TSMC is moving quickly toward a major production milestone, aiming to bring four 2 nm fabs online by 2026, with a combined capacity of more than 60,000 wafers per month. In Kaohsiung's Nanzi park, TSMC has already started installing next-generation lithography scanners in Fab 22's new cleanroom. Its existing P1 line is running at roughly 10,000 wafers per month, and teams worked through the night to equip the neighboring P2 hall. Trial wafers from P2 are expected before Christmas, which would increase Kaohsiung's total output to more than 30,000 wafers per month by the end of the year. Meanwhile, a third building, P3, is rising nearby to support the upcoming A16 node, and P4 and P5 are in the early stages of permitting. About 200 km to the north in Hsinchu's Baoshan district, Fab 20 has also made rapid progress. Its P1 section has completed risk-ramp testing and is shifting to full volume production, while P2 is fully tooled and awaiting qualification lots.

Together, they are projected to add another 30,000 to 35,000 wafers this year, and P3 and P4 structures are already under concrete to serve the A14 generation. All four sites will utilize TSMC's first-generation nanosheet architecture, which reduces switching power by 25% and increases transistor density by 15% compared to the 3 nm node. Although each 300 mm wafer will cost approximately US $30,000, a roughly 50 percent premium over current 3 nm wafers, TSMC has already secured more design wins from Apple, Qualcomm, and MediaTek at this stage than it saw for its 3 nm and 5 nm nodes. Analysts estimate that these four fabs could support up to US $2.5 trillion in downstream electronics revenue over the next five years. Construction crews now work around the clock, and the push to reach 60,000 wafers per month is well underway.