News Posts matching #next-gen

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Evolve Your Game With the EK-Quantum MSI MPG Z690 Carbon EK X D-RGB

EK, the premium liquid cooling gear manufacturer, and MSI, a world-leading gaming brand, have partnered up once again to launch the next-gen MSI CARBON motherboard and EK-Quantum monoblock combo. The brand new EK-Quantum MSI MPG Z690 CARBON EK X D-RGB is based on the latest Z690 chipset and supports Intel 12th gen Alder Lake CPUs, this motherboard offers unparalleled cooling for the CPU, VRM section, and the first slot m.2 SSD thanks to the purpose-designed monoblock.

MSI's world-class engineering team and EK's industry-leading thermal engineers worked together to improve the previous-gen solution and bring even more benefits to the newest Intel Alder Lake platform. The MPG Z690 Carbon EK X allows maximum performance without the noisy environment, providing you with countless hours of uninterrupted gameplay while monitoring the flow in your loop via the integrated flow indicator. And to make sure your first assembly goes without a hitch, an EK-Leak Tester was included in the package.

Enter the Next Generation of Performance and Speed— Introducing CORSAIR DDR5 Memory

CORSAIR, a world leader in enthusiast components for gamers, creators, and PC builders, today kicked off the DDR5 era with the launch of DOMINATOR PLATINUM RGB DDR5 and VENGEANCE DDR5. Leveraging more than 25 years of experience crafting premium, high-performance memory, these new modules open the way to far higher frequencies, greater capacities, and faster performance. Launching initially at speeds of up to 5,200 MHz and capacities of up to 32 GB per module, DDR5 pushes the performance limit further than ever before alongside next-generation platforms, starting with 12th Generation Intel Core Processors and Z690 motherboards. With your choice between the iconic styling and stunning lighting of DOMINATOR PLATINUM RGB DDR5 or the compact, minimalist profile of VENGEANCE DDR5 in kits of 32 GB - 64 GB, CORSAIR has the options to equip your new cutting-edge PC with the unprecedented performance of DDR5.

As the performance and capabilities of modern CPUs continue to increase, your system needs upgraded memory to keep up and make the most of its potential. DDR5 ensures that today's high-end CPUs receive data as quickly as possible, and take system performance to the next level. While previous generations of DRAM were limited to less precise motherboard-based control for voltage regulation, DDR5 modules are the first equipped with onboard voltage regulation now conveniently controlled through CORSAIR iCUE software, resulting in more finely tuned and stable overclocking. iCUE also enables you to customize and save your own Intel XMP 3.0 profiles with ease, to tailor performance by app or task.

TEAMGROUP Brings RGB to Next-Gen DDR5 with the Launch of T-FORCE DELTA RGB DDR5 Gaming Memory

Since the end of 2020, TEAMGROUP has been at the forefront of next-generation DDR5 development, working closely with motherboard manufacturers to perform extensive validation testing. Whether it is the testing and research of DDR5's new PMIC architecture or XMP overclocking parameters, the company has achieved very fruitful results. Today TEAMGROUP is launching its brand new DELTA DDR5 Memory Series, the first DDR5 modules to be equipped with RGB lighting effect, providing gamers who enjoy visual flair with both next-level speed and eye-pleasing illumination.

The T-FORCE DELTA RGB DDR5 continues the design language of the DELTA DDR4 Series by maintaining the ultra-large spreader with wide-angled RGB edges and a minimalist geometrical surface. The overall look is further enhanced by its sleek stealth-fighter-inspired design. In addition, the color and flashing speed of each RGB LED used in DELTA RGB DDR5 can be independently controlled, offering more freedom to customize lighting effects than a typical RGB DDR4 memory. Currently samples have been sent to ASUS, GIGABYTE, MSI, ASROCK, BIOSTAR and other motherboard manufacturers for lighting tests. Players will be able to easily customize their own dazzling RGB effects through the manufacturers' lighting software.

DisplayPort 2.0 Could Land in Next-Generation AMD Radeon RDNA3 GPUs

AMD is slowly preparing to launch its next-generation of graphics cards based on the RDNA3 architecture, and it could bring some new connectivity options as well. Currently, the graphics cards we are using today use DisplayPort 1.4 connector for their DP output. However, the more advanced DisplayPort 2.0 could land in RDNA3 GPUs, bringing much-needed improvements to the video output system. What DP 2.0 brings to the table is an upgrade to an Ultra High Bit Rate individual lane speed of 20 GB/s, totaling 80 GB/s with four of those. The DP 2.0 capable system would be able to output a 10K uncompressed resolution at 60 Hz, or two 4K 144 Hz monitors at the same time. With compression, that would be extended much further. We have to wait and see what AMD does and if the next-generation RDNA3 brings this new DisplayPort standard to the masses.

Microsoft Launches Windows 11 Operating System

Microsoft is today holding a virtual Windows Event to showcase what is next for Windows. As we have made reports earlier in the past few weeks, the Redmond giant has shown-off the next-generation Windows 11 operating system, which will make a major improvement compared to Windows 10 both internally and as far as looks are concerned. We were live-blogging all of that, and at exactly, 11 am Eastern Time. You can find the whole live blog below, and check out the new Windows 11 OS features.

14:43 UTC: The event is about to start...

HWiNFO Adds Enhanced Early Support for AMD Zen 4

AMD's Zen 4 based systems are still in development, however, the company is already distributing firmware to give the new core design proper support once it arrives. By doing this, software providers are already able to distribute software with support for Zen 4 architecture. One of those examples is HWiNFO, popular monitoring, and diagnostics tool. In the pre-release of its upcoming version 7.05, which you can already download, the tool lists "Enhanced early support of some Zen4-based systems". This means that the software would likely be capable of monitoring a few components of the Zen 4 system, as the temperature for example. While we are not sure what the "enhanced" really means, only time will tell, as we await the launch of AMD's next-generation systems. You can download the pre-release 7.05 version of HWiNFO here, and you can check out the changelog below.

Microsoft Clears Way for Windows 11: Windows 10 Support to End October 14th, 2025

Microsoft has revealed the date when support for Windows 10 is going to end - effectively confirming that their original vision of Windows 10 being "the last Windows OS ever" is now dead. The information comes from Microsoft's own update to Windows 10's support life cycle page, which the company has amended with the final resting date set for October 14th 2025 for both Home and Pro versions of the operating system. Previously, the support life cycle page listed end of support dates for various release versions of Windows 10 - not the entire OS.

Adding this to the announcement that Windows would get a new, "next-gen" update; the related teaser art which omits the shadow of the window crossbar, making the cast shadow look either basically unrealistic (some Raytracing seems to be needed by Microsoft's art personnel) or, infinitely more likely, the omitted shadow serves to approximate the cast shadows as much as possible to 11. No official announcement by Microsoft, but usually 1 + 1 = 2.

Samsung Preparing to Deploy 176-Layer V-NAND in PCIe 4.0, PCIe 5.0 SSD Products

Samsung is preparing to deploy their latest innovations in NAND density with the next-generation V-NAND (7th gen). Samsung says it is preparing products that leverage both V-NAND's higher density (at 176 layers per chip versus up to 136 layers on 6th gen) with the throughput of both PCIe 4.0 and PCIe 5.0. This would of course mean higher density drives available, as well as a reduction in the overall $/GB equation. Due to Samsung's vertical integration (meaning that they are one of the few companies that can design and produce all SSD components in-house), the company is also developing next-gen NAND controllers that can leverage throughputs of 2,000 MT/s transfer rates and thus "optimized for multitasking huge workloads".

Samsung expects to be able to scale V-NAND well past the 1,000 layer mark - a far-cry from the claims made by SK Hynix, who have only talked about a theoretical 600-layer NAND configuration. While the 176-layer, 7-gen V-NAND is only now entering mass production and the final stages of product development, Samsung has already taped out the initial batches of their 8th-gen V-NAND, which feature "more than 200 layers". It's likely that Samsung's 1,000-layer claim actually looks towards the future in a timeframe of decade(s?) and isn't actually something to look forward to in the approximate future.

GIGABYTE Unleashes the AORUS Gen 4 7000s Prem. SSD

GIGABYTE Technology, one of the top global manufacturers of motherboards, graphics cards, and hardware solutions, announces today the latest AORUS Gen4 7000s Prem. SSD with up to 7 GB/s read speed while optimizing passive thermal dissipation, which promises no throttling under long-lasting operation. Through the SSD Tool Box application, users can have an instant control on overall operation of SSD.

AORUS Gen4 7000s Prem. SSD adopts the PCIe 4.0 NVMe M.2 interface and it equips the latest Phison E18 selected 8-channel controller, which provides users with ultimate random access rate, as well as the high speed 3D-TLC NAND Flash and SLC cache design that brings the PCIe 4.0 into full play. With the read speed up to 7 GB/s and write speed up to 6.85 GB/s, AORUS Gen4 7000s Prem. SSD can power up content creators, gamers, and users eager for extreme performance.

GeIL is Ready to Launch the Next Generation DDR5 RGB High-Performance Gaming Memory

GeIL, Golden Emperor International Ltd. - one of the world's leading PC component manufacturers, is proud to announce the next-generation DDR5 RGB high-performance gaming memory, Polaris RGB, is ready for the upcoming DDR5 platform. The GeIL Polaris RGB Gaming Memory will be available in Q4, 2021, with capacities ranging from 16 GB (16 GB x1) up to 128 GB (32 GB x4).

It has been seven years since DDR4 launched into the market, and GeIL has put countless hours into developing the new DDR5 memory modules. And in doing so, GeIL has designed the Polaris RGB to provide RGB illuminated high-performance DDR5 gaming memory and has been working closely with motherboard makers to guarantee the best compatibility and reliability among the latest Intel and AMD motherboards.

Redesigned Apple MacBook Pro Coming This Summer with up to 64 GB of RAM and 10-Core Processor

According to Bloomberg, which first predicted the arrival of Apple custom processors in MacBooks, we have another piece of information regarding Apple's upcoming MacBook Pro lineup, set to arrive this summer. As you are aware, MacBook Pro right now comes in two different variants. The first is a smaller 13-inch design that is powered by Apple's M1 chip, while the second is a 16-inch design powered by an Intel Core processor. However, it seems like that will no longer be the case when the next-generation lineup arrives. Starting this summer, all of the MacBook Pro models will have Apple's custom silicon powering these devices, which bring Intel's presence to an end.

And the successor to the now-famous M1 chip seems to be very good. As per the report, Apple is upgrading the architecture and the total core count. There are two different chips, codenamed Jade C-Chop and Jade C-Die. Both are 10-core designs, equipped with two small and eight big cores. The difference between the two is the total number of graphics cores enabled. The smaller version will have 16 graphics cores, while the bigger one will have 32 graphics cores. On the SoC, there will be an updated Neural Engine, for better AI processing. These new processors will come with up to 64 GB of RAM in selected configurations as well. The report also notes the arrival of HDMI port, SD card slot, and MagSafe for charging.

Intel Ponte Vecchio GPU Scores Another Win in Leibniz Supercomputing Centre

Today, Lenovo in partnership with Intel has announced that Leibniz Supercomputing Centre (LRZ) is building a supercomputer powered by Intel's next-generation technologies. Specifically, the supercomputer will use Intel's Sapphire Rapids CPUs in combination with the highly-teased Ponte Vecchio GPUs to power the applications running at Leibniz Supercomputing Centre. Along with the various processors, the LRZ will also deploy Intel Optane persistent memory to process the huge amount of data the LRZ has and is producing. The integration of HPC and AI processing will be enabled by the expansion of LRZ's current supercomputer called SuperMUG-NG, which will receive an upgrade in 2022, which will feature both Sapphire Rapids and Ponte Vecchio.

Mr. Raja Koduri, Intel graphics guru, has on Twitter teased that this supercomputer installment will represent a combination of Sapphire Rapids, Ponte Vecchio, Optane, and One API all in one machine. The system will use over one petabyte of Distributed Asynchronous Object Storage (DAOS) based on the Optane technologies. Then, Mr. Koduri has teased some Ponte Vecchio eye candy, which is a GIF of tiles combining to form a GPU, which you can check out here. You can also see some pictures of Ponte Vecchio below.
Intel Ponte Vecchio GPU Intel Ponte Vecchio GPU Intel Ponte Vecchio GPU Intel Ponte Vecchio GPU

Apple M2 Processor is Reportedly in Mass Production

Apple's M1 processors are a big success. When Apple introduced the M1 processors in the MacBook lineup, everyone was impressed by the processor performance and the power efficiency it offered. Just a few days ago, Apple updated its Mac lineup to feature these M1 processors and made it obvious that custom silicon is the way to go in the future. Today, we have information coming from Nikkei Asia, that Apple's next-generation M2 chip has entered mass production and that it could be on the way for as early as July when Apple will reportedly refresh its products. The M2 chip is made inside TSMC's facilities on a 5 nm+ N5P node. While there is no more information coming from the report about the SoC, we can expect it to be a good generational improvement.

Samsung Announces PM1653 SAS-4 Enterprise SSD

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced its launch of the industry's highest performing 24G SAS (SAS-4) SSD - the PM1653. Based on the latest SAS interface, the new drive can support twice the speed of the previous 12G SAS-3 generation. The PM1653 is also the industry's first 24G SAS SSD made with sixth-generation (1xx-layer) V-NAND chips, enabling storage capacities from 800 GB to 30.72 TB for advanced enterprise server systems.

"As the leading provider of SAS storage for a decade, Samsung has been offering the most advanced and reliable enterprise solutions in full support of the critical workloads of global server OEMs, governments and financial institutions. Samsung enterprise solutions are also accredited by the U.S. National Institute of Standards and Technology for the most powerful data security," said Kwangil Park, senior vice president of the Memory Product Planning Team at Samsung Electronics. "Like we have done with the PM1653, Samsung will continue to collaborate with our customers to accommodate the ever-growing demand of the enterprise server market for the most uncompromising offerings available."

Foundry Revenue Projected to Reach Historical High of US$94.6 Billion in 2021 Thanks to High 5G/HPC/End-Device Demand, Says TrendForce

As the global economy enters the post-pandemic era, technologies including 5G, WiFi6/6E, and HPC (high-performance computing) have been advancing rapidly, in turn bringing about a fundamental, structural change in the semiconductor industry as well, according to TrendForce's latest investigations. While the demand for certain devices such as notebook computers and TVs underwent a sharp uptick due to the onset of the stay-at-home economy, this demand will return to pre-pandemic levels once the pandemic has been brought under control as a result of the global vaccination drive. Nevertheless, the worldwide shift to next-gen telecommunication standards has brought about a replacement demand for telecom and networking devices, and this demand will continue to propel the semiconductor industry, resulting in high capacity utilization rates across the major foundries. As certain foundries continue to expand their production capacities this year, TrendForce expects total foundry revenue to reach a historical high of US$94.6 billion this year, an 11% growth YoY.

CPU-Z Enables Preliminary Support for Intel Alder Lake CPUs

CPU-Z, the CPU monitoring tool used to gather information about the processor your system is running on, has been updated with version 1.96. This new update doesn't change the software much but rather brings support for new hardware. Starting from this revision, Intel's upcoming Alder Lake CPUs have received preliminary support in the tool. To go along with CPUs, the software is now also enabled to recognize Intel's Z6xx motherboards that pair with Alder Lake processors. Alongside that, the software now also brings support for next-generation DDR5 memory, which is supposed to feature speeds anywhere from 4800 to 8400 MT/s. When it comes to AMD, the tool received an update that enables it to read information about AMD's Ryzen 5700G, 5600G, and 5300G APUs, and Radeon RX 6900 XT, 6800 (& XT), 6700 XT GPUs.
Download CPU-Z Version 1.96 Here.

NVIDIA Extends Data Center Infrastructure Processing Roadmap with BlueField-3 DPU

NVIDIA today announced the NVIDIA BlueField -3 DPU, its next-generation data processing unit, to deliver the most powerful software-defined networking, storage and cybersecurity acceleration capabilities available for data centers.

The first DPU built for AI and accelerated computing, BlueField-3 lets every enterprise deliver applications at any scale with industry-leading performance and data center security. It is optimized for multi-tenant, cloud-native environments, offering software-defined, hardware-accelerated networking, storage, security and management services at data-center scale.

NVIDIA Announces New DGX SuperPOD, the First Cloud-Native, Multi-Tenant Supercomputer, Opening World of AI to Enterprise

NVIDIA today unveiled the world's first cloud-native, multi-tenant AI supercomputer—the next-generation NVIDIA DGX SuperPOD featuring NVIDIA BlueField -2 DPUs. Fortifying the DGX SuperPOD with BlueField-2 DPUs—data processing units that offload, accelerate and isolate users' data—provides customers with secure connections to their AI infrastructure.

The company also announced NVIDIA Base Command, which enables multiple users and IT teams to securely access, share and operate their DGX SuperPOD infrastructure. Base Command coordinates AI training and operations on DGX SuperPOD infrastructure to enable the work of teams of data scientists and developers located around the globe.

SK Hynix to Build $106 Billion Mega Factory in South Korea

Today, we are getting a report coming from the South Korean press, stating that the country of South Korea has just given SK Hynix the green light to start building the mega factory complex. Being in the planning phase for a long time, the new mega factory is going to be located in Yongin, a city set 50 km south of the capital Seoul. The company expects to break ground with construction in Q4 of this year, and finish everything and start volume production of DRAM in 2025. When it comes to the size of the new mega factory, the plant is going to have an area of ​​4.15 million square meters.

The total cost of it will be about $106 billion worth of investment from SK Hynix, making all the recent fab construction plans look tiny compared to this massive investment. The mega factory complex would consist out of four fabs, where their total wafer per month output would be around 800,000. These foundries will be in charge of producing regular DRAM, and next-generation DRAM technologies like we have talked about just a few days ago. It remains to be seen what the company will come out with in the future, however, we are watching its moves closely.
SK Hynix Foundry

TSMC to Enter 4 nm Node Volume Production in Q4 of 2021

TSMC, the world leader in semiconductor manufacturing, has reportedly begun with plans to start volume production of the 4 nm node by the end of this year. According to the sources over at DigiTimes, Taiwan's leading semiconductor manufacturer could be on the verge of starting volume production of an even smaller node. The new 4 nm node is internally referred to as a part of the N5 node generation. The N5 generation covers N5 (regular 5 nm), N5P (5 nm+), and N4 process that is expected to debut soon. And perhaps the most interesting thing is that the 4 nm process will be in high-volume production in Q4, with Apple expected to be one of the major consumers of the N5 node family.

DigiTimes reports that Apple will use the N5P node for the upcoming Apple A15 SoCs for next-generation iPhones, while the more advanced N4 node will find itself as a base of the new Macs equipped with custom Apple Silicon SoCs. To find out more, we have to wait for the official product launches and see just how much improvement new nodes bring.

Team T-FORCE Gaming Launches the Next-Gen with Overclockable DDR5 Memory

TEAMGROUP has worked vigorously on the development of next-generation DDR5 memory. After completing validation tests for standard DDR5 U-DIMM and SO-DIMM products with the collaboration of major motherboard manufacturers, TEAMGROUP is announcing an exciting breakthrough today: its T-FORCE brand has successfully created DDR5 overclocking memory. Samples were immediately sent to ASUS, ASRock, MSI, and GIGABYTE for collaborative testing of its overclocking capability. Consumers can expect TEAMGROUP's products to be fully compatible with motherboards from the four major manufacturers when the DDR5 generation arrives.

The DDR5 overclocking memory has greater room for voltage adjustment, due to its upgraded power management IC. This PMIC can support high frequency overclocking with voltage over 2.6 V. In previous generations, voltage conversion was controlled by the motherboard. With DDR5, components were moved to the memory, enabling the module to handle the voltage conversion, which not only reduces voltage wear but also reduces noise generation. This allows significantly increased room for overclocking compared to the past, and more powerful computing processing.

SK Hynix Envisions the Future: 600-Layer 3D NAND and EUV-made DRAM

On March 22nd, the CEO of SK Hynix, Seok-Hee Lee, gave a keynote speech to the IEEE International Reliability Physics Symposium (IRPS) and shared with experts a part of its plan for the future of SK Hynix products. The CEO took the stage and delivered some conceptual technologies that the company is working on right now. At the center of the show, two distinct products stood out - 3D NAND and DRAM. So far, the company has believed that its 3D NAND scaling was very limited and that it can push up to 500 layers sometime in the future before the limit is reached. However, according to the latest research, SK Hynix will be able to produce 600-layer 3D NAND technology in the distant future.

So far, the company has managed to manufacture and sample 512Gb 176-layer 3D NAND chips, so the 600-layer solutions are still far away. Nonetheless, it is a possibility that we are looking at. Before we reach that layer number, there are various problems needed to be solved so the technology can work. According to SK Hynix, "the company introduced the atomic layer deposition (ALD) technology to further improve the cell property of efficiently storing electric charges and exporting them when needed, while developing technology to maintain uniform electric charges over a certain amount through the innovation of dielectric materials. In addition to this, to solve film stress issues, the mechanical stress levels of films is controlled and the cell oxide-nitride (ON) material is being optimized. To deal with the interference phenomenon between cells and charge loss that occur when more cells are stacked at a limited height, SK Hynix developed the isolated-charge trap nitride (isolated-CTN) structure to enhance reliability."

AMD's Next-Generation Van Gogh APU Shows Up with Quad-Channel DDR5 Memory Support

AMD is slowly preparing to launch its next-generation client-oriented accelerated processing unit (APU), which is AMD's way of denoting a CPU+GPU combination. The future design is codenamed after Van Gogh, showing AMD's continuous use of historic names for their products. The APU is believed to be a design similar to the one found in the SoC of the latest PlayStation 5 and Xbox Series X/S consoles. That means that there are Zen 2 cores present along with the latest RDNA 2 graphics, side by side in the same processor. Today, one of AMD's engineers posted a boot log of the quad-core Van Gogh APU engineering sample, showing some very interesting information.

The boot log contains information about the memory type used in the APU. In the logs, we see a part that says "[drm] RAM width 256bits DDR5", which means that the APU has an interface for the DDR5 memory and it is 256-bit wide, which represents a quad-channel memory configuration. Such a wide memory bus is typically used for applications that need lots of bandwidth. Given that Van Gogh uses RDNA 2 graphics, the company needs a sufficient memory bandwidth to keep the GPU from starving for data. While we don't have much more information about it, we can expect to hear greater details soon.

Apple is Discontinuing Intel-based iMac Pro

According to the official company website, Apple will no longer manufacture its iMac Pro computers based on Intel processors. Instead, the company will carry these models in its store, only while the supplies last. Apple will be replacing these models with next-generation iMac Pro devices that will be home to the custom Apple Silicon processors, combining Arm CPU cores with custom GPU design. Having a starting price of 4990 USD, the Apple iMac Pro was able to max out at 15000 USD. The most expensive part was exactly the Intel Xeon processor inside it, among the AMD GPU with HBM. Configuration pricing was also driven by storage/RAM options. However, even the most expensive iMac Pro with its 2017 hardware had no chance against the regular 2020 iMac, so the product was set to be discontinued sooner or later.

When the stock of the iMac Pro runs out, Apple will replace this model with its Apple Silicon equipped variant. According to the current rumor mill, Apple is set to hold a keynote on March 16th that will be an announcement for new iMac Pro devices with custom processors. What happens is only up to Apple, so we have to wait and see.

Micron Launches Low-Power Memory Qualified for Automotive Safety Applications

Micron Technology, Inc. today announced that it has begun sampling the industry's first automotive low-power DDR5 DRAM (LPDDR5) memory that is hardware-evaluated to meet the most stringent Automotive Safety Integrity Level (ASIL), ASIL D. The solution is part of Micron's new portfolio of memory and storage products targeted for automotive functional safety based on the International Organization for Standardization (ISO) 26262 standard.

Micron's functional safety-evaluated DRAM is compatible with advanced-driver assistance system (ADAS) technologies, including adaptive cruise control, automatic emergency braking systems, lane departure warning and blind spot detection systems. Micron's LPDDR5's high performance, superior power efficiency and low latency provide the requisite performance and headroom to keep pace with increasing bandwidth requirements of next-generation automotive systems.

"Autonomous vehicles promise to make our roads safer, but they need powerful, trusted memory that can enable real-time decision-making in extreme environments," said Kris Baxter, corporate vice president and general manager of Micron's Embedded Business Unit. "To fulfill this growing market need, we've optimized our automotive LPDDR5 to deliver the utmost performance, quality and reliability for the smart, safe cars of tomorrow."
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