Thermaltake USA, the leading PC Case, Cooling, Power, and memory solutions, proudly announces the launch of twelve innovative models in the LCGS (Liquid Cooled Gaming System) Reactor series, available exclusively at Best Buy. This launch marks a significant milestone for Thermaltake, introducing the next generation of gaming PCs, meticulously designed with the newly unveiled The Tower 300 Micro Tower Chassis. These gaming powerhouses are equipped with the latest high-performance components, including the cutting-edge Intel Core 14th Gen i9/i7 processors, NVIDIA GeForce RTX 40 Super Series/4090 graphics cards, 32 GB of DDR5 5600 MT/s memory, and expansive 2 TB NVMe M.2 SSD storage.

Each system in the LCGS Reactor series boasts a 360 mm radiator liquid cooling solution, ensuring exceptional cooling performance and stability during intense gaming sessions. The addition of vibrant color options such as Snow, Black, Hydrangea Blue, and Turquoise adds a personalized touch to these systems, catering to gamers' and content creators' diverse tastes and styles. Tailored for the most demanding gamers and creative professionals, these pre-built gaming desktop PCs are assembled and rigorously tested by Thermaltake's skilled engineers in the USA, ensuring unparalleled build quality and reliability.

The first CPU-Z test results of AMD's upcoming Ryzen 7 8700G were sniffed out by serial leaker @momomo_us on X/Twitter and the new APU is looking very promising performance wise. It ends up being neck and neck with yours truly own Ryzen 7 7800X3D with a small lead to the CPU over the APU in single-threaded performance, but in the multi-threaded test the APU manages to stay ahead of the CPU, if only just. Both AMD chips are still somewhat behind Intel's Core i7-12700KF, but it has an extra four threads, even though those threads are slower due to them being on the E-cores.

The Ryzen 7 8700G test system was using an ASRock B650 Pro RS motherboard and the APU was paired with 32 GB of DDR5-6400 memory with reasonably tight timings of 32-39-39-102. The tester relied on the integrated Radeon 780M graphics in the APU and the Windows 11 operating system was installed on a 500 GB Seagate BarraCuda 510 SSD. In the single-threaded test the Ryzen 7 8700G scores 675 points vs 683 for the Ryzen 7 7800X3D and in the multi-threaded tests it came in at 7318 vs 7301. Not bad for a 65 W TDP APU vs a 120 W TDP CPU. For comparison, the average for Intel's Core i7-12700KF is 7754 in the mutli-threaded test. Although CPU-Z is far from an exhaustive test, it does at least give us a first glimpse of what to expect from the new Zen 4 APUs from AMD in terms of performance and it looks like it's in line with its best Zen 4 CPUs.

According to sources close to Seoul Economy, and reported by DigiTimes, Intel has reportedly chosen Samsung as a supplier for its next-generation Lunar Lake processors, set to debut later this year. The report notes that Samsung will provide LPDDR5X memory devices for integration into Intel's processors. This collaboration could be a substantial win for Samsung, given Intel's projection to distribute millions of Lunar Lake CPUs in the coming years. However, it's important to note that this information is based on a leak and has not been officially confirmed. Designed for ultra-portable laptops, the Lunar Lake-MX platform is expected to feature 16 GB or 32 GB of LPDDR5X-8533 memory directly on the processor package. This on-package memory approach aims to minimize the platform's physical size while enhancing performance over traditional memory configurations. With Lunar Lake's exclusive support for on-package memory, Samsung's LPDDR5X-8533 products could significantly boost sales.

While Samsung is currently in the spotlight, it remains unclear if it will be the sole LPDDR5X memory provider for Lunar Lake. Intel's strategy involves selling processors with pre-validated memory, leaving the door open for potential validation of similar memory products from competitors like Micron and SK Hynix. Thanks to a new microarchitecture, Intel has promoted its Lunar Lake processors as a revolutionary leap in performance-per-watt efficiency. The processors are expected to utilize a multi-chipset design with Foveros technology, combining CPU and GPU chipsets, a system-on-chip tile, and dual memory packages. The CPU component is anticipated to include up to eight cores, a mix of four high-performance Lion Cove and four energy-efficient Skymont cores, alongside advanced graphics, cache, and AI acceleration capabilities. Apple's use of on-package memory in its M-series chips has set a precedent in the industry, and with Intel's Lunar Lake MX, this trend could extend across the thin-and-light laptop market. However, systems requiring more flexibility in terms of configuration, repair, and upgrades will likely continue to employ standard memory solutions like SODIMMs and/or the new CAMM2 modules that offer a balance of high performance and energy efficiency.

GPD has disclosed to ITHome that a specification refresh of its Win Max 2 handheld/mini-laptop gaming PC is incoming—this model debuted last year with Ryzen 7040 "Phoenix" APUs sitting in the driver's seat. A company representative provided a sneak peek of an upgraded device that sports a Team Red Ryzen 8040 series "Hawk Point" mobile processor, and a larger pool of system memory (32 GB versus the 2023 model's 16 GB). The refreshed GPD Win Max 2's Ryzen 7 8840U APU was compared to the predecessor's Ryzen 7 7840U in CPU-Z benchmarks (standard and AX-512)—the results demonstrate a very slight difference in performance between generations.

The 8040 and 7040 APUs share the same "Phoenix" basic CPU design (8-cores + 16-threads) based on the prevalent "Zen 4" microarchitecture, plus an integration of AMD's Radeon 780M GPU. The former's main upgrade lies in its AI-crunching capabilities—a deployment of Team Red's XDNA AI engine. Ryzen 8040's: "NPU performance has been increased to 16 TOPS, compared to 10 TOPS of the NPU on the 'Phoenix' silicon. AMD is taking a whole-of-silicon approach to AI acceleration, which includes not just the NPU, but also the 'Zen 4' CPU cores that support the AVX-512 VNNI instruction set that's relevant to AI; and the iGPU based on the RDNA 3 graphics architecture, with each of its compute unit featuring two AI accelerators, components that make the SIMD cores crunch matrix math. The whole-of-silicon performance figures for "Phoenix" is 33 TOPS; while 'Hawk Point' boasts of 39 TOPS. In benchmarks by AMD, 'Hawk Point' is shown delivering a 40% improvement in vision models, and Llama 2, over the Ryzen 7040 "Phoenix" series."

Acer unleashes a series of powerhouse gaming laptops, headlined by the refreshed models of the Predator Helios 18 and Predator Helios 16. Acer also announced the new Predator Helios Neo 18 gaming laptop and major updates to the Predator Helios Neo 16, all outfitted with the latest Intel Core 14th gen processors and NVIDIA GeForce RTX 40 Series Laptop GPUs with DLSS 3.5 technology and NVIDIA Advanced Optimus. NVIDIA RTX Laptop GPUs are packed with specialized AI Tensor Cores enabling unmatched AI performance and accelerations in creative apps, ultra-efficient productivity, blistering fast gaming, and more. The Predator laptops feature Microsoft's Copilot in Windows 11 and a dedicated Copilot key for quick access to AI-powered task assistance. They also come with one month of Xbox Game Pass Ultimate, giving gamers access to hundreds of high-quality PC games.

Gamers seeking a competitive edge will be thrilled with the Predator Helios 18 and Predator Helios 16 laptops as they come with options for captivating Mini LED panels, MagKey 3.0 swappable mechanical switch for shorter key travel and response time, and lightning-fast network speeds with Wi-Fi 7 compatibility.

Ugreen, a leading brand in consumer electronics.They'll be unveiling their rendition of NAS devices along with vehicle accessories to complement their portable power station, aptly titled the PowerRoam series, at CES 2024 (booth No.22733), running from January 9-12, 2024 in Las Vegas.

At the forefront of Ugreen NAS product line is the flagship product: NASync DX480T Plus. The DX480T Plus is the smallest in the NAS line at 7.0 x 5.6 x 2.0 inches and developed with an emphasis on high-performance and portability. SSD storage spaces allow for up to 16 TB of fast, all-flash storage space. An expandable RAM drive provides up to 32 GB of memory for high-speed processing, and powering the homemade Ugreen OS Pro (UGOS Pro) is Intel's very own 12th gen Core i5 10 Core processor. Boosting data and media transfer speeds are two Thunderbolt 4 USB-C ports providing up to 40 Gb/s of transfer speeds, making it one of the smallest, fastest NAS devices around.

Acer expanded its Swift family of thin and light laptops with new Intel Core Ultra processors featuring Intel's first neural processing unit (NPU) and integrated AI acceleration capabilities. Now even more performance-minded, capable, and intuitive for content creation, schoolwork, productivity, and play, the new Swift laptops' powerful processing and AI-supported features further the laptop's usability.

"After unveiling our first Intel Core Ultra laptops last month, we're debuting even more products in our Swift line to help a wider range of customers take advantage of premium laptop experiences and AI-supported technology for more exciting and effective PC use," said James Lin, General Manager, Notebooks, IT Products Business, Acer. "Plus, these laptops feature impressive updates that help customers do more - and do them even better."

Acer today announced the extension of its SpatialLabs stereoscopic 3D lineup to the Aspire line of laptops and Predator gaming monitors.

The new Aspire 3D 15 SpatialLabs Edition laptop delivers captivating 3D content for entertainment and creation on its 15.6-inch UHD display; It also comes with a suite of AI-powered SpatialLabs applications for 3D viewing and content creation, without the need for specialized glasses, delighting users when watching their favorite content and empowering developers to see their designs in their real 3D forms. With Microsoft Copilot in Windows 11, users can experience upscaled creativity and productivity with AI-powered task assistance, while Acer's suite of AI-supported solutions in Acer PurifiedView and PurifiedVoice elevate conference calls on the 3D laptop.

TerraMaster, a professional brand focused on providing innovative storage products for homes and businesses, recently introduced the 424 series, a new upgrade of 423 series. It is equipped with an Intel Core i3 CPU and up to 32 GB DDR5 memory, catering to the needs of individuals and business users who demand higher performance. The 424 series will come with TOS 5.1 operating system and can be smoothly upgraded to the TerraMaster TOS 6 in the future.

Peak Performance 4-Bay NAS
Intel Core i3 8-core 8-thread CPU at 3.8 GHz (turbo), integrated UHD GPU at 1.25 GHz, 32 GB DDR5, dual 2.5G Ethernet ports, and dual M.2 NVMe slots for SSD caching.

V-COLOR Technology Inc. is proud to unveil the Manta XFinity Series, our newest product tailored for PC enthusiasts and end users in pursuit of high performance. Engineered for extreme speeds and dependability, this series places a strong emphasis on facilitating high overclocking with straightforward compatibility and enhanced heat dissipation. The module has been tested on systems utilizing 14th generation CPUs, including the Gigabyte Z790 AORUS TACHYON X and ROG MAXIMUS Z790 APEX Motherboards. The XFinity Series has undergone extensive testing on motherboards from reliable manufacturers to guarantee smooth integration with a range of systems in configuration.

Neuchips, a leading AI Application-Specific Integrated Circuits (ASIC) solutions provider, will demo its revolutionary Raptor Gen AI accelerator chip (previously named N3000) and Evo PCIe accelerator card LLM solutions at CES 2024. Raptor, the new chip solution, enables enterprises to deploy large language models (LLMs) inference at a fraction of the cost of existing solutions.

"We are thrilled to unveil our Raptor chip and Evo card to the industry at CES 2024," said Ken Lau, CEO of Neuchips. "Neuchips' solutions represent a massive leap in price to performance for natural language processing. With Neuchips, any organisation can now access the power of LLMs for a wide range of AI applications."

Chinese company Sipeed has introduced the Lichee Pocket 4A, one of the first handheld gaming devices based on the RISC-V open-source instruction set architecture (ISA). Sipeed positions the device as a retro gaming platform capable of running simple titles via software rendering or GPU acceleration. At its core is Alibaba's T-Head TH1520 processor featuring four 2.50 GHz Xuantie C910 RISC-V general-purpose CPU cores and an unnamed Imagination GPU. The chip was originally aimed at laptop designs. Memory options include 8 GB or 16 GB LPDDR4X RAM and 32 GB or 128 GB of storage. The Lichee Pocket 4A has a 7-inch 1280x800 LCD touchscreen, Wi-Fi/Bluetooth connectivity, and an array of wired ports like USB and Ethernet. It weighs under 500 grams. The device can run Android or Linux distributions like Debian, Ubuntu, and others.

As an early RISC-V gaming entrant, performance expectations should be modest—the focus is retro gaming and small indie titles, not modern AAA games. Specific gaming capabilities remain to be fully tested. However, the release helps showcase RISC-V's potential for consumer electronics and competitive positioning against proprietary ISAs like ARM. Pricing is still undefined, but another Sipeed handheld console retails for around $250 currently. Reception from enthusiasts and developers will demonstrate whether there's a viable market for RISC-V gaming devices. Success could encourage additional hardware experimentation efforts across emerging open architectures. With a 6000 mAh battery, battery life should be decent. Other specifications can be seen in the table below, and the pre-order link is here.

QNAP Systems, Inc., a leading computing, and storage solutions innovator, today unveiled the new high-capacity TS-hx77AXU-RP ZFS NAS series, including 12-bay TS-h1277AXU-RP and 16-bay TS-h1677AXU-RP rackmount models powered by AMD Ryzen 7000 Series processors based on the cutting-edge AMD Socket AM5 platform. By integrating robust hardware and diverse I/O including DDR5 RAM, M.2 PCIe Gen 5, PCIe Gen 4 slots, and redundant power supplies, the TS-hx77AXU-RP series unleashes enterprise-level performance and delivers ultra-high bandwidth, futureproof expandability, and trusted reliability for performance-demanding Tier 2 storage, virtualization, 4K video editing, and PB-level storage applications.

"The whole new TS-hx77AXU-RP series ZFS NAS provides enterprises with superb performance and large storage capacity to tackle business-critical workloads and storage-demanding applications. The AMD Ryzen 7000 Series multi-core processors further unlocks the key performance of DDR5 and M.2 PCIe Gen 5," said Alex Shih, Product Manager of QNAP, adding "Paired with the ZFS file system that's most suited for business applications, the TS-hx77AXU-RP series stands out as the top choice for storage solutions that require uncompromising data integrity."

G.SKILL International Enterprise Co., Ltd., the world's leading brand of performance overclock memory and PC components, is excited to announce the Zeta R5 Neo series overclocked DDR5 R-DIMM memory kits for the latest AMD Ryzen Threadripper 7000 series and AMD Ryzen Threadripper Pro 7000 WX-series processors with AMD TRX50 chipset motherboards. This is the first R-DIMM platform from AMD that officially supports memory overclocking, so the Zeta R5 Neo features AMD EXPO memory overclocking profiles for easy memory overclocking. Built with hand-screened ICs and will be available in DDR5-6400 CL32 16 GB x4 and 32 GB x4 kit specifications at launch, Zeta R5 Neo series is the ideal R-DIMM memory solution to build an overclocked performance AMD workstation.

Overclocked DDR5-6400 R-DIMM Kits Designed for Quad-Channel AMD TRX50 Platform
With the launch of the AMD TRX50 workstation platform that supports DDR5 R-DIMM overclocking, G.SKILL is bringing AMD EXPO memory overclocking profile support to its R-DIMM memory lineup under the Zeta R5 Neo series. Available in quad-channel configurations of DDR5-6400 CL32-39-39-102 64 GB (16 GB x4) and 128 GB (32 GB x4) specifications, visit the G.SKILL product pages for more product information.

Thermaltake, the leading PC DIY premium brand for Case, Power, Cooling, Gaming Peripherals, and Enthusiast Memory solutions, is excited to launch the TOUGHRAM XG RGB D5 Memory DDR5 7600/8000 MT/s 32 GB (16 GB x2) available in black and white. The TOUGHRAM XG RGB D5 is a high-performance DDR5 RAM module that features a unique X-shaped light bar with 16 LEDs. To satisfy different speed demands, the TOUGHRAM XG RGB D5 series provides frequency options starting from 5600MT/s, and now has new higher frequency additions of up to 8000MT/s and can support the latest Intel 14th Gen.

The TOUGHRAM XG RGB D5 7600/8000 MT/s are made with superior components to achieve uncompromised speed. Built with tightly-screened ICs and a 10-layer PCB with 2oz copper inner layer, The TOUGHRAM XG RGB D5 can deliver outstanding response time performance and overclocking performance. The high-quality 10μ gold fingers on the ram provide high wear resistance to reinforce durability. Additionally, the TOUGHRAM XG RGB D5 Memory DDR5 is equipped with a doubled bank group architecture, increasing capacity without lag. To reach long-term stability, the DDR5 memory features a native Power Management IC (PMIC) to optimize power efficiency with merely 1.1 V low operating voltage. The TOUGHRAM XG RGB D5 7600/8000 MT/s include the on-die error correction code (ECC) can strengthen stability and reliability through its auto error correction.

Lexar, a leading global brand of flash memory solutions, is excited to announce THOR OC DDR5 Desktop Memory. Featuring a complete redesign that pays homage to Thor's hammer, this memory also boasts a durable, solid aluminium heatsink that more than stands up to the challenges of overclocking by providing superior heat dissipation. Lexar THOR OC DDR5 Desktop Memory delivers up to 6000MT/s with timing as low as CL32 for a truly next-gen experience. It features a low-profile form factor that is perfect for compact PC builds. It also supports Intel XMP 3.0 and AMD EXPO overclocking and is compatible with most DDR5 motherboards.

Lexar THOR OC DDR5 Desktop Memory's on-die Error Correction Code (ECC) offers improved stability and reliability while its on-board Power Management IC (PMIC) enhances power efficiency. Another option for PC users is THOR OC DDR4 Desktop Memory. It offers 3200MT/s performance with timing of CL16 and is designed for PC enthusiasts and extreme gamers. It has an aluminium heat spreader with a winged design to keep systems running cool and is compatible with INTEL XMP 2.0 and AMD Ryzen.

Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, has unveiled a powerful enabling technology for affordable Edge AI computing in mainstream use cases. The Company's new customized ultra-bandwidth elements (CUBE) enable memory technology to be optimized for seamless performance running generative AI on hybrid edge/cloud applications.

CUBE enhances the performance of front-end 3D structures such as chip on wafer (CoW) and wafer on wafer (WoW), as well as back-end 2.5D/3D chip on Si-interposer on substrate and fan-out solutions. Designed to meet the growing demands of edge AI computing devices, it is compatible with memory density from 256 Mb to 8 Gb with a single die, and it can also be 3D stacked to enhance bandwidth while reducing data transfer power consumption.

Today Lenovo is announcing its top-of-the-line Lenovo Legion 9i (16", 8), the first 16-inch gaming laptop in Lenovo Legion's ecosystem—and in the world—with a self-contained liquid-cooling system, designed for gamers and creators with heavy graphic workflow requirements who need a full development studio in their bag. The Lenovo Legion 9i caps out the Lenovo Legion lineup that also includes the Lenovo Legion Pro series for competitive gamers and the Lenovo Legion Slim series for gamers who value agility, as well as Lenovo Legion displays and peripherals. Also announced today are the Lenovo Legion 16" Gaming Backpack GB700 and GB400, two backpack options that give gamers a choice between slim and lightweight agility or extra storage without sacrificing protection for their Lenovo Legion 9i (16", 8) or any other laptops and accessories.

"The introduction of the Lenovo Legion 9i (16", 8) marks the latest pinnacle of Lenovo Legion's gaming laptop innovation. The Lenovo Legion 9i is first laptop in the Lenovo Legion ecosystem with an integrated liquid-cooling system and hardware AI chip tuning. The forged carbon A-cover, which in addition to its 'unique-to-each-laptop aesthetics' means a lighter laptop for gamers and creators who demand nothing but the best." said Jun Ouyang, Lenovo's vice president and general manager of the Consumer Business Segment, Intelligent Devices Group. "We are constantly challenging ourselves to push the limits when designing gaming solutions. The Lenovo Legion 9i (16", 8) has set a new benchmark for us that we are excited to meet—and exceed—in the future."

V-COLOR Technology Inc, a leading memory manufacturer is proud to present the revolutionary DDR5 OC R-DIMM Workstation Memory in configurations 16 GB, 32 GB, and 64 GB. Designed for use with the latest unlocked Intel Xeon W-2400X and W-3400X series processors on respective Intel W790 chipset-based motherboards supporting quad-channel and octo-channel memory

Extreme Overclocking: Experience unrivaled power with OC R-DIMM Workstation Memory. Engineered for extreme overclocking capabilities, this memory module dares to push the limits and achieve unparalleled speeds. With v-color technology, effortlessly unlock the full potential of workstations and conquer even the most demanding tasks. Intel XMP 3.0 Certified: Seamlessly compatible with Intel XMP 3.0, OC R-DIMM Workstation Memory ensures a hassle-free and optimized experience. Effortlessly enhance system's performance and achieve the perfect balance between speed and stability.

Valve's Steam Deck handheld gaming console has launched with 16 GB of LPDDR5 memory running at 5500 MT/s. This is distributed over four 32-bit channels for 88 GB/s total bandwidth memory bandwidth. While the storage option can be upgraded, the memory is limited to 16 GB, and the memory chips are soldered. However, it seems like that problem can also be solved only if you are a professional and can solder well. Thanks to the Balázs Triszka on Twitter/X, we have witnessed a mod of Steam Deck, where memory gets upgraded from 16 to 32 GB.

The modder successfully bumped up the system memory using Samsung's LPDDR5 K3LKCKC0BM-MGCP memory chips. All it was needed was some experience with ball grid array (BGA) resoldering. No glue was under the chips, and they were easy to remove. You can see the pictures below, and the system shows the higher memory count.

During yesterday's HBM3 Gen2 memory products yesterday, Micron also shared an updated roadmap with select media and partners. The most interesting details on that roadmap were updates to DRAM and GDDR memory products, with increases in capacity coming for both types of memory. Micron is aiming to launch 32 Gbit or 4 GB DDR5 memory ICs somewhere in the beginning of 2024, which means we can look forward to 32 GB single sided DIMMs with a single DRAM die per memory IC. This should, in theory at least, enable cheaper 32 GB DIMMs, but as always, it's unlikely that the cost saving will be passed on to the end customer. As far as server customers goes, Micron is planning 128 GB DIMMs for 2024, followed by 192 GB DIMMs in 2025 and 256 GB DIMMs in 2026.

When it comes to GDDR, Micron will be launching JEDEC standard GDDR7 memory with 16 and 24 Gbit dies, or 2 and 3 GB capacity, the latter could be the highest capacity GDDR7 memory IC on the market and could see some interesting graphics card configurations. Micron is promising speeds of up to 32 Gbps per pin or 128 GB/s per chip, which is a big jump up from its current best GDDR6X memory which tops out at 24 Gbps per pin or 96 GB/s per chip. GDDR7 differs from Micron's proprietary GDDR6X by using PAM-3 rather than PAM-4 signalling, although this is simply something that the likes of AMD and NVIDIA would have to design their GPUs around. Micron doesn't appear to have any plans for GDDR7X at this point in time. The company is also working on several new iterations of HBM memory over the coming years, with the company expecting to hit 2 TB/s sometime in 2026 or later.

XPG, the e-sports arm of ADATA, the world's leading memory brand, specializes in creating high-performance and stunningly designed e-sports products for e-sports enthusiasts, technology-minded gamers, and overclockers. XPG today announced the launch of LANCER BLADE RGB DDR5 and LANCER BLADE DDR5 memory, emphasizing its low-profile heatsink design, freeing motherboard assembly from heatsink height, and providing a profile that is perfect for small cases with limited space. The XPG LANCER BLADE series includes two models with top speeds of 6000MT/s and 6400MT/s.

By utilizing high-quality carefully selected Hynix chips, these memory modules are low latency and easy to overclock while allowing gamers to enable a hassle-free speed boost with one-click overclocking. At the same time, The XPG LANCER BLADE series supports Intel XMP 3.0 and AMD EXPO and is compatible with the latest Intel and AMD platforms, ensuring excellent memory stability and a smoother operating experience when multitasking or running large-scale applications. In addition, the XPG LANCER BLADE series adopts a high price-performance strategy, combined with excellent operation and quality, it is definitely the foremost choice when gamers upgrade their systems.

Introducing Page: our Most Advanced 7" eReader with Built-in Page-Turn Buttons. The BOOX Page is a cutting-edge 7" eReader equipped with our most advanced processor and customizable page-turn buttons. Discover the impressive array of features on our newest model below.

A Supercharged Journey of eReading
With its Qualcomm advanced octa-core CPU and enhanced configuration of 3 GB RAM + 32 GB ROM, the all-new Page guarantees an incredibly smooth experience while reading ebooks, browsing websites, or using third-party apps, which is made possible by the open Android 11 system it operates on. The 7-inch ePaper screen comes with the E Ink Carta 1200 touchscreen technology, replicating the sensation of reading on traditional paper. With a 300 PPI high definition, each word is presented with extra sharpness and more distinct contrast, resulting in a gentler visual effect and diminished strain on the eyes.

HYTE, the PC components, peripherals, and lifestyle brand of iBUYPOWER, today, unveiled the new limited-edition Mori Calliope Y40 case and accessory bundle, in collaboration with hololive English, represented by the VTuber agency COVER Corporation.

HYTE's third case collaboration with hololive English and illustrator Rosuuri, depicts the famous VTuber, Mori Calliope, along with her mascot Death Sensei and scythe, Ricky, on the front and side panels of its Black Y40 PC case. Mori Calliope appears on the main side panel floating above a large skull hand, holding Ricky, surrounded by thorns, roses, and souls of the underworld reaching for her. On the front tempered glass, Mori Calliope appears in a closeup holding Death Sensei with her name in Japanese script descending the panel.

An AMD Navi 32 die was belatedly observed in a Forbes video feature on the company's CEO and President Lisa Su—this small tidbit fired up the PC hardware community once again with speculation about why Team Red has not yet released proper mid-range RDNA 3 game-oriented models. A handful of news sites have recently reported that a Navi 32 GPU sits at the heart of AMD's fairly new workstation-grade AMD Radeon Pro W7800 32 GB GDDR6 graphics card, but fact checkers have quickly pointed out that the $2499 (MSRP) product is actually based on Navi 31. Sites have theorized about the makeup of a possible "Radeon RX 7800" GPU and assumed that a similarly named/numbered workstation model would offer a preview of things to come.

Igor Wallossek (of Igor's Lab fame) has conducted an interesting investigation into this matter. He has put a Radeon Pro W7800 test unit through its paces as a gaming card, but the high-end nature of the Navi 31 GPU leads him to believe that the performance level on tap would be roughly equivalent to a hypothetical "RX 7800 XT." Igor assumes that his simulated gaming card will have access to a smaller pool of VRAM (16 GB instead of 32 GB)—he achieves this via the memtestcl program, since "RDNA 3 no longer allows us to emulate the cards directly." He also sets provisions for differing power consumption due to the workstation card being an efficiency-focused product: "The Radeon Pro W7800 has a TBP of 260 watts, my own extrapolation results in a TBP of around 270 watts for the RTX 7800XT based on the efficiency values of the other two Navi 31 cards."