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Revenue of Top 10 Foundries Expected to Increase by 20% YoY in 1Q21 in Light of Fully Loaded Capacities, Says TrendForce

Demand in the global foundry market remains strong in 1Q21, according to TrendForce's latest investigations. As various end-products continue to generate high demand for chips, clients of foundries in turn stepped up their procurement activities, which subsequently led to a persistent shortage of production capacities across the foundry industry. TrendForce therefore expects foundries to continue posting strong financial performances in 1Q21, with a 20% YoY growth in the combined revenues of the top 10 foundries, while TSMC, Samsung, and UMC rank as the top three in terms of market share. However, the future reallocation of foundry capacities still remains to be seen, since the industry-wide effort to accelerate the production of automotive chips may indirectly impair the production and lead times of chips for consumer electronics and industrial applications.

TSMC has been maintaining a steady volume of wafer inputs at its 5 nm node, and these wafer inputs are projected to account for 20% of the company's revenue. On the other hand, owing to chip orders from AMD, Nvidia, Qualcomm, and MediaTek, demand for TSMC's 7 nm node is likewise strong and likely to account for 30% of TSMC's revenue, a slight increase from the previous quarter. On the whole, TSMC's revenue is expected to undergo a 25% increase YoY in 1Q21 and set a new high on the back of surging demand for 5G, HPC, and automotive applications.

Samsung is Preparing Exynos SoC with Radeon GPU for Next-Generation PCs

In 2019, AMD and Samsung have announced that they will be joining forces to develop a new class of mobile SoCs, carrying the Exynos name and having a Radeon GPU inside. These Exynos SoCs could be used for almost everything that needs a low-power processor. While the original plan was to have these processors run inside Samsung's mobile phone offerings, it seems like there is another application for them. If the rumors coming from ZDNet Korea are correct, we are in for a surprise. According to the source, Samsung is preparing to use the Exynos SoC with Radeon graphics in the company's next-generation laptops lineup.

While there is little to no information regarding the specifications of the said system, we can expect it to be a fully Samsung-made laptop. That means that Samsung will provide display, RAM, storage, battery, and other components manufactured by the company or its divisions. This laptop is expected to replace Samsung's Galaxy Book S, which currently uses Qualcomm Snapdragon 8cx SoC. The new PC is going to be Windows 10 based system. For more details, we have to wait for the announcement.

Explosive Growth in Automotive DRAM Demand Projected to Surpass 30% CAGR in Next Three Years, Says TrendForce

Driven by such factors as the continued development of autonomous driving technologies and the build-out of 5G infrastructure, the demand for automotive memories will undergo a rapid growth going forward, according to TrendForce's latest investigations. Take Tesla, which is the automotive industry leader in the application of autonomous vehicle technologies, as an example. Tesla has adopted GDDR5 DRAM products from the Model S and X onward because it has also adopted Nvidia's solutions for CPU and GPU. The GDDR5 series had the highest bandwidth at the time to complement these processors. The DRAM content has therefore reached at least 8 GB for vehicles across all model series under Tesla. The Model 3 is further equipped with 14 GB of DRAM, and the next-generation of Tesla vehicles will have 20 GB. If content per box is used as a reference for comparison, then Tesla far surpasses manufacturers of PCs and smartphones in DRAM consumption. TrendForce forecasts that the average DRAM content of cars will continue to grow in the next three years, with a CAGR of more than 30% for the period.

Electronic Arts and Codemasters Establish a New Global Powerhouse for Racing Videogames & Entertainment

Electronic Arts Inc. (NASDAQ: EA), a global leader in interactive entertainment, today announced the completion of its acquisition of Codemasters for 604 pence (approximately US$8.37) in cash for each ordinary share of Codemasters with an implied enterprise value of US$1.2 billion.

The combination of Electronic Arts and Codemasters marks an exciting new era in racing game entertainment. Bringing together two of the most passionate, creative and talented game developer and publishing organizations in the industry will enable further growth and continued success for a stable of the most powerful and popular racing brands in the world, including Formula 1, Need for Speed, DIRT, DiRT Rally/WRC, GRID, Project CARS, Real Racing and more. With this critically acclaimed portfolio, Electronic Arts and Codemasters will be positioned to bring fans a regular cadence of new and exciting racing content, in addition to reaching across more platforms and more regions of the world.

Immerse Yourself in the Future of Gaming Audio with the Xbox Wireless Headset

When we were designing Xbox Series X|S, we wanted to ensure that games feel true-to-life, load incredibly fast, and sound as if you were dropped in the middle of the action. We embraced spatial sound processing by including custom audio hardware to offload audio processing from the CPU, dramatically improving the accessibility, quality, and performance of these experiences. Having a high-quality set of headphones at an affordable price for your new console or existing Xbox One will help you feel immersed, react faster to the action, and connect further with your gaming worlds.

With each new generation of our Xbox accessories, we've raised the bar for innovation by focusing on performance, stand-out features, quality, and accessibility to deliver immersive experiences across console, PC, and mobile devices. We are excited to build on this legacy with the latest accessory to join the family: the new Xbox Wireless Headset.

Qualcomm Announces World's First 10 Gigabit 5G Modem-RF System

Qualcomm Technologies, Inc. today announced the Snapdragon X65 5G Modem-RF System, its fourth-generation 5G modem-to-antenna solution. It is the world's first 10 Gigabit 5G and the first 3GPP release 16 modem-RF system, which is currently sampling to OEMs and targeting commercial device launches in 2021. Snapdragon X65 is the Company's biggest leap in 5G solutions since the commercialization of its first modem-RF system. It is designed to support the fastest 5G speeds currently available with fiber-like wireless performance and makes best use of available spectrum for ultimate network flexibility, capacity and coverage. In addition to the Snapdragon X65, Qualcomm Technologies also announced the Snapdragon X62 5G Modem-RF System, a modem-to-antenna solution optimized for mainstream adoption of mobile broadband applications.

NAND Flash Wafer Prices Stabilize Due to High SSD Demand from PC OEMs, Says TrendForce

NAND Flash demand continues to rise as strong sales of notebook (laptop) computers spur PC OEMs to place additional orders for client SSDs, according to TrendForce's latest investigations. Also, the supply-side inventory for NAND Flash memory has already fallen considerably due to the aggressive stock-up activities of some smartphone brands. With customers in the data center segment expected to ramp up procurement in 2Q21, NAND Flash suppliers have decided to scale back the supply of NAND Flash wafers. Compared with other product categories, wafers have a lower gross margin. As a result of these factors, the decline in contract prices of wafers has been easing over the past two months (i.e., from December of last year to January of this year).

Thermaltake's Pacific V-RTX 3070 and Pacific V-RTX 3080/3090 GPU Water Blocks are Now Available for Purchase

Thermaltake, the leading PC DIY premium brand for Cooling, Gaming Gear, and Enthusiast Memory solutions, is excited to announce that the Pacific V-RTX 3070 GPU Water Block and Pacific V-RTX 3080/3090 GPU Water Block are both ready to sell.

The Pacific V-RTX 3070 GPU Water Block and Pacific V-RTX 3080/3090 GPU Water Block are both RGB designed waterblocks for ASUS ROG STRIX RTX 3070 and 3080/3090 graphic cards; these transparent water blocks are part of the TT RGB ecosystem and support the TT RGB Plus software, displaying 16.8M RGB lighting effects to create the best visual effects for the users' builds. They also support various motherboards with a 5 V addressable RGB header allowing users to control the lighting effects through the synchronized software, such as ASUS Aura Sync and MSI Mystic Light Sync. Their high-water flow design, mirror-finished CU base, and micro-channel structure guarantee these water blocks' performance and visual aesthetics. Therefore, if you happen to get an ASUS ROG STRIX RTX 3070 or a 3080/3090 graphics card, come try out our latest Pacific V-RTX 3070 GPU Water Block or the Pacific V-RTX 3080/3090 GPU Water Block.

TSMC to Put Away More Capacity for Automotive Industry if Possible

TSMC is one of the world's biggest semiconductor manufacturers, and the company is currently the leading provider of the newest technologies like 5 nm and 3 nm, along with advanced packaging. So far, TSMC's biggest customers have included Apple, NVIDIA, AMD, etc., where the company has mainly produced chips for mobile phones and PCs/Servers. However, Taiwan's Economics Ministry has announced that they have spoken to TSMC and have reached an agreement that the company will be putting away some additional capacity for the automotive industry, specifically for the production of automotive chips. The reason for this push is the increasing shortage of semiconductors for automakers, experienced due to the Trump administration sanctions against key Chinese chip factories.

TSMC has stated that "Other than continuously maximizing utilization of our existing capacity, Dr. Wei also confirmed in our investors' conference that we are working with customers closely and moving some of their mature nodes to more advanced nodes, where we have a better capacity to support them". The company also states that their capacities are fully utilized for now, however, TSMC has ensured ministry that "if production can be increased by optimizing production capacity, it will cooperate with the government to regard automotive chips as a primary application." That means that TSMC will not decrease any existing capacity, but rather just evaluate any increased capacity for automotive chip production.

NVIDIA Expands GeForce NOW Game Streaming Service to Turkey, Saudi Arabia, and Australia

NVIDIA has today announced the expansion of its GeForce NOW game streaming service to Turkey, Saudi Arabia, and Australia. The company has worked closely with telecommunication providers to ensure that the streaming service is working well and now they can deliver even more gamers a chance to play their favorite games in the cloud. NVIDIA stated that: "It also offers an opportunity for the world's leading telecommunications firms to deliver high-quality, low-latency PC gaming to nearly any device from the cloud. These partners form the GeForce NOW Alliance, a partnership of operators using RTX Servers and NVIDIA cloud-gaming software to expand and improve cloud gaming globally."

As a reminder, the GeForce NOW is a game streaming service that "brings real-time raytracing to today's biggest blockbusters to underpowered PCs, Macs, Chromebooks, Android and iOS devices." You can access a wide range of games from almost any device and play as much as you like.

NVIDIA to Drop Max-Q and Max-P Differentiators in Mobile GPU Specifications

NVIDIA has recently introduced its 3000 series of Ampere graphics cards designed for mobile/laptop devices. And usually, these GPUs in the past few years have been divided into two configurations: Max-P and Max-Q. The Max-P variant was a maximum performance configuration meant for more power usage and higher temperatures, representing a standard GPU configuration. The Max-Q design was, according to NVIDIA, "a system-wide approach to deliver high performance in thin and light gaming laptops. Every aspect of the laptop, chip, software, PCB design, power delivery, and thermals, are optimized for power and performance." Meaning that the Max-Q variants are more TGP limited compared to the Max-P configuration.


Update 23rd of January 11:35 UTC: NVIDIA spokesperson told Tom's Hardware that: "No, Max-Q branding is not going away. When we originally introduced Max-Q back in 2017, the brand was initially used in GPU naming since Max-Q referred to the GPU TGP only. Today, 3rd Generation Max-Q is broader, and is a holistic set of platform technologies and design approach to building powerful and thin laptops. In addition, to be more transparent about a laptop's exact capabilities, RTX 30 Series laptops now show more information than ever, listing exact TGP, clocks and features supported. You will find this in the control panel which now reports maximum power (TGP+Boost), and support for key features including Dynamic Boost 2, WhisperMode 2, Advanced Optimus, and others, all of which fall under the Max-Q umbrella. We strongly encourage OEMs to list clocks and other technologies a laptop supports, including Advanced Optimus, Dynamic Boost 2, and more. Ultimately, like all laptop features and specs, it is up to the OEM to market what their particular laptop configuration supports.)"

NVIDIA Quietly Relaxes Certification Requirements for NVIDIA G-SYNC Ultimate Badge

UPDATED January 19th 2021: NVIDIA in a statement to Overclock3D had this to say on the issue:
Late last year we updated G-SYNC ULTIMATE to include new display technologies such as OLED and edge-lit LCDs.

All G-SYNC Ultimate displays are powered by advanced NVIDIA G-SYNC processors to deliver a fantastic gaming experience including lifelike HDR, stunning contract, cinematic colour and ultra-low latency gameplay. While the original G-SYNC Ultimate displays were 1000 nits with FALD, the newest displays, like OLED, deliver infinite contrast with only 600-700 nits, and advanced multi-zone edge-lit displays offer remarkable contrast with 600-700 nits. G-SYNC Ultimate was never defined by nits alone nor did it require a VESA DisplayHDR1000 certification. Regular G-SYNC displays are also powered by NVIDIA G-SYNC processors as well.

The ACER X34 S monitor was erroneously listed as G-SYNC ULTIMATE on the NVIDIA web site. It should be listed as "G-SYNC" and the web page is being corrected.
NVIDIA has silently updated their NVIDIA G-SYNC Ultimate requirements compared to their initial assertion. Born as a spin-off from NVIDIA's G-SYNC program, whose requirements have also been laxed compared to their initial requirements for a custom and expensive G-SYNC module that had to be incorporated in monitor designs, the G-SYNC Ultimate badge is supposed to denote the best of the best in the realm of PC monitors: PC monitors that feature NVIDIA's proprietary G-SYNC module and HDR 1000, VESA-certified panels. This is opposed to NVIDIA's current G-SYNC Compatible (which enables monitors sans the G-SYNC module but with support for VESA's VRR standard to feature variable refresh rates) and G-SYNC (for monitors that only feature G-SYNC modules but may be lax in their HDR support) programs.

Critical Flaw in Windows 10 Could Corrupt Your Hard Drive

Windows OS security is taken seriously, as the OS is wide-spread across millions of PCs around the world, however, there may be issues where OS has some security flaw that is found by external researchers. Due to the sheer code base of the new OS like Windows 10, there are a plethora of bugs and security flaws waiting to get discovered by someone. And today, thanks to the team of cybersecurity researchers, we have found out that in Windows 10 file-system called NTFS, there is a bug that corrupts your hard drive by simply triggering a specific variable name in a file.

If the end-user inside Windows 10 tries to access the NTFS attribute called "$i30" in a specific way, the flaw is exploited. The NTFS search index attribute, specifically the string "$i30", is containing a list of files and subfolders in a directory, and there is even a log of deleted files and folders. After running a specific command inside the command line (CMD) or inside the browser, Windows will start to display warnings of "File or directory is corrupted and cannot be read". After that, the OS will prompt a user to restart the machine and repair the damaged drive, so the Windows disk check utility will start. Once corrupted, Windows 10 will start displaying a notification indicating that the main file table (MFT) on the particular disk is corrupted and thus can not operate. Starting from the build Windows 10 Build 1803 the OS is vulnerable until the current version and a possible fix is expected to be released soon.

NVIDIA Discloses Listing of Mice Compatible With Reflex Latency Analyzer

NVIDIA has published listings of gaming mice compatible with their Reflex latency reduction technology - specifically, mice that are compatible with NVIDIA's Latency Analyzer, which will ensure the best responsiveness from your NVIDIA-equipped PC in gaming scenarios. The mice listing is always pending updates as more and more manufacturers submit their mice for NVIDIA certification, and the list of certified ones is currently bigger than what NVIDIA is sharing in renders.

As per NVIDIA, the listing of currently-supported and certified reflex mice features a total of 11 mice. Acer features three certified mice in the form of the Acer GM310, Predator Cestus 330, and Predator Cestus 350; Alienware's only mice is the AW610M; ASUS ROG counts with the Chakram Core; Corsair's DARK CORE RGB PRO/ RGB PRO SE make the cut; Logitech features the G Pro X Superlight; MSI counts with the GM 41 gaming mouse in the roster; The Razer Death Adder V2 and SteelSeries Rival 3 also make the cut. These are mice that are certified to provide compatibility with NVIDIA's Reflex ecosystem, which takes into account your graphics card, PC monitor and gaming mouse to ensure the lowest latency and fastest system response times for competitive gaming.

Shipped Pre-built PC Systems See 13% Rise in Sales in 2020 Compared to 2019

The International Data Corporation (IDC) has revealed PC shipping growth numbers for 2020 - counting desktops, notebooks (including Chromebooks) and workstations (but excluding laptops and servers), and the results are clear. In a currently-pandemic world, and with the urge and necessity for teleworking efforts so as to reduce personal exposure to risk environments, we've seen an unprecedented demand for technological components. Whether in shortages for the latest "comfort" technologies such as dedicated graphics cards, latest-gen consoles, or even webcams, it's been clear that citizens of the world have been increasingly investing their money in technological devices. This need - either for work, for bridging social distances through the Internet, or for entertainment - has led the pre-built PC ecosystem shipments to increase as much as 13% in 2020 - and a global shipment number set at 302.6 million units.

This year-over-year (YoY) increase is bolstered, mainly, by rises in sales throughout Q4 of 2020, where global PC shipments achieved an outstanding 26% increase from Q4 2019 - in the fourth quarter of 2020 alone, 91.6 million units were shipped. In that particular quarter, Lenovo led the top three vendors with a 25.2% share of the sales, followed by HP (20.9%) and Dell (17.2%). Apple appears in fourth place with a mere 8% market share, but shows the strongest growth among the top 5 sellers, at 49.2% YoY - and that's with Apple's comparatively small product portfolio when put against any of the other top three vendors.

AMD Talks Zen 4 and RDNA 3, Promises to Offer Extremely Competitive Products

AMD is always in development mode and just when they launch a new product, the company is always gearing up for the next-generation of devices. Just a few months ago, back in November, AMD has launched its Zen 3 core, and today we get to hear about the next steps that the company is taking to stay competitive and grow its product portfolio. In the AnandTech interview with Dr. Lisa Su, and The Street interview with Rick Bergman, the EVP of AMD's Computing and Graphics Business Group, we have gathered information about AMD's plans for Zen 4 core development and RDNA 3 performance target.

Starting with Zen 4, AMD plans to migrate to the AM5 platform, bringing the new DDR5 and USB 4.0 protocols. The current aim of Zen 4 is to be extremely competitive among competing products and to bring many IPC improvements. Just like Zen 3 used many small advances in cache structures, branch prediction, and pipelines, Zen 4 is aiming to achieve a similar thing with its debut. The state of x86 architecture offers little room for improvement, however, when the advancement is done in many places it adds up quite well, as we could see with 19% IPC improvement of Zen 3 over the previous generation Zen 2 core. As the new core will use TSMC's advanced 5 nm process, there is a possibility to have even more cores found inside CCX/CCD complexes. We are expecting to see Zen 4 sometime close to the end of 2021.

Alienware Upgrades Laptop Lineup and Unveils Aurora Ryzen Edition R10 Desktop

Alienware, the gaming division of Dell Technologies, has today announced a lineup refresh, meaning that all of the existing products will get upgraded to versions with the latest hardware. And to start off, the company has equipped their thin and powerful Alienware m15 R4 and m17 R4 laptops with the latest hardware we saw announced just yesterday. The laptops are equipped with 12-phase voltage regulation modules to power the newest NVIDIA GeForce RTX 3000 series of mobile GPUs. To pair with a strong GPU, Alienware decided to use 10th generation Intel Comet Lake-H designs. These new laptops can be equipped with up to 4 TB of PCIe 3.0 NVMe SSD storage and up to 32 GB of 2933 MHz RAM. For display, options range from FHD LCD to a 4K OLED panel and 360 Hz refresh rate for the m17 R4 model.

GPUs to See Price Increase Due to Import Tariffs, Other PC Components to Follow

Yesterday, we have reported that ASUS is officially increasing the prices of their graphics cards and motherboards, due to increased component and logistics costs. What the company meant by that was not exactly clear to everyone, as it looked like the company has adjusted to the current market prices exceeding the MSRP of components like graphics cards. The GPUs are today selling at much higher prices compared to the original MSRP and it is representing a real problem for consumers. Today, we get to see what is the underlying problem behind the announcement we saw yesterday and if we are going to see more of that in the close future.

According to the New York Times, the Chinese import tariff exemptions have expired with the arrival of a new year (2021) and we can expect the tariffs to start from 7.5%-25%, which will massively increase component costs. A Reddit user has noted that MSRP will increase about $80 for every major GPU manufacturer like ASUS, GIGABYTE, PNY, Zotac, etc. so we are expecting MSRP adjustment from other companies to follow just like ASUS did. The import tariff exemptions are also supposed to increase MSRPs of other PC components like motherboards, SSDs, PSUs, cases... everything without exemption. As a product of a trade war between China and the Trump administration, it remains a question will these tariffs get easier shortly, so consumers can afford their desired components.

Hedge Fund Urges Intel to Outsource Chip Production: Reuters

Intel is familiar with chip manufacturing problems since the company started the development of a 10 nm silicon semiconductor node. The latest node is coming years late with many IPs getting held back thanks to the inability of the company to produce it. All of Intel's chip production was historically happening at Intel's facilities, however, given the fact that the demand for 14 nm products is exceeding production capability, the company was forced to turn to external foundries like TSMC to compensate for its lack of capacity. TSMC has a contract with Intel to produce silicon for things like chipsets, which is offloading a lot of capacity for the company. Today, thanks to the exclusive information obtained by Reuters, we have information that a certain New York hedge fund, Third Point LLC, is advising the company about the future of its manufacturing.

The hedge fund is reportedly accounting for about one billion USD worth of assets in Intel, thus making it a huge and one influencing shareholder. The Third Point Chief Executive Daniel Loeb wrote a letter to Intel Chairman Omar Ishrak to take immediate action to boost the company's state as a major provider of processors for PCs and data centers. The company has noted that Intel needs to outsource more of its chip production to satisfy the market needs, so it can stay competitive with the industry. The poor performance of Intel has reflected on the company shares, which have declined about 21% this year. This has awoken the shareholders and now we see that they are demanding more aggressiveness from the company and a plan to outsource more of the chip production to partner foundries like TSMC and Samsung. It remains to be seen how Intel responds and what changes are to take place.

Thermaltake Unveils TOUGHFAN 12 Turbo High Static Pressure Radiator Fan

Thermaltake, the leading PC DIY premium brand for Cooling, Gaming Gear, and Enthusiast Memory solutions, is excited to announce that the new TOUGHFAN 12 Turbo High Static Pressure Radiator Fan is available for purchase. The TOUGHFAN 12 Turbo is a PWM controlled fan that now performs at a maximum speed of 2500 RPM. These high-quality, great performance fans are made with our 2nd generation hydraulic bearing and metal reinforced hub, which are optimized for high static pressure while maintaining minimal noise levels. The liquid crystal polymer (LCP) fan blades are extremely tensile in strength; their low thermal expansion coefficient can reduce the fan's vibration when running at full speed. If you think you need some extra boost from the Thermaltake's TOUGHFAN series products, don't hesitate to try out the TOUGHFAN 12 Turbo High Static Pressure Radiator Fan.

Tachyum Prodigy Software Emulation Systems Now Available for Pre-Order

Tachyum Inc. today announced that it is signing early adopter customers for the software emulation system for its Prodigy Universal Processor, customers may begin the process of native software development (i.e. using Prodigy Instruction Set Architecture) and porting applications to run on Prodigy. Prodigy software emulation systems will be available at the end of January 2021.

Customers and partners can use Prodigy's software emulation for evaluation, development and debug, and with it, they can begin to transition existing applications that demand high performance and low power to run optimally on Prodigy processors. Pre-built systems include a Prodigy emulator, native Linux, toolchains, compilers, user mode applications, x86, ARM and RISC-V emulators. Software updates will be issued as needed.

Intel Core i7-11700K "Rocket Lake" CPU Outperforms AMD Ryzen 9 5950X in Single-Core Tests

Intel's Rocket Lake-S platform is scheduled to arrive at the beginning of the following year, which is just a few days away. The Rocket Lake lineup of processors is going to be Intel's 11th generation of Core desktop CPUs and the platform is expected to make a debut with Intel's newest Cypress Cove core design. Thanks to the Geekbench 5 submission, we have the latest information about the performance of the upcoming Intel Core i7-11700K 8C/16T processor. Based on the Cypress Cove core, the CPU is allegedly bringing a double-digit IPC increase, according to Intel.

In the single-core result, the CPU has managed to score 1807 points, while the multi-core score is 10673 points. The CPU ran at the base clock of 3.6 GHz, while the boost frequency is fixed at 5.0 GHz. Compared to the previous, 10th generation, Intel Core i7-10700K which scores 1349 single-core score and 8973 points multi-core score, the Rocket Lake CPU has managed to put out 34% higher single-core and 19% higher multi-core score. When it comes to the comparison to AMD offerings, the highest-end Ryzen 9 5950X is about 7.5% slower in single-core result, and of course much faster in multi-core result thanks to double the number of cores.

Prices of NAND Flash Controller ICs Poised to Rise by 15-20% due to Tightening Production Capacity for Foundry Services, Says TrendForce

In the upstream semiconductor industry, the major foundries such as TSMC and UMC are reporting fully loaded capacities, while in the downstream, the available production capacity for OSAT is also lacking, according to TrendForce's latest investigations. Given this situation, suppliers of NAND Flash controller ICs such as Phison and Silicon Motion are now unable to meet upside demand from their clients. Not only have many controller IC suppliers temporarily stopped offering quotes for new orders, but they are also even considering raising prices soon because the negotiations between NAND Flash suppliers and module houses over 1Q21 contracts are now at the critical juncture. The potential increases in prices of controller ICs from outsourced suppliers (IC design houses) are currently estimated to be the range of 15-20%.

With regards to the demand side, demand has risen significantly for eMMC solutions with medium- and low-density specifications (i.e., 64 GB and lower), for which NAND Flash suppliers have mostly stopped updating the NAND Flash process technology, while maintaining support with the legacy 2D NAND or the 64L 3D NAND process. This is on account of strong sales for Chromebook devices and TVs. As older processes gradually account for a lowering portion of bit output proportions from NAND Flash suppliers, these companies are exhibiting a lowered willingness to directly supply such eMMC products to clients. As a result, clients now need to turn to memory module houses, which are able to source NAND Flash components and controllers, to procure eMMC products in substantial quantities.

AMD Ryzen 5 5600H "Cezanne" Processor Benchmarked, Crushes Renoir in Single Core and Multi Core Performance

With the launch of AMD's next-generation mobile processors just around the corner, with an expected launch date in the beginning of 2021 at the CES virtual event. The Cezanne lineup, as it is called, is based on AMD's latest Zen 3 core, which brings many IPC improvements, along with better frequency scaling thanks to the refined architecture design. Today, we get to see just how much the new Cezanne generation brings to the table thanks to the GeekBench 5 submission. In the test system, a Ryzen 5 5600H mobile processor was used, found inside of a Xiaomi Mi Notebook, paired with 16 GB of RAM.

As a reminder, the AMD Ryzen 5 5600H is a six-core, twelve threaded processor. So you are wondering how the performance looks like. Well, in the single-core test, the Zen 3 enabled core has scored 1372 points, while the multi-threaded performance result equaled 5713 points. If we compare that to the last generation Zen 2 based "Renoir" design, the equivalent Ryzen 5 4600H processor, the new design is about 37% faster in single-threaded, and about 14% faster in multi-threaded workloads. We are waiting for the announcement to see the complete AMD Cezanne lineup and see the designs it will bring.
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