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LG and Samsung Said to Launch Smaller Sized OLED Displays in 2022

Rumours are starting to circulate about LG and Samsung's OLED plans for 2022 and we might get a first preview come CES in January. For those hoping to get an OLED computer screen at a reasonable price it seems like you might have to wait a bit longer, unless you'd be ok with using a TV as your computer display.

LG is said to be launching a 42-inch version of its C series of OLED TVs and it should retain or improve on the features of its current C series. The model name should be OLED42C2xxx and it's expected to retail for less than the current 48-inch CX and C1 TVs. There will obviously be larger sizes available too, including the current 48-inch size, which is also said to be available in the lower cost and lower spec A2 series. As for the exact spec, we'll have to wait until CES to find out, but HDMI 2.1, HDMI-VRR and possibly either or both of AMD's FreeSync Premium Pro and Nvidia's G-Sync compatible might be part of the package.
Samsung is on the other hand said to be working on a 34-inch QD-OLED computer monitor, alongside 55 and 65-inch QD-OLED TVs. Even less is known about these products, but all the products have apparently already gone into mass production and are expected to be on display at CES. Note that QD-OLED is not the same as QLED, although both display types are using Quantum Dot technology.

Samsung Electronics Announces New Advanced Semiconductor Fab Site in Taylor, Texas

Samsung Electronics, a world leader in advanced semiconductor technology, today announced that it would build a new semiconductor manufacturing facility in Taylor, Texas. The estimated $17 billion investment in the United States will help boost production of advanced logic semiconductor solutions that power next-generation innovations and technologies.

The new facility will manufacture products based on advanced process technologies for application in areas such as mobile, 5G, high-performance computing (HPC) and artificial intelligence (AI). Samsung remains committed to supporting customers globally by making advanced semiconductor fabrication more accessible and meeting surging demand for leading-edge products.

Samsung Electronics Expands its "Green Chip" Line-Up

Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today announced that five of its memory products achieved global recognition for successfully reducing its carbon emission, while 20 additional memory products received carbon footprint certification. Samsung's automotive LED packages also had their carbon footprint verification, a first in the industry for automotive LED packages, further expanding Samsung's portfolio of eco-conscious "green chips".

"It is exciting to see our environmentally sustainable efforts receiving global acknowledgements," said Seong-dai Jang, Senior Vice President and Head of DS Corporate Sustainability Management Office at Samsung Electronics. "We will continue our path towards a sustainable future with 'greener' chips enabled by Samsung's cutting-edge technology."

Samsung Talks DDR6-12800, GDDR7 Development, and HBM3 Volume Production

During Samsung's Tech Day 2021, the company presented some interesting insights about the future of system memory technologies and how it plans to execute its production. Starting with the latest DDR5 standard, the company intends to follow JEDEC documents and offer some overclocking modules that surpass the specification advised by JEDEC. While the DDR5 standard specifies memory modules with 6,400 MT/s, Samsung will develop modules capable of overclocking up to 8,400 MT/s. These are not yet confirmed as they are still in the development phase. However, we can expect to see them in the later life of DDR5 memory.

The company also talked about the DDR6 standard, which is supposedly twice as fast as DDR5. The new DDR6 standard is still in early development, and all we know so far is that the number of memory channels per module is seeing a twofold increase over DDR5 to four channels. The number of memory banks also increases to 64. In addition to DDR6 for desktop and server use cases, the company is also working on Low Power DDR6 (LPDDR6) for mobile applications. While the company's LPDDR5 memory goes into volume production using the 1a-nm process at the beginning of 2022, the LPDDR6 is still in early development. The base speed for DDR6 modules will allegedly arrive at 12,800 MT/s, while overclocking modules will join the party at up to 17,000 MT/s. Mobile-oriented LPDDR6 version is also supposed to come with up to 17,000 MT/s speeds.

AMD Expected to See 65 Percent Growth Rate in Sales for 2021, Intel Down One Percent

According to an industry report by IC Insights, AMD will see a yearly growth rate of no less than 65 percent this year, compared to 2020, whereas Intel is expected to have a slightly negative growth rate of one percent. The report includes the top 25 semiconductor sales leaders, ranked by growth rate, although it should be pointed out that some of them are foundries and not just semiconductor companies.

AMD is closely followed by MediaTek, which is expected to reach a 60 percent growth rate this year, followed by Nvidia at 54 percent and Qualcomm and 51 percent growth. The only surprise in the top five is PRC based SMIC, which saw a 39 percent growth this year, despite, or maybe because of the US sanctions against various Chinese IC makers.

TOP500 Update Shows No Exascale Yet, Japanese Fugaku Supercomputer Still at the Top

The 58th annual edition of the TOP500 saw little change in the Top10. The Microsoft Azure system called Voyager-EUS2 was the only machine to shake up the top spots, claiming No. 10. Based on an AMD EPYC processor with 48 cores and 2.45GHz working together with an NVIDIA A100 GPU and 80 GB of memory, Voyager-EUS2 also utilizes a Mellanox HDR Infiniband for data transfer.

While there were no other changes to the positions of the systems in the Top10, Perlmutter at NERSC improved its performance to 70.9 Pflop/s. Housed at the Lawrence Berkeley National Laboratory, Perlmutter's increased performance couldn't move it from its previously held No. 5 spot.

Samsung Announces Availability of Its Leading-Edge 2.5D Integration H-Cube Solution

Samsung Electronics, a world leader in advanced semiconductor technology, today announced that it has developed Hybrid-Substrate Cube (H-Cube) technology, its latest 2.5D packaging solution specialized for semiconductors for HPC, AI, data center, and network products that require high-performance and large-area packaging technology.

"H-Cube solution, which is jointly developed with Samsung Electro-mechanics (SEMCO) and Amkor Technology, is suited to high-performance semiconductors that need to integrate a large number of silicon dies," said Moonsoo Kang, senior vice president and Head of Foundry Market Strategy Team at Samsung Electronics. "By expanding and enriching the foundry ecosystem, we will provide various package solutions to find a breakthrough in the challenges our customers are facing."

Samsung Develops Industry's First LPDDR5X DRAM

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it has developed the industry's first 14-nanometer (nm) based 16-gigabit (Gb) Low Power Double Data Rate 5X (LPDDR5X) DRAM, designed to drive further growth throughout the high-speed data service applications including 5G, artificial intelligence (AI) and the metaverse.

"In recent years, hyperconnected market segments such as AI, augmented reality (AR) and the metaverse, which rely on extremely fast large-scale data processing, have been rapidly expanding," said SangJoon Hwang, senior vice president and head of the DRAM Design Team at Samsung Electronics. "Our LPDDR5X will broaden the use of high-performance, low-power memory beyond smartphones and bring new capabilities to AI-based edge applications like servers and even automobiles."

Annual DRAM Revenue for 2022 Expected to Reach US$91.5 Billion, with Prices Likely to Rally in 2H22, Says TrendForce

Despite the forecasted 18.6% YoY growth in total DRAM bit supply next year, the global DRAM market is still expected to shift from a shortage situation to an oversupply, according to TrendForce's latest investigations. This shift can primarily be attributed to the fact that, not only are most buyers now carrying a relatively high level of DRAM inventory, but DRAM bit demand is also expected to increase by only 17.1% YoY in 2022. On the price front, the oversupply situation will result in a drop in DRAM ASP in 2022 but not a major decline in annual DRAM revenue, thanks to the oligopolistic nature of the DRAM industry. Annual DRAM revenue for 2022 is expected to reach US$91.54 billion, which represents a slight YoY increase of 0.3%.

Based on an analysis of DRAM sufficiency ratio (which refers to the surplus of supply in comparison with demand) for each quarter in 2022, TrendForce forecasts a 15% YoY decrease in DRAM ASP for 2022, with prices undergoing the more noticeable declines during the first half of the year. Heading into 2H22, however, owing to the rise in DDR5 penetration rate, as well as the arrival of peak seasonal demand, the decline in DRAM ASP will likely narrow. TrendForce does not rule out the possibility that DRAM ASP may even hold flat or undergo an increase in 2H22.

G.SKILL Showcases DDR5-7000 CL40 Extreme Speed Memory

G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory and gaming peripherals, is thrilled to announce the achievement of DDR5-7000 CL40-40-40-76 32 GB (2x16 GB) extreme speed, passing the Memtest stability test. 7000MT/s memory speed is an exciting milestone, as it was only seen under liquid nitrogen sub-zero temperature cooling not long ago in overclocking records. Accomplished with high-performance Samsung DDR5 components, this extreme speed memory is truly worthy of the G.SKILL flagship Trident Z5 family classification.

G.SKILL has been dedicated to develop the fastest possible DDR5 memory on the latest 12th Gen Intel Core desktop processors and Intel Z690 chipset motherboards. Today, G.SKILL is proud to announce the feat of reaching DDR5-7000 extreme speed, while maintaining an ultra-low CAS latency timing of CL40-40-40-76. The memory modules that reached this monumental achievement is built with high-performance Samsung DDR5 components, and has shown to be stable under Memtest. Please refer to the screenshot below.

TrendForce: Annual Foundry Revenue Expected to Reach Historical High Again in 2022 with 13% YoY Increase with Chip Shortage Showing Sign of Easing

While the global electronics supply chain experienced a chip shortage, the corresponding shortage of foundry capacities also led various foundries to raise their quotes, resulting in an over 20% YoY increase in the total annual revenues of the top 10 foundries for both 2020 and 2021, according to TrendForce's latest investigations. The top 10 foundries' annual revenue for 2021 is now expected to surpass US$100 billion. As TSMC leads yet another round of price hikes across the industry, annual foundry revenue for 2022 will likely reach US$117.69 billion, a 13.3% YoY increase.

TrendForce indicates that the combined CAPEX of the top 10 foundries surpassed US$50 billion in 2021, a 43% YoY increase. As new fab constructions and equipment move-ins gradually conclude next year, their combined CAPEX for 2022 is expected to undergo a 15% YoY increase and fall within the US$50-60 billion range. In addition, now that TSMC has officially announced the establishment of a new fab in Japan, total foundry CAPEX will likely increase further next year. TrendForce expects the foundry industry's total 8-inch and 12-inch wafer capacities to increase by 6% YoY and 14% YoY next year, respectively.

JEDEC Publishes Update to DDR5 SDRAM Standard Used in HPC Applications

JEDEC Solid State Technology Association, the global leader in standards development for the microelectronics industry, today announced publication of the JESD79-5A DDR5 SDRAM standard. This update to the JEDEC DDR5 SDRAM standard includes features designed to enhance reliability and performance in a wide range of applications involving client systems and high-performance servers. JESD79-5A is now available for download from the JEDEC website.

Added features designed to meet industry demand for improved system reliability include bounded fault error-correction support, Soft Post-Package Repair (sPPR) undo and lock, Memory Built-In Self-Test Post Package Repair (MBIST and mPPR), Adaptive RFM, and an MR4 extension. JESD79-5A expands the timing definition and transfer speed of DDR5 up to 6400 MT/s for DRAM core timings and 5600 MT/s for IO AC timings to enable the industry to build an ecosystem up to 5600 MT/s. The nomenclature for core timing parameters and their respective definitions has been revamped to closely align with the upcoming JEDEC JESD400-5 DDR5 Serial Presence Detect (SPD) Contents V1.0 standard. The document can be accessed here.

Portability, Meet Performance: Samsung Expands Galaxy Book Lineup in the U.S. with Three New, Powerful PCs

Samsung Electronics America, Inc. today announced the availability of three new Galaxy Book PC portfolio products in the U.S.: Galaxy Book, Galaxy Book Odyssey, and Galaxy Book Pro 360 5G. Galaxy Book is available starting today, while both Galaxy Book Odyssey and Galaxy Book Pro 360 5G will be available on November 11. With every laptop, users get a take-anywhere, do-anything premium PC, thanks to brilliant displays, 11th Generation Intel powered performance, and seamless continuity with the Galaxy ecosystem.

Each new Galaxy Book sports a unique design to meet a wide range of tastes - from Galaxy Book Pro 360 5G's ultra-thin body, to Galaxy Book's refined classic look, to Galaxy Book Odyssey's rugged beveled style. All three PCs also come with Windows 11, offering a fresh, new and modern feel and tools to bring you closer to what you love, empower productivity and inspire creativity.

G.SKILL Announces World's Fastest DDR5-6600 CL36 Trident Z5 Memory Kits

G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory and gaming peripherals, is thrilled to announce the world's fastest DDR5 memory kit at an extreme speed and low latency of DDR5-6600 CL36-36-36-76 32 GB (2x 16 GB). This is the world's first DDR5 memory kit to reach such high level of frequency speed and extremely efficient low timings, achieved with high-performance Samsung DDR5 ICs.

In the never-ending quest for memory performance, G.SKILL is proud to reveal the latest addition of ultra-high DDR5 frequency to the flagship Trident Z5 family. While reaching an extreme frequency speed of DDR5-6600, this memory kit specification is also created with an ultra-low timing at CL36-36-36, compared to the typical CL40-40-40 timing of DDR5, making this the ultimate performance choice for gamers, enthusiasts, and overclockers. The screenshot below shows a G.SKILL memory kit validated with the use of high performance Samsung DDR5 ICs.

DRAM Prices Projected to Enter Period of Downswing in 2022 as Demand Lags Behind Supply, Says TrendForce

DRAM contract prices are likely to exit a bullish period that lasted three quarters and be on the downswing in 4Q21 at a QoQ decline of 3-8%, according to TrendForce's latest investigations. This decline can be attributed to not only the declining procurement activities of DRAM buyers going forward, but also the drop in DRAM spot prices ahead of contract prices. While the buying and selling sides attempt to gain the advantage in future transactions, the DRAM market's movement in 2022 will primarily be determined by suppliers' capacity expansion strategies in conjunction with potential growths in demand. The capacity expansion plans of the three largest DRAM suppliers (Samsung, SK hynix, and Micron) for 2022 are expected to remain conservative, resulting in a 17.9% growth in total DRAM bit supply next year. On the demand side, inventory levels at the moment are relatively high. Hence, DRAM bit demand is expected to grow by 16.3% next year and lag behind bit supply growth. TrendForce therefore forecasts a shift in the DRAM market next year from shortage to surplus.

Samsung 980 PRO SSD Finally Gets a Stock Heatsink Option

Samsung's flagship client M.2 NVMe SSD, the 980 PRO, finally has a stock heatsink in new SKUs. Its design calls for what appears to be an aluminium monoblock with ridges for fins that join at the top. This heatsink is held in place by a metal shroud that covers the sides and back of the drive. The drive comes with its own retail SKUs and name—"980 PRO with Heatsink," much like how Western Digital segregates SKUs with or without heatsinks for its flagship WD Black SN850 drives. Retail channel availability of these variants remains to be seen, as The Verge reports that these drives will be sold as PlayStation 5-compatible drives. When they come out on October 29, the 1 TB variant is expected to be priced at $250, with the 2 TB variant going for $450.

Samsung Starts Mass Production of Most Advanced 14 nm EUV DDR5 DRAM

Samsung Electronics, the world leader in advanced memory technology, today announced that it has begun mass producing the industry's smallest, 14-nanometer (nm), DRAM based on extreme ultraviolet (EUV) technology. Following the company's shipment of the industry-first EUV DRAM in March of last year, Samsung has increased the number of EUV layers to five to deliver today's finest, most advanced DRAM process for its DDR5 solutions.

"We have led the DRAM market for nearly three decades by pioneering key patterning technology innovations," said Jooyoung Lee, Senior Vice President and Head of DRAM Product & Technology at Samsung Electronics. "Today, Samsung is setting another technology milestone with multi-layer EUV that has enabled extreme miniaturization at 14 nm—a feat not possible with the conventional argon fluoride (ArF) process. Building on this advancement, we will continue to provide the most differentiated memory solutions by fully addressing the need for greater performance and capacity in the data-driven world of 5G, AI and the metaverse."

Intel CEO Cites Brexit as Reason for Chip Fab Plans in UK Not an Option

In an interview with the BBC, Intel CEO Pat Gelsinger said that the company is no longer considering the UK as a site for a chip fab, due to Brexit, something the company had apparently done prior to Brexit. Now the company is looking for a location in another EU country for a US$95 billion investment for a new semiconductor plant, as well as upgrades to its current plants in Ireland.

Although Intel had not made any firm decisions on a site location prior to Brexit, Gelsinger is quoted as saying "I have no idea whether we would have had a superior site from the UK, but we now have about 70 proposals for sites across Europe from maybe 10 different countries." He continues "We're hopeful that we'll get to agreement on a site, as well as support from the EU... before the end of this year."

Samsung Foundry Announces GAA Ready, 3nm in 2022, 2nm in 2025, Other Speciality Nodes

Samsung Electronics, a world leader in advanced semiconductor technology, today unveiled plans for continuous process technology migration to 3- and 2-nanometer (nm) based on the company's Gate-All-Around (GAA) transistor structure at its 5th annual Samsung Foundry Forum (SFF) 2021. With a theme of "Adding One More Dimension," the multi-day virtual event is expected to draw over 2,000 global customers and partners. At this year's event, Samsung will share its vision to bolster its leadership in the rapidly evolving foundry market by taking each respective part of foundry business to the next level: process technology, manufacturing operations, and foundry services.

"We will increase our overall production capacity and lead the most advanced technologies while taking silicon scaling a step further and continuing technological innovation by application," said Dr. Siyoung Choi, President and Head of Foundry Business at Samsung Electronics. "Amid further digitalization prompted by the COVID-19 pandemic, our customers and partners will discover the limitless potential of silicon implementation for delivering the right technology at the right time."

Samsung Introduces Industry's First Open-source Software Solution for CXL Memory Platform

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today introduced the first open-source software solution, the Scalable Memory Development Kit (SMDK), that has been specially designed to support the Compute Express Link (CXL) memory platform. In May, Samsung unveiled the industry's first CXL memory expander that allows memory capacity and bandwidth to scale to levels far exceeding what is possible in today's server systems. Now, the company's CXL platform is being extended beyond hardware to offer easy-to-integrate software tools, making CXL memory much more accessible to data center system developers for emerging artificial intelligence (AI), machine learning (ML) and 5G-edge markets.

The CXL interconnect is an open, industry-backed standard that enables different types of devices such as accelerators, memory expanders and smart I/O devices to work more efficiently when processing high-performance computational workloads. "In order for data center and enterprise systems to smoothly run next-generation memory solutions like CXL, development of corresponding software is a necessity," said Cheolmin Park, vice president of the Memory Product Planning Team at Samsung Electronics. "Today, Samsung is reinforcing its commitment toward delivering a total memory solution that encompasses hardware and software, so that IT OEMs can incorporate new technologies into their systems much more effectively."

List of Validated DDR5 for Intel Alder Lake Leaks

If you're looking at getting your hands on some DDR5 memory for your new Alder Lake build once it launches, a leak of validated RAM has popped up on Twitter, that should give you an idea of what to expect. The list is only a couple of weeks old and it's not what we'd call a long list, as it only covers five companies, out of which three are actual DRAM manufacturers and one is a subsidiary of one of those companies, there are no real surprises here.

All the DDR5 modules tested are rated at 4800 MHz and are either 8, 16 or 32 GB in size, with all modules using 16 Gbit chips. All modules were tested with timings of 40-39-39 at 1.1 V. Kingston is the only outlier here, since they're not a DRAM manufacturer, unlike SK hynix, Samsung and Micron/Crucial. Intel is listing all the modules as non ECC, which should put an end to the claims of all DDR5 being ECC memory.

Samsung Confirms RDNA2-based Exynos 2200 iGPU Will Support Ray Tracing

Samsung appears to be in a hurry to beat Apple and Qualcomm at bringing real-time ray tracing to the smartphone space, with its next-generation Exynos 2200 "Pamir" SoC. The chip integrates a graphics processor based on the AMD RDNA2 architecture, codenamed "Voyager." Samsung all but confirmed that the compute units of this will feature Ray Accelerators, the hardware component that performs ray-intersection calculations. The "Voyager" iGPU, as implemented on the Exynos 2200 SoC, physically features six RDNA2 compute units (384 stream processors), and hence six Ray Accelerators.

Built on the 4 nm EUV silicon fabrication process, Exynos 2200 will feature not two, but three kinds of CPU cores—four lightweight efficiency cores, three mid-tier cores, and one ultra high-performance core. Each of these three operate in unique performance/Watt bands, giving software finer-grained control over the kinds of hardware resources they want. Samsung is expected to debut the Exynos 2200 with its next-generation Galaxy S and Galaxy Note devices.

Annual Notebook Shipment for 2021 Projected to Reach 240 Million Units, Though Demand in 4Q21 Remains Contingent on Market Trends, Says TrendForce

As growing vaccination rates worldwide starting in July lead to a gradual easing of lockdowns, the overall demand for notebook computers has also experienced a corresponding slowdown, with Chromebook demand dropping by as much as 50%, according to TrendForce's latest investigations. However, factors such as a wave of replacement demand for commercial notebooks in Europe and North America due to the return to physical workplaces, as well as brands' aggressive efforts to rush out their 4Q21 shipments ahead of time due to global port congestions, became the primary drivers of notebook demand in 3Q21. Hence, annual notebook shipment for 2021 will likely reach 240 million units, a 16.4% YoY increase.

TrendForce further indicates that 4Q21 will welcome both the gradual release of new models equipped with Intel's next-gen CPUs and a wave of replacement demand for notebooks featuring Windows 11. Even so, overall notebook shipment in 4Q21 will depend on the status of the COVID-19 pandemic and the demand for commercial notebooks. As vaccinations become even more widespread in 2022, pandemic-related spending is expected to decline as a result. TrendForce therefore expects global notebook shipment to decline by 7-8% YoY next year and reach approximately 220 million units, although this still represents a growth of 60 million units over the shipment volume for 2019, prior to the emergence of the pandemic.

Samsung Working on Attracting more Foundry Customers by Improving Customer Structure and Process Node Breakthroughs

Samsung is by far Samsung's largest foundry customers and this is no secret, but now it seems like the company wants to gain more customers to help pay for the costs of operating a cutting edge foundry. A little over a decade ago, Samsung was part of the Common Platform technology alliance together with GlobalFoundries and IBM, which allowed companies to almost pick either foundry based on a common design kit and common process technologies. It made Samsung an attractive foundry option, but the alliance didn't last.

As we know, Nvidia gave Samsung a try with Ampere and there were a lot of reports of yield issues and what not early on. This seems to have persuaded Nvidia to move back to TSMC for Lovelace and Hopper, which is a big loss for Samsung. However, it seems this was also something of a wakeup call for Samsung, as the company is apparently looking at making some internal changes to its customer structure so it can handle third party customers in a better way.

DRAM Prices Projected to Decline by 3-8% QoQ in 4Q21 Due to Rising Level of Client Inventory, Says TrendForce

Following the peak period of production in 3Q21, the supply of DRAM will likely begin to outpace demand in 4Q21, according to TrendForce's latest investigations (the surplus of DRAM supply is henceforth referred to as "sufficiency ratio", expressed as a percentage). In addition, while DRAM suppliers are generally carrying a healthy level of inventory, most of their clients in the end-product markets are carrying a higher level of DRAM inventory than what is considered healthy, meaning these clients will be less willing to procure additional DRAM going forward. TrendForce therefore forecasts a downward trajectory for DRAM ASP in 4Q21. More specifically, DRAM products that are currently in oversupply may experience price drops of more than 5% QoQ, and the overall DRAM ASP will likely decline by about 3-8% QoQ in 4Q21.

Although WFH and distance learning applications previously generated high demand for notebook computers, increasingly widespread vaccinations in Europe and North America have now weakened this demand, particularly for Chromebooks. As a result, global production of notebooks is expected to decline in 4Q21, in turn propelling the sufficiency ratio of PC DRAM to 1.38%, which indicates that PC DRAM will no longer be in short supply in 4Q21. However, PC DRAM accounts for a relatively low share of DRAM manufacturers' DRAM supply bits, since these suppliers have allocated more production capacities to server DRAM, which is in relatively high demand. Hence, there will unlikely be a severe surplus of PC DRAM in 4Q21. It should also be pointed out that, on average, the current spot prices of PC DRAM modules are far lower than their contract prices for 3Q21. TrendForce therefore expects an imminent 5-10% QoQ decline in PC DRAM contract prices for 4Q21, with potential for declines that are even greater than 10% for certain transactions, as PC OEMs anticipate further price drops in PC DRAM prices in the future.
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