Videocardz is advancing an exclusive in that Intel seems to be about to introduce even more cores in a single package than previously thought. Intel's X299 platform, which we've just started officially started seeing some motherboards for (just scroll down on our news feed), looks to be the awakening of a slumbering giant. But you don't have to believe me on this: before we ever knew of AMD's Ryzen line of processors (much less about their Threadripper line), leaks on Intel's Skylake-X and Kaby Lake-X processors only showed core counts up to 10-cores - in line with previous Intel HEDT platforms (see below image.) Cue more recent leaks, and it would seem that Intel is increasing the core-counts on its upcoming platform on a daily basis - especially if the most recent leak referencing 14, 16 and 18-core parts pans out. (I am reminded of a "moar cores" meme that used to float around the web. Maybe one of you in the comments can find it for me?)

A new, leaked slide on Intel's X-series processors shows 18, 16, 14, and 12-core configurations as being available on the upcoming X299 platform, leveraging Intel's turbo Boost Max Technology 3.0 (which is apparently only available on Intel's Core i9-7820X, 7900X, 7920X (which we know to be a 12-core part), 7940X (probably the 14-core), 7960X (16-core) and the punchline 7980XE 18-core processor, which should see a price as eye-watering as that name tumbles around on the tip of the tongue. There is also mention of a "Rebalanced Intel Smart Cache hierarchy". But you don't want me to be rambling on about this. You want to comment about this story. Feel free to partake in a joyous conversation over these news (I'll also leave you with a bonus picture of some purported, upcoming Intel X-series packaging efforts. They're certainly colorful.)

ASRock showed off its premium gaming-grade X299 Fatal1ty Professional Gaming i9 and X299 Killer SLI/ac motherboards. The two boards are based on a common PCB, but differ with the former featuring 10 GbE network connectivity and Creative Sound Blaster Cinema audio DSP, while the latter lacks them. If you want the feature-set of the X299 Killer SLI/ac but the white+black color scheme isn't rubbing of on you, ASRock has you covered with the X299 Fatal1ty Gaming K6. Drawing power from a combination of 24-pin ATX and 8-pin EPS connectors, the boards employ a 14-phase VRM to condition power to the CPU, which is wired to eight DDR4 DIMM slots, and four PCI-Express 3.0 x16.

Storage connectivity on the boards includes three 32 Gb/s M.2 slots, and six SATA 6 Gb/s ports. Both boards further feature two USB 3.1 ports (of which one is type-C), about 8 USB 3.0 ports, and network connectivity that includes 802.11ac WLAN, Bluetooth 4.1, and at least one gigabit Ethernet connection driven by an Intel i219-V controller. The Fatal1ty Gaming i9 tops this with Aquantia AQC107 controller-driven 10 GbE. The two feature Aura Sync RGB headers.

ASUS returned to its extremely durable TUF (The Ultimate Force) line of motherboards with the TUF X299 Mark 2. You'll notice that it dropped the "Sabertooth" moniker. This LGA2066 motherboard covers all the feature-set checkboxes of a premium motherboard plus the military-grade durability people have come to expect of the TUF series. It draws power from a combination of 24-pin ATX, 4-pin ATX, and 8-pin EPS power connectors, conditioning it using an 8-phase VRM.

The TUF X299 Mark 2 features eight DDR4 DIMM slots, three PCI-Express 3.0 x16 slots (x16/x16/NC or x16/x8/x8), an open-ended x4, and two x1 slots completing the expansion area. Storage features include two 32 Gb/s M.2 slots (of which one is perpendicular), and six SATA 6 Gb/s ports. USB connectivity includes two USB 3.1 ports (one each type-A and type-C), and eight USB 3.0. 8-channel HD audio driven by a Realtek ALC1220A CODEC, and a single gigabit Ethernet connection, powered by Intel i219-V make for the rest of it.

Professional overclocker Nick Shih has led ASRock design teams through some of the most well laid-out motherboards for enthusiasts. His latest creation is the ASRock X299 OC Formula. This board gets down to the brass-tacks of overclocking-grade motherboards with a simple layout that's stripped of everything unnecessary. It draws power from a 24-pin ATX, 8-pin EPS, a 6-pin PCIe, and 4-pin ATX. The CPU is powered by a 14-phase VRM, and wired to four DDR4 DIMM slots, and five PCI-Express 3.0 x16 slots. A PCIe 3.0 x4 makes for the rest of the expansion. Overclocking features include ultra fine-grained voltage control using onboard controls, and an OC Formula kit. Storage connectivity includes two 32 Gb/s M.2-22110, and eight SATA 6 Gb/s. 802.11ac WLAN, and gigabit Ethernet, besides ASRock's top of the line onboard audio make for the rest of it.

ASRock did it! Finally, there's an Intel HEDT platform motherboard with full quad-channel DDR4 memory. The new X299E-ITX/ac is for those who need up to 18 CPU cores and up to 64 GB of quad-channel DDR4 memory in their SFF machines for reasons. The board manages its limited PCB real-estate by going vertical. It features two riser cards, one with a few onboard controllers, and a pair of 32 Gb/s M.2 slots), and the other riser with SATA 6 Gb/s ports, a third M.2 slot, and the headers such as USB 3.1. The board draws power from 24-pin ATX and 8-pin EPS connectors, conditioning it for the LGA2066 CPU using a 7-phase VRM. The lone expansion slot is a PCI-Express 3.0 x16, memory is handled by four DDR4 SO-DIMM slots. Connectivity includes two Intel I219-V driven gigabit Ethernet interfaces, 802.11ac WLAN, and Bluetooth 4.1.

BIOSTAR has consistently improved its motherboard product design back to the standards of its TPower glory-days, and unveiled this stunning looking flagship LGA2066 motherboard, the Racing X299GT9. Built in the E-ATX form-factor, the board features a well-spaced out layout, and draws power from a pair of 8-pin EPS power connectors, and a 6-pin PCIe, besides 24-pin ATX. It conditions it for the CPU with a 14-phase VRM. The CPU is wired to eight DDR4 DIMM slots, and seven PCI-Express 3.0 x16 slots (x16/x16/x8/x4/x4/x4/x4).

Storage connectivity on the BIOSTAR Racing X299GT9 includes two 32 Gb/s M.2 slots (stacked), two 32 Gb/s U.2 ports, and four SATA 6 Gb/s ports. Connectivity includes a 10 GbE connection driven by Intel X550AT processor), a second 1 GbE driven by Intel i219-V, USB connectivity includes two 10 Gb/s USB 3.1 ports (one each type-A and type-C), and six 5 Gb/s USB 3.0. The onboard audio features a Hi-Fi circuit. The board is peppered with RGB LEDs and additional headers.

ASUS showed off its PRIME X299-A socket LGA2066 motherboard. The PRIME series consists of ASUS' mainline motherboards, and a consistent product design theme follows through the entire lineup. We reckon that the PRIME X299-A will be the "entry-level" socket LGA2066 offering by ASUS, topped by the PRIME X299-PRO and PRIME X299-Deluxe. Built in the ATX form-factor, the board draws power from 24-pin ATX, 8-pin EPS, and a 4-pin ATX power connector. It uses a simple 8-phase VRM to condition power for the CPU. The LGA2066 socket is wired to eight DDR4 DIMM slots, in addition to three PCI-Express 3.0 x16 slots (x16/x16/NC or x16/x8/x8). Two close-ended PCI-Express 3.0 x4 and an x1 slot make for the rest of the expansion.

Storage connectivity includes two 32 Gb/s M.2 slots (one 80 mm and the other 110 mm), and eight SATA 6 Gb/s. There's just the one gigabit Ethernet interface driven by an Intel I219-V controller, and an onboard audio solution featuring Realtek ALC1220 (120 dBA SNR) CODEC, audio-grade capacitors, and ground-layer isolation. This board could be priced around the $200 mark.

Here's the first picture of the GIGABYTE X299 Aorus Gaming 9 motherboard, a TechPowerUp-exclusive. This socket LGA2066 motherboard is ready for upcoming Core i7 "Kaby Lake-X" 4-core, and "Skylake-X" 6-core, 8-core, 10-core, and 12-core processors. Based on Intel X299 Express chipset, this board draws power from two 8-pin EPS power connectors, besides 24-pin ATX. This could become the norm with X299 motherboards. There could either be a second 8-pin EPS or a second 4-pin ATX connector. A 12-phase VRM conditions power.

The LGA2066 socket is wired to four PCI-Express 3.0 x16 slots, which can be configured as electrical x8/x8/x8/x8 or x16/NC/x16/NC or x16/NC/x8/x8 with "Skylake-X" 10-core and 12-core chips; or x8/NC/x8/x4 or x16/NC/NC/x4 with "Kaby Lake-X" quad-core and "Skylake-X" 6-core and 8-core chips. The 5th x16 slot is electrical x4 and wired to the PCH. There are plenty of storage options, including two 32 Gb/s M.2 (up to 80 mm) slots, a 32 Gb/s M.2 (up to 110 mm) slot, with native NVMe RAID and Optane support; and eight SATA 6 Gb/s. The board features ASMedia ASM3142 USB 3.1 controller with type-A and type-C ports on the rear panel, as well as additional ports through headers.

Disclaimer: It's currently unclear whether or not the majority of these are actual X299 motherboards. Remember MSI's GODLIKE tease, which was expected to be a X299 motherboard due to the number of PCIe slots on offer, but ended up being a Z270-based one? Well, we remember, hence why we start with this disclaimer to pour some cold water on expectations. However, there is one model that can be said to be a X299 offering pretty confidently: MSI's tease of a new Gaming Pro motherboard, which shows the four RAM slots as close to the I/O bracket: a design usually reserved for quad-channel supporting platforms. Port design in the PCIe and M.2 fronts seems similar to the GODLIKE Z270, but it would seem that MSI has designed another kind of an M.2 Shield interface, which now encircles a PCIe port while cooling two simultaneous M.2 SSDs.

The next motherboard, which we can't confirm is really a X299 based-one, is teased by ASUS, under its Republic of gamers branding, which shows the integration a an LCD screen in the motherboard footprint. The LCD seems basic enough, and could be useful so as to visually check operating frequencies and temperatures, though ASUS naturally had to add their ROG bling to it. Seems like simple LED support was too 2016 for them.

SiSoft Sandra is one of the best (and more common) sources for details on upcoming, as-of-yet-unreleased hardware details and characteristics. Now, details on one of Intel's upcoming Skylake-X parts have surfaced, which gives us some details on what are likely final specifications, considering how close we are to X299's accelerated release.

The processor in the spotlight is one of Intel's 10-core processors, the Core i9 7900X (which is erroneously reported by the software as the Core i7 7900X), Intel's 10-core CPU. While initial reports pegged this CPU at as running at clock speeds of 3.30 GHz base and with 4.30 GHz Turbo Boost, it would seem Intel's release silicon will leverage much higher stock speeds, with the reported values on this SiSoft report being a staggering 4.0 GHz base, and 4.5 GHz Turbo Boost. These are extremely high clock speeds for a ten-core part, but all the other details about the Core i9 7900X check out: there are 14,080 KB (13.75 MB) of shared L3 cache, 1 MB L2 cache per core (for a total of 10 MB), as well as a 175 W TDP. This difference in clock speeds (especially when you compare it to Ryzen's much lower clock speeds) are probably an indicator of not only architectural differences between both designs, but a statement on Intel's fabrication process capabilities. And as an added bonus, check the motherboard that was used: a juicy, as-of-yet-unknown, X299 Gigabyte AORUS Gaming 7. Two details of this magnitude in a single screenshot? It's clearly a case of having your cake and eating it too.

PC Cooling innovator CRYORIG, is announcing two new CPU cooling projects ahead of Computex 2017. The CRYORIG R5 high-end single tower and the Cu Series of Copper Fin enhanced coolers. The R5 and Cu Series will both make their debut in the coming Computex 2017 from May 30th to June 3rd.

The R5 is the second cooler in CRYORIG's R series of flagship coolers. The R5 is the missing piece to CRYORIG's PC cooling lineup. It is a high-end dual-fan single tower that is designed to stay within the mainboard's CPU Keep-Out-Zone. This means that the CRYORIG R5 has Zero RAM Interference, even on Intel's X99/X299 based platforms. Made with performance in-mind the R5 contains multiple CRYORIG cooling innovations including: Convex-Align cooler base optimization, Multi-Seg Quick Mount System, 6 CRYORIG High-end Copper Heatpipes, CRYORIG Dual Fan Fin Optimizations and more. Dual XF140 800-1400 rpm PWM fans will be attached front and back for enhanced performance. The R5 will also see the debut of CRYORIG's brand new Quick Lock Mounting, that promises to simplify the way coolers are mounted.

MSI posted its third teaser pic for one of its upcoming socket LGA2066 motherboards, which is likely the X299 Gaming Pro. Designed for Core i7 "Kaby Lake-X" and Core i9 "Skylake-X" processors, the board appears to feature eight DDR4 DIMM slots (four slots on the left side of the socket). The teaser also gives us a glance of the LGA2066 socket, which could feature a similar retention mechanism to the current LGA2011v3 socket, even if the cooler support isn't consistent, given that some cooler manufacturers such as Noctua are already giving away LGA2066 brackets. The teaser pic also reveals two CPU power inputs, an 8-pin EPS and 4-pin ATX. This is unusual for a "mid-range" brand extension such as Gaming Pro, unless some of the Core i9 "Skylake-X" chips really do have >140W TDPs that demand more power inputs than your run of the mill single 8-pin EPS.

The folks at MSI seem to be particularly fond of puzzles at this point in time, for no discernible reason. I say so because they've been giving us snippets of an upcoming high-end motherboard, which we have previously covered. At the time, we posited it would fall somewhere along the X299-end of the spectrum, considering the huge amount of PCIe x16 ports on-board.

It would seem those suspicions were founded, since MSI's other GODLIKE branded motherboards (which means they have all the bells & whistles available on time of their release) were X99-based, so it would follow that the new GODLIKE would usher in their footsteps as well. From the new piece of the puzzle, we can glean that this motherboard will offer, in addition to its 4x PCIe x16 ports and 3x M.2 slots over the X299's 44 PCIe lanes, 3x Ethernet connectors, 6x USB 3.1, and 2x Wi-Fi antennas. Expect this motherboard to be one of the most feature-packed offerings for Intel's expected ninth coming (of their Core i9-branded HEDT processors, that is.)

Recent reports mentioned Intel's moves to bring forward the launch of their Basin Falls HEDT platform, which succeeds their X99 platform. Intel is doing this in hopes to hold the blue flag against AMD's upcoming X399 Ryzen-based HEDT platform (there's seemingly a war in numbers here), pitting 4, 6, 8, 10, and 12-core CPUs against AMD's expected 12-core and 16-core processors.

As such, it's only natural motherboard makers would also have to expedite their work on X299-based motherboards, and it would seem that MSI has done just that, simultaneously advancing their marketing campaign. A teaser image from the company showcases an as-of-yet unreleased motherboard (not just any motherboard, but the "Best. Motherboard. Ever") which boasts of a trio of M.2 slots (with MSI's M.2 Shield thermal solution), and four PCIe x16 slots. Are you still counting the number of PCI lanes needed to drive all these slots? Well, it just so happens Intel's Basin Falls is expected to deliver up to 44 PCIe 3.0 lanes, so those should be enough to at least make this ridiculous amount of slots worthwhile... For some use cases. There's also an additional power-supply connector on top of the first PCIe slot, which should increase power delivery for these. It's almost open season on these HEDT platforms, kind sirs.

Intel's immediate answer to AMD's Ryzen challenge, the Core i7-7740K processor and "Basin Falls" platform, could launch on the 12th of June, 2017. Intel is the main sponsor of the PC Gaming Show hosted by PC Gamer magazine, in the backdrop of E3-2017, and we expect it to launch its first product, the Core i7-7740K on the occasion. Intel could announce retail availability of the chips immediately after. The Core i7-7740K launch will be accompanied by a more cost-effective Core i5-7640K, and the X299 Express chipset. Motherboard vendors could announce their first waves of socket LGA2066 motherboards based on this chipset.

Built on the 14 nm "Kaby Lake-X" silicon, the Core i7-7740K is a quad-core processor featuring higher clock speeds than the current i7-7700K. It features a dual-channel integrated memory controller, and lacks integrated graphics. It could feature a 28-lane PCI-Express gen 3.0 root-complex. The only ace up its sleeve is the X299 platform itself, which could be ready for bigger six-, eight-, and ten-core processors with more PCIe lane budgets.

Noctua today announced that it will continue its tradition of supplying customers with its premium-class SecuFirm2 mounting kits for novel platforms free of charge. While most current Noctua heatsinks support the new LGA2066 socket of Intel's 'Basin Falls' X299 platform for 'Skylake-X' and 'Kaby Lake-X' CPUs out of the box, older models can be upgraded with the NM-I2011 or NM-i20xx kits at no additional cost.

"We're determined to provide the best possible support to our customers and, over the years, we've sent many thousands of mounting kits free of charge to users who wanted to upgrade to new platforms", says Roland Mossig (Noctua CEO). "With Skylake-X just around the corner, we're pleased to announce that we'll extend this offer for LGA2066. Owners of older Noctua retail heatsinks that don't support LGA2011/LGA2066 out of the box will be able to upgrade to the new socket free of charge!"

Two days, two leaks on an upcoming Intel platform (the accelerated release dates gods are working hard with the blue giant, it would seem.) Now, it's Intel's own i7-7740K, a Kaby Lake-X HEDT processor that packs 4 cores and 8 threads, which is interesting when one considers that AMD's latest mainstream processors, Ryzen, already pack double the cores and threads in a non-HEDT platform. Interesting things about the Kaby Lake-X processors is that they are rumored to carry 16x PCIe 3.0 lane from the CPU (which can be configured as a singularly populated 16x or as a triple-populated 1x @ 8x and 2x @ 4x PCIe ports. Since these parts are reported as being based of on consumer, LGA-1151 Kaby Lake processors, it would seem these eschew Intel's integrated graphics, thus saving die space. And these do seem to deliver a quad-channel memory controller as well, though we've seen with Ryzen R7 reviews how much of a difference that makes for some of the use cases.

Intel's X299 HEDT platform, whose launch we recently covered as having been pushed forward by the company so as to better compete against AMD's upcoming X399 HEDT platform, has some new, juicy rumors floating about it. Namely, Bench.Life has reported that Intel's upcoming Kaby Lake-X and Skylake-X lines of high performance CPUs will also feature 12-core offerings on its Skylake-X materialization, instead of just the previously reported 6, 8, and 10-core designs.

This really looks like an Intel that's stretching its manufacturing and chip design prowess so as to prevent itself from being buried in higher-performing, higher core and thread count offerings from its rival AMD, which has turned Intel's line-up in the mainstream consumer market head-over-heels already. Latest reports peg the new series as being presented on Computex 2017 (specifically, on may 30th), with availability being expected on June 26th. Which platform are most interested in, and what do you think of this move from Intel?

According to DigiTimes, sources among Taiwan-based PC vendors have indicated that Intel's upcoming Basin Falls platform, which includes Skylake-X and Kaby Lake-X processors on a new X299 chipset, will be unveiled at Computex 2017 (May 30th, June 3rd), in Taipei - two months earlier than expected. This move comes accompanied by an accelerated launch of the Coffee Lake microarchitecture, which still uses the 14 nm process, to August 2017 from an initial January 2018 launch. If true, this is big in a number of ways - that Intel would bring forward a product launch 4 months has some interesting implications - or at least, confirmations.

Remember that Coffee Lake is supposed to carry an increased number of cores in its mainstream designs. And we all know how Intel's line-up has almost been torn apart by Ryzen's aggressive core and thread-count, with AMD offering more cores and threads than Intel at virtually all price-points. And even if an argument is made regarding Intel's better gaming performance, that's one scenario out of many. Future proofing, professional work, multimedia, all of these assert AMD's dominance in a pure price-performance ratio. I, for one, would gladly give up some FPS in some games and accept an increased number of cores than go the other way around (especially with AMD's platform support and the number of patches that have increased game performance on Ryzen CPUs.)

In an interesting report that would give some credence to reports of AMD's take on the HEDT market, it would seem that some Ryzen chips with 12 Cores and 24 Threads are making the rounds. Having an entire platform built for a single processor would have always beenludicrous; now, AMD seems to be readying a true competitor to Intel's X99 and its supposed successor, X299 (though AMD does have an advantage in naming, if its upcoming X399 platform really does ship with that naming scheme.)

Intel's next-generation HEDT processor platform, based on the "Kaby Lake" micro-architecture, is the 7th generation Core i7 "Kaby Lake-X" family. The platform is based on the new LGA2066 CPU socket, and a new motherboard chipset, the Intel X299 Express. The platform builds on the strengths of the Intel HEDT (high-end desktop) market-segment, in offering double the memory bandwidth and PCIe lanes as the LGA1151 mainline desktop platform, and succeeds the current Core "Broadwell-E" family processors that run on socket LGA2011v3 motherboards, with Intel X99 Express chipsets.

The first chip on the X299 platform isn't a meaty two-figure core-count chip, but the 4-core Intel Core i7-7740K. This chip lacks an integrated graphics core. Its TDP has been increased to 112W from 91W of the i7-7700K. Someone with access to an i7-7740K sample paired it with an ASRock X299 Fatal1ty Gaming i7 motherboard, and posted SiSoft SANDRA processor arithmetic and multimedia performance scores of the chip. The chip performs close to the Ryzen 5 1600X six-core chip, but falls short of the Ryzen 7 1800X.