According to Economic Daily News, TSMC is overhauling Fab 15A in Central Taiwan Science Park, transitioning it from 28/22 nm to 4 nm production. Old equipment is being cleared out and replaced with new tooling, and the total bill (cleanrooms and machinery included) is expected to top NT$100 billion (US$3.16 billion). The displaced 28/22 nm tools aren't going to waste either, heading to TSMC facility in Dresden, Germany, which is ramping toward mass production in 2027 on mature nodes aimed at the automotive and industrial market. Fab 15B stays on 7 nm for now. Further up the process roadmap, TSMC's 1.4 nm fab at the Phase 2 Central Taiwan site in Taichung is coming together faster than planned. Groundwork is mostly completed and construction bidding is expected to start shortly. If things keep moving at this pace, trial production could start as early as Q3 2027, with full mass production following in the second half of 2028.

There are also talks of 1 nm arriving at the Central Taiwan site earlier than previously expected. Worth noting that 1.4 nm isn't part of TSMC's US fab plans at all. Once all four Phase 2 fabs are running at capacity, the Taichung complex is expected to be the single largest production base for AI and HPC chips anywhere in the world. In April, TSMC introduced its A13 (1.3 nm) process at the 2026 North America Technology Symposium as a direct shrink of the previously announced A14 (1.4 nm) node. The new node offers around 6% area reduction, along with improved performance and power efficiency through design-technology co-optimization. The A13 node remains fully backward compatible with A14 design rules to allow easier migration. TSMC A13 node is expected to enter mass production in 2029, one year after A14.