Tuesday, July 28th 2026
Intel "Nova Lake-S" 12 Xe3P iGPU to Draw Up to 65 Watts
Intel's upcoming "Nova Lake-S" is gearing up for a launch later this year. However, rumors suggest that certain "Nova Lake-S" models with large integrated graphics might require significant power, increasing the TDP and peak power. According to the well-known Intel leaker Jaykihn on X, Intel's 16-core CPU SKU with 12 Xe3P cores will need specialized power delivery, with 65 W dedicated to integrated graphics. This SKU includes four P-Cores, eight E-Cores, and four LPE-Cores, along with 12 Xe3P GPU cores. This 4+8+8+12 core configuration is one of the few processors where integrated graphics require two VCCGT phases. In regular SKUs, VCCGT is a single-phase power rail for the integrated graphics inside the processor. However, since Intel aims to enhance its iGPU performance with "Nova Lake," a single phase is insufficient.
Previously, we learned that Intel's top-end, overclocking-focused, dual compute die "Nova Lake-S" CPU with 52 cores will feature a PL2 mode with a power level of 474 W. This also includes the possibility of three 8-pin CPU power connectors on high-end Z990 motherboards, an intriguing design choice considering that most enthusiast boards typically have two 8-pin EPS CPU connectors. The three 8-pin connectors are mainly intended for the highest-end overclocking designs, rather than being necessary for running the dual compute die designs. Motherboards with either two or three EPS connectors are still expected to support Intel's upcoming high-end 44-core and 52-core processors on the 175 W platform. However, we are likely to see various configurations, and motherboard designs are preparing for higher TDPs. Below image is illustration only.
Finally, we also know that the lower-end SKUs are expected to arrive first. Intel has SKUs coming with either one or two compute dies, featuring up to eight "Coyote Cove" P-Cores and 16 "Arctic Wolf" E-Cores, along with four LPE-Cores that are part of the I/O die. Depending on the SKU, Intel can include a single compute die for up to 28 cores total or two compute dies for a 52-core CPU SKU. It seems that the single compute die version will arrive first, with the dual compute die variants following. The 28-core "Nova Lake-S" DS version, a new SKU segment, is expected to launch in Q1 of 2027. For the regular overclocking-focused "K" SKUs, Intel reportedly plans an early Q2 launch between March and April.
Source:
Jaykihn on X
Previously, we learned that Intel's top-end, overclocking-focused, dual compute die "Nova Lake-S" CPU with 52 cores will feature a PL2 mode with a power level of 474 W. This also includes the possibility of three 8-pin CPU power connectors on high-end Z990 motherboards, an intriguing design choice considering that most enthusiast boards typically have two 8-pin EPS CPU connectors. The three 8-pin connectors are mainly intended for the highest-end overclocking designs, rather than being necessary for running the dual compute die designs. Motherboards with either two or three EPS connectors are still expected to support Intel's upcoming high-end 44-core and 52-core processors on the 175 W platform. However, we are likely to see various configurations, and motherboard designs are preparing for higher TDPs. Below image is illustration only.
32 Comments on Intel "Nova Lake-S" 12 Xe3P iGPU to Draw Up to 65 Watts
Strix Point was supposed to have IC by the way. But it was replaced with the NPU block.
By the same source that this article used, Jaykihn on twitter, like a week before that report came out, no, only the 4+0 compute tiles will be on 18A.That never really should have been a reason why, at the very least, the 4+8 compute tile wouldn't have been fabbed internally. That die would be, by all means, very small. Much smaller than even PTL, which was the lead 18A product. And PTL's 18A compute tile itself was also smaller than many flagship smartphone chip die sizes.
The problem is that you lose perf and power by not using N2P. Plus you would need to spend a sizable amount of money tooling the empty shells.
What's really interesting though is that AMD is rumored to be using N3 for most of their mainstream mobile lineup too for Zen 6, so why Intel would feel the need to use a more advanced leading edge node rather than their on par 18A-P stuff is kinda confusing.
Every single major "leaker" (MLID, Bionicsquash, Jaykihn, Raichu, etc etc) has at least the 8+16 tile as being external (which the analyst report that you cite also thinks got moved over to 18A).
Also mind you, I don't know why you would believe the report more, when by now it should be much too late to switch over compute tiles like how the report suggested. Even if we believe the 4+8 tile development could have been resurrected with only a minor delay, as we had rumors of 4+8 being on 18A-P too at one point, the 8+16 tiles switching over like the report suggests would have added a significant delay, as that was allegedly always supposed to be N2.
Sounds very ARL-esque, where only the 6+8 tile was once upon a time rumored to be internal (and we know Intel officially did claim they had a 20A compute tile in development that got canned) and the 8+16 tile was always supposed to be external lol.From what we see in PTL, where the frequency/power curve is pretty much identical to N3B, 18A does not have better or even the same perf/watt as N2.Remember, most Zen 4 server skus had no good Fmax gains over Zen 3 server either. And yet client saw a very good Fmax bump.
And Zen 5 server had most skus see a very nice bump in Fmax... and Zen 5 client was the only Zen DT generation afaik to see no Fmax bump.
And specifically for Fmax, that's where 18A looks the least impressive. Don't forget Panther Lake is a 300mhz regression in Fmax vs ARL-H. BSPD also brings thermal density challenges that could challenge Fmax in DT.
As for the timeline there's a low chance of any console launching next year let alone a handheld which initial rumors pointed at being original MSRP Steam Deck priced. While they might get away with a $1000+ console the chances of a $750+ handheld console being viable is extremely low.
18A-P does seem to have some improvements that will help in the Fmax department for sure though, and there is that rumored 8+0 bLLC desktop gaming 18A-P tile rumored to be coming out in 2027 that is based on NVL IP (though allegedly will launch with the RZL lineup).