Avalue Technology Inc. (TPEx: 3479.TWO), a provider specializing in industrial computer solutions, provides innovative, value-based motherboards that empower industries to enhance operational efficiency. In today's competitive landscape, choosing the right industrial motherboard can significantly boost productivity, streamline operations, and enable faster, more efficient outcomes across various industries. Avalue continues to lead the way in providing cutting-edge motherboard solutions by introducing Intel Panther Lake H Core Ultra (Series 3) H Series Processors motherboard.

Avalue's EMX-PTLP supports up to 64 GB of DDR5 7200 MHz SoDIMM/CSoDIMM max. memory, delivering a significant leap in data processing speeds. Optimized for the burgeoning AI market, the board delivers up to 180 TOPS of AI performance. With the integration of PCIe 5.0, users benefit from doubled bandwidth and ultra-low latency, providing the essential foundation for AI acceleration and high-performance computing (HPC) in embedded applications.

Axiomtek, a world-renowned leader relentlessly devoted to the research, development, and manufacture of innovative, highly efficient, and reliable industrial computer products, is proud to announce the IMB550, a high-performance ATX motherboard designed for demanding AI vision inspection, high-performance computing (HPC), and image analysis applications.

The IMB550 is powered by 15th Gen Intel Core Ultra 9/7/5 processors (Arrow Lake-S) with the Intel W880 chipset. It features a PCIe Gen 5 x16 slot for multiple high-end graphics or acceleration cards, and two M.2 Key M slots for NVMe SSD storage with RAID 0/1 support, providing scalable performance, flexibility, and reliability to meet the demands of next-generation AI workloads.

Toward the end of 2026, Intel will debut its next generation Core Ultra Series 4 "Nova Lake-S" desktop processors, introducing new CPU core IP and a significant uplift in CPU core counts, besides special SKUs with large L3 caches to take the fight to AMD's X3D processors with 3D V-Cache. Much has been reported on the processors, but not much about the platform and chipsets, until Jaykihn dropped a new leak. We are now hearing that Intel could take a similar approach to AMD in differentiating its desktop chipsets, with two enthusiast-segment chipset models, and a mainstream model, besides the usual chipset models for commercial desktop and workstation segments.

This approach would see the introduction of the new Z970 chipset positioned a notch below the flagship Z990 chipset that succeeds the current Z890. There will not be an "H970," as Intel has seen consistently low demand for such a chipset, and there's no "H870" in the current generation. The Intel 900-series "Nova Point" chipset family will begin with the B960 mainstream chipset succeeding the current B860. Positioned above this will be the new Z970, offering enthusiast features such as multiplier-unlocked CPU overclocking when paired with K-series processor models. Above this, is the flagship Z990 with significantly more platform I/O features. The Q970 will be the commercial desktop chipset from this generation, while W980 will cater to workstation platforms powering Xeon W-series processors based on "Nova Lake-S."

ASRock is closely monitoring recent discussions regarding the performance and behavior of AMD Ryzen 9000 series processors on ASRock AMD platforms. In response to these reports, we have implemented comprehensive internal reviews and rigorous verification processes. We have been working in seamless coordination with AMD continuously to further validate system performance across a wide range of hardware configurations, while optimizing BIOS and enhancing overall system stability.

ASRock deeply values user feedback as a cornerstone of our continuous improvement. Customers experiencing technical difficulties or seeking further assistance are encouraged to contact the ASRock Technical Support Department. We remain committed to delivering high-performance products that meet the highest standards of quality and performance.

As AI workloads, industrial digitalization, and edge data centers continue to scale, industrial manufacturers are facing a fundamental shift in how high-performance computing platforms must be designed. Today's systems must not only deliver extreme performance, but also ensure continuous uptime, remote operability, and long-term deployment stability in demanding production environment. In response to these demands, ASRock Industrial proudly announced the launch of IMB-X1904, a high-performance EATX motherboard powered by Intel Xeon 600 processors and the W890 chipset, designed to serve as a new backbone for AI computing, advanced industrial automation, and compute-intensive applications.

Designed for manufacturers that operate performance-critical systems, the IMB-X1904 delivers exceptional performance with robust-class processing power, high-speed DDR5 memory, extensive PCIe Gen 5 expansion, and next-generation I/O in a platform engineered for continuous operation, remote deployment, and secure lifecycle management.

Giga Computing, a subsidiary of GIGABYTE and a leader in high-performance computing and data center solutions, today announced two new enterprise-grade workstation motherboards for demanding workloads in engineering, AI development, data science, and media creation. For Intel Xeon 600 processors for workstations, the first wave of products from Giga Computing includes the GIGABYTE MW94-RP0 and MW54-HP0. Designed for a traditional computer chassis, these new motherboards are feature rich and offer a significant boost in AI bound workloads.

Intel Xeon 600 Processors for Workstations
Modern workstation workloads are evolving rapidly, driven by AI, higher core density, and the need for faster data movement across the system. Intel Xeon 600 processors for workstations are built on the new Redwood Cove+ P-core architecture and the Intel 3 process, delivering a significant leap in compute capability, AI acceleration, and platform bandwidth. With expanded PCIe 5.0 connectivity, faster DDR5 memory, and the new W890 workstation chipset, this platform provides a future-ready foundation for professionals tackling demanding workloads in engineering, AI development, data science, and media creation.

MS-Terminator B850M PRO II WIFI7 AM5 motherboard with support for latest AMD Ryzen processors. Despite being a microATX form factor motherboard, it comes with a 12+2+1 VRM with support for up to 300 W CPUs, which means it can easily handle the new Ryzen 9 9950X3D CPU. In addition, it also got upgraded to Wi-Fi 7, 2.5G Ethernet, and Bluetooth 5.4 for connectivity, as well as got two PCIe 5.0 x4 M.2 slots and single PCIe 4.0 x4 M.2 slot.

Since it is a microATX motherboard, the Maxsun MS-Terminator B850M PRO II WIFI7 comes with one PCIe 5.0 x16 and one PCIe 4.0 x4 slots, and four standard DDR5 DIMM slots with support for up to 192 GB of DDR5-8000 memory. In case you are wondering, it uses Realtek's RTL8125D 2.5 Gb Ethernet and MTK MT7825 Wi-Fi 7, as well as Realtek's ALC897 audio. It also supports up to 16 USB ports, with dual front and rear USB-C 10G ports, six USB 5G, and eight USB 2.0 ports.

GIGABYTE, the world's leading computer brand, proudly announces the availability of its flagship X870E AORUS XTREME X3D AI TOP motherboard after its debut alongside the X3D series in September. This model is designed to level up performance for AMD Ryzen X3D processors, featuring X3D Turbo Mode 2.0, powered by a built-in dynamic AI overclocking model and hardware chip, and equipped with GIGABYTE's D5 Bionic Corsa to unleash DDR5 performance. By leveraging advanced AI technology, XTREME cooling solution, and enhanced DIY-friendly design, as the flagship, the X870E AORUS XTREME X3D AI TOP integrates the newest, industry-defining capabilities to deliver uncompromising performance for PC enthusiasts.

At the core of this motherboard, X3D Turbo Mode 2.0, is powered by a dynamic AI overclocking model and hardware chip to adjust voltage, frequency, and temperature in real time. Resulting in a up to 25% significant performance enhancement for AMD Ryzen X3D processors in gaming and multi-tasking. While equipped with the revolutionary D5 Bionic Corsa, integrating software, hardware, and firmware to boost DDR5 memory performance up to 9000+ MT/s, pushing performance boundaries even further.

Intel did not introduce its oft-leaked "Arrow Lake Refresh" desktop and laptop CPU ranges at CES 2026, despite plenty of pre-event activity suggesting a near future arrival at retail. Almost two weeks after the conclusion of new product promotional activities in Las Vegas, ASUS has just started to hype up its own "in advance" preparations for Team Blue's inevitable release of "ARL-S Refresh" desktop chips. A few hours ago, the Taiwanese hardware manufacturer's main social media account proudly declared: "ready for the future of Intel! ASUS W880, Z890, Q870, B860 & H810 motherboards are BIOS READY—rolling out in late January." Leaked "Core Ultra 200 Plus" nomenclature suggests that Intel has kept its slightly upgraded designs within the Core Ultra Series 2 generation. Previously, their refreshment of "Raptor Lake" was deemed worthy of becoming a new processor generation: 14th Gen Core.

Curiously, today's ASUS announcement labels the latest mid-gen refresh as next generation: "all set for Intel Arrow Lake Refresh! Upgrade smoothly. Next-gen power is coming!" Gaming CPU market segment trackers believe that the "Plus/+" designation will only turn up on three new SKUs: Core Ultra 9 290K Plus, Core Ultra 9 270K Plus, and Core Ultra 5 250K Plus. This seemingly sparse lineup is expected to keep Team Blue's LGA 1851 platform propped up for a little bit longer, until the successive and truly next-gen "Nova Lake-S" desktop family rolls up with its matching LGA 1954 socket. About a week ago, Golden Pig Upgrade predicted that Intel would launch Ultra 200 Plus desktop and laptop/notebook (HX) products within a March/April window. Coinciding with ASUS readying BIOS updates for 800-series motherboard later this month, Intel and its hardware partners will be unleashing Core Ultra 300 "Panther Lake-H" mobile processors.

ASRock, a global leader in motherboards, graphics cards, gaming monitors, small form factor PCs, power supply units, and AIO liquid coolers, today introduces the all-new Rock Series lineup, engineered to provide comprehensive solutions for PC DIY builders, including models such as the B850 Rock WiFi 7 and B860 Rock WiFi 7 in ATX, as well as the B850M Rock WiFi and B860M Rock WiFi in microATX, offering dependable performance and a clean, satisfying aesthetic—all while maintaining an accessible price point.

Functionality and practicality is the key aspects of Rock series. Every Rock series motherboard comes standard with built-in Wi-Fi, 2.5GbE networking, PCIe 5.0 support, and a DIY-friendly pre-installed I/O shield—delivering a well-balanced, sweet-spot solution for daily PC builds. For ATX models, the B850 Rock WiFi 7 and B860 Rock WiFi 7 further enhance connectivity with Wi-Fi 7 support.

Axiomtek, a world-renowned leader relentlessly devoted to the research, development, and manufacture of innovative, highly efficient, and reliable industrial computer products, proudly announces the launch of the IMB711, an ATX server-grade motherboard designed to support 5th/4th Gen Intel Xeon Scalable processors. Built on the Intel C741 chipset, the IMB711 delivers exceptional compute density, next-generation I/O bandwidth, and enterprise-grade reliability, making it an ideal platform for mission-critical applications across AI acceleration, data centers, and advanced healthcare systems.

High-Performance Xeon Computing for Mission-Critical and Medical AI Workloads
Powered by the LGA4677 socket for 5th/4th Gen Intel Xeon Scalable processors with up to 270 W TDP, the IMB711 delivers exceptional core density and sustained computing performance for next-generation medical applications. Leveraging the Intel C741 chipset, the platform is meticulously optimized for compute-intensive workloads, such as high-end CT and MRI image reconstruction, as well as advanced X-ray imaging for radiation therapy. Whether handling digital pathology, surgical 3D modeling, or robotic-assisted surgery, the IMB711 accelerates medical imaging processing efficiency while ensuring mission-critical stability and 24/7 continuous operation.

MSI is pleased to announce support for the upcoming AMD Ryzen 7 9850X3D processor, built on the Zen 5 architecture and powered by the latest AMD 3D V-Cache technology from AMD. Compatible with MSI motherboards supporting AMD's AM5 platform, this processor features 8 cores and 16 threads with a massive 104 MB total cache, delivering boost clock speeds of up to 5.60 GHz with a max TDP of 120 W. Designed for outstanding performance and efficiency, it effortlessly handles the most demanding gaming and content creation workloads, setting a new standard for high-performance computing.

At the same time, we also unveil the new flagship MEG X870E UNIFY-X MAX during CES 2026. It is engineered for ultra-high performance, featuring a specialized 2-DIMM layout and OC Engine for extreme overclocking enthusiasts. It is powered by a robust 18+2+1 power phase (110 A SPS) and cooled by an advanced thermal solution, incorporating a Direct Touch Cross Heat-pipe and double-sided EZ M.2 Shield Frozr II. By fully optimizing for AMD Ryzen 9000 Series Processors with AMD 3D V-Cache Technology, integrating cutting-edge Wi-Fi 7 and 5G LAN to ensure peak efficiency and low-latency connectivity for data-intensive applications, MEG X870E UNIFY-X MAX is ready for the challenge. An exclusive Tuning Controller provides instant, hands-on control for enthusiasts, enabling quick access to overclocking adjustments and CMOS clearing, all with a single press.

Days after the conclusion of CES 2026, ASUS has presented a brand-new workstation motherboard design on social media. Today's mid-morning teaser claims that company representatives had already introduced their behemoth EBB format product in Las Vegas—furthermore, they describe their next-gen board as being "built for pros who demand serious performance and rock-solid stability." An included photo shows a demonstration sample sitting on top of a black plinth, emblazoned with the ASUS logo and a customary "in search of incredible" slogan. TechPowerUp and several other PC hardware media outlets did not manage to inspect this particular unit during visits to the Taiwanese brand's showroom space. The ASUS social media account hinted that "the future of workstations" is arriving soon, and included a cryptic link to their ExpertCenter Pro ET900N G3 workstation product page. It should be noted that this specific system is powered by NVIDIA's GB300 "Grace Blackwell" ultra desktop superchip.

It is possible that an Intel-based ExpertCenter workstation variant will emerge in the near future. The teased new-gen W890 Pro WS mainboard could succeed the company's current Pro WS W790E-SAGE SE design. The lone ASUS preview shot shows an LGA 4710 socket. This format will host Team Blue's upcoming Xeon "Granite Rapids-WS" HEDT processor family. Coincidentally, the supposed 86-core flagship "Xeon 698X" SKU has made an appearance this week. Forthcoming compatible motherboards are expected to utilize the W890 workstation platform chipset. The gigantic new ASUS Pro WS layout sports eight DDR5 DIMM slots, seven PCIe x16 slots, and four Gen 5 x4 slots. Various large heatsinks and two active cooling fans temper crucial elements on this feature-rich board. Naturally, pricing information is not available at this point in time. Given that the Pro WS W790E model goes for $1600+, we expect its successor to launch with a price tag closer to $2000.

With Intel and AMD both knee-deep into a desktop CPU refresh cycle, it's expected that new motherboard revisions will pop up at CES 2026. This is just what the TechPowerUp team spotted at the ASRock booth at the annual trade show. Although specifications are scarce, we got a glimpse at ASRock's upcoming AM5 and Intel LGA 1851 motherboards. While there are some new additions and other returning brand series coming, many of the motherboards on show at CES are simply refreshes that try to capture the essence of existing ASRock motherboards in new form factors or with new color schemes.

New to AMD's B850 chipset is the ASRock B850M Challenger WiFi, which looks to be a microATX version of the existing B850 Challenger WiFi ATX motherboard—a fairly feature-rich motherboard with a well-equipped VRM, Wi-Fi 7 support, and plenty of rear I/O. From the looks of the prototypes the TechPowerUp team spotted at CES 2026, the biggest difference between the microATX version and the original is the omission of one of the PCIe x4 slots, as it seems as though even the four-slot spacing between the full-size PCIe slots was maintained. The B850M Challenger motherboard will be available in both black and white colorways. Both versions of the Challenger WiFi will also feature four DDR5 RAM slots, although it's unclear what RAM compatibility will look like. ASRock also debuted the Challenger B860 WiFi for Intel's socket LGA 1851 CPUs.

At CES 2026, Sapphire introduced its latest motherboard featuring AMD's Ryzen AI Embedded P132 APU. This APU includes six "Zen 5" cores with 12 threads, achieving a boost frequency of 4.5 GHz, and offers a configurable TDP ranging from 15 W to 54 W. It also integrates an RDNA 3.5 iGPU and an XDNA 2 NPU for local AI processing. Additionally, Sapphire's EDGE+ VPR-7P132 motherboard includes an unexpected accelerator: AMD's Versal AI Edge Series Gen 2 FPGA, which allows the motherboard to process various external signals and create custom data paths as needed. Designed for industrial PCs that require continuous operation, this motherboard is ideal for applications such as smart cameras with sensor fusion and industrial robotics.

At CES 2026, GIGABYTE is unlocking the full potential of AMD Ryzen 9000 Series Processors with AMD 3D V-Cache technology. Through its exclusive, AI-powered X3D Turbo Mode 2.0, GIGABYTE delivers real-time, adaptive performance tuning that pushes X3D CPUs beyond traditional limits. Built as a true hardware-software fusion and trained with massive real-world datasets, X3D Turbo Mode 2.0 is fully optimized and ready for the latest X3D Powered Ryzen 9000 Series Processors—right from day one.

Highlighting this breakthrough is the flagship X870E AORUS XTREME X3D AI TOP, engineered for users seeking uncompromising performance. It supports DDR5 speeds up to 9000+ MT/s, enabling exceptional memory bandwidth and stability. Its advanced thermal architecture includes the CPU Thermal Matrix, reducing VRM and DDR temperatures by up to 8.5°C, while DDR Wind Blade XTREME lowers module temperatures by up to 9°C. To maintain storage reliability under heavy workloads, the M.2 Thermal Guard XTREME reduces SSD temperatures by up to 22°C, ensuring sustained speed and endurance.

This year at CES 2026, MSI proudly unveils a new generation of PC hardware designed to inspire industry professionals and enthusiasts with innovative solutions that make building, upgrading, and personalizing systems more accessible and exciting than ever before. From a new line-up of motherboards, brand new Power Supplies with exclusive features, a flagship triple-sided panoramic chassis paired with a curved OLED display liquid cooler, and two Dual-Tower Air Coolers making their debut, MSI aims to showcase its commitment to pushing boundaries. Let's take a quick look below at what you'll find at MSI's CES 2026 show floor.

Brand New AMD X870(E)/B850 MAX Series Motherboards - Engineered for Maximum Performance
MSI will showcase its latest AMD MAX series motherboards at CES, spanning X870(E) and B850 chipsets to cover a wide range of performance needs. Each MAX model features an integrated OC Engine that enables asynchronous BCLK control for precise frequency tuning, delivering up to 15% higher gaming performance in supported scenarios. Building on MSI's EZ DIY approach, the onboard Direct OC Jumper allows real-time BCLK adjustments directly in the operating system, and the new BCLK Booster adds a simple one-click option for quick overclocking. To support a more feature complete BIOS experience, all MAX motherboards also include an upgraded 64 MB BIOS chip, expanding ROM capacity for current and future AMD processors.

ASUS at the 2026 CES will showcase its first ROG Crosshair series flagship AMD platform motherboard to feature a white PCB and color scheme, called the ROG Crosshair X870E Extreme Glacial. Functionally identical to the ROG Crosshair X870E Extreme that the company launched in 2025, this new board features a white PCB, a silvery-white shroud, and matte-white anodized aluminium heatsinks, along with some chrome accents and glossy textures along the combi heatsink spanning the chipset and M.2 slots.

We are as puzzled as you are with the lack of a visible PCI-Express 5.0 x16 slot in this render, but this may not be a mistake, the slot could be concealed and located at a 90-degree angle pointing downward, so you can use it with a Gen 5-capable riser. The board may even include it. This board apparently won a CES innovation award, so the innovative feature likely is this angled slot. Then again, there's that add-on card ejection mechanism. We can't wait to go hands-on with this board in Vegas to solve this mystery.

MSI introduces the new PRO MAX Series, a unified high-end platform shaped by Modernity, Acceleration, and eXperience for the evolving rhythm of everyday work. Guided by a consistent design language of color, hierarchy, and structure, PRO MAX keeps the focus on what matters most-the content itself. Performance is tuned for multitasking, image processing, data-driven workloads, and out of office collaboration, while an intuitive and predictable user experience ensures a smooth and uninterrupted flow across different work environments.

As work expands across shared, and hybrid settings, PRO MAX maintains continuity wherever work happens. The PRO MAX Series debuts with a complete product lineup spanning Monitor, Desktop PC, All-in-one PC, Motherboard, Power supply, Chassis and Liquid cooler-forming a fully integrated ecosystem for everyday work.

ASUS introduced the Pro WS B850M-ACE SE, an AMD Socket AM5 motherboard in the microATX form-factor that's laid out like a server motherboard, but targets a range of consumers spanning from home and small-business servers, to workstations with storage-heavy loadouts. The board draws power from a combination of 24-pin ATX, and 8+4 pin EPS. It supports the entire range of consumer Ryzen and commercial Ryzen PRO desktop processors from the Ryzen 7000 and Ryzen 9000 series. It also supports EPYC 4005 series server processors in the AM5 package. The board also supports ECC DDR5 unbuffered memory, with support for up to 256 GB of dual-channel (4 sub-channel) DDR5-5600 memory.

Among its use case-specific features are IPMI, U.2, and PCIe Gen 4 MCIO NVMe interfaces. The IPMI is driven by an ASPEED AST2600 chip that includes ASUS Control Center Express IT management software. Storage options include two M.2-2280 slots each with PCI-Express 5.0 x4 wiring, a PCIe Gen 4 MCIO, a U.2 Gen 3, and four SATA 6 Gbps ports. There's also an internal microSD slot for software key storage. There are three wired LAN interfaces—a 10 GbE driven by a Realtek RTL8127 PHY, a 2.5 GbE driven by Intel i225 series controller, and a third 1 GbE interface for the IPMI controller. USB interfaces include two 10 Gbps USB-C ports on the rear panel, a 20 Gbps USB-C header, three 10 Gbps USB type-A, an internal type-A, and additional 5 Gbps ports via headers. Display outputs include HDMI and DisplayPort from the iGPU, and a D-Sub from the IPMI chip. The board is expected to be priced around the $400 mark.

GIGABYTE just released four new AMD Socket AM4 motherboard models as gamers seek out older PC platforms supporting DDR4 memory that's available at more affordable prices. This aligns with our recent report that talks about how acute shortage of DDR5 memory is driving consumers to older platforms with DDR4, such as AMD Socket AM4, and Intel LGA1700. AMD has been releasing new Ryzen 5000 series processor models throughout these past few years even with the advent of the DDR5-exclusive Socket AM5, meanwhile, Intel's 12th Gen through 14th Gen Core desktop processors support DDR4, and there are motherboards based on Intel 600 series and 700 series chipset with DDR4 slots.

Among the motherboards released by GIGABYTE are the A520M H ARGB, the B550I AORUS Pro AX 1.4, B550M H ARGB, and A520I AC 1.5. These are all based on entry or midsegment chipset models. The A520M H ARGB comes with a single PCI-Express 3.0 x16 slot, HDMI display output, and supports all Socket AM4 processors out of the box. The B550I AORUS Pro AX 1.4 is a premium Mini-ITX board based on B550, with PCI-Express 4.0 x16, and a modern Wi-Fi 6E WLAN solution. The B550M H ARGB is essentially the same board as A520M H ARGB, but with B550 and PCI-Express Gen 4 for the PEG and M.2 slots. The A520I AC 1.5 is an interesting entry-level Mini-ITX board with Gen 3 PCIe and older Wi-Fi 5 (AC) WLAN.

ASRock, a global leader in motherboards, graphics cards, gaming monitors, small form factor PCs, power supply units, and AIO liquid coolers, is set to impress tech enthusiasts worldwide at CES 2026 with its latest product lineup innovations. This year, ASRock will unveil an expanded lineup featuring cutting-edge motherboards, graphics cards, gaming monitors, compact systems, power supply series, and the debut of its all-in-one (AIO) liquid cooler solution.

This comprehensive product showcase highlights ASRock's continuous commitment to high performance and precision engineering. By combining innovative technology, reliable quality, and industry-leading design aesthetics, ASRock continues to shape the future of PC hardware, driving the industry forward with innovation that leads the flow.

Perhaps in response to the overwhelming demand for DDR5 and the resulting price increase for PC hardware, ASUS is apparently planning to increase production of its B550 AM4 motherboards, which still rely on aging DDR4 RAM. This is according to a leak posted to Board Channels (via Videocardz), which claims that ASUS will make changes to its supply chain and production in the first quarter of 2026 in order to increase DDR4 motherboard production. This may be an indication that ASUS doesn't expect DDR5 supply and pricing to return to normal anytime soon, which lines up with recent rumors that console makers are considering postponing next-gen console launches until DRAM supply has stabilized.

These plans will include both AMD's B550 and A520 motherboards, both of which use the venerable AM4 socket, and Intel's B760M and H610M-G, and the increased supply will apparently be dedicated to e-commerce channels rather than physical retailers. These motherboards will cover up to AMD's Ryzen 5000 CPUs and Intel 14th-Gen CPUs. At the time of writing, there has been no confirmation from ASUS that these rumors are true, but the AM4 platform has continued to receive support from AMD, with the most recent AM4 CPU, the Ryzen 5 5600F, launching as recently as September 2025.

AMD's Ryzen 9 9955HX3D launched earlier this year as a 16-core mobile gaming CPU based on AMD's Zen 5 architecture. Now, it appears to be coming to an microATX motherboard designed for use in DIY PC builds, courtesy of Aoostar. The company, known for its mini PCs, has announced two versions of the microATX motherboard via a Bilibili post: one with an AMD Ryzen 9 9955HX and another with the AMD Ryzen 9 9955HX3D. Both motherboards feature a full-size PCIe 5.0×16 expansion slots for dGPU compatibility, two DDR5 RAM slots for dual-channel capability, and dual 2280 M.2 PCIe 5.0×4 slots for storage expansion.

The motherboard also looks to use a standard 24-pin ATX power connector. The 9955HX3D's biggest claim to fame is the sizeable cache that's split between 64 MB of 3D V-Cache and 64 MB of regular cache, but this specific offering might be a decent option for those looking for a lot of power in a smaller form factor without the very limited expansion options that come from traditional mini PCs. The Ryzen 9 9955HX motherboard will launch at $530 (converted from ¥3799), a while the 3D V-Cache-equipped 9955HX3D will launch at $669.53 (converted from ¥4799), although it is unclear if these motherboards will be available for purchase outside of China.

Update Dec 30th: Aoostar has officially launched the TA95X3D microATX motherboards on its international store at a launch price of $749 (after a 25% discount).

Sapphire launched its flagship graphics card and motherboard featuring PhantomLink discreet power delivery technology. The tech sees an ASUS BTF-like GC-HPWR power-delivery slot located along the plane of the main PCI-Express 5.0 x16 slot, which delivers power to the graphics card without you having to wrestle with a delicate 12V-2x6 cable on top of the card. But then there's a catch. The motherboard isn't designed on the philosophy of backside connectivity like ASUS BTF or MSI Project Zero or GIGABYTE Stealth, the connects are all still located along the obverse side of the PCB. There is a 600 W-capable 12V-2x6 input located next to the 24-pin ATX, which simply routes power to the GC-HPWR slot.

Launching today, are the Sapphire NITRO+ Radeon RX 9070 XT PhantomLink PE graphics card, and the NITRO+ X870EA PhantomLink Socket AM5 motherboard. Both products have an identical silver-white color scheme and NITRO+ design theme that pair well visually. The graphics card features an overclocked RX 9070 XT with similar specs to the regular NITRO+ RX 9070 XT from Sapphire. The motherboard comes in two color trims, white+silver and black+silver. It offers a premium CPU VRM solution, a heavy M.2 PCIe Gen 5 heatsink, reinforced PCI-Express 5.0 x16 slot, premium Wi-Fi 7 and onboard audio solutions, and USB4. Sapphire is expected to showcase this along with example builds at CES next week.