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Intel Xeon "Sapphire Rapids" Processor Die Shot Leaks

Thanks to the information coming from Yuuki_Ans, a person which has been leaking information about Intel's upcoming 4th generation Xeon Scalable processors codenamed Sapphire Rapids, we have the first die shots of the Sapphire Rapids processor and its delidded internals to look at. After performing the delidding process and sanding down the metal layers of the dies, the leaker has been able to take a few pictures of the dies present on the processor. As the Sapphire Rapids processor uses multi-chip modules (MCM) approach to building CPUs, the design is supposed to provide better yields for Intel and give the 10 nm dies better usability if defects happen.

In the die shots, we see that there are four dies side by side, with each die featuring 15 cores. That would amount to 60 cores present in the system, however, not all of the 60 cores are enabled. The top SKU is supposed to feature 56 cores, meaning that there would be at least four cores disabled across the configuration. This gives Intel flexibility to deliver plenty of processors, whatever the yields look like. The leaked CPU is an early engineering sample design with a low frequency of 1.3 GHz, which should improve in the final design. Notably, as Sapphire Rapids has SKUs that use in-package HBM2E memory, we don't know if the die configuration will look different from the one pictured down below.

Marvell Announces Bravera, World's First PCIe 5.0 SSD Controllers

Marvell today announced its new Bravera SC5 controller family, bringing unprecedented performance, best-in-class efficiency, and leading security features to address ever-expanding workloads in the cloud. The massive amount of data to be processed in cloud data centers is driving demand for faster and higher bandwidth storage in these environments. Marvell's Bravera SC5 SSD controllers address the critical requirements for scalable, containerized cloud storage infrastructure. By enabling the highest performing flash storage solutions, Marvell's controllers are poised to be the foundation for data centers that offer ultra-low latency, real-time applications while also providing cost-optimized, cloud-scale capacity.

As the industry's first SSD controllers to support PCIe 5.0 and NVMe 1.4b, Marvell's Bravera SC5 doubles the performance compared to PCIe 4.0 SSDs. This contributes to accelerated workloads and reduced latency, dramatically improving the user experience. In order to meet cloud service providers' stringent security requirements to ensure users' data is safe and protected, the controllers offer FIPS-compliant root of trust (RoT), AES 256-bit encryption and multi-key revocation. The new controllers are the first with a hardware-based Elastic SLA Enforcer to assure quality of service (QoS) and provide metering capabilities per customer to increase overall storage efficiency and utilization while lowering total cost of ownership (TCO).

Intel "Sapphire Rapids" Xeon Processors Use "Golden Cove" CPU Cores, Company Clarifies in Linux Kernel Dev E-Mail Chain

Intel's upcoming Xeon "Sapphire Rapids" processors which debut in the second half of 2021, will feature up to 80 "Golden Cove" CPU cores, and not the previously rumored "Willow Cove." This was clarified by an Intel developer in a Linux Kernel code e-mail chain. "Golden Cove" CPU cores are more advanced than the "Willow Cove" cores found in current-generation Intel products, such as the client "Tiger Lake" processors. Intel stated that "Golden Cove" introduces an IPC gain over "Willow Cove" (expressed as "ST perf"), increased AI inference performance from an updated GNI component, "network and 5G perf," which is possibly some form of network stack acceleration, and additional security features.

Over in the client segment, the 12th Gen Core "Alder Lake" processor debuts a client variant of "Golden Cove." The "Alder Lake-S" silicon features eight "Golden Cove" cores serving as the "big" performance cores, next to eight "little" low-power "Gracemont" cores. The client- and server implementations of "Golden Cove" could differ mainly in the ISA, with the client chip receiving a slightly skimmed AVX-512 and DLBoost instruction-sets, with only client-relevant instructions. The server variant, in addition being optimized for a high core-count multi-core topology; could feature a more substantial AVX-512 and DLBoost implementation relevant for HPC use-cases.

Intel to Detail "Alder Lake" and "Sapphire Rapids" Microarchitectures at Hot Chips 33, This August

Intel will detail its 12th Gen Core "Alder Lake" client and "Sapphire Rapids" server CPU microarchitectures at the Hot Chips 33 conclave, this August. In fact, Intel's presentation leads the CPU sessions on the opening day of August 23. "Alder Lake" will be the session opener, followed by AMD's presentation of the already-launched "Zen 3," and IBM's 5 GHz Z processor powering its next-gen mainframes. A talk on Xeon "Sapphire Rapids" follows this. Hot Chips is predominantly an engineering conclave, where highly technical sessions are presented by engineers from major semiconductor firms; and so the sessions on "Alder Lake" and "Sapphire Rapids" are expected to be very juicy.

"Alder Lake" is Intel's attempt at changing the PC ecosystem by introducing hybrid CPU cores, a concept introduced to the x86 machine architecture with "Lakefield." The processor will also support next-generation I/O, such as DDR5 memory. The "Sapphire Rapids" server CPU microarchitecture will see an increase in CPU core counts, next-gen I/O such as PCI-Express 5.0, CXL 1.1, DDR5 memory, and more.

Intel Xeon W-1300 Series "Rocket Lake" Processors Detailed

Intel has quietly let out details of its latest-generation Xeon W series workstation processors based on the 14 nm "Rocket Lake" silicon. These chips are built in the same Socket LGA1200 package as the 11th Gen Core desktop processors, but compatible with the W580 chipset. The lineup includes two 6-core/12-thread; and five 8-core/16-thread parts. Leading the pack is the Xeon W-1390P, with clock speeds of up to 5.30 GHz, followed by the W-1390, at 5.20 GHz. These two SKUs feature Thermal Velocity Boost, and are analogous with the 11th Gen Core i9 series.

Next up, are the Xeon W-1370P and W-1370, clocked at speeds of up to 5.20 GHz, and 5.10 GHz respectively, These parts lack Thermal Velocity Boost, and are comparable in many ways to the 11th Gen Core i7 SKUs. The slowest of these 8-core parts is the energy-efficient W-1390T, ticking at nominal clocks of just 1.50 GHz, with 4.90 GHz maximum boost, but a TDP of just 35 W. Among the other SKUs, the "P" SKUs have rated TDP of 125 W, while the non-P ones have 80 W. The 6-core/12-thread SKUs include the W-1350P and W-1350, clocked up to 5.10 GHz and 5.00 GHz, respectively. All Xeon W processors support up to 128 GB of dual-channel DDR4-3200 memory with ECC support.

AMD Clocks Highest Quarterly Growth in Server CPU Sales Against Intel in 15 Years

AMD has registered the steepest single-quarter growth in server CPU sales in 15 years, for Q1-2021, according to Mercury Research data accessed by Tom's Hardware. "While we don't often discuss average selling prices, we note that this quarter saw unusually strong price moves for AMD -- as AMD shipped fewer low-end parts and more high-end parts, as well as shipping many more server parts, the company's average selling price increased significantly," said Dean McCarron of Mercury Research. Unfortunately, the growth in its EPYC server CPU sales also coincides with a drop in notebook CPU sales. It's also interesting to note here that AMD's Q1-2021 performance with server CPUs also coincides with a 20% drop in revenue for its Data Center Group, the business unit responsible for sales of its Xeon server processors.

DFI Announces Downsized Desktop SBC with Auto Heat-Up against Extreme Weathers

As AI technology becomes ubiquitous, the impact of unusual weather also gains more attention. The most impressive case was the sudden weather change in Denver, the US, last September that the temperature dropped from 37°C to minus overnight. Faced with such fluctuation, the devices which maintained the daily life of the city in order, like the facilities for traffic flow analysis, surveillance, and AI visual analytics, could no longer operate normally, or even damaged, due to the lack of endurance to the extreme weathers.

Inspired by the situation, DFI brought an innovative design into the newly-released CS551, the "World's First 3.5" desktop SBC with auto heat-up". This breakthrough gives devices high performance with smaller footprint for image analysis or heavy workloads, no matter at subzero temperatures or under heat waves.

Intel "Sapphire Rapids" Xeon Processor Could Feature Up To 80 Cores: New Leak

Intel's upcoming Xeon "Sapphire Rapids" enterprise processor come come with CPU core-counts as high as 80, according to the latest round of photo-leaks. An earlier article predicted the chip cram up to 56 cores alongside on-package HBM. The processor reportedly features up to 80 cores, spread across four 20-core chiplets. Unlike on the latest AMD EPYC processor, there doesn't appear to be a centralized I/O controller die. This particular processor is based in the LGA4189 package, which features additional pins compared to the LGA4577-X socket from the 56-core leak. The newer socket has additional pins that enable next-gen I/O, which include PCI-Express Gen 5.0, and CXL 1.1 interface.

AAEON Announces ARES-WHI0 Server Board

AAEON, an industry leader of AI and IOT solutions, is excited to celebrate the launch of Intel's latest scalable platform, the 3rd Generation Intel Xeon Scalable Processors (formerly Ice Lake-SP). As an associate member of the Intel IoT Solutions Alliance, AAEON is excited to bring this new technology to market with the ARES-WHI0 industrial ATX server board and other future products.

The 3rd Generation Intel Xeon Scalable Processors deliver the next generation of high-end computing performance and support for vital data integrity and security technologies. This new generation of Xeon SP brings higher processing speeds and Intel's Deep Learning Boost technology, allowing for greater acceleration and more efficient processing for AI server applications.

AMD Breaks Through Cinebench R23 World Record With Dual Epyc Build

AMD via its official YouTube channel shared a video of two of its Epyc chips destroying Cinebench's R23 benchmark, setting a new world record in the process. The record-setting feat was achieved with two off-the shelf Epyc 7763 CPUs - the ones with 64 physical CPUs and 128 threads of Zen 3 IPC. The system, which was built on top of a reference server motherboard and paired with server-grade aircooling, reached a grand total of 113,631 points - completing the benchmark run is around ten (10) measly seconds and soaring through the previous record-holder, a heavily overclocked Ryzen Threadripper 3990X (105,170 points).

The AMD system crushes the closest-priced Intel Xeon CPUs in performance - a dual Intel Xeon Platinum 8380 (Ice Lake-SP generation) configuration reached a comparably paltry 74,630 points - and AMD wins in the price-performance ratio again, with each of its Epyc 7763 CPUs costing $7,890 compared to $8,100 for each of the Intel Xeon platinum 8380. AMD's name of choice for their server-grade CPUs offering up a justification for its admittedly 15-year-old naming scheme. Catch the AMD video after the break.

Intel's Upcoming Sapphire Rapids Server Processors to Feature up to 56 Cores with HBM Memory

Intel has just launched its Ice Lake-SP lineup of Xeon Scalable processors, featuring the new Sunny Cove CPU core design. Built on the 10 nm node, these processors represent Intel's first 10 nm shipping product designed for enterprise. However, there is another 10 nm product going to be released for enterprise users. Intel is already preparing the Sapphire Rapids generation of Xeon processors and today we get to see more details about it. Thanks to the anonymous tip that VideoCardz received, we have a bit more details like core count, memory configurations, and connectivity options. And Sapphire Rapids is shaping up to be a very competitive platform. Do note that the slide is a bit older, however, it contains useful information.

The lineup will top at 56 cores with 112 threads, where this processor will carry a TDP of 350 Watts, notably higher than its predecessors. Perhaps one of the most interesting notes from the slide is the department of memory. The new platform will make a debut of DDR5 standard and bring higher capacities with higher speeds. Along with the new protocol, the chiplet design of Sapphire Rapids will bring HBM2E memory to CPUs, with up to 64 GBs of it per socket/processor. The PCIe 5.0 standard will also be present with 80 lanes, accompanying four Intel UPI 2.0 links. Intel is also supposed to extend the x86_64 configuration here with AMX/TMUL extensions for better INT8 and BFloat16 processing.

Intel Announces 10 nm Third Gen Xeon Scalable Processors "Ice Lake"

Intel today launched its most advanced, highest performance data center platform optimized to power the industry's broadest range of workloads—from the cloud to the network to the intelligent edge. New 3rd Gen Intel Xeon Scalable processors (code-named "Ice Lake") are the foundation of Intel's data center platform, enabling customers to capitalize on some of the most significant business opportunities today by leveraging the power of AI.

New 3rd Gen Intel Xeon Scalable processors deliver a significant performance increase compared with the prior generation, with an average 46% improvement on popular data center workloads. The processors also add new and enhanced platform capabilities including Intel SGX for built-in security, and Intel Crypto Acceleration and Intel DL Boost for AI acceleration. These new capabilities, combined with Intel's broad portfolio of Intel Select Solutions and Intel Market Ready Solutions, enable customers to accelerate deployments across cloud, AI, enterprise, HPC, networking, security and edge applications.

Intel 3rd Gen Xeon Scalable Launch Event Liveblog

Intel today is launching its 3rd Generation Xeon Scalable processor bringing its first major IPC uplift to the enterprise space in five years. The Xeon Scalable processors are built on the 10 nm SuperFin process, and the "Ice Lake-SP" microarchitecture that bring new "Sunny Cove" CPU cores to the server space, including support for PCI-Express 4.0 I/O capabilities, a wider memory interface, and a more feature-rich AVX-512 instruction-set, along with DLBoost for HPC. join us for its launch live-blog.

14:59 UTC: CEO Pat Gelsinger and Data Platforms group head Navin Shenoy are expected to take centerstage. Xeon and memory group head Lisa Spelman could announce relevant platform products. This is Gelsinger's first major launch since taking office.

15:01 UTC: What will you solve for?

Intel Readies Xeon W-1300 Socket LGA1200 Processors Based on "Rocket Lake"

Intel is reportedly giving final touches to the Xeon W-1300 line of enterprise processors targeting workstations, according to an ASRock CPU support list dug up by Komachi Ensaka. The processors are based on the same 14 nm "Rocket Lake" silicon as the company's 11th Gen Core desktop processors, and come in core counts of up to 8-core/16-thread. The lineup is expected to debut with five SKUs, three of which are 8-core/16-thread, and two 6-core/12-thread.

The lineup is led by the W-1370, with base frequency of 2.90 GHz, 16 MB of shared L3 cache, and 80 W TDP. Next up, is the slightly slower W-1390, clocked at 2.80 GHz, and 80 W TDP. The third 8-core part is the W-1390T, which is clocked at just 1.50 GHz (base), and comes with aggressive power-management that gives it a TDP rating of 35 W. The 6-core/12-thread W-1350P has the highest clock speeds, with a base frequency of 4.00 GHz, 12 MB of shared L3 cache, and 125 W TDP. The W-1350 is its slower sibling, clocked at 3.30 GHz, and 80 W TDP. The processors will be compatible with Intel Z490, W480, and H470 chipsets, besides their 500-series successors.

Intel to Launch 3rd Gen Intel Xeon Scalable Portfolio on April 6

Intel today revealed that it will launch its 3rd Generation Xeon Scalable processor series at an online event titled "How Wonderful Gets Done 2021," on April 6, 2021. This will be one of the first major media events headed by Intel's new CEO, Pat Gelsinger. Besides the processor launch, Intel is expected to detail many of its advances in the enterprise space, particularly in the areas of 5G infrastructure rollout, edge computing, and AI/HPC. The 3rd Gen Xeon Scalable processors are based on the new 10 nm "Ice Lake-SP" silicon, heralding the company's first CPU core IPC gain in the server space since 2015. The processors also introduce new I/O capabilities, such as PCI-Express 4.0.

HPE Lists 40-Core Intel Ice Lake-SP Xeon Server Processor

Hewlett Packard Enterprise, the company focused on making enterprise hardware and software, has today mistakenly listed some of Intel's upcoming 3rd generation Xeon Scalable processors. Called Ice Lake-SP, the latest server processor generation is expected to launch sometime in the coming days, with a possible launch date being the March 23rd "Intel Unleashed" webcast. The next generation of processors will finally bring a new vector of technologies Intel needs in server space. That means the support for PCIe 4.0 protocol for higher speed I/O and octa-channel DDR4 memory controller for much greater bandwidth. The CPU lineup will for the first time use Intel's advanced 10 nm node called 10 nm SuperFin.

Today, in the leaked HPE listing, we get to see some of the Xeon models Intel plans to launch. Starting from 32-core models, all the way to 40-core models, all SKUs above 28 cores are supposed to use dual die configuration to achieve high core counts. The limit of a single die is 28 cores. HPE listed a few models, with the highest-end one being the Intel Xeon Platinum XCC 8380 processor. It features 40 cores with 80 threads and a running frequency of 2.3 GHz. If you are wondering about TDP, it looks like the 10 nm SuperFin process is giving good results, as the CPU is rated only for 270 Watts of power.

AMD Announces 3rd Generation EPYC 7003 Enterprise Processors

AMD today announced its 3rd generation EPYC (7003 series) enterprise processors, codenamed "Milan." These processors combine up to 64 of the company's latest "Zen 3" CPU cores, with an updated I/O controller die, and promise significant performance uplifts and new security capabilities over the previous generation EPYC 7002 "Rome." The "Zen 3" CPU cores, AMD claims, introduce an IPC uplift of up to 19% over the previous generation, which when combined by generational increases in CPU clock speeds, bring about significant single-threaded performance increases. The processor also comes with large multi-threaded performance gains thanks to a redesigned CCD.

The new "Zen 3" CPU complex die (CCD) comes with a radical redesign in the arrangement of CPU cores, putting all eight CPU cores of the CCD in a single CCX, sharing a large 32 MB L3 cache. This the total amount of L3 cache addressable by a CPU core, and significantly reduces latencies for multi-threaded workloads. The "Milan" multi-chip module has up to eight such CCDs talking to a centralized server I/O controller die (sIOD) over the Infinity Fabric interconnect.

Apple is Discontinuing Intel-based iMac Pro

According to the official company website, Apple will no longer manufacture its iMac Pro computers based on Intel processors. Instead, the company will carry these models in its store, only while the supplies last. Apple will be replacing these models with next-generation iMac Pro devices that will be home to the custom Apple Silicon processors, combining Arm CPU cores with custom GPU design. Having a starting price of 4990 USD, the Apple iMac Pro was able to max out at 15000 USD. The most expensive part was exactly the Intel Xeon processor inside it, among the AMD GPU with HBM. Configuration pricing was also driven by storage/RAM options. However, even the most expensive iMac Pro with its 2017 hardware had no chance against the regular 2020 iMac, so the product was set to be discontinued sooner or later.

When the stock of the iMac Pro runs out, Apple will replace this model with its Apple Silicon equipped variant. According to the current rumor mill, Apple is set to hold a keynote on March 16th that will be an announcement for new iMac Pro devices with custom processors. What happens is only up to Apple, so we have to wait and see.

Cincoze Announces Flagship GP-3000 Industrial-Grade High-Performance GPU Computer

Cincoze, a professional manufacturer of embedded systems, has announced its new flagship GPU edge computing system, the GP-3000. Its crowning feature is an exclusive GPU Expansion Box that provides expansion for up to two high-end GPU graphics cards and creating a high-performance industrial-grade GPU computer. Brandon Chien, General Manager of Cincoze, stated that "We already know AI will drive innovation and expansion for industrial applications. The GP-3000 is Cincoze's answer for intensive image processing and complex calculations, such as deep machine learning, autonomous driving, automated visual inspection, and mobile monitoring. As our latest flagship model, the GP-3000 multiplies edge computing efficiency, amplifies productivity and reliability, and accelerates AIoT automation."

The GP-3000's extreme computing power starts with an 8th or 9th generation Intel Xeon or Core i3/i5/i7 (Coffee Lake and Coffee Lake-R) CPU, Intel C246 chipset, and supports two sets of DDR4-2666 ECC/non-ECC SO-DIMM up to 64 GB and can support up to two 250 W high-end GPU graphics cards. With a total system power consumption of 720 W, it's easy to meet and exceed high-efficiency application requirements. A precision heat dissipation and cooling design quickly wick away heat, keeping the focus squarely on the breathtaking performance of the GP-3000.

Ex-Intel Employee Reportedly Stole Confidential Xeon Files, Company Files a Lawsuit

Intel has reportedly caught an ex-employee stealing confidential company files for the Xeon processor lineup. Dr. Varun Gupta, who left Intel last year to join Microsoft as Principal for Strategic Planning in Cloud and AI, has reportedly walked away with over 3900 files of confidential information. The stolen files, contain information about Intel's Xeon processors, pricing data, corporate strategies, and Intel's manufacturing capabilities of the chips. Dr. Gupta is being sued by Intel for 75,000 USD and liability to not use confidential Intel information again. The security forensics team at Intel has discovered that Dr. Gupta downloaded almost 4000 files on multiple USB drives, however, Dr. Gupta is denying these claims. We are waiting to hear more information about the situation as it evolves.

Silicon Motion: PCIe 5.0 SSD Controller to Arrive Next Year

With the debut of PCIe 4.0 standard, SSD manufacturers have started launching a new generation of storage devices, with unseen speeds before. Today's PCIe 4.0 SSDs can reach up to 8.0 GB/s reads and writes, all thanks to the bandwidth-heavy PCIe protocol. However, enterprise workloads are always requiring more and more bandwidth to satisfy their needs. Data is being moved in immense quantities and faster hardware is always welcome. The previous PCIe 4.0 standard is about to kneel to its successor - PCIe 5.0 protocol. Having double the amount of bandwidth, the new standard is set to bring unseen speeds.

The PCIe 5.0 protocol offers 32 GT/s per lane, making up to 64 GB/s in the full x16 implementation. However, when it comes to SSDs, as they use x4 lanes, it will increase the maximum speed to 16 GB/s, doubling the previous bandwidth. Silicon Motion, the maker of NAND flash controllers, has announced that the company is going to debut a PCIe 5.0 controller next year. "We are excited about enterprise-grade PCIe Gen5 controller, which we will have taped out early next year and sample in the second half of 2022", said Wallace Kuo, chief executive of Silicon Motion, during a conference call. Launching just in time to pair with Intel's Sapphire Rapids Xeon processors that support the PCIe 5.0 protocol, Silicon Motion is probably expecting to grab its market share there.

Microchip Announces World's First PCI Express 5.0 Switches

Applications such as data analytics, autonomous-driving and medical diagnostics are driving extraordinary demands for machine learning and hyperscale compute infrastructure. To meet these demands, Microchip Technology Inc. today announced the world's first PCI Express (PCIe) 5.0 switch solutions—the Switchtec PFX PCIe 5.0 family—doubling the interconnect performance for dense compute, high speed networking and NVM Express (NVMe ) storage. Together with the XpressConnect retimers, Microchip is the industry's only supplier of both PCIe Gen 5 switches and PCIe Gen 5 retimer products, delivering a complete portfolio of PCIe Gen 5 infrastructure solutions with proven interoperability.

"Accelerators, graphic processing units (GPUs), central processing units (CPUs) and high-speed network adapters continue to drive the need for higher performance PCIe infrastructure. Microchip's introduction of the world's first PCIe 5.0 switch doubles the PCIe Gen 4 interconnect link rates to 32 GT/s to support the most demanding next-generation machine learning platforms," said Andrew Dieckmann, associate vice president of marketing and applications engineering for Microchip's data center solutions business unit. "Coupled with our XpressConnect family of PCIe 5.0 and Compute Express Link (CXL ) 1.1/2.0 retimers, Microchip offers the industry's broadest portfolio of PCIe Gen 5 infrastructure solutions with the lowest latency and end-to-end interoperability."

Intel Xeon "Sapphire Rapids" LGA4677-X Processor Sample Pictured

Here are some of the first pictures of the humongous Intel Xeon "Sapphire Rapids-SP" processor, in the flesh. Pictured by YuuKi-AnS on Chinese micro-blogging site bilibili, the engineering sample looks visibly larger than an AMD EPYC. Bound for 2021, this processor will leverage the latest generation of Intel's 10 nm Enhanced SuperFin silicon fabrication node, the latest I/O that include 8-channel DDR5 memory, a large number of PCI-Express gen 5.0 lanes, and ComputeXpress Link (CXL) interconnect. Perhaps the most interesting bit of information from the YuuKi-AnS has to be the mention of an on-package high-bandwidth memory solution. The processors will introduce an IPC uplift over "Ice Lake-SP" processors, as they use the newer "Willow Cove" CPU cores.

Intel Starts Production of "Ice Lake" Xeons, Ships 11th Gen Core "Rocket Lake-S"

Intel in its FY 2020 + Q4 2020 earnings release revealed two important development milestones from its two core businesses. As part of its Q4 2020 business highlights disclosures, the company revealed that it has commenced mass-production of its next-generation Xeon Scalable "Ice Lake-SP" enterprise processors. These chips implement the "Ice Lake" microarchitecture, with "Sunny Cove" CPU cores that offer higher IPC over "Cascade Lake," and are built on the company's 10 nm silicon fabrication node. Our older article details the 10 nm "Ice Lake-SP" silicon, where each die offers up to 28 cores, and enables Intel to build processors with up to 56 cores using two such dies on multi-chip modules.

Next up, the company states that it has "started shipping" its 11th Gen Core "Rocket Lake-S" desktop processors. "Shipping" in this context could even mean commencement of mass-production, and transfer of inventory down the supply chain, in the build up to a market availability date. At its digital keynote address on the sidelines of the 2021 International CES, Intel revealed many more details of "Rocket Lake-S," including its flagship Core i9-11900K 8-core processor, which it claims retakes the gaming performance lead that the company recently lost to AMD's Ryzen 5000 series. Multiple sources confirmed that these processors should be available only after mid-March, 2021.

Intel Reports Fourth-Quarter and Full-Year 2020 Financial Results

Intel Corporation today reported fourth-quarter and full-year 2020 financial results. The company also announced that its board of directors approved a cash dividend increase of five percent to $1.39 per share on an annual basis. The board declared a quarterly dividend of $0.3475 per share on the company's common stock, which will be payable on March 1 to shareholders of record on February 7.

"We significantly exceeded our expectations for the quarter, capping off our fifth consecutive record year," said Bob Swan, Intel CEO. "Demand for the computing performance Intel delivers remains very strong and our focus on growth opportunities is paying off. It has been an honor to lead this wonderful company, and I am proud of what we have achieved as a team. Intel is in a strong strategic and financial position as we make this leadership transition and take Intel to the next level."
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