On Wednesday (December 17), Maxsun presented its brand-new PC Farm motherboard series at this year's Shunwang Technology and Intel Cloud Business Summit. The Taiwanese computer hardware specialist introduced three options (in slide form only): MS-PC Farm B760I, MS-PC Farm H770I D5 V2, and MS-PC Farm B860I. The latter SKU has attracted the most attention, due to it featuring: "four DIMM slots (that support) up to 256 GB of (DDR5) memory." Maxsun's PR department reckons that this configuration will be ready to "meet high-load computing demands." A single low resolution promo shot shows off a largely black Mini-ITX board design, with a third of its real estate occupied by four DIMM slots. Initial press analysis proposes that Maxsun's upcoming product could be the first of its kind; a tiny consumer-grade board that can accommodate four sticks of DDR5 RAM.

Normally, compact PC enthusiasts—desiring 4-slot setups—have compromised with selections of larger microATX parts. Maxsun's MS-PC Farm flagship model builds on "existing airflow optimization and IPMI management capabilities." The company's preview material outlines support on the MCIO interface for high-speed PCIe 5.0 expansion. Also, the MS-PC Farm B860I is capable of "forced BIOS flashing." An intelligent fault diagnosis system is advertised as being able to accurately locate: "problems with various IC components on the motherboard for rapid troubleshooting and recovery, ensuring continuous and stable system operation." A full specification sheet was not released during a mid-week preview event, but the presence of an Intel B860 chipset and LGA 1851 socket pave the way for hosting of current-gen Core Ultra 200S "Arrow Lake" processors.

Following leaked renders in November, Sapphire has now published near-complete specifications for its upcoming PURE X870A WIFI 7 motherboard on its official website. This is Sapphire's first AM5 board based on the AMD X870 chipset, after previously limiting its lineup to B650 and B850 designs, including the PURE B850A WIFI 7. The PURE X870A WIFI 7 (SKU: 52122-02-40G) follows the standard ATX layout, measuring 305 × 245 mm and supports AMD Ryzen 7000, 8000, and 9000 series processors. It features a 16+2+1 phase VRM and dual 8-pin EPS connectors. For memory the motherboard offers four DDR5 DIMM slots with up to 256 GB capacity and overclocked speeds of up to DDR5-8400. For expansion, the board offers one PCIe 5.0 x16 slot, a PCIe 4.0 x4 slot in a full-length connector, and a PCIe 3.0 x1 slot.

Storage options include one PCIe 5.0 M.2 slot, two PCIe 4.0 M.2 slots, and four SATA ports. Networking is handled by a Realtek 2.5 GbE controller, paired with a Wi-Fi 7 module supporting 2.4 GHz, 5 GHz, and 6 GHz bands, plus Bluetooth 5.4. Rear I/O is fairly loaded, featuring DisplayPort and HDMI outputs, USB4 Type-C (40 Gbps, DisplayPort Alt Mode, 15 W PD), multiple USB 3.2 Gen 1 and Gen 2 ports, a Flash BIOS button, and six audio jacks driven by a Realtek ALC897 codec. Front headers include USB-C, USB 3.2 Gen 1, and USB 2.0. Sapphire is yet to officially announce exact availability and pricing. However, the company is at this moment promoting the PURE X870A WIFI 7 motherboard with an ongoing online contest alongside other items such as the Sapphire Pure Radeon RX 9070 graphics card.

Minisforum has introduced the BD895i SE, a new MoDT (Mobile on Desktop) Mini-ITX motherboard built around AMD's Ryzen 9 8945HX mobile processor. Similar in concept to the earlier BE7XXi HX series, the BD895i SE targets compact, high-performance desktop builds by combining a flagship mobile CPU with a full-featured ITX (170 × 170 mm) layout and a large, pre-installed CPU heatsink. The board features a 16-core, 32-thread Ryzen 9 8945HX processor, running at a 2.5 GHz base clock with boost speeds of up to 5.4 GHz. The CPU is rated at a 100 W TDP, with boost power reaching up to 120 W. Minisforum included a low-profile heatsink with four heatpipes and a total height of 37 mm leaving users the choice to add their own 120 mm fan if needed.

The BD895i SE motherboard features a full PCIe 5.0 x16 slot for a dedicated graphics card, as the integrated AMD Radeon 610M is not really suitable for gaming. Then there are two DDR5-5200 SO-DIMM slots supporting up to 96 GB and dual PCIe 4.0 x4 M.2 2280 slots for NVMe storage. Another M.2 2230 E-Key slot is reserved for Wi-Fi or Bluetooth cards. In terms of connectivity, it offers HDMI 2.1, DisplayPort 1.4, and USB-C with DisplayPort Alt Mode (all up to 8K at 60 Hz or 4K at 120 Hz). A 2.5 GbE LAN port alongside a mix of USB 2.0, USB 3.2 Gen 1, and USB-C Gen 2 ports and full analog audio jacks on the rear I/O complements the specs. Power is supplied through standard ATX connectors, making the board compatible with conventional desktop PSUs. Pricing is set at around $423.90 in the US (regular price $529), while European pricing is listed at €439 (regular price €549). Minisforum BD895i SE is positioned as a compact but premium option for users looking to build a powerful small-form-factor system around AMD latest high-end mobile CPU.

Earlier today, ASRock's "AGESA to Combo AM5 1.2.7.1" BIOS update turned up within the official support index. In general, several B650 and B850 chipset-based motherboard models—once updated with the AGESA BIOS 1.2.7.1 stable release—will be blessed with "upcoming CPU compatibility." Recent PC hardware community excitement has been generated by key marketing terms, including "Future CPU Ready" or "Ultimate Compatibility." As of mid-October, ASUS started hinting about forthcoming "Zen 6" processor support, on AM5 platforms. Next-gen mainstream desktop Ryzen CPUs are not expected to arrive until later on in 2026.

Looking at ASRock's latest BIOS release, upcoming support could refer to products that are due for launch in the near future. Around late October, the AGESA 1.2.7.0 beta contained code references to familiar Team Red "Strix Point" (STX) and "Phoenix Point" (PHX) architectures. Unlike nearby rivals, ASRock did not embrace v1.2.7.0—instead today's release jumps to v1.2.7.1. Presumably, the up-to-date revisions pave the way for "Krackan Point" or "Strix Point" desktop APUs on ASRock's slice of B650 and B850 boards. AMD could introduce the "Ryzen 9000G" series at CES 2025, potentially alongside the oft-leaked "Ryzen 7 9850X3D" SKU, and a more mysterious "Ryzen 9 9950X3D2" flagship model.

BIOSTAR, a leading manufacturer of edge computing solutions, industrial motherboards, graphics cards, and storage devices, today unveils the A620MT-E 2.0 motherboard, a reliable and adaptable AM5 platform designed for modern office environments, home entertainment setups, and SI integration projects.

Built on AMD's A620A single chip architecture with full support for Ryzen 9000, 8000, and 7000 series processors, the A620MT-E 2.0 delivers efficient performance and dependable stability for a wide range of everyday applications. It is an ideal choice for office users who need a smooth experience running essential tasks such as web browsing, emails, and productivity software. Home users will enjoy its capability as an HTPC platform for streaming TV shows and movies, listening to music, and engaging in light gaming. SI builders will appreciate its ability to support integrated systems handling customer data, transaction records, communications, and various business processes with consistent and secure performance.

MSI is thrilled to unveil its latest range of motherboards, designed specifically for the AMD Ryzen X870E chipset. These motherboards are part of the new MSI MAX series, they are not just about robust performance and rock-solid reliability. They also offer enhanced customization, putting you in the driver's seat of your computing experience. With MSI's signature EZ DIY features, these motherboards are set to revolutionize computing, offering seamless installation and unimaginable control over your system.

Alongside the debut of MSI's new X870E motherboards, the MEG X870E ACE MAX makes a powerful return. This refreshed edition features a suite of refined enhancements designed to enhance performance further. With enhancements tailored for the MAX and EVO series, users can expect improved overclock tuning, improved thermal solutions, and greater compatibility making it an ideal choice for enthusiasts seeking to maximize the systems.

Last month, ASUS started a teaser campaign that alluded to a brand-new ROG Mini motherboard design. Promo material provided a very pixellated preview of a pale Mini-ITX form factor product. Earlier this week, a single render leaked out—image quality was good enough to identify the unreleased SKU as a white spin-off of the already launched Strix B850-I Gaming WiFi7 board design. At some point within the past couple of days, the main ASUS web presence was updated with a dedicated "W" model product page. We suspect that their next move will be the publication of press material, unless staffers deem this SKU's slight redecoration unworthy of such attention. Annoyingly, the White Edition's detailed web portal does not provide a clear view of the board's back section.

Unsurprisingly, the Taiwanese manufacturer has rolled out the standard black variant's exact same description and specs: "(our latest model) integrates cutting-edge technology into a sleek Mini-ITX form factor. It features PCIe 5.0 slots for graphics and storage, dual-channel DDR5 slots and robust power delivery for top-tier gaming and heavy workloads. Meanwhile, advanced cooling solutions maintain peak performance, and Wi-Fi 7 ensures ultra-fast connectivity. This platform delivers the power and connectivity that advanced AI PC applications demand." One major difference, at least on digital paper, is the White Edition's deployment of a "64 MB BIOS." The larger ASUS BIOS chip is advertised as offering a "more powerful interface" and "support for future AM5 processors."

BIOSTAR, a leading manufacturer of edge computing solutions, industrial motherboards, graphics cards, and storage devices, today introduces the BIW88-AHS industrial motherboard, designed for intelligent infrastructure requiring high-speed computing and smart system management. Built to support a broad range of industrial and AI-driven deployments, the BIW88-AHS combines strong performance with versatile expansion and reliable connectivity.

The BIW88-AHS is an ideal platform for system integrators who need a dependable foundation for customer information systems, transaction management, and communication workflows. Its extensive expansion options and stable connectivity provide the long-term reliability that SI projects depend on, ensuring smooth operation and efficient workflow management. For AIOT applications, the BIW88-AHS offers the expansion and interface support required to integrate communication modules and AI accelerators. Support for dual graphics cards via two PCIe 5.0 x16 slots and multiple PCIe interfaces enables efficient interaction with AI processors, bringing analytics and machine intelligence closer to the devices generating real-time data.

BIOSTAR, a leading manufacturer of edge computing solutions, industrial motherboards, graphics cards, and storage devices, today introduces the BIW88-AHS industrial motherboard, designed for intelligent infrastructure requiring high-speed computing and smart system management. Built to support a broad range of industrial and AI-driven deployments, the BIW88-AHS combines strong performance with versatile expansion and reliable connectivity.

The BIW88-AHS is an ideal platform for system integrators who need a dependable foundation for customer information systems, transaction management, and communication workflows. Its extensive expansion options and stable connectivity provide the long-term reliability that SI projects depend on, ensuring smooth operation and efficient workflow management.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, today marks a revolutionary moment in computing aesthetics with the introduction of X870E AERO X3D WOOD, a groundbreaking motherboard that represents more than a technological advancement—it's a statement piece that harmonizes organic elegance with uncompromising performance. Crafted for the discerning connoisseur, this motherboard transforms cold technology into an inviting element that belongs in your living space.

X870E AERO X3D WOOD brings comfort and harmony to your space through thoughtful design that honors the quiet presence of natural materials. Every detail has been meticulously considered, from the premium leather pull tab—a tactile delight that brings luxurious warmth to your fingertips—to the natural wood aesthetic that evokes the warmth and authenticity of home.

ASRock's Vietnamese website has added an intriguing new microATX motherboard to its portfolio of Intel H610 chipset products. Uniko's Hardware stumbled upon this low-key addition earlier today—their social media post expressed excitement about the young SKU's unique RAM setup. They proclaimed: "a new LGA 1700 H610M motherboard that supports DDR4 and DDR5—but not at the same time! Six DIMM slots on this mobo = two for DDR4, and the other four support DDR5, both in dual channel mode...ASRock saving our ass!" In-depth investigations reveal that the H610M COMBO's first BIOS release is tagged with a June 2025 publication date.

This basic board design's hybrid slot system—targeting office and industrial applications—offers refreshing flexibility. Over the past couple of weeks, computer memory prices have escalated. In particular, mainstream DDR5 product costs of ownership have hit unreasonable heights. Fortunately, the H610M COMBO can accept cheaper DDR4 sticks. Uniko's Hardware recalls that an obscure ONDA H610M+ board offered a similar system three years ago, albeit restricted to one slot per DDRx type (single channel). It is encouraging to see a mainstream manufacturer release a more capable "combo" design, but the new model's specifications and feature set outline entry-level operations—no pricing information or retail availability has emerged online. Hardcore gamers and overclockers will likely sniff at the H610M COMBO SKU's basic capabilities.

GIGABYTE introduced an interesting new Socket LGA1851 motherboard that could mark the mainstreaming of aluminium fin-stack heatsinks for CPU VRM. The new B860M DS3H WIFI6E Rev 2.0 is part of GIGABYTE's mainline brand, it escapes the gamer-focused AORUS brand, or even the slightly spruced-up Gaming brand. For a mainstream microATX motherboard based on the mid-range Intel B860, it offers some interesting specs, such as a VRM cooling solution that consists of two aluminium fin-stack heatsinks that are joined by a 6 mm-thick copper heatpipe. This feature is only found on Revision 2.0 of the B860M DS3H WIFI6E. The Revision 1.0 of this board has regular extruded aluminium monoblock heatsinks for the VRM.

The B860M DS3H WIFI6E Rev 2.0 draws power from a combination of 24-pin ATX and 8-pin EPS connectors, and uses a 10-phase VRM to power the CPU. The Intel B860 chipset lacks multiplier-based CPU overclocking, but supports memory overclocking, and this board can do up to DDR5-9066. Expansion slots include one PCI-Express 5.0 x16, and three PCI-Express x16 slots with PCI-Express 4.0 x1 wiring, each. Storage connectivity includes one M.2-2280 slot with PCI-Express 5.0 x4 that's wired to the CPU, and one M.2-2280 with PCI-Express 4.0 x4, wired to the PCH. Display connectivity includes two DisplayPorts and one HDMI; networking includes an Intel AX211 (Wi-Fi 6E + Bluetooth 5.3) WLAN module, and a Realtek 2.5 GbE wired LAN interface. The onboard audio is basic Realtek ALC897 fare. USB ports include a 10 Gbps type-C USB 3.2 header, one 10 Gbps USB 3.2 Gen 1 port on the rear I/O, and four 5 Gbps USB 3.1 Gen 1 ports (two on the rear I/O, two via headers). The company didn't reveal pricing.

ASUS Republic of Gamers has teased the imminent arrival of a spun-off STRIX B850-I GAMING WIFI motherboard model. The standard black version has been out for almost a year, but a pale sibling will be added to the Taiwanese manufacturer's collection of small form factor (SFF) mainboards. A cute mascot pixel art-themed teaser was released prior to the discovery of a single product promo render. In the early hours, realVictor_M uploaded this lone image to social media. As expected, the forthcoming white Mini ITX product—dubbed "ROG STRIX B850-I Gaming WIFI7 W"—deploys a familiar layout.

The ASUS mainboard design team has revised a small portion of visual elements; mainly on the I/O and M/2 covers/shrouds. Branding and graphical themes are slightly different, when compared to material printed on the standard black SKU. We expect similar visual updates to be present on the white edition's rear surface, but this morning's leak did not include any additional shots of the motherboard's back and sides. At the time of writing, official ASUS web presences do not list this SKU. It is possible that the leaked render was sourced from an inadvertent webstore entry.

Giga Computing, a subsidiary of GIGABYTE Group and a leader in high-performance computing and data center solutions, today announced a strategic partnership with Syrma SGS Technology Limited, a premier Indian electronics manufacturing services provider. This collaboration will establish local manufacturing of GIGABYTE server products in Tamil Nadu, India, supporting the country's "Make in India" initiative and strengthening Giga Computing's supply chain presence in South Asia.

To enhance global advanced manufacturing capabilities and create a more agile supply chain, Syrma SGS will begin assembly of GIGABYTE server motherboards at its Chennai facility to meet India's growing market demand. Initial production will include enterprise-grade boards such as the GIGABYTE MS73-HB0 and MZ33-AR1, delivering critical hardware for data centers and enterprise computing. The partnership will later expand to full box-build system manufacturing with export capabilities, enabling Giga Computing to accelerate global delivery with greater efficiency and flexibility.

Over the past few years, Sapphire has been making inroads with its custom AMD motherboard designs—primarily targeting the Chinese PC hardware market. A mid-September announcement signalled wider ambitions, with a warmly welcomed global launch of various NITRO+, PULSE, and standard mainboard models. An unannounced "PURE X870A" SKU seems to on the way to release. Promotional renders were uploaded to social media by momomo_us this afternoon, without comment—these images were likely sourced from a prematurely published e-tail listing. According to VideoCardz, an unnamed French webshop was advertising "out of stock" units at €279, prior to the discovery of promo shots. Internet sleuths are still seeking out a proper rundown of board specifications.

So far, Sapphire has only produced AM5-based board designs featuring B650 and B850 chipsets—including a PURE B850A WIFI 7 model. The freshly leaked SKU is destined to sit above lesser specced siblings. The forthcoming board sports a greater compliment of PURE-themed armor, carrying the expected combination of white, silver and gray shades. The Hong Kong-based technology firm is better known for its graphics card product line; where the NITRO+, PURE and PULSE monikers originated from. Their PURE Radeon RX 9070 XT and non-XT cards already aesthetically match the existing white B850A board model. Given the recent uptick in NDA-busting activities, a possible imminent worldwide launch could occur.

Erying, a Chinese PC hardware manufacturer, specializes in Mobile on Desktop (MoDT) motherboards. TechPowerUp has covered the emerging OEM's past efforts; notably an Intel "Alder Lake-H" APU-powered range. Yesterday, the company introduced its second generation "Ultra MoDT" product line. As is tradition, these desktop format mainboards are based on mobile silicon—normally utilized in laptops/notebooks (BGA platforms). This hybrid configuration has proved popular across international budget-conscious PC building communities, due to attractive price points and "all-in-one" convenience. Erying's latest release seems to be marketed with "young" customers in mind. Their late 2025 release has launched as a Micro-ATX-sized board, featuring Intel Core Ultra 200H "Arrow Lake-H" processors.

A JD.com listing immediately defaults to Erying's range-topping variant, carrying Team Blue's 16-core Core Ultra 9 285H chip. Priced at 2699 RMB (~$381 USD), this option could form the basis of a fairly potent compact gaming system. The entry-point model—tagged with 1799 RMB (~$254 USD) price point—runs on a Core Ultra 5 225H processor. Erying's two middle ground alternatives are based on Ultra 5 235H and Ultra 7 255H APUs—priced at 1899 RMB and 2199 (respectively). The company has released initial gaming and production benchmark results, in written article form (in Mandarin) and on YouTube (see below).

Colorful Technology Company Limited, a leading brand in gaming PC components, gaming laptops, and Hi-fi audio products, today announced three new additions to its B850 motherboard family: the CVN B850M ARK FROZEN, BATTLE-AX B850M-PLUS S WIFI7, and COLORFIRE B850M-MEOW WIFI7. These new models bring enhanced power delivery, upgraded connectivity, and signature COLORFUL design identities to meet the performance needs of next-generation AMD Ryzen processors.

The expanded B850 Series is engineered for gamers, creators, and PC enthusiasts seeking powerful performance and distinctive visual design. A key highlight of this launch is the much-anticipated COLORFIRE MEOW Series motherboard for AMD Ryzen users, now built on the AMD B850 chipset and refreshed with a new white color scheme, cat-inspired accents, and the playful MEOW aesthetic that defines the series. Each of the new B850 motherboards delivers robust support for AMD Ryzen 7000, 8000, and 9000 Series processors, high-speed DDR5 memory, and advanced thermal and aesthetic designs unique to their respective product lines.

Colorful's sub-brand—COLORFIRE—is well known for producing cartoon cat-themed "MEOW" designs; mostly adorning graphics cards, motherboards, PC enclosures and peripherals. TechPowerUp staffers inspected various offerings that were exhibited at Colorful's Computex 2025 booth. The Chinese company's mid-year presence—in Las Vegas—signalled new international ambitions; beyond its native distribution of products. A fresh VideoCardz article indicates that COLORFIRE's B850M-MEOW WIFI V14 motherboard is receiving some form of international release. Chinese customers were able to buy retail units two months ago, with prices reportedly going up from an initial launch tag of $120 to $134.

The V14 board design seems to succeed a slightly older B850M SKU: the MEOW WIFI Orange model. COLORFIRE's cat mascot features prominently on this product, along with a much busier overall presentation—consisting of text and patterns. By contrast, the fancier (specs-wise) mostly white V14 option dials back on visual flare. A smattering of subtle cartoon feline paw prints and MEOW logos are present on the newer model; perhaps better suited to Western tastes. Upgrades include a 10+2+1 power phase design (versus 7+2+1), support for four DDR5 DIMMs, more rear panel connectivity, and Wi-Fi 7 functionality.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, proudly announces another historic breakthrough in the world of extreme overclocking. In a spectacular demonstration of engineering excellence and collaborative innovation, elite overclocker Sergmann, together with GIGABYTE's legendary overclocker HiCookie, have obliterated the DDR5 memory speed world record, pushing past the 13,000 MT/s threshold to achieve an extraordinary 13,530 MT/s—the fastest memory speed ever achieved on the planet. This groundbreaking milestone was powered by GIGABYTE's revolutionary Z890 AORUS TACHYON ICE motherboard, paired with cutting-edge Corsair memory modules and Intel Core Ultra processors (Series 2), creating the ultimate trifecta of extreme performance technology.

"The Z890 AORUS TACHYON ICE represents the pinnacle of motherboard engineering—a testament to our relentless pursuit of performance perfection. This world record validates our vision: when you refuse to compromise on design, power delivery, and innovation, you don't just compete for records—you own them." said Jackson Hsu, Director of Motherboard Division at GIGABYTE.

A series of reports from Korean and Taiwanese outlets suggests growing pressure across the PC hardware industry as DRAM, NAND, and even NOR Flash prices continue to climb. Korea Economic Daily says NVIDIA, AMD, and other GPU makers are considering dropping some mid-to-high-end gaming cards where memory now makes up an unusually large share of total cost. Taiwanese PC brands, including ASUS, are also said to be looking at ways to reduce memory configurations in upcoming products. TrendForce warns that manufacturers may shift more production toward lower-margin models or raise prices across the board to cope with higher component costs. With most modern PCs, laptops, consoles, tablets, and phones now shipping with at least 16 GB of RAM, any further price spikes or supply shortages could force major brands to cut orders and increase retail pricing. Commercial Times reports that memory alone could add nearly NT$3,000 (about US $96) to basic office PCs next year.

According to Commercial Times, due to rising memory prices some motherboard makers and notebook ODMs vendors have paused new motherboard development or mass production. DRAM, NAND, and NOR Flash supply is tightening at the same time. DDR4 is becoming especially scarce as suppliers accelerate phase-outs and move mature-node capacity toward HBM and DDR5. WJ Capital Perspective estimates a DDR4 shortfall of around 70,000 wafers by the end of 2025, with 2026 unlikely to recover fully. NOR Flash demand is rising as well, driven by AI servers. Commercial Times says NVIDIA's GB200 NVL72 system already uses more than US $600 of NOR per rack, possibly reaching $900 within two years. This comes right after earlier reports that AMD is preparing GPU price increases and Samsung is raising memory prices by up to 60% due to tight supply.

GAMDIAS, a global leader in high-performance gaming hardware, proudly unveils the ATHENA M4M Series, a compact yet powerful micro-tower case lineup designed to maximize performance in a minimal form factor. The series introduces two models: the ATHENA M4M with a sleek mesh front panel and RGB accents, and the ATHENA M4M WOOD, which pairs cutting-edge engineering with a refined natural wood finish. Aligned with GAMDIAS's 2025 slogan, "GAMING REIMAGINED," the ATHENA M4M Series combines advanced cooling support, broad compatibility, and modern aesthetics to empower gamers who demand both style and substance.

"The ATHENA M4M Series redefines compact performance builds by offering maximum thermal efficiency, dual 360 mm radiator support, and a clean BTF-ready design in a minimal footprint," said Stimson Wang, CEO of GAMDIAS. "The addition of the ATHENA M4M WOOD reflects our vision to blend technology with natural design elements, giving gamers more ways to personalize their setups."

GIGABYTE TECHNOLOGY Co. Ltd, the world's leading computer brand, takes extreme performance and style to the next level with its All New X870E AORUS XTREME X3D AI TOP motherboard. First unveiled at GIGABYTE EVENT 2025, the X870E AORUS XTREME X3D AI TOP is the world's first Flagship motherboard platform purpose-built for AMD Ryzen X3D processors, delivering GIGABYTE X3D Turbo Mode 2.0 for uncompromising gaming and productivity, industry-leading DDR5 speeds of up to 9000+ MT/s, and a smarter user experience through innovative thermal solutions (e.g., CPU Thermal Matrix etc.), Unrivaled EZ-DIY features, and DriverBIOS technology.

At the core of the X870E AORUS XTREME X3D AI TOP is X3D Turbo Mode 2.0, a dynamic AI overclocking model trained on big data, tailored for per-chip optimization and resulting in a custom tuning profile with optimal results. This breakthrough enables users to achieve the optimal balance without compromise, improving 25% gaming performance and 14% multi-tasking productivity over default settings. By intelligently finetuning frequency, power, and thermal behavior, X3D Turbo Mode 2.0 unleashes the true potential of AMD Ryzen X3D processors.

In mid-May, MSI previewed its upcoming Portal X project, offering customers a way to adjust ARGB lighting for GPUs and motherboards directly from their browser, eliminating the need for the MSI Mystic Light software. MSI now suggests that users seeking quick and easy light control use the browser-based Portal X. This tool can manage MSI motherboards with Intel and AMD 800 series chipsets, MSI GPUs from NVIDIA's GeForce RTX 50 series, and various memory modules. MSI states that Portal X is compatible with most memory brands available. To install it, go to portalx.msi.com, and you'll be automatically redirected to install the MSI Portal X Launcher from the Microsoft Store. Once installed, you can access Portal X anytime through your browser or the Launcher app—no further updates needed.

For more advanced lighting control and users with multiple lighting devices, MSI advises using the Mystic Light application. Portal X has the advantage of running in a browser and consuming fewer system resources, but it requires a somewhat more modernized setup. Tests by VideoCardz revealed that Portal X lacks certain fine-tuning options, such as separate control for AIO cooler lighting, which follows the motherboard's lighting setup. Additionally, Portal X does not support fan speed control or AIO display status, features exclusive to the full Mystic Light application. MSI users should explore Portal X to see if it meets their needs, but for more comprehensive tuning, the full Mystic Light application remains superior. For those of you with MSI hardware, please let us know if you tried the new Portal X app in the comments.

MSI is excited to partner with SEGA and Sports Interactive for an exclusive limited-time offer! From November 4 to December 4, 2025, purchase select MSI motherboards or monitors and receive a free copy of Football Manager 26 (via the Epic Games Store). Step into the dugout, where every choice shapes your story and lead your club to glory.

Take the Field with MSI!
MSI's latest Intel 800 series motherboards and monitors give you the power, precision, and vision to manage every match. Perfect for Football Manager 26, they're your ultimate tools to lead your club to glory.

With LGA1700 continuing to be relevant to gamers, motherboard manufacturers continue to revise or launch new products on this platform. The latest such product from MSI is the new B760 MPOWER, targeting the performance segment. The board is designed for those picking the non-K variants of 14th Gen Core "Raptor Lake Refresh" processors with superior gaming performance to non-K variants of "Arrow Lake-S." Built in the microATX form-factor, the board is powered by the mid-range Intel B760 chipset. MSI has given the board a PCI-Express 5.0 x16 slot wired to the PEG interface of the processor. There are no M.2 Gen 5 slots that eat into this PEG slot, the board only puts out two M.2 Gen 4, one of which is wired to the processor, and the other to the PCH.

While the board lacks multiplier-based CPU overclocking, it supports BCLK-based OC, besides a fully capable DDR5 memory overclocking feature-set in its UEFI BIOS, letting you use the fastest XMP kits supported by "Raptor Lake." Besides the PCIe 5.0 x16 slot, you get a PCIe 4.0 x4 and x1 slots from the PCH. Networking connectivity includes 2.5 GbE, there is surprisingly no WLAN, not even an M.2 E-key slot. The onboard audio solution uses an entry-level Realtek ALC892 CODEC. In all, we're not sure where MSI is going with this product, other than diluting the MPOWER brand.