OCZ Technology Group today unveiled a blazing fast DDR3 addition to the new Flex II memory series. These premium modules run at incredibly fast 2000MHz speeds at CL8-8-8 timings for added performance to high-end systems with integrated water-cooling. Designed to the very core to offer enthusiasts the thermal management innovation of hybrid water and passive cooling, the new PC3-16000 Flex II Series offers rock-solid stability and performance for your high-end gaming or overclocking system.

Corsair, a worldwide leader in enthusiast computer and flash memory products, announced today the launch of their new Corsair high-density Memory Line for Mac Pro desktop systems. Made especially for the high performance demands of the Mac market, the new Corsair Mac Pro Memory Kits are fully buffered 667MHz solutions, available immediately in 2GB (2 x 1GB modules) and 4GB (2 x 2GB modules) DIMM kits.

Heatpipes certainly seem to be the big thing in cooling at the moment, and memory is no exception. As this year's Intel Developer Forum, Kingston has been showing-off some dual-heatpipe HyperX RAM modules, as you can see in the image below. There's no firm information about specs or availability yet, but you can expect these modules to have tight timings and clock quite nicely - although they aren't likely to be particularly affordable.

Corsair announced today their NVIDIA 790i Ultra SLI high-performance DDR3 partner memory offerings, including a record-breaking 2GHz module.

After extensive partnership efforts between NVIDIA and Corsair, the NVIDIA 790i Ultra SLI platform was found to exhibit extreme overclocking capabilities with the latest in DDR3 memory architectures. All Corsair SLI-ready partner memory is pre-loaded with EPP2, the latest in memory performance specifications. EPP2 is designed to deliver an automatic memory performance boost for enthusiasts when used with the 790i Ultra SLI platform.

Corsair announced today the world's first high performance memory modules made especially for the Mac. The new Corsair memory modules are the industry's first low latency modules specifically tuned for the new MacBook and MacBook Pro laptop computers.

Memory manufacturer Kingston has managed to achieve unprecedented memory speeds using overclocked HyperX DDR3 modules combined with NVIDIA's next-generation core-logic. The company managed to take its memory from stock speeds of 2.0GHz to 2.13GHz (a 6.5% overclock) using NVIDIA's nForce 790i chipset without any special cooling systems, although no details of voltages or latencies were disclosed. Up until now, the fastest DDR3 memory has only been capable of running at 2GHz - a figure which Kingston, A-Data, Walton Chaintech and Corsair have all managed to reach. The modules used, which were the so-far unannounced Kingston HyperX PC3-16000 (KHX16000D2K2/2G) modules, will be available during the first quarter of this year - so presumably within the next month.

When the going gets rough, people simply don't see a need to spend so much on luxuries. A prevalent example is Apple. Now that the economy as a whole is slowing down, Apple is realizing that people simply aren't going to buy a gazillion iPhones and iPods this year. Considering the majority of the aforementioned devices used memory from NAND, Apple suddenly decided that they don't need to buy so much memory from NAND after all. Estimates of growth for NAND suddenly took a turn for the worse, going from upwards of 30% to a rather low single-digit number. Unfortunately for NAND, this announcement comes after NAND decided to increase capital investment by 20%. DRAM, on the other hand, has it worse. They've already predicted abysmal growth, but with a continuing demand for low RAM prices, abysmal growth translates into extreme losses.

Corsair, a worldwide leader in high performance computer and flash memory products, announced today that new record breaking speeds have been achieved within the Corsair DDR2 and DDR3 lines of DRAM memory.

Available by the end of February, two new Corsair 4GB DDR2 module speed grades are being offered for high-performance enthusiast users: Corsair 1066MHz (PC2-8500) and 1142MHz (PC2-9136) 4GB memory kits (2X2GB). The new memory modules utilize Corsair's patented DHX technology, which employs a specially designed quadruple heat sink to dissipate heat through both convection and conductive methods. The results are maximum performance and extreme over-clocking capability for the demanding gaming enthusiast.

While memory prices continue to fall, allowing gamers and hardware enthusiasts everywhere to splurge on memory, it would seem as though this "golden age" of cheap memory is coming to an end. Hynix, mainly thanks to ridiculously low DRAM prices, reported a net loss of a half billion dollars last year. Hynix is also none too happy to announce that they do not expect things to get much better. DRAM prices are low/falling, and are expected to stay that way for quite some time. There are currently rumors that Hynix may consider exiting the memory business, despite strong sales in NAND flash technology.

Team Group looks set to take the crown for having the fastest-rated DDR3 memory with the 2133MHz modules which it is showing off at CES. The memory will run with timings of 10-10-10-30 (not exactly aggressive) at require 2.1-2.2V, compared to the industry guidelines of 1.5V. The memory will feature special "Super Thermal Conduction" black heat spreaders and ship in 2GB kits, although no pricing details have been revealed.

Hardware company Walton Chaintech has introduced new DDR3 modules certified to run at 2000MHz with timings of 9-8-8-24. The Apogee GT modules are expected to ship as a 2GB dual channel kit, although the pricing has not yet been unveiled. As you can see from the image below, the memory features quite a substantial heatsink covering two sticks.

With the increased demands from the PC Enthusiasts and the increased RAM frequency, the thermal management issues of DDR Ram have become more and more important. After the successful introduction of the memory cooler, Spirit RX, at the beginning of 2007, Thermaltake is now launching another new RAM cooler - V1R.

Corsair, a worldwide leader in high performance computer and flash memory products, today announced today announced they have been licensed by Intel to use the new Intel Extreme Memory Profile (XMP) certification logo. The certification will apply to the latest offered by Corsair and specifically programmed with the new Intel XMP specification.

At this year's Games Convention ASUS is showing off their new RD780 M3A-MVP motherboard. It will feature the new Socket AM2+, but it will be able to handle any AM2 CPU along with the new Phenoms. It will also be able to run DDR2 up to 8500 (1066MHz) speeds, and it will feature two PCI-E 2.0 compliant x16 slots.

RAM prices are ridiculously cheap nowadays. However, OEM's get RAM even cheaper. System builders such as Dell are getting RAM for $28 USD per gigabyte. OEMs are getting RAM for such low prices because RAM demand is extremely low right now, and they are hoping to stockpile a large amount of RAM for when demand is high again. Samsung is the first RAM company to refuse to sell OEM's RAM, in protest of the outrageously low prices the OEM's are demanding. Samsung hopes this boycott will increase demand of RAM, and hence, bring prices back where they want them.

However, this may backfire, as Hynix and Nanya are more than happy to fill in what Samsung doesn't.

For those Mushkin fans out there we are pleased to announce special deals on Newegg and Ncix on Mushkin power supplies starting Monday, June 4. Promotions will last throughout the following week.

The deals will be priced as follows:

• Mushkin HP-550 PSU - $67.99
• Mushkin HP-580AP PSU - $86.99
• Mushkin XP-650 PSU - $109

Mushkin - Get more !

OCZ Technology Group, Inc., today announced the OCZ PC2-8500 AMD CrossFire Reaper HPC Edition. As some of the highest performing modules on the market, the PC2-8500 CrossFire features the exclusive OCZ CrossFire edition Reaper HPC heatsink for advanced component cooling.

OCZ Technology Group, today released PC2-5400 2GB SODIMM modules, an addition to their line of premium upgrade laptop memory. Specially targeted at the notebook PCs running Windows Vista, these modules are priced aggressively and offer exceptional quality for its price. The latest line of OCZ SODIMMs will be available in 2GB modules rated to run 667MHz at CL5-5-5-15 with 1.8V default operational voltage. Each module comes backed with industry leading technical support and the OCZ Lifetime Warranty. For more information on the DDR2 PC2-5400 SODIMM, please click here.

OCZ Technology Group, today unveiled a unique memory kit for AMD enthusiasts and power users. The new PC2-5400 (667MHz) Titanium modules (CL5-5-5-15) were designed exclusively for the AMD AM2 platform and are custom-tailored to the extended column address range of the AM2 memory controller. With a doubled page size, access penalties are reduced to ultimately improve system performance. Used on the AM2 platform, the architecture of these modules is particularly beneficial for large CAD model processing and memory intense graphics applications such as filters in Adobe Photoshop or video processing.

Aeneon, a Qimonda AG brand, announced the availability of a new series of overclocking memory modules designed on the needs of demanding users looking for highest speed and reduced latency. The new XTUNE overclocking series consists of DDR2 1066MHz overclocking memory modules offering exceptional system performance without any compromise on fast, stable and reliable system operation. With the XTUNE series Aeneon becomes the worldwide first memory vendor to provide high-performance memory modules without the need of higher supply voltages. The 1066MHz DIMMs operate at the default DDR2 voltage value of 1.8V and support the Enhanced Performance Profile (EPP) standard. The XTUNE DDR2 memory modules are available with densities of 512MB and 1GB. Both single modules and dual channel kits are tested to run at 1066MHz at a latency timing of 5-5-5-15 at the standard DDR2 voltage value of 1.8 V. The new overclocking DIMMs will be available through the authorized Aeneon sales representatives and distributors starting May 2007.

Hynix Semiconductor today announced it has received validation on its DDR3 memory components and modules from Intel. The newly-validated DDR3 products are 1GB DDR3 SDRAM Unbuffered-DIMMs manufactured on 80nm process technology. These devices have operating speeds from 800MHz to 1066MHz with reduced voltage to 1.5V. These speeds are offered in latency combinations of 5-5-5 and 6-6-6 for the 800MHz, and 7-7-7 for the 1066MHz memory modules. Mass production of the 1GB DDR3 on the 80nm line will begin in the third quarter of this year. Hynix plans to manufacture the product on a 66nm process beginning in late 2007.

OCZ Technology Group, today announced two new additions to the Reaper HPC family, reflecting OCZ's dedication to evolving their memory lineup for enthusiasts of all walks of life. The two new kits will be available in two classifications depending on the platform at hand and desired performance levels. While both feature DDR2-800 speeds, the PC2-6400 Reaper Enhanced Bandwidth Edition is designed for optimal performance on NVIDIA nForce 680i chipsets.

Japanese Buffalo Ltd. anounced that it will ship its first DDR3 memory modules in Japan by the end of the month. The company will offer a kit of 512MB memory modules (2x 512MB), a single 1GB module as well as a 2GB set (2x1GB). The DDR3 memory standard is considered as the successor of the DDR2 SDRAM. It promises power consumption reduction of 40% compared to current DDR2 modules, allowing lower operating voltages (1.5V, compared to 1.8V in DDR2 modules). Buffalo's new modules run at 1,066MHz((PC3-8500) and maintain the 240-pin DIMM interface of DDR2. Intel has preliminarily announced that they expect to be able to offer support for DDR3 in mid 2007 with a version of their upcoming P35 Bearlake chipset. AMD's roadmap indicates their own adoption of DDR3 to come in 2008.

Samsung Electronics, has developed the first all-DRAM stacked memory package using 'through silicon via' (TSV) technology, which will soon result in memory packages that are faster, smaller and consume less power. The new wafer-level-processed stacked package (WSP) consists of four 512 megabit DDR2 DRAM chips that offer a combined 2 gigabits (Gb) of high density memory. Using the TSV-processed 2Gb DRAMs, Samsung can create a 4GB DIMM based on advanced WSP technology for the first time. Samsung's proprietary WSP technology not only reduces the overall package size, but also permits the chips to operate faster and use less power.

Mushkin, today released the HP2-6400 5-4-4 modules available in 4GB dual-channel kits and 2GB single DIMMs. Designed for high-performance and value, the HP2-6400 is specified to work at 800MHz, 5-4-4-12 latencies and 2V operating voltage. Each kit is tested beyond its rated specification to ensure the overclocking headroom and quality that Mushkin customers expect. The 4GB HP2-6400 kit will be available in limited quantities through the Mushkin.com manufacturer-direct web store and through authorized resellers and distributors.