Huawei has just unveiled its latest MateBook Pro laptop, featuring a homegrown processor, operating system, and a fully integrated experience. Priced at 9,999 RMB for the base model with 24 GB of RAM and a 512 GB SSD, this equates to about $1,480. The top-end configuration offers 32 GB of RAM and a 1 TB SSD for 13,999 RMB, approximately $2,072 at the current exchange rate.

Inside, the previous Kirin X90 has been replaced by the new Kirin X90 Plus, which is kept cool by a foam-copper vapor chamber, allowing the chip to maintain a 40 W performance envelope. Huawei seems to have retained the same core counts and GPU specs with a 10-core, 20-thread design, but the improved thermal management suggests they are extracting more performance from this generation. No official specifications have been released yet, so this remains speculative.

A fresh leak from Geekbench has surfaced listing an unannounced AMD processor with the OPN (Ordering Part Number) code 100-000001713-31. As for the platform, that is listed as Plum-MDS1, a somewhat direct hint to Medusa Point, AMD's next-gen mobile APU family based on Zen 6. The chip is a 10-core, 20-thread with a 2.4 GHz base clock, though actual test results show it running closer to 1.3-2 GHz, unsurprising for an engineering sample this early in development. Each core gets 1 MB of L2 cache, and the L3 comes in at 32 MB, up from 24 MB on Strix Point and 16 MB on Hawk Point. This is 50% more cache than the current 10-core parts like the Ryzen AI 9 365. The test system had 32 GB of memory installed, type unspecified. Benchmark numbers aren't worth reading into at this stage, as the chip spent most of the test hovering around 1.39 GHz and barely peeked above 2 GHz, well below what a final retail part on a 3 nm process would run at. Too early to draw any conclusions from the scores.

Shipping manifests from Planet3DNow linked to the "Medusa" codename suggest a 4C+4D layout, standard and density-optimized cores, though that doesn't exactly explain the 10-core count seen in Geekbench. One theory is that two additional low-power cores sit in the IO die, bringing the total to ten. The part is expected to be a 28 W TDP mobile chip for the FP10 socket. Medusa Point is shaping up to combine Zen 6 CPU cores with a mix of RDNA 5 and RDNA 3.5 graphics, plus an updated NPU. A launch around CES 2027 fits the AMD usual cadence, meaning there is likely a long wait ahead; however, this Geekbench entry confirms that testing is already happening, whether at AMD itself or at one of its early hardware partners.

Apple today announced the new MacBook Air with M5, bringing exceptional performance and expanded AI capabilities to the world's most popular laptop. M5 features a faster CPU and next-generation GPU with a Neural Accelerator in each core, enabling MacBook Air to power through a variety of workflows, from creative projects to complex AI tasks. MacBook Air now comes standard with double the starting storage at 512 GB with faster SSD technology, and is configurable up to 4 TB, so customers can keep their most important work on hand. Apple's N1 wireless chip delivers Wi-Fi 7 and Bluetooth 6 for seamless connectivity on the go.

MacBook Air features a beautifully thin, light, and durable aluminium design, stunning Liquid Retina display, 12MP Center Stage camera, up to 18 hours of battery life, an immersive sound system with Spatial Audio, and two Thunderbolt 4 ports with support for up to two external displays. Combined with the power of macOS Tahoe and Apple Intelligence, MacBook Air delivers unmatched value for college students and creative professionals, and it's the most popular laptop for business users. Available in 13- and 15-inch models in sky blue, midnight, starlight, and silver, the new MacBook Air with M5 is available for pre-order starting tomorrow, March 4, with availability beginning Wednesday, March 11.

Intel's "Bartlett Lake-S" (Performance) P-Core-only processor design has made a surprise appearance, after a long period of developmental silence. Earlier, today X86 is dead&back put a spotlight on the intriguing entry of Team Blue's unreleased "Core 7 253PE" SKU within PassMark's CPU benchmark database. The keen watcher of not-yet-released PC hardware believes that this particular unit is possibly the first sample of Team Blue's 10-core "Bartlett Lake-S" variant to appear in the wild. This further refinement of 14th Gen "Raptor Lake Refresh" tech popped up a few times last year, but the TechPowerUp news archive shows a dry period during third and fourth quarters. An August report alluded to an embedded market target, the existence of a flagship 12 P-core model, and a potential launch under the "Intel Core Series 2" banner—minus an Ultra tag, due to lack of onboard NPUs.

All P-Core configurations could appeal to budget-conscious PC gamers. Efficiency-oriented (E and LPE) units are considered superfluous for these purposes. X86 is dead&back was pleased to find PassMark data that signalled improved multicore performance over the related Core i5 14400 "Raptor Lake-R" processor. They exclaimed: "Core 7 253PE (has) more MT performance than Core i5 14400 (6P + 4E)!" Their comparison shows a 20.6% uplift here, but a slight regression in terms of single-core scores (-2.73%). The sole "Core 7 253PE" sample's PassMark multi-thread rating, of 31802, closes in on the 14-core (6P + 8E) Core i5-14500 model's tally (31121). According yesterday's PassMark diagnostic, the newer chip utilizes Intel's UHD Graphics 770 integrated solution (akin to Core i5-14500), whilst the Core i5 14400 makes do with the UHD 730 iGPU. There are apparent differences across the various levels of cache, but the "Core 7 253PE" SKU seems to enjoy a larger overall pool—36 MB—when cross-examined with its older relatives.

Earlier in the month, Samsung's marketing team initiated their Exynos 2600 promotional campaign. At the time, official teaser material did not provide any substantial hints about the next-gen mobile chipset's technical underpinnings. Weeks later, a fresh leak has laid out the cutting-edge mobile processor's fundamentals. PhoneArt's social media post seems to confirm previous predictions about an overall 10-core design, and being based on an important in-house 2 nm node process. Today's prediction did not outline the Exynos 2600 SoC's cluster configuration, but previous outpourings have settled on a "1x Prime + 3x Performance + 6x Efficiency" internal setup. PhoneArt reckons that the prime core will reach a maximum clock frequency of 3.9 GHz. A commenter, Erencan Yılmaz, reckons that this figure should be reduced to 3.8 GHz, due to power consumption considerations when looking at a 2 nm GAA-based design.

Supposedly, max. performance core speed is 3.25 GHz, while efficiency-oriented units can only reach up to 2.75 GHz. In the past Samsung and AMD have co-developed various Xclipse integrated graphics solutions, for proprietary smartphone platforms. Industry observers expected this RDNA-based collaboration to continue into a new generation. The fresh mentioning of a mysterious "AMD JUNO" iGPU has caused some confusion—this new Team Red IP is said to be clocked at 985 MHz. Additionally, PhoneArt claims that "JUNO" supports modern APIs: OpenGL ES 3.2, OpenCL 3.0, and Vulkan 1.3. It is plausible that "JUNO" could be a codename for the speculated "Xclipse 960" integrated graphics processor.

An Ultra variant of Apple's M5 SoC line-up has been rumored for a while now, specifically when it comes to Apple's Mac Studio, which has more or less become the brand's de-facto high-end desktop workstation lineup. Given that the M3 Ultra occupied the top position in Apple's chip line-up, it was expected that if Apple ever released an update to the Apple iMac Pro, it would feature the Ultra model of the current SoC family. However, thanks to a leaked kernel debug tool, courtesy of MacRumors, we now have tentative confirmation that the Apple iMac Pro will likely top out at an M5 Max instead of the rumored Ultra SoC. The software refers to an iMac identified by the codename J833c with a platform that goes by H17C, which has been associated with the M5 Max SoC. This suggests that the M5 Max iMac Pro is not only planned, but has already made it into testing.

The current generation iMac tops out at the M4 SoC, which is still an impressive performer, for what it is, but if the difference between the M4 and the M4 Max is anything to go by, an M5 Max-powered iMac Pro would mean stepping up from a 10-core GPU and 10-core CPU to a 16-core CPU and 40-core GPU, and that's just in terms of processing power. The iMac Pro will likely see a revival of the bigger 27-inch display, and it's also more than likely that Apple will also upgrade the display brightness and perhaps even its HDR performance, since rumors point to the iMac Pro being destined for professional and creative workspaces. Apple only recently released the base model M5 SoC, but the M5 Pro, Max, and Ultra are expected to launch at some point in Spring 2026.

Apple today introduced Apple Vision Pro with the powerful M5 chip that delivers a leap forward in performance, improved display rendering, faster AI-powered workflows, and extended battery life. The upgraded Vision Pro also comes with the soft, cushioned Dual Knit Band to help users achieve an even more comfortable fit, and visionOS 26, which unlocks innovative spatial experiences, including widgets, new Personas, an interactive Jupiter Environment, and new Apple Intelligence features with support for additional languages. There are over 1 million apps and thousands of games on the App Store, hundreds of 3D movies on the Apple TV app, and all-new series and films in Apple Immersive with a selection of live NBA games coming soon. Vision Pro with M5 and the Dual Knit Band is now available to pre-order on apple.com. Customers can book a demo at Apple Store locations today and it will be available nationwide beginning Wednesday, October 22.

"With the breakthrough performance of M5, the latest Apple Vision Pro delivers faster performance, sharper details throughout the system, and even more battery life, setting a new standard for what's possible in spatial computing," said Bob Borchers, Apple's vice president of Worldwide Product Marketing. "Paired with the comfortable Dual Knit Band, innovative features in visionOS 26, and all-new Apple Immersive experiences spanning adventure, documentary, music, and sports, spatial computing is even more capable, entertaining, and magical with the new Vision Pro."

Apple today announced M5, delivering the next big leap in AI performance and advances to nearly every aspect of the chip. Built using third-generation 3-nanometer technology, M5 introduces a next-generation 10-core GPU architecture with a Neural Accelerator in each core, enabling GPU-based AI workloads to run dramatically faster, with over 4x the peak GPU compute performance compared to M4. The GPU also offers enhanced graphics capabilities and third-generation ray tracing that combined deliver a graphics performance that is up to 45 percent higher than M4. M5 features the world's fastest performance core, with up to a 10-core CPU made up of six efficiency cores and up to four performance cores. Together, they deliver up to 15 percent faster multithreaded performance over M4. M5 also features an improved 16-core Neural Engine, a powerful media engine, and a nearly 30 percent increase in unified memory bandwidth to 153 GB/s. M5 brings its industry-leading power-efficient performance to the new 14-inch MacBook Pro, iPad Pro, and Apple Vision Pro, allowing each device to excel in its own way. All are available for pre-order today.

"M5 ushers in the next big leap in AI performance for Apple silicon," said Johny Srouji, Apple's senior vice president of Hardware Technologies. "With the introduction of Neural Accelerators in the GPU, M5 delivers a huge boost to AI workloads. Combined with a big increase in graphics performance, the world's fastest CPU core, a faster Neural Engine, and even higher unified memory bandwidth, M5 brings far more performance and capabilities to MacBook Pro, iPad Pro, and Apple Vision Pro."

Apple today introduced the new iPad Pro featuring the incredibly powerful M5 chip. M5 unlocks the most advanced iPad experience ever, packing an incredible amount of power and AI performance into the ultraportable design of iPad Pro. Featuring a next-generation GPU with a Neural Accelerator in each core, M5 delivers a big boost in performance for iPad Pro users, whether they're working on cutting-edge projects or tapping into AI for productivity. The new iPad Pro delivers up to 3.5x the AI performance than iPad Pro with M41 and up to 5.6x faster than iPad Pro with M1. N1, the new Apple-designed wireless networking chip, enables the latest generation of wireless technologies with support for Wi-Fi 7 on iPad Pro. The C1X modem comes to cellular models of iPad Pro, delivering up to 50 percent faster cellular data performance than its predecessor with even greater efficiency, allowing users to do more on the go. Available in space black and silver, iPad Pro comes in 11-inch and 13-inch sizes, and features the Ultra Retina XDR display for an unparalleled viewing experience. The game-changing features of iPadOS 26 supercharge iPad Pro and help users handle demanding creative and professional tasks with ease. With staggering performance gains and breakthrough improvements over M1 models, there has never been a better time to upgrade. The new iPad Pro is available to pre-order starting today, and will be available in stores beginning Wednesday, October 22.

"Powered by the next generation of Apple silicon, the new iPad Pro delivers our most advanced and versatile iPad experience yet," said John Ternus, Apple's senior vice president of Hardware Engineering. "iPad Pro with M5 unlocks endless possibilities for creativity and productivity—with a huge leap in AI performance and a big boost in graphics, superfast wireless connectivity, and game-changing iPadOS 26 features, it pushes the boundaries of what iPad can do yet again."

Last Thursday, Xiaomi revealed its proprietary XRING O1 3 nm mobile chipset. After months of rumors, the Chinese firm's highly anticipated first-party chip design was introduced during their special "A New Beginning" event—held in Beijing. During this multipronged product launch celebration, company leadership disclosed the underpinnings of their first-ever flagship processor. According to official descriptions, Xiaomi's pivotal XRING O1 SoC is built on: "a cutting-edge second-gen 3 nm process with 19 billion transistors, features a 10-core CPU and 16-core Immortalis-G925 GPU, delivering flagship performance with industry-leading power efficiency. It also integrates Xiaomi's fourth-gen ISP and a 6-core NPU offering 44 TOPS for advanced AI processing." Days prior to important ceremonies in China, a joint statement—issued by Qualcomm—detailed an extended Snapdragon chipset supply agreement. The XRING O1 processor line will drive forthcoming Xiaomi 15S Pro smartphones and Pad 7 Ultra tablets; reserved for initial "domestic market" launches. Qualcomm's current flagship offerings are technically superior to Xiaomi's fresh effort, but an ever-shifting political landscape could affect future shipments.

Lu Weibing—a company president and partner—has outlined a vision for XRING's eventual expansion beyond a flagship/high-end product tier. Last week's intro firmly positioned the 3 nm part as premium option that will power suitably expensive Android-based mobile devices. Weibing acknowledged that his team has jumped into the deep end: "(for) this platform capability, it is most difficult to work on smartphone flagship SoC, it has high power consumption demand and its technology is extremely complicated. If you can, then you should have the ability to work on flagship smartphone SoC. (Once you) move to work on other chips, it won't be that difficult." Industry moles posit that Xiaomi's XRING division is already a formidable force, in terms of staff headcounts and experience. The department could be absorbing some inspiration from Apple; namely their custom C1 modem chip. The firm's president painted a picture of things to come: "so we want to focus on the flagship SoC, and then we want to make a capable modem for the future. We have to work on 4G and 5G parts—together with 3G—leading to a complete matrix. So that is what we need to do at this stage." Early leaks have indicated the existence of a binned version of the XRING O1 SoC; present within early Xiaomi Pad 7 Ultra tablet samples. In theory, these compromised chips could be deployed in unannounced cheaper products.

Apple's unannounced M4 MacBook Air family is likely reaching market availability status at some point next month. Last December, slimline notebook enthusiasts started hearing about an updated lineup; macOS's Sequoia 15.2 update reportedly referenced upcoming MacBook Air M4 13-inch and 15-inch models. An early sample unit—named "Mac16,12"—has participated in a Geekbench 6.4.0 (macOS AArch64) gauntlet; results appeared online yesterday. The alleged "MacBook Air 13" candidate posted an overall Metal score of 54,806, and an overall OpenCL tally of 36,305. The two separate Geekbench Browser entries confirm that the sampled device makes use of a 10-core M4 processor, with Cluster 1 containing four performance cores. Cluster 2 consists of six power efficiency-oriented cores. Base frequency is listed at 4.41 GHz; reportedly the highest recorded for an M4 SoC. Said chip accessed 24 GB of unified memory, during its macOS 15.2 (Build 24C2101)-based test session.

Notebookcheck and Wccftech compared the aforementioned data points with slightly older M4-equipped hardware, including a premium model. Both outlets observed a "measly" five percent performance difference. Elaborating on their findings, Notebookcheck stated: "as always, we would recommend taking early benchmark results with a healthy amount of skepticism for the time being. With that being said, the MacBook Air 13 benchmarked falls about 5% short of the median Geekbench OpenCL and Geekbench Metal results we achieved so far when benchmarking the M4 versions of Apple's Mac Mini and MacBook Pro 14." The rumored next-gen MacBook Air is expected to operate with a fan-less cooling system—press outlets reckon that the MacBook Pro's air-cooled operation puts it at a slight advantage (in benchmarks).

Intel has launched its first wave of Bartlett Lake processors, introducing hybrid-core models specifically designed for embedded systems, with pure performance-core (P-core) variants scheduled to follow later. The initial release, unveiled at CES, showcases the processors through congatec's new COM-HPC modules. The flagship Core 7 251E leads the embedded lineup with 24 cores (8P + 16E) and impressive clock speeds reaching 5.6 GHz boost. Intel claims this processor outperforms the i7-14700 by 6% in single-core and 8% in multi-core benchmarks, despite maintaining a modest 65 W TDP. The series also includes the Core 5 211E with 10 cores (6P + 4E) and the Core 3 201E featuring 4 P-cores. However, the more intriguing development lies ahead.

Earlier sources indicate that Intel plans to release pure P-core variants of Bartlett Lake in Q3 2025, targeting desktop users. These processors will introduce a more traditional approach by replacing E-core clusters with additional P-cores, resulting in configurations of up to 12 P-cores in the upcoming Core 9 series. The pure P-core models will maintain compatibility with existing LGA1700 motherboards, potentially offering an attractive upgrade path for current Intel platform users. The lineup is expected to include 8-core, 10-core, and 12-core variants under the Core 5, 7, and 9 brands respectively, with TDP options ranging from 45 W to 125 W. While the current embedded models focus on specialized applications like medical imaging and edge computing, the future P-core variants seem positioned to appeal to gamers. The processors are expected to utilize Raptor Cove cores, though rumors suggest Intel might consider backporting Lion Cove architecture to the platform.

Taiko Audio, a Dutch high-end audio manufacturer, has unveiled what might be the most over-engineered music server ever created—the Extreme Server. With a starting price of €28,000 (US$29,600), this meticulously crafted device embodies either the pinnacle of audio engineering or the epitome of audiophile excess. The Extreme's most distinctive feature is its unique dual-processor architecture, using two Intel Xeon Scalable 10-core CPUs. This unusual configuration isn't just for show—Taiko claims it solves a specific audiophile dilemma: the impact of Roon's music management interface on sound quality. By dedicating two processors to Roon and Windows 10 Enterprise LTSC 2019 interface, they've made Roon's processing "virtually inaudible", addressing a concern most music listeners probably never knew existed.

Perhaps the most striking technical achievement is the server's cooling system, or rather, its complete absence of conventional cooling. Taiko designed a custom 240 W passive cooling solution with absolutely no fans or moving parts. The company machined the CPU interface to a mind-boggling precision of 5 microns (0.005 mm) and opted for solid copper heat sinks instead of aluminium, claiming this will extend component life by 4 to 12 years. The attention to detail extends to the memory configuration, where Taiko takes an unconventional approach. The server uses twelve 4 GB custom-made industrial memory modules, each factory pre-selected with components matched to within 1% tolerance. According to Taiko, this reduces the refresh rate burst current by almost 50% and allows for lower operating temperatures. The PSU that powers the PC is a custom 400 W linear power supply, an in-house development designed specifically for the Extreme's unique needs. It combines premium Mundorf and Duelund capacitors for sonic neutrality, Lundahl chokes selected by ear, and extensive vibrational damping using Panzerholz (a compressed wood composite) for durability, low temperature operation, longevity, and exceptional sound quality.

Recent Geekbench results have surfaced for Intel's unreleased Core Ultra 5 225F processor without an integrated GPU, showcasing interesting performance improvements over its predecessors. The benchmark results, initially shared by Benchleaks on X, reveal that this new 10-core chip delivers performance comparable to the higher-core-count Core i5-13600. The Core Ultra 5 225F achieved a single-core score of 2,653 points and a multi-core score of 13,028 points. The processor combines six P-cores, four E-cores, and 20 MB of L3 cache. During testing, the chip reached a maximum frequency of 4.887 GHz. When compared to its direct predecessor, the Core i5-14400F, the new 225F demonstrates significant improvements with approximately 13% better performance in both single and multi-core tests.

More impressively, it manages to edge out the 14-core Core i5-13600 by 5% across both metrics despite having fewer cores and threads. However, the 225F falls behind its premium sibling with four more E-cores, the Core Ultra 5 245K, which outperforms it by 16% in single-core and 44% in multi-core operations. The Core Ultra 5 225F is expected to be part of Intel's new 65 W TDP lineup, targeting mainstream desktop systems with limited overclocking capabilities. This positions it as a more energy-efficient alternative to the current 125 W TDP Core Ultra 200 series processors. While we wait for more firmware updates to boost Arrow Lake performance, Intel could target the launch of the F-series SKUs for CES 2025, which is just a few weeks away now.

Lenovo, a global leader in technology innovation, proudly announces a series of groundbreaking products at Lenovo Innovation World 2024, each designed to redefine the future of professional computing and artificial intelligence. At a special event hosted in Berlin, the highlights include the newly designed premium Lenovo ThinkPad X1 Carbon Gen 13 Aura Edition powered by the latest Intel Core Ultra processors (Series 2), and the innovative Lenovo Auto Twist AI PC proof of concept. Lenovo also featured the ThinkPad T14s Gen 6 and the all new ThinkBook 16 Gen 7+ powered by the latest AMD Ryzen AI processors. Additionally, Lenovo introduced the ThinkBook 16 Gen 7 powered by the Snapdragon X Plus 8-core processor. Together, these innovations showcase Lenovo's commitment to delivering cutting-edge technology, exceptional user experiences, and enhanced productivity and creativity for enterprise customers.

Lenovo also announced AI PC Fast Start, a solution designed to help organizations swiftly transition to AI-ready devices, maximizing ROI through AI-powered advisory and simplified deployment. Backed by Lenovo's award-winning support, these services accelerate AI adoption and ensure seamless implementation.

CPUID this week released the latest version of CPU-Z, and its change-log confirms the core-configurations of upcoming AMD Ryzen AI 300-series "Strix Point" processor SKUs. On paper, "Strix Point" packs a 12-core CPU based on the latest "Zen 5" microarchitecture, but there's more to this number. We've known since June 2024 that the chip has a heterogeneous multicore configuration of four full-sized "Zen 5" cores, and eight compacted "Zen 5c" cores. Only the "Zen 5" cores can reach the maximum boost frequencies rated for the chip, while the "Zen 5c" cores go a few notches above the base frequency, although it's expected that the gap in boost frequencies between the two core types is expected to slightly narrow compared to that between the "Zen 4" and "Zen 4c" cores in chips such as the "Phoenix 2."

The series is led by the AMD Ryzen AI 9 HX 375, an enthusiast segment chip that maxes out all 12 cores on the chip—that's 4x "Zen 5" and 8x "Zen 5c." This model is closely followed by the Ryzen AI 9 365, which AMD marked in its presentations as being simply a 10-core/20-thread chip. We're now learning that it has 4x "Zen 5" and 6x "Zen 5c," meaning that AMD hasn't touched the counts of its faster "Zen 5" cores. It's important to note here that "Zen 5c" is not an E-core. It supports SMT, and at base frequency, it has an identical IPC to "Zen 5." It also supports the entire ISA that "Zen 5" does.

AMD today launched its Ryzen AI 300 series mobile processors, codenamed "Strix Point." These chips implement a combination of the AMD "Zen 5" microarchitecture for the CPU cores, the XDNA 2 architecture for its powerful new NPU, and the RDNA 3+ graphics architecture for its 33% faster iGPU. The new "Zen 5" microarchitecture provides a 16% generational IPC uplift over "Zen 4" on the backs of several front-end enhancements, wider execution pipelines, more intra core bandwidth, and a revamped FPU that doubles performance of AI and AVX-512 workloads. AMD didn't go in-depth with the microarchitecture, but the broad points of "Zen 5" are detailed in our article for the Ryzen 9000 "Granite Ridge" desktop processors. Not only is AMD using these faster "Zen 5" CPU cores, but also increased the CPU core count by 50%, for a maximum of 12-core/24-thread.

The "Strix Point" monolithic silicon is built on the 4 nm foundry node, and packs a CPU core complex (CCX) with 12 CPU cores, four of these are "Zen 5," which can achieve the highest possible boost frequencies, the other eight are "Zen 5c" cores that feature an identical IPC and the full ISA, including support for SMT; but don't boost as high as the "Zen 5" cores. AMD is claiming a productivity performance increase ranging between 4% and 73% for its top model based in the series, when compared to Intel's Core Ultra 9 185H "Meteor Lake" processor. The iGPU sees its compute unit (CU) count go all the way up to 16 from 12 in the previous generation, and this yields a claimed 33% increase in iGPU gaming performance compared to the integrated Arc graphics of the Core Ultra 9 185H. Lastly, the XDNA 2 NPU sees more that triple the AI inference performance to 50 AI TOPS, compared to the 16 TOPS of the Ryzen 8040 "Hawk Point" processor, and 12 TOPS of Core Ultra "Meteor Lake." This makes the processor meet Microsoft's Copilot+ AI PC requirements.

There's no doubt the AI PC revolution is here. We're as excited now about the future of the PC as we were when Michael founded the company 40 years ago. New transformative AI experiences will bring enhanced productivity and efficiency to the hands of consumers and professionals alike. Those with an AI PC will never look back, and everyone will want to be part of the action. We're here to lead the way.

As part of the Dell AI Factory's growing AI devices and infrastructure offerings, Dell expands our broad portfolio of AI PCs and workstations with the introduction of the most Copilot+ PCs powered by Snapdragon X Elite and Snapdragon X Plus processors. This brand-new class of devices transforms your AI PC experience with extraordinary performance and battery life, upleveled productivity and powerful security. Our five new laptops, XPS 13, Inspiron 14 Plus, Inspiron 14, Latitude 7455 and Latitude 5455, offer a range of consumer and commercial options that deliver exceptional speed and AI performance to elevate computing and simplify tasks. So, whether you're a business professional looking to spend more time on strategic work and less time on tedious to-dos, or you're a student looking to prioritize your studies while being untethered to a desk, we have you covered.

Apple today announced the redesigned 11-inch and all-new 13-inch iPad Air, supercharged by the M2 chip. Now available in two sizes for the first time, the 11-inch iPad Air is super-portable, and the 13-inch model provides an even larger display for more room to work, learn, and play. Both deliver phenomenal performance and advanced capabilities, making iPad Air more powerful and versatile than ever before. Featuring a faster CPU, GPU, and Neural Engine in M2, the new iPad Air offers even more performance and is an incredibly powerful device for artificial intelligence. The front-facing Ultra Wide 12MP camera with Center Stage is now located along the landscape edge of iPad Air, which is perfect for video calls. It also includes faster Wi-Fi, and cellular models include super-fast 5G, so users can stay connected on the go. With a portable design, all-day battery life, a brilliant Liquid Retina display, and support for Apple Pencil Pro, Apple Pencil (USB-C), and Magic Keyboard, iPad Air empowers users to be even more productive and creative. The new iPad Air is available in new blue and purple finishes, along with starlight and space gray. The 11-inch iPad Air still starts at just $599, and the 13-inch iPad Air is a fantastic value at just $799. Customers can order the new iPad Air today, with availability beginning Wednesday, May 15.

"So many users—from students, to content creators, to small businesses, and more—love iPad Air for its performance, portability, and versatility, all at an affordable price. Today, iPad Air gets even better," said Bob Borchers, Apple's vice president of Product Marketing. "We're so excited to introduce the redesigned 11-inch and all-new 13-inch iPad Air, offering two sizes for the first time. With its combination of a brilliant Liquid Retina display, the phenomenal performance of the M2 chip, incredible AI capabilities, and its colorful, portable design with support for new accessories, iPad Air is more powerful and versatile than ever."

Apple today unveiled the groundbreaking new iPad Pro in a stunningly thin and light design, taking portability and performance to the next level. Available in silver and space black finishes, the new iPad Pro comes in two sizes: an expansive 13-inch model and a super-portable 11-inch model. Both sizes feature the world's most advanced display—a new breakthrough Ultra Retina XDR display with state-of-the-art tandem OLED technology—providing a remarkable visual experience. The new iPad Pro is made possible with the new M4 chip, the next generation of Apple silicon, which delivers a huge leap in performance and capabilities. M4 features an entirely new display engine to enable the precision, color, and brightness of the Ultra Retina XDR display. With a new CPU, a next-generation GPU that builds upon the GPU architecture debuted on M3, and the most powerful Neural Engine yet, the new iPad Pro is an outrageously powerful device for artificial intelligence. The versatility and advanced capabilities of iPad Pro are also enhanced with all-new accessories. Apple Pencil Pro brings powerful new interactions that take the pencil experience even further, and a new thinner, lighter Magic Keyboard is packed with incredible features. The new iPad Pro, Apple Pencil Pro, and Magic Keyboard are available to order starting today, with availability in stores beginning Wednesday, May 15.

"iPad Pro empowers a broad set of pros and is perfect for anyone who wants the ultimate iPad experience—with its combination of the world's best displays, extraordinary performance of our latest M-series chips, and advanced accessories—all in a portable design. Today, we're taking it even further with the new, stunningly thin and light iPad Pro, our biggest update ever to iPad Pro," said John Ternus, Apple's senior vice president of Hardware Engineering. "With the breakthrough Ultra Retina XDR display, the next-level performance of M4, incredible AI capabilities, and support for the all-new Apple Pencil Pro and Magic Keyboard, there's no device like the new iPad Pro."

Apple today announced M4, the latest chip delivering phenomenal performance to the all-new iPad Pro. Built using second-generation 3-nanometer technology, M4 is a system on a chip (SoC) that advances the industry-leading power efficiency of Apple silicon and enables the incredibly thin design of iPad Pro. It also features an entirely new display engine to drive the stunning precision, color, and brightness of the breakthrough Ultra Retina XDR display on iPad Pro. A new CPU has up to 10 cores, while the new 10-core GPU builds on the next-generation GPU architecture introduced in M3, and brings Dynamic Caching, hardware-accelerated ray tracing, and hardware-accelerated mesh shading to iPad for the first time. M4 has Apple's fastest Neural Engine ever, capable of up to 38 trillion operations per second, which is faster than the neural processing unit of any AI PC today. Combined with faster memory bandwidth, along with next-generation machine learning (ML) accelerators in the CPU, and a high-performance GPU, M4 makes the new iPad Pro an outrageously powerful device for artificial intelligence.

"The new iPad Pro with M4 is a great example of how building best-in-class custom silicon enables breakthrough products," said Johny Srouji, Apple's senior vice president of Hardware Technologies. "The power-efficient performance of M4, along with its new display engine, makes the thin design and game-changing display of iPad Pro possible, while fundamental improvements to the CPU, GPU, Neural Engine, and memory system make M4 extremely well suited for the latest applications leveraging AI. Altogether, this new chip makes iPad Pro the most powerful device of its kind."

Apple today unveiled the new Mac mini, supercharged by M2 and the all-new M2 Pro. With the M2 chip, Mac mini is even more powerful, capable, and affordable with a new starting price of just $599. The new M2 Pro chip delivers pro-level performance to Mac mini for the first time, enabling users to run high-performance workflows that were previously unimaginable in such a compact design. Mac mini with M2 and M2 Pro delivers faster performance, even more unified memory, and advanced connectivity, including support for up to two displays on the M2 model, and up to three displays on the M2 Pro model. Paired with Studio Display and Magic accessories, along with the power and ease of macOS Ventura, Mac mini provides a phenomenal desktop experience that will take users' productivity and creativity to the next level. Customers can order the new Mac mini models today, with availability beginning Tuesday, January 24.

"With incredible capabilities and a wide array of connectivity in its compact design, Mac mini is used in so many places, in so many different ways. Today, we're excited to take it even further with M2 and M2 Pro," said Greg Joswiak, Apple's senior vice president of Worldwide Marketing. "Bringing even more performance and a lower starting price, Mac mini with M2 is a tremendous value. And for users who need powerful pro performance, Mac mini with M2 Pro is unlike any other desktop in its class."

Apple today announced the new iPad Pro with the M2 chip, delivering the ultimate combination of portability, versatility, and unbelievable performance. The new iPad Pro features a next-level Apple Pencil hover experience and superfast wireless connectivity, along with the world's most advanced mobile display, pro cameras, Face ID, Thunderbolt, and a four-speaker audio system. New features in iPadOS 16—including Stage Manager, full external display support, desktop-class apps, and Reference Mode—take pro workflows on iPad even further. Enabled by its advanced hardware and iPadOS 16, iPad Pro has an incredible ecosystem of powerful pro apps unlike any other device of its kind. The new iPad Pro is available to order starting today, and in stores beginning Wednesday, October 26.

"The next-generation iPad Pro pushes the boundaries of what's possible on iPad, bringing even more versatility, power, and portability to the ultimate iPad experience," said Greg Joswiak, Apple's senior vice president of Worldwide Marketing. "Powered by the M2 chip, the new iPad Pro features incredible performance and the most advanced technologies, including a next-level Apple Pencil hover experience, ProRes video capture, superfast wireless connectivity, and powerful iPadOS 16 features. There's nothing else like it."

Apple today announced M1 Pro and M1 Max, the next breakthrough chips for the Mac. Scaling up M1's transformational architecture, M1 Pro offers amazing performance with industry-leading power efficiency, while M1 Max takes these capabilities to new heights. The CPU in M1 Pro and M1 Max delivers up to 70 percent faster CPU performance than M1, so tasks like compiling projects in Xcode are faster than ever. The GPU in M1 Pro is up to 2x faster than M1, while M1 Max is up to an astonishing 4x faster than M1, allowing pro users to fly through the most demanding graphics workflows.

M1 Pro and M1 Max introduce a system-on-a-chip (SoC) architecture to pro systems for the first time. The chips feature fast unified memory, industry-leading performance per watt, and incredible power efficiency, along with increased memory bandwidth and capacity. M1 Pro offers up to 200 GB/s of memory bandwidth with support for up to 32 GB of unified memory. M1 Max delivers up to 400 GB/s of memory bandwidth—2x that of M1 Pro and nearly 6x that of M1—and support for up to 64 GB of unified memory. And while the latest PC laptops top out at 16 GB of graphics memory, having this huge amount of memory enables graphics-intensive workflows previously unimaginable on a notebook. The efficient architecture of M1 Pro and M1 Max means they deliver the same level of performance whether MacBook Pro is plugged in or using the battery. M1 Pro and M1 Max also feature enhanced media engines with dedicated ProRes accelerators specifically for pro video processing. M1 Pro and M1 Max are by far the most powerful chips Apple has ever built.

According to Bloomberg, which first predicted the arrival of Apple custom processors in MacBooks, we have another piece of information regarding Apple's upcoming MacBook Pro lineup, set to arrive this summer. As you are aware, MacBook Pro right now comes in two different variants. The first is a smaller 13-inch design that is powered by Apple's M1 chip, while the second is a 16-inch design powered by an Intel Core processor. However, it seems like that will no longer be the case when the next-generation lineup arrives. Starting this summer, all of the MacBook Pro models will have Apple's custom silicon powering these devices, which bring Intel's presence to an end.

And the successor to the now-famous M1 chip seems to be very good. As per the report, Apple is upgrading the architecture and the total core count. There are two different chips, codenamed Jade C-Chop and Jade C-Die. Both are 10-core designs, equipped with two small and eight big cores. The difference between the two is the total number of graphics cores enabled. The smaller version will have 16 graphics cores, while the bigger one will have 32 graphics cores. On the SoC, there will be an updated Neural Engine, for better AI processing. These new processors will come with up to 64 GB of RAM in selected configurations as well. The report also notes the arrival of HDMI port, SD card slot, and MagSafe for charging.