GIGABYTE over the last week posted UEFI firmware updates for its Socket AM4 motherboards that add support for the upcoming AMD Ryzen 5800X3D processor. Released for motherboards across its AMD 400-series and 500-series lineups; the updates pack AGESA ComboPI V2 1.2.0.6 Patch-b microcode. Another key feature of these updates are that they re-introduce the "Max CPU Boost Clock Override" toggle, which appears when a Ryzen 5000 "Vermeer" processor is installed.

The Ryzen 7 5800X3D is an 8-core/16-thread processor based on the "Zen 3" microarchitecture, and packs the AMD 3D Vertical Cache (3DV Cache) technology, featuring 100 MB of Total Cache (AMD jargon for the sum of all L2 + L3 cache). The company claims gaming performance on par with the Core i9-12900K "Alder Lake" processor. The re-introduction of the Boost Frequency overrides signal that the company wants enthusiasts to go to town with overclocking, making this a possible response to the i9-12900KS gaming performance, at a lower price-point.

AMD announced the expansion of Amazon Web Services Inc. (AWS) AMD EPYC processor-based offerings with the general availability of compute optimized Amazon EC2 C6a instances. According to AWS, the C6a instances offer up to 15% better compute price performance over previous generation C5a instances for a variety of compute focused workloads.

The C6a instances support compute-intensive workloads such as batch processing, distributed analytics, ad serving, highly scalable multiplayer gaming, and video encoding. This is the second AWS EC2 instance type powered by 3rd Gen AMD EPYC processors, following the release of the M6a instances. These instances continue the collaboration between AWS and AMD providing AWS EC2 customers access to the performance and price performance capabilities of the latest generation of AMD EPYC processors.

We're not sure if this will bring more praise for AMD, or if there will be a new angry mob with virtual pitchforks, because it's coming too late, but it looks like at least some AMD X370 based motherboards are getting support for AMD's Zen 3 based Ryzen processors. First out is ASRock with the X370 Pro4, which even at launch was a run of the mill X370 board, but it's possible that the company is just using it as its test platform to see if it's worth adding support for Zen 3 or not.

ASRock has added support for all of AMD's Vermeer based CPUs, as well as several Renoir based APUs. You can find all the added models in the modified screenshot below, since the processors weren't all listed in order on ASRock's website. The P7.10 UEFI update is required and it also drops support for AMD's now rather old Excavator+ based Bristol Ridge APUs, a loss that almost no-one is likely to shed a tear over. The interesting thing to keep an eye on now, is both if ASRock will follow suit with other models, as well as what its competitors will do in terms of adding support for Zen 3 CPUs on their older motherboard models.

AMD's Ryzen 7000 series of desktop processors based on the novel Zen 4 core architecture are scheduled to arrive in the second half of 2022. While we are not sure just how big the architectural differences will be going from Zen 3 (with or without 3D V-cache) to the new Zen 4 core, we have some leaked information that confirms the existence of two SKUs that reveal additional details about the processor configuration. In the MilkyWay@Home project, aiming to create a model of the Milky Way galaxy by utilizing countless PCs across the globe, we found two next-generation Ryzen 7000 SKUs. The MilkyWay@Home project isn't a benchmark. However, it is a valuable reference where the next generation processors appeared.

First in line is the 100-000000666-21_N CPU, a codename for an eight-core, sixteen-threaded design. This model should correspond to the AMD Ryzen 7 7800X CPU, a successor to the Ryzen 7 5800X model. Next in line is the 100-000000665-21_N CPU with 16 cores and 32 threads, a successor to the Ryzen 9 5950X named Ryzen 9 7950X. One important thing to note is that these new CPUs feature different level two (L2) cache configurations. With the previous generation 5000 series "Vermeer" processors, the L2 cache was locked at 512 KB per core. However, according to today's leak, the upgraded Zen 4 IP will bring 1024 KB of L2 cache per core, doubling the cache size at one of the fastest levels.

One of the most debated questions surrounding AMD's AM4 platform has been the lack of support for AMD's Ryzen 5000-series CPUs on the company's 300-series chipsets. Now, in an interview with Tom's Hardware, AMD's Corporate VP and GM of the Client Channel business, David McAfee, has thrown some cautious words into the hellish debate on platform fragmentation (some even say artificial segmentation). "It's definitely something we're working through," David said. "And it's not lost on us at all that this would be a good thing to do for the community, and we're trying to figure out how to make it happen." It's not a promise, but it seems that AMD is indeed contemplating solutions that would enable first-generation AM4 chipsets to support AMD's latest Ryzen 5000 series CPUs.

The problem has mostly to do with storage space: there are only so much available bits to be used in AM4 motherboards' 16 MB SPI ROM, the read-only memory bank that stores BIOS configurations and the necessary instructions for processor support. As AM4 is one of the longest-lived consumer platforms ever, the number of CPUs has ballooned, which has led to difficult decisions as to which CPUs to support. However, some more creative board partners have resorted to interesting techniques that allowed them to free up space in the SPI ROM that could be used to add support for otherwise incompatible CPUs, such as simplifying the BIOS GUI and falling back on more traditional text-based UIs. That and other practices resulted in a number of vendors adding support for AMD's Ryzen 5000 chips on the most entry-level A320 motherboards, which left consumers that had opted for the more technically accomplished X370 motherboards high and dry - barring a few lucky, ASRock-toting exceptions.

The Ryzen 3000XT line of processors were the kind of stop-gap products that make people wary of stop-gap products, and AMD plans to remedy this. The new Ryzen 7 5800X3D is an upcoming Socket AM4 processor designed with the singular purpose of matching the Intel Core i9-12900K "Alder Lake" processor at gaming performance, so Intel doesn't have free reign until much later in the year, when AMD debuts "Zen 4" and AM5. It's also a means for AMD to signal consumers as well as investors to the sheer engineering depth the company enjoys these days.

The Ryzen 7 5800X3D isn't a a 5800X with an insane CPU overclock that throws efficiency out of the window. In fact, it has lower clocks! Instead, it leverages a new feature addition AMD did to its existing "Zen 3" microarchitecture, called 3D Vertical Cache. This is basically 64 MB of fast SRAM physically stacked on top of the CPU core die (CCD), giving it 96 MB of last-level cache. The company has already debuted this with its EPYC "Milan-X" enterprise processors, and the Ryzen 7 5800X3D would be the first client-segment product with this CCD.

AMD's next-generation Ryzen "Raphael" processor could launch only in the second half of 2022, confirms a leaked company slide scored by VideoCardz. The slide points to a Ryzen 5000X3D series product-stack update within the 1H-2022. These are Socket AM4 processors that leverage the company's updated "Zen 3(+)" CPU core die (CCD), which features 64 MB of 3D Vertical cache memory in addition to 32 MB of L3. AMD claims that 3DV Cache technology significantly improves performance akin to a generational update (anywhere between 5% to 25% depending on the application). The company is targeting "Spring" 2022 for launch, which would put this around early-Q2.

The "Raphael" Socket AM5 processor is sure to catch much of the attention, as it's the company's true next-gen desktop product. It heralds Socket AM5, a new LGA-based socket; and next-generation connectivity that includes DDR5 memory and PCI-Express Gen 5. The CCDs of these processors are built on the TSMC N5 (5 nm) silicon fabrication node, and are based on the "Zen 4" microarchitecture. The leaked slide shows the first grainy picture of Socket AM5, with a retention mechanism not unlike what we're used to, on the Intel platform. We're hearing rumors that AM5 will somehow manage cooler-compatibility with AM4 despite the radical redesign to the socket. An H2-2022 launch would put "Raphael" close to Intel's 13th Gen Core "Raptor Lake" launch, as team blue hopes to return to an annual IPC-uplift cadence, with up to 8 "Raptor Cove" P-cores, and 16 "Gracemont" E-cores.

AMD is planning to crash Intel's big 12th Gen Core "Alder Lake-P" mobile processor launch with its own next-gen launch, the Ryzen 6000 mobile processor series. These chips are the company's first built on the TSMC N6 (6 nm) silicon fabrication process, and combine up to 8 "Zen 3+" CPU cores, with a next-generation iGPU based on the RDNA2 graphics architecture. The company has given the Media CoreNext and Video CoreNext engines incremental updates, according to a leaked slide scored by VideoCardz.

Ryzen 6000 "Rembrandt" processors come with hardware-accelerated decode of the AV1 video format. The Display CoreNext (display I/O engine) now supports DisplayPort 2.0, complete with DSC, UHBR10, HDR10+, and variable refresh-rate. The HDR pipeline has awareness for the various display panel types, including OLED and mini-LED. The iGPU on "Rembrandt" features up to 12 compute units (768 stream processors). It remains to be seen if Ray Accelerators are featured, as that would make this the first iGPU (on the PC platform) with DirectX 12 Ultimate support.

In a few hours, AMD is about to hold its CES press conference, but details of its Ryzen 6000 series Mobile CPUs have made their way online and it looks like anyone considering a new laptop this year, should be in for quite a treat. AMD's CEO, Lisa Su already teased the company's new CPU on social media yesterday, but obviously provided no further details, but courtesy of a leak from VideoCardz, we now have what looks like the full specs.

AMD is apparently planning no less than eight H-series consumer SKUs, plus another two U-series consumer SKUs at launch, plus the rumoured 5x25U Zen 3 based additions, which adds a further three SKUs. The new H-series processors will range from Ryzen 5 to 9 and will have max boost speeds ranging from 4.5 to 5 GHz, which confirms earlier rumours about these chips supporting very high clock speeds. All of the new CPU SKUs will feature 19 or 20 MB of L2 plus L3 cache and with the exception of the three Zen 3 based chips, all of the new processors will be manufactured at 6 nm.

If you've been waiting for more details about AMD's next mobile platform, then you're in luck, as the motherload has dropped today, with lots of details about the new Rembrandt APU's that are launching next year. Not only has a picture of the first motherboard, with adhering laptop showed up, but we also have a mostly complete block diagram and a list of expected SKU's, even though not all SKU models are revealed as yet.

AMD's Rembrandt APU will be its first APU with PCIe 4.0 support, which in itself might not be worth the wait, but if paired with the right GPU, this might help increase the performance somewhat compared to the previous generation of APUs from AMD. The bigger news is USB4 support, plus a new GPU which we so far don't know too much about, but it's speculated that it'll be called Radeon RX 680M and should offer 12 compute units. DDR5 memory support is also expected, so Rembrandt clearly has a new memory controller, since the APU is still based on the Zen 3 architecture.

Intel's upcoming Core i3-12100 and i3-12300 quad-core processors that form the value-end of the 12th Gen Core "Alder Lake-S" desktop processor family, pack an incredible mix of performance for their segment, which puts them ahead of six-core parts from the previous-generation, according to performance testing on the ChipHell forums. The two chips are based on the "H0" silicon, and feature four "Golden Cove" P-cores with HyperThreading enabled; no E-cores, and 12 MB of shared L3 cache. From what we can tell, the i3-12100 and i3-12300 are segment only by a 100 MHz maximum boost frequency value, and possibly at the iGPU-level.

Among the tests run by ChipHell are Cinebench R20, Cinebench R23, CPU-Z bench, CS:GO; and power/thermal testing using AIDA64. Right off the bat, we see the two chips flex their high IPC in the CPU-Z bench, scoring 687 points (i3-12100), and 702.5 points (i3-12300). An AMD "Zen 3" based quad-core chip, such as the OEM-only Ryzen 3 PRO 5350G, should score roughly 620 points, while the slowest "Rocket Lake" part, the i5-11400, only does 566 points. The multi-threaded test sees scores ranging between 3407 to 3482 points for the two.

AMD is preparing to update its Ryzen Threadripper PRO line of workstation processors, with product announcements slated for January 2022, along the sidelines of CES, with availability slated for March 8, 2022, according to a VideoCardz report. The new Ryzen Threadripper PRO 5000 series processors are likely to combine "Zen 3+" CCDs (6 nm, featuring 3D Vertical Cache memory), with full sWRX8 I/O that includes 128 PCI-Express Gen 4 lanes, and 8-channel DDR4 memory. There are no sTRX4 options on the horizon.

What's interesting with the lineup is that CPU core-counts range all the way from 12-core/24-thread to 64-core/128-thread. Past generations of Threadripper WX stuck with higher core-counts (32 and up). The series begins with the Threadripper PRO 5945WX (12-core/24-thread), followed by the PRO 5955WX (16-core/32-thread), the PRO 5965WX (24-core/48-thread), PRO 5975WX (32-core/64-thread), and the 64-core/128-thread PRO 5995WX. There's no 48-core part in the stack. The TDP of all these chips is rated at 280 W.

AMD apparently finds itself with quite a bit of undigested 7 nm "Renoir" silicon, which it plans to repackage as Socket AM4 processors, reports VideoCardz, citing sources on ChipHell forums. The most interesting aspect of this leak is that the silicon variant, codenamed "Renoir X," comes with a disabled iGPU. This is hence a case of AMD harvesting enough "Renoir" dies with faulty iGPU components, to sell them off as desktop processors. It is also learned that these chips don't feature all of the 8 "Zen 2" CPU cores present on the silicon, but rather AMD is looking to carve out entry-level SKUs, such as the Ryzen 3 or Athlon. The company lacks Athlon desktop SKUs based on "Zen 2" or later, although traditionally the company sought to include some basic iGPU solution with its Athlon SKUs.

In related news, the source reports that AMD will refresh its Ryzen desktop processor family with the new "Vermeer S" Ryzen processors. Built on the existing Socket AM4 package, these use AMD's "Zen 3" CCDs that feature 3D Vertical Cache (3DV Cache), much like the recently announced EPYC "Milan X" server processors. AMD claimed that the 3DV Cache technology has a significant performance uplift on performance akin to a generational update. These could be the company's first response to Intel Core "Alder Lake," although since they're based on the older AM4 platform, could only feature DDR4 and PCIe Gen 4. Much like the Ryzen 3000XT series, these appear to be a stopgap product lineup, with AMD targeting late-Q2/early-Q3 for next-generation "Raphael" Socket AM5 processors based on the "Zen 4" architecture, with DDR5 and PCIe Gen 5.

Prominent chip designers like AMD and NVIDIA could bless consumers with a broader offering of their new products as soon as CES 2022 arrives. AMD should present its rumored Rembrandt-H lineup of processors based on the enhanced Zen 3 core, sometimes referred to as Zen 3+. According to the latest report coming from MyLaptopsGuide, Bluetooth SIG has some data entry about ASUS'es upcoming ROG Zephyrus Duo GX650 laptop that integrates AMD Rembrandt-H processors and NVIDIA GeForce RTX 30-series graphics. As the website claims, the heart of this laptop will be AMD Ryzen 9 6900HX processor built on TSMC's 6 nm manufacturing process. We don't know much about this model, but we expect it to refine the previous Ryzen 9 5900HX.

We again see the rumored NVIDIA GeForce RTX 3080 Ti graphics card for mobile, powering the graphics side of things. This model is supposedly based on GA103S GPU SKU, which is likely tailor-made for laptops in mind and exclusive to them. ASUS has also paired 16 GB of DDR5-4800 RAM with an AMD Ryzen processor, suggesting that Rembrandt-H has a new memory controller in place. This laptop model also has a 16-inch 300 Hz Full HD screen with anti-glare; however, the amount of information ended there. We have to wait for CES 2022 launch to find out more.

AMD (NASDAQ: AMD) announced Amazon Web Services, Inc. (AWS) has expanded its AMD EPYC processor-based offerings with the general availability of general-purpose Amazon EC2 M6a instances. The M6a instances are powered by 3rd Gen AMD EPYC processors delivering, according to AWS, up to 35% better price-performance compared to the previous M5a instances and a 10% lower cost than comparable x86-based EC2 instances.

"Our 3rd Gen AMD EPYC processors provide Amazon EC2 users excellent scalability and impressive price-performance compared to previous generation Amazon EC2 M5a instances. This announcement shows our strong collaboration as well as highlights our overall momentum in cloud infrastructure," said Lynn Comp, corporate vice president, Cloud Business, AMD. "Our work with AWS exemplifies our commitment to giving end users innovation and performance for their cloud environments and workloads."

AMD later this month is preparing to address investors as part of a yet-unknown event. The company typically hosts Financial Analyst Day events around Q1-Q2, and goes to the investors with substantial material on the current state of the organization, the products on offer, what's on the horizon, and how it could impact the company's financials. An alleged presentation related to the November 2021 event was leaked to the web. The presentation provides a guided tour of the entire product portfolio of the company, spanning server processors, compute accelerators, consumer graphics, some client processors, and the semi-custom business.

The presentation outlines that the company has so far successfully executed its roadmaps for the client-CPU, server-CPU, graphics, and compute-accelerator segments. In the client CPU segment, it shows a successful execution up to 2021 with the "Zen 3" microarchitecture. In the server space, it mentions successful execution for its EPYC processors up to "Zen 3" with its "Milan" processors, and confirms that its next-generation "Zen 4" microarchitecture, and its sister-architecture, the "Zen 4c," will be built on the 5 nm silicon fabrication node (likely TSMC N5). The presentation also details the recently announced "Milan-X" processor for existing SP3 platforms, which debuts the 3D Vertical Cache technology, bringing up to 96 MB of L3 cache per CCD, and up to 768 MB of L3 cache (804 MB L1+L2+L3 cache) per socket.Update 10:54 UTC: The presentation can now be found on the AMD Investor Relations website.

AMD disrupted a decade of $350 quad-core from Intel with its path-breaking Ryzen processor and the "Zen" microarchitecture, which enters 5th year in the market (5 years since tapeout). AMD went into the Ryzen processor launch as a company that had been written off in the CPU space by PC enthusiasts, and "Zen" was at best expected to give AMD another round of processors to sell around $250. Boy was everyone wrong. The Ryzen 7 1800X eight-core processor brought HEDT-levels of performance to the mainstream desktop form-factor, and its HEDT counterpart, the Threadripper, dominated Intel's Core X series ever since.

Intel's first response to the 1800X was a 50% increase in CPU core counts calculating that AMD would only see marginal IPC increases going forward, and the superior IPC of "Skylake" cores, along with a 6-core/12-thread setup in the Core i7-8700K would see things through. This is roughly when Intel faced severe supply shortages that spiraled prices out of control, giving AMD space to come out with the Ryzen 7 2700X with a 4% IPC increase, and improved multi-threaded performance, but more importantly, predictable pricing at around $330. Months later, Intel refreshed its lineup with the 9th Gen, and finally attained parity with AMD in core counts, with the Core i9-9900K.

Launch of AMD's upcoming Ryzen Threadripper 5000 series high-end desktop (HEDT) and Threadripper WX workstation processors, is rumored to have been delayed to 2022, according to Greymon55, a reliable source with AMD leaks. Codenamed "Chagall," these processors are compatible with existing sTRX4 and sWRX8 motherboards, based on the AMD TRX40 and AMD WRX80 chipsets, respectively. What's new, is the "Zen 3" microarchitecture.

It remains to be seen if the delay is the result of a last-minute decision by AMD to go with the newer "Zen 3" CCD that comes with 3D Vertical Cache technology, over the conventional "Zen 3" CCD; or some other reason. A 2022 launch would mean that Threadripper 5000 series will be launching around the time when Intel has desktop platforms with DDR5 memory and PCI-Express Gen 5. Threadripper 5000 chips with quad-channel DDR4 memory (four 64-bit wide channels) will be seen offering only comparable memory bandwidth to "Alder Lake" systems with overclocked DDR5 memory (four 40-bit wide channels). AMD is likely to prioritize its next "big" socket for the enterprise segment with EPYC "Genoa," as the company could find itself embattled with Xeon "Sapphire Rapids" processors that come with next-gen I/O.

AMD's "Zen 3" CCD, or compute complex die, the physical building-block of both its client- and enterprise processors, possibly has a core count limitation owing to the way the various on-die bandwidth-heavy components are interconnected, says an AnandTech report. This cites what is possibly the first insights AMD provided on the CCD's switching fabric, which confirms the presence of a Ring Bus topology. More specifically, the "Zen 3" CCD uses a bi-directional Ring Bus to connect the eight CPU cores with the 32 MB of shared L3 cache, and other key components of the CCD, such as the IFOP interface that lets the CCD talk to the I/O die (IOD).

Imagine a literal bus driving around a city block, picking up and dropping off people between four buildings. The "bus" here resembles a strobe, the buildings resemble components (cores, uncore, etc.,) while the the bus-stops are ring-stops. Each component has its ring-stops. To disable components (eg: in product-stack segmentation), SKU designers simply disable ring-stops, making the component inaccessible. A bi-directional Ring Bus would see two "vehicles" driving in opposite directions around the city block. The Ring Bus topology comes with limitations of scale, mainly resulting from the latency added from too many ring-stops. This is precisely why coaxial ring-topology faded out in networking.

BIOSTAR, a leading brand of motherboards, graphics cards, and storage devices, today announced product support for the latest AMD Ryzen 5000G series Cezanne processors. AMD's next-generation Ryzen 5000G series desktop processors codenamed "Cezanne" are ready to invade the global market. The new 5000G series processors are based on Zen 3 architecture, AMD's Ryzen 5000 series of desktop APUs based on the Zen 3 CPU and Vega GPU microarchitectures succeeding the Ryzen 4000 "Renoir" series.

Extreme performance enabled for personal computing with up to 8 cores fueled by the world's most advanced 7 nm processor core technology, the AMD Ryzen 5000 G-series desktop processors with Radeon graphics deliver ultra-fast responsiveness and multi-threaded performance for any use case.

AMD is looking to launch a substantial lineup of HEDT and workstation processors before the end of 2021, based on its latest "Zen 3" microarchitecture. These processors are categorized in two distinct lines—the Ryzen Threadripper 5000X targeting HEDTs, and the Ryzen Threadripper Pro 5000WX targeting workstations. Both are based on different sockets, sTRX4 and sWRX8, respectively, with the latter featuring 8-channel DDR4 memory, compared to the former's 4-channel. Two Ryzen Threadripper Pro 5000WX series chips surfaced on the Milky Way@Home distributed computing database, the 5945WX and 5995WX.

The application identifies the 5945WX as a 12-core/24-thread processor, while the 5995WX is the top-dog 64-core/128-thread part. AMD maintains lower core-count Threadrippers to target the section of the market that seeks I/O capabilities over core-counts (memory bandwidth, a large number of PCIe lanes supporting NVMe RAID or multiple AIC compute accelerators, etc,). The lower core counts also come with higher CPU clock-speeds, benefiting less-parallelized applications. At this point it's not known if the Threadripper 5000 family features the conventional "Zen 3" CCD chiplet, or the new "Zen 3+" chiplets with 64 MB 3D Vertical Cache (3DV cache), but the company is planning to monetize the new chiplet across its EPYC enterprise line as the additional cache benefits certain applications with large streaming data-sets. It's conceivable that the Threadripper Pro series could benefit from 3DV cache, too.

Here's the first picture of a production EVGA X570 DARK motherboard, the company's flagship Socket AM4 motherboard targeting overclocking features on the latest "Zen 3" processors. The board prioritizes CPU and memory overclocking headroom above all else. The orientation of the Socket AM4 is rotated 240°, such that the memory slots are located on top of the socket. There's only 1 DIMM per memory channel, which is the most optimal topology for memory overclocking. The angled power inputs, along with onboard buttons, switches, POST code display, and voltage measurement points, are conveniently located in the top-right corner of the PCB, with the power inputs being angled to reduce cable clutter.

The CPU socket is wired to two PCI-Express 4.0 x16 slots (x8/x8 with both populated), and an M.2 NVMe slot with PCI-Express 4.0 x4 wiring. The X570 chipset (not specified whether it's an X570S), is cooled passively, by a large heatsink that extends into heatsink over the board's two M.2 slots. Connectivity likely includes two wired networking interfaces, a Wi-Fi 6E wireless interface, and EVGA's highest-grade onboard audio solution. The board's BIOS is optimized for record-breaking CPU and memory overclocking, using sub-zero cooling solutions. The company didn't reveal availability or pricing.

The upcoming Ryzen Threadripper 5000 lineup of processors has been leaked in documents received by Wccftech from the recent Gigabyte data breach. The next generation of Zen 3 based Threadripper processors will include at least 8 SKUs with varying core counts up to 64 cores. The documents also confirm that AMD will launch both Workstation and High-End Desktop models for the WRX80 and TRX40 sockets respectively with the same TDP and core counts as their Zen 2 predecessors. The five PRO (Workstation) chips will be offered in 64, 32, 24, 16, and 12 core models while the three HEDT versions will be offered with 64, 32, and 24 cores. The Workstation processors will offer an 8-channel IMC and 128 PCIe 4.0 lanes compared to 64 on the HEDT chips. AMD is expected to launch these Ryzen Threadripper 5000 processors in November 2021.

We have recently seen the first high-resolution die shots of AMD's Ryzen 5 5600G Cezanne APU thanks to the work of Fritzchens Fritz. The photos show the internal layout of the processor with its Zen 3 CPU, Vega GPU, and corresponding components. To get these shots, the chip had to be delidded by removing the IHS which has been made harder with the move to a soldered design. The Ryzen 5 5600G is a 6 core, 12 thread part with 7 Vega GPU cores which can all be seen in the annotated diagram of the die created by Locuza. The diagram also shows the suspected locations of various PCIe 3.0, and memory controllers along with cache placements for the CPU and GPU. The processor is manufactured on TSMC's 7 nm process and features a total of 10.7 Billion transistors packed into the 180 mm² die.

German online retailer Mindfactory may not be as big as Amazon, but it puts out its sales figures of PC hardware components, that often get picked up by the tech-press as a sample size. While using its data as a yardstick for AMD outselling Intel in the DIY market is debatable, sales of individual AMD or Intel products provide valuable insights to what consumers are after these days. Apparently, the recently launched Ryzen 7 5700G and Ryzen 5 5600G APUs are already outselling the Ryzen 7 5800X and Ryzen 5 5600X, respectively, for the week of 2nd August running.

AMD designed the Ryzen 7 5700G to succeed the popular Ryzen 7 3700X, and the 5600G to succeed the best-selling Ryzen 5 3600, which explains the absence of "Ryzen 7 5700X" or "Ryzen 5 5600," at least in the DIY market. It's little surprise then, that just as the 3700X outsold the 3800X, Mindfactory bagged orders for 820 units of 5700G, as opposed to 610 units of the 5800X; and 900 units of the 5600G, compared to 680 units of the 5600X. It's interesting to note that the 5700G even outsold the 5600X. The 5700G and 5600G are based on the 7 nm "Cezanne" silicon, which packs up to 8 "Zen 3" cores, and an iGPU with up to 512 stream processors. Unlike "Vermeer," Cezanne is a monolithic die.