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Neo Forza Announces DDR4-5000 and DDR4-4600 Memory Kits for AMD Zen 3 and Intel Rocket Lake

Regardless the hype surrounding the impending DDR5 memory and boards, Neo Forza (the gaming arm and brand of Goldkey Technology Corporation, TAIWAN) firmly believes DDR4 systems to still be the de-facto choice for the gaming community for some time to come, due primarily to both budget considerations and the large pool of DDR4 community forums. Would not be surprised for DDR4 versions of Alder Lake boards and Zen 4 boards to appear in the near horizon.

Entrenched in this belief, Neo Forza proudly announces release of readily available DDR4-5000 and DDR4-4600 memory. Neo Forza's frequency segmentation; 3000-3600 MHz | 3600-4400 MHz | 4400-5000 MHz is acknowledgement of bulk of PC gamers and enthusiasts to having systems one to two generations behind very latest CPU and mainboard offerings. Neo Forza's frequency segmentation practically matches DDR4 motherboard chipset tiers and CPU configurations, thereby eking out every last drop of performance from the system, maximizing budgets across all tiers of enthusiasts.

Intel Core i9-12900K Allegedly Beats AMD Ryzen 9 5950X at Cinebench R20

With qualification samples of the upcoming Intel Core i9-12900K "Alder Lake-S" processors and companion Socket LGA1700 motherboards hitting the black-market, expect a deluge of benchmarks on social media. One such that stands out makes a fascinating claim that the i9-12900K beats AMD's current flagship Ryzen 9 5950X processor at Cinebench R20, which has been AMD's favorite multi-threaded benchmark. At stock speeds, with liquid cooling, the i9-12900K allegedly scores 810 points in the single-threaded test, and 11600 points in multi-threaded.

To put these numbers into perspective, a retail Ryzen 9 5950X scores 641 points in the single-threaded test, and 10234 points in multi-threaded, in our own testing. The i9-12900K is technically a 16-core processor, just like the 5950X, but half its cores are low-power "Gracemont." The "Alder Lake-S" chip appears to be making up ground on the single-threaded performance of the "Golden Cove" P-core, that's a whopping 25% higher than the "Zen 3" core on the 5950X. This is aided not just by higher IPC, but also the max boost frequency of 5.30 GHz for 1~2 cores, and 5.00 GHz "all-core" boost (for the P-cores).

AMD Ryzen Threadripper 5000 "Chagall" Processors Arrive This August in Both sTRX4 and sWRX8 Variants

AMD is preparing to launch the Ryzen Threadripper 5000 "Chagall" HEDT processors in August 2021, according to a MoePC report, confirming a rumor from April 2021. These chips will arrive in core-counts of up to 64, spanning two CPU socket types—sTRX4 (Ryzen Threadripper) and sWRX8 (Ryzen Threadripper PRO), and compatible with existing motherboards that run Ryzen 3000 Threadrippers, requiring a UEFI firmware update. Nearly every retail sTRX4 motherboard we've come across features USB BIOS Flashback, letting you update the firmware of an off-the-shelf motherboard without needing to install a compatible processor.

What's new with the Ryzen Threadripper 5000 is the new "Zen 3" CCDs, which place all 8 CPU cores of the die into a single CCX, sharing a unified 32 MB L3 cache. The I/O is identical to the previous generation, with the sTRX4 chips featuring quad-channel DDR4 interface, and sWRX8 ones featuring 8-channel, both with ECC; and up to 88 PCI-Express Gen 4 lanes. AMD also slightly increased the xGMI2 bandwidth to 18 GT/s, from 16 GT/s on the Ryzen Threadripper 3000 series.

Many Thanks to DeathtoGnomes for the tip.

HP Unveils Pavilion Aero - its Lightest Consumer Laptop, Powered by AMD

Today, HP Inc. announced its lightest consumer laptop yet, the HP Pavilion Aero 13 Laptop PC. Starting at less than 1 kilogram, the Pavilion Aero 13 delivers a flawless sustainable design with the power to entertain, connect, and be productive. HP also welcomed the HP M24fwa FHD Monitor and HP M27fwa FHD Monitor to the M-Series line of monitors featuring built-in audio; the newest additions are part of the world's first Eyesafe certified monitor series made with recycled ocean bound plastics.

As more people return to a new normal, they need a PC that can move with them while at home and on the go. The PC is used away from home 45% of the time to perform a wide range of tasks, with 25% of time spent streaming videos while 11% of the time is spent being productive, whether it be learning or work-related. With the new Pavilion Aero 13, people can work hard and play hard no matter where they are, on a single, lightweight device.

AMD Ryzen Embedded V3000 SoCs Based on 6nm Node, Zen 3 Microarchitecture

AMD's next generation Ryzen Embedded V3000 system-on-chips aren't simply "Cezanne" dies sitting on BGA packages, but rather based on a brand new silicon, according to Patrick Schur, a reliable source with leaks. The die will be built on the more advanced 6 nm silicon fabrication node, whilst still being based on the current "Zen 3" microarchitecture. There are several things that set it apart from the APU silicon of the current-generation, making it more relevant for the applications the Ryzen Embedded processor family is originally built for.

Built in the FP7r2 BGA package, the V3000 silicon features an 8-core/16-thread CPU based on the "Zen 3" microarchitecture. There are also an integrated GPU based on the RDNA2 graphics architecture, with up to 12 CUs, a dual-channel DDR5 memory interface, a 20-lane PCI-Express 4.0 root complex, with up to 8 lanes put out for PEG; two USB4 ports, and two 10 GbE PHYs. AMD could design at least three SKUs based on this silicon, spanning TDP bands of 15-30 W and 35-54 W.

AMD Socket AM5 Motherboards Arriving in 2022, Paves Way for Zen3 + 3DV Cache on AM4

AMD Socket AM5 motherboards are set to arrive in Q2-2022, according to PJ, the editor of Uniko's Hardware. This would mean that the Zen 3 + 3D Vertical Cache chiplet AMD CEO Dr Lisa Su showed off in her Computex keynote, could very well be built in the Socket AM4 package, compatible with existing motherboards. The prototype Dr Su showed off appeared Socket AM4, too. AMD claims that the 3D Vertical Cache feature, when paired with a "Zen 3" chiplet, improves gaming performance by a significant 15 percent, helping AMD catch up with Intel's "Rocket Lake-S" processor at gaming. Elsewhere across the landscape, PJ predicts that the Z690 chipset, which goes with "Alder Lake-S" processors in the LGA1700 package, will arrive by Q4 2021, with cost-effective chipsets such as the B660 and H610 in Q1-2022.

AMD Shares New Details on Their 3D V-Cache Tech for Zen 3+

AMD via its official YouTube has shared a video that goes into slightly more detail on their usage of V-Cache on the upcoming Zen 3+ CPUs. Firstly demoed to the public on AMD's Computex 2021 event, the 3D V-Cache leverages TSMC's SoIC stacking technology, which enables silicon developments along the Z axis, instead of the more usual footprint increase along the X axis. The added 3D V-Cache, which was shown in Computex as being deployed in a prototype Ryzen 9 5900X 12-core CPU, adds 64 MB of L3 cache to each CCX (the up-to-eight-cores core complex on AMD's latest Zen design), basically tripling the amount of L3 cache available for the CPU. This, in turn, was shown to increase FPS in games quite substantially (somewhere around 15%), as games in particular are sensitive to this type of CPU resources.

The added information explains that there is no usage of microbumps - instead, there is a perfect alignment between the bottom layer (with the CCX) and the top layer (the L3 cache) which enables the bonding process to occur naturally via the TSVs (Through Silicon Vias) already present in the silicon, in a zero-gap manner, between both halves of the CPU-cache sandwich. To enable this, AMD flipped the CCX upside down (the core complex now faces the bottom of the chip, instead of the top), shaved 95% of the silicon on top of the upside-down core complexes, and then attaches the 3D V-Cache chips on top of this formation. This also has the added bonus of decreasing the distance between the L3 cache and the CCX (the distance between both in the Z axis is around 1,000 times smaller than if the L3 cache was deployed in the classical X axis), which decreases power consumption, temperatures, and latency, allowing for further increases to system performance. Look after the break for the full video.

GIGABYTE Announces AMD Ryzen 5000U-powered BRIX Mini PC

GIGABYTE Technology, a leading manufacturer of motherboards, graphics cards, and hardware solutions, today announced the all-new 2021 BRIX mini-PC series, which adopts the latest AMD Ryzen 5000U mobile processors that have leading 7 nm technology, 8 cores/16 threads CPU architecture, low 15 W TDP, and reduced power consumption compared to the previous generation. Benefiting from AMD's premium "Zen 3" core architecture and "Vega" GPU cores, these processors boost the performance significantly in CPU and GPU related workloads. Enhanced by GIGABYTE's exclusive design, the all-new 2021 BRIX mini-PC design integrates 4 display outputs, 2.5G Ethernet, and 802.11ax WiFi 6E configuration, creating the most powerful multitasking mini-PC with astounding performance and responsiveness for either gaming or content creation.

The latest AMD Ryzen 5000U mobile processors highlight 7 nm technology, and when compared to the previous generation, these new processors feature a 16% increase in single-threaded performance, 14% increase in multi-threaded performance, and do so with higher clock frequencies and lower SoC power consumption. The powerful performance of AMD Ryzen 5000U mobile processors sets a milestone for the mobile platform. When it comes to benchmark testing, it is inspiring to see that 3DMark CPU Performance scores come in at 1.23x that of competitor's 11th Gen processors and 1.8x on Cinebench R20 benchmark too. No more needing to compromise between productivity, performance, and gaming/video performance.

AMD Announces Ryzen 5000G and PRO 5000G Desktop Processors

AMD today announced the launch of its first Ryzen 5000 series desktop processors with integrated graphics, under the Ryzen 5000G and Ryzen Pro 5000G lines. These processors are based on the 7 nm "Cezanne" silicon, featuring up to 8 CPU cores based on the "Zen 3" microarchitecture, an iGPU based on the "Vega" graphics architecture with up to 8 compute units, but updated display- and media-acceleration engines; 512 KB of L2 cache per core, and 16 MB of L3 cache that's shared between all eight cores. Built in the Socket AM4 package, the processors are compatible with AMD 500-series chipset motherboards. The chips feature PCI-Express Gen 3 downstream I/O.

The consumer Ryzen 5000G series include the Ryzen 7 5700G, and the Ryzen 5 5600G. The 5700G features an 8-core/16-thread CPU, clock speeds of 3.80 GHz, with up to 4.60 GHz boost, and all 8 iGPU compute units being unlocked with up to 2.00 GHz engine clocks. The 5600G, on the other hand, has a 6-core/12-thread CPU clocked at 3.90 GHz, with up to 4.40 GHz boost, and 7 iGPU compute units with up to 1.90 GHz engine clocks. Both chips have their TDP rated at 65 W. AMD claims that the 5700G beats the Core i7-11700 in a variety of content creation and iGPU gaming tasks, as shown in the graphs below; and the iGPU is capable of 1080p e-sports gaming. The 5700G is priced at USD $359, and the 5600G goes for $259. Both chips are available from August 5, 2021.

Acer Announces the Swift X Featuring NVIDIA GeForce RTX 30 Series Laptop GPUs

Acer today introduced the Swift X, the newest member of its popular Swift line of notebooks. Designed to take ultra-portable PC design to the next level, this ultrathin-and-light laptop boasts an AMD Ryzen 5000 Series Mobile Processor with "Zen 3" architecture and the latest NVIDIA GeForce RTX 3050 Ti Laptop GPUs.

"Acer's new notebook models are designed to offer consumers the widest possible choice of high-performance, ultraportable computing devices," said James Lin, General Manager, Notebooks, IT Products Business, Acer Inc. "Professionals need a clean-looking notebook that is compact enough to take with them throughout the day, but it also has to be powerful enough to run multiple resource-intensive programs at once. With every device we make, we're always pursuing that balance."

GIGABYTE Announces AMD Ryzen-powered Gaming Laptops

Hot of the release of the new generation of AERO creator and AORUS professional gaming laptops equipped with the GeForce RTX 30 series laptop GPUs, world leading PC brand, GIGABYTE is proud to unveil the all new mid-range gaming laptop series: GIGABYTE GAMING laptops. Introducing two models, the A5 and A7 laptops made for multitasking. Beyond gaming the A7 laptop is GIGABYTE's first mid-end gaming laptops to be equipped with AMD Ryzen 5000H series mobile processors and NVIDIA GeForce RTX 30 series laptop GPUs.

As COVID-19 continues to ravage countries around the world, cities are once again under lockdown and people are once again subject quarantine restrictions. Working remotely, learning remotely, and stay-at-home economics means accessible innovative computing is needed to meet the changes. GIGABYTE GAMING series target Gen Z and Millennial users, by offering up machines built for "multitasking" and meeting multiple needs at once, whether its learning, commerce, gaming or content creation. Capable of great performance, the GIGABYTE GAMING is ideal for everyday life, work, and entertainment. It features all-purpose product specifications - Up to 144 Hz refresh rate and 72% NTSC wide color gamut, 1+3 external DisplayPort, and three slots that support up to 6 TB storage space. The GIGABYTE GAMING series is ready to offer high performance to the mid-range market.

AMD "Milan-X" Processor Could Use Stacked Dies with X3D Packaging Technology

AMD is in a constant process of processor development, and there are always new technologies on the horizon. Back in March of 2020, the company has revealed that it is working on new X3D packaging technology, that integrated both 2.5D and 3D approaches to packing semiconductor dies together as tightly as possible. Today, we are finally getting some more information about the X3D technology, as we have the first codename of the processor that is featuring this advanced packaging technology. According to David Schor, we have learned that AMD is working on a CPU that uses X3D tech with stacked dies, and it is called Milan-X.

The Milan-X CPU is AMD's upcoming product designed for data center usage. The rumors suggest that the CPU is designed for heavy bandwidth and presumably a lot of computing power. According to ExecutableFix, the CPU uses a Genesis-IO die to power the connectivity, which is an IO die from EPYC Zen 3 processors. While this solution is in the works, we don't know the exact launch date of the processor. However, we could hear more about it in AMD's virtual keynote at Computex 2021. For now, take this rumor with a grain of salt.
AMD X3D Packaging Technology

Intel to Detail "Alder Lake" and "Sapphire Rapids" Microarchitectures at Hot Chips 33, This August

Intel will detail its 12th Gen Core "Alder Lake" client and "Sapphire Rapids" server CPU microarchitectures at the Hot Chips 33 conclave, this August. In fact, Intel's presentation leads the CPU sessions on the opening day of August 23. "Alder Lake" will be the session opener, followed by AMD's presentation of the already-launched "Zen 3," and IBM's 5 GHz Z processor powering its next-gen mainframes. A talk on Xeon "Sapphire Rapids" follows this. Hot Chips is predominantly an engineering conclave, where highly technical sessions are presented by engineers from major semiconductor firms; and so the sessions on "Alder Lake" and "Sapphire Rapids" are expected to be very juicy.

"Alder Lake" is Intel's attempt at changing the PC ecosystem by introducing hybrid CPU cores, a concept introduced to the x86 machine architecture with "Lakefield." The processor will also support next-generation I/O, such as DDR5 memory. The "Sapphire Rapids" server CPU microarchitecture will see an increase in CPU core counts, next-gen I/O such as PCI-Express 5.0, CXL 1.1, DDR5 memory, and more.

Intel Announces 11th Gen Core "Tiger Lake-H" Mobile Processors

Intel today announced the 11th generation Core "Tiger Lake-H" mobile processors for notebooks of conventional thickness, gaming notebooks, and mobile workstations. This is the first scale-up of the "Tiger Lake" microarchitecture, with the introduction of a brand new die that has up to 8 "Willow Cove" CPU cores. These processors typically come with TDP of 35-45 W, but the flagship part ships with TDP as high as 65 W. Unlike "Rocket Lake," this chip is built on Intel's latest 10 nm SuperFin silicon fabrication process. With it, Intel is announcing ten processor SKUs—five each for the consumer and commercial notebook market segments. These span across the Core i9, Core i7, and Core i5 brand extensions.

The 10 nm "Tiger Lake-H" silicon measures roughly 190 mm², and has several changes compared to the 4-core "Tiger Lake-U" silicon the company debuted the 11th Gen with. The biggest change is the CPU core count of 8. This lets it not only achieve parity with AMD in mobile CPU core counts, but also purportedly beat it on the back of a higher IPC. Each of these 8 "Willow Cove" cores has 1.25 MB of dedicated L2 cache, and share 24 MB of L3 cache. You get the same "Willow Cove" ISA as the "Tiger Lake-U," including AVX-512 and DLBoost. Next up, the chip features an integrated graphics based on the Gen12 Xe LP graphics architecture, only that the execution units have reduced to just 32 on this silicon, compared to 96 on the 4-core Tiger Lake-U. The new chip enjoys a bigger power budget to run the iGPU at higher clock speeds. There is also a 20-lane PCI-Express Gen 4.0 interface, and a dual-channel DDR4 memory controller.

AMD Ryzen 7 5700G and Ryzen 5 5600G "Zen 3" Cezanne Desktop Processors Benched

Several benchmark numbers of the upcoming AMD Ryzen 7 5700G and Ryzen 5 5600G desktop processors were fished out by Thai PC enthusiast TUM_APISAK. The 5700G and 5600G are based on the 7 nm "Cezanne" silicon that combines up to 8 "Zen 3" CPU cores across a single CCX, sharing a single 16 MB L3 cache; along with an iGPU based on the "Vega" graphics architecture. Both chips were put through the CPU-Z Bench, where they posted spectacular results.

Both chips post higher single-thread score than the Core i9-10900K "Comet Lake," riding on the back of the high IPC of the "Zen 3" cores, and low latencies from the monolithic "Cezanne" silicon. In the multi-threaded test, the 8-core/16-thread 5700G scored above the Core i9-9900KS (5.00 GHz all-core). An HP OMEN 25L pre-built was put through Geekbench 5, where it was found performing within 90% of the Core i5-11600K. Userbenchmark remarks that the 5600X performs within the league of contemporaries, but falls behind on memory latency. Find the validation pages in the source links below.

AMD Breaks Through Cinebench R23 World Record With Dual Epyc Build

AMD via its official YouTube channel shared a video of two of its Epyc chips destroying Cinebench's R23 benchmark, setting a new world record in the process. The record-setting feat was achieved with two off-the shelf Epyc 7763 CPUs - the ones with 64 physical CPUs and 128 threads of Zen 3 IPC. The system, which was built on top of a reference server motherboard and paired with server-grade aircooling, reached a grand total of 113,631 points - completing the benchmark run is around ten (10) measly seconds and soaring through the previous record-holder, a heavily overclocked Ryzen Threadripper 3990X (105,170 points).

The AMD system crushes the closest-priced Intel Xeon CPUs in performance - a dual Intel Xeon Platinum 8380 (Ice Lake-SP generation) configuration reached a comparably paltry 74,630 points - and AMD wins in the price-performance ratio again, with each of its Epyc 7763 CPUs costing $7,890 compared to $8,100 for each of the Intel Xeon platinum 8380. AMD's name of choice for their server-grade CPUs offering up a justification for its admittedly 15-year-old naming scheme. Catch the AMD video after the break.

AMD Launches Ryzen 5000G "Cezanne" APU Lineup for OEMs

AMD has today decided to launch the next generation of Accelerated Processing Units (APUs), now in form of the 5000G lineup codenamed Cezanne. The APUs are getting launched as OEM-exclusive products for now, which means that only manufacturers like Dell, HP, Lenovo, etc. can have access to them. AMD is set to announce these processors for wider masses, such as consumer DIYers, later this year. So you must be wondering what is new about the 5000G APUs. For starters, the new APUs feature AMD's improved Zen 3 core with a notable IPC boost over Zen 2 found in last generation 4000G APUs. When it comes to graphics, the new APUs feature anywhere from 6-8 GPU cores, based on the Vega architecture.

When it comes to the available models, AMD lists six SKUs, all differentiating in CPU/GPU core count, TDP, and frequency. There are three regular SKUs, with their power-efficient variants. The regular SKUs are AMD Ryzen 7 5700G, Ryzen 5 5600G, and Ryzen 3 5300G. They are normal SKUs that have a TDP of 65 Watts, meaning a higher base frequency needing a more adequate cooling solution. However, as there are regular SKUs, there are also power-efficient, TDP-constrained models present. Called the AMD Ryzen 7 5700GE, Ryzen 5 5600GE, and Ryzen 3 5300GE, these models bring the TDP down to 35 Watts and reduce base frequency by a couple of hundreds of MHz.

AMD Ryzen 5000 Series CPUs with Zen 3 Cores Could be Vulnerable to Spectre-Like Exploit

AMD Ryzen 5000 series of processors feature the new Zen 3 core design, which uses many techniques to deliver the best possible performance. One of those techniques is called Predictive Store Forwarding (PSF). According to AMD, "PSF is a hardware-based micro-architectural optimization designed to improve the performance of code execution by predicting dependencies between loads and stores." That means that PSF is another "prediction" feature put in a microprocessor that could be exploited. Just like Spectre, the feature could be exploited and it could result in a vulnerability in the new processors. Speculative execution has been a part of much bigger problems in CPU microarchitecture design, showing that each design choice has its flaws.

AMD's CPU architects have discovered that the software that relies upon isolation aka "sandboxing", is highly at risk. PSF predictions can sometimes miss, and it is exactly these applications that are at risk. It is reported that a mispredicted dependency between load and store can lead to a vulnerability similar to Spectre v4. So what a solution to it would be? You could simply turn it off and be safe. Phoronix conducted a suite of tests on Linux and concluded that turning the feature off is taking between half a percent to one percent hit, which is very low. You can see more of that testing here, and read AMD's whitepaper describing PSF.

ASUS ROG G15 with Radeon RX 6800M and Ryzen 9 5900HX Spotted

It's close to impossible finding a Ryzen 9 mobile processor-powered gaming notebook with a high-end NVIDIA GPU. Having returned to the high-end discrete GPU market with the "Big Navi" Radeon RX 6000 series, AMD is looking to complement its Ryzen 5000M series "Zen 3" Cezanne mobile processors with high-end RDNA2 GPUs of its own. An upcoming model of the ASUS ROG G15 (2021) leaked to the web in a CPU-Z validation database (model: G513QY). This notebook packs a Ryzen 9 5900HX "Cezanne" 8-core/16-thread processor based on the "Zen 3" microarchitecture; but more interestingly, the discrete GPU is Radeon RX 6800M.

The desktop Radeon RX 6800 (non-XT) and RX 6700 XT have shown that AMD has achieved performance/Watt parity/leadership over NVIDIA with high-end GPUs. VideoCardz reports that the RX 6800M is likely based on a maxed-out 7 nm "Navi 22" silicon, with 2,560 stream processors, and 12 GB of GDDR6 memory across a 192-bit wide memory bus. The RX 6800M could play in the same performance league as the GA104-based GeForce RTX 3080 Mobile, given that the desktop RX 6700 XT is leveling up to the desktop RTX 3070. Given the 256-bit memory bus width of the larger "Navi 21" silicon, it's quite possible that AMD comes up with even higher mobile SKUs, so AMD-powered gaming notebooks finally match/beat Intel+NVIDIA combinations.

AMD Reportedly Preparing To Launch Zen 3 Ryzen Threadripper 5000 in August

The AMD Zen 3 architecture provided significant performance improvements with the company releasing server, desktop, and mobile processors featuring the architecture. AMD is yet to update their Threadripper lineup with the new architecture however that looks set to change with the company reportedly preparing to announce the next generation "Chagall" Threadripper 5000 processors in August. The Threadripper family is in dire need of a refresh with the latest 3000 series processors being launched back in November 2019. The new processors should be compatible with existing TRX40 motherboards with a simple BIOS update.

TYAN Now Offers AMD EPYC 7003 Processor Powered Systems

TYAN, an industry-leading server platform design manufacturer and a MiTAC Computing Technology Corporation subsidiary, today introduced AMD EPYC 7003 Series Processor-based server platforms featuring efficiency and performance enhancements in hardware, security, and memory density for the modern data center.

"Big data has become capital today. Large amounts of data and faster answers drive better decisions. TYAN's industry-leading server platforms powered by 3rd Gen AMD EPYC processors enable businesses to make more accurate decisions with higher precision," said Danny Hsu, Vice President of MiTAC Computing Technology Corporation's Server Infrastructure BU. "Moving the bar once more for workload performance, EPYC 7003 Series processors provide the performance needed in the heart of the enterprise to help IT professionals drive faster time to results," said Ram Peddibhotla, corporate vice president, EPYC product management, AMD. "Time is the new metric for efficiency and EPYC 7003 Series processors are the perfect choice for the most diverse workloads, helping provide more and better data to drive better business outcomes."

AMD Announces 3rd Generation EPYC 7003 Enterprise Processors

AMD today announced its 3rd generation EPYC (7003 series) enterprise processors, codenamed "Milan." These processors combine up to 64 of the company's latest "Zen 3" CPU cores, with an updated I/O controller die, and promise significant performance uplifts and new security capabilities over the previous generation EPYC 7002 "Rome." The "Zen 3" CPU cores, AMD claims, introduce an IPC uplift of up to 19% over the previous generation, which when combined by generational increases in CPU clock speeds, bring about significant single-threaded performance increases. The processor also comes with large multi-threaded performance gains thanks to a redesigned CCD.

The new "Zen 3" CPU complex die (CCD) comes with a radical redesign in the arrangement of CPU cores, putting all eight CPU cores of the CCD in a single CCX, sharing a large 32 MB L3 cache. This the total amount of L3 cache addressable by a CPU core, and significantly reduces latencies for multi-threaded workloads. The "Milan" multi-chip module has up to eight such CCDs talking to a centralized server I/O controller die (sIOD) over the Infinity Fabric interconnect.

AMD to Launch 3rd Gen EPYC Processors on March 15

AMD today announced that its 3rd generation EPYC enterprise processors will launch on March 15, 2021. Codenamed "Milan," these processors are expected to leverage the company's latest "Zen 3" CPU microarchitecture to significantly increase IPC (single-threaded performance), and retain compatibility with the the SP3 socket. AMD set up a micro-site where it will stream the 3rd Gen EPYC processor launch event on March 15, at 11 ET (16:00 UTC). "Milan" is rumored to be AMD's final processor architecture on this socket, before transitioning to SP5 and the next-gen processor codenamed "Genoa," sometime in 2022. "Genoa" marks a switch to next-gen I/O such as DDR5 memory and PCIe gen 5.0, along with an increase in CPU core counts.

Dell Lists an AMD "Ryzen 7 5800" (non-X) Option

AMD appears to be taking baby steps toward expanding its Ryzen 5000 "Zen 3" desktop processor lineup. Dell Canada has started listing a model of the processor series not yet available in the DIY retail channel, the Ryzen 7 5800 (non-X). This isn't a typo, as the option is listed next to the 5800X. The Ryzen 7 5800 is described as being an 8-core part, much like the 5800X, but has a slightly lower max boost frequency of 4.60 GHz, as opposed to 4.70 GHz of the 5800X. It could have a lower nominal (base) frequency compared to the 5800X, and possibly even a lower TDP. The last time AMD released an OEM-exclusive non-X SKU was the Ryzen 9 3900 12-core processor.

AMD's current retail-channel (PIB) lineup of Ryzen 5000 series desktop processors starts at $299 for the 6-core Ryzen 5 5600X, with the company still selling Ryzen 3000-series SKUs such as the 8-core Ryzen 7 3700X under this price. We expect the company to flesh out the 5000-series with SKUs such as the "Ryzen 5 5600 (non-X)," later this year, in response to Intel's 11th Gen Core i5 series based on the "Rocket Lake-S" silicon. Given the fate of the Ryzen 9 3900, we don't expect a broad retail launch of the Ryzen 7 5800.

Intel Core i9-11900T "Rocket Lake" Processor Allegedly Catches Up with Zen 3 in Single-Threaded Performance

When AMD announced its Ryzen 5000 series of processors based on the new Zen 3 architecture, the performance of these processors was the best on the market. Even in our own testing, we have found that AMD's Zen 3 core is the highest performing core on the market, even beating Intel's latest and greatest, the 10th generation of Core processors. However, Intel has been doing some silent work and the company has developed a new core to be used in the 11th generation "Rocket Lake" platform. Codenamed Cypress Cove, the design is representing a backport of the 10 nm Sunny Cove design, supposed to bring around 19% IPC improvement across the board.

If you were wondering if that was enough to catch up with AMD's Zen 3 IPC performance, look no further because we have Geekbench 5 performance results of Intel's 35 Watt Core i9-11900T processor. Having a base frequency of only 1.51 GHz, the CPU is capable of boosting one or two cores to the very high speed of 4.9 GHz, giving us a good example of the single-threaded performance we can expect from this CPU. In GB5 tests, the Core i9-11900T has managed to score 1717 points in the single-threaded test and 8349 points in multi-threaded results. Comparing that to something like AMD Ryzen 5800X, which scores 1674 points in single-threaded results, Rocket Lake's Cypress Cove core has managed to be 2.5% faster than Zen 3. However, in multi-threaded results, the AMD chip is unmatched as the low TDP of the Intel processor is stopping it from reaching full performance.
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