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NVIDIA Leads the Edge AI Chipset Market but Competition is Intensifying: ABI Research

Diversity is the name of the game when it comes to the edge Artificial Intelligence (AI) chipset industry. In 2019, the AI industry is witnessing the continual migration of AI workloads, particularly AI inference, to edge devices, including on-premise servers, gateways, and end-devices and sensors. Based on the AI development in 17 vertical markets, ABI Research, a global tech market advisory firm, estimates that the edge AI chipset market will grow from US $2.6 billion in 2019 to US $7.6 billion by 2024, with no vendor commanding more than 40% of the market.

The frontrunner of this market is NVIDIA, with a 39% revenue share in the first half of 2019. The GPU vendor has a strong presence in key AI verticals that are currently leading in AI deployments, such as automotive, camera systems, robotics, and smart manufacturing. "In the face of different use cases, NVIDIA chooses to release GPU chipsets with different computational and power budgets. In combination with its large developer ecosystem and partnerships with academic and research institutions, the chipset vendor has developed a strong foothold in the edge AI industry," said Lian Jye Su, Principal Analyst at ABI Research.

NVIDIA is facing stiff competition from Intel with its comprehensive chipset portfolio, from Xeon CPU to Mobileye and Movidius Myriad. At the same time, FPGA vendors, such as Xilinx, QuickLogic, and Lattice Semiconductor, are creating compelling solutions for industrial AI applications. One missing vertical from NVIDIA's wide footprint is consumer electronics, specifically smartphones. In recent years, AI processing in smartphones has been driven by smartphone chipset manufacturers and smartphone vendors, such as Qualcomm, Huawei, and Apple. In smart home applications, MediaTek and Amlogic are making their presence known through the widespread adoption of voice control front ends and smart appliances.

Intel Discontinues Omni-Path Enabled Xeon Processors

Intel's Omni-Path technology has been used primarily in high performance computing market, in order to provide high speed interconnect between Intel Xeon CPUs, with speeds reaching around 100 Gbps. Accompanied by different design and system integration that Omni-Path uses, it was a bit difficult to integrate into server system, while not adding much value that other technologies couldn't match or beat.

Because of these reasons, Intel is now discontinuing its last product capable of utilizing Omni-Path - the first generation Xeon Scalable CPUs. Carrying the suffix "F", these CPUs had an extra connector sticking out of CPU's PCB to enable the Omni-Path functionality (see images bellow). There were eight CPUs manufactured in total that had this extra feature, consisting out of two Xeon Platinum and six Xeon Gold CPUs, which have now reached end of life. Intel states that focus from these CPUs has shifted to other technologies like silicon photonics, which provides much greater speed reaching 100s of gigabits per second. Intel already demonstrated transceivers capable of reaching 400 Gb/s speeds with the magic of light, which will become available in 1H 2020.

Intel Adds More L3 Cache to Its Tiger Lake CPUs

InstLatX64 has posted a CPU dump of Intel's next-generation 10 nm CPUs codenamed Tiger Lake. With the CPUID of 806C0, this Tiger Lake chip runs at 1000 MHz base and 3400 MHz boost clocks which is lower than the current Ice Lake models, but that is to be expected given that this might be just an engineering sample, meaning that production/consumer revision will have better frequency.

Perhaps one of the most interesting findings this dump shows is the new L3 cache configuration. Up until now Intel usually put 2 MB of L3 cache per each core, however with Tiger Lake, it seems like the plan is to boost the amount of available cache. Now we are going to get 50% more L3 cache resulting in 3 MB per core or 12 MB in total for this four-core chip. Improved cache capacity can result in additional latency because of additional distance data needs to travel to get in and out of cache, but Intel's engineers surely solved this problem. Additionally, full AVX512 support is present except avx512_bf which supports bfloat16 floating-point variation found in Cooper Lake Xeons.

LGA 4189 is the Latest Socket for Intel's Next Generation of Xeon CPUs

TE Connectivity, the maker of various kinds of connectivity solutions for computer systems, has released its latest iteration of the LGA socket for the next generation of Xeon Scalable CPUs. Being validated by Intel, the LGA 4189-4 and LGA 4189-5 are going to power the next generation of 10 nm Xeon CPUs, based on the Ice Lake architecture, and up to 56-core 2nd generation Xeon Scalable CPUs. While there are two models of the socket, TE Connectivity didn't reveal what the differences are between them. Socket P4 (LGA 4189-4) and P5 (LGA 4189-5) also feature exactly the same pin count, 0.9906 mm hex pitch and 2.7 mm SP height, so we can only speculate that the "4" or "5" in the revision is supposed to indicate details like higher power delivery capability or support for Ice Lake CPUs.

In addition to providing a new socket for Ice Lake, these sockets have support for PCI-Express Gen 4.0 and eight-channel memory (supported memory configurations are vendor dependent), meaning that we are getting two more memory channels than previous Xeon CPUs with a faster and newer PCIe standard.

Intel Ships First 10nm Agilex FPGAs

Intel today announced that it has begun shipments of the first Intel Agilex field programmable gate arrays (FPGAs) to early access program customers. Participants in the early access program include Colorado Engineering Inc., Mantaro Networks, Microsoft and Silicom. These customers are using Agilex FPGAs to develop advanced solutions for networking, 5G and accelerated data analytics.

"The Intel Agilex FPGA product family leverages the breadth of Intel innovation and technology leadership, including architecture, packaging, process technology, developer tools and a fast path to power reduction with eASIC technology. These unmatched assets enable new levels of heterogeneous computing, system integration and processor connectivity and will be the first 10nm FPGA to provide cache-coherent and low latency connectivity to Intel Xeon processors with the upcoming Compute Express Link," said Dan McNamara, Intel senior vice president and general manager of the Networking and Custom Logic Group.

TechPowerUp GPU-Z v2.24.0 Released

TechPowerUp today released the latest version of GPU-Z, the popular graphics subsystem information, monitoring, and diagnostic utility. The new version 2.24.0 fixes a compatibility issue with Windows Vista in which the digital signature of the application's kernel-mode driver would spring up an error. We've also taken the opportunity to do some touch-ups, such as adding the PCI vendor ID for Dataland, some typos in the Vulkan Advanced information page; and support for a handful GPUs that include NVIDIA GeForce 305M, Quadro P620, and the Intel HD Graphics iGPU inside the Xeon E3-1265L V2. Grab it from the link below.

DOWNLOAD: TechPowerUp GPU-Z 2.24.0
The change-log follows.

AMD Zen 2 EPYC "Rome" Launch Event Live Blog

AMD invited TechPowerUp to their launch event and editor's day coverage of Zen 2 EPYC processors based on the 7 nm process. The event was a day-long affair which included product demos and tours, and capped off with an official launch presentation which we are able to share with you live as the event goes on. Zen 2 with the Ryzen 3000-series processors ushered in a lot of excitement, and for good reason too as our own reviews show, but questions remained on how the platform would scale to the other end of the market. We already knew, for example, that AMD secured many contracts based on their first-generation EPYC processors, and no doubt the IPC increase and expected increased core count would cause similar, if not higher, interest here. We also expect to know shortly about the various SKUs and pricing involved, and also if AMD wants to shed more light on the future of the Threadripper processor family. Read below, and continue past the break, for our live coverage.
21:00 UTC: Lisa Su is on the stage at the Palace of Fine Arts events venue in San Francisco to present AMD's latest developments on EPYC for datacenters, using the Zen 2 microarchitecture.

21:10 UTC: AMD focuses not just on delivering a single chip, but it's goal is to deliver a complete solution for the enterprise.

Next-generation Intel Xeon Scalable Processors to Deliver Breakthrough Platform Performance with up to 56 Processor Cores

Intel today announced its future Intel Xeon Scalable processor family (codename Cooper Lake) will offer customers up to 56 processor cores per socket and built-in AI training acceleration in a standard, socketed CPU as part of its mainline Intel Xeon Scalable platforms, with availability in the first half of 2020. The breakthrough platform performance delivered within the high-core-count Cooper Lake processors will leverage the capabilities built into the Intel Xeon Platinum 9200 series, which today is gaining momentum among the world's most demanding HPC customers, including HLRN, Advania, 4Paradigm, and others.

"The Intel Xeon Platinum 9200 series that we introduced as part of our 2nd Generation Intel Xeon Scalable processor family generated a lot of excitement among our customers who are deploying the technology to run their high-performance computing (HPC), advanced analytics, artificial intelligence and high-density infrastructure. Extended 56-core processor offerings into our mainline Intel Xeon Scalable platforms enables us to serve a much broader range of customers who hunger for more processor performance and memory bandwidth."
-Lisa Spelman, vice president and general manager of Data Center Marketing, Intel Corporation

ASUS Rolls Out Pro WS C246-ACE Motherboard with Xeon E-series Support

ASUS today rolled out of the WS C246-ACE, a sober-looking workstation motherboard in the ATX form-factor based on the Intel C246 chipset, which supports not just Intel Xeon E-series processors in the LGA1151 package, but also 8th and 9th generation Core processors. The board draws power from a combination of 24-pin ATX and 8-pin EPS power connectors, conditioning it for the processor with a 9-phase VRM that's cooled by heavy ridged heatsinks. The CPU socket is wired to four DDR4 DIMM slots that support up to 128 GB of dual-channel DDR4 memory, and two metal-reinforced PCI-Express 3.0 x16 slots (x16/NC or x8/x8). Two open-ended PCIe 3.0 x1 and a PCI-Express x16 (electrical gen 3.0 x4) make for the rest of the expansion area.

Storage connectivity on the ASUS WS C246-ACE include two M.2-22110 slots with PCI-Express 3.0 x4 and SATA 6 Gbps wiring, a U.2 port, and four SATA 6 Gbps ports. Networking is care of two 1 GbE interfaces, driven by a combination of Intel i211-AT and i219-LM controllers. The onboard audio solution combines a Realtek ALC1220S CODEC with EMI shielding, ground-layer isolation, and a headphones amp circuit. USB connectivity includes four 10 Gbps USB 3.1 gen 2 ports, all on rear panel, one of which is a type-C port; and six 5 Gbps USB 3.1 gen 1 ports, of which two are via headers. Display connectivity include HDMI and DisplayPort. The company didn't reveal pricing.

Intel Internal Memo Reveals that even Intel is Impressed by AMD's Progress

Today an article was posted on Intel's internal employee-only portal called "Circuit News". The post, titled "AMD competitive profile: Where we go toe-to-toe, why they are resurgent, which chips of ours beat theirs" goes into detail about the recent history of AMD and how the company achieved its tremendous growth in recent years. Further, Intel talks about where they see the biggest challenges with AMD's new products, and what the company's "secret sauce" is to fight against these improvements.
The full article follows:

Lenovo Unveils New ThinkPad P Series Portfolio with World's Most Powerful 15-Inch Mobile Workstation

Today at NXT BLD in London, Lenovo is launching the next generation of its ThinkPad P Series with the release of five new ThinkPads, including the ThinkPad P73, ThinkPad P53, ThinkPad P1 Gen 2, and ThinkPad P53s and P43s. The new portfolio is designed to meet the ever-changing power and portability needs of modern professionals across industries - both in the office and beyond without sacrificing our legendary engineering know-how, reliability and security.

Innovation can now happen anywhere - accomplished on movie sets, in the field and on the plot of land where the latest architecture masterpiece comes to life. The need for on-location power also requires real mobility - from the meeting room, to the office, to the presentation and back. Because of this, industry professionals are seeking similar power and performance they have come to expect from desktop workstations in their mobile workstations - and our new ThinkPad mobile workstations are meeting this demand.

Apple Announces Groundbreaking Mac Pro and Pro Display XDR

Apple today introduced the all-new Mac Pro, a completely redesigned, breakthrough workstation for pros who push the limits of what a Mac can do, and unveiled Apple Pro Display XDR, the world's best pro display. Designed for maximum performance, expansion and configurability, the all-new Mac Pro features workstation-class Xeon processors up to 28 cores, a high-performance memory system with a massive 1.5TB capacity, eight PCIe expansion slots and a graphics architecture featuring the world's most powerful graphics card. It also introduces Apple Afterburner, a game-changing accelerator card that enables playback of three streams of 8K ProRes RAW video simultaneously.

Pro Display XDR features a massive 32-inch Retina 6K display with gorgeous P3 wide and 10-bit color, an extreme 1,600 nits of peak brightness, an incredible 1,000,000:1 contrast ratio and a superwide viewing angle, all at a breakthrough price point. Together, the new Mac Pro and Pro Display XDR are the most powerful tools Apple has ever put in the hands of pro customers and will change pro workflows forever.

Intel Puts Out Benchmarks Showing Minimal Performance Impact of MDS Mitigation

Intel Tuesday once again shook the IT world by disclosing severe microarchitecture-level security vulnerabilities affecting its processors. The Microarchitectural Data Sampling (MDS) class of vulnerabilities affect Intel CPU architectures older than "Coffee Lake" to a greater extent. Among other forms of mitigation software patches, Intel is recommending that users disable HyperThreading technology (HTT), Intel's simultaneous multithreading (SMT) implementation. This would significantly deplete multi-threaded performance on older processors with lower core-counts, particularly Core i3 2-core/4-thread chips.

On "safer" microarchitectures such as "Coffee Lake," though, Intel is expecting a minimal impact of software patches, and doesn't see any negative impact of disabling HTT. This may have something to do with the 50-100 percent increased core-counts with the 8th and 9th generations. The company put out a selection of benchmarks relevant to client and enterprise (data-center) use-cases. On the client use-case that's we're more interested in, a Core i9-9900K machine with software mitigation and HTT disabled is negligibly slower (within 2 percent) of a machine without mitigation and HTT enabled. Intel's selection of benchmarks include SYSMark 2014 SE, WebXprt 3, SPECInt rate base (1 copy and n copies), and 3DMark "Skydiver" with the chip's integrated UHD 630 graphics. Comparing machines with mitigations applied but toggling HTT presents a slightly different story.

In Win Launches 928 Super Tower case for $999

In Win, a known luxurious case manufacturer has launched a super tower case titled the 928. The case costs $999 and is made out of premium and high-quality materials such as aluminium and tempered glass. In Win positions this case with the aim to "Present PC's Power" using its spacious interior. For a price of almost 1000 USD, the case is made with looks first and functionality second.

The 928 is made out of three distinct pieces: an aluminium shell and two tempered glass side panels. The aluminium shell is anodized in black and is 4 mm thick. Being over 125 liters in size, the case is perfect for any oversized watercooling build and is compatible with 14' x 14', EEB, E-ATX, ATX, Micro-ATX and Mini-ITX motherboard form factors. Of course, it doesn't lack RGB support - the front In Win logo is RGB illuminated, but that can be turned off if you so prefer. This case is made for extreme workstations that use Intel's Xeon W-3175X CPU, thus using ultra wide EEB motherboards like ASUS ROG Dominus Extreme.

Intel 10nm Ice Lake to Quantitatively Debut Within 2019

Intel put out interesting details about its upcoming 10 nanometer "Ice Lake" CPU microarchitecture rollout in its recent quarterly financial results call. The company has started qualification of its 10 nm "Ice Lake" processors. This involves sending engineering samples to OEMs, system integrators and other relevant industry partners, and getting the chips approved for their future product designs. The first implementation of "Ice Lake" will not be a desktop processor, but rather a low-power mobile SoC designed for ultraportables, codenamed "Ice Lake-U." This SoC packs a 4-core/8-thread CPU based on the "Sunny Cove" core design, and Gen11 GT2 integrated graphics with 64 execution units and nearly 1 TFLOP/s compute power. This SoC will also support WiFi 6 and LPDDR4X memory.

Intel CEO Bob Swan also remarked that the company has doubled its 10 nm yield expectations. "On the [10 nm] process technology front, our teams executed well in Q1 and our velocity is increasing," he said, adding "We remain on track to have volume client systems on shelves for the holiday selling season. And over the past four months, the organization drove a nearly 2X improvement in the rate at which 10nm products move through our factories." Intel is prioritizing enterprise over desktop, as "Ice Lake-U" will be followed by "Ice Lake-SP" Xeon rollout in 2020. There was no mention of desktop implementations such as "Ice Lake-S." Intel is rumored to be preparing a stopgap microarchitecture for the desktop platform to compete with AMD "Matisse" Zen 2 AM4 processors, codenamed "Comet Lake." This is essentially a Skylake 10-core die fabbed on existing 14 nm++ node. AMD in its CES keynote announced an achievement of per-core performance parity with Intel, so it could be interesting to see how Intel hopes 10 "Skylake" cores match up to 12-16 "Zen 2" cores.

Intel Reports First-Quarter 2019 Financial Results

Intel Corporation today reported first-quarter 2019 financial results. "Results for the first quarter were slightly higher than our January expectations. We shipped a strong mix of high performance products and continued spending discipline while ramping 10nm and managing a challenging NAND pricing environment. Looking ahead, we're taking a more cautious view of the year, although we expect market conditions to improve in the second half," said Bob Swan, Intel CEO. "Our team is focused on expanding our market opportunity, accelerating our innovation and improving execution while evolving our culture. We aim to capitalize on key technology inflections that set us up to play a larger role in our customers' success, while improving returns for our owners."

In the first quarter, the company generated approximately $5.0 billion in cash from operations, paid dividends of $1.4 billion and used $2.5 billion to repurchase 49 million shares of stock. In the first quarter, Intel achieved 4 percent growth in the PC-centric business while data-centric revenue declined 5 percent.

Kingston Server Premier DDR4-2933 RDIMMs Validated on Intel "Cascade Lake"

Kingston Technology Company, Inc., a world leader in memory products and technology solutions, today announced its 32GB, 16GB and 8GB Server Premier DDR4-2933 Registered DIMMs have received validation on the Intel Purley Platform, featuring the Intel Xeon Scalable processor family (formerly known as "Cascade Lake-SP"). A link to the validation page can be found here.

Kingston's Purley-validated Server Premier modules are specifically engineered to unleash the power of Intel's six-channel server microarchitecture. At 2933MT/s - the next-generation memory frequency supported in the latest Intel Xeon Scalable processor family - each DIMM provides peak bandwidth of 23.46 GB/s. When grouped for multi-channel performance, this provides a significant boost in performance for today's memory intensive server applications.

Intel Driving Data-Centric World with New 10nm Intel Agilex FPGA Family

Intel announced today a brand-new product family, the Intel Agilex FPGA. This new family of field programmable gate arrays (FPGA) will provide customized solutions to address the unique data-centric business challenges across embedded, network and data center markets. "The race to solve data-centric problems requires agile and flexible solutions that can move, store and process data efficiently. Intel Agilex FPGAs deliver customized connectivity and acceleration while delivering much needed improvements in performance and power for diverse workloads," said Dan McNamara, Intel senior vice president, Programmable Solutions Group.

Customers need solutions that can aggregate and process increasing amounts of data traffic to enable transformative applications in emerging, data-driven industries like edge computing, networking and cloud. Whether it's through edge analytics for low-latency processing, virtualized network functions to improve performance, or data center acceleration for greater efficiency, Intel Agilex FPGAs are built to deliver customized solutions for applications from the edge to the cloud. Advances in artificial intelligence (AI) analytics at the edge, network and the cloud are compelling hardware systems to cope with evolving standards, support varying AI workloads, and integrate multiple functions. Intel Agilex FPGAs provide the flexibility and agility required to meet these challenges and deliver gains in performance and power.

Intel Unleashes 56-core Xeon "Cascade Lake" Processor to Preempt 64-core EPYC

Intel late Tuesday made a boat-load of enterprise-relevant product announcements, including the all important update to its Xeon Scalable enterprise processor product-stack, with the addition of the new 56-core Xeon Scalable "Cascade Lake" processor. This chip is believed to be Intel's first response to the upcoming AMD 7 nm EPYC "Rome" processor with 64 cores and a monolithic memory interface. The 56-core "Cascade Lake" is a multi-chip module (MCM) of two 28-core dies, each with a 6-channel DDR4 memory interface, totaling 12-channel for the package. Each of the two 28-core dies are built on the existing 14 nm++ silicon fabrication process, and the IPC of each of the 56 cores are largely unchanged since "Skylake." Intel however, has added several HPC and AI-relevant instruction-sets.

To begin with, Intel introduced DL Boost, which could be a fixed-function hardware matrix multiplier that accelerates building and training of AI deep-learning neural networks. Next up, are hardware mitigation against several speculative execution CPU security vulnerabilities that haunted the computing world since early-2018, including certain variants of "Spectre" and "Meltdown." A hardware fix presents lesser performance impact compared to a software fix in the form of a firmware patch. Intel has added support for Optane Persistent Memory, which is the company's grand vision for what succeeds volatile primary memory such as DRAM. Currently slower than DRAM but faster than SSDs, Optane Persistent Memory is non-volatile, and its contents can be made to survive power-outages. This allows sysadmins to power-down entire servers to scale down with workloads, without worrying about long wait times to restore uptime when waking up those servers. Among the CPU instruction-sets added include AVX-512 and AES-NI.

Intel Announces Broadest Product Portfolio for Moving, Storing, and Processing Data

Intel Tuesday unveiled a new portfolio of data-centric solutions consisting of 2nd-Generation Intel Xeon Scalable processors, Intel Optane DC memory and storage solutions, and software and platform technologies optimized to help its customers extract more value from their data. Intel's latest data center solutions target a wide range of use cases within cloud computing, network infrastructure and intelligent edge applications, and support high-growth workloads, including AI and 5G.

Building on more than 20 years of world-class data center platforms and deep customer collaboration, Intel's data center solutions target server, network, storage, internet of things (IoT) applications and workstations. The portfolio of products advances Intel's data-centric strategy to pursue a massive $300 billion data-driven market opportunity.

Intel to Refresh its LGA2066 HEDT Platform This Summer?

Intel is rumored to refresh its high-end desktop (HEDT) platforms this Summer with new products based on the "Cascade Lake" microarchitecture. Intel now has two HEDT platforms, LGA2066 and LGA3647. The new "Cascade Lake-X" silicon will target the LGA2066 platform, and could see the light of the day by June, on the sidelines of Computex 2019. A higher core-count model with 6-channel memory, will be launched for the LGA3647 socket as early as April. So if you've very recently fronted $3,000 on a Xeon W-3175X, here's a bucket of remorse. Both chips will be built on existing 14 nm process, and will bring innovations such as Optane Persistent Memory support, Intel Deep Learning Boost (DLBOOST) extensions with VNNI instruction-set, and hardware mitigation against more variants of "Meltdown" and "Spectre."

Elsewhere in the industry, and sticking with Intel, we've known since November 2018 of the existence of "Comet Lake," which is a 10-core silicon for the LGA1151 platform, and which is yet another "Skylake" derivative built on existing 14 nm process. This chip is real, and will be Intel's last line of defense against AMD's first 7 nm "Zen 2" socket AM4 processors, with core-counts of 12-16.

GIGABYTE Unveils C621 Aorus Xtreme to Challenge ROG Dominus

With ASUS monetizing its exclusivity as being the sole supplier of a Xeon W-3175X-capable client-segment motherboard by selling the ROG Dominus for 1,550€, it was only a matter of time before other motherboard makers came out with halo products of their own. GIGABYTE unveiled the C621 Aorus Xtreme, and it's nothing like the board the company supplied to Intel for its 2018 demo of the W-3175X. This monstrosity pulls power from as combination of two 24-pin ATX and four 8-pin EPS connectors, conditioning power for the CPU with a gargantuan 32-phase VRM that's cooled by a large aluminium heatsink that covers not just much of the upper part of the board, but also the I/O area, and much of the board's tail end. It also takes in two 6-pin PCIe connectors to stabilize power for the PCIe slots. The massive PCH heatsink extends to meet up with the VRM heatsink on the other end.

Connectivity includes everything you'd possibly want, with a riser card providing four M.2-22110 slots with PCIe 3.0 x4 wiring, each; a U.2 port, and eight SATA ports completing the storage options; two 1 GbE interfaces driven by Intel I210AT and I219LM controllers, a high-grade onboard audio solution, and an immeasurable amount of overclocker-friendly features that include diagnostic POST code read-outs, voltage measurement points, voltage stabilizers, and a feature-rich BIOS setup program. GIGABYTE didn't reveal pricing.

QNAP Officially Launches the TS-2888X AI-Ready NAS for Machine Learning

QNAP Systems, Inc. today officially launched the TS-2888X, an AI-Ready NAS specifically optimized for AI model training. Built using powerful Intel Xeon W processors with up to 18 cores and employing a flash-optimized hybrid storage architecture for IOPS-intensive workloads, the TS-2888X also supports installing up to 4 high-end graphics cards and runs QNAP's AI developer package " QuAI". The TS-2888X packs everything required for machine learning AI, greatly reducing latency, accelerating data transfer, and eliminating performance bottlenecks caused by network connectivity to expedite AI implementation.

Intel Announces Next-Generation Acceleration Card to Deliver 5G

Today at Mobile World Congress (MWC) 2019, Intel announced the Intel FPGA Programmable Acceleration Card N3000 (Intel FPGA PAC N3000), designed for service providers to enable 5G next-generation core and virtualized radio access network solutions. The Intel FPGA PAC N3000 accelerates many virtualized workloads, ranging from 5G radio access networks to core network applications.

"As the mobile and telecommunications industry gears up for an explosion in internet protocol traffic and 5G rollouts, we designed the Intel FPGA PAC N3000 to provide the programmability and flexibility with the performance, power efficiency, density and system integration capabilities the market needs to fully support the capabilities of 5G networks," said Reynette Au, Intel vice president of marketing, Programmable Solutions Group.

At 1550€, ASUS ROG Dominus Most Expensive Client-Segment Motherboard

ASUS formally launched its Republic of Gamers (ROG) Dominus, the sole available motherboard option for Intel Xeon W-3175X unlocked quasi-HEDT processor. Cowcotland scored its price in the old continent to be a whopping 1,550€, making it the most expensive client-segment motherboard (at least in the past 20 years of PC history). Built in the SSI-EEB form-factor, this board is designed for overclocking the 28-core/56-thread Xeon chip, which is capable of pulling over 1000W of power (just the CPU) under extreme overclocking. The processor itself is priced around 3,100€ including VAT. Add a matching hexa-channel DDR4 memory kit such as these Trident Z Royal ones, and your platform cost could easily touch 5,500€.
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