News Posts matching #Samsung

Return to Keyword Browsing

Revenue of Top 10 Foundries Expected to Increase by 20% YoY in 1Q21 in Light of Fully Loaded Capacities, Says TrendForce

Demand in the global foundry market remains strong in 1Q21, according to TrendForce's latest investigations. As various end-products continue to generate high demand for chips, clients of foundries in turn stepped up their procurement activities, which subsequently led to a persistent shortage of production capacities across the foundry industry. TrendForce therefore expects foundries to continue posting strong financial performances in 1Q21, with a 20% YoY growth in the combined revenues of the top 10 foundries, while TSMC, Samsung, and UMC rank as the top three in terms of market share. However, the future reallocation of foundry capacities still remains to be seen, since the industry-wide effort to accelerate the production of automotive chips may indirectly impair the production and lead times of chips for consumer electronics and industrial applications.

TSMC has been maintaining a steady volume of wafer inputs at its 5 nm node, and these wafer inputs are projected to account for 20% of the company's revenue. On the other hand, owing to chip orders from AMD, Nvidia, Qualcomm, and MediaTek, demand for TSMC's 7 nm node is likewise strong and likely to account for 30% of TSMC's revenue, a slight increase from the previous quarter. On the whole, TSMC's revenue is expected to undergo a 25% increase YoY in 1Q21 and set a new high on the back of surging demand for 5G, HPC, and automotive applications.

Samsung is Preparing Exynos SoC with Radeon GPU for Next-Generation PCs

In 2019, AMD and Samsung have announced that they will be joining forces to develop a new class of mobile SoCs, carrying the Exynos name and having a Radeon GPU inside. These Exynos SoCs could be used for almost everything that needs a low-power processor. While the original plan was to have these processors run inside Samsung's mobile phone offerings, it seems like there is another application for them. If the rumors coming from ZDNet Korea are correct, we are in for a surprise. According to the source, Samsung is preparing to use the Exynos SoC with Radeon graphics in the company's next-generation laptops lineup.

While there is little to no information regarding the specifications of the said system, we can expect it to be a fully Samsung-made laptop. That means that Samsung will provide display, RAM, storage, battery, and other components manufactured by the company or its divisions. This laptop is expected to replace Samsung's Galaxy Book S, which currently uses Qualcomm Snapdragon 8cx SoC. The new PC is going to be Windows 10 based system. For more details, we have to wait for the announcement.

Samsung Begins Mass Production of Data Center SSD Customized for Hyperscale

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it has begun mass producing its most advanced line of data center SSDs, the PM9A3 E1.S.

The new PM9A3 fully complies with the Open Compute Project (OCP) NVMe Cloud SSD Specification to satisfy the rigorous demands of enterprise workloads. Defined by leading data center providers including Facebook, the OCP Specification is a set of unified interoperable standards, enabling SSD vendors to work toward next-generation storage designs with much more effectiveness.

"Rocket Lake" Offers 11% Higher PCIe Gen4 NVMe Storage Performance: Intel

Intel claims that its upcoming 11th Gen Core "Rocket Lake-S" desktop processors offer up to 11% higher storage performance than competing AMD Ryzen 5000 processors, when using the CPU-attached M.2 NVMe slot. A performance slide released by Intel's Ryan Shrout shows a Samsung 980 PRO 1 TB PCI-Express 4.0 x4 M.2 NVMe SSD performance on a machine powered by a Core i9-11900K processor, compared to one powered by an AMD Ryzen 9 5950X. PCMark 10 Quick System Drive Benchmark is used to evaluate storage performance on both machines. On both machines a separate drive is used as the OS/boot drive, and the Samsung 980 PRO is used as a test drive, free from any OS role.

The backup page for the slide provides details of the system configurations used for both machines. What it doesn't mention, however, is whether on the AMD machine, the 980 PRO was installed on the CPU-attached M.2 NVMe slot, or one that's attached to the AMD X570 chipset. Unlike the Intel Z590, the AMD X570 puts out downstream PCI-Express 4.0, which motherboard designers can use to put out additional NVMe Gen 4 slots. On the Intel Z590 motherboard, the M.2 NVMe Gen 4 slot the drive was tested on is guaranteed to be the CPU-attached one, as the Z590 PCH puts out PCIe Gen 3 downstream lanes. A PCI-Express 4.0 x4 link is used as chipset bus on the AMD X570, offering comparable bandwidth to the DMI 3.0 x8 (PCI-Express 3.0 x8) employed on the Intel Z590. A drive capable of attaining 7 GB/s sequential transfers should be in a sub-optimal situation on a chipset-attached M.2 slot. It would be nice if Intel clears this up in an update to its backup.

Update 02:51 UTC: In response to a specific question on Twitter, on whether the drives were tested on CPU-attached M.2 slots on both platforms, Ryan Shrout stated that a PCI-Express AIC riser card was used on both platforms to ensure that the drives are CPU-attached. 11% is a significant storage performance uplift on offer.

Gartner Says Worldwide Smartphone Sales Declined 5% in Fourth Quarter of 2020

Global sales of smartphones to end users declined 5.4% in the fourth quarter of 2020, according to Gartner, Inc. Smartphone sales declined 12.5% in full year 2020.

"The sales of more 5G smartphones and lower-to-mid-tier smartphones minimized the market decline in the fourth quarter of 2020," said Anshul Gupta, senior research director at Gartner. "Even as consumers remained cautious in their spending and held off on some discretionary purchases, 5G smartphones and pro-camera features encouraged some end users to purchase new smartphones or upgrade their current smartphones in the quarter."

Manufacturing: Samsung Semiconductor Fabs in Texas Shut Down Following State-wide Power Shortages

News just keep flowing that are bound to have impact on pricing for components users of this website know and love. The Austin-American Statesman reports that Samsung has been ordered to shutter its Texas factories in wake of recent power shortages that have impacted the state. The order, which came from Austin Energy, doesn't just affect Samsung: all industrial and semiconductor manufacturers in the state were ordered to idle or shut down their facilities, meaning that NXP Semiconductors and Infineon Semiconductors have also been affected. According to Austin Energy, all companies have complied with the order. A date for the lifting of these restrictions still hasn't been given.

As we know, semiconductor manufacturing is a drawn-out process, with some particular wafers taking several months in their journey from initial fabrication until they reach completion. This meas that it's a particularly sensitive business in regards to power outages or general service interruptions. The entire semiconductor manufacturing lines - and products therein, in various stages of production - can be rendered unusable due to these events, which will have a sizable impact in the final manufacturing output of a given factory. It remains to be seen the scale of this production impact, but a few percentage points difference in the overall global semiconductor manufacturing could have dire implications for availability and pricing, considering the already insufficient operational capacity in regards to demand. Considering the impact adverse temperatures are having on Texas residents, here's hoping for the quick resolution of these problems, which affect much more than just semiconductor manufacturing capabilities.

Samsung Develops Industry's First High Bandwidth Memory with AI Processing Power

Samsung Electronics, the world leader in advanced memory technology, today announced that it has developed the industry's first High Bandwidth Memory (HBM) integrated with artificial intelligence (AI) processing power—the HBM-PIM. The new processing-in-memory (PIM) architecture brings powerful AI computing capabilities inside high-performance memory, to accelerate large-scale processing in data centers, high performance computing (HPC) systems and AI-enabled mobile applications.

Kwangil Park, senior vice president of Memory Product Planning at Samsung Electronics stated, "Our groundbreaking HBM-PIM is the industry's first programmable PIM solution tailored for diverse AI-driven workloads such as HPC, training and inference. We plan to build upon this breakthrough by further collaborating with AI solution providers for even more advanced PIM-powered applications."

Samsung to Build $17 Billion Silicon Manufacturing Plant in the US by 2023

Samsung has been one of the world's biggest foundries and one of three big players still left in the leading-edge semiconductor process development and manufacturing. However, the Korean giant is always seeking ways to improve its offerings, especially for Western customers. Today, it is reported that Samsung has reportedly talked with regulators in Texas, New York, and Arizona about building a $17 billion silicon manufacturing facility in the United States. The supposed factory is going to be located near Austin, Texas, and is supposed to offer around 1800 jobs. If the deal is approved and Samsung manages to complete the project on time, the factory is supposed to start mass production in Q4 of 2023.

What process is Samsung going to manufacture in the new fab? Well, current speculations are pointing out to the 3 nm node, with Samsung's special GAAFET (Gate All Around FET) technology tied to the new node. The fab is also expected to make use of extreme ultraviolet (EUV) lithography for manufacturing. Samsung already has a facility in the US called S2, however, that will not be upgraded as it is still serving a lot of clients. Instead, the company will build new facilities to accommodate the demand for newer nodes. It is important to note that Samsung will not do any R&D work in the new fab, and the company will only manufacture the silicon there.

Apple is Reportedly Working with TSMC on a Special Micro OLED Panel Technology

OLED panes are expertise areas of display makers such as LG and Samsung, however, when it comes to Apple, they have to rely on external manufacturers to make a display. For years Apple has been contracting LG and Samsung to make the display for iPhones and Macs, but it looks like Apple is now collaborating with another firm to develop micro OLED technology. According to sources over at Nikkei Asia, Apple is collaborating with Taiwan Semiconductor Manufacturing Company (TSMC) to develop "ultra-advanced display technology at a secretive facility in Taiwan". Despite TSMC not being the traditional choice for panel manufacturing, there is a list of reasons why Apple chose its years-long partner to work with.

TSMC is known for manufacturing silicon chips, however, Apple envisions that the Taiwan maker will manufacture ultra-advanced micro OLED technology using wafers. Building the displays using wafers will result in much lower power consumption and far lower size. Why is this approach necessary you might wonder? Well, Apple is developing a new generation of AR glasses and there needs to be a solid display technology for them to exist. It is reported that the new micro OLED displays are under development and are about one inch in diameter. The source also adds that this is just one out of two projects being worked on inside of Apple's secretive labs located in the Taiwanese city of Taoyuan. What is the other project remains a mystery, however, with more time we could get information on that as well.

DigiTimes: DDR3 Prices to Soar 40-50% in 2021

Yes, you are reading that title correctly. Today we got ahold of information that DDR3 prices are going to skyrocket by as much as 40-50% this year! Despite DDR4 being present for seven years (since 2014), which is a lot in the world of tech, DDR3 is still thriving. Used in a wide range of devices like IoT, older servers, and long time running machines that need maintenance for decades. The DDR3 has been manufactured by SK Hynix, Samsung, and Micron, however, as technology moved on, these companies began the migration to the newer DDR4 standard. Even DDR5 exists today and it is currently manufactured.

So why is DDR3 soaring in value? It is because of the increased scarcity of this memory. SK Hynix has stopped the production of 2 Gb modules, leaving only the 4 Gb modules in production. Samsung has cut down the capacity from 60,000 wafers of DDR3 memory modules per month to just 20,000. This has caused the price of 2 Gb and 4 Gb modules to rise already as much as 30%. Despite the age of 14 years, DDR3 is still widely used in many systems. And because of that, the scarcity is making the price of the current memory increase. The price is expected to rise through the whole year and it could reach a 50% increase.

AMD Releases Radeon Software Adrenalin 21.2.1

AMD today released the latest version of Radeon Software Adrenalin drivers. Version 21.2.1 beta comes with optimization for "Medium," with a 9% performance increase at 4K measured using an RX 6800 XT graphics card, over the previous driver. A number of bugs and issues are also addressed. To begin with stuttering noticed on certain RX Vega series graphics cards at high refresh rates. A screen flickering observed with MSI Afterburner has been fixed. A bug that caused recording and streaming with Radeon Software, on Radeon HD 7800 series GPUs, has been fixed. A rendering error with SketchUp on RDNA GPUs has been fixed. Samsung CRG9 displays waking up from screen to black screens, has been fixed. Application crashes with "Metro Exodus" with DXR enabled, have been fixed. Video playback on other displays in a multi-display setup, during "Doom Eternal" gameplay on one of the displays, experiences stutter, which has been fixed.

DOWNLOAD: AMD Radeon Software Adrenalin 21.2.1

AMD Reportedly in Plans to Outsource Partial Chip Production to Samsung

It's been doing the rounds in the rumor mill that AMD is looking to expand its semiconductor manufacturing partners beyond TSMC (for the 7 nm process and eventually 5 nm) and Global Foundries (12 nm process used in its I/O dies). The intention undoubtedly comes from the strain that's being placed on TSMC's production lines, as most foundry-less businesses outsource their wafer production to the Taiwanese companies' factories and manufacturing processes, which are currently the industry's best. However, as we've seen, TSMC is having a hard time scaling its production facilities to the unprecedented demand it's seeing from its consumers. The company also has recently announced it may prioritize new manufacturing capabilities for the automotive industry, which is also facing shortages in chips - and that certainly doesn't instill confidence in capacity increases for its non-automotive clients.

That's what originated form the rumor mill. Speculating, this could mean that AMD would be looking to outsource products with generally lower ASP to Samsung's foundries, instead of trying to cram even more silicon manufacturing onto TSMC's 7 nm process (where it already fabricates its Zen 3, RDNA 2, EPYC, and custom silicon solutions for latest-gen consoles). AMD might thus be planning on leveraging Samsung's 8 nm or even smaller fabrication processes as alternatives for, for example, lower-than-high-end graphics solutions and other product lines (such as APUs and FPGA production, should its acquisition of Xilinx come through).

Samsung Exynos SoC with AMD RDNA GPU Destroys Competition, Apple 14 Bionic SoC Kneels

Some time ago, Samsung and AMD announced that they will be building a mobile processor that utilizes AMD RDNA architecture for graphics processing. Samsung is readying its Exynos 2100 SoC and today we get to see its performance results in the first leaked benchmark. The new SoC design has been put through a series of GPU-only benchmarks that stress just the AMD RDNA GPU. Firstly there is Manhattan 3 benchmark where the Exynos SoC scored 181.8 FPS. Secondly, the GPU has scored 138.25 FPS in Aztek Normal and 58 FPS in Aztek High. If we compare those results to the Apple A14 Bionic chip, which scored 146.4 FPS in Manhattan 3, 79.8 FPS in Aztek Normal, and 30.5 FPS in Aztek High, the Exynos design is faster anywhere from 25% to 100%. Of course, given that this is only a leak, all information should be taken with a grain of salt.

NVIDIA RTX 2070 Modded to Support 16GB Memory

PC enthusiast VIK-on pulled off a sophisticated memory mod for the GeForce RTX 2070, doubling its memory amount to 16 GB. In a detailed video presentation (linked below), VIK-on demonstrated how he carefully removed the 8 Gb Micron-made GDDR6 memory chips of his card, with 16 Gb Samsung-made chips he bought off AliExpress for $200. Memory replacement mods are extremely difficult to pull off, as you first de-solder the existing chips using a hot air gun while keeping the contacts on the PCB intact (ensuring no pins short); and solder the replacement BGA memory chips in place.

In addition, a set of "jumpers" on the PCB need to be modified to make it recognize the Samsung memory. The resulting card booted to desktop successfully, with GPU-Z reading its full 16 GB memory size. The card successfully made it through 3DMark TimeSpy, albeit with 30% lower performance than a normal RTX 2070 (6176 points vs. ~9107 points). The card would also crash Furmark. Still, it's mighty impressive that the "TU106" recognizes 16 GB of addressable memory (which means all its memory channels are intact), without the need for any BIOS mods, which is impossible to pull off.
Watch the VIK-on video presentation here.

Industry R&D Spending To Rise 4% After Hitting Record in 2020: IC Insights

Research and development spending by semiconductor companies worldwide is forecast to grow 4% in 2021 to $71.4 billion after rising 5% in 2020 to a record high of $68.4 billion, according to IC Insights' new 2021 edition of The McClean Report—A Complete Analysis and Forecast of the Integrated Circuit Industry. Total R&D spending by semiconductor companies is expected to rise by a compound annual growth rate (CAGR) of 5.8% between 2021 and 2025 to $89.3 billion.

When the world was hit by the Covid-19 virus health crisis in 2020, wary semiconductor suppliers kept a lid on R&D spending increases, even though total semiconductor industry revenue grew by a surprising 8% in the year despite the economic fallout from the deadly pandemic. Semiconductor R&D expenditures as a percentage of worldwide industry sales slipped to 14.2% in 2020 compared to 14.6% in 2019, when research and development spending declined 1% and total semiconductor revenue fell 12%. Figure 1 plots semiconductor R&D spending levels and the spending-to-sales ratios over the past two decades and IC Insights' forecast through 2025.

Samsung Display to Introduce First 90Hz OLED Laptop Display

While most laptops and notebooks now offer a 60 Hz refresh rate, Samsung Display announced today that it will mass produce the world's first 90 Hz OLED laptops in the first quarter of this year. Samsung Display Chief Executive Officer Joo Sun Choi said that the company will initially produce very large quantities of 14-inch, 90 Hz OLED displays destined for laptops and notebooks, beginning in March.

"OLED display panels can best satisfy the diverse consumer needs for laptops used in telework, online education, video streaming, and gaming," the company said. Samsung Display said it is helping to introduce a major shift in the market as it collaborates closely with global manufacturers to achieve a new level of excellence for refresh rates in laptops, beginning this year.

Samsung Officially Announces 870 EVO SATA SSD Series

Samsung today has officially taken the lid off their latest consumer-oriented SATA SSDs, the 870 EVO. The 870 EVO series from Samsung don't push the maximum storage density ceiling on traditional SATA consumer drives, topping out at a maximum 4 TB, but they do achieve that ceiling whilst making use of Samsung's 128-layer TLC (Triple-Layer-Cell) NAND, which offers increased endurance (and higher theoretical performance than) more widespread QLC-based SSDs (of which Samsung launched the 870 QVO back in July 2020).

Samsung quotes SATA sequential read and write speeds of 560 MB/s and 530 MB/s respectively, with a "variable SLC" cache (which means it decreases in maximum size as the available free drive space decreases). The drives are also quoted at 98K IOPS Random Read, and 88K IOPS Write, and feature the company's Intelligent TurboWrite to maintain the interface's SATA 6 Gbps saturation as long as possible before sustained performance degradation appears. Samsung claims the 870 EVO also delivers a nearly 38% improvement in random read speeds over the previous 860 model, and quotes a (TBW) rating of 2,400 TB (or a 5-year limited warranty, whichever comes first) for its 4 TB model. The 870 EVO is available in either 256 GB, 512 GB, 1 TB, 2 TB, or 4 TB capacities, with the drives' RAM buffer scaling almost accordingly (512 MB DDR3 for the 256/512 Gb models, 1 GB for the 1 TB, 2 GB for the 2 TB drive, and 4 GB for the 4 TB one. Pricing starts at $49,99 for the 256 GB model; 500 GB for $79.99, 1 TB for $139.99; 2 TB for $269.99; and 4 TB for $529.99.

Samsung to Introduce OLED-Powered Laptops With Under-Display Webcam

Samsung this year aims to bring OLED panels in laptops closer to mainstream, with the company already announcing it would be scaling its OLED screens to serve the 13,3-16" diagonal-craving population with the best visual quality available. The company is apparently aiming to take this further by investing into under-display webcams, which would prevent machines from shipping with large top bezel designs engineered to accommodate them. It also skirts implementation of other, more exotic solutions such as the one found in the Huawei Matebook X Pro - where the webcam is located in a mechanical pop-up on the keyboard area, and mostly shows viewers the inside of your nostrils.

Samsung says that this under-display design should allow laptop makers to achieve up to 93 percent screen-to-body ratio for an immersive viewing experience. Do keep in mind that such a design was implemented only once in the industry in ZTE's Axon 20 smartphone, which incidentally featured diminished selfie camera and display quality due to it being under-display, which even led to resolution compromises on the area of the display that sits over the camera. The idea in ZTE's phone - and is the same for Samsung here - is that the segment of the OLED display that covers the camera will turn translucent whenever the optics are activated. In the ZTE phone, this resulted in clear quality compromises. We'll see if Samsung fares better. There is currently no time to market on such OLED panels, however.

Samsung Unveils Their Flagship Exynos 2100 Mobile Processor

Samsung Electronics, a world leader in advanced semiconductor technology, today announced the Exynos 2100 through its first virtual event, Exynos On 2021. The new mobile processor is the company's first premium 5G-integrated mobile processor built on the most advanced 5-nanometer (nm) extreme ultra-violet (EUV) process node.

The chip's computation and graphic processing performance have been improved and refined to surpass the power user's performance expectations. As Samsung's first 5G-integrated flagship mobile processor, the Exynos 2100 is built on an advanced 5 nm EUV process technology that allows up to 20-percent lower power consumption or 10-percent higher overall performance than the 7 nm predecessor. For further enhancement, the chip offers improved cache memory utilization and a stronger scheduler. The octa-core CPU comes in an improved tri-cluster structure made up of a single powerful Arm Cortex -X1 core that runs at up to 2.9 GHz, three high-performing Cortex-A78 cores and four power-efficient Cortex-A55 cores delivering more than 30-percent enhancement in multi-core performance than the predecessor.

Samsung x AMD: South Korean Giant Announces RDNA Integration in Next-Gen Exynos

Samsung today at its Exynos 2100 launch event announced that its labor with AMD to integrate the company's RDNA graphics architecture onto Exynos chips has born fruit. It's unclear today on which set of technology this integration is bound to - whether RDNA, RDNA 2, or a combination of both - and actual products will only hit shelves by the end of 2021 and beginning of 2022.

Samsung has announced that the design-in for AMD's RDNA platform into the company's flagship Exynos products for the 2021-2022 timeframe have been successful, and that the first iteration of the design will see the light of day on the upcoming Exynos 2100. The collaboration has reportedly resulted in very good performance values obtained from their IP merger in May 2020. It seems we have a few months to look towards to before we see a Galaxy phone with an RDNA-powered engraving, though.

Intel CEO Says Using Competitor's Semiconductor Process in Intel Fabs is an Option

Semiconductor manufacturing is not an easy feat to achieve. Especially if you are constantly chasing the smaller and smaller node. Intel knows this the best. The company has had a smooth transition from other nodes to the smaller ones until the 10 nm node came up. It has brought Intel years of additional delay and tons of cost improving the yields of a node that was seeming broken. Yesterday the company announced the new Tiger Lake-H processors for laptops that are built using the 10 nm process, however, we are questioning whatever Intel can keep up with the semiconductor industry and deliver the newest nodes on time, and with ease. During an interview with Intel's CEO Bob Swan, we can get a glimpse of Intel's plans for the future of semiconductors at the company.

In the interview, Mr. Swan has spoken about the technical side of Intel and how the company plans to utilize its Fabs. The first question everyone was wondering was about the state of 10 nm. The node is doing well as three Fabs are ramping up capacity every day, and more products are expected to arrive on that node. Mr. Swan has also talked about outsourcing chip production, to which he responded by outlining the advantage Intel has with its Fabs. He said that outsourcing is what is giving us shortages like AMD and NVIDIA experience, and Intel had much less problems. Additionally, Mr. Swan was asked about the feasibility of new node development. To that, he responded that there is a possibility that Intel could license its competitor's node and produce it in their Fabs.

Premium Comes Standard with Samsung Galaxy Chromebook 2 - World's First QLED Chromebook

Samsung Electronics Co., Ltd. today introduced Galaxy Chromebook 2, the newest member of the Galaxy Computing family. Since 2011, Samsung has been a leader in the Chromebook market, finding new ways to elevate the Chrome OS experience—and the ultra-premium Galaxy Chromebook represented a path-breaking leap forward. The 2-in-1 Galaxy Chromebook 2 builds on that legacy, offering the leading features from its predecessor at a more accessible price. Boasting the first-ever QLED display on a Chromebook, reliable hardware, and seamless integration into the Galaxy and Google ecosystems, Galaxy Chromebook 2 represents yet another high-performance option for users who love the flexibility of Chrome OS.

"Many kids grew up using Chromebooks in school, and as they enter the workforce, their needs evolve, they're looking for premium, powerful hardware that can elevate that intuitive Google experience," said Shoneel Kolhatkar, General Manager, Head of New Computing, Samsung Electronics America. "We designed the Galaxy Chromebook 2 with these users in mind, taking the popular features from Galaxy Chromebook—incredible visuals, great specs, and gorgeous design and color—and bringing them to a wider base of customers."

Samsung Announces Mass Production of 13.3"-16" OLED Panels for Laptops

Laptop screens are usually considered to be slightly behind the bend compared to TVs or PC monitors when it comes to technology and specs. For one, most laptops still ship with a 1080p panel; if you want a higher-resolution, your next best bet is in looking at a 4K panel, though these do usually max out at 60 Hz. Some 1440p panels should enter the market this year, though, and that might mean more than just a handful of models sporting higher-than-1080p resolution.

Samsung, however, has just announced that they have begun mass production of laptop-oriented OLED screens. These are being mass-produced at the 13.3" to 16" diagonals, and should mean more options from system integrators in delivering an uncompromised image quality on mobility offerings. For now, it seems these OLED panels will only feature 1080p resolution, in a bid to decrease panel costs and thus increase prevalence of OLED in the display market by catering to lower-priced products and price-conscious customers. There is no word on refresh rates at this time, but Samsung says these OLED panels offer up to 10x higher response rates than the typical laptop LCD screen, whilst offering tempting 120% DCI-P3 coverage and minimum pixel brightness of just 0.0005 nits.

Samsung Readies 870 EVO SATA SSD to Soak Up Your Swelling Game Libraries

Samsung is reportedly readying the 870 EVO line of SATA SSDs, with the drives succeeding the 860 EVO series. While there's no word on the type of NAND flash chips used with these drives, it's very likely that they feature a new generation 3D TLC (3 bits per cell) NAND flash memory, as QLC (4 bits per cell) has been marketed by Samsung under the 870 QVO series, which the company launched back in July 2020. The new-gen 3D TLC NAND could enable the 870 EVO drives to reach capacities as high as 4 TB, and offer slightly higher sequential transfer rates, with WinFuture.de reporting up to 560 MB/s sequential reads, and up to 530 MB/s writes, compared to 550/520 MB/s for the 860 EVO series. Being based on TLC (3 bpc) should also give these drives higher write endurance than the 870 QVO series.
Samsung 870 EVO

Hedge Fund Urges Intel to Outsource Chip Production: Reuters

Intel is familiar with chip manufacturing problems since the company started the development of a 10 nm silicon semiconductor node. The latest node is coming years late with many IPs getting held back thanks to the inability of the company to produce it. All of Intel's chip production was historically happening at Intel's facilities, however, given the fact that the demand for 14 nm products is exceeding production capability, the company was forced to turn to external foundries like TSMC to compensate for its lack of capacity. TSMC has a contract with Intel to produce silicon for things like chipsets, which is offloading a lot of capacity for the company. Today, thanks to the exclusive information obtained by Reuters, we have information that a certain New York hedge fund, Third Point LLC, is advising the company about the future of its manufacturing.

The hedge fund is reportedly accounting for about one billion USD worth of assets in Intel, thus making it a huge and one influencing shareholder. The Third Point Chief Executive Daniel Loeb wrote a letter to Intel Chairman Omar Ishrak to take immediate action to boost the company's state as a major provider of processors for PCs and data centers. The company has noted that Intel needs to outsource more of its chip production to satisfy the market needs, so it can stay competitive with the industry. The poor performance of Intel has reflected on the company shares, which have declined about 21% this year. This has awoken the shareholders and now we see that they are demanding more aggressiveness from the company and a plan to outsource more of the chip production to partner foundries like TSMC and Samsung. It remains to be seen how Intel responds and what changes are to take place.
Return to Keyword Browsing