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Samsung Showcases Industry-Leading Displays at ISE 2020

Samsung Electronics is pushing the industry another step forward with an expansion of QLED 8K SMART displays, new applications of The Wall and showcasing the new-and-improved Samsung Flip 2 digital flipchart.

"Samsung is making tomorrow's technology a reality with complete display solutions that are more immersive, collaborative and interactive than ever before. ISE is one of the best opportunities for Samsung to showcase advanced commercial applications of our industry-leading displays," said Hyesung Ha, Senior Vice President of Visual Display Business at Samsung Electronics. "We're excited to unveil new features and expanded lineups of our digital signage with next-generation technology such as 8K, the new model of The Wall, collaborative displays and more that will provide businesses with opportunities they've never had before."

Samsung Launches 3rd-Generation "Flashbolt" HBM2E Memory

Samsung Electronics, the world leader in advanced memory technology, today announced the market launch of 'Flashbolt', its third-generation High Bandwidth Memory 2E (HBM2E). The new 16-gigabyte (GB) HBM2E is uniquely suited to maximize high performance computing (HPC) systems and help system manufacturers to advance their supercomputers, AI-driven data analytics and state-of-the-art graphics systems in a timely manner.

"With the introduction of the highest performing DRAM available today, we are taking a critical step to enhance our role as the leading innovator in the fast-growing premium memory market," said Cheol Choi, executive vice president of Memory Sales & Marketing at Samsung Electronics. "Samsung will continue to deliver on its commitment to bring truly differentiated solutions as we reinforce our edge in the global memory marketplace."

Fractal Design Announces the Aventador-inspired Gaming PC Giveaway

Fractal Design partnered with Greg Salazar to bring you a chance to win a pre-built gaming PC inspired by the Lamborghini Aventador. Other prizes include 24-hour exotic car rentals so you can turn heads wherever you go. The star attraction is the Aventador-inspired gaming PC, powered by Fractal Design hardware. Nestled in a custom Fractal Design Meshify C chassis, and powered by a Fractal Design Ion+ 860 W Platinum power-supply, this beast has some serious chops: AMD Ryzen 9 3900X processor, MSI MPG X570 Gaming Pro Carbon motherboard, MSI GeForce RTX 2070 Super Gaming X graphics card, 16 GB G.Skill RipJaws V memory, and Samsung 860 EVO 500 GB storage. The main giveaway hosted on Gleam lets you win the Aventador-inspired gaming PC, while a bonus giveaway form lets you take a crack at the exotic car rentals. Gleam lets you increase your chances of winning by up to 24 times. Open from now, February 4, 01:00 UTC, until February 18, 05:59 UTC, the main giveaway is open worldwide. Good Luck!

For more information, and to participate, visit this page.

Intel Core i5-L16G7 is the first "Lakefield" SKU Appearance, Possible Prelude to New Nomenclature?

Intel Core i5-L16G7 is the first commercial SKU that implements Intel's "Lakefield" heterogenous x86 processor architecture. This 5-core chip features one high-performance "Sunny Cove" CPU core, and four smaller "Tremont" low-power cores, with an intelligent scheduler balancing workloads between the two core types. This is essentially similar to ARM big.LITTLE. The idea being that the device idles most of the time, when lower-powered CPU cores can hold the fort; performance cores kick in only when really needed, until which time they remain power-gated. Thai PC enthusiast TUM_APISAK discovered the first public appearance of the i5-L16G7 in an unreleased Samsung device that has the Userbenchmark device ID string "SAMSUNG_NP_767XCL."

Clock speeds of the processor are listed as "1.40 GHz base, with 1.75 GHz turbo," but it's possible that the two core types have different clock-speed bands, just like the cores on big.LITTLE SoCs. Other key components of "Lakefield" include an iGPU based on the Gen11 graphics architecture, and an LPDDR4X memory controller. "Lakefield" implements Foveros packaging, in which high-density component dies based on newer silicon fabrication nodes are integrated with silicon interposers based on older fabrication processes, which facilitate microscopic high-density wiring between the dies. In case of "Lakefield," the Foveros package features a 10 nm "compute field" die sitting atop a 22 nm "base field" interposer.

Chinese Government Closes Foxconn and Samsung Factories Amid Coronavirus Outbreak

Some of the recent news from China is the stuff of science fiction, with the Central Government there locking down entire cities to contain the deadly Coronavirus outbreak there. When cities with 10+ million populations are under lock-down, it's only natural for factories to run out of workforce. According to a ZeroHedge report, the government has reportedly shut down factories owned or operated by big names in the technology and FMCG (fast-moving consumer goods) industries.

Among these are the ubiquitous Foxconn, which has manufacturing contracts with the biggest silicon valley tech firms for contract-manufacturing their hard-product - including the Apple iPhone; and Samsung Electronics, which makes consumer electronics, home appliances, and certain semiconductor products in China. A third big name in the report is the FMCG and pharmaceutical giant Johnson & Johnson. The closure of factories could wreck tech stocks in the coming trading sessions, not to mention possible impact on prices of electronics. As of now, the closure is stipulated for the next 1-2 weeks.

Rumor: NVIDIA's Next Generation GeForce RTX 3080 and RTX 3070 "Ampere" Graphics Cards Detailed

NVIDIA's next-generation of graphics cards codenamed Ampere is set to arrive sometime this year, presumably around GTC 2020 which takes place on March 22nd. Before the CEO of NVIDIA, Jensen Huang officially reveals the specifications of these new GPUs, we have the latest round of rumors coming our way. According to VideoCardz, which cites multiple sources, the die configurations of the upcoming GeForce RTX 3070 and RTX 3080 have been detailed. Using the latest 7 nm manufacturing process from Samsung, this generation of NVIDIA GPU offers a big improvement from the previous generation.

For starters the two dies which have appeared have codenames like GA103 and GA104, standing for RTX 3080 and RTX 3070 respectively. Perhaps the biggest surprise is the Streaming Multiprocessor (SM) count. The smaller GA104 die has as much as 48 SMs, resulting in 3072 CUDA cores, while the bigger, oddly named, GA103 die has as much as 60 SMs that result in 3840 CUDA cores in total. These improvements in SM count should result in a notable performance increase across the board. Alongside the increase in SM count, there is also a new memory bus width. The smaller GA104 die that should end up in RTX 3070 uses a 256-bit memory bus allowing for 8/16 GB of GDDR6 memory, while its bigger brother, the GA103, has a 320-bit wide bus that allows the card to be configured with either 10 or 20 GB of GDDR6 memory. In the images below you can check out the alleged diagrams for yourself and see if this looks fake or not, however, it is recommended to take this rumor with a grain of salt.

Samsung at CES 2020: SSD 980 PCIe Gen 4 M.2, SSD T7, and the Gorgeous Odyssey G9 Monitor

It's finally here: a high-end PCI-Express gen 4.0 M.2 NVMe SSD by Samsung, made end-to-end by homebrew components. When it releases sometime later this year with a possible technical reveal in Q2, the SSD 980 will be possibly the only client-segment M.2 NVMe PCIe gen 4 SSD to feature MLC (2 bits per cell) NAND flash memory. This also means that the highest capacity on offer is just 1 TB. The company also put out sequential transfer rates: up to 6,500 MB/s reads, with up to 5,000 MB/s writes. The biggest payoffs of MLC would be sustained write performance and endurance (in its capacity class, compared to TLC and QLC).

Next up, is the Portable SSD T7 Touch, a successor to the T5 from 2017. This drive comes in an in-built fingerprint reader, letting you secure its data with your fingerprints. The drive is also a much needed update to the T5, which still uses 64-layer TLC NAND; and possibly uses the latest generation 96-layer V-NAND. The drive is built with an aluminium case that's drop-resistant up to 2 m. A single USB 3.2 connection handles power and data. The drive includes type-C to type-C and type-C to type-A cables, and will be compatible not just with PCs, but also Samsung Galaxy smartphones and tablets.

Elevate the Google Experience with Samsung's First-Ever Galaxy Chromebook

Samsung Electronics Co., Ltd. today introduced Galaxy Chromebook, a premium 2-in-1 device that sets a higher standard in mobile computing. This new entrant to the Galaxy Computing portfolio redefines what a Chromebook can be. As the thinnest Samsung Chromebook ever released, it combines the best of Samsung technical innovation - such as an AMOLED display and built-in-pen support, offering users new ways to take advantage of Chrome OS experience that is simple, fast, and seamless.

"The notion that we do everything stationary at a desk is a thing of the past, and people need premium devices built for our new reality," said Alanna Cotton, Senior Vice President and General Manager at Samsung Electronics America. "By offering a seamless, premium user experience, Galaxy Chromebook helps you effortlessly switch between streaming, creative projects, word processing, and more."

AMD to Outpace Apple as TSMC's Biggest 7nm Customer in 2020

AMD in the second half of 2020 could outpace Apple as the biggest foundry customer of TSMC for its 7 nm silicon fabrication nodes (DUV and EUV combined). There are two key factors contributing to this: AMD significantly increasing its orders for the year; and Apple transitioning to TSMC's 5 nm node for its A14 SoC, freeing up some 7 nm allocation, which AMD grabbed. AMD is currently tapping into 7 nm DUV for its "Zen 2" chiplet, "Navi 10," and "Navi 14" GPU dies. The company could continue to order 7 nm DUV until these products reach EOL; while also introducing the new "Renoir" APU die on the process. The foundry's new 7 nm+ (EUV) node will be utilized for "Zen 3" chiplets and "Navi 2#" GPU dies in 2020.

Currently, the top-5 customers for TSMC 7 nm are Apple, HiSilicon, Qualcomm, AMD, and MediaTek. Barring AMD, the others in the top-5 build mobile SoCs or 4G/5G modem chips on the node. AMD is expected to top the list as it scales up orders with TSMC. In the first half of 2020, TSMC's monthly output for 7 nm is expected to grow to 110,000 wafers per month (wpm). Apple's migration to 5 nm in 2H-2020, coupled with capacity-addition could take TSMC's 7 nm output to 140,000 wpm. AMD has reportedly booked the entire capacity-addition for 30,000 wpm, taking its allocation up to 21% in 2H-2020. Qualcomm is switching to Samsung for its next-generation SoCs and modems designed for 7 nm EUV. NVIDIA, too, is expected to built its next-gen 7 nm EUV GPUs on Samsung instead of TSMC. These moves by big players could free up significant foundry allocation at TSMC for AMD's volumes to grow in 2020.

Samsung Expands Computing Portfolio with Galaxy Book Flex Alpha

Samsung Electronics Co., Ltd. today introduced Galaxy Book Flex α (alpha), a new variant of Galaxy Book Flex that offers long-lasting battery, immersive QLED display, and exquisite design features at a competitive price-point. Today's consumers are constantly striving to blend their personal and work lives - and everything in between. Galaxy Book Flex α is the latest installment in Samsung's new line of Galaxy Computing devices, which combine the productivity and premium experience of a laptop with the mobility and flexibility of a smartphone.

"We all have different routines, and we need technology that works the way we work, and with our new Galaxy Computing line, we're giving consumers the ability to choose a PC that meets their unique needs," said Alanna Cotton, Senior Vice President and General Manager at Samsung Electronics America. "Galaxy Book Flex α is a stellar new variant of the Galaxy Computing line, offering many of the best design, hardware, and display features at an accessible price-point."

NAND Flash Prices to Rise up to 40% in 2020

According to the sources over at DigiTimes, NAND flash prices are set to rise by up to 40% in 2020. This report is coming from sources over at memory chipmakers, presumably some of the biggest players like SK Hynix, Micron, and Samsung. If the prediction realizes, consumers will see a significant price jump for products based on NAND flash memory like most of today's solid-state drives. For reference, earlier today we also reported that a minute long power outage at Samsung created damage worth millions of Dollars in DRAM and NAND flash memory.

This incident alone could help contribute to the price rise of NAND memory in 2020. Other possible reasons may include an inefficient supply of materials used by NAND flash production lines or a simple supply-demand ratio, which would hurt prices of NAND flash long-therm. However, we hope that the underlying problems for this predicted price rise can be worked out and that companies like Samsung, which got power outage accident, can supplement the capacity loss during the unplanned turn of events.

Minute-long Power Outage at Samsung Plant Damages Millions Worth DRAM and NAND

A tiny minute-long power-outage halted production at a Samsung Electronics plant in Hwaseong, South Korea, according to a Reuters report citing Korean news agency Yonhap. This stopped some production lines of DRAM and NAND flash memory. A source with "direct knowledge of the matter" told Reuters that the outage likely caused millions of Dollars in losses to Samsung. Semiconductor manufacturing in general is a very power-sensitive process, and a stoppage at any of its manufacturing stages can result in wasted batches; not to mention the time lost to recovery. For instance, a 30-minute power outage in 2018 inflicted a $43.32 million loss to Samsung.

The cause of the power outage on Tuesday afternoon (31st December), is said to be a fault with a regional transmission cable. It will take Samsung up to two days (mid-Thursday) to get the production line rolling again. On the flipside, the resulting drop in output could help Samsung push out its swelling NAND flash and DRAM inventory, reports Yonhap, citing an analyst.

Samsung Starts Production of AI Chips for Baidu

Baidu, a leading Chinese-language Internet search provider, and Samsung Electronics, a world leader in advanced semiconductor technology, today announced that Baidu's first cloud-to-edge AI accelerator, Baidu KUNLUN, has completed its development and will be mass-produced early next year. Baidu KUNLUN chip is built on the company's advanced XPU, a home-grown neural processor architecture for cloud, edge, and AI, as well as Samsung's 14-nanometer (nm) process technology with its I-Cube (Interposer-Cube) package solution.

The chip offers 512 gigabytes per second (GBps) memory bandwidth and supplies up to 260 Tera operations per second (TOPS) at 150 watts. In addition, the new chip allows Ernie, a pre-training model for natural language processing, to infer three times faster than the conventional GPU/FPGA-accelerating model. Leveraging the chip's limit-pushing computing power and power efficiency, Baidu can effectively support a wide variety of functions including large-scale AI workloads, such as search ranking, speech recognition, image processing, natural language processing, autonomous driving, and deep learning platforms like PaddlePaddle.

TSMC Becomes Asia's Most Valuable Company

Taiwan Semiconductor Manufacturing Company, Limited, also known as TSMC shortly became Asia's biggest and the most valuable company with a market cap of over 8.02 trillion New Taiwan Dollars, which roughly translates to 262.75 billion US Dollars. Becoming the biggest Asian company, TSMC's market capitalization has now surpassed Samsung for the first time in the history of company existence.

The underlying reasons for becoming a company that TSMC is today, are plenty. Firstly, they are providing customers with the flexibility of choosing any manufacturing node, whatever it is the latest 7 nm or the older ones like 180 nm. They have a choice whatever they want to use something older and less expensive or something newer for high-performance and lower power. Additionally, TSMC is re-investing a big part of its profits into research and development efforts to stay competitive and deliver only the best technology to its customers, on time.

Samsung Scores PC CPU Manufacturing Order from Intel

Samsung has reportedly secured a "PC CPU" manufacturing order from Intel. This would entail Intel using Samsung's fabs to manufacture its processors. "PC CPU" is a broad term, interchangeable with "client CPU," and could include both notebook and desktop processors, spanning the "S," "H," "U," and "Y" silicon variants (mainstream desktop, mainstream notebook, ultrabook, and ultra low-power, respectively). Samsung's bouquet of contract-manufacturing covers not just silicon fabrication across 14 nm, but also sub 10 nm nodes, but also provides other key stages of processor manufacturing, including bumping and packaging. Intel would want minimal expenditure in adapting its chip designs to Samsung's nodes

In her November 20 letter addressed to Intel's customers, executive V-P and GM for sales, marketing, and communications, Michelle Johnston Holthaus, mentioned that in addition to Intel's own manufacturing facilities, the company is roping in "foundries" (third-party silicon fabrication companies) to meet demand. Samsung and TSMC lead the foundry business, followed by the likes of GlobalFoundries, UMC, etc.
Many Thanks to biffzinker for the tip.

Intel Takes the Crown of World's Largest Semiconductor Supplier in 2019

Intel is set to become the world's largest semiconductor supplier of 2019, according to the research from IC Insights. Intel held a crown for the largest semiconductor supplier since 1992, until 2018 when Samsung overtook it because of the booming DRAM business driven by high demand and not enough supply. Being Samsung's main business, any DRAM price/demand fluctuation was having a massive impact on its business. Due to high demand and high pricing, Samsung saw a massive revenue jump which resulted in a new king of the world's largest semiconductor supplier.

However, having seen predictions for a fall of 34% for this year, the decrease in demand will result in lower revenue for all DRAM market suppliers. SK Hynix, Micron and Samsung are expecting their revenues to decline around 29% on a year-over-year basis given the situation. This is resulting in lower revenue for Samsung than Intel has, and makes Intel the king of semiconductors once more. Intel's revenue is expected to reach around 70 billion USD, which is similar to last year's numbers.

Samsung Faces Factory Contamination

Today, Samsung's foundry division, dedicated to the manufacturing of DRAM chips, is facing challenges from mistakes that happened a few weeks ago. Those mistakes are in the form of contamination of the clean rooms, where all the tools necessary for the manufacturing of DRAM chips on 200 mm wafers got infected, and now Samsung is taking a multi-million dollar loss because the new wafers have to be scrapped.

Clean rooms are essential for the semiconductor manufacturing process, because they keep all the pollutants away from silicon, keeping silicon clean and ready for use. However, Samsung has not managed to keep a clean room for its DRAM manufacturing facility working with 200 mm wafers for 1x nm-class DRAM chips. The tools used for wafer processing have been contaminated and, therefore, the wafers themselves because of their interactions. Samsung has admitted that they have lost around "several billion South Korean won," resulting in millions of US dollars. The re-assuring thing that this will not significantly impact the DRAM market is that production is now going as planned, and the issue is sorted out, so we can hope this doesn't have any big impact on the DRAM prices.

Samsung Shuts Down Its Custom CPU Design Group

According to the information obtained by Statesman, Samsung Electronics is shutting down its custom CPU design group within the company. Known for the designs of mobile SoCs like Exynos 9110, 9810 and 9820 just to name a few, it seems that there will be no more future developments of custom Exynos SoC for Samsung's mobile devices. Instead of designing its own cores, Samsung is now going to use ARM's reference A7x series of CPUs based on ARM v8 instruction set, with A76 or A77 being chosen as likely candidates for the high-performance workloads.

So far it is still unknown what will be inside new processors like the upcoming Exynos 9830 SoC, meant to power the next generation of mobile devices. But if things are like Samsung states, there should be reference ARM cores like A77 inside the new chip. Already announced chips like Exynos 990 are supposed to use a custom CPU core, while all future revisions of any new Exynos SoC will license a design IP from ARM. This decision is supposedly a by-product of being unable to compete with offers from Qualcomm, which offers faster "Snapdragon" SoCs. Samsung already uses the Snapdragon SoCs in its phones for the US and Chinese markets, while the rest of the world is getting an Exynos equivalent with the purchase of the same mobile device.

Samsung Delivers a New Computing Experience with Galaxy Book Flex and Galaxy Book Ion

Samsung Electronics today introduced Galaxy Book Flex and Galaxy Book Ion at the Samsung Developer Conference 2019 (SDC19), two premium laptops offering ultra-portable and ultra-powerful computing experiences to meet the unique needs of modern professionals for their always on-the-go lifestyles. Today's on-the-go consumers need PCs that deliver maximum productivity, while being mobile enough to take wherever you're going. Galaxy Book Flex and Galaxy Book Ion were built for that and more, offering a seamless continuity across multiple devices.

"Consumers often have to choose between mobility and high-performance hardware when choosing a laptop," said YoungGyoo Choi, Senior Vice President of, Mobile Communications Business at Samsung Electronics. "Galaxy Book Flex and Galaxy Book Ion eliminate the need to compromise by offering powerful performance with unparalleled portability and display innovation."

Intel "Tiger Lake-U" Processors Could Support LPDDR5 Memory

Intel's Core "Tiger Lake" microarchitecture could be a point of transition between DDR4 and DDR5 for the company. Prototypes of devices based on the ultra-compact "Tiger Lake-Y" SoC were earlier shown featuring LPDDR4X memory, although a new device, possibly a prototyping platform, in the regulatory queue with the Eurasian Economic Commission describes itself as featuring a "Tiger Lake-U" chip meant for thin and light notebooks and convertibles. This device features newer LPDDR5 memory, according to its regulatory filing.

LPDDR5 succeeds LPDDR4X as the industry's next low-power memory standard, offering data-rates of up to 6,400 MT/s (versus up to 4,266 MT/s of LPDDR4X), and consumes up to 30 percent less power. This prototype at the EEC is sure to be using unreleased LPDDR5 memory chips as DRAM majors Samsung and SK Hynix plan to ship their DDR5-based memory solutions only by the end of this year, although mass-production of the chips have already started at Samsung, in PoP form-factors. A successor to the 10th generation Core "Ice Lake," "Tiger Lake" will be Intel's second CPU microarchitecture designed for its 10 nm silicon fabrication node.

Samsung Begins Mass-production of 12GB LPDDR4X uMCP Memory Chips

Samsung Electronics, a world leader in advanced memory technology, today announced that it has begun mass producing the industry's first 12-gigabyte (GB) low-power double data rate 4X (LPDDR4X) UFS-based multichip package (uMCP). The announcement was made as part of the company's annual Samsung Tech Day at its Device Solutions' America headquarters in San Jose, California.

"Leveraging our leading-edge 24-gigabit (Gb) LPDDR4X chips, we can offer the highest mobile DRAM capacity of 12 GB not only for high-end smartphones but also for mid-range devices," said Sewon Chun, executive vice president of Memory Marketing at Samsung Electronics. "Samsung will continue to support our smartphone-manufacturing customers with on-time development of next-generation mobile memory solutions, bringing enhanced smartphone experiences to many more users around the globe."

NVIDIA Leads the Edge AI Chipset Market but Competition is Intensifying: ABI Research

Diversity is the name of the game when it comes to the edge Artificial Intelligence (AI) chipset industry. In 2019, the AI industry is witnessing the continual migration of AI workloads, particularly AI inference, to edge devices, including on-premise servers, gateways, and end-devices and sensors. Based on the AI development in 17 vertical markets, ABI Research, a global tech market advisory firm, estimates that the edge AI chipset market will grow from US $2.6 billion in 2019 to US $7.6 billion by 2024, with no vendor commanding more than 40% of the market.

The frontrunner of this market is NVIDIA, with a 39% revenue share in the first half of 2019. The GPU vendor has a strong presence in key AI verticals that are currently leading in AI deployments, such as automotive, camera systems, robotics, and smart manufacturing. "In the face of different use cases, NVIDIA chooses to release GPU chipsets with different computational and power budgets. In combination with its large developer ecosystem and partnerships with academic and research institutions, the chipset vendor has developed a strong foothold in the edge AI industry," said Lian Jye Su, Principal Analyst at ABI Research.

NVIDIA is facing stiff competition from Intel with its comprehensive chipset portfolio, from Xeon CPU to Mobileye and Movidius Myriad. At the same time, FPGA vendors, such as Xilinx, QuickLogic, and Lattice Semiconductor, are creating compelling solutions for industrial AI applications. One missing vertical from NVIDIA's wide footprint is consumer electronics, specifically smartphones. In recent years, AI processing in smartphones has been driven by smartphone chipset manufacturers and smartphone vendors, such as Qualcomm, Huawei, and Apple. In smart home applications, MediaTek and Amlogic are making their presence known through the widespread adoption of voice control front ends and smart appliances.

Samsung Develops Industry's First 12-Layer 3D-TSV Chip Packaging Technology

Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today announced that it has developed the industry's first 12-layer 3D-TSV (Through Silicon Via) technology. Samsung's new innovation is considered one of the most challenging packaging technologies for mass production of high-performance chips, as it requires pinpoint accuracy to vertically interconnect 12 DRAM chips through a three-dimensional configuration of more than 60,000 TSV holes, each of which is one-twentieth the thickness of a single strand of human hair.

The thickness of the package (720 µm) remains the same as current 8-layer High Bandwidth Memory-2 (HBM2) products, which is a substantial advancement in component design. This will help customers release next-generation, high-capacity products with higher performance capacity without having to change their system configuration designs. In addition, the 3D packaging technology also features a shorter data transmission time between chips than the currently existing wire bonding technology, resulting in significantly faster speed and lower power consumption.

NVIDIA Could Launch Next-Generation Ampere GPUs in 1H 2020

According to the sources over at Igor's Lab, NVIDIA could launch its next generation of GPUs, codenamed "Ampere", as soon as first half of the 2020 arrives. Having just recently launched GeForce RTX Super lineup, NVIDIA could surprise us again in the coming months with replacement for it's Turing lineup of graphics cards. Expected to directly replace high-end GPU models that are currently present, like GeForce RTX 2080 Ti and RTX 2080 Super, Ampere should bring many performance and technology advancements a new graphics card generation is usually associated with.

For starters, we could expect a notable die shrink to take place in form of 7 nm node, which will replace the aging 12 nm process that Turing is currently being built on. This alone should bring more than 50% increase in transistor density, resulting in much more performance and lower power consumption compared to previous generation. NVIDIA's foundry of choice is still unknown, however current speculations are predicting that Samsung will manufacture Ampere, possibly due to delivery issues that are taking place at TSMC. Architectural improvements should take place as well. Ray tracing is expected to persist and get enhanced with possibly more hardware allocated for it, along with better software to support the ray tracing ecosystem of applications.

Moore's Law - Is it Really Dead ?

"Moore's Law" is a term coined in 1965 by Gordon Moore, who presented a paper which predicts that semiconductor scaling will allow integrated circuits to feature twice as many transistors present per same area as opposed to a chip manufactured two years ago. That means we could get same performance at half the power than the previous chip, or double the performance at same power/price in only two years time. Today we'll investigate if Moore's Law stayed true to its cause over the years and how much longer can it keep going.
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