News Posts matching #RAM

Return to Keyword Browsing

Team Group Launches Two ZEUS Series Gaming Memory Modules

TEAMGROUP announced the T-FORCE ZEUS DDR4 U-DIMM Gaming Memory and SO-DIMM DDR4 Gaming Laptop Memory. Both possess a visually-striking design and are constructed with carefully selected, high-quality ICs. Each stick has up to 32 GB of memory and multiple frequency options, allowing you to maintain blazing speeds for your conquering foes.

The T-FORCE ZEUS DDR4 U-DIMM Gaming Memory features T-FORCE's iconic logo and a fierce thunderbolt design, symbolizing the awesome power of Zeus backing up the player. Built with a high-end integrated circuit, this memory module comes with up to 32 GB of RAM and frequency options ranging from DDR4 2666 to DDR4 3200. Say goodbye to complicated BIOS configuration as it supports overclock profiles, allowing you to switch speeds at a press of a button. You can also upgrade easily regardless of whether you use Intel or AMD processors.

Colorful is Preparing DDR4-4000 C14 Memory for Ryzen 5000 Series CPUs

Colorful, a Chinese manufacturer of PC components known for its graphics cards, is apparently preparing a special RAM version for AMD's Ryzen 5000 series CPUs. The new arrival is part of the iGame series that Colorful offers. Thanks to SMZDM forums, we have specifications of the upcoming iGame RAM tuned specifically for Ryzen 5000 series processors. Coming in with all white PCB without a heat spreader, the new Colorful iGame memory features Samsung's B-dies designed for maximum speed and performance. The dies are running at 4000 MT/s with some very strict timings. The memory features C14 (14-14-14-35) timings that are supposed to bring the system latency down and improve performance even further. It is estimated that such a configuration will require 1.5 Volts to power it. While the exact name, launch date, and pricing is unknown, we can only wait and see how Colorful plays it out.

RISC-V Comes to PC: SiFive Introduces HiFive Unmatched Development Board

RISC-V architecture is a relatively new Instruction Set Architecture (ISA) developed at the University of California Berkeley. Starting as a "short, three-month project" the RISC-V ISA is a fifth generation of the Reduced Instruction Set Computing (RISC) ideology. A company working on this technology and helping to grow the ecosystem is SiFive. Today, they announced a big step forward for the ecosystem that will enable developers to make and optimize even more software for this architecture and platform. Called the HiFive Unmatched, the development board represents the first entry of RISC-V ISA to the world of personal computing, with its Mini-ITX form factor and PC-like connectors of power supply and I/O.

The board is home to SiFive's FU740 SoC, a five-core heterogeneous, coherent processor with four SiFive U74 cores, and one SiFive S7 core. This SoC is capable of smooth Linux OS operation, giving the developers a good platform to do their optimizations for. There is 8 GB of onboard DDR4 RAM (unknown frequencies and timing), a MicroSD card slot, and one PCIe 3.0 x4 M.2 slot for system storage. To connect the board to the outside world, you get one Gigabit Ethernet port. For user I/O there are four USB 3.2 Gen 1 Type-A ports (1 Charging port) and one MicroUSB Console port. To power the board, you need a proper power supply with a 24-pin power connector. If you plan to build a PC based on the Unmatched board, you would need a standard ITX case, as it comes in the standard Mini-ITX (170x170 mm) form factor. For more information, please check out SiFive's website.

PNY Announces XLR8 Gaming EPIC-X RGB DDR4 3600MHz Desktop Memory

PNY Announced today the addition of the new XLR8 Gaming EPIC-X RGB DDR4 3600 MHz Desktop Memory to the Company's assortment that will deliver the overclocked performance demanded today combined with the brilliance of RGB lighting and unmatched style. Life today demands speed and performance in everything that we do. Whether for work, content creation, learning, or gaming - and we do game - the demand for speed and performance has never been greater and as such, to count on components that deliver this speed and performance is not a luxury but a must. Consider it delivered.

Winning in extreme game titles demands higher framerates allowing for faster on-screen loading letting gamers perform at their best. Faster memory means less bottlenecking for modern CPUs and GPUs that thrive off high speed RAM. The PNY XLR8 Gaming EPIC-X RGB DDR4 3600 MHz Desktop Memory delivers the required Overclocked Performance and supports XMP 2.0 technology to provide a superior gaming experience.
PNY XLR8 Epic-X DDR4-3600

Dialog Semiconductor Licenses its Non-Volatile ReRAM Technology to GLOBALFOUNDRIES for 22FDX Platform

DIALOG SEMICONDUCTOR, a leading provider of battery and power management, Wi-Fi and Bluetooth low energy (BLE) and Industrial edge computing solutions and GLOBALFOUNDRIES (GF ), the world's leading specialty foundry, today announced that they have entered into an agreement in which Dialog licenses its Conductive Bridging RAM (CBRAM) technology to GLOBALFOUNDRIES. The resistive ram (ReRAM)-based technology was pioneered by Adesto Technologies which was recently acquired by Dialog Semiconductor in 2020. GLOBALFOUNDRIES will first offer Dialog's CBRAM as an embedded, non-volatile memory (NVM) option on its 22FDX platform, with the plan to extend to other platforms.

Dialog's proprietary and production proven CBRAM technology is a low power NVM solution designed to enable a range of applications from IoT and 5G connectivity to artificial intelligence (AI). Low power consumption, high read/write speeds, reduced manufacturing costs and tolerance for harsh environments make CBRAM particularly suitable for consumer, medical, and select industrial and automotive applications. Furthermore, CBRAM technology enables cost-effective embedded NVM for advanced technology nodes required for products in these markets.

Arm Spins-out Cerfe Labs to Advance Development of CeRAM Memory Technology

Today Arm announced the spin-out of Cerfe Labs to develop and license new types of non-volatile memories based on correlated electron materials (CeRAM) and ferroelectric transistors (FeFETs). Arm CeRAM researchers will join Cerfe Labs and assume ownership of the Arm joint development project with Symetrix Corporation.

As part of the spin-out, Arm will transfer its full CeRAM IP portfolio of more than 150 patent families to Cerfe Labs that will be the foundation for a roadmap of related CeRAM technologies. Cerfe Labs initial focus will be on producing meaningful prototypes which will be licensed to partners with a goal of accelerating timing of enabling these novel non-volatile materials for systems.

ADATA XPG Launches SPECTRIX D50 Xtreme DDR4 RGB Memory Modules

XPG, a provider of systems, components, and peripherals for gamers, eSports pros, and tech enthusiasts, today announces the XPG SPECTRIX D50 Xtreme DDR4 RGB memory module. Delivering speeds of up to 5000Hz, the XPG SPECTRIX D50 Xtreme isn't just about performance but also form with its solidly constructed heat sink with gorgeous geometric lines, dazzling RGB lighting, and a stunning reflective surface.

Manufactured with only the highest quality chips and PCBs, the SPECTRIX D50 Xtreme offers the pinnacle in stability, reliability, as well as speeds of up to 5000 MHz. What's more, it supports the latest Intel and AMD platforms. The SPECTRIX D50 Xtreme is a looker too with the combination of its indented geometric lines, triangular RGB light bar, and a polished and electroplated surface with a mirror-like sheen. The SPECTRIX D50 Xtreme comes as a dual kit with a capacity of 8 GB per module and in two performance variants, 4800 MHz and 5000 MHz.

Samsung and SK Hynix to Impose Sanctions Against Huawei

Ever since the Trump administration imposed sanctions against Huawei to stop it from purchasing parts from third-party vendors to bypass the ban announced back in May, some vendors continued to supply the company. So it seems like some Korean manufacturers will be joining the doings of the US government, and apply restrictions to Huawei. According to the reports of South Korean media outlets, Samsung Electronics and SK Hynix will be joining the efforts of the US government and the Trump administration to impose sanctions against Chinese technology giant - Huawei.

It is reported that on September 15th, both Samsung and SK Hynix will stop any shipments to Huawei, where Samsung already stopped efforts for creating any new shipments. SK Hynix is said to continue shipping DRAM and NAND Flash products until September 14th, a day before the new sanctions are applied. Until the 14th, Huawei will receive some additional chips from SK Hynix. And it is exactly SK Hynix who is said to be a big loser here. It is estimated that 41.2% of SK Hynix's H1 2020 revenue came from China, most of which was memory purchased for Huawei phones and tablets. If the company loses Huawei as a customer, it would mean that the revenue numbers will be notably lower.

DRAM Revenue Rises by 15.4% in 2Q20, with Possible Decline in Prices Expected for 3Q20, Says TrendForce

The last cyclical upturn in DRAM contract prices began at the start of 2020 and was led by server DRAM, according to TrendForce's latest investigations. In 2Q20, the emergence of the COVID-19 pandemic shocked the global economy, but OEMs maintained or even stepped up procurement of components because they feared disruptions in the supply chain. As a result, DRAM suppliers' bit shipments surpassed expectations for the quarter, in turn widening the overall increase in DRAM ASP and raising the global DRAM revenue by 15.4% QoQ in 2Q20 to US$17.1 billion.

Nevertheless, TrendForce indicates that server OEMs are now carrying a rather high level of DRAM inventory after aggressively stocking up for two consecutive quarters. At the same time, customers of enterprise servers are holding back on procurement because the economic outlook is getting bleaker and more uncertain. Since server DRAM has the unique role of leading cyclical changes, this category is going to be first to experience price drop in the next downturn and thereby pull prices down for other types of DRAM products. As such, TrendForce forecasts at best a flattening of product shipments and decrease in DRAM prices in 3Q20, with DRAM suppliers suffering a decline in profitability.

SiFive Secures $61 Million in Series E Funding Led by SK Hynix

SiFive, Inc., the leading provider of commercial RISC-V processor IP and silicon solutions, today announced it raised $61 million in a Series E round led by SK hynix, joined by new investor Prosperity7 Ventures, with additional funding from existing investors, Sutter Hill Ventures, Western Digital Capital, Qualcomm Ventures, Intel Capital, Osage University Partners, and Spark Capital.

"Global demand for storage and memory in the data center is increasing as AI-powered business intelligence and data processing growth continues", said Youjong Kang, VP of Growth Strategy, SK hynix. "SiFive is well-positioned to grow with opportunities created from data center, enterprise, storage and networking requirements for workload-focused processor IP."

JEDEC Publishes New DDR5 Standard for Advancing Next-Generation High Performance Computing Systems

JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, today announced the publication of the widely-anticipated JESD79-5 DDR5 SDRAM standard. The standard addresses demand requirements being driven by intensive cloud and enterprise data center applications, providing developers with twice the performance and much improved power efficiency. JESD79-5 DDR5 is now available for download from the JEDEC website.

DDR5 was designed to meet increasing needs for efficient performance in a wide range of applications including client systems and high-performance servers. DDR5 incorporates memory technology that leverages and extends industry know-how and experience developing previous DDR memories. The standard is architected to enable scaling memory performance without degrading channel efficiency at higher speeds, which has been achieved by doubling the burst-length to BL16 and bank-count to 32 from 16. This revolutionary architecture provides better channel efficiency and higher application level performance that will enable the continued evolution of next-generation computing systems. In addition, the DDR5 DIMM has two 40-bit fully independent sub-channels on the same module for efficiency and improved reliability.

New features, such as DFE (Decision Feedback Equalization), enable IO speed scalability for higher bandwidth and improved performance. DDR5 supports double the bandwidth as compared to its predecessor, DDR4, and is expected to be launched at 4.8 Gbps (50% higher than DDR4's end of life speed of 3.2 Gbps).

HyperX Adds New Predator DDR4 RGB and FURY DDR4 RGB Memory Modules up to 256GB

HyperX, the gaming division of Kingston Technology, Inc., today announced the release of new and updated speeds and capacities for HyperX Predator DDR4 RGB and HyperX FURY DDR4 RGB memory modules and kits. Featuring memory kits up 256 GB and speeds up to 4600MHz1, the Predator DDR4 RGB and FURY DDR4 RGB memory modules are designed to pass rigorous certification test procedures and are Intel XMP certified and AMD certified Ready for Ryzen.

HyperX Predator DDR4 delivers fast frequencies and low latencies with speeds up to 4800MHz1 and latencies from CL12 to CL19. Predator DDR4 utilizes a black aluminium heat spreader and matching black PCB to complement the look of the latest PC builds. Predator memory is available in 8 GB, 16 GB and 32 GB single modules and in kits of two, four, and eight.

PNY Launches XLR8 RGB DDR4 Desktop Gaming Memory

PNY Technologies Asia Pacific Limited Technologies, the world's leading brand of extreme performance memory,NAND Flash products and professional/gaming graphic cards is pleased to announce the latest addition of its PC Memory assortment by adding the XLR8 Gaming RGB DDR4 Desktop Memory line-up.

The XLR8 Gaming RGB line provides a dynamic experience for gamers, modders and enthusiasts alike combining RGB customization with overclocking capability, XRL8 RGB DRAM uses selected aluminium alloy heat spreader with state of the art surface finish technique and design, create the extraordinary look and feel.

SK hynix Starts Mass-Production of HBM2E High-Speed DRAM

SK hynix announced that it has started the full-scale mass-production of high-speed DRAM, 'HBM2E', only ten months after the Company announced the development of the new product in August last year. SK hynix's HBM2E supports over 460 GB (Gigabyte) per second with 1,024 I/Os (Inputs/Outputs) based on the 3.6 Gbps (gigabits-per-second) speed performance per pin. It is the fastest DRAM solution in the industry, being able to transmit 124 FHD (full-HD) movies (3.7 GB each) per second. The density is 16 GB by vertically stacking eight 16 Gb chips through TSV (Through Silicon Via) technology, and it is more than doubled from the previous generation (HBM2).

HBM2E boasts high-speed, high-capacity, and low-power characteristics; it is an optimal memory solution for the next-generation AI (Artificial Intelligence) systems including Deep Learning Accelerator and High-Performance Computing, which all require high-level computing performance. Furthermore, it is expected to be applied to the Exascale supercomputer - a high-performance computing system which can perform calculations a quintillion times per second - that will lead the research of next-generation basic and applied science, such as climate changes, bio-medics, and space exploration.

Micron Technology Reports Results for the Third Quarter of Fiscal 2020

Micron Technology, Inc. (Nasdaq: MU) today announced results for its third quarter of fiscal 2020, which ended May 28, 2020. "Micron's exceptional execution in the fiscal third quarter drove strong sequential revenue and EPS growth, despite challenges in the macro environment," said Micron Technology President and CEO Sanjay Mehrotra. "We are ramping the industry's most advanced DRAM technology into production and have delivered more than 75% of our NAND volume as high-value solutions, supported by record SSD revenue in the quarter. Our portfolio momentum positions us exceedingly well to leverage the long-term growth across our end markets."

Semiconductor Fabs to Log Record Spending of Nearly $68 Billion in 2021, SEMI Reports

2021 is poised to mark a banner year for global fab equipment spending with 24 percent growth to a record US$67.7 billion, 10 percent higher than the previously forecast US$65.7 billion, and all product segments promising solid growth rates, according to the second-quarter 2020 update of the SEMI World Fab Forecast report. Memory fabs will lead worldwide semiconductor segments with US$30 billion in equipment spending, while leading-edge logic and foundry is expected to rank second with US$29 billion in investments.

The 3D NAND memory subsegment will help power the spending spree with a 30 percent jump in investments this year before tacking on 17 percent growth in 2021. DRAM fab investments will surge 50 percent next year after declining 11 percent in 2020, and fab spending on logic and foundry, mainly leading edge, will trace a similar but more muted trajectory, rising 16 percent 2021 after an 11 percent drop this year.

GELID Unveils the Lumen RAM Heatsinks with RGB Lighting

GELID Lumen offers an easy way of adding RGB into your PC. It features the double-side vest heatsink to enhance DRAM cooling and the RGB module with a standard 3-Pin Fan connector that can be attached to any motherboard. The RGB functions are fully automatic and don't require external hardware or software to set lighting modes.

Made of high-grade components, Lumen supports all types and form-factors of DDR2/DDR3/DDR4 RAM modules designed for desktops. It ensures fast installation and perfectly fits high-performance DRAM to boost overclocking capabilities and energize your gaming rig with spectacular RGB lighting.

Micron's Low-Power DDR5 DRAM Boosts Performance and Consumer Experience of Motorola's New Flagship Edge+ Smartphone

Micron Technology, Inc., together with Motorola, today announced integration of Micron's low-power DDR5 (LPDDR5) DRAM into Motorola's new motorola edge+ smartphone, bringing the full potential of the 5G experience to consumers. Micron and Motorola worked in close collaboration to enable the edge+ to reach 5G network speeds that require maximum processing power coupled with high bandwidth memory and storage.

With 12 gigabytes (GB) of industry-leading Micron LPDDR5 DRAM memory, motorola edge+ delivers a smooth, lag-free consumer experience. The new phone takes advantage of the faster data speeds and lower latency of 5G to increase the performance of cloud-based applications such as gaming and streaming entertainment.
Motorola Edge+

GDP Win Max is an 8-inch Gaming Laptop with Intel's Ice Lake CPU

GDP, a company specializing in the creation of tiny laptops designed for gaming, has just announced the latest addition to its family of tiny notebooks - the GDP Win Max gaming laptop. This model is an 8-inch gaming laptop packing a lot for its size. On the outside, this laptop is equipped with joysticks on both sides, so there is even an option to directly play games using these joysticks instead of the built-in keyboard. The display of the device is an IPS screen that features a 1280×800 resolution, resulting in a 16:10 aspect ratio of the display. What's more important, however, is what is under the hood of the small body.

It is powered by Intel's latest Ice Lake CPU - the Intel Core i5-1035G7. Being a 4 core/ 8 threaded CPU with Gen11 Iris Plus 940 graphics it is accompanied by 16 GB of LPDDR4X RAM and 512 GB SSD. GDP has provided some of the benchmark results of this configuration which you can check out below, however, please take these with a grain of salt. As far as I/O goes, this small laptop is rather well equipped with plenty of ports. There is one Thunderbolt 3 port to connect to external GPU is it is needed. There is one USB Type-C 3.1 Gen2 port and two USB Type-A 3.1 Gen1 ports for the connection of external peripherals. If you wish to connect the laptop to the outside screen, there are options of HDMI, USB Type-C or Thunderbolt 3 ports for connection. A welcome addition to I/O is the inclusion of the RJ45 connector, meaning that if you have access to ethernet you can easily plug it into this laptop.
GDP Win Max GDP Win Max GDP Win Max Benchmarks GDP Win Max Benchmarks

ADATA Announces XPG SPECTRIX D50 DDR4 RGB 32GB Memory Module

ADATA, a leading manufacturer of high-performance DRAM modules, NAND Flash products, gaming products, and mobile accessories,today announces the launch of the XPG SPECTRIX D50 DDR4 RGB memory module. Reaching performance of up to 4800 MHz, sporting a maximum capacity of 32 GB, and featuring an elegant geometric design, the XPG SPECTRIX D50 offers immense performance and minimalist styling gamers, overclockers, and PC enthusiasts will appreciate.

Made with only the highest quality chips and PCBs, the XPG D50 provides ultimate stability, reliability, and speeds of up to 4800 MHz. What's more, it supports the latest Intel and AMD platforms. To ensure all that amazing performance inside is protected from impact, the XPG D50 sports a robust heatsink with a wall thickness of nearly 2 mm for excellent durability. The D50 support Intel XMP 2.0 for hassle-free and stable overclocking without the need to go into BIOS.

Gartner Forecasts Worldwide Semiconductor Revenue to Decline 0.9% in 2020 Due to Coronavirus Impact

Due to the impact of the coronavirus on semiconductor supply and demand, worldwide semiconductor revenue is forecast to decline 0.9% in 2020, according to Gartner, Inc. This is down from the previous quarter's forecast of 12.5% growth.

"The wide spread of COVID-19 across the world and the resulting strong actions by governments to contain the spread will have a far more severe impact on demand than initially predicted," said Richard Gordon, research practice vice president at Gartner. "This year's forecast could have been worse, but growth in memory could prevent a steep decline."
Gartner WorldWide Semiconductor Revenue Forcast

DDR5 Arrives at 4800 MT/s Speeds, First SoCs this Year

Cadence, a fabless semiconductor company focusing on the development of IP solutions and IC design and verification tools, today posted an update regarding their development efforts for the 5th generation of DDR memory which is giving us some insights into the development of a new standard. The new DDR5 standard is supposed to bring better speeds and lower voltages while being more power-efficient. In the Cadence's blog called Breakfast Bytes, one of Cadence's memory experts talked about developments of the new standards and how they are developing the IP for the upcoming SoC solutions. Even though JEDEC, a company developing memory standards, hasn't officially published DDR5 standard specifications, Cadence is working closely with them to ensure that they stay on track and be the first on the market to deliver IP for the new standard.

Marc Greenberg, a Cadence expert for memory solutions was sharing his thoughts in the blog about the DDR5 and how it is progressing. Firstly, he notes that DDR5 is going to feature 4800 MT/s speeds at first. The initial speeds will improve throughout the 12 months when the data transfer rate will increase in the same fashion we have seen with previous generation DDR standards. Mr. Greenberg also shared that the goals of DDR5 are to have larger memory dies while managing latency challenges, same speed DRAM core as DDR4 with a higher speed I/O. He also noted that the goal of the new standard is not the bandwidth, but rather capacity - there should be 24Gb of memory per die initially, while later it should go up to 32Gb. That will allow for 256 GB DIMMs, where each byte can be accessed under 100 ns, making for a very responsive system. Mr. Greenberg also added that this is the year of DDR5, as Cadence is receiving a lot of orders for their 7 nm IP which should go in production systems this year.
Cadence DDR5

Micron to Launch HBM2 Memory This Year

Micron Technologies, in the latest earnings report, announced that they will start shipping High-Bandwidth Memory 2 (HBM2) DRAM. Used for high-performance graphics cards, server processors and all kinds of processors, HBM2 memory is wanted and relatively expensive solution, however, when Micron enters the market of its manufacturing, prices, and the market should adjust for the new player. Previously, only SK-Hynix and Samsung were manufacturing the HBM2 DRAM, however, Micron will join them and they will again form a "big-three" pact that dominates the memory market.

Up until now, Micron used to lay all hopes on its proprietary Hybrid Memory Cube (HMC) DRAM type, which didn't gain much traction from customers and it never really took off. Only a few rare products used it, as Fujitsu SPARC64 XIfx CPU used in Fujitsu PRIMEHPC FX100 supercomputer introduced in 2015. Micron announced to suspend works on HMC in 2018 and decided to devote their efforts to GDDR6 and HBM development. So, as a result, we are seeing that they will launch HBM2 DRAM products sometime this year.
Micron HMC High-Bandwidth Memory

Samsung Announces Industry's First EUV DRAM with Shipment of First Million Modules

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it has successfully shipped one million of the industry's first 10 nm-class (D1x) DDR4 (Double Date Rate 4) DRAM modules based on extreme ultraviolet (EUV) technology. The new EUV-based DRAM modules have completed global customer evaluations, and will open the door to more cutting-edge EUV process nodes for use in premium PC, mobile, enterprise server and datacenter applications.

"With the production of our new EUV-based DRAM, we are demonstrating our full commitment toward providing revolutionary DRAM solutions in support of our global IT customers," said Jung-bae Lee, executive vice president of DRAM Product & Technology at Samsung Electronics. "This major advancement underscores how we will continue contributing to global IT innovation through timely development of leading-edge process technologies and next-generation memory products for the premium memory market."
Samsung EUV DDR4

Everspin Technologies and GLOBALFOUNDRIES Extend MRAM Joint Development Agreement to 12nm

Everspin Technologies, Inc., the world's leading developer and manufacturer of Magnetoresistive RAM (MRAM), today announced an amendment of its Spin-transfer Torque (STT-MRAM) joint development agreement (JDA) with GLOBALFOUNDRIES (GF ), the world's leading specialty foundry. Everspin and GF have been partners on 40 nm, 28 nm, and 22 nm STT-MRAM development and manufacturing processes and have now updated their agreement to set the terms for a future project on an advanced 12 nm FinFET MRAM solution. Everspin is in production of discrete STT-MRAM solutions on 40 and 28 nm, including its award winning 1 Gb DDR4 device. GF recently announced it has achieved initial production of embedded MRAM (eMRAM) on its 22FDX platform.
Return to Keyword Browsing