News Posts matching "LGA1151"

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Intel's Coffee Lake CPUs Likely Compatible With LGA 1151 Motherboards

Another interesting tidbit to have dropped from recent SiSotware leaks on Intel's upcoming Coffee Lake CPUs is that these could be backwards compatible with LGA 1151 motherboards that rock the 200 series chipset (and perhaps even the 100 series.) This last tidbit seems to be a bit of a stretch, even if it does end up being somewhat of a motherboard manufacturer's choice whether or not to issue updated, supporting BIOSes for the most recent Intel processors on their older boards. But why lose so many sales of motherboards equipped with Intel's upcoming, complimentary 300 series chipsets?

This piece of information comes courtesy of SiSoftware Sandra, again, where the 6-core Coffee Lake Intel chip, running @ 3.5 GHz, was tested in a Kaby Lake S platform - which features a 200 series chipset, no less. This means that there is a chance users will have a straight, drop-in upgrade path for Coffee Lake 6-core chips (seems Intel is no longer keeping all of those cores to themselves.) Doesn't that make the world seem a better place?

Source: WCCFTech

ECS Intros the Z270-Lightsaber Motherboard

ECS introduced its premium socket LGA1151 motherboard, the Z270-Lightsaber. A successor to the Z170-Lightsaber the company unveiled way back in January 2016, the board is packed to the brim with features. To begin with, it draws power from a combination of 24-pin ATX and 8-pin EPS power connectors, conditioning it for the CPU with a 14-phase VRM. The socket is wired to four DDR4 DIMM slots, supporting up to 64 GB of dual-channel DDR4 memory; and two PCI-Express 3.0 x16 slots (x8/x8 with both populated). The third x16 slot is electrical gen 3.0 x4, and wired to the Z270 PCH, and four PCI-Express 3.0 x1 slots make for the rest of its expansion.

Storage connectivity includes six SATA 6 Gb/s ports, a 32 Gb/s M.2 slot, and a 32 Gb/s U.2 port, with NVMe booting and Intel Optane support. USB connectivity includes two 10 Gb/s USB 3.1 ports, both of which are type-A, and eight 5 Gb/s USB 3.0 ports (six on the rear panel, two via headers). The onboard audio solution includes a 115 dBA SNR CODEC sitting on an elevated PCB of its own, besides ground layer isolation for the audio circuit that includes a replaceable TI NE5532AP OPAMP, and audio-grade capacitors. The gigabit Ethernet connection is driven by Killer E2500 controller. The board also features standardized RGB LED headers over two zones. The board also features dual-BIOS with manual switching between two EEPROMs. The company didn't reveal pricing.

Calyos Announces Availability of its NSG S0, The Ultimate Fanless PC Case

Calyos announced availability of its NSG S0, a revolutionary new case with factory-fitted phase-change cooling for the CPU and graphics cards. From today (29th March), Calyos will be accepting pre-orders for the case through a 30-day Kickstarter campaign. The NSG S0 will start at 479€, and buyers will be able to order one of many custom-design themes, such as Battlefield Edition, LoL Edition, MSI Gaming edition, Unicorn Team Fortress edition, and more functional changes, such as a water-cooling mod. The case will come optimized for Core i7-7700K (socket LGA1151) and GeForce GTX 1080 Ti graphics. At a later date, the company plans to sell complete pre-assembled gaming PC builds featuring the two components.

The case features a central brushed aluminium frame that holds a motherboard tray on one side, and a compartment on the other side with the PSU tray, some drive trays, and the phase-change cooler that puts out pressurized coolant through high-pressure CPU and VGA blocks. Phase-change cooling works on the same principle as refrigeration, and is a proven sub-zero cooling method for enthusiast PC builds. The case can also be refitted to handle liquid cooling.
Pictures of the special-edition variants and the press-release follow.

BIOSTAR and TechPowerUp Racing GT Giveaway: The Winners

Here are the winners of the TechPowerUp and BIOSTAR Racing GT giveaway. Three lucky winners from the United States and Mexico, win one of BIOSTAR's finest socket LGA1151 Racing GT series motherboards, which includes one winner for the Racing Z270GT6 and two winners that get a Racing B250GT5, each. These motherboards feature powerful CPU VRM, RGB LED lighting preparation, and BIOSTAR's Puro Hi-Fi onboard audio solutions. Without further ado, the winners:
  • Daniel from the United States, wins a Racing Z270GT6
  • William and John, both from the United States, win a Racing B250GT5, each
TechPowerUp will return with more such interesting giveaways.

Last Chance to Grab One of Three BIOSTAR Racing GT 200-series Motherboards

Did you sign up for our BIOSTAR Racing GT 200-series Motherboard Giveaway yet? Well, why didn't you? Win one of these three premium socket LGA1151 motherboards, one BIOSTAR Racing GT Z270GT6, or one of two Racing B250GT5, armed with BIOSTAR's most premium VRM implementation, and its PuroHiFi onboard audio solution, and preparation for RGB LED lighting. The giveaway ends tomorrow (3rd March), and is open to residents of the United States and Mexico.

For more information, and to participate, visit this page.

EK Releases Monoblock for ASUS Maximus IX Hero

EK Water Blocks, the world renowned premium liquid cooling manufacturer, is proud to release their monoblock liquid cooling solution for the ASUS ROG Maximus IX Hero motherboard. The EK-FB ASUS M9H is first in the line of monoblocks for socket 1151 ASUS Z270 chipset motherboards. EK-FB ASUS M9H Monoblock is a complete all-in-one (CPU and motherboard) liquid cooling solution for the new Intel Z270 Express Chipset LGA1151 ASUS ROG Maximus IX motherboard that supports the latest 7th generation and 6th generation Intel Core Processors as well.

Designed and engineered in cooperation with ASUS, this monoblock uses award-winning EK-Supremacy EVO cooling engine to ensure best possible CPU cooling. This water block directly cools Intel LGA-1151 socket type CPU, as well as the power regulation (MOSFET) module. Liquid flows directly over all critical areas, providing the enthusiasts with a great solution for high and stable overclocks. Like with every EK monoblock, EK-FB ASUS M9H features high flow design and this monoblock can be easily used with the system using a weaker water pump as well.

GIGABYTE Intros the B250M-Gaming 5 Motherboard

GIGABYTE today introduced the B250M-Gaming 5 motherboard. This micro-ATX socket LGA1151 board is targeted at performance-segment gaming PC builds, and features full RGB lighting over two multi-color LED elements near the CPU socket, and a multi-color LED lighting strip near the ATX power connector. There are also LEDs under the PCH heatsink and the audio ground layer isolation strip. The board is based on the Intel B250 Express chipset, and lacks support for CPU overclocking, or NVIDIA SLI. The CPU socket is wired to four DDR4 DIMM slots (reinforced), and one PCI-Express 3.0 x16 slot. The second x16 slot is gen 3.0 x4 and wired to the PCH. Two other gen 3.0 x1 slots make for the rest of the expansion area.

Storage connectivity on the B250M-Gaming 5 includes six SATA 6 Gb/s ports, and a 32 Gb/s M.2 slot. Display outputs include DVI and HDMI. Networking is care of a single gigabit Ethernet interface, driven by an Intel-made controller. GIGABYTE deployed its AMP-UP onboard audio solution, with an 8-channel HD audio CODEC that boasts of 120 dBA SNR, a headphones amp, audio-grade electrolytic capacitors, and ground-layer isolation. USB ports include four USB 3.1 ports (two on the rear panel, including a type-C port, and two ports through headers); and six USB 3.0 ports. Other features include GIGABYTE's dual-UEFI BIOS. The company didn't reveal pricing, although one could expect this one to be priced around the $100 mark.

ASUS Intros the B150M Expedition Motherboard

ASUS' new line of PC hardware targeted at gaming iCafes under the Expedition brand grows, with its first motherboard, the B150M Expedition (model: EX-B150M-V5 D3). These products are designed to be durable enough for the rigors of gaming iCafes, at affordable prices, though not as apocalypse-survivalist as the company's coveted TUF series. The B150M Expedition is a socket LGA1151 motherboard with DDR3 memory support. It features two memory slots that support up to 16 GB of dual-channel DDR3-1866 memory. The memory slots have an anti-theft feature that lets you screw-in the modules to the slots.

The narrow micro-ATX board draws power from a combination of 24-pin ATX and 8-pin EPS power connectors, and conditions it for the CPU with a 7-phase VRM. Expansion slots include one PCI-Express 3.0 x16, and two PCI-Express 3.0 x1. Storage connectivity includes four SATA 6 Gbps ports. USB connectivity includes eight USB 3.0 ports (six on the rear panel, two via headers). Networking is care of a single gigabit Ethernet interface driven by a Realtek RTL8111GR controller. ASUS deployed the gaming-grade Crystal Audio 2 onboard audio solution, with a Realtek ALC887 6-channel HD audio CODEC, ground-layer isolation, audio-grade capacitors, and a headphones amp. The board also features a PS/2 port for legacy input devices. ASUS didn't disclose pricing.

Light Up Your Gaming with Biostar B250 Motherboard Series

BIOSTAR is proud to announce its line-up of new motherboards based on the Intel B250 chipset as part of the 2nd-generation RACING series family of products with the announcement of the BIOSTAR RACING B250GT5 and B250GT3. Both motherboards support Intel's 7th-generation Core processors as well as native support for Intel Optane Memory technology for next-generation high-speed storage.

BIOSTAR Announces Line-up of Z270 Motherboards

BIOSTAR is proud to announce the full line-up for the new 2nd-generation RACING series motherboards featuring support for Intel's 7th-generation Core processors. Following the announcement last week of the flagship RACING Z270GT9, today BIOSTAR proudly announces the different level products of the new RACING series family with the introduction of the RACING Z270GT8, RACING Z270GT6 and RACING Z270GT4 motherboards featuring the latest technology from BIOSTAR inspired by the quest for the best in gaming features. The 2nd-gen RACING series Z270 motherboard lineup brings a new level of gaming experience and performance-oriented motherboards to gamers and enthusiasts.

Eurocom Launches the 15.6" Tornado F5 - 4K, GTX 1080, i7 7700K, 64 GB DDR4 RAM

Eurocom launches the fully upgradeable, high performance 15.6" Tornado F5 with NVIDIA GeForce GTX 1080 graphics, Intel Core i7 7700K processor, 64 GB DDR4 memory via four slots, dual M.2 SSD slots and a 4K 15.6" display.

EUROCOM Tornado F5 users who own an Intel Core i7-6700K SKU can upgrade to the i7-7700K since the two processors share the same LGA 1151 socket. The EUROCOM Tornado F5 is one of the few laptops with a Z170 chipset, LGA 1151 CPU socket and MXM 3.0 graphics slot for a wide range of customization options. Two M.2 SSD PCIe x2/x4 or SATA SSD and one 9.5mm SATA3 6Gb/s storage drive is also supported to offer a great combination of capacity and speed. Four memory slots are available to support up to 64 GB of DDR4 SODIMM. Customers have a 15.6" FHD matte display and a 4K matte display to choose from as well.

Colorful Unveils its iGame Z270 Gamer Customization Motherboard

Colorful Technology Company Limited, professional manufacturer of graphics cards and motherboards, is proud to announce its latest motherboard for enthusiasts and gamers featuring the latest Intel Z270 chipset to support LGA1151 processors including the newly announced 7th generation Core processors from Intel with their new iGame Z270 Gamer. Customization motherboard. This latest products joins the family of iGame enthusiast and performance series of motherboards and graphics cards which focuses on not just the needs of gamers for a faster and robust system but serves as a canvas to promote their creativity and idea with great customization options.

BIOSTAR Announces the Racing Z270GT9 Motherboard

BIOSTAR is proud to announce its latest motherboard supporting the 7th-generation of Intel Core series processors with the announcement of the BIOSTAR RACING Z270GT9. Featuring the latest Intel Z270 chipset, this motherboard supports LGA1151 processors for the latest in performance and power as well as the best features including support for DDR4-3600+ high-speed memory, six PCI-E x16 3.0 slots, and two USB 3.1 (TYPE A+C) ports amongst others.

Built upon reliability, the new BIOSTAR RACING Z270GT9 features enhanced endurance and stability under intense conditions which is a great advantage for gamers thanks to its improved power design named Digital Power+ which features IR digital PWM controller and PowIRstage IC which offer excellent stability and voltage delivery whilst operating cooler and more reliable under load than competing designs. The BIOSTAR RACING Z270GT9 features 14-phase power design complimented with all solid capacitors for a stable overclocking experience.

Colorful Unveils Feature Preview of its iGame200 Motherboards

Colorful Technology Company Limited, professional manufacturer of graphics cards and motherboards, is thrilled to reveal its preview of features for its upcoming iGame200 motherboard product line. The new motherboards from Colorful will support both existing and upcoming processors for the LGA1151 socket including the 7th-gen Core series processors from Intel. The new processors will bring several improvements over its predecessor including performance and efficiency enhancements and Colorful is ready to bring the best that these CPUs can offer and deliver the needs of gamers with outstanding features.

ASRock Z270 Extreme4 Motherboard Pictured

Here are some of the first pictures of ASRock Z270 Extreme4, the company's mid-range socket LGA1151 motherboard based on Intel's upcoming Z270 Express chipset, with out of the box support for 7th generation Core "Kaby Lake" processors, and support for Intel Optane 3D X-point solid-state storage. Built in the ATX form-factor, the Z270 Extreme4 draws power from a combination of 24-pin ATX and 8-pin EPS connectors, and conditions it for the CPU with a 12-phase VRM.

The CPU socket is wired to four DDR4 DIMM slots, supporting up to 64 GB of dual-channel DDR4 memory; and two PCI-Express 3.0 x16 slots (electrical x8/x8 when both are populated). The third PCIe 3.0 x16 slot is electrical x4 and wired to the PCH. Three open-ended PCIe 3.0 x1 slots make for the rest of the expansion area. Storage connectivity includes eight SATA 6 Gb/s ports, and two 32 Gb/s M.2 slots. Display connectivity includes one each of D-Sub, DVI, and HDMI. You get a total of eight USB 3.0 ports (four on the rear panel four by headers), and two USB 3.1 ports (one each of type-A and type-C, both on the rear panel). Eight channel HD audio and gigabit Ethernet make for the rest of the connectivity.

Source: VideoCardz

MSI Z270 "Tomahawk" Motherboard Teased

Tis the season of 'leaks.' A marketing image of an upcoming socket LGA1151 Z270 chipset based motherboard by MSI bearing its Gaming Series Tomahawk branding was teased on Facebook. It appears to be feature-rich given that MSI positions its "Tomahawk" branded motherboards in the mid-tier of its lineup. One of the features that caught our attention is MSI's claim to have achieved true 1000 MB/s bandwidth for USB 3.1 (gen 2.0) using a custom software feature. MSI is calling this the X-Boost. The company is also guaranteeing full 8 Gb/s bandwidth per port, since it's using ASMedia AS2142 controllers to drive its USB 3.1 ports.

Many Thanks to TheLostSwede for the tip.

Scythe Announces the Mugen 5 CPU Cooler with Kaze Flex 120 Fan

Japanese cooling expert Scythe presents the fifth version of the Mugen CPU Cooler, which has been fitted with significant improvements. The Mugen has been one of the most popular CPU coolers on the market for a long time. Scythe was able to ramp up the performance even further with Mugen 5 and at the same time equip the heatsink with a unique new fan. Supplied Kaze Flex 120 PWM fan features noise reduction rubber-insulators in the corners, dynamic fan speed range from 300 to 1.200 rpm as well as a brand-new Sealed Precision FDB bearing, allowing smooth and silent operation at all times.

Scythe's engineering team took the user feedback and applied it on the revamped design of Mugen 5! The heatsink of the Mugen 5 is based on 6 high-quality all-copper heatpipes and a solid aluminum fin stack. Great compatibility to tall memory modules is achieved thanks to the new asymmetrical design of Mugen 5. The solid copper base-plate has been placed slightly shifted for this purpose, instead of centered. In addition to that, several layers of the fin stack on the back of Mugen 5 have been shortened, to further increase RAM compatibility. Mugen 5 can easily fit into most PC chassis on the market, thanks to the total height of only 154.5 mm. In order to avoid corrosion and to improve the quality, all copper-heatpipes and the copper-baseplate are nickel-plated.

Intel Z270 and H270 Chipsets Detailed: More PCIe Lanes

Early 2017, a new wave of socket LGA1151 motherboards based on Intel 200-series chipset will launch, alongside the company's 7th generation Core "Kaby Lake" processors. The lineup will be led by the Z270 Express, targeting performance desktops, and H270 Express, targeting premium commercial desktops. The question on your mind probably is what sets these chipsets apart from the current 100-series Z170 and H170 chipsets. Here are some pointers.

To begin with, motherboards based on Z270 and H270 chipsets are assured to support Core "Kaby Lake" processors, out of the box. The 100-series chipset motherboards inventory with retailers may require BIOS updates, although some of the newer production batches could ship with the latest BIOS that support "Kaby Lake." Secondly, the Z270 and H270 support Intel Optane technology, a new breed of bleeding-edge performance SSDs based on the company's 3D X-point non-volatile memory, which is the very latest in sold-state storage, and purported to be the fastest. The chipets also support Rapid Storage Technology v15.

Intel "Coffee Lake" Company's First 6-core Mainstream SKU

Intel's upcoming "Coffee Lake" micro-architecture, or the 9th generation Core processor family by Intel, is scheduled for launch in the second half of 2018. It succeeds the 8th generation "Cannon Lake" family of notebook processors (which likely doesn't see a desktop launch), and the 7th Gen Core "Kaby Lake" socket LGA1151 processors slated for January 2017. While it's not known if mainstream desktop "Coffee Lake" chips will continue to be based on the LGA1151 socket, the possibility is diminishing, looking at a platform layout diagram leaked to the web by Benchlife.info, supported by new connectivity interfaces coming out of the CPU package. The biggest selling-point of "Coffee Lake," is its core-count.

The 9th generation Core "Coffee Lake" family could introduce Intel's first 6-core processor to the mainstream desktop platform. The company's first 6-core client part was launched in its LGA1366 HEDT (high-end desktop) platform with the Core i7 "Gulftown" processor, way back in 2010. An increase in core-count from 4 has eluded the mainstream-desktop lineup. The 6-core "Coffee Lake" silicon will be built on a highly-refined 14 nm node by Intel, with a die-size of 149 mm². Quad-core parts won't be carved out of this silicon by disabling two cores, but rather be built on a smaller 126 mm² die. For reference, the quad-core "Kaby Lake" die is expected to be 123 mm², and the current quad-core "Skylake-D" die measures 122.6 mm².
Source: BenchLife.info

Intel Core i5-7600K Tested, Negligible IPC Gains

Ahead of its launch, a Core i5-7600K processor (not ES) made its way to Chinese tech publication PCOnline, who wasted no time in putting it through their test-bench, taking advantage of the next-gen CPU support BIOS updates put out by several socket LGA1151 motherboard manufacturers. Based on the 14 nm "Kaby Lake" silicon, the i5-7600K succeeds the current i5-6600K, and could be positioned around the $250 price-point in Intel's product-stack. The quad-core chip features clock speeds of 3.80 GHz, with 4.20 GHz max Turbo Boost frequency, and 6 MB of L3 cache. Like all its predecessors, it lacks HyperThreading.

In its review of the Core i5-7600K, PCOnline found that the chip is about 9-10% faster than the i5-6600K, but that's mostly only due to its higher clock speeds out of the box (3.80/4.20 GHz vs. 3.50/3.90 GHz of the i5-6600K). Clock-for-clock, the i5-7600K is just about 1% faster, indicating that the "Kaby Lake" architecture offers only negligible IPC (instructions per clock) performance gains over the "Skylake" architecture. The power-draw of the CPU appears to be about the same as the i5-6600K, so there appear to be certain fab process-level improvements, given the higher clock speeds the chip is having to sustain, without a proportionate increase in power-draw. Most of the innovation appears to be centered on the integrated graphics, which is slightly faster, and has certain new features. Find more performance figures in the review link to PCOnline below.
Sources: PCOnline.com.cn, WCCFTech

SilentiumPC announces Fortis 3 HE1425 v2 CPU-Cooler

SilentiumPC has announced the Fortis 3 HE1425 v2 CPU-cooler which is a much cheaper version of the award winning Fortis 3 HE1425 Malik Customs Edition. Despite a much more attactive price the Fortis 3 HE1425 v2 is still offering the same cooling performance. Engineered to achieve optimal balance between heat dissipation and airflow it uses five high performance heatpipes transferring heat efficiently to 38 aluminum fins. In terms of styling the Fortis 3 v2 has a black top with black caps sealing the heatpipes.

The former properties of the cooler remain otherwise unchanged. The asymmetric high performance cooling body consists of aluminum fins and heat pipes, which have a direct contact to the processor and form the basic framework. For the corresponding heat dissipation there is a quiet Sigma Pro 140mm-PWM-fan included. The in-house Pactum PT-2-thermal paste also comes in the package.

ASUS Rolls Out BIOS Updates for Next-Generation LGA1151 Processors

ASUS today announced that all 100-series motherboards will now support next-generation Intel Core processors. A quick and easy UEFI BIOS update unleashes the full potential of the next-generation high-performance CPUs for socket LGA 1151, reaffirming ASUS as the BEST leading motherboard brand - Best Selling, Easy to Use, Stable and Trusted. Owners of ASUS Republic of Gamers (ROG), Pro Gaming, Signature and TUF Z170, H170, B150 and H110 motherboards are able to take advantage of the easy upgrade to the award-winning ASUS UEFI BIOS, which is available today via the relevant ASUS Support web page.

All ASUS 100-series motherboards that include the ASUS USB BIOS Flashback feature allow users to apply UEFI BIOS updates with ease. For other ASUS 100-series motherboards the necessary UEFI BIOS update takes just one click in an easy-to-use Windows-based BIOS updater application, ASUS EZ Update, which is available to download from the ASUS website.

Two ASRock Z270 Motherboard Packages Smile for the Camera

Ahead of their Q1-2017 launch alongside the 7th generation Core "Kaby Lake" processors, the boxes of two premium ASRock motherboards based on the upcoming Z270 Express chipset smiled for the camera. These are the ASRock Z270 Gaming K6, and the Z270 Pro4, or at least that's the best we could read through the blur. The Z270 Gaming K6 could be a premium offering, while the Z270 Pro4 could be an entry-mainstream one.

Just as Intel launched both the 6-series and 7-series chipset for the LGA1155 socket, and the 8-series and 9-series chipset for the LGA1150 socket; the Z270 could be Intel's second platform for the LGA1151 socket, in being compatible with both the upcoming 7th generation Core "Kaby Lake" processors, and the existing 6th generation Core "Skylake" ones. Existing 100-series chipset motherboards will support "Kaby Lake" chips with BIOS updates.

-- images removed at request of AsRock --

ASRock Unveils the Z170M-PIO2 Motherboard with Parallel Expansion Slot

ASRock unveiled the Z170M-PIO2, a micro-ATX socket LGA1151 motherboard with a unique angled PCI-Express gen 3.0 x16 slot that lets you install a graphics card parallel to the plane of the motherboard. It takes away the need for PCIe riser cables in certain PIO form-factor compliant SFF chassis. The PIO form-factor is an emerging standard of compact SFF cases that you mount along the VESA wall-mount bolts of your display. Technically, the board conforms to the uDTX form-factor, but is compatible with micro-ATX and PIO form-factors.

Its star-attraction aside, the Z170-PIO2, as its name suggests, is based on the overclocking-ready Z170 Express chipset. It supports up to 32 GB of dual-channel DDR4 memory with its two memory slots. The board draws power from a combination of 24-pin ATX and 4-pin CPU power connectors. Besides the angled PCIe x16, you get an mPCIe slot (for WLAN cards), and one 32 Gb/s M.2 slot. Four SATA 6 Gb/s ports, 6-channel HD audio, four USB 3.0 ports, and gigabit Ethernet make for the rest of its connectivity.

Scythe Announces the Byakko CPU Cooler

Japanese cooling expert Scythe announces a new addition to the tower-design CPU cooler line-up. Scythe Byakko is a compact cooling solution with a total height of mere 130 millimeters, which fits in virtually every PC case. Great compatibility is assured thanks to the asymmetric alignment of the base-plate and the heatsink. Byakko is equipped with Scythes Slip Stream 92 PWM fan, offering a wide speed range for different purposes. User friendly and fast mounting of Byakko on both Intel and AMD Sockets is accomplished thanks to the supplied mounting clips.

Scythe Byakko was designed with the aim to fit into most PC cases on the market and to offer maximum compatibility to tall memory modules as well as VRM heatsinks. All this is possible thanks to the compact dimensions of 102 x 130 x 84 mm (W x H x D) and the new asymmetric design of the heatsink. Three high-quality copper heatpipes with 6 millimeter diameter are connecting the solid copper base-plate and the aluminum fins-stack heatsink. Both the copper-heatpipes and the copper-baseplate are nickel-plated in the final process, in order to avoid corrosion and to improve the quality.
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