsystem. Micron has already announced GDDR6 memory as a product back in 2017, with sampling by the beginning of 2018 and mass volume production by June - just enough time to spool up a nice inventory for new, shiny graphics cards to come out in September. Of course, this ramp-up and initial Micron leadership doesn't mean they will be the only suppliers for NVIDIA - however, it's safe to say they'll be the most relevant one for at least a good while.

Samsung 16Gb GDDR6 Memory Powers Latest NVIDIA Quadro Professional Graphics Solution

Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today announced that its 16-gigabit (Gb) Graphics Double Data Rate 6 (GDDR6) memory is being used in NVIDIA's new Turing architecture-based Quadro RTX GPUs.

Thanks to Samsung's industry-leading 16Gb GDDR6 memory, end users can expect improved performance and energy efficiency in the widest array of graphics-intensive applications, including computer-aided design (CAD), digital content creation (DCC) and scientific visualization applications. Samsung's 16Gb GDDR6 can also be used in rapidly growing fields such as 8K Ultra HD video processing, virtual reality (VR), augmented reality (AR) and artificial intelligence (AI).

ADATA XPG Unveils SPECTRIX D41 TUF Gaming Edition DDR4 RGB Memory

ADATA Technology, a leading manufacturer of high-performance DRAM modules and NAND Flash products, today announces the launch of the XPG SPECTRIX D41 TUF Gaming Edition DDR4 RGB memory module. The special edition memory module is TUF Gaming Alliance-certified, which means it has passed rigorous testing to meet the stringent standards of the alliance. While this memory module offers the same great performance and dazzling programmable RGB lighting as the original model, it sports a more combative look via its black heat spreaders with yellow trimming.

SK Hynix to Build New $3.5B Plant for Future Memory Technologies

SK Hynix Inc. today announced that the Company will construct a new semiconductor fabrication plant (or 'the FAB') at its headquarters in Icheon, Gyeonggi-do, to respond to growing demand for memory chips and to secure a future growth engine.

Construction on the 53,000 m² site in Icheon will begin late 2018 and is slated to be completed in October 2020. SK Hynix will invest 3.5 trillion won in the FAB. The production portfolio of the FAB shall be decided considering future market conditions as well as the Company's technology capability.

Samsung Begins Mass Producing 2nd-Gen 10nm-Class, 16Gb LPDDR4X Mobile DRAM

Samsung Electronics, the world leader in advanced memory technology, today announced that it has begun mass producing the industry's first 2nd-generation of 10-nanometer-class (1y-nm), LPDDR4X (Low Power, Double Data Rate, 4X) DRAM to improve the efficiency and lower the battery drain of today's premium smartphones and other mobile applications. Compared to the mobile DRAM memory chips most used in current flagship mobile devices (1x-nm 16Gb LPDDR4X), the 2nd- generation LPDDR4X DRAM features up to a 10 percent power reduction while maintaining the same data rate of 4,266 megabits per second (Mb/s).

"The advent of 10nm-class mobile DRAM will enable significantly enhanced solutions for next-generation, flagship mobile devices that should first hit the market late this year or the first part of 2019." said Sewon Chun, senior vice president of Memory Sales & Marketing at Samsung Electronics. "We will continue to grow our premium DRAM lineup to lead the 'high-performance, high capacity, and low power' memory segment to meet the market demand and strengthen our business competitiveness."

ATP Miniature Storage Powerhouses Take Center Stage at FMS 2018

The volume of data traffic is growing by the minute, and ATP Electronics, a leading manufacturer of high-performance industrial memory and storage solutions, is meeting colossal storage demands with its latest portfolio built for space-restricted embedded, industrial, and automotive systems. ATP shows off its extensive array of flash memory and storage products at the Flash Memory Summit 2018 in Sta. Clara, USA from August 7 to 9.

"We are seeing data propelling the transformation of cities and nations, and we need effective solutions of handling, storing and analyzing data to deliver rapid, actionable insights that will improve the way we live and do business," noted Marco Mezger, ATP Vice President of Global Marketing. "As the Internet of Things (IoT) adoption gains momentum, systems are diminishing in size so memory and storage solutions have to adapt. ATP is thoroughly amplifying reliability, endurance, performance and capacity in its embedded and removable flash products while keeping them compact and portable," he added.

Crucial Ballistix Sport AT Gaming Memory Now Available

Ballistix, a leading global brand of gaming memory, today announced the immediate availability of Ballistix Sport AT memory in support of ASUS' TUF Gaming Alliance. Developed as a collaboration between ASUS, Ballistix, and other trusted industry partners, TUF Gaming Alliance ensures easier building, the best compatibility, and complementary aesthetics from components to cases.

"Our TUF Gaming Alliance relationship with Ballistix, the memory brand of choice for so many gamers, offers customers and partners an exciting new product for PC builds," said Sharon Pan, Division Director of the ASUS Motherboard Channel PM Department. "On the heels of all the positive feedback at Computex 2018, we're looking forward to a successful collaboration with Ballistix as we continue to create products that excel in both performance and aesthetics."

Micron and Intel go Separate Ways for 3D XPoint Program After 2019

Micron and Intel today announced an update to their 3D XPoint joint development partnership, which has resulted in the development of an entirely new class of non-volatile memory with dramatically lower latency and exponentially greater endurance than NAND memory.

The companies have agreed to complete joint development for the second generation of 3D XPoint technology, which is expected to occur in the first half of 2019. Technology development beyond the second generation of 3D XPoint technology will be pursued independently by the two companies in order to optimize the technology for their respective product and business needs.

The two companies will continue to manufacture memory based on 3D XPoint technology at the Intel-Micron Flash Technologies (IMFT) facility in Lehi, Utah.

GIGABYTE Lights Up DRAM Market With AORUS RGB Memory

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards and graphics cards, announced its first XMP supported DRAM, the AORUS RGB Memory. With DDR4 XMP 3200 16GB(8GB*2)memory modules and exclusive 2* RGB Infused Demo Modules, AORUS RGB Memory delivers outstanding value to anyone seeking a combination of high-end performance and glowing aesthetics. GIGABYTE RGB Fusion or RGB Fusion Link software allows users to easily control over 5 new lighting effects available only for DDR so they can enjoy the most impressive RGB lighting effects memory kits have to offer.

GIGABYTE introduced its AORUS RGB Memory at Computex 2018, garnering much praise among the media and receiving Best Product awards from U.S. based Tom's Hardware as well as U.K. based TechRadar. AORUS RGB Memory Modules feature aluminum heatsinks with anodized hairline surface for a sleek, metallic look. A standout feature of AORUS RGB Memory is the addition of 2 brand exclusive RGB Infused Demo Modules for pure RGB illumination and lighting effects. This feature makes it completely unnecessary for the user to purchase a completely different set of memory modules with RGB functionality to fill out the DIMM slots of the memory configuration, without affecting their budget. Users can now add RGB Infused Demo Modules to their boards to enjoy a full memory configuration packed with RGB brilliance.

New Phase Change Memory Uses Antimony, Wants To Compete with DRAM

Researchers at IBM Zurich and Germany University of RTWH Aachen have developed a new non-volatile phase change memory with monoatomic glassy antimony, which unlike conventional phase-change-materials uses just a single element: antimony (Sb). Traditional phase-change memories use a mix of different materials, which makes things complicated when you try to shrink them down for higher storage densities, as impurities and composition differences negatively affect yields.

The novel approach is based on pure antimony films that are between 3 and 10 nanometers thick, confined between Silicon layers of 40-200 nm thickness. For their prototypes the engineers achieved a switching rate of 50 nanoseconds (20 MHz). While this doesn't sound very fast, the researchers are optimistic that this can be optimized further, their next goal is 10 nanoseconds, which is getting in the region of DRAM speeds.

Micron Begins Volume Production of GDDR6 High Performance Memory

Micron Technology, Inc. today announced volume production on its 8 GB GDDR6 memory. Built on experience and execution for several generations of GDDR memory, GDDR6 - Micron's fastest and most powerful graphics memory designed in Micron's Munich Development Center - is optimized for a variety of applications that require high performance memory, including artificial intelligence (AI), networking, automotive and graphics processing units (GPUs). Additionally, Micron has worked with core ecosystem partners to ramp GDDR6 documentation and interoperability, enabling faster time to market for designs.

"Micron is a pioneer in developing advanced high bandwidth memory solutions and continues that leadership with GDDR6. Micron demonstrated this leadership by recently achieving throughput up to 20 GB/s on our GDDR6 solutions," said Andreas Schlapka, director, Compute Networking Business Unit, Micron. "In addition to performance increases, Micron has developed a deep partner ecosystem to enable rapid creation of GDDR6 designs, enabling faster time to market for customers looking to leverage this powerful new memory technology."
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