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Intel Core i9-10900K Stressed, Package Power Reads 235W, Temperatures 93°C

A stock Intel Core i9-10900K 10-core processor was subjected to FPU stress by Chinese PC enthusiast @WolStame. The power and temperature values of the processor are inside HEDT territory. With a Furmark GPU stress running on the side, under AIDA64 FPU stress, the i9-10900K measured a package power draw of up to 235.17 W, as measured using HWInfo64. The CPU package temperature shot up to 93 °C. A 240 mm AIO liquid CPU cooling solution was used in the feat. Interestingly, the processor is able to sustain clock speeds of 4.77 GHz, which is close to the advertised 4.80 GHz all-core turbo boost frequency, called for by the multi-core FPU stress.

To show that the values weren't obtained in a few seconds of test, the AIDA64 Stability Test window keeps a timestamp log and displays time elapsed into the stress. In this particular case, the all-core stress has been running for close to 48 minutes; and yet the processor is keeping up with its advertised all-core boost speed, making this an impressive feat.

Intel Core i9-10900K Cinebench 15 Benchmark Leaked: Stock 2347 Points, 3K Points @ 5.4 GHz and 1.35 V

Even as review embargoes remain on Intel's latest 10th Gen CPUs, benchmark scores that show what these 14 nm CPUS are capable of are already flooding the web. Case in point: a Cinebench 15 benchmark of Intel's unlocked Core i9-10900K running at an overclocked 5.4 GHz on all cores @ 1.35 V core. The 10-core CPU features a base clockspeed set at 3.7 GHz, so we're looking at a frequency increase of around 46%.

At those speeds, tested on an ASRock Phantom Gaming 4/AX motherboard and 16 GB of G.Skill DDR4-3200 MHz CL14 memory, the Intel Core i9-10900K managed to post a 3002 multi-core score. When at stock, it achieved a relatively paltry 2347 points. An AMD Ryzen 7 3800X CPU (8-core, 16-thread) typically scores around 2200 points, and an AMD Ryzen 9 3900X CPU (12-core, 24-thread) achieves a 3200 score. They do so at stock frequencies, though; and the Intel Core i9-10900K is sandwiched in-between those when it comes to core-count, but not on price: 10 Intel cores will set you back $488.00, while AMD's 8-core launched at $399 (and is now cheaper) and AMD's 12-core CPU launched for $499. Adding to the benchmarking caveat, the operating temperatures for this particular Core i9-10900K show 0º min and 69º max, so assuming the temperature report is correct, it's fair to say an air cooler wasn't used for this overclocking feat.

Intel Bringing the Xeon W Brand to LGA1200 Socket?

Intel is bringing its Xeon W brand extension of processors meant for workstations, to the LGA1200 socket. The Xeon W brand were typically associated with enterprise variants of HEDT platforms, with those of mainstream desktop sockets reserved for the Xeon E brand. At least 7 SKUs are in the works, beginning with the Xeon W-1290P, W-1290, and W-1290T, which are 10-core/20-thread parts based on the "Comet Lake" silicon, with TDP ratings of 125 W, 65 W, and 35 W, respectively; and nominal clock speeds of 3.70 GHz, 3.20 GHz, and 1.90 GHz, respectively.

The Xeon W-1270P and W-1270 are 8-core/16-thread parts, likely with 125 W, and 65 W TDP ratings, respectively, and clock speeds of 3.80 GHz and 3.40 GHz, respectively. Lastly, there are the 6-core/12-thread Xeon W-1260P and W-1260, clocked at 4.10 GHz and 3.60 GHz, respectively. It's likely that the processors are either compatible with the W480/W480E chipsets, or have a C-series enterprise chipset with a similar feature-set to it. The W-1290P is priced at $620.62, the W-1290 at $568.91, the W-1290T at $568.80; the W-1270P at $492.57, the W-1270 at $416.21; the W-1260P at $358.41, and the W-1260 at $293.12. All prices are per-unit in 1,000-unit tray quantities.

ASRock Launches Z490 AQUA Flagship Motherboard Ready for Liquid Cooling

Leading global motherboard manufacturer, ASRock, proudly announces its latest flagship motherboard, the Z490 AQUA to the delight of gamers and power hungry users alike. And to highlight our launch we are limiting the Z490 AQUA to only 999 units making it extremely valuable. Using the latest 16 Phase 90 A Dr.MOS & 2 oz copper PCBs, it delivers up to 95% VRM efficiency. To keep VRM's and 10-core processors cool even during sustained heavy loads or even overclocking, the Z490 AQUA features an advanced water cooling system that decreases heat on the CPU VRMs to reduce VRM temps dramatically.

Decked in a matte black undershell, the Z490 complements what young gamers want in a machine these days, simple, refined edges encased with a metallic armor which highlights the vibrant, techno LED lighting which screams I'm a water cooling aficionado and a PC mod enthusiast. "Be Aqua, Be Cool" highlights ASRock's determination to be the frontrunner in water-cooled gaming motherboard manufacturers and the PCIe 4.0 ready means it's prepped and the hardware is ready with PCI-Express Gen-4 support. By uniquely adding an external base clock generator, PCIe 4.0 components such as extra slots and an M.2 socket we're assured the motherboard is ready to accommodate the next generation of CPUs.
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ASUS Intros ROG Strix GT35 Gaming Desktop with 10th Gen Core Processors

ASUS today rolled out its latest ROG Strix GT35 pre-built gaming desktop, powered by 10th generation Intel Core desktop processors. The top variant of this desktop is powered by an Intel Core i9-10900KF processor, paired with 64 GB of high frequency DDR4 memory, NVIDIA GeForce RTX 2080 Ti graphics, an ASUS ROG Strix Z490-series motherboard, and a 240 mm x 120 mm AIO liquid CPU cooler taming the 10-core beast. Storage is care of a 1 TB NVMe SSD and a 2 TB SATA HDD. The desktop otherwise features the same chassis and connectivity options as the AMD Ryzen 9 3950X-powered ROG Strix GA35 desktop from March, which include Wi-Fi 6 and 2.5 GbE support. The company didn't reveal pricing.

Schenker Announces XMG Ultra Laptop Featuring up to Intel Core i9-10900K and up to NVIDIA RTX 2080 SUPER

Schenker today announced the release of their XMG Ultra laptops, which have been purpose/built as desktop alternatives. This means there are no limitations on hardware, and that portability or battery life aren't crucial factors - power is. To that effect, the XMG Ultra launches with a Z490/based motherboard and support for up to a ten-core Intel Core i9-10900K (the Core i7-10700K, with 8 cores, and the Core i7-10600K, with six cores, are also available). You can pair these CPUs with NVIDIA's RTX 2060 SUPER, 2070 SUPER, or 2080 SUPER for close to ultimate performance when it comes to available hardware. You can configure your XMG Ultra with up to 128 GB of system RAM.

Monitor options include a 17,3" 1080p 240 Hz, G-Sync panel, or an Ultra HD G-Sync panel with the same diagonal. The XMG Ultra's call to fame is that it is the first announced laptop with a 10-core Intel solution. And, since you'd be hard pressed to find an AMD offering that packs a comparable CPU with these very same graphics solutions (since OEMs, for some reason, have maxed out AMD CPU + NVIDIA GPU combos with up an RTX 2070 non-SUPER graphics card), this may be your best bet at getting a decent CPU paired with maximum mobile GPU power. Bear in mind that a pretty standard configuration will, however, set you back some €2,799.

Intel 10th Generation Comet Lake Desktop Processors and 400-Series Chipsets Announced, Here's what's New

Intel today launched its 10th generation Core desktop processor family and its companion Intel 400-series chipsets. Based on the 14 nm++ silicon fabrication process and built in the new LGA1200 package, the processors are based on the "Comet Lake" microarchitecture. The core design of "Comet Lake" and its IPC are identical to those of "Skylake," however Intel brought significant enhancements to the processor's clock-speed boosting algorithm, increased core- or thread counts across the board, and introduced new features that could interest enthusiasts and overclockers. The uncore component remains largely unchanged from the previous-generation, with support for DDR4 memory and PCI-Express gen 3.0. Use of these processors requires a new socket LGA1200 motherboard, they won't work on older LGA1151 motherboards. You can install any LGA115x-compatible cooler on LGA1200, provided it meets the thermal requirements of the processor you're using.

At the heart of the 10th generation Core processor family is a new 10-core monolithic processor die, which retains the same basic structure as the previous-generation 8-core "Coffee Lake Refresh" die, and 4-core "Skylake." The cores are arranged in two rows, sandwiched by the processor's uncore and iGPU blocks. A ring-bus interconnect binds the various components. The cache hierarchy is unchanged from previous generations as well, with 32 KB each of L1I and L1D caches; 256 KB of dedicated L2 cache per core, and 20 MB of shared L3 cache. The iGPU is the same Gen 9.5 based UHD 630 graphics. As we mentioned earlier, much of Intel's innovation for the 10th generation is with the processor's microcode (boosting algorithms).
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Intel 10th Generation Core Desktop Series Presentation Leaked

Ahead of its launch, tech publication HD Tecnologia posted the press-deck of Intel's 10th generation Core "Comet Lake-S" desktop processor series, as its launch is imminent (30th April, according to the slides). Right upfront, we see Intel's new retail packaging for the flagship Core i9 parts. Gone is the large acrylic dodecahedron, and in its place is a conventional paperboard-looking cuboidal box with a large triangular cutout window (probably made of LDPE) on the front face, which reveals the processor inside.

The next slide reveals all that's new with the 10th generation Core processor family, starting with clock speeds of up to 5.30 GHz, the desktop debut of Intel's Thermal Velocity Boost technology, HyperThreading being enabled across the board (Core i9 thru Core i3), native support for DDR4-2933, new CPU- and memory-overclocking features, and new platform I/O through the 400-series chipset. Next up, we see overclocker-relevant new features. Apparently, these processors allow you to toggle HyperThreading on a per-core basis. Until now, you could toggle HTT only across all cores. Next up, is "overclocking" for the PCI-Express x16 link (PEG) and DMI chipset bus. There are improved V/F curve controls with this generation. Intel is preparing to announce updated XTU and Performance Maximizer utilities. There are some packaging-level refinements, too, such as a physically thinner die (Z-height), making way for a thicker IHS. The internal TIM is still solder. We now move on to the actual SKUs.

Intel Core i9-10900F Can Allegedly Pull Up to 224 W

As if reports of Intel's latest mobile flagship Core i9-10980HK pulling up to 135 W power in short bursts to achieve its 5.30 GHz Thermal Velocity Boost (TVB) frequency weren't bad enough, it appears like the 10th generation Core desktop processors won't win Intel any prizes in the energy efficiency contests. According to tech Tweeter "@9550Pro," citing Chinese enthusiast @Wolstame, with a reasonably high hit-rate with tech rumors, Intel's upcoming Core i9-10900F processor can pull up to 224 Watts of power. The i9-10900F isn't even an unlocked chip like i9-10900K, but rather an iGPU-disabled version of the locked i9-10900.

The i9-10900F 10-core/20-thread processor allegedly has its PL1 value set at 170 W, and PL2 at 224 W. The latter is probably needed to give the chip's TVB algorithm power headroom to achieve either the chip's 5.30 GHz TVB max frequency, or its maximum all-core boost frequency of 4.50 GHz. The latter could be Intel's strategy to take on AMD's Ryzen 9 3900X and 3950X in multi-threaded benchmarks (run 10 cores at 4.50 GHz). Intel is possibly looking to price the i9-10900 series (i9-10900F, i9-10900, i9-10900KF, and i9-10900K) at price-points ranging between $450-500, if not more. With these power-draw figures, it's all but certain that Intel could recommend serious cooling solutions for the i9-10900 series, at least a 240 mm x 120 mm AIO. AMD recommends a 280 mm x 140 mm AIO for the 16-core 3950X.

Intel 10th Gen Core Desktop Marketing Materials Confirm Core Counts

Marketing materials of Intel's upcoming 10th generation Core "Comet Lake-S" desktop processors leaked to the web confirm the lineup's core-counts. The series will be led by 10-core/20-thread Core i9 processors, with Thermal Velocity Boost frequencies of up to 5.30 GHz. The Core i7 series will consist of 8-core/16-thread processors, with up to 5.10 GHz TVB frequencies. The Core i5 series gets its biggest shot in the arm, with the introduction of HyperThreading for the first time in 8 generations (the last Core i5 desktop processors with HTT were dual-core first-generation Core chips). The 10th gen Core i5 series chips are 6-core/12-thread, with clock-speeds running up to 4.80 GHz.

These frequencies should indicate two interesting things. One, that the Core i5-10600K will outperform the Core i7-8700K (6-core/12-thread, up to 4.70 GHz boost), resulting in a roughly 35% increase in price-performance vs. the i7-8700K, if it ends up being priced at $260. Two, that the Core i7-10700K will outperform the Core i9-9900K on virtue of 100 MHz higher frequencies, and give the segment a roughly 30% price-performance increase compared to the i9-9900K, if the i7-10700K ends up priced at $380. The Core i9-10900K will outperform the i9-9900K both in single- and multi-threaded fronts given its 300 MHz higher max boost and two extra cores (four extra threads), in what could be a roughly 25% price-performance gain, assuming an unchanged $500 price.

Intel Core i9-10900K and i7-10700K Allegedly Pictured

Alleged pictures of the upcoming Intel Core i9-10900K and i7-10700K processors made it to Chinese social media. The blurry-cam pictures of the chips' topside don't reveal much other than the "Intel Confidential" markings, denoting that these chips are engineering samples. The reverse side confirm that these are chips are built in the new LGA1200 package. You can also spot electrical ancillaries laid out unlike any previous-gen Intel package, and different socket key notches.

In the run up to the rumored April 2020 launch we could learn more about these chips. Based on the 14 nm "Comet Lake" silicon, Intel's 10th generation Core desktop processors in the LGA1200 package increase logical processor counts across the board, and increase clock speeds. The i9-10900K is a 10-core/20-thread processor with 20 MB of shared L3 cache, and up to 5.10 GHz boost frequency, with 4.80 GHz all-core boost. The i7-10700K, on the other hand, is an 8-core/16-thread chip with 16 MB L3 cache, and clock speeds of 5.00 GHz boost and 4.50 GHz all-core Turbo. The Core i5 series also gets a shot in the arm, being configured as 6-core/12-thread, with 12 MB of L3 cache. The per-core performance (IPC) is expected to be the same as 6th generation "Skylake."

Intel 10th Generation Core "Comet Lake-S" Desktop Processor Boxed Retail SKUs Listed

Ahead of their rumored April 2020 availability product codes of Intel's upcoming 10th generation Core "Comet Lake-S" desktop processors leaked to the web, courtesy momomo_us. The lineup includes 22 individual SKUs, although it's unknown if all of these will be available in April. There are four 10-core/20-thread SKUs: the i9-10900K, the i9-10900KF, the i9-10900, and the i9-10900F. The "K" extension denotes unlocked multiplier, while the "F" extension indicates lack of integrated graphics. "KF" indicates a SKU that's both unlocked and lacking an iGPU. Similarly, there are four 8-core/16-thread Core i7 SKUs, the i7-10700K, the i7-10700KF, the i7-10700, and the i7-10700F.

The 6-core/12-thread Core i5 family has several SKUs besides the range-topping i5-10600K and its siblings, i5-10600KF and i5-10600. These include the i5-10500, i5-10400, and i5-10400F. The quad-core Core i3 lineup includes the i3-10320, i3-10300, and i3-10100. The former two have 8 MB L3 cache, while the i3-10100 has 6 MB. Among the entry-level Pentium SKUs are the G6600, G6500, G6400, G5920, and G5900.

Intel Core i9-10900 10-core CPU Pictured

Intel's desktop Comet Lake-S lineup is close to being released and we are getting more leaks about the CPU models contained inside it. Perhaps one of the most interesting points for Comet Lake-S series is that it brings a boost in frequency and boost in core count, with the highest-end Core i9 processors going up to 10 cores. Thanks to Xfastest, a Hong Kong-based media outlet, we have first pictures of what appears to be an engineering sample of the upcoming Core i9-10900 processor.

Being a non-K version, this CPU is not capable of overclocking and has a fixed TDP rating of 65 Watts. Compared to 125 W of the K models like the upcoming Core i9-10900K, this CPU will output almost half the heat, thus requiring a less capable cooling solution. The CPU is installed in LGA1200 socket, which is a new home for Comet Lake-S CPUs and provides backward compatibility for coolers supporting LGA1151. In the sample processor pictured below, we can see a marking on the CPU that implies 2.5 GHz base clock. Previously rumors were suggesting that this CPU version has 2.8 GHz base clock, however, it can be an early engineering sample given that no official imprints are found on the CPU heat spreader.

Intel Enthusiast-Grade K Processors in the Comet Lake-S Family Rumored to Feature 125 W TDP

This piece of news shouldn't surprise anyone, except for the fact that Intel is apparently signing on a TDP of 125 W for even its K-series unlocked processors for their next-generation Comet Lake-S family. Intel's current Comet Lake 9900K CPU features a TDP of "only" 95 W - when compared to the rumored 125 W of the 10900K), whilst their current top offering, the i9-9900KS, features a 127 W TDP. Remember that Intel's 10900K should feature 10 cores and 20 threads, two extra cores than their current 9900K - this should explain the increased TDP, a mathematical necessity given that Intel can only count on marginal improvements to its 14 nm fabrication process to frequencies and power consumption of its CPUs.

A leaked slide from momomo on Twitter shows, if real, that Intel's future enthusiast-grade CPUs (likely i5-10600K, i7-10700K and i9-10900K) will feature this 125 W TDP, while other launches in that family will make do with the more traditional 65 W TDP (interesting to see that Intel has some 10-core CPUs with 65 W TDP, the same as their current 9900, despite two more cores). A footnote on the leaked slide shows that these K processors can be configured for a 95 W TDP, but this would likely come at a significant cost to operating frequency. Intel seems to be bringing a knife to a gunfight (in terms of core counts and TDP) with AMD's Ryzen 3000 and perhaps Ryzen 4000 CPUs, should those and Intel's future offerings actually coexist in the market.

Intel Core i9-10900K 10-core Processor and Z490 Chipset Arrive April 2020

Intel is expected to finally refresh its mainstream desktop platform with the introduction of the 14 nm "Comet Lake-S" processors, in Q2-2020. This sees the introduction of the new LGA1200 socket and Intel 400-series chipsets, led by the Z490 Express at the top. Platform maps of these PCI-Express gen 3.0 based chipsets make them look largely similar to current 300-series platform, with a few changes. For starters, Intel introducing its biggest ACPI change since C6/C7 power states that debuted with "Haswell;" with the introduction of C10 and S0ix Modern Standby power-states, which give your PC an iPad-like availability while sipping minimal power. This idea is slightly different from Smart Connect, in that your web-connected apps and processor work at an extremely low-power (fanless) state, rather than waking your machine up from time to time for the apps to refresh. 400-series chipset motherboards will also feature updated networking interfaces, such as support for 2.5 GbE wired LAN with an Intel i225-series PHY, 802.11ax WiFi 6 WLAN, etc.

HyperThreading will play a big role in making Intel's processor lineup competitive with AMD's given that the underlying microarchitecture offers an identical core design to "Skylake" circa 2015. The entry-level Core i3 chips will be 4-core/8-thread, Core i5 6-core/12-thread, Core i7 8-core/16-thread; and leading the pack will be the Core i9-10900K, a 10-core/20-thread processor. According to a WCCFTech report, this processor will debut in April 2020, which means at CES 2020 in January, we'll get to see some of the first socket LGA1200 motherboards, some even based on the Z490. The platform also mentions an interesting specification: "enhanced core and memory overclocking." This could be the secret ingredient that makes the i9-10900K competitive with the likes of the Ryzen 9 3900X. The LGA1200 platform could be forwards-compatible with "Rocket Lake," which could herald IPC increases on the platform by implementing "Willow Cove" CPU cores.

Benchmarks Surface on Intel's Next-Gen Comet Lake-S 10-Core, 6-Core CPUs

Benchmarks have been uploaded to popular benchmarking utility Geekbench's servers, and they seemingly allow us to look into Intel's next-gen Comet Lake-S processors. The results, which have likely been taken from pre-release hardware (which means benchmarks and even proper identification of features on the CPUs shouldn't be taken as guarantees), help paint a picture on Intel's next release all the same.

Processor information for the 10-core, 20-thread CPU gives us a 1.51 GHz base clock and 3.19 GHz boost, with the chip featuring 32 Kb each for L1 instruction and L1 data caches (x10 cores, 640 KB total) 256 KB L2 cache (x10 cores, for a total of 2.5 MB) and 20 MB L3 cache. The six-core part, on the other hand, is reported as featuring a 1.99 GHz base clock and 2.89 GHz boost clock, 384 KB total L1 instruction and data caches (32 KB x 6 cores), 256 KB L2 cache (x6 cores, for a total of 1.5 MB) and 12 MB L3 cache. This means each core is in Comet Lake-S is paired with 2 MB of L3 cache, which is being cut-down alongside cores. Like almost all other Intel desktop CPU releases, these CPU cores will be paired with an IGP in the form of Intel UHD Graphics 630, which features up to 24 Execution Units (EUs). With Intel's 10-core CPU being expected to be the cream of the crop on the company's mainstream CPU lineup come Comet Lake-S, comparisons to AMD's own core density are moot, in that there is no real competition available, should that top core count actually materialize.

Intel 10th Gen Core X "Cascade Lake-X" Pricing and Specs Detailed

Ahead of their October 7th product launch and November availability, we have confirmation of the specifications and pricing of Intel's 10th generation Core X "Cascade Lake-X" HEDT processors in the LGA2066 package. These chips feature compatibility with existing socket LGA2066 motherboards with a UEFI BIOS update, although several motherboard manufacturers are launching new products with some of the latest connectivity options, such as 2.5 GbE wired Ethernet, and 802.11ax Wi-Fi 6 WLAN.

The 10th generation Core X HEDT processor family is based on the new 14 nm++ "Cascade Lake" silicon, which comes with hardware fixes against several classes side-channel vulnerabilities, and introduces an updated instruction-set that includes more AVX-512 instructions, and the new DLBoost instruction. DLBoost leverages new fixed-function hardware on silicon to accelerate AI deep-learning neural-set building and training by up to 5 times. Intel's first wave of 10th gen Core X lineup is rather slim, with just four processor models. The company did away with the Core i7 brand extension, as core-counts in the mainstream desktop segment have already reached 8-core. The lineup now begins at 10-core/20-thread, with the chip's full 48-lane PCI-Express and 4-channel DDR4 interfaces enabled across the board. All models feature the "XE" brand extension, and feature unlocked base-clock multipliers.

Intel 10th Gen Core X "Cascade Lake" HEDT Processors Launch on October 7

October 7 promises to be an action-packed day, with not just AMD's launch of its Radeon RX 5500 series graphics card, but also Intel's 10th generation Core X "Cascade Lake" HEDT processors in the LGA2066 package. With AMD having achieved near-parity with Intel on IPC, the focus with the 10th generation Core X will be on price-performance, delivering double the number of cores to the Dollar compared to the previous generation. Intel will nearly halve the "Dollars per core" metric of these processors down to roughly $57 per core compared to $103 per core of the 9th generation Core X. This means the 10-core/20-thread model that the series starts with, will be priced under $600.

The first wave of these processors will include the 10-core/20-thread Core i9-10900XE, followed by the 12-core/24-thread i9-10920XE around the $700-mark, the 14-core/28-thread i9-10940XE around the $800-mark, and the range-topping 18-core/28-thread i9-10960XE at $999, nearly half that of the previous-generation i9-9980XE. There is a curious lack of a 16-core model. These chips feature a 44-lane PCI-Express gen 3.0 root complex, a quad-channel DDR4 memory interface supporting up to 256 GB of DDR4-2933 memory (native speed), and compatibility with existing socket LGA2066 motherboards with a BIOS update. The chips also feature an updated AES-512 ISA, the new DLBoost instruction set with a fixed-function hardware that accelerates neural net training by 5 times, and an updated Turbo Boost Max algorithm. Intel will extensively market these chips to creators and PC enthusiasts. October 7 will see a paper-launch, followed by November market-availability.

Intel "Cascade Lake-X" HEDT CPU Lineup Starts at 10-core, Core i9-10900X Geekbenched

With its 10th generation Core X "Cascade Lake-X" HEDT processor series, Intel will not bother designing models with single-digit core-counts. The series is likely to start at 10 cores with the Core i9-10900X. This 10-core/20-thread processor features a quad-channel DDR4 memory interface, and comes with clock speeds of 3.70 GHz base, a 200 MHz speed-bump over the Core i9-9900X. The chip retains the mesh interconnect design and cache hierarchy of Intel's HEDT processors since "Skylake-X," with 1 MB of dedicated L2 cache per core, and 19.3 MB of shared L3 cache.

Geekbench tests run on the chip show it to perform roughly on par with the i9-9900X, with the 200 MHz speed-bump expected to marginally improve multi-threaded performance. Where the "Cascade Lake-X" silicon is expected to one-up "Skylake-X" is its support for DLBoost, an on-die fixed function hardware that multiplies matrices, improving AI DNN building and training; and pricing. Intel is expected to price its next-generation HEDT processors aggressively, to nearly double cores-per-Dollar.

Alleged Leaked Details on Intel Comet Lake-S Platform Require... You Guessed It... A New Platform

Intel's development of their Core architecture in the post-Ryzen world has been slow, with solutions slowly creeping up in core counts with every new CPU release - but much slowly than rival AMD's efforts. Before Intel can capitalize on a new, more scalable and power-efficient architecture, though, it has to deliver performance and core count increases across its product line to stay as relevant as possible against a much revitalized rival. Enter Comet Lake-S: the desktop parts of Intel's new round of consumer CPUs, which will reportedly see an increase in the maximum core count to a 10-core design. This 10-core design, however, comes with an increase in power consumption (up to 135 W), and the need, once again, for beefier power delivery systems in a new, LGA 1200 package (with 9 more pins that the current LGA 1151).

The move to a new socket and the more stringent power requirements give Intel the opportunity to refresh its chipset offerings once again. If everything stays the same (and there's no reason it should change), new Z470 and Z490 chipsets should be some of the higher tier offerings for builders to pair with their motherboards. The new Comet Lake-S CPUs will still be built in the now extremely refined 14 nm process, and allegedly keep the same 16 PCIe 3.0 lanes as current Coffee Lake Refresh offerings. The new CPU offerings from Intel are expected to roll out in Q1 2020.

Intel "Comet Lake" Not Before 2020, "Ice Lake-S" Not Before Q3-2020, Roadmap Suggests

Earlier this week, news of Intel's 10th generation Core "Comet Lake" processors did rounds as the company's short-term response to AMD's 3rd generation Ryzen processors. According to slides leaked to the web by Hong Kong-based tech publication XFastest, "Comet Lake" isn't Intel's short-term reaction to "Zen 2," but rather all it has left to launch. These processors won't launch before 2020, the slide suggests, meaning that AMD will enjoy a free rein over the processor market until the turn of the year, including the all-important Holday shopping season.

More importantly, the slide suggests that "Comet Lake" will have a market presence spanning Q1 and Q2 2020, meaning that the 10 nm "Ice Lake" won't arrive on the desktop platform until at least Q3 2020. It's likely that the LGA1200 platform which debuts with "Comet Lake" will extend to "Ice Lake," so consumers aren't forced to buy a new motherboard within a span of six months. The platform diagram put out in another slide junks the idea of an on-package MCM of the processor and PCH dies (which was likely ripped off from the "Ice Lake-Y" MCM platform diagram).

AMD Ryzen 9 3000 is a 16-core Socket AM4 Beast

AMD is giving finishing touches to its 3rd generation Ryzen socket AM4 processor family which is slated for a Computex 2019 unveiling, followed by a possible E3 market availability. Based on the "Matisse" multi-chip module that combines up to two 8-core "Zen 2" chiplets with a 14 nm I/O controller die, these processors see a 50-100 percent increase in core-counts over the current generation. The Ryzen 5 series now includes 8-core/16-thread parts, the Ryzen 7 series chips are 12-core/24-thread, while the newly created Ryzen 9 series (designed to rival Intel Core i9 LGA115x), will include 16-core/32-thread chips.

Thai PC enthusiast TUM_APISAK confirmed the existence of the Ryzen 9 series having landed himself with an engineering sample of the 16-core/32-thread chip that ticks at 3.30 GHz with 4.30 GHz Precision Boost frequency. The infamous Adored TV leaks that drew the skeleton of AMD's 3rd generation Ryzen roadmap, referenced two desktop Ryzen 9 parts, the Ryzen 9 3800X and Ryzen 9 3850X. The 3800X is supposed to be clocked at 3.90 GHz with 4.70 GHz boost, with a TDP rating of 125W, while the 3850X tops the charts at 4.30 GHz base and a staggering 5.10 GHz boost. The rated TDP has shot up to 135W. We can now imagine why some motherboard vendors are selective with BIOS updates on some of their lower-end boards. AMD is probably maximizing the clock-speed headroom of these chips out of the box, to preempt Intel's "Comet Lake" 10-core/20-thread processor.

Intel 10nm Ice Lake to Quantitatively Debut Within 2019

Intel put out interesting details about its upcoming 10 nanometer "Ice Lake" CPU microarchitecture rollout in its recent quarterly financial results call. The company has started qualification of its 10 nm "Ice Lake" processors. This involves sending engineering samples to OEMs, system integrators and other relevant industry partners, and getting the chips approved for their future product designs. The first implementation of "Ice Lake" will not be a desktop processor, but rather a low-power mobile SoC designed for ultraportables, codenamed "Ice Lake-U." This SoC packs a 4-core/8-thread CPU based on the "Sunny Cove" core design, and Gen11 GT2 integrated graphics with 64 execution units and nearly 1 TFLOP/s compute power. This SoC will also support WiFi 6 and LPDDR4X memory.

Intel CEO Bob Swan also remarked that the company has doubled its 10 nm yield expectations. "On the [10 nm] process technology front, our teams executed well in Q1 and our velocity is increasing," he said, adding "We remain on track to have volume client systems on shelves for the holiday selling season. And over the past four months, the organization drove a nearly 2X improvement in the rate at which 10nm products move through our factories." Intel is prioritizing enterprise over desktop, as "Ice Lake-U" will be followed by "Ice Lake-SP" Xeon rollout in 2020. There was no mention of desktop implementations such as "Ice Lake-S." Intel is rumored to be preparing a stopgap microarchitecture for the desktop platform to compete with AMD "Matisse" Zen 2 AM4 processors, codenamed "Comet Lake." This is essentially a Skylake 10-core die fabbed on existing 14 nm++ node. AMD in its CES keynote announced an achievement of per-core performance parity with Intel, so it could be interesting to see how Intel hopes 10 "Skylake" cores match up to 12-16 "Zen 2" cores.

Intel to Refresh its LGA2066 HEDT Platform This Summer?

Intel is rumored to refresh its high-end desktop (HEDT) platforms this Summer with new products based on the "Cascade Lake" microarchitecture. Intel now has two HEDT platforms, LGA2066 and LGA3647. The new "Cascade Lake-X" silicon will target the LGA2066 platform, and could see the light of the day by June, on the sidelines of Computex 2019. A higher core-count model with 6-channel memory, will be launched for the LGA3647 socket as early as April. So if you've very recently fronted $3,000 on a Xeon W-3175X, here's a bucket of remorse. Both chips will be built on existing 14 nm process, and will bring innovations such as Optane Persistent Memory support, Intel Deep Learning Boost (DLBOOST) extensions with VNNI instruction-set, and hardware mitigation against more variants of "Meltdown" and "Spectre."

Elsewhere in the industry, and sticking with Intel, we've known since November 2018 of the existence of "Comet Lake," which is a 10-core silicon for the LGA1151 platform, and which is yet another "Skylake" derivative built on existing 14 nm process. This chip is real, and will be Intel's last line of defense against AMD's first 7 nm "Zen 2" socket AM4 processors, with core-counts of 12-16.

AMD 3rd Generation Ryzen Confirmed for Computex 2019

In a development that could explain why Intel is frantically stitching together 10 cores with the "Comet Lake" silicon, a slide leaked from a private event hosted by motherboard major GIGABYTE reveals that AMD's third generation Ryzen desktop platform could launch as early as Computex 2019 (June). The platform will include AMD's first client-segment processor based on its "Zen 2" microarchitecture, codenamed "Matisse," and its companion chipset, the AMD X570.

3rd generation Ryzen with X570 is expected to be the world's first mainstream desktop platform to feature PCI-Express gen 4.0. AMD could maintain the processor's backwards compatibility with older 300-series and 400-series chipset motherboards by shaping its PCI-Express implementation to use external re-drivers based on the motherboard. This could make 500-series motherboards slightly pricier than current AM4 motherboards. Backwards compatibility could mean that unless you really need PCIe gen 4.0, you should be able to save money by opting for older motherboards.
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