News Posts matching "Samsung"

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Qualcomm to Built Snapdragon 5G SoCs on Samsung 7nm LPP EUV Process

Samsung Electronics, a world leader in advanced semiconductor technology, and Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, today announced the intention to expand their decade-long foundry relationship into EUV (extreme ultra violet) lithography process technology, including the manufacture of future Qualcomm Snapdragon 5G mobile chipsets using Samsung's 7-nanometer (nm) LPP (Low Power Plus) EUV process technology.

Using 7LPP EUV process technology, Snapdragon 5G mobile chipsets will offer a smaller chip footprint, giving OEMs more usable space inside upcoming products to support larger batteries or slimmer designs. Process improvements, combined with a more advanced chip design, are expected to bring significant improvements in battery life.

Samsung Begins Mass-production of 30.72-terabyte PM1643 SSD

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it has begun mass producing the industry's largest capacity Serial Attached SCSI (SAS) solid state drive (SSD) - the PM1643 - for use in next-generation enterprise storage systems. Leveraging Samsung's latest V-NAND technology with 64-layer, 3-bit 512-gigabit (Gb) chips, the 30.72 terabyte (TB) drive delivers twice the capacity and performance of the previous 15.36 TB high-capacity lineup introduced in March 2016.

This breakthrough was made possible by combining 32 of the new 1TB NAND flash packages, each comprised of 16 stacked layers of 512 Gb V-NAND chips. These super-dense 1 TB packages allow for approximately 5,700 5-gigabyte (GB), full HD movie files to be stored within a mere 2.5-inch storage device.

Samsung's Latest Notebook 9 Laptops Available Starting February 18

Samsung Electronics America, Inc. today announced that three new PCs will be available for purchase starting February 18. The Samsung Notebook 9 Pen will be available on Samsung.com and Amazon.com for $1,399.99, along with the Samsung Notebook 9 (2018), which comes in 13-inch and 15-inch models, starting at $1,199.99 and $1,299.99, respectively. The Samsung Notebook 7 Spin (2018) will be available at Best Buy and on Samsung.com and Bestbuy.com for $899.99.

Samsung Notebook 9 Pen: Lightweight convertible with embedded S Pen
Available in a 13-inch model ($1,399.99), the Notebook 9 Pen is Samsung's lightest 2-in-1 PC weighing 2.2 pounds that comes with the creative power of the S Pen, popularized in Samsung Galaxy Note devices. It is equipped with an 8th Generation Intel Core i7 processor and engineered with Metal12, a premium magnesium alloy built for ultimate portability and durability.

Samsung Begins Mass Production of 256GB eUFS for Automotive Applications

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it has begun mass production of a 256-gigabyte (GB) embedded Universal Flash Storage (eUFS) solution with advanced features based on automotive specifications from the JEDEC UFS 3.0 standard, for the first time in the industry. Following the memory breakthrough of the automotive industry's first 128GB eUFS in September, 2017, Samsung's 256GB eUFS is now being shipped to automotive manufacturers preparing the market for Advanced Driver Assistance Systems (ADAS), next-generation infotainment systems and new-age dashboards in luxury vehicles.

As thermal management is crucial for automotive memory applications, Samsung's 256GB eUFS extends the temperature range to between -40°C and 105°C for both operational and power-saving modes. Warranties for conventional embedded multimedia card (eMMC) 5.1 solutions generally cover -25°C to 85°C for vehicles in operation and -40°C to 85°C when in idle or power-saving mode.

Samsung to Invest $27.7 billion On Second Pyeongtaek Semiconductor Plant

Samsung's management committee has reportedly convened this morning, February 7th, to officially approve an investment plan on a new semicondctor manufacturing facility. Reports say this new factory is expected to be built on Pyeongtaek, the same general location as Samsung's current Pyeongtaek Fab 1. The investment plan is being made with plans for the plant to start production of the "P2-Project" plant during the first half of 2019.

Giving credence to these industry reports is the fact that Samsung has already celebrate gas pipeline contracts with companies (such as Wonik Holdings), just last month, in preparation for this new fab construction. It's as of yet unclear what specific plan the company has for the new factory, though it will certainly inject extraordinary new amounts of volume to Samsung's various foundry businesses. With two years of construction since it broke ground in May, 2015, the original fabrication line at the Pyeongtaek campus is currently the largest single Fab in the industry; in the face of this, it seems that a "first half of 2019" starting date for semiconductor production at Samsung's new manufacturing facilities may be slightly optimistic. However, those plans start to sound a little more on the doable side if one considers these might actually be plans for an expansion of the current Pyeongtaek Fab 1 facilities, plans for which the company has already announced back in July 2017.

NDRC, Samsung to Sign MOU That Could Moderate DRAM Prices, Increase Production

PC hardware enthusiasts all over (but particularly in our own forums) have been adamant in how this is one of the worst times to be building a new system. And it's true; the DIY market is a mess right now, as our own btarunr mentioned in his latest editorial; so much so, that in a full reversal of years and years of experience, users might now actually be better served in the $/performance department by buying their systems from boutique retailers, than by acquiring all of the parts separately. It's a mad, mad world out there, for a multitude of reasons; but one such reason is DRAM pricing. And fortunately, it seems that China's National Development and Reform Commission (NDRC) is on the verge of signing a Memorandum Of Understanding (MOU) with Samsung that might help the DRAM market as a whole.

Samsung Electronics Announces Fourth Quarter and FY 2017 Results

One of the industry's giants is having a strong showing, with a grand total of $64.17 billion in revenue and $14 billion in profits for Q4 2017. These results were buoyed by earnings increases across almost all of Samsung's sectors: the Consumer Electronics, Device Solutions, and Display Panel sectors registered strong growth. The only outlier was IT & Mobile Communications, where the company fell short for the second consecutive quarter (likely has something to do with splash damage from Samsung's still too close for comfort, exploding failures).

Samsung is expecting stable NAND demand alongside increased DRAM demand for datacenters. Samsung is citing "strong market conditions" for its semiconductor revenue (particularly considering DRAM pricing and volume), and says that what would be, under normal circumstances, a slow quarter due to low seasonality of its semiconductor business was somewhat compensated by Samsung's acquisition of new China clients (I wonder if this has anything to do with mining ASICs...) There's also no mention of Samsung's entry into the OLED TV market, with the company instead choosing to focus on its Quantum Dot technology, higher resolution panels, and higher diagonals as the method of choice to attract new buyers. The full press release follows.

Samsung Enters Volume Production of a Killer Crypto-mining ASIC

One of the world's largest SoC, DRAM, and NAND flash makers, with its own semiconductor fabs, Samsung, is eyeing itself a large slice of the crypto-currency mining craze. The company reportedly entered volume production of a highly efficient crypto-currency mining ASIC, for an unnamed client from China. The client has placed a gargantuan order for crypto-coin mining ASICs contract-manufactured by Samsung, which appears to be targeted at Bitcoin, for now.

China's largest mining ASIC solutions providers, Bitman and Cannan, have similarly contracted TSMC to manufacture mining ASICs. An ASIC (from a mining context) is a single-chip solution that combines a CPU, a SIMD parallel-processing component tailored for mining, memory, and storage. It has infinitesimally smaller PCB, power, and thermal footprints compared to PCs with GPUs, and can be deployed in extremely large numbers for mining on an industrial-scale.

Samsung Launches 800GB Z-SSD for HPC and AI Systems

Samsung Electronics, the world leader in advanced memory technology, today announced that it has launched an 800-gigabyte (GB) solid state storage drive-the SZ985 Z-SSD, for the most advanced enterprise applications including supercomputing for AI analysis. Developed in 2017, the new 800 GB Z-SSD provides the most efficient storage solution for high-speed cache data and log data processing, as well as other enterprise storage applications that are being designed to meet rapidly growing demand within the AI, big data and IoT markets.

"With our leading-edge 800 GB Z-SSD, we expect to contribute significantly to market introductions of next-generation supercomputing systems in the near future, enabling improved IT investment efficiency and exceptional performance," said Jinman Han, senior vice president, Memory Product Planning & Application Engineering at Samsung Electronics. "We will continue to develop next-generation Z-SSDs with higher density and greater product competitiveness, in order to lead the industry in accelerating growth of the premium SSD market."

Samsung Officially Launches SSD 860 PRO and 860 EVO Series

Samsung Electronics America, Inc. today introduced the 860 PRO and 860 EVO solid state drives (SSDs), the most up-to-date additions to the company's SATA interface lineup. The products are aimed at consumers who require fast, reliable performance across various applications, from everyday computing to heavy workloads and graphic-intensive operations. Building on the successful launch of the 850 PRO and 850 EVO - the industry's first consumer SSDs with V-NAND technology - the 860 PRO and 860 EVO achieve industry-leading performance for SATA SSDs, offering enhancements in speed, reliability, compatibility and capacity.

"The new 860 PRO and 860 EVO SSDs combine the latest 512Gb and 256Gb 64-layer V-NAND, up to 4GB LPDDR4 mobile DRAM and a new MJX controller to elevate the user experience for both consumers and businesses," said Un-Soo Kim, senior vice president of Brand Product Marketing, Memory Business at Samsung Electronics. "Samsung will continue to fuel meaningful innovations in the consumer SSD space and drive growth of the overall memory industry for years to come."

SK Hynix Marks its 8Gb GDDR6 Memory Chips "Available" in Latest Catalog Update

SK Hynix, the other Korean DRAM and NAND flash giant than Samsung, updated its DRAM product catalog to reflect immediate availability of its 8-gigabit (1 GB) GDDR6 memory chips. The company is selling four SKUs, part "H56C8H24MJR-S2C" in 14 Gbps and 12 Gbps variants; and part "H56C8H24MJR-S0C" in 12 Gbps and 10 Gbps variants. The -S2C chips are more energy efficient, in achieving 14 Gbps at 1.35V and 12 Gbps at 1.25V; while the -S0C achieves 12 Gbps at 1.35V, and 10 Gbps at 1.25V. Unless NVIDIA decides that the GTX 1080-successor should feature 16 GB of memory, the company could be in the market for 8 Gb GDDR6 chips.

Meanwhile, rival Samsung announced that it began mass-production of 16 Gb (2 GB) GDDR6 memory chips, which should enable 16 GB of memory across a 256-bit memory interface, or 8 GB over a 128-bit interface. Samsung's latest chips not only have double the density as SK Hynix's, but also tick faster, at 18 Gbps, with a voltage of 1.35V. It is widely expected that GDDR6 will be the dominant memory standard for entry, mainstream, and even high-end graphics cards, which launch through 2018-19. NVIDIA is expected this year to launch its new "Volta" graphics architecture across various consumer-graphics market-segments.

Samsung 860 EVO SSD Makes an Appearance

Hot on the heels of Samsung updating its website with its next performance-segment SSD 860 Pro series, with its range-topping 4 TB variant, a similar pre-launch website update revealed the company's next mainstream SATA SSD, the 860 EVO. The drive will be available in three form-factors, 7 mm-thick 2.5-inch, M.2-2280, and mSATA; all with SATA 6 Gbps interface. The 2.5-inch version comes in 250 GB, 500 GB, 1 TB, 2 TB, and 4 TB variants; while the M.2-2280 version comes in just 500 GB, 1 TB, and 2 TB variants; and the mSATA version in 250 GB, 500 GB, and 1 TB variants. The drives combine Samsung's latest generation 3D VNAND flash memory built in the 10 nm-class sliicon fabrication process, with an updated controller and refined firmware.

The 860 EVO offers sequential transfer rates of up to 550 MB/s, with up to 520 MB/s sequential writes, up to 97,000 IOPS 4K random reads, and up to 88,000 IOPS 4K random writes. The new-generation flash is rated for "8 times higher" endurance than the 850 EVO series; with up to 2,400 TBW. Samsung is reinforcing its faith in the drive by backing it with 5-year warranties. The company is introducing the new TurboWrite feature, which is a user-configurable SLC cache. You can set anywhere between 12 GB to 72 GB of the NAND flash to function as SLC, so the controller can juggle hot data in and out of it, for improved performance, using the Samsung Magician software.

Samsung Starts Producing Industry's First 16-Gigabit GDDR6 Memory

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it has started mass production of the industry's first 16-gigabit (Gb) Graphics Double Data Rate 6 (GDDR6) memory for use in advanced graphics processing for gaming devices and graphics cards as well as automotive, network and artificial intelligence systems.

"Beginning with this early production of the industry's first 16 Gb GDDR6, we will offer a comprehensive graphics DRAM line-up, with the highest performance and densities, in a very timely manner," said Jinman Han, senior vice president, Memory Product Planning & Application Engineering at Samsung Electronics. "By introducing next-generation GDDR6 products, we will strengthen our presence in the gaming and graphics card markets and accommodate the growing need for advanced graphics memory in automotive and network systems."

Samsung Reveals 860 Pro 4TB SSD on its Website Listing

Samsung has unwittingly released some specs and product images of the as of yet unannounced SSD product. The 860 Pro SSD carries the model number MZ-76P4T0E, and has a pretty impressive 4 TB capacity that's sure to deliver the highest performance possible on the SATA III interface. The stated performance levels stand at 560 MB/s read speeds, and 530 MB/s write, which should be more than enough for most usage tasks. Pricing is also more than enough, and then some; Samsung is quoting a $1,899 pricing for this particular drive.

The Balloon Falls: Memory Chip Price Decrease in Q4 2017 Prompts Investor Fear

Reuters reports that a sudden (if ridiculous) 5% drop in memory chip prices in Q4 2017 has brought revenue expectations and investors' profit measurements to a teetering halt. 5% may not look like much - it certainly isn't much when we look at the historic price increases that almost doubled the cost of DDR4 memory kits, as you can see in the PC Part Picker chart below. This memory module price chart doesn't include the 5% drop yet, probably because it takes time for memory chip pricing to materialize in end-user module pricing. But for investors, it's like a spark in a paper archive - it could signal an impending price decrease that would push all profit estimates out the window.

This 5% drop in pricing has prompted industry analysts to review their profit estimates for 2018, and expect that the memory industry's growth rate will fall by more than half this year to 30 percent. You read that right - investors are scared because growth rates will be 30 percent instead of 60 percent. Oh the joys of inflated pricing, and slower-than-usual ramp-up to keep demand higher than supply. The joys of economic capitalism, where prices for consumers go up, and an industries' value skyrockets by more than 70$ in a single year (2017).

Samsung Starts Mass-producing 2.4 Gbps 8GB HBM2 Stacks

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it has started mass production of its 2nd-generation 8-gigabyte (GB) High Bandwidth Memory-2 (HBM2) with the fastest data transmission speed on the market today. The new solution, Aquabolt, which is the industry's first HBM2 to deliver a 2.4 gigabits-per-second (Gbps) data transfer speed per pin, should accelerate the expansion of supercomputing and the graphics card market.

"With our production of the first 2.4 Gbps 8 GB HBM2, we are further strengthening our technology leadership and market competitiveness," said Jaesoo Han, executive vice president, Memory Sales & Marketing team at Samsung Electronics. "We will continue to reinforce our command of the DRAM market by assuring a stable supply of HBM2 worldwide, in accordance with the timing of anticipated next-generation system launches by our customers."

Samsung Introduces the New Notebook 7 Spin (2018)

Samsung Electronics America, Inc. today announced the Samsung Notebook 7 Spin (2018), a versatile notebook that provides consumers with the accessibility needed to remain productive in today's digital world. Designed for working professionals, students and those looking for entertainment, the Notebook 7 Spin (2018) offers modern features including a 360-degree touchscreen for added convenience; an Active Pen (sold separately) for quick and easy note-taking; as well as the power and performance for more efficient multi-tasking.

"Our customers wanted a functional, intuitive device that includes a wide range of their favorite features, and that's what we've delivered with the Notebook 7 Spin (2018)," said YoungGyoo Choi, Senior Vice President of the PC Business Team, Mobile Communications Business at Samsung Electronics. "This device meets the needs of today's digital lifestyle, combining work and play with a smart, seamless and personalized experience that connects users with their other devices."

Samsung Optimizes Exynos 9810 for AI Applications and Richer Multimedia Content

Samsung Electronics, a world leader in advanced semiconductor technology, today announced the launch of its latest premium application processor (AP), the Exynos 9 Series 9810. The Exynos 9810, built on Samsung's second-generation 10-nanometer (nm) FinFET process, brings the next level of performance to smartphones and smart devices with its powerful third-generation custom CPU, faster gigabit LTE modem and sophisticated image processing with deep learning-based software. In recognition of its innovation and technological advancements, Samsung's Exynos 9 Series 9810 has been selected as a CES 2018 Innovation Awards HONOREE in the Embedded Technologies product category and will be displayed at the event, which runs January 9-12, 2018, in Las Vegas, USA.

"The Exynos 9 Series 9810 is our most innovative mobile processor yet, with our third-generation custom CPU, ultra-fast gigabit LTE modem and, deep learning-enhanced image processing," said Ben Hur, vice president of System LSI marketing at Samsung Electronics. "The Exynos 9810 will be a key catalyst for innovation in smart platforms such as smartphones, personal computing and automotive for the coming AI era."

Samsung Unveils First Thunderbolt 3 QLED Curved Monitor

Samsung Electronics will expand the connectivity and performance capabilities of its signature curved display line-up with the debut of its new CJ791 monitor, the first curved monitor to feature Intel's Thunderbolt 3 connectivity. Designed for entertainment and business audiences, the 34-inch CJ791 model aligns single-source power and processing speed with an exceptional picture quality for a comfortable and productive user experience.

Through a single Thunderbolt 3 cable, CJ791 users can link and dock their monitor and laptop without extensive wiring. The Thunderbolt 3 connection provides processing speed of up to 40 Gigabits per second (Gbps) - a rate nearly four times faster than USB alternatives - allowing users to enjoy connectivity across a full ecosystem of docks, displays and peripheral devices including Macs, USB type-C laptops, and other desktop accessories like storage drives or external graphics cards. The Thunderbolt 3 interface also enables the CJ791 to provide up to 85 watts (W) of laptop charging power.

China Regulator to Look Into Possible DRAM, NAND Price Fixing by Manufacturers

It's been a couple years now that we've seen continuously increasing pricing of DRAM and NAND semiconductors. The price increase, which has been hailed and documented over, over, and over again (and there are way more articles on this subject here on TPU), follows reported increased demand which has failed to be accompanied by its respective manufacturing and supply ability.

However, reports that companies were planning on increasing production of DRAM and NAND below the expected increases in supply demand may have turned at least some regulatory eyes towards the issue. China's National Development and Reform Commission's Pricing Supervision Department (NDRC) said they are aware of the situation, how it could point towards price-fixing from the four major NAND production players (Samsung, Hynix, Micron and Toshiba), and are looking into the matter. "We have noticed the price surge and will pay more attention to future problems that may be caused by 'price fixing' in the sector," the official Xu Xinyu was quoted as saying in an interview to Chinese newspaper Daily China.

G.Skill Releases World's Fastest 64GB (4x16GB) SO-DIMM Kit at DDR4-3466 CL17

G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory and gaming peripherals, is announcing the world's fastest performance 64GB DDR4 SO-DIMM memory running at DDR4-3466MHz CL17-17-17-37 at 1.35V with a 4x16GB kit configuration. Constructed with rigorously hand-selected Samsung B-die DDR4 IC components, this new Ripjaws DDR4 SO-DIMM memory kit elevates the computing power of small-form-factor (SFF) PCs to a whole new realm of memory performance, allowing you to design a miniature powerhouse system for virtually any tasks ranging from content creation to gaming.

The Perfect Trio: High Capacity, High Frequency, Low Timings
The need of faster and larger capacity memory kits continue to rise as modern day workloads increases in both capacity and weight. To tackle this need, G.SKILL is expanding the delivery of maximum memory performance across all memory capacities; and by using 16GB SO-DIMM modules, high-end machines and workstation PCs can now be built in the size of a SFF system that can fit into a shoebox. Shown in the following screenshot is the high capacity 64GB SO-DIMM memory kit running at DDR4-3466MHz CL17-17-17-37 and being tested for over 6 hours on the ASRock X299E-ITX/ac mini-ITX motherboard with the Intel Core i9-7900X processor.

Samsung ARTIK 05x Modules Are the First to Earn the OCF 1.3 Certification

Samsung Electronics Co. Ltd. today announced Open Connectivity Foundation (OCF) 1.3 certification for the Samsung ARTIK 05x series of modules, the first system-on-module family to be certified using new OCF standards for trust and connectivity for IoT. With the ARTIK 05x series, companies can quickly build Wi-Fi enabled edge products that meet OCF standards for interoperability, and take advantage of the ARTIK platform's built-in hardware and software solutions to ensure reliability, safety and privacy for connected products.

The OCF certification program ensures companies can create products that work seamlessly with other OCF certified IoT devices regardless of their form factor, operating system or service providers. OCF 1.3 certification assures interoperability with OCF specific testing and certification, improving time-to-market, and enhancing the customer experience.

LINKFLOW is Bringing the World's First Wearable 360° Camera to Kickstarter

Samsung Electronics unveiled the concept of the FITT360, a 360-degree wearable camcorder, last year. The K-ICT Born2Global Centre announced that accelerated and spun off from Samsung Electronics with this concept developed, LINKFLOW is bringing this state-of-the-art technology to the market via Kickstarter with full details to be disclosed. FITT360 is wearable around the neck all day with its light and portable design. Ergonomically designed to fit everybody while keeping it unobtrusive with its sleek neckband form, FITT360 is rain-, snow-, heat-, and shockproof to endure users' life. With patented image stabilization, live stitching and streaming functionality, FITT360 opens up possibilities for tele-presence and life streaming scenarios. With life logging in mind, the built-in GPS enables users to keep their personal 360 video-logs within the companion mobile application.

4Q DRAM Sales Put Exclamation Point On An Amazing Year of Growth

Throughout 2017, DRAM manufacturers faced pressure to boost output of their devices-particularly high-performance DRAM used in data center servers, and low-power high-density DRAM used in smartphones and other mobile products. Strong, ongoing demand put significant upward pressure on DRAM average selling prices. This trend continued into 4Q17 and is expected to drive quarterly DRAM sales to an all time high mark of $21.1 billion (Figure 1), capping an incredible year of growth in which DRAM sales set a new all time high sales mark each quarter. The forecast $21.1 billion sales level in 4Q17 would be an increase of 65% compared to the $12.8 billion DRAM market of 4Q16.

G.Skill Intros Quad-channel DDR4-4000 MHz SO-DIMM Kit

G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory and gaming peripherals, is announcing the world's highest performance DDR4 SO-DIMM memory running at DDR4-4000 MHz CL18-18-18-38 32 GB (4x8 GB) at 1.35V. Combining high frequency and ultra-low timing, this Ripjaws DDR4 SO-DIMM memory kit is capable of achieving the new high level of performance through rigorously hand-binned Samsung B-die DDR4 IC components.

Just two months ago, G.SKILL announced the high performance DDR4-3800MHz CL18-18-18-38 Ripjaws DDR4 SO-DIMM kit. Aiming to push memory limits to yet another level, G.SKILL strives to deliver the best memory performance possible on current systems, and this time for small form factor (SFF) PCs. With this new SO-DIMM memory kit, SFF PCs can now unlock the full potential of memory performance, as shown in the following screenshot, where this new memory kit is tested for over 6 hours on the ASRock X299E-ITX/ac mini-ITX motherboard with the Intel Core i9-7900X processor.
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