ASRock Rack is promising up to 4 TB of DDR5 on a single socket with its DMRD16-2L+, one of the first motherboards built for Intel's upcoming Xeon 7 "Diamond Rapids" processors. The board was shown at the OCP Global Summit 2026 and has since been detailed by ServeTheHome. It has 16 DIMM slots in a one-DIMM-per-channel layout, matching the 16-channel memory setup Intel detailed at HOT CHIPS. Regular RDIMMs top out at 128 GB per module and 8000 MT/s, while MRDIMMs run at up to 12,800 MT/s, with taller 2U MRDIMMs reaching 256 GB each. Populate all 16 slots with those, and you hit 4 TB, along with a theoretical bandwidth of roughly 1.6 TB/s.

Expansion is unusual, with no standard PCIe slots and no OCP NIC 3.0 connector. All I/O goes through up to 16 MCIO x8 connectors, each rated for PCIe 6.0 or CXL 3.0, for 128 lanes in total. The rest is fairly basic: one PCIe 5.0 x4 M.2 slot, two Intel I350 Gigabit Ethernet ports, an ASPEED AST2700 BMC with a dedicated management port, and VGA output. ASRock Rack fits it all on a 12 x 13-inch EEB PCB, about the size of a large E-ATX board, so it could squeeze into some bigger workstation cases. Pricing and availability have not been shared yet, but that is hardly surprising, since Intel has the Xeon 7 family slated for a 2027 debut on the new LGA9324 socket. The board is aimed at servers, though anyone planning a high-memory workstation for local AI will probably keep an eye on it.

Maxsun has shared full specifications for the SK-PTLNAS and SK-WCLAIO, two NAS-focused MoDT (Mobile on Desktop) motherboards built around Intel's Panther Lake and Wildcat Lake chips. Both were first shown at Computex 2026 and are expected to launch this month, though pricing is still unknown. The SK-PTLNAS now tops out at the Core Ultra 9 386H, a 16-core chip with four Xe3 GPU cores, a 25 W base power and up to 80 W of turbo power. The Computex listing mentioned options up to the Core Ultra X9 388H, which no longer seems to be on the table. It supports up to 128 GB of DDR5-7200 memory across two SO-DIMM slots, with five M.2 slots and three Mini SAS ports for storage. The board also gets a PCIe 5.0 x8 slot, 10GbE, 2.5GbE and two 1GbE ports, plus two Thunderbolt 4 ports. Maxsun lists Windows 11 and Ubuntu support.

The SK-WCLAIO measures just 90 x 165 mm, a big change from the mATX design shown in June. It runs the six-core Core 7 350 (2P + 4LPE) with two Xe3 cores, a single DDR5-6400 SO-DIMM slot for up to 48 GB, 1 TB of onboard UFS 3.1 storage and four M.2 slots. Wildcat Lake has very few PCIe lanes, so those drives probably won't each get full x4 bandwidth. Maxsun rates the system at 45 W when active and 16 W with drives on standby, which should suit an always-on home NAS. The power input is a bit unclear for now, since the listing mentions both a 12 V DC jack and USB-C PD.

Beelink today announced the Kickstarter launch of the ME Pro, a modular NAS available in two-bay and four-bay configurations. Its swappable motherboard design lets users upgrade performance or add drive bays as their needs change. The ME Pro uses cooling and vibration damping to help reduce operating noise and comes with Fygo OS preinstalled for file sync, backup, and remote access.

Modular Hardware for Flexible Upgrades and Quiet Operation

• Swappable motherboard modules. A slide-out design supports compatible Intel and AMD motherboard modules. The same module can move between compatible two-bay and four-bay enclosures in either direction, so users can keep their existing motherboard when expanding storage.
• Compact, one-piece metal chassis. The enclosure takes up about 50% less space than NAS systems with the same number of drive bays, making it easier to fit on a desk or in a living room or studio.
• Cooling and vibration control. Thermally conductive silicone and aluminium brackets draw heat away from the drives. A vapor chamber and internal blower distribute and dissipate heat, while a tightly secured assembly helps reduce vibration noise. The ME Pro is designed for round-the-clock operation, with noise levels as low as 34 dB.

As spotted by Club386, two motherboards based on Intel's Z970 chipset have shown up in the NBD shipping database, which logs Vietnamese customs records. Going by the names, both appear to be from ASRock: the Z970 LiveMixer WiFi and the Z970 Pro-A WiFi. The entries refer to PCBs shipping at the end of September 2026. The Z970 chipset is rumored to support CPU multiplier overclocking, but not the base clock tweaking that Z990 is expected to offer. Leaker Jaykihn has also previously reported that it will replace most of the market the B860 covers today. If that ends up being the case, it would be a big change, since Intel has kept CPU overclocking on its most expensive chipset for years, while AMD allows it on most of its B-series boards.

Intel's Robert Hallock has previously said the goal is more unlocked SKUs over time, and that overclocking shouldn't be reserved for the people paying the most. It looks like that approach could extend to motherboards too. Of course, Intel hasn't announced Z970 or Z990 yet, so this is all unofficial, and we don't know what the prices of either would look like. Moreover, shipments this early don't necessarily mean retail boards are close. Intel has reportedly promised more details at CES in January 2027, which fits the rumored CES 2027 launch window. If Z970 does arrive at B860 prices, it could be the most interesting platform for most builders.

Haswell owners finally have a way to get Resizable BAR running on Intel 8-series motherboards. As spotted by Haze on X, a developer going by roschank has released reBART, an open-source UEFI driver for Z87, H87, Q87, B85, Q85, and H81 boards. Back in 2020, it was reported that Intel CPUs since Haswell support Resizable BAR, pending firmware updates from motherboard makers that never came for 8-series. The developer went digging after failing to get Above 4G Decoding working on their own B85 board, and found that Intel's 8-series platform code skips mapping memory above 4 GB altogether, something both 7-series and 9-series firmware handle. Apparently, every board maker they checked inherited the same gap, so the 4G toggle some of these BIOSes expose likely does nothing.

reBART lets the board boot normally and only kicks in right before the OS loads. At that point, it shifts the GPU's memory window up past the 4 GB line and points the boot display at the new location too. Unlike ReBarUEFI, it doesn't need module patching, though a DSDT patch is still required. Newer builds added experimental support for Intel Arc cards and multi-GPU setups, which is important since Intel once told Arc buyers without ReBAR to stick with other vendors. One user reports an Arc A750 and an Arc B580 both working with an unlimited BAR size on a Gigabyte GA-Z87M-D3H under Ubuntu. Of course, going this route means flashing a modified BIOS, and at least one ASUS Z87-Plus owner couldn't get the board to boot after the DSDT patch. The developer hasn't shared any performance numbers yet either.

GIGABYTE, a global leader in high-performance computer hardware, today announced the WRX90 AI TOP workstation motherboard, supporting AMD Ryzen Threadripper PRO series processors. Engineered specifically for local AI workloads and intensive computing, the motherboard features multi-GPU PCIe 5.0 expansion slots, high-capacity ECC memory support, and enterprise-grade BMC remote management. It provides a robust, highly extensible hardware foundation for professionals to deploy dedicated local AI platforms and manage model development on-premises.

Scale Up for AI Development
To support evolving AI applications, the WRX90 AI TOP allows organizations to configure and expand their hardware as computational workloads grow. Equipped with seven PCIe 5.0 x16 slots and two MCIO 8i connectors, the motherboard offers extensive bandwidth capable of supporting up to nine GPU devices through compatible expansion hardware. Complementing this expansion capacity, eight-channel DDR5 memory support accommodates up to 2 TB of ECC RDIMM for large datasets and memory-intensive applications. The inclusion of Error-Correcting Code (ECC) memory automatically detects and corrects data corruption, ensuring data integrity during prolonged AI computing sessions.

Printed circuit boards (PCBs) are the foundation of every PC component, as they mount everything and connect the entire system using electrical components, wiring, and more. However, we are about to enter another phase of consumer electronics price hikes, as these PCBs are now experiencing severe component shortages projected to last until 2030. According to Nikkei Asia, an unnamed executive from an American PC maker told the publication that PCB manufacturers are confirming this situation, with some predicting that orders placed today may not be fulfilled until late 2028.

American PC Maker for Nikkei AsiaEven though PC shipments could decline again next year, we are still struggling to secure enough PCB supplies to meet our needs.

Intel Arc cards have always leaned heavily on Resizable BAR, to the point where Intel once told Alchemist buyers without it to stick with other vendors, and TechPowerUp's B580 review listed it as required for good performance. As spotted by Videocardz, developer Rod Burlamaqui has now released arc-rebar, a Linux tool that turns it on for Arc GPUs on motherboards that never got a ReBAR option. It runs from the initramfs at every boot, before the GPU driver loads, and doesn't touch the BIOS, kernel, or Intel's drivers. That sets it apart from earlier workarounds like ReBarUEFI, which has to be added to the motherboard's firmware.

The fix targets the PCIe switch built into Arc cards, whose small upstream BAR blocks Linux from enlarging the GPU's memory window. arc-rebar writes the card's ReBAR register, then removes and rescans the root port. Intel engineers have proposed a kernel-level fix for this, though it hasn't been merged yet. On a Supermicro X9DRH-7TF with dual Xeon E5-2670 v2 CPUs and a 2015 BIOS, a B580 went from 256 MiB of CPU-visible VRAM to a 16 GiB window covering all 12 GB. Measured VRAM bandwidth jumped from 15 GB/s to 392 GB/s, and a 4K Vulkan blur that used to stall ran at 39 to 50 FPS.

Axiomtek, a world-renowned leader relentlessly devoted to the research, development, and manufacture of innovative, highly efficient, and reliable industrial computer products, proudly introduces the MANO330, a compact Thin Mini-ITX motherboard powered by the Intel Processor N97 or N150 and DDR5 memory. Designed for space-constrained systems that require flexible connectivity and expansion, the MANO330 combines multi-display capability, dual LAN connectivity, versatile M.2 expansion, and industrial I/O in a compact platform. With a wide 12-24 VDC power input, the MANO330 provides system developers with a flexible foundation for smart manufacturing and industrial automation, digital signage, smart retail, and POS applications.

Compact Performance for Space-Constrained Systems
The MANO330 combines a compact Thin Mini-ITX design with Intel Processor N97 or N150 and DDR5-4800 memory support. The N97 supports up to 32 GB of memory, while the N150 supports up to 16 GB. Measuring just 170 x 170 mm, the MANO330 provides the essential computing performance and I/O capabilities needed for embedded systems, helping developers build space-efficient solutions for a wide range of industrial and commercial applications.

Colorful has just released its latest overclocking motherboard, the X870E Ultra-S V14, a new E-ATX unit with 16+2+1 power phases, five M.2 slots, and plenty of high-speed I/O. The new motherboard, as shared by IT Home, is priced at 1,899 CNY, which comes out to around $284 at the time of writing, although it only seems to be available in China for the time being. The iGame X870E Ultra-S V14 is explicitly marketed to overclockers on AMD's AM5 platform, bearing XMP/EXPO memory overclocking and asynchronous BCLK CPU overclocking, a digital debug display, EZ Debug diagnosis, and easily accessible rear I/O buttons for both clear CMOS and BIOS updates.

The motherboard also features Wi-Fi 7 and 5 GbE networking built-in, alongside expansive rear I/O that includes: 4× USB Type-A 5 Gbps, 3× USB Type-A 10 Gbps, 2× USB Type-A 2.0, 2× USB4 40 Gbps, and both 3.5 mm line in/out ports and SPDIF out for audio. Colorful claims that its 16+2+1 VRMs are capable of 80 A, and the VRMs are covered by beefy aluminium heat sinks. It also has five M.2 slots for expanded storage, each with its own heat sink. The Colorful iGame X870E Ultra-S V14 is available on JD.com at the time of writing.

BIOSTAR, a leading manufacturer of consumer and industrial motherboards, edge computing solutions, graphics cards, and storage devices, today introduced the BIWCL-PAT industrial motherboard. Powered by Intel Core Series 3 (Wildcat Lake) processors, the BIWCL-PAT brings triple independent displays, high-speed NVMe storage expansion, and versatile wired and wireless connectivity into a small-form-factor platform. Designed for system integrators, it supports applications across industrial automation, AIoT, and edge computing, as well as human-machine interfaces (HMI), POS systems, and self-service kiosks.

With a 148 × 102 mm footprint, the BIWCL-PAT is built for integration into space-constrained equipment. It supports processor options from Intel Core 3 to Intel Core 7, and its single DDR5-6400 SO-DIMM slot supports up to 64 GB of memory, providing capacity for multitasking and local data processing. This combination gives developers a solid foundation for systems that bring computing closer to factory equipment, retail terminals, and networked devices.

Gigabyte launched the B760M AORUS Ari WiFi6E DDR4 microATX motherboard for the Intel LGA1700 platform, adding PCIe 5.0 support and its AORUS anime theme. The board relies on DDR4 memory instead of DDR5, a choice made possible by the B760 chipset that supports both technologies. With DDR5 reaching record prices and limited availability, the still considerably cheaper DDR4 memory came as a logical option nowadays. The layout is almost identical to last year's B760M AORUS Elite WIFI6E GEN5, with DDR5 replaced by DDR4 and the Ari anime theme added to the board. It supports Intel's 12th, 13th, and 14th Gen processors and implements a 12+1+1 phase hybrid VRM. As part of Gigabyte VRM Thermal Armor feature, dedicated heatsinks are placed on the VRM, PCH and M.2 slots. The four DDR4 DIMM slots support up to 128 GB DDR4-5333 via XMP profiles or manual overclocking. The primary PCIe 5.0 x16 slot features a quick-release design with a second PCIe 4.0 x4 slot from the chipset. For storage, the motherboard offers two PCIe 4.0 x4 M.2 slots with screwless installation, alongside four SATA ports.

The board has 2.5 GbE LAN and Intel Wi-Fi 6E AX210 connectivity with a Wi-Fi Compass feature that automatically detects the best antenna position. Rear I/O panel includes USB-C ports at 20 Gbps, DisplayPort, and HDMI 2.1 with 4K output. The front USB-C header runs at 10 Gbps, while for audio we have a Realtek ALC1220 codec. Other features include Q-Flash Plus for BIOS updates without a CPU installed and Smart Fan 6 for fan control. The B760M AORUS Ari WiFi6E DDR4 is available in Japan for ¥26,800, around $170.

ASRock Industrial proudly presents its latest lineup of industrial edge computing platform powered by Intel Core Series 3 processors (Wildcat Lake-U), designed to bring power-efficient computing and integrated AI acceleration to mainstream industrial and embedded edge applications. Featuring integrated CPU, GPU, and NPU compute engines with up to 40 platform TOPS, the new platforms support up to 64 GB DDR5 6400 MHz memory, high-speed expansion and storage, rich I/O connectivity, and multi-display capabilities. Spanning industrial motherboards, NUC motherboards, and compact NUC BOX systems, ASRock Industrial's Intel Core Series 3 portfolio provides right-sized computing options for industrial control, HMI, intelligent gateways, smart retail, digital signage, and other mainstream edge applications.

NUC Core 300 BOX Series: Compact, Power-Efficient Edge Computing
The NUC BOX-320 and NUC BOX-304 integrate Intel Core Series 3 processors into compact fanned embedded BOX PCs, powered by the Intel Core 5 processor 320 and Intel Core 3 processor 304, respectively. The systems support up to 64 GB of single-channel DDR5 6400 MHz memory with In-Band ECC. For expansion, the systems provide one M.2 Key E (2230) slot with Wi-Fi 6E and Bluetooth 5.3 for wireless connectivity. Networking includes one Intel 2.5 Gigabit LAN and one Realtek 2.5 Gigabit LAN. Storage configuration includes one M.2 Key M (2242) slot with PCIe Gen 4 x1 and one M.2 Key M (2242/2280) slot with PCIe Gen 4 x2 for SSDs. I/O connectivity includes two USB 3.2 Gen2x2 Type-C and three USB 3.2 Gen 1 Type-A ports. The series supports triple-display output up to 4K through two HDMI 2.1 and DisplayPort 1.4a outputs from Type-C. Intel PTT and a 19 V/90 W power adapter further support secure, ready-to-deploy system integration. Built in a compact 117.5 x 110 x 49 mm fanned chassis with VESA mounting support, the NUC Core 300 BOX Series provides a space-efficient computing platform for smart retail, digital signage, kiosks, HMI, and other mainstream edge applications.

MSI quietly added three new B550 motherboards to its AM4 lineup, one microATX model and two ATX boards. The new models are the PRO B550M WIFI6E, PRO B550-S, and B550-S WIFI6E, all targeting AMD's Ryzen 3000, 4000G and 5000 processors. The PRO B550M WIFI6E is the microATX model measuring 243.84 x 210 mm. MSI opted for a spartan layout with only a tiny radiator on top of the AMD B550 chipset. The motherboard has two DDR4 DIMM slots supporting memory up to 4600+ MT/s (OC). For expansion, there is one PCIe 4.0 x16 slot and two PCIe 3.0 x1 slots, with one M.2 slot and four SATA 6 Gb/s ports for storage. The M.2 slot runs at PCIe 4.0 x4, while the wireless connectivity is provided by a pre-installed Wi-Fi 6E module.

The PRO B550-S and B550-S WIFI6E are full-size ATX boards measuring 243.84 x 304.8 mm. MSI opted for a more robust cooling package with dedicated heatsinks for the VRM, chipset and M.2 slot. Both feature four DDR4 DIMM slots with support for up to 128 GB and up to 4800+ MT/s (OC). The boards have two PCIe x16 slots, one PCIe x1, two M.2 slots, and four SATA ports. The first M.2 slot supports PCIe 4.0 x4, while the second runs at PCIe 3.0 x4. There are USB 5 Gbps Type-A and Type-C ports, along with 10 Gbps Type-A and Type-C ports on the rear I/O. The B550-S WIFI6E adds a pre-installed Wi-Fi 6E module. All three boards use the Realtek ALC897 7.1-channel audio codec and Realtek RTL8111H Gigabit Ethernet. MSI has not yet announced pricing or international availability.

BIOSTAR, a leading manufacturer of consumer and industrial motherboards, edge computing solutions, graphics cards, and storage devices, is currently presenting its latest innovations at Embedded World North America 2026, running from September 22 to 24 at the Anaheim Convention Center in California, USA. At Hall B, Booth 6512, BIOSTAR is spotlighting its comprehensive industrial motherboards, advanced EdgeComp systems, and a cutting-edge EdgeComp MT-N150 DX-M1 edge AI demonstration, delivering high-performance computing solutions tailored for smart manufacturing, smart cities, and smart retail applications.

BIOSTAR's industrial motherboard lineup features the BIW88-AHS, BIH61-AHA, BIPTL-IHT, BITWL-IHT, BIWCL-IHT, BIWCL-PAT, BIRPL-PAT, and BIAST-PAT, offering a versatile range of computing platforms, form factors, and connectivity options for embedded system development. Highlights include the BIW88-AHS, which combines the Intel W880 platform with support for Intel Core Ultra 200 series processors, DDR5 ECC and non-ECC memory, and four 2.5GbE LAN ports. The BIPTL-IHT features the Intel Panther Lake-H platform, DDR5 memory, and quad-display support, while the Wildcat Lake-based BIWCL-IHT and BIWCL-PAT provide Mini-ITX and 3.5-inch single-board computer options, respectively.

Some Z990 motherboards for Intel's upcoming Nova Lake platform have started showing up in shipping records, suggesting the launch is getting closer. Club386 spotted at least five boards with "Z990" in their names listed in customs data from Taiwan and Vietnam, dated July 2026.

Z990 is expected to be the flagship chipset for Nova Lake-S, Intel's next Core Ultra desktop lineup on the new LGA1954 socket. Intel is also prepping a cheaper Z970 chipset that keeps multiplier overclocking but offers a less diverse expansion suite overall. Also, these aren't the first Z990 boards spotted in the wild either. A Gigabyte AORUS Z990 Pro turned up at Computex earlier this year with its socket taped over, though the branding gave it away. With boards already moving through shipping channels, Nova Lake's early 2027 window looks increasingly realistic, though the rumored 52-core flagship apparently won't arrive until later in the year.

Colorful Technology Company Limited, a leading brand in gaming PC components, gaming laptops, and Hi-fi audio products, is opening a new chapter in the Japanese market through a strategic partnership with CFD Sales Inc. (CFD), a well-established Japanese hardware distributor. As part of this renewed market expansion, COLORFUL's flagship iGame graphics card series and BATTLE-AX motherboards will officially go on sale in Japan on September 16, ahead of TOKYO GAME SHOW 2026. The iGame graphics card series will also be showcased as part of CFD's new gaming brand, Crowxis, at the event.

Beginning September 16, Japanese customers will be able to purchase COLORFUL iGame graphics cards and BATTLE-AX motherboards through CFD's local distribution channels. Product and availability details will be available on the official CFD website. COLORFUL's partnership with CFD represents an important step in strengthening its presence among Japanese PC DIY enthusiasts and gamers, while bringing its latest graphics card and motherboard products to the Japanese market.

Maxsun has launched three new B850 microATX motherboards for the AM5 platform supporting AMD Ryzen series processors: MS-B850M I-CAFE, B850M-P WIFI and B850M-B WIFI. The Maxsun MS-B850M I-CAFE measures 245 x 210 mm and features two DDR5 DIMM slots supporting up to 128 GB at DDR5-8000 OC. It has one PCIe 5.0 x16 and one PCIe 4.0 x4 slot, two M.2 slots (PCIe 5.0 and PCIe 4.0), two SATA ports, 2.5 GbE, and HDMI 1.4 for integrated graphics. The board has no Wi-Fi but includes four USB 5 Gbps and two USB 2.0 Type-A ports at the rear. The two Challenger models share most of their specs. Both have PCIe 5.0 x16 and PCIe 4.0 x4 expansion slots, two M.2 slots, two SATA ports, Wi-Fi 6 and Bluetooth 5.2 via MediaTek MT7902, 2.5 GbE, a USB-C 20 Gbps front header, and four USB 5 Gbps plus four USB 2.0 on the rear. The main difference is memory support and size: the B850M-P WIFI is the larger motherboard at 245 x 245 mm and supports four DIMM slots for up to 256 GB of DDR5. The B850M-B WIFI is more compact at 245 x 215 mm with two slots supporting 128 GB. Both motherboards feature HDMI 2.0 and dual DisplayPort 4K at 60 Hz for integrated graphics output.

All three motherboards use a Realtek ALC897 audio codec. Pricing and availability for the full lineup have not been officially announced, though the MS-Challenger B850M-P WIFI has appeared listed on the Chinese market at CNY 799 (around $119) at the time of writing.

DFI, a Qisda Group company and a global leader in embedded motherboards and industrial computers, introduces the ARH171/ARH173, expanding its AI-ready portfolio with a Mini-ITX platform built for space-constrained, mission-critical deployments. Powered by Intel technologies, the ARH171/ARH173 is purpose-built to handle demanding Physical AI workloads from perception to reasoning, enabling next-generation smart logistics and industrial automation.

As Physical AI transitions to operational deployment, intralogistics is driving rapid mobile automation adoption. Mordor Intelligence projects the autonomous mobile robot (AMR) market to expand at a CAGR of nearly 15% through 2029 to counter labor shortages, while advanced systems like 3D cube storage robots require on-device AI to navigate floors, climb racks, and process dense sensor streams in real time.

AAEON (Stock Code: 6579), today announced the release of two new microATX industrial motherboards featuring Intel Core Ultra 200S Series Processors (formerly Arrow Lake-S), the MAX-Q870A and MAX-H810A.

The two boards are compatible with a range of Arrow Lake-S CPUs, with the MAX-Q870A supporting up to 125W SKUs and the MAX-H810A supporting up to 65 W SKUs. This difference reflects the market positioning of the two boards, with the former marketed for advanced AI and machine vision use and the latter for more cost-efficient industrial automation and HMI applications.

A Ryzen 9 9950X3D has reportedly died just an hour after being moved into an ASUS ROG Crosshair X670E Hero motherboard. According to Reddit user SpecialistConcept423, posting in r/GamersNexus, the chip had been running fine for about a year and a half in an ASRock X670E Taichi Carrara before the swap. After switching to the new board, no manual overclocking or voltage tweaks were applied; only one of the board's built-in memory presets was enabled for a set of SK hynix 6200 MHz modules. After saving that setting and rebooting, the board threw a "00" Q-Code and refused to post. Pulling the CPU and inspecting it revealed two brown marks on its contacts, which all but confirmed the catastrophic failure.

Things got stranger when the user resorted to an older Ryzen 5 8500G that had previously worked fine on the same board. That chip apparently now throws a "4D" code too, pointing at the motherboard itself as the culprit, not just the CPU. There's no confirmation yet on whether a faulty BIOS, a bad batch of boards, or something else is to blame, and ASUS hasn't commented on this specific case. It is worth noting that the ASUS board was not new, and it had undergone USB-related repairs and a BIOS rewrite. The user has since contacted AMD in Brazil for an RMA, but has shared no updates yet.

Another increase in motherboard prices looks likely, according to a report from the Chinese industry forum Board Channels. The source claims that motherboard production costs have risen by at least 10%, while the price adjustments manufacturers actually made in August averaged only about 3%, a gap that suggests further increases are coming. PCBs appear to be the biggest driver, with prices reportedly up 15% to 50% depending on board type. Capacitors are said to have climbed by around 50%, and Wi-Fi modules are up an estimated 10 to 20%. Those are bill-of-materials costs, before manufacturing and logistics get factored in.

The August price increases were apparently uneven. MSI reportedly raised prices across its whole lineup, while ASUS and Gigabyte stuck to select higher-volume models. If accurate, that 3% bump falls well short of covering the reported cost increase, which suggests that manufacturers have been absorbing part of the difference so far. It's worth noting that this is not an official manufacturer statement, so these figures should be treated as industry chatter for now. Still, multiple outlets have independently sourced similar numbers, and earlier reports already pointed to ASUS, Gigabyte, and MSI prepping Q3 pricing changes.

Advantech, a leading provider of industrial edge AI and high-performance computing solutions, announces the ASMB-808, a next-generation workstation motherboard designed to bring high-performance Intel Xeon 600 processors and scalable multi-GPU acceleration to professional AI and compute-intensive workloads. Supporting a single Intel Xeon 600 processor with up to 350 W TDP and seven PCIe Gen 5 x16 slots, ASMB-808 provides the high-bandwidth expansion needed for advanced GPU and accelerator configurations. Combined with Advantech's HPC-7485 4U chassis and 2,000 W power supply, the platform can support up to four Intel Arc Pro B70 workstation GPUs, delivering a scalable foundation for AI inference, generative AI, engineering simulation, 3D visualization, and professional content creation.

"AI is penetrating into industrial and professional work environments, where high-performance computing is needed with the flexibility to run demanding workloads locally. ASMB-808 combines the latest Intel Xeon 600 processor technology with a highly scalable PCIe architecture, enabling system developers to build powerful multi-GPU workstations tailored to AI and professional applications," said Barry Chang, Director of Advantech's industrial servers. "By pairing ASMB-808 with up to four Intel Arc Pro B70 GPUs, we provide a flexible platform for AI inference and professional workloads that demand high compute performance and GPU acceleration."

ASRock has silently expanded its Pro-A motherboard lineup with the B550M Pro-A WiFi 6E, a microATX board for the AMD AM4 platform. The new model is essentially the existing B550M Pro-A with the addition of a Wi-Fi 6E module. The launch comes as the AM4 platform is seeing something of a second life, with other major motherboard manufacturers recently adding new models, or increasing production, for the socket first introduced nearly a decade ago. Needless to say that this trend is mostly driven by the current memory pricing situation. The motherboard supports Ryzen 3000, 4000G, 5000 and 5000G series processors, or, if you like the "resurrection" idea, AMD CPUs (Vermeer, Matisse) and APUs (Cezanne, Renoir, Picasso) series.

The ASRock B550M Pro-A WiFi 6E features an 8-phase power design and four DDR4 DIMM slots that can support up to DDR4-4733+ memory modules via overclocking. The motherboard has one PCIe 4.0 x16 slot, one PCIe 3.0 x16 and two PCIe 3.0 x1 slots. It also has two M.2 slots, the primary offering PCIe 4.0 x4 support, and four SATA 6 Gb/s ports. The features are completed by Gigabit Ethernet, Wi-Fi 6E, HDMI, two USB 3.2 Gen 1 Type-C ports and nine USB 3.2 Gen 1 ports. Two RGB and two ARGB headers are also included for those who want a bit of color. The board is expected to be priced around $90, however ASRock has not yet announced an MSRP.

Colorful Technology Company Limited, a leading brand in gaming PC components, gaming laptops, and Hi-fi audio products, announces the iGame X870E VULCAN W OC, an all-white flagship overclocking motherboard designed for enthusiasts seeking uncompromising performance, advanced tuning capabilities, and distinctive aesthetics. Building on the success of the iGame X870E VULCAN OC launched earlier this year, the new white edition combines an extensively engineered power delivery system, high-speed memory support, advanced connectivity, and a striking iridescent finish that produces subtle, rainbow-like reflections that shift with the viewing angle and lighting.

Refined for more than half a year following the launch of the original VULCAN OC, the iGame X870E VULCAN W OC is built to unlock the full potential of AMD Ryzen processors on the AM5 platform. Its 18+2+2-phase 110A DrMOS power design, graphics card-inspired heat pipe and fin cooling system, and 10-layer server-grade PCB provide a strong foundation for demanding overclocking workloads. Dedicated overclocking controls, combined with a user-friendly one-click overclocking button, give experienced enthusiasts precise tuning options while making performance optimization more accessible to first-time overclockers.