News Posts matching "NAND flash"

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NVMe 1.3 Specification Published

NVM Express, the special interest group behind the NVMe protocol, which enables significantly higher performance on flash-based storage devices, compared to the AHCI protocol, published the NVMe 1.3 specification. This is the most significant update to the protocol since the NVMe 1.2 specification released in 2014. NVMe 1.3, which could be implemented in SSDs, motherboards, and HBA cards starting late-2017 or 2018, introduces several major features that increase performance, endurance, and manageability of flash-based storage devices, such as SSDs.

To begin with, NVMe 1.3 introduces a drive self-test feature similar to SMART. The host machine can now command the drive to perform a self-test without having to mount volumes and expose their contents to OS-based utilities. The self-test parameters could be left up to the drive vendor, and could include hardware tests in addition to data integrity tests. The protocol also adds much needed support for boot-partitions, without needing the motherboard UEFI firmware to store it. The current implementation of motherboards with NVMe booting support involves storing a tiny boot partition with the bootloader on the SPI flash chip of the motherboard which stores the UEFI firmware.

HGST Announces the Ultrastar SS300 Series SAS SSDs

Western Digital Corp., a global data storage technology and solutions leader, today announced the HGST-branded Ultrastar SS300, the company's highest-performing SAS SSD to date. It is the latest addition to the company's family of Ultrastar 12Gb/s SAS SSDs, which are used to meet the rigorous data demands of many of the world's largest companies today. Developed in partnership with Intel, the new Ultrastar SS300 delivers best-in-class random performance, offering speeds of up to 400,000 IOPS random read and up to 200,000 IOPS random write.

"Today, we raise the bar with our newest 12 Gb/s SAS SSD, the Ultrastar SS300," said Ulrich Hansen, vice president of SSD product marketing at Western Digital. "Built with high-endurance 3D NAND flash memory, the Ultrastar SS300 offers best-in-class speed, outstanding capacity and intelligent power options that enable customers to tailor storage systems and server solutions that are just right for their demanding needs. These benefits are delivered with the same tremendous reliability that has helped to make Ultrastar 12 Gb/s SAS SSDs popular around the globe."

Transcend Announces Four SSD Product Lines Based on 3D NAND

Transcend Memory announced four client SSD product lines based on 3D NAND flash memory. The lineup begins with the new MTS810 and MTS420 lines of mainstream SSDs built in the M.2-2280 and M.2-2242 form-factors, respectively, which take advantage of the SATA 6 Gb/s interface. The MTS810 succeeds the MTS800 series the company launched in 2016. It is based on a newer TLC NAND flash memory, and a more compact SSD controller made by Silicon Motion. The drive puts out up to 560 MB/s of sequential transfer rates. The MTS420 is its miniaturized version in the M.2-2242 form-factor. Both drives will be available only in 128 GB capacities.

Next up, is the SSD230 series. The company already announced this drive back in November 2016. Built in the 7 mm-thick 2.5-inch form-factor, it comes in 128 GB, 256 GB, and 512 GB capacities, and offers sequential transfer rates of up to 560 MB/s reads, with up to 520 MB/s writes. Lastly, Transcend unveiled its latest high-performance M.2-2280 SSD, which takes advantage of the PCI-Express 3.0 x4 interface with NVMe 1.2 protocol, the MTE850 series. Available in 128 GB, 256 GB, and 512 GB capacities, the drive belts out sequential transfer rates of up to 2,500 MB/s reads, with up to 1,100 MB/s writes. It features 3D MLC NAND flash memory.

Silicon Motion Announces SATA FerriSSD Single-chip 3D NAND SSD

Silicon Motion Technology Corporation, a global leader in designing and marketing NAND flash controllers and solid-state storage devices, today announced that it has extended its popular family of SATA 6 Gb/s FerriSSD Industrial BGA SSDs to support the latest 3D NAND with end-to-end data path protection, NANDXtend ECC, and IntelligentScan feature - delivering unsurpassed data reliability for embedded storage applications. The new FerriSSD products offer flexible data capacity options up to 256GB and feature proprietary data protection technologies that eliminate drive downtime and extend the service life of these SSDs. FerriSSD products offer customized solutions for various end-market demands and are optimized to meet the specific needs of the customer.

Kingston Announces the DCP-1000 PCI-Express NVMe SSD

Kingston today announced the DCP-1000 line of high-performance PCI-Express SSDs, targeted at enterprises, particularly at data-centers with high bandwidth demands, the drives come in the half-height add-on card form-factor, and take feature a PCI-Express 3.0 x8 host interface (64 Gbps), and takes advantage of the NVMe protcol. It puts this interface bandwidth to good use, belting out sequential transfer rates in excess of 6,800 MB/s. The drive comes in capacities of 800 GB, 1600 GB, and 3200 GB.

All three models offer sequential read speeds of up to 6,800 MB/s. The 800 GB variant writes at speeds of up to 5,000 MB/s, while the other two models write at up to 6,000 MB/s. The 4K random access performance of the 800 GB variant is 900,000/145,000 IOPS (reads/writes); with the 1600 GB variant belting out 1,100,000/200,000 IOPS, and the 3200 GB variant 1,000,000/180,000 IOPS. The drives come with full-length heatsinks cooling the MLC NAND flash chips and controller; and a bank of capacitors that provide power-outage data-loss mitigation.

NGD Systems Announces the Industry's Highest Capacity SSD

NGD Systems, a pioneer creating intelligent solid state drives (SSD) for public and private cloud data centers, today announced the availability of the industry's highest density storage solution. Shipping immediately and currently being qualified at leading OEMs, the Catalina SSD is available in capacities up to 24TB with 3D TLC flash in a PCIe edge card form factor.

"The Catalina is the industry's highest capacity PCIe NVMe SSD, designed and optimized for applications requiring consistent and low latency mass storage," said Nader Salessi, founder and chief executive officer of NGD Systems. "We are setting a new metric for energy and storage density to meet a key concern within data center and cold storage applications alike."

Death By a Thousand Cuts: Toshiba to Sell Majority of its Semiconductor Business

Toshiba may not be dead in the water just yet, but news are dire for the company. After the company confirmed it was looking to spin-off its NAND production business so as to sell a minority, 20% stake for much-needed liquidity in the face of amounting debt and multiple management mistakes, reports now announce a much more aggressive stance from the company. It is now apparently looking to sell a majority stake (60%) on the spin-off, in the face of escalating costs and dwindling prospective chances.

Intel Optane DC P4800X with 3D XPoint Offers 21x Endurance Over MLC NAND

Intel is readying a fleet of new SSDs based on its new 3D XPoint non-volatile memory, a technology that Intel hopes will replace NAND flash in the years to come. The company developed this technology in collaboration with Micron Technology, under its IMFlash Technologies banner. The first Intel SSDs with this memory will be sold under the Optane brand. There are several sub-brands targeting the various market segments (client, enterprise, data-center, etc.), and technical slides of the data-center targeted Optane DC P4800X SSD were leaked to the web.

One of the first Optane DC P4800X SSDs comes in a rather measly capacity of 375 GB. The drive is built in the half-height PCI-Express add-on card (AIC) form-factor, with PCI-Express 3.0 x4 host interface. The drive belts out sequential transfer rates of up to 2400 MB/s reads, with up to 2000 MB/s writes, which may not sound like much given that even TLC NAND flash based PCIe 3.0 x4 drives offer higher transfer rates; until you look at three key metrics - latency, random-access performance, and endurance.

SanDisk Announces the SkyHawk Series Enterprise SSDs

SanDisk today announced the SkyHawk and SkyHawk Ultra lines of enterprise SSDs. Built in the 12 mm-thick 2.5-inch form-factor, the drives feature PCI-Express 3.0 x4 interface over U.2 or SATA-Express connections. The drives incorporate high-endurance 15 nm MLC NAND flash memory. The SkyHawk series includes 1920 GB and 3840 GB variants, and offer transfer speeds of up to 1500 MB/s reads, with up to 1700 MB/s writes; up to 250,000 IOPS 4K random reads, and up to 47,000 IOPS 4K random writes. Its MTBF is rated at 2 million hours, and it is backed by a 5-year warranty.

The more premium SkyHawk Ultra series comes in 1600 GB and 3200 GB variants, with sequential transfer speeds of up to 1700 MB/s reads, and up to 1200 MB/s writes, up to 250,000 IOPS random reads, with up to 83,000 IOPS random writes. These drives offer nearly triple the durability of the SkyHawk (standard) series, with 1.7 DWPD (vs. 0.6 DWPD of the SkyHawk standard); although their MTBF are rated the same, at 2 million hours, and are backed by the same 5-year product warranties.

Micron's Outlook for the Future of Memory: GDDR6, QuantX in 2017

After finally reaching mature yields (comparable to those of planar NAND processes), Micron's 32-layer first generation 3D NAND has grown increasingly prominent in the company's NAND output. Now, the company is looking to ramp-up production of their (currently sampling) 64-layer 3D NAND, promising "meaningful output" by the end of December 2017, looking for an 80% increase in total GB per wafer and a 30% decrease in production costs.

When it comes to the graphics subsystem memory, Micron is looking to transition their 20nm production to a "1x nm" (most likely 16nm) node, in a bid to improve cost per GB by around $20, with introduction of 16nm GDDR5 memory to be introduced later this year. However, GDDR5X volume is expected to grow significantly, in a bid to satisfy bandwidth-hungry uses through GPUs (like NVIDIA's GTX 1080 and potentially the upcoming 1080 Ti) and networking, with GDDR6 memory being introduced by the end of 2017 or early 2018. The company is still mum on actual consumer products based on their interpretation of the 3D XPoint products through their QuantX brand, though work is already under way on the second and third generation specifications of this memory, with Micron planning an hitherto unknown (in significance and product type) presence in the consumer market by the end of this year.

Soon: Kaby Lake-based Systems Carrying Intel Optane Solutions

Lenovo has recently released the specifications for their 2017 Thinkpad series line-up, with several models (T470p, L470, L570, T470, T570, X270 and Yoga 370) featuring the usual, evolutionary hardware improvements, such as being equipped with Intel's latest generation Kaby Lake processors and increased screen resolutions. However, one of the hardware announcements for the new Thinkpad series goes a little further than your usual, run-of-the-mill updates: these solutions will feature what is expected to be the first consumer-level adaptations of Intel's Optane technology.

PNY Announces the CS2030 Series M.2 NVMe SSD

PNY announced the CS2030 line of high-performance SSDs in the M.2-2280 form-factor. The drives take advantage of PCI-Express 3.0 x4 (32 Gb/s M.2 slots), and the NVMe protocol, and are available in two capacities - 240 GB and 480 GB. Combining a Phison PS5007 controller with MLC NAND flash memory, the drives offer sequential transfer-rates of up to 2,750 MB/s reads, with up to 1,500 MB/s sequential writes. 4K random access performance is rated by the manufacturer at up to 210,000 IOPS reads, and up to 215,000 IOPS writes. Backed by 3-year warranties, the 240 GB variant is priced at US $179.99, and the 480 GB variant at $329.99.

Silicon Power Announces High-endurance SD Cards

SP/ Silicon Power, a leading provider of memory storage solutions, launches its new High Endurance microSDHC/microSDXC cards especially designed for car video recorders, security cameras and surveillance systems. These write-intensive applications crucially depend on the highest level of reliability to provide trustworthy proof in the most decisive moments. Equipped with high-quality MLC NAND flash chips, SP's new high Endurance micro SDHC/microSDXC card meets this special requirement by achieving up to 12,000 hours of 64 GB Full HD video recording.

Additional key features for reliable and speedy performance are the card's built- in error correction code (ECC) function technology for high data transmission safety and full support of Ultra High Speed Class 3 (U3) specification.

SSD Pricing to Surge on the Back of NAND Shortages - Stock Your SSD Needs

Business. Business never changes. Whether you're for Keynes or Hayek, some truths just can't be escaped: and the one based on the market tending to equilibrium between the forces of supply and demand is oft times almost akin to a law of physics - other times, not so much. This time, it appears as if the market forces are steering NAND prices through the roof. The causes? Varied, though you probably carry one of them in your pocket most of the time. We earlier reported surging prices in the DRAM market, spurred by the Note 7 fiasco and increased production of that smartphone's competitors (and Samsung's own products) to fill the gaping hole left by its forcible market removal. But not only by DRAM are smartphones powered - they also make use of NAND flash.

Plextor Extends EX1 Portable SSD Warranty

Plextor today announced that it revised the warranty policy of its recently announced EX1 portable solid-state drive to be effective for 5 years, from its existing 3 years. This change is applicable to all products already sold and with retailers as unsold inventory. The EX1 is a series of portable SSDs with 10 Gb/s USB 3.1 host interface, with a single cable handling both power and host connectivity. The drives combine Silicon Motion-made controllers with SK Hynix 16 nm TLC NAND flash memory, and come in capacities of 128 GB, 256 GB, 512 GB, priced at 79€, 119€, and 213€, respectively.

Intel Readies TLC 3D NAND Flash Based 610P Series PCIe SSD for 2017

Intel is readying a follow-on to its 600P series performance-segment PCIe solid-state drive (SSD) series, with the 610P series. Built in the M.2-2280 form-factor, with PCIe gen 3.0 x4 bus interface, and support for the NVMe protocol, the SSD 610P will be based on TLC 3D NAND flash by IMFlash Technology, the company's joint-venture with Micron Technology. The SSD 610P series will come in capacities of 128 GB, 256 GB, 512 GB, 1 TB, and 2 TB.

The company is also working on a smaller M.2-1620 variant for notebooks and SFF desktops, which will feature a BGA version of the SSD. These are multi-chip modules of NAND flash stacks and SSD controllers bundled into single packages. The BGA variants will come in sizes of 128 GB, 256 GB, and 512 GB. Not much else (performance figures) are known about these drives, except that Intel plans to release these towards Q4 2017 (after September).

Source: Benchlife.info

Samsung Bundles "Watch_Dogs 2" with Select SSDs and Curved Gaming Monitors

Samsung Electronics America, Inc. announced an exclusive collaboration with Ubisoft, offering a free PC download of Watch_Dogs 2 with the purchase of qualifying Samsung solid state drives (SSDs) and its newest Curved Gaming Monitors. The partnership delivers gamers an incredible package for high-level gameplay.

"Samsung is dedicated to providing best-in-class technology to gamers, so we're excited to offer Ubisoft's highly anticipated Watch_Dogs 2 as an added value with our industry-leading SSDs and monitors," said Andrew Sivori, Vice President of CE-IT Marketing at Samsung Electronics America. "Our high-performance SSDs and stunning new monitors deliver an enhanced gaming experience, providing exceptional visuals and lag-free gameplay."

Transcend Announces the SSD230 Series with 3D NAND Flash

Transcend Information, Inc. (Transcend ), a leading manufacturer of storage and multimedia products, is proud to announce the launch of a brand new SSD with built-in 3D NAND flash. With the growing needs for high-capacity and high-performance storage, Transcend has adopted 3D NAND flash technology for its 2.5" SSD230 solid state drives, boosting storage capacity, transfer rates, and reliability all at once.

To achieve higher densities, 2D planar NAND flash technology shrinks each memory cell onto a single layer of cells. However, this technology increases cell-to-cell interference and hence reduces reliability as it approaches its physical scaling limit. 3D NAND flash was developed to resolve this bottleneck, as it features multiple layers of memory cells stacked vertically. 3D NAND flash not only resolves the density limitations of 2D horizontal NAND, but also boosts read and write performance, as it does not require the invocation of algorithms to prevent data corruption. Free from cell-to-cell interference, state-of-the art 3D NAND flash technology also features higher endurance and lower power consumption.

Toshiba Announces New-Generation Supreme+ eMMC Flash Storage

Toshiba America Electronic Components, Inc. (TAEC) has enhanced its lineup of managed NAND devices with the addition of new Embedded Multimedia Card (e-MMC) and Universal Flash Storage (UFS) embedded memory solutions. Featuring enhanced integrated controller technologies, the new 'Supreme+' e-MMC (JEDEC ver. 5.1) and UFS (JEDEC ver. 2.1) offerings deliver significant read and write speed improvements to demanding applications.

In contrast to raw NAND flash memory solutions, e-MMC and UFS devices integrate NAND flash memory and a controller chip in a single package. This saves space and relieves host processors of the burden of key memory management functions including bad block management, error correction, wear leveling, and garbage collection. As a result, e-MMC and UFS devices simplify design when compared to standalone memory ICs with a standard NAND flash interface.

Toshiba Expands 24nm SLC NAND Flash Lineup to Address Industrial Applications

Toshiba America Electronic Components, Inc. (TAEC) has expanded its family of 24nm single-level cell (SLC) NAND flash memory solutions. The new 16 gigabit (Gb) BENAND is housed in an industry-standard 48-pin TSOP package, and offers a combination of high read/write performance, effective write endurance (using 8-bit BCH error correction code), and extended temperature operation. This makes it suitable for a wide variety of commercial and industrial applications.

The new addition rounds out Toshiba's broad SLC product lineup, allowing designers to take advantage of the price/performance of advanced 24nm NAND flash SLC technology at densities from 1Gb to 128Gb. Based on a 4x4Gb die, 16Gb BENAND operates from a power supply of 2.7V to 3.3V with a temperature range of -40°C to 85°C. Many industrial applications have a long life expectancy. Toshiba designed BENAND with this in mind. With the ability to replace older generations of discrete SLC NAND, BENAND extends the product life of everything from telecom applications and LCD TVs to robots and printers - while also potentially reducing BOM costs.

Toshiba OCZ Announces the VX500 Series Performance SSDs

Toshiba company OCZ today announced the new VX500 line of performance SSDs in the 2.5-inch form-factor, featuring SATA 6 Gb/s interface. The drives are based on a new-generation platform by OCZ's parent company Toshiba. The drives combine Toshiba TC358790 controller with 15 nm MLC NAND flash memory chips by Toshiba. The drives come in capacities of 128 GB, 256 GB, 512 GB, and 1 TB, and offer price/GB comparable to TLC NAND flash-based drives; yet with performance comparable to high-end MLC NAND flash drives.

All four variants offer up to 550 MB/s sequential reads. The 128 GB, 256 GB, 512 GB, and 1 TB variants offer up to 485 MB/s, 510 MB/s, 515 MB/s, and 515 MB/s of sequential writes, respectively. Random access performance is rated around 90,000 IOPS reads, with up to 65,000 IOPS writes. The 128 GB variant is priced at US $63.99, the 256 GB variant at $92.79, the 512 GB variant at $152.52, and the 1 TB variant at $337.06. The drives are backed by 5-year warranty. Acronis TrueImage disk cloning software comes included.
Read our review of the VX500 512GB here.

Crucial Scraps the Ballistix TX3 PCIe SSD

Crucial today, in a statement to TechPowerUp stated that it has canceled the Ballistix TX3 PCIe solid-state drive launch. The company canceled the product on the basis of "prioritization of company resources and investments." The company however stated that it will continue to develop SSD products that target the gamer-enthusiast market that the Ballistix TX3 PCIe was intended for. "We are, however, continuing to explore potential opportunities for future gaming products and will provide an update as new plans are formalized," the company stated.

Crucial first unveiled the Ballistix TX3 at the 2016 Computex Expo, where it demonstrated its M.2 variants. The drives combined Silicon Motion's new SMI2260H processor with Micron-made 3D MLC NAND flash memory. The drive took advantage of 32 Gb/s PCIe and the new NVMe protocol to offer transfer rates up to four times higher than current performance-segment SATA 6 Gb/s SSDs.

Samsung Unveils Massive 32 TB SSD Leveraging 64-layer 3D V-NAND

At the 2016 Flash Memory Summit, Samsung unveiled a massive 32-terabyte solid state drive (SSD) for enterprise applications. The drive leverages the company's 4th generation, 64-layer 3D V-NAND flash memory, making it the company's highest-capacity SSD, upping the 15.36 TB drive the company unveiled in March, 2016. The drive is built in the 12 mm-thick, 2.5-inch form-factor, and features the SAS 12 Gb/s interface. At the summit, the company announced that it plans to have 100 TB SSDs ready by 2020.

Source: PC World

Toshiba Announces New BG SSDs with 3-Bit-Per-Cell (TLC) BiCS Flash

Toshiba America Electronic Components, Inc. (TAEC), a committed technology leader, will showcase its new BG series solid state drive (SSD) family featuring cutting-edge BiCS FLASH with 3-bit-per-cell TLC (triple-level cell) technology and Toshiba's new single-package ball grid array (BGA) NVMe PCI Express (PCIe) Gen3 x2 SSD at the 2016 Flash Memory Summit held in Santa Clara, California between August 8 - 11. Delivering a smaller footprint, lower power consumption and better performance than traditional storage options, the BG SSD series is purpose-built for the future wave of ultra-thin mobile PCs, including 2-in-1 convertible notebooks and tablets.

With a surface area 95 percent smaller than conventional 2.5-inch SATA storage devices and 82 percent smaller than M.2 Type 22806, the Toshiba BG series condenses both the controller and NAND flash memory in a single 16 mm x 20 mm BGA package enabling device manufacturers to prioritize features like battery capacity for longer operating times. The BG series is also available mounted on a M.2 Type 22307 module for applications requiring socketed storage. BG SSDs utilize BiCS FLASH, a three-dimensional (3D) stacked cell structure, making it possible to accommodate up to 512 GB of storage capacity in this high-performance and compact form factor. Additionally, the BG series SSDs utilize an in-house Toshiba-developed controller and firmware for a full, vertically developed solution, ensuring technology is tightly integrated for optimal performance, power consumption and reliability.

Western Digital Announces World's First 64-Layer 3D NAND Technology

Western Digital Corp. today announced that it has successfully developed its next generation 3D NAND technology, BiCS3, with 64 layers of vertical storage capability. Pilot production of the new technology has commenced in the Yokkaichi, Japan joint venture facilities and initial output is expected later this year. Western Digital expects meaningful commercial volumes of BiCS3 in the first half of calendar 2017.

"The launch of the next generation 3D NAND technology based on our industry-leading 64 layer architecture reinforces our leadership in NAND flash technology," said Dr. Siva Sivaram, executive vice president, memory technology, Western Digital. "BiCS3 will feature the use of 3-bits-per-cell technology along with advances in high aspect ratio semiconductor processing to deliver higher capacity, superior performance and reliability at an attractive cost. Together with BiCS2, our 3D NAND portfolio has broadened significantly, enhancing our ability to address a full spectrum of customer applications in retail, mobile and data center."
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