Intel Foundry is achieving another significant success as SK hynix, a leading memory maker, is reportedly becoming a customer for EMIB advanced packaging. During Hot Chips 2026, SK hynix mentioned that it is collaborating with TSMC to integrate HBM memory into CoWoS-L, CoWoS-S, CoWoS-R, and most importantly, Intel EMIB. For instance, SK hynix's discussion focused on memory progressing from approximately 1,024 pins to 2,048 pins in the latest HBM4. The number of TSVs is increasing, and integration requires 2.5D packaging, hybrid bonding, as well as 3D DRAM integration to achieve next-generation memory technology with advanced AI accelerators.

As customers increasingly seek to diversify from TSMC's CoWoS, Intel's EMIB family offers many attractive options, particularly with EMIB-T. This variant includes TSVs to enable vertical power delivery across multiple stacked chips, supporting SK hynix's concept of vertical power delivery for 3D memory modules at the package level with EMIB-T.Another significant advantage of Intel's packaging is its considerable cost benefit. The price difference between EMIB-T and CoWoS can be as much as 50%, depending on whether an expensive interposer is needed. This cost advantage allows customers to invest in other production areas. For SK hynix, this means that customers can invest in more HBM memory and translate these cost savings into increased revenue, which is a substantial win for the memory maker.