Remember the "Lego"/"Tetris" DRAM modules that Galaxy was showing off last week? Well, now we have the first benchmarks of said memory running at 4,800 MHz/MT/s with standard timings of 36-36-36-76 and the results are pretty much in line with DDR4 at the same clocks, but with a CAS latency of 19. That said, this doesn't take the latency into account and this is where the issue lies, just as expected.

Despite the change in memory architecture by going to a dual 32-bit bus per DIMM, instead of a 64-bit bus, there is somewhat surprisingly no real gains to be had in AIDA64, even when using two DIMMs. Earlier AIDA64 DDR5 memory benchmarks have only been with a single DIMM, so it has been a bit hard to compare the performance. However, the latency is up by about 30 ns compared to equivalent speed DDR4 memory, which is quite a jump. This does admittedly happen every time there's a transition to a new DRAM technology, but the increase in memory latency has never been this high before. Hopefully RAM with tighter timings and improved CPU memory controllers will help reduce the latency over time, since it'll have an adverse affect on a lot of things, least not many games.

The first trace of AMD's upcoming Ryzen 6000 mobile series has recently appeared with a processor of OPN code 100-000000518-41_N surfacing in the UserBenchmark database with the socket listed as FP7 which is the rumored platform for AMD's 6 nm Rembrandt family. The engineering sample features 8-cores and 16-threads with a base clock of 3.9 GHz and a boost of 4.1 GHz along with an integrated RDNA2 iGPU.

This marks the move from Vega to Navi 2 for the integrated GPU which should result in significant graphics performance and efficiency improvements. The processor was paired with a single 16 GB DDR5 memory module from Corsair running at 4800 MHz CL40, the computer is also listed as Corsair Xenomorph which is interesting as we are not aware of any plans for Corsair to release laptops. AMD is expected to announce Rembrandt at CES 2022 and the processors have allegedly already entered production.

G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory and gaming peripherals, is thrilled to announce the world's fastest DDR5 memory kit at an extreme speed and low latency of DDR5-6600 CL36-36-36-76 32 GB (2x 16 GB). This is the world's first DDR5 memory kit to reach such high level of frequency speed and extremely efficient low timings, achieved with high-performance Samsung DDR5 ICs.

In the never-ending quest for memory performance, G.SKILL is proud to reveal the latest addition of ultra-high DDR5 frequency to the flagship Trident Z5 family. While reaching an extreme frequency speed of DDR5-6600, this memory kit specification is also created with an ultra-low timing at CL36-36-36, compared to the typical CL40-40-40 timing of DDR5, making this the ultimate performance choice for gamers, enthusiasts, and overclockers. The screenshot below shows a G.SKILL memory kit validated with the use of high performance Samsung DDR5 ICs.

The first mainstream Z690 boards have made an appearance online in the shape of ASUS' Prime Z690-P series. As with most of ASUS' Prime boards, these are fairly basic boards, but shouldn't leave the average user wanting for much, although ASUS has made a rather odd layout decision on these boards that we can't quite grasp.

The four models on display are the Prime Z690-P WiFi D4, Prime Z690-P D4, Prime Z690-P and Prime Z690M-Plus D4. The last model doesn't strictly belong to the Prime Z690-P family, but it follows a pretty similar overall design. The Prime Z690-P is obviously the only DDR5 SKU among the four boards, although from what we can tell, there are no other differences between it and the equivalent DDR4 model.

The global memory provider TEAMGROUP has announced the T-FORCE VULCAN DDR5 GAMING MEMORY. Designed for overclocking, the new RAM takes the design language of the sleek and compact DDR4 series even further. Its aluminium alloy heatspreader comes in a unibody design, created through a sophisticated stamping process. It features a gorgeous streamlined body and multi-angular design, outlining its one-of-a-kind visual aesthetics. With the highest-spec kit providing capacity of 2X32GB for dual channel mode and frequency of up to 5,200 MHz, the T-FORCE VULCAN DDR5 will lead the new generation of overclocking memory with its beauty and performance.

The T-FORCE VULCAN DDR5 GAMING MEMORY, debuted at the recent TEAMGROUP Online Launch Event 2021, has been highly anticipated by both gaming and overclocking enthusiasts worldwide. It uses a special thermal conducting silicone to strengthen the adhesion between the heat sink and memory, enhancing the cooling of the power management IC. The ingenious thermal design quickly dissipates heat from top to bottom, allowing the memory to maintain the optimal working temperature and provide more stable operation. It is available in frequencies of 4,800 MHz and 5,200 MHz and capacity options of single 16 GB and 32 GB sticks and dual-channel 2X16GB and 2X32GB kits, meeting the needs of a wide range of consumers seeking ultra-fast speeds. The VULCAN DDR5 GAMING MEMORY is fully tested for compatibility and reliability and will deliver incredible performance to gamers and overclocking enthusiasts around the world.

If the amount of upcoming Z690 was anything to go by, one could presume that the motherboard makers are backing Intel's upcoming platform to the max, as a leaked list of what should be close to every Z690 that will hit the market, counts a total of 98 boards. The list covers ASRock, ASUS, Biostar, NZXT, Gigabyte and MSI, but not EVGA and some other smaller players.

ASUS is apparently planning no less than 30 different models/SKUs, since some are clearly DDR4/DDR5 SKUs of the same model or SKUs with or without Wi-Fi, but even so, that's a massive launch lineup. Gigabyte isn't far behind with 27, followed by MSI at 24 and ASRock at 14, if we didn't count wrong. There isn't much news in terms of details of each of the boards here though, but it's clear that the high-end SKUs are mostly DDR5, while the mid-range and standard models are mostly using DDR4. The only slight surprise here is that only ASRock has more DDR4 than DDR5 models, with ASUS having exactly half of each, but Gigabyte and MSI are going with a preference for DDR5. ASRock, ASUS and Gigabyte appear to have liquid cooled SKUs, but it's not clear if MSI will offer such a SKU of its Godlike board.

Ahead of the rumored late-October debut of Intel's 12th Gen Core "Alder Lake" processors, motherboard makers started teasing their compatible Socket LGA 1700 products. Older reports suggest that in 2021, Intel will only release unlocked "K" and "KF" SKUs, and motherboard partners will only launch boards based on the top Intel Z690 chipset. The lineup is expected to be joined by more affordable non-K SKUs in Q1-2022, along with lower chipset models such as the B660 and H670.

The MEG Z690 ACE appears to introduce a new design scheme with die-cast metal mesh rear I/O shrouds, and a gold+black trim. The I/O shroud design is interesting as it lets the VRM heatsink underneath breathe better. The silver-white MPG motherboard is possibly the MPG Z690 Force. MSI is probably trying to get this to rival the ROG Strix-A SKU by ASUS. The third teaser, of a brushed gunmetal shroud, is likely the MAG Z690 Tomahawk. Like most other brands, MSI appears to have an extensive lineup of Socket LGA 1700 motherboards with DDR4 memory slots, although boards with DDR4 are restricted to the MAG and entry-level PRO series. The mid-tier MPG and enthusiast-segment MEG series boards only come with DDR5.

DIMM designs by the various DRAM module manufacturers are always something of a personal taste thing and then there's the polarising issue of RGB or not. Well, it looks like Galax has worked on something special for its upcoming Gamer RGB DDR5 modules that is likely to cause mixed reactions, but we have a feeling they'll potentially be popular with younger gamers.

The new modules are expected to come in kits of two, ranging in size from 16 to 64 GB, with the 32 GB kit launching first. These are merely 4800 MHz modules, so there's not too much to get excited about there and no timings have been announced. However, these are the first customisable DIMMs we've ever come across, as the RGB LED strip at the top of the module is compatible with LEGO bricks, although presumably there's no official license involved here. Based on the fact that it's Galaxy China that has shown off these modules, they're unlikely to make an appearance in markets outside of China.

Rambus, today announced it is now sampling its 5600 MT/s 2nd-generation RCD chip to the major DDR5 memory module (RDIMM) suppliers. This new level of performance represents a 17% increase in data rate over the first-generation 4800 MT/s Rambus DDR5 RCD. With key innovations, Rambus is able to deliver 5600 MT/s performance at lower latency and power while optimizing timing parameters for improved RDIMM margins.

"Advanced workloads are driving an insatiable demand for greater memory bandwidth," said Shane Rau, research vice president, Computing Semiconductors at IDC. "It's essential that DDR5 ecosystem players like Rambus continue to raise the bar on performance to meet the rapidly rising needs of data center applications."

ADATA Technology, a manufacturer of high-performance DRAM modules, NAND Flash products, mobile accessories, gaming products, electric power trains, and industrial solutions today announces the ADATA DDR5-4800, a next-generation DDR5 memory module that is capable of reaching frequencies of up to 4800MT/s and comes with up to 32 GB of capacity. In addition, ADATA has worked with six major motherboard brands, including AORUS, ASROCK, ASUS, GIGABYTE, MSI and ROG to ensure optimal performance and compatibility across a wide range of motherboards.

"Through our strong R&D capabilities and close partnerships with the world's leading motherboard makers, we are committed to offering memory modules with next-generation performance, higher capacities, and enhanced stability," said Nick Dai, Senior Manager of DRAM Products at ADATA. "In the coming months, we will continue to launch a diverse array of DDR5 products to meet the different needs of creators, gamers, and other users."

GeIL, is proud to announce the launch of their latest Polaris RGB DDR5 Memory providing high-speed modules ranging from 4800 MHz to 5600 MHz and available in large kit capacities of 16 GB to 64 GB with excellent heatspreader and stunning RGB illumination for gamers and PC enthusiasts. GeIL's next-generation POLARIS RGB DDR5 Memory products do not only represent a fundamental frequency/speed upgrade but are designed to deliver unprecedented performance through the combination of larger capacities, enhanced speeds, and broader bandwidth per processor core.

Increases in system performance and efficiency are the cornerstones of any new memory generation. The new architecture has plenty of features to support that, such as the increased burst length, improved refresh schemes, and the increased bank groups significantly boosting performance. In addition, the introduction of the local voltage regulation based on the PMIC (Power Management IC) provides current monitoring, offers threshold protection, and intelligent voltage and power management for a more comprehensive range of voltage tweaking and adjustment. Finally, a newly added on-die ECC function further improves data integrity and performance enhancements.

Client-segment DDR5 memory is on the anvil, with Intel 12th Gen Core "Alder Lake-S" desktop processors that support them. It should come as little surprise then, that some of the first DDR5 memory kits will be outrageously pricey. One such product, a GeIL Polaris RGB DDR5-4800 2x 16 GB kit, saw an early listing on Newegg for $350. DDR5-4800 can be considered an entry-level memory speed (similar to DDR4-2400, when the DDR4 standard was new). DDR5 heralds 16 GB as the new mainstream module density, with "single rank" (two individual ranks for each of the two 40-bit channels per DIMM) being standard. 32 GB per DIMM will be the new premium density (four ranks, two each for the 40-bit channels per DIMM).

Given these, it's conceivable that the first DDR5 memory kits targeting gamers and PC enthusiasts will come with a heavy early-adopter premium. Luckily, the 12th Gen Core processors support both DDR5 and DDR4 memory standards, and there appears to have been a major attempt by Intel to get its motherboard partners to launch motherboards with DDR4 slots across a wide range of price-points, so people can keep using their existing memory, or buy the relatively more affordable memory kits out there. It remains to be seen just how much of a performance penalty using DDR4 attracts on the new processors.

Samsung Electronics, the world leader in advanced memory technology, today announced that it has begun mass producing the industry's smallest, 14-nanometer (nm), DRAM based on extreme ultraviolet (EUV) technology. Following the company's shipment of the industry-first EUV DRAM in March of last year, Samsung has increased the number of EUV layers to five to deliver today's finest, most advanced DRAM process for its DDR5 solutions.

"We have led the DRAM market for nearly three decades by pioneering key patterning technology innovations," said Jooyoung Lee, Senior Vice President and Head of DRAM Product & Technology at Samsung Electronics. "Today, Samsung is setting another technology milestone with multi-layer EUV that has enabled extreme miniaturization at 14 nm—a feat not possible with the conventional argon fluoride (ArF) process. Building on this advancement, we will continue to provide the most differentiated memory solutions by fully addressing the need for greater performance and capacity in the data-driven world of 5G, AI and the metaverse."

Good news everyone, for once it looks like prices are going to be going down for something computer related, as DRAM prices are expected to drop this quarter. At least this is what Nanya Technology Corporation's president, Dr. Pei-Ing Lee told investors during the company's third quarter results announcement, last week.

Apparently the word that was used was correction, although this is meant to be taken as a drop in prices for DRAM, due to less market demand. This is tied to the shortage of various components, not just in the consumer space, but also the server, and mobile devices space, as well as the EV market. That said, Nanya is expecting continued demand for mobile and server DRAM, as well as enterprise PC's and various other consumer products, as well as SSDs. The shortfall is likely to be from EVs, digital TV and specifically Chromebooks are mentioned.

Marvell today announced the expansion of its industry-leading 5 nm data infrastructure platform with the launch of the industry's first 5 nm 50G PAM4 device for the carrier market, the Prestera DX 7321 Ethernet switch. The new switch builds on the success of the Prestera carrier-optimized portfolio and is ideal for 5G fronthaul and edge connectivity. In concert with this, Marvell's 5 nm OCTEON 10 DPU family, incorporating industry-leading hardware accelerators, is now sampling. By utilizing the industry's leading advanced process geometry, the Marvell Prestera switch and OCTEON DPU deliver 50% lower power than existing offerings, enabling new infrastructure solutions for next-generation carrier edge networks and RAN deployment models.

With the addition of the 5 nm Prestera device, the expanded carrier-optimized switch portfolio now comprises four cutting-edge Ethernet switches that scale port speeds from 1 Gbps to 400 Gbps with aggregate bandwidths ranging from 200 Gbps to 1.6 Tbps. The newest offering enhances Marvell's 5G solutions for Open RAN, vRAN and traditional RAN architectures, with Class D precision time protocol (PTP), which provides more timing headroom to enable larger cell coverage radius. The switch device incorporates integrated MACsec security and advanced telemetry to facilitate network visibility and automation.

Corsair on Wednesday tweeted the first picture of its production Vengeance DDR5 memory modules. The picture reveals a simple, minimalist design, with a sheet-metal heatspreader design with some printed graphic, and the new Vengeance logo. Unlike the Vengeance DDR4 generation, there don't appear to be false "finnage" toward the top of the module. Since DDR5 will be coexisting with DDR4 to at least the next couple of years as Intel is getting its motherboard partners to come out with a substantive lineup of LGA1700 motherboards with DDR4 memory slots, Corsair made sure to mention "DDR5" right on the module. Corsair also revealed that it is developing the first Dominator-branded DDR5 memory, which will possibly come out with the first Intel 12th Gen Core processors.

Kingston Technology Company, Inc., a world leader in memory products and technology solutions, today announced its forthcoming DDR5 UDIMMS have received Intel Platform Validation. This marks the first and arguably most important milestone in validating compatibility between Kingston DDR5 memory solutions and Intel platforms utilizing DDR5.

Kingston's introductory portfolio of DDR5 memory will be the first in a series of high performance, low to high capacity, multiple form factor solutions in support of DDR5 based platforms debuting over the next year. After developing the next generation of DDR memory, Kingston is providing over 10,000 DDR5 UDIMM samples to major motherboard manufacturers and technology partners in support of the platform launch. By supporting partners early, Kingston is doing its part to lay the foundation for a successful product launch.

If you're looking at getting your hands on some DDR5 memory for your new Alder Lake build once it launches, a leak of validated RAM has popped up on Twitter, that should give you an idea of what to expect. The list is only a couple of weeks old and it's not what we'd call a long list, as it only covers five companies, out of which three are actual DRAM manufacturers and one is a subsidiary of one of those companies, there are no real surprises here.

All the DDR5 modules tested are rated at 4800 MHz and are either 8, 16 or 32 GB in size, with all modules using 16 Gbit chips. All modules were tested with timings of 40-39-39 at 1.1 V. Kingston is the only outlier here, since they're not a DRAM manufacturer, unlike SK hynix, Samsung and Micron/Crucial. Intel is listing all the modules as non ECC, which should put an end to the claims of all DDR5 being ECC memory.

Intel is set to launch their 12th Generation Alder Lake desktop processors on November 4th alongside the new Z690 chipset supporting DDR5 and PCIe 5.0. We have recently seen the first of these new Z690 motherboards from ASUS being listed for sale by PC Canada. The listings include TUF, ROG Maximus, ROG Strix, and Prime motherboards but we don't see any mention of Apex or Extreme boards so they may not be available at launch. The models all appear to retail for less than their Z590 counterparts except for some of the Prime series models which will come as a pleasant surprise to many. We are also aware that the VRM design for these boards will receive various upgrades according to a recent report from @Komachi. The Z690 Hero is set to feature a 20+1 phase design with 90 A Power Stages while the lower-end boards will get a 14+1 design.

Launch of AMD's upcoming Ryzen Threadripper 5000 series high-end desktop (HEDT) and Threadripper WX workstation processors, is rumored to have been delayed to 2022, according to Greymon55, a reliable source with AMD leaks. Codenamed "Chagall," these processors are compatible with existing sTRX4 and sWRX8 motherboards, based on the AMD TRX40 and AMD WRX80 chipsets, respectively. What's new, is the "Zen 3" microarchitecture.

It remains to be seen if the delay is the result of a last-minute decision by AMD to go with the newer "Zen 3" CCD that comes with 3D Vertical Cache technology, over the conventional "Zen 3" CCD; or some other reason. A 2022 launch would mean that Threadripper 5000 series will be launching around the time when Intel has desktop platforms with DDR5 memory and PCI-Express Gen 5. Threadripper 5000 chips with quad-channel DDR4 memory (four 64-bit wide channels) will be seen offering only comparable memory bandwidth to "Alder Lake" systems with overclocked DDR5 memory (four 40-bit wide channels). AMD is likely to prioritize its next "big" socket for the enterprise segment with EPYC "Genoa," as the company could find itself embattled with Xeon "Sapphire Rapids" processors that come with next-gen I/O.

Intel is expected to announce their desktop Alder Lake processors later this month on October 28th and it would appear that laptop processors could enter production as early as November. These revelations come from a leaked roadmap published by Wccftech that lists the Alder Lake-P and Alder Lake-M processor families for launch in Q4 2021 and Q1 2022 respectively. The production window for Alder Lake-P opens November 8th and closes March 13th while for Alder Lake-M that period is from January 17th to April 17th.

The roadmap lists Alder Lake-P processors as featuring a TDP between 12 W to 45 W and Alder Lake-M covering 7 W to 15 W. The two platforms will both feature up to 96 Xe graphics Execution units along with Thunderbolt 4 and WiFi 6E connectivity. Alder Lake-P will include PCIe 5.0 and DDR5 support with no mention of DDR4 compatibility while Alder Lake-M will get PCIe 4.0 and LPDDR4X/LPDDR5. The mobile lineup is divided into 3 groups of which the flagship H55 was not mentioned in the roadmap indicating a post Q1 2022 release.

While we wait for Intel's official launch of its Alder Lake platform, more leaks are making their way onto the internet and this time we get a sneak peek at the maximum memory speed at four different motherboards from ASUS. The model names of the boards leaked a couple of weeks ago, which makes this leak slightly more interesting, as we can get the full model names of the board this way, since the leaker was a bit sloppy here.

Two of the boards, the TUF Gaming Z690-Plus D4 and what we presume is the ROG Strix Z690-A Gaming D4, but the Wi-Fi version, as there are no Prime gaming boards, top out at 5,333 MHz. However, this shouldn't come as a surprise, as both boards rely on DDR4 and the highest memory speed is on par with ASUS' current Z590 boards.

ADATA Industrial, a leading manufacturer of high-performance DRAM modules, NAND Flash products, and mobile accessories today announces the launch of a new generation of industrial-grade DDR5 memory modules that offer a major leap forward in performance. They are geared toward assisting the development of 5G, AI, Edge Computing, High-Performance Computing, Automated Vehicles, and Smart Healthcare, to name a few.

According to Yole Developments, DDR5 memory shipments will exceed DDR4 by 2023 and DDR5 sales will account for 90% of the market by 2026. DDR5 will be the undisputed standard of the future and a key component of 5G, AIoT, and other applications. To meet the future demands of its customers, ADATA has unveiled a slew of DDR5 memory modules, including U-DIMM and SO-DIMM variants. The modules utilize select high-quality ICs straight from the manufacturer and will come with capacities of 8 GB and above. Compared with DDR4, DDR5 has twice the bandwidth and offers higher frequencies of up to 4800 MHz. What's more, they operate on just 1.1 V for improved energy efficiency.

At the COMPUTEX 2021 Virtual Expo in May, TEAMGROUP presented the core value underlying its new products in 2021: "Chill the Heat, Feel the Speed, Make it Big", representing cooling, DDR5, and large capacity, the three major focuses TEAMGROUP builds its new products and design concepts around. Tonight at 10 PM (GMT+8), everyone is sincerely invited to the TEAMGROUP Online Launch Event 2021 via official website, Facebook Page, and YouTube channel as it again takes the three focuses to the next level with its powerful new technical capabilities and innovative technologies. To celebrate the event with the world, TEAMGROUP will give away a Gaming Desktop PC and other prizes worth up to $7,000 USD. Make sure to stay tuned for the TEAMGROUP Online Launch Event 2021.

In recent years, TEAMGROUP has been focusing on developing diverse cooling solutions and applying unique materials to the SSD of the Gaming product line, T-FORCE. Inspired by the four natural elements of wind, fire, water, and earth, TEAMGROUP has utilized four exclusive components of cooling to T-FORCE gaming products. The wind element can be found in TEAMGROUP's CARDEA A440 Pro M.2 PCIe SSD as further improvements are made on existing aluminium fin thermal conductivity technology for fluid ventilation and more effective cooling performance. The impressive read/write speeds of the CARDEA A440 Pro are also approaching the defined maximum speeds for Gen4 x4 by PCI-SIG at an outstanding 7,400/7,000 MB/s.

Once again, the Eurasian Economic Commission has provided us with a look into a wide range of upcoming motherboard models and this time it's Gigabyte's Z690 lineup. The company appears to be reading no less than 17 DDR5 models and 10 DDR4 models, which is simply a massive amount of motherboards. There are two models that caught our eye, firstly the Aorus Tachyon, which continues HiCookies overclocking SKU from the current Z590 Aorus Tachyon and secondly the Aorus Elite Stealth, which may or may not be a passively cooled board, suggesting the Z690 chipset might be coming with active cooling.

We'd hazard a guess and say that not all SKUs will be available at launch, since it's unlikely that there will be a demand for this many different models. A few other noteworthy mentions here include the Z690M Aorus Elite DDR4 (with or without Wi-Fi), which seems to be a higher-end mATX model and it looks like we're getting three Mini-ITX models with the Z690I Aorus Ultra, the Z690 Aero D and the Z690I A Ultra DDR4. Also gone is the Vision name, as it has been replaced with Aero, a brand Gigabyte has used for some of its AMD boards. Time will tell what actually lands in the various markets at the end, as it might be that some of these SKUs are region specific as well.