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Samsung Electronics Announces Second Quarter 2021 Results

Samsung Electronics today reported financial results for the second quarter ended June 30, 2021. Total consolidated revenue was KRW 63.67 trillion, a 20% increase from the previous year and a record for the second quarter. Operating profit increased 34% from the previous quarter to KRW 12.57 trillion as market conditions improved in the memory market, operations normalized at the Austin foundry fab, and as effective global supply chain management (SCM) helped maintain solid profitability for the finished product businesses.

The Semiconductor business saw a significant improvement in earnings as memory shipments exceeded previous guidance and price increases were higher than expected, while the Company strengthened its cost competitiveness. For the Display Panel Business, a one-off gain and an increase in overall prices boosted profits.

Samsung Announces Odyssey Neo G9 Gaming Monitor

Samsung Electronics, today announced the global launch of its next-generation curved gaming monitor, the Odyssey Neo G9, enhanced with Quantum Mini LED technology. The Odyssey Neo G9 joins the Odyssey lineup, taking gaming to the next level with Quantum Matrix technology, supported by Quantum Mini LED display and Quantum HDR 2000 for an immersive gaming experience.

With the previous launch of the Odyssey G9 in 2020, Samsung pushed the boundaries of premium gaming monitors with smooth and brilliant picture quality. Now with the industry's first Quantum Mini LED curved display delivering the most refined detail regardless of the game played, the Odyssey Neo G9 is catapulting the gaming monitor category forward. Featuring Quantum Matrix Technology combined with super-fast response and refresh rates, Odyssey Neo G9 delivers an unrivaled dynamic picture and premium performance for all gamers.

Intel Rebadges 10nm Enhanced SuperFin Node as "Intel 7," Invents Other Creative Node Names

Intel, in a move comparable to its competitors' Performance Rating system from the 1990s, has invented a new naming scheme for its in-house foundry nodes to claim technological parity with contemporaries such as TSMC and Samsung, that are well into the sub-10 nm class. Back in the i586 era, when Intel's competitors such as AMD and Cyrix, couldn't keep up with its clock-speeds yet found their chips to be somewhat competitive, they invented the PR (processor rating) system, with a logical number attempting to denote parity with an Intel processor's clock-speed. For example, a PR400 processor rating meant that the chip rivaled a Pentium II 400 MHz (which it mostly didn't). The last that the PR system made sense was with the final generation of single-core performance chips, Pentium 4 and Athlon XP, beyond which, the introduction of multi-core obfuscated the PR system. A Phenom X4 9600 processor didn't mean performance on par with a rival Intel chip running at an impossible 9.60 GHz.

Intel's new foundry naming system sees its 10 nm Enhanced SuperFin node re-badge as "Intel 7." The company currently builds 11th Gen Core "Tiger Lake" processors on the 10 nm SuperFin node, and is expected to build its upcoming 12th Gen Core "Alder Lake" chips on its refinement, the 10 nm Enhanced SuperFin, which will now be referred to as "Intel 7." The company is careful to avoid using the nanometer unit next to the number, instead signaling the consumer that the node somehow offers transistor density and power characteristics comparable to a 7 nm node. Intel 7 offers a 10-15 percent performance/Watt gain over 10 nm SuperFin, and is already in volume production, with a debut within 2021 with "Alder Lake."

NVIDIA "Ada Lovelace" Architecture Designed for N5, GeForce Returns to TSMC

NVIDIA's upcoming "Ada Lovelace" architecture, both for compute and graphics, is reportedly being designed for the 5 nanometer silicon fabrication node by TSMC. This marks NVIDIA's return to the Taiwanese foundry after its brief excursion to Samsung, with the 8 nm "Ampere" graphics architecture. "Ampere" compute dies continue to be built on TSMC 7 nm nodes. NVIDIA is looking to double the compute performance on its next-generation GPUs, with throughput approaching 70 TFLOP/s, from a numeric near-doubling in CUDA cores, generation-over-generation. These will also be run at clock speeds above 2 GHz. One can expect "Ada Lovelace" only by 2022, as TSMC N5 matures.

Samsung Exynos 2200 SoC, Built on 4 nm, Packs Faster RDNA2 GPU

Samsung intends to take its partnership with AMD for graphics further, by designing its next-generation Exynos 2200 "Pamir" SoC with a faster GPU based on the AMD RDNA2 graphics architecture. Bound for the second half of 2021, Exynos 2200 will be built on Samsung's swanky new 4 nanometer 4LPP (4 nm Low Power Plus) silicon fabrication node, and integrate an RDNA2-based GPU codenamed "Voyager." Samsung hopes to compete with Qualcomm's Snapdragon 895 SoC and its Adreno 730 GPU. Interestingly, the new Snapdragon is also expected to be built on the same Samsung 4 nm node. It will be interesting to see what device the Exynos 2200 debuts with, given that both the Galaxy S22 and Galaxy Note 21 won't arrive before 2022.

NAND Flash Contract Prices Likely to Increase by 5-10% QoQ in 3Q21 as Quotes Continue to Rise, Says TrendForce

The recent wave of COVID-19 outbreaks in India has weakened sales of retail storage products such as memory cards and USB drives, according to TrendForce's latest investigations. However, demand remains fairly strong in the main application segments due to the arrival of the traditional peak season and the growth in the procurement related to data centers. Hence, the sufficiency ratio of the entire market has declined further. NAND Flash suppliers have kept their inventories at a healthy level thanks to clients' stock-up activities during the past several quarters. Moreover, the ongoing shortage of NAND Flash controller ICs continues to affect the production of finished storage products. Taking account of these demand-side and supply-side factors, TrendForce forecasts that contract prices of NAND Flash products will rise marginally for 3Q21, with QoQ increases in the range of 5-10%.

DRAM Prices for 3Q21 Projected to Undergo Minor QoQ Increase of 3-8%: Trendforce

As third quarters have typically been peak seasons for the production of various end-products, the sufficiency ratio of DRAM is expected to undergo a further decrease in 3Q21, according to TrendForce's latest investigations. However, DRAM buyers are now carrying a relatively high DRAM inventory due to their amplified purchases of electronic components in 1H21. The QoQ increase in DRAM contract prices are hence expected to slightly narrow from 18-23% in 2Q21 to 3-8% in 3Q21. Looking ahead to 4Q21, TrendForce believes that DRAM supply will continue to rise, thereby leading to either a further narrowing of price hikes or pressure constraining the potential price hike of DRAM products.

From the perspective of demand, the stay-at-home economy has resulted in persistently high demand for notebook computers. Although discrepancies still exist among notebook brands' inventory levels of various components, these brands are still making an aggressive attempt at maximizing their production of notebooks. However, as most of these brands are still carrying about 8-10 weeks' worth of PC DRAM inventory (which is relatively high), PC DRAM purchasing strategies from the buyers' side will therefore remain relatively conservative. From the perspective of supply, due to the rising demand for server DRAM, the production capacity allocated to PC DRAM is still in a severe supply crunch. Hence, DRAM suppliers are firm in their attitudes to raise PC DRAM quotes, and TrendForce expects the price negotiations between PC DRAM buyers and suppliers in 3Q21 to become both lengthier and more difficult as a result, with contract prices likely finalized at the end of July. Even so, what is now certain is that both sides have reached some level of understanding regarding the ongoing price hike of PC DRAM products. TrendForce forecasts a 3-8% increase in PC DRAM contract prices for 3Q21.

Annual Notebook Shipment Likely to Break Records in 2021 at 236 Million Units, with Chromebook Demand Slowing Down in 2H21, Says TrendForce

While the stay-at-home economy generated high demand for notebook computers from distance learning and WFH applications last year, global notebook shipment for 2020 underwent a nearly 26% YoY increase, which represented a significant departure from the cyclical 3% YoY increase/decrease that had historically taken place each year, according to TrendForce's latest investigations. The uptrend in notebook demand is expected to persist in 2021, during which notebook shipment will likely reach 236 million units, a 15% YoY increase. In particular, thanks to the surging demand for education notebooks, Chromebooks will become the primary growth driver in the notebook market. Regarding the shipment performance of various brands, Samsung and Apple will register the highest growths, with the former having Chromebooks account for nearly 50% of its total notebook shipment this year and the latter continuing to release MacBooks equipped with the M1 chip.

Samsung Teases PCIe 5.0 Enterprise SSD Coming Q2 2022

Samsung has recently provided a few details of their PM1743 PCIe Gen 5 E3.S 1T EDSFF SSD set to release in Q2 2022. The PM1743 is an upcoming enterprise SSD from Samsung with PCIe 5.0 x4 connectivity which can enable a theoretical maximum speed of 15.7 GB/s. The SSD features V6 TLC NAND flash and comes with 1 Drive Writes Per Day (DWPD) of write endurance. The drive features an enterprise E3.S 1T single-width form factor (111.5 mm × 31.5 mm) popular in server deployments and will likely come with a TDP of 20-25 W. Samsung has provided a basic mechanical drawing of the SSD but we expect to find out more information closer to release.

Samsung 5 nm Node Struggles With Yields, Reports Indicate Less Than 50% Yielding

Semiconductor manufacturing is no easy task. Every company in that business knows that, and the hardships of silicon manufacturing have been felt by even the greatest players like Samsung and Intel. Today, according to the latest report from Business Korea, Samsung is again in trouble with its 5 nm node. It has been reported previously that Samsung is struggling with yields of its 5 nm node, however, we didn't know just how much until now. According to the sources over at Business Korea, Samsung's 5 nm semiconductor node is experiencing less than 50% yields. That means, for example, that out of 100 chips manufactured on a single silicon wafer, only half are functional. And that is not good at all.

Usually, for a node to go into high-volume manufacturing (HVM), the yielding rate needs to be around 95%. In case it is not at that level, manufacturing of that node is not very efficient and not very profitable. The V1 Line in Hwaseong, where this Samsung 5 nm is made, uses EUV tools to manufacture the new node. While the yields are currently below 50%, it is expected to improve as Samsung engineers tweak and tune the node and the tools that are running the facility. We can expect to hear more about the yields of this node in the coming months.

Samsung 3 nm GAAFET Node Delayed to 2024

Samsung's ambitious 3 nm silicon fabrication node that leverages the Gate All Around FET transistors, has reportedly been delayed to 2024. The company brands this specific node as 3GAE. 2024 is the earliest date when Samsung will be able to mass-produce chips on 3GAE, which means the company, along with Intel, will begin to fall significantly behind TSMC on foundry technology. The Taiwanese semiconductor fabrication giant will target 2 nm-class nodes around 2024, which leverages EUV multi-patterning, extensive use of cobalt in contacts and interconnects, germanium doped channels, and other in-house innovations. With Intel's foundry technology development slowing to a crawl in the sub-10 nm domain, Samsung is the only viable alternative to TSMC for cutting-edge logic chip manufacturing.

Samsung Exynos SoC with RDNA2 Graphics Scores Highest Mobile Graphics Score

We recently reported that Samsung would be announcing their next-generation flagship Exynos processor with AMD RDNA2 graphics next month. We heard that the RDNA2 GPU was expected to be ~30% faster than the Mali-G78 GPU present in Galaxy S21 Ultra however according to a new 3DMark Wild Life benchmark it would appear the new processor scores 56% higher. This result would give the upcoming Exynos processor the fastest graphics available in any Android phone even matching/beating out the Apple A14 Bionic found in the iPhone 12. This early performance benchmark paints a very positive picture for the upcoming processor however we still don't know how the score will be affected under sustained load or if this will performance will even be replicated in the final product.

Marvell Extends OCTEON Leadership with Industry's First 5nm DPUs

Marvell today introduced its new OCTEON 10 DPU designed to accelerate and process a broad spectrum of security, networking, and storage workloads required by demanding 5G, cloud, carrier and enterprise datacenter applications. With the increasing shift of workloads to the cloud, complex security requirements and the growing number of edge devices the demand for data centric compute has accelerated. By combining compute with best-in-class hardware accelerators, Marvell's OCTEON 10 DPU offers a significant TCO advantage and features numerous industry firsts. Delivering three times the performance and 50 percent lower power compared to previous generations of OCTEON, the newly announced solution is the first to be designed on a 5 nm process to incorporate Arm Neoverse N2 cores, as well as the first inline artificial intelligence/machine learning (AI/ML) hardware acceleration, the first integrated 1 terabit switch and the first to incorporate vector packet processing (VPP) hardware accelerators.

"To meet and exceed the growing data processing requirements for network, storage, and security workloads, Marvell focused on significant DPU innovations across compute, hardware accelerators, and high speed I/O," said John Sakamoto, vice president of Marvell's Infrastructure Processors Business Unit. "The OCTEON 10 brings compute leadership, supports networking and security workloads exceeding 400G, and incorporates leading edge I/O including DDR5 and PCIe 5.0."

Three Major Arm Licensees Endorse the NVIDIA Takeover

NVIDIA's $40 billion takeover of Arm Holdings plc from SoftBank, got a shot in the arm, as three major licensees of the IP came out in support of the bid. These include Broadcom, MediaTek, and Marvell Technology Group. This development is key for NVIDIA to fight the perception built up by a rival faction, that the democratized nature of the Arm IP would get lost if a chipmaker like NVIDIA owns it. This rival faction is primarily led by Qualcomm.

It's interesting to note the individual backers of the NVIDIA takeover. There is nothing but love between Broadcom and Qualcomm, especially after the former's failed bid to acquire the latter. MediaTek is a major smartphone and IoT SoC maker, dominating the low-cost and mainstream smartphone segments. Marvell is big in datacenter and storage IP. Each of the three are results of huge IP consolidation over the past decade.

Samsung Exynos SoC with AMD RDNA2 Graphics Coming Next Month

The partnership between Samsung and AMD began in 2019 when the two companies announced that they would work together to integrate Radeon graphics IP in Samsung Exynos processors. We can see the results of this partnership with Dr. Lisa Su confirming at Computex that RDNA2 graphics will be integrated into the next flagship Samsung Exynos SoC. The RDNA2 GPU found in the upcoming mobile chip will include support for raytracing and variable-rate shading with a strong possibility that it will power the next Galaxy S series flagship. Samsung was initially expected to announce this new chipset in June however the event was postponed until July where the complete details and performance numbers will be unveiled.

Update Jun 22nd: The upcoming GPU is expected to be 30% faster than the current Mali-G78 GPU present in Galaxy S21 Ultra which should give it a comfortable lead of ~10% against the next generation Mali GPU. The GPU does appear to suffer from quite severe thermal throttling with a 20% performance drop after the second run and 30% on the third run. Samsung seems pleased with the collaboration and has engaged in talks with AMD to extend the contract for future GPU architectures.

Intel Planning to Build Chip Factory in Bavaria Germany

Intel is in talks with the German government to build a European chip factory hoping to counter the global chip shortages and help achieve the EU local chip manufacturing target. Germany is interested in attracting semiconductor companies to increase domestic chip production to improve security for their automotive industry which increasingly relies on foreign chips. Intel wants to open up manufacturing capacity at their foundries to external companies allowing them to compete with TSMC and Samsung in the high-end market. Intel is seeking large subsidies from the German government to the tune of several billion to help make the new factory a reality.

Samsung Unveils Its Expanded 2021 Odyssey Gaming Monitor Lineup

Samsung Electronics, today announced the expanded 2021 Odyssey monitor lineup will be available across the global markets from June 21, 2021, providing gamers of all skill sets with superb picture quality and futuristic design. Following the curved gaming monitor launch in 2020, Samsung now offers a variety of Odyssey monitors in flat-screen design, ranging from 24 to 28 inches. The new lineup delivers hyper-real picture quality, a higher response level, tailored ergonomics and intuitive usability. Together with these latest features, gaming enthusiasts can enjoy real-world colors, pinpoint accuracy and sharp response speeds for their PC and console gaming entertainment devices.

As gaming industry continues to thrive worldwide, Samsung Odyssey has quickly become the number one choice among gamers seeking incredible picture quality and high performance, all in one package. The expanded lineup now ensures gamers can choose a monitor that can accommodate their exact preferences and play needs.

Samsung Brings Flagship Features to Broader Smartphone Market with LPDDR5 Multichip Package

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it has begun mass producing its latest smartphone memory solution, the LPDDR5 UFS-based multichip package (uMCP). Samsung's uMCP integrates the fastest LPDDR5 DRAM with the latest UFS 3.1 NAND flash, delivering flagship-level performance to a much broader range of smartphone users.

"Samsung's new LPDDR5 uMCP is built upon our rich legacy of memory advancements and packaging know-how, enabling consumers to enjoy uninterrupted streaming, gaming and mixed reality experiences even in lower-tier devices," said Young-soo Sohn, vice president of the Memory Product Planning Team at Samsung Electronics. "As 5G-compatible devices become more mainstream, we anticipate that our latest multichip package innovation will accelerate the market transition to 5G and beyond, and help to bring the metaverse into our everyday lives a lot faster."

NVIDIA Reportedly Cutting RTX 2060 Fabrication to Focus on RTX 30-series

NVIDIA is reported to be cutting down on production of its highly popular RTX 2060 graphics card, in a bid to increase production of the RTX 30-series graphics cards that still elude most consumers looking to get one on their gaming rig. The decision may be motivated by increased margins on RTX 30-series products, as well as by the continuing component shortage in the industry, with even GDDR6 becoming a limiting factor to production capability.

While one might consider this a strange move at face value (Turing is manufactured on TSMC's 12 nm node, whilst Ampere is manufactured on Samsung's 8 nm), the fact of the matter is that there are a multitude of components required for GPUs besides the graphics processing silicon proper; and NVIDIA essentially sells ready-to-produce kits to AICs (Add-in-Card Partners) which already include all the required components, circuitry, and GPU slice to put together. And since supply on most components and even simple logic is currently strained, every component in an RTX 2060-allocated kit could be eating into final production capacity for the RTX 30-series graphics cards - hence the decision to curb the attempt to satiate pent-up demand with a last-generation graphics card and instead focusing on current-gen hardware.

Samsung Preparing to Deploy 176-Layer V-NAND in PCIe 4.0, PCIe 5.0 SSD Products

Samsung is preparing to deploy their latest innovations in NAND density with the next-generation V-NAND (7th gen). Samsung says it is preparing products that leverage both V-NAND's higher density (at 176 layers per chip versus up to 136 layers on 6th gen) with the throughput of both PCIe 4.0 and PCIe 5.0. This would of course mean higher density drives available, as well as a reduction in the overall $/GB equation. Due to Samsung's vertical integration (meaning that they are one of the few companies that can design and produce all SSD components in-house), the company is also developing next-gen NAND controllers that can leverage throughputs of 2,000 MT/s transfer rates and thus "optimized for multitasking huge workloads".

Samsung expects to be able to scale V-NAND well past the 1,000 layer mark - a far-cry from the claims made by SK Hynix, who have only talked about a theoretical 600-layer NAND configuration. While the 176-layer, 7-gen V-NAND is only now entering mass production and the final stages of product development, Samsung has already taped out the initial batches of their 8th-gen V-NAND, which feature "more than 200 layers". It's likely that Samsung's 1,000-layer claim actually looks towards the future in a timeframe of decade(s?) and isn't actually something to look forward to in the approximate future.

Samsung Announces Galaxy Book Go and Galaxy Book Go 5G

Samsung Electronics Co., Ltd. today unveiled the Galaxy Book Go and Galaxy Book Go 5G, new additions to the Galaxy Book lineup, powered by the latest Qualcomm Snapdragon compute platforms. The Galaxy Book Go series provides more choices at accessible prices to consumers looking to achieve more anytime, anywhere.

"PCs continue to enable our digital lives, helping us connect to our friends and family, work remotely, and find outlets for creativity and relaxation," said Woncheol Chai, SVP and Head of Experience Planning Team, Mobile Communications Business, Samsung Electronics. "The Galaxy Book Go series is built for today's mobile-first users, who expect seamless communication, sustained productivity, and immersive entertainment—all in one device. With the new addition to the Galaxy Book, Samsung offers wider options to our consumers to choose a device that best fits their needs."

G.SKILL Trident Z Royal Elite Releases with High Performance CL14 Low-Latency Kits Up To DDR4-4000 32GB

G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory and gaming peripherals, is thrilled to announce the availability of the latest Trident Z Royal Elite memory series, along with the introduction of new high-speed, low-latency performance memory specifications at DDR4-4000 CL14-15-15-35 and DDR4-3600 CL14-14-14-34. Built with Samsung 8 Gb B-die ICs to achieve these incredibly low latency timings, these new DDR4 memory specifications are the ideal choice for building a powerful workstation or the ultimate gaming system.

G.SKILL is dedicated to developing high-speed, low-latency memory kits for high performance PC systems, and achieving an extremely low CL14 latency on high-speed dual-ranked memory modules is no easy feat. Created with Samsung B-die ICs, G.SKILL is launching the incredible DDR4-4000 CL14-15-15-35 memory specification with 16 GB modules for a 32 GB (16 GB x2) kit capacity. Below is a screenshot showing the memory kit on the ASUS ROG STRIX Z590-E GAMING WIFI motherboard with the Intel Core i7-11700KF processor.

Eurocom Announces Sky Z7 R2 Laptop with Fully-Upgradeable Components

The EUROCOM Sky Z7 R2 has unmatched levels of upgradeability through the Mobile Supercomputer's modular slots, allowing the safe removal and replacement of important hardware components such as the laptop's CPU, GPU, Memory, Storage, LCD, and more. Having slots or sockets allows the Sky Z7 R2 to customized, upgraded and modified with compatible parts- giving this Eurocom Mobile Supercomputer the ability to run the most demanding applications and perform high level tasks for a very long time. As newer and improved technologies emerge within the same chipset, the EUROCOM Sky Z7 R2's hardware components such as the CPU, GPU, RAM, storage, LCD, to name a few, can all be upgraded and replaced relatively easy in order to acquire more power as desired. Having modular components greatly increases the laptop's lifespan for many years and prevents the cycle of having to buy new laptops every few years, which can be the case with most laptops that have non-upgradeable components.

Eurocom's Sky Z7 R2 is one of the few laptops that utilizes modular GPU technology based on the MXM 3.1 version 2.0 socket technology. This means the Mobile Supercomputer's high performance GPU can be replaced at any time as long as it is compatible in the chipset, allowing the EUROCOM Sky Z7 R2 to perform at an extremely high level throughout the duration of its long lifespan. This Mobile Supercomputer can be configured up to the GeForce RTX 3080 which delivers twice the performance as its previous generation counterpart (GeForce RTX 2080). The EUROCOM Sky Z7 R2 offers seamless and stutter-free 4K gaming at 60 FPS, as well as 8K video editing, rendering and gaming.

Reference Liquid-Cooled Radeon RX 6900 XT Listed, Possibly the RX 6900 XTX, with Faster Memory

To preempt NVIDIA's GeForce RTX 3080 Ti launch, AMD had worked with its partners to release a refreshed Radeon RX 6900 XT based on a swanky new ASIC internally dubbed "XTXH." This is essentially the highest bin of the "Navi 21" silicon that allows 10% higher clock speeds over the standard RX 6900 XT. Our testing of one such card, the ASRock RX 6900 XT OC Formula, showed that the XTXH is able to trade blows with the RTX 3090, making it competitive with the RTX 3080 Ti. Interestingly, there seemed to lack a reference design "made by AMD" card based on this silicon. Turns out, AMD had other plans. This card was earlier believed to be the "Radeon RX 6900 XTX," when it was first leaked in April, but turns out, that AMD is allowing partners to simply call this the RX 6900 XT.

The reference design card uses a liquid-cooled design. The card itself is two slots thick, and about the size of the reference Radeon RX 6800, but two coolant tubes emerge from its top, which head to a 120 mm x 120 mm radiator. This is a purely liquid-cooled card, with no secondary air-based cooling, like the ASUS ROG Strix LC RX 6900 XT. The only sources of noise are the AIO pump-block, and the single included 120 mm fan. Besides 10% higher GPU clocks, the reference design card has an ace in the hole that custom-design XTXH cards lack—faster memory.

Enterprise SSD Prices Projected to Increase by More Than 10% QoQ in 3Q21 Due to Growing Procurement Capacity, Says TrendForce

Enterprise SSD procurement has been rising on the back of growing server shipments since 2Q21, according to TrendForce's latest investigations. In particular, the share of 8 TB products in shipments of SSDs to data centers has shown the most noticeable growth, which is expected to persist through 3Q21. However, certain SSD components and parts may be in shortage due to insufficient foundry capacity. TrendForce is therefore revising the QoQ hikes in contract prices of enterprise SSDs for 3Q21 to 10-15% from the previous projection of 5-10%.

TrendForce further indicates that the high demand for enterprise SSDs in 3Q21 is attributed to several factors. First, North American cloud service providers (hyperscalers) have pretty much completed their inventory adjustments and now continue to expand their storage capacity. Second, the flow of incoming orders to traditional server brands is getting stronger over the quarters as government agencies and SMBs increase their budgets for IT infrastructure. Third, Intel and AMD are ramping up production for server CPUs based on their respective new processor platforms. Following the adoption of new CPUs, the overall demand for enterprise SSDs has also shifted to higher-density products because clients want to upgrade their computing power and storage capacity. Specifically, demand is mainly trending toward 4/8 TB SSDs since raising NAND Flash density can lower the cost of SSD deployment.
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