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AMD Aggressively Clearing Inventory to Make Room for ZEN

AMD is reportedly "aggressively clearing" its inventories of current-generation processors, such products in the AM3+ and FM2+ packages; to make room for next-generation processors based on the "ZEN" architecture, and new 7th generation A-series "Bristol Ridge" APUs, both of which are built in the new socket AM4 package. You should be able to find AMD FX CPUs at attractive prices, so current 4-core and 6-core users could be lured to upgrade to faster 8-core chips, including those featuring the company's Wraith silent CPU cooler.

Taiwan industry observer DigiTimes reports that AMD will launch its next-generation "ZEN" processors, and motherboards based on the high-end X370 chipset, alongside the 2017 International CES expo, in early January. 2017 promises to be a big year for the company as it's not only attempting to regain competitiveness in the performance desktop CPU space, but also high-end graphics, with its Radeon "VEGA" family.

Source: DigiTimes

Valve-HTC VIVE Available for Pre-order

HTC and Valve today announced their 2016 CES Best of Show winning VR system is available now for pre order with first shipments targeted to begin on Tuesday, April 5th. A complete VR solution, Vive includes two wireless VR controllers, room scale movement, a full 360° of tracking, and an HMD featuring a built-in camera to create what many critics are calling the most convincing VR experience launching this year.

In addition to the VR system, and for a limited time, those who pre order will also receive a free copy of three new VR titles: Tilt Brush from Google, Fantastic Contraption from Northway and Radial Games, and Job Simulator: The 2050 Archives from Owlchemy Labs. "We are delighted to help usher in the next generation of virtual reality," said Cher Wang of HTC. "Launching Vive with Valve has helped us ignite the creativity of thousands of content developers around the world." Vive is the first SteamVR system, giving it the backing of full integration with the leading online platform for PC games.

Dell Unveils a 30-inch Ultra HD Monitor with an OLED Panel

The star attraction at Dell's CES booth was undoubtedly its stunning new 30-inch monitor, the Ultrasharp 30. Featuring an OLED (organic light-emitting diode) panel, which offers the darkest blacks, and the brightest whites to get you contrast no LCD panel can ever come close to; this monitor also puts out Ultra HD (3840 x 2160 pixels) resolution. Dell is asking US $5,000 for the Ultrasharp 30, which is reasonable, if you consider a similar spec'ed display from Sony going for $18,000. Dell plans to release the Ultrasharp 30 to the market by March 31, 2016.

SanDisk's Most Popular Mobile Flash Drives Get A Massive Capacity Boost

SanDisk Corporation, a global leader in flash storage solutions, today expanded its mobile storage portfolio by upgrading two of its most popular mobile flash drives. The award-winning SanDisk Connect Wireless Stick is now available in 200GB* capacity, while the SanDisk Ultra Dual USB Drive 3.0 is now available in 128GB capacity with faster transfer speeds, giving users even more options when it comes to expanding the capabilities of their mobile devices.

"With the explosion of content, people need more advanced storage solutions to keep up with the volume and quality of the photos, videos and files they're creating on their mobile devices," said Dinesh Bahal, vice president, product marketing, SanDisk. "Our goal is to deliver innovative, intuitive offerings that help them capture life's great moments without worrying about storage limitations."

Plextor Unveils the Next Generation PCIe NVMe SSD, the New M8Pe

Plextor, a leading developer of high performance storage devices, will be adding the new third generation, four-lane PCI-Express NVMe M.2 M8Pe solid-state drive (SSD), and the M7V Series mainstream SATA SSD to its exemplary line of solid-state drive products at the upcoming 2016 Consumer Electronics Show (CES) in the Plextor suite at the Aria.

The M8Pe is the first Plextor SSD with the revolutionary NVMe protocol that helps reduce access latency, allowing for faster speeds. It connects via PCIe, enabling 4KB random read performance up to 270,000 IOPS, and 4KB write performance up to 150,000 IOPS. M8Pe PCI express drives are designed to give gamers and other high intensity users complete synergy and maximum performance. M8Pe features M.2 form factor allowing better airflow and cooling, increases the speed and performance of the SSD. PlexTurbo latest version 3.0, an intelligent RAM caching solution uses the system memory to boost access storage performance compared to standard factory SSDs. Other features of M8Pe include PlexCompressor, a smart compression technology that gives the user more storage capacity without impacting user experience and system performance., and PlexVault, a useful feature allowing private data to be hidden securely for shared computers using Plextor SSDs.

ENERMAX Announces the Ostrog Advance Chassis

The prototype of the Ostrog Advance made its debut at the 2015 Taipei Computex, and it received a great number of requests for its final version. Now in 2016 CES, after more than 6 months of product improvement, ENERMAX proudly presents the neatly designed, yet elegant Ostrog Advance with the astonishing LED lighting effect that equipped with 262 LED diodes.

ENERMAX is once again making the impossible possible by implementing ENERMAX's distinctive LED layout technology, this craftsmanship allows the LED diodes to be closely arrayed for extraordinary and unsurpassed lighting results. The Ostrog Adavnce LED version also comes with 2 synchronized ENERMAX T.B. Vegas fans in the front panel in order to complete with spectacular x6 different LED lighting movements.

Creative Announces the iRoar Smart Speaker

Creative Technology Ltd today announced the Creative iRoar Intelligent Portable Bluetooth Speaker System. This compact multipurpose iRoar represents the next step in the evolution of portable speakers -- with its audio performance, expandability, intelligent audio processing, personalization and a collaborative open platform that allows for value-added third-party add-ons. And, it is twice as powerful as the original Sound Blaster Roar and has a huge 20-hour battery life. The Creative iRoar has been named a CES 2016 Innovation Awards Honoree product in the Home Audio/Video Components and Accessories category. The speaker will be showcased at CES 2016 -- the world's largest consumer electronics show.

At the heart of the Creative iRoar's intelligence is the powerful, flexible and programmable multi-core floating point SB-Axx1 processor. It is responsible for all the audio and voice enhancement, and proprietary effect processing, as well as an open platform that allows users to customize the behaviour of the speaker. The built-in processor also allows the iRoar to function as a high-end sound card.

ZOTAC Shows Off its High-end PCIe SSD

ZOTAC unveiled its upcoming premium PCIe SSD at the 2016 CES. Built for performance, with sequential transfer rates in the neighbourhood of 2 GB/s, the drive is based on a Phison processor, mated with Toshiba 10 nm class MLC NAND flash memory. The half-height add-on card features an integrated heatspreader, with a back-plate. It interfaces with your system over PCIe gen 3.0 x4, and is bootable.

Corsair Launches High-Performance Carbide 400Q and 400C PC Cases at CES 2016

Corsair, a world leader in enthusiast PC hardware and components, today announced the new Corsair Carbide 400Q and Carbide 400C high-performance PC cases. The Carbide 400Q and Carbide 400C are engineered to pack performance and expandability into beautifully compact mid-tower case designs. The 400C puts your PC's components on display through a stunning full size windowed side panel, while the 400Q features an interior lined with sound-damping material to minimize noise. In both the 400Q and 400C, Direct Airflow technology ensures unimpeded flow of cool air to your PC's hottest components.

The Carbide Quiet 400Q and Carbide Clear 400C are both easy to build in, easy to clean, and liquid cooling capable. Tool-free drive installation, easy-access side-panels and tons of cable routing options mean PC enthusiasts can spend less time building a PC and more time using it. Dust filters are easily accessible to cut cleaning time down to a minimum and two modular and refined PSU and 3.5" bay covers make it easy to conceal cables and drives. The 400Q and 400C both feature room for up to a 360mm radiator in front, a 240mm radiator on top, and a 120mm radiator in the rear, and Direct Airflow technology directs air to the hottest components from two included Corsair AF series fans (1 x AF140L intake, 1 x AF120L exhaust). Despite their compact mid-tower dimensions, the 400Q and 400C can house a full ATX motherboard and multiple GPUs if expansion is desired, making them as capable as they are beautiful.

Data Storage Leader PROMISE Debuts First Consumer Product at CES

PROMISE Technology marked its foray into the consumer electronics market today at CES with the unveiling of Apollo, a personal Cloud appliance and app that gives users and their circles or groups full control over the storage and selective sharing of their digital content. Designed with families, small businesses, and small office / home office in mind, Apollo makes it easy for a group of members to store, access and share selected data from wherever they happen to be.

This week at CES, PROMISE will demonstrate Apollo's many features at booth #21731, located in the South Hall of the Las Vegas Convention Center Tech East. Apollo will be showcased at the Showstoppers media-only event on January 6 at the Wynn Hotel, Table F4. Apollo is a small, quiet appliance that stores huge amounts of data-up to 4 TB. It's a valuable asset to consumers who find it difficult to manage treasured family photos and videos that proliferate like wildfire on family members' phones, tablets and laptops and at increasingly high resolutions.

Lenovo and Razer Partner to Revolutionize Gaming Devices

At DreamHack Winter 2015 today, Lenovo (HKSE:992) (ADR: LNVGY) and Razer revealed their first-ever gaming desktop prototype that will officially launch at CES (Consumer Electronics Show) 2016. The two companies announced that together they will co-brand and co-market special Razer Edition models of Lenovo's Y series gaming devices - marrying the manufacturing, supply chain and channel relationships of Lenovo, the world's number one PC maker, with the immersive technology and deep expertise of Razer, a leading company in connected gaming devices and software for gamers.

PC gaming today offers a rich and immersive experience - thanks in part to cutting-edge graphics performance, superior processing power, and peripherals designed specifically for gaming. Lenovo will employ its system design and engineering expertise, while Razer will enhance the immersive experience for gamers. All forthcoming Lenovo Razer Edition products will be co-branded and reflect the edgy Lenovo Y series look and feel with iconic Razer elements like customizable Chroma lighting effects.

Corsair Hydro H110i GT Cooler Starts Selling

Corsair started selling its Hydro Series H110i GT all-in-one liquid CPU cooler, which it launched at the International CES 2015, early last month. It's priced at US $129.99. The cooler consists of a new block+pump main unit, with a higher coolant pressure compared to the H105, because it's feeding coolant to a larger 280 mm x 140 mm radiator. The block features a glowing Corsair logo, with RGB multi-color illumination, which you can customize using the Corsair Link software. The cooler plugs into a USB header, in addition to power, interfacing with the Link software, letting you monitor and control its various parameters.

The H110i GT supports all modern CPU socket types, including LGA2011v3, LGA1150, AM3+, and FM2+. Also included are two Corsair SP140L PWM "high-torque" fans. These 140 mm spinners are a variant of the SP140 series, which lack LED lighting, but feature 4-pin PWM power inputs, offering speeds of up to 2,100 RPM, pushing up to 113 CFM of air, each, with a noise output of up to 43 dBA, each.

ADATA Shows Off XPG V3 DDR3 Memory

ADATA showed off its third-generation XPG DDR3 memory module. A departure from its pointy gold heatsink design of the XPG Z1 series, the XPG V3 features a more conventional, 2-tone aluminium heatsink design, with three layers of fins projecting upward. The outer fins dissipate heat drawn from the DRAM chips, while the inner, colored ones (red, blue, green, gold, and orange), dissipate heat drawn a heat-spreading copper layer in the module's PCB. The module on display at CES featured a red inner heatsink, with an XMP 1.3 profile for DDR3-3100 MHz, with a 1600 MHz failsafe JEDEC profile.

OCZ to Unveil Its Next-Generation State-of-the-Art SSD Controller at CES 2015

OCZ Storage Solutions, a Toshiba Group Company and the most awarded solid state drive (SSD) brand of all time, today announced plans to showcase the highly anticipated JetExpress SSD controller at this year's Consumer Electronics Show (CES) in Las Vegas, Nevada to be held January 6 - 9, 2015.

Designed and developed in-house, JetExpress will be the heart and soul of OCZ's future product line. JetExpress silicon is native SATA and PCIe/NVMe and will support multiple form factors including M.2, 2.5-inch SATA, and SFF-8639 which enables PCI Express speeds in a compact 2.5-inch form factor. The flexible and advanced architecture of JetExpress is designed to offer superior flash endurance empowering SSDs to continue down the path to ubiquity in both mainstream notebooks and hyperscale data centers.

Toshiba Launches Industry's First TransferJet Adapter for iPhone, iPad, iPod

Toshiba Corporation today announced the launch of "TJM35420LT", the industry's first TransferJet adapter for iOS devices such as the iPhone, iPad and iPod that is compliant with TransferJet close proximity wireless transfer technology. Sales of the adapter by mass marketers and online stores are scheduled to start from spring 2015 in Japan, followed by Europe, the Americas and Asia.

TransferJet is a close proximity wireless transfer technology standard promoted by the TransferJet Consortium. The technology provides simple connections and ultra-high speed data transfers with low power consumption, and works simply by bringing the two devices in the transfer into close proximity. Maximum data throughput is 375 Mbps, and 100 MBytes of data can be transmitted in approximately three seconds.

We're Live from the 2015 International CES

TechPowerUp begins its year with the planet's hottest technology expo, the International CES, held in Las Vegas USA, each January. The 2015 International CES is expected to bring together some of the newest, strangest, and most out of the box creations in the world of tech, under one roof. We'll be out there, bringing you our latest finds! Stay live, and chat with us, on this page.

Possible NVIDIA GM200 Specs Surface

Somebody sent our GPU-Z validation database a curious looking entry. Labeled "NVIDIA Quadro M6000" (not to be confused with AMD FirePro M6000), with a device ID of 10DE - 17F0, this card is running on existing Forceware 347.09 drivers, and features a BIOS string that's unlike anything we've seen. Could this be the fabled GM200/GM210 silicon?

The specs certainly look plausible - 3,072 CUDA cores, 50 percent more than those on the GM204; a staggering 96 ROPs, and a 384-bit wide GDDR5 memory interface, holding 12 GB of memory. The memory is clocked at 6.60 GHz (GDDR5-effective), belting out 317 GB/s of bandwidth. The usable bandwidth is higher than that, due to NVIDIA's new lossless texture compression algorithms. The core is running at gigahertz-scraping 988 MHz. The process node and die-size are values we manually program GPU-Z to show, since they're not things the drivers report (to GPU-Z). NVIDIA is planning to hold a presser on the 8th of January, along the sidelines of the 2015 International CES. We're expecting a big announcement (pun intended).

Intel "Broadwell" NUC Spotted on Company Website

Intel's next-generation NUC (next unit of computing) compact desktop, believed to be based on the company's Core "Broadwell" processor, was spotted on the company website. Pictures reveal that the next NUC could be pocketable, yet have the computing power of a full-blown desktop. The NUC system board features some of the newer connectivity, such as DDR3L SO-DIMM slots, M.2 slots, an mPCIe slot, an additional SATA 6 Gb/s port, and processors from the Core i3 and Core i5-5000 series. Intel could unveil the next-gen NUC in January 2015, likely at CES 2015.

Source: FanlessTech

EVGA Rolls Out SuperNova 750 G2 and 850 G2 Power Supplies

At CES, EVGA unveiled two additions to its SuperNova line of 80 Plus Gold-compliant modular PSUs, the 750 G2 and 850 G2. Both units are based on a common platform, with a single +12V rail design. The 750 G2 has enough juice for dual- graphics card gaming rigs, while with the 850 G2, you could squeeze in a third card. Both units feature fully modular cabling, including modular 24-pin ATX and 8-pin EPS connectors. Both rely on large 140 mm spinners to stay cool. EVGA is expected to launch both a little later this year.

Crucial Shows Off its DDR4 DIMMs and SO-DIMMs

Here is the first picture of a DDR4 SO-DIMM module, exhibited by Crucial at its 2014 International CES booth. The company revealed its first DDR4 server memory lineup, as its DDR4 SO-DIMMs, targeting micro-servers, and future notebooks, tagged along. DDR4 DIMMs and SO-DIMMs measure roughly the same as their standard (full-height) DDR3 counterparts, except that the index notch is positioned differently. DDR4 promises to up memory bandwidths, densities, and energy efficiency. Intel's next-generation HEDT (high-end desktop) platform could be the first client platform to support DDR4. Crucial unveiled the first Ballistix-branded DDR4 memory module, targeting some of those systems. DDR4 memory modules could start at speeds of up to 2133 MT/s, and module voltages as low as 1.2V. Compare those to the 1066 MT/s and 1.8V DDR3 started off with!

Gigabyte Hosts Extreme Overclock 2014 Event

GIGABYTE TECHNOLOGY Co. Ltd., a leading manufacturer of motherboards and graphics cards announces its attendance at CES 2014, teaming up with Intel, G.SKILL and Enermax to host the 2014 CES Extreme Overclock event, also demonstrating a range of the latest enthusiast motherboards and systems.

Join GIGABYTE during CES 2104 at the Caesar's Palace Conference Center, Las Vegas from January 6th, 2014 where a GIGABYTE Overclocking team led by renowned Overclockers Hicookie and Dinos22 will be joined by other world class talent from around the globe, demonstrating all the skills and experience need to break world records on a GIGABYTE Z87X-OC motherboard.

"We are really excited about hosting some of the world's top Overclockers in Las Vegas," commented Hicookie, Chief Overclocking Evangelist, GIGABYTE Motherboard Business Unit. "It promises to be a fantastic OC showcase event, one that underlines our commitment to extreme overclocking and the development of world-class overclocking motherboards like the Z87X-OC."

LG to Unveil Improved, Streamlined Ultra PC and Tab-Book at CES 2014

LG Electronics (LG) will be unveiling its newest Ultra PC (Model 13Z940) as well as second generation Tab-Book 2 hybrid devices (Models 11T740 and 11T540) at the International Consumer Electronics Show (CES) in Las Vegas, running from January 7 - 10, 2014.

Featuring slimmer designs, the company's latest PC products weigh less than their predecessors and feature refined, minimalistic form factors. With upgraded capabilities and designs, all of the company's newest PC products - including the attractive All-In-One (AIO) PC model 27V740 - feature Windows 8.1 and employ LG's superior IPS display technology, ensuring stunning color accuracy, motion clarity and wide viewing angle.

MSI Showcases Complete High Performance Computing Lineup during CES 2014

MSI Computer Corp, leading manufacturer of computer hardware products and solutions, unveils its 2014 lineup during CES in Las Vegas. On display at the MGM Skyline Marquee Suites will be MSI's next-generation GT, GE and GX gaming notebooks, Quadro workstations for mobile professionals, tablets, touchscreen laptops, a brand new 24-inch All-In-One Gaming PC and the recently released 3K GT60.

MSI's 3K GT60 features a WQHD+ 3K display and is the world's first model to utilize a high resolution display on a true gaming laptop/workstation. MSI will also be displaying their AMD Kabini based W20 tablet and the AMD configured S12T touchscreen laptop.

Core i7 "Haswell-E" Engineering Sample Pictured

Here's the first picture of Intel's next-generation Core i7 HEDT (high-end desktop) processor, codenamed "Haswell-E." Based on Intel's latest "Haswell" micro-architecture, the chip will be Intel's first HEDT processor to ship with eight cores, and the first client CPU to ship with next-generation DDR4 memory interface. In addition to IPC improvements over "Ivy Bridge" that come with "Haswell," the chip integrates a quad-channel DDR4 integrated memory controller, with native memory speeds of DDR4-2133 MHz; a PCI-Express gen 3.0 root complex with a total of 40 PCI-Express lanes, and yet the same DMI 2.0 (4 GB/s) chipset bus.

Built into the LGA2011-3 socket, "Haswell-E" will be incompatible with current LGA2011 motherboards, as the notches of the package will vary from LGA2011 "Ivy Bridge-E." Intel will introduce the new X99 Express chipset, featuring all 6 Gb/s SATA ports, integrated USB 3.0 controllers, and a PCI-Express gen 2.0 root complex for third-party onboard controllers. Interestingly, there's no mention of SATA-Express, which Intel's next-generation 9-series chipset for Core "Broadwell" platforms reportedly ships with; and X99 isn't looking too different from today's Z87 chipset. With engineering samples already out, it wouldn't surprise us if Intel launches "Haswell-E" along the sidelines of any of next year's big-three trade-shows (CES, CeBIT, and Computex).

Source: VR-Zone

AMD to Roll Out Eyefinity Frame-Pacing Fix in January

AMD is reportedly releasing a fix for frame-pacing issues for Radeon-based systems with Eyefinity setups in January, 2014, according to an AnandTech report. This September, AMD rolled out the first fix into the frame-pacing issues that affected Radeon GPUs based on the Graphics CoreNext architecture, in which raw-framerate didn't come with the right pacing between each frame, resulting in display output that isn't fluid, which even caused accusations to fly from some quarters about how honest AMD really is with performance numbers of its GPUs.

The Catalyst update that rolled out in September 2013 resolved the problem for a majority of users - with single displays connected to single GPUs, but left out cases in which people use Eyefinity (single display head spanning across multiple physical displays), on CrossFireX (multi-GPU) setups. It was originally expected that AMD would release the so-called "phase 2" Catalyst driver update looking into frame-pacing issues this November, but since the month has passed, AMD has obviously hit a delay. AnandTech reports that delay could last as long as two months, and one should expect "phase 2" to come out only towards the later half of January, since in the first half, AMD, along with the rest of the industry, will be busy with the 2014 International CES, where it will launch its next-generation A-Series APUs, codenamed "Kaveri."Source: AnandTech
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