Qualcomm Technologies, Inc. today announced its collaboration with Google to bring the Snapdragon X Elite platform to the first Googlebook laptops. The collaboration builds on the leading performance, power efficiency and AI capabilities of Snapdragon X Elite paired with Googlebook, with built-in Gemini Intelligence to deliver proactive and personalized help that keeps you a step ahead. This new category of premium laptops enables cross-device experiences with Android phones and tablets powered by Snapdragon, including support for native Android applications and games for a seamless personal computing ecosystem.

Googlebook laptops powered by Snapdragon X Elite combine Google's Gemini with the incredible performance, efficiency, and connectivity of Snapdragon X Elite. Features like Cast my Apps, Magic Pointer, and Rambler help you stay more productive without breaking your flow by surfacing relevant information from emails, calendars, and on-screen content, delivering seamless phone integration and advanced security features, and building on native Android apps to enable connected, intelligent, and secure computing experiences from virtually anywhere. The global Android ecosystem enables users to create, learn, and even game on Snapdragon - with popular Snapdragon Elite Gaming features like faster frame rates and enhanced graphics also available on Googlebook laptops powered Snapdragon X Elite.

Today, HP Inc. (NYSE: HPQ) announced the HP Googlebook 14, a premium laptop designed to bring the best of HP craftsmanship and the performance and efficiency of the Snapdragon X Elite processor to the new Googlebook experience. Built for people who move fluidly between their phones, laptops, work, creativity and life, the HP Googlebook 14 combines Google Gemini, seamless Android phone synchronization and the premium performance and mobility needed to keep up with demanding days.

Designed to work seamlessly with supported Android devices, the HP Googlebook 14 helps bring phone and laptop together in a more connected experience. With features like Quick Access and Cast my Apps, users can move tasks from phone to laptop, access phone files directly from their laptop's file browser, open supported phone apps without additional installs, and move naturally between devices throughout the day.

Dell Technologies announced the XPS Googlebook, a 13-inch premium laptop, powered by the Snapdragon X Elite processor, and the first XPS device designed for Gemini Intelligence. Built for Android users and supercharged to power their most advanced workflows, the XPS Googlebook brings the premium materials of the XPS portfolio to the Googlebook platform for the first time.

Why it matters
The XPS Googlebook is the first Dell laptop built for Gemini Intelligence, marking an expansion of the XPS portfolio into a space where premium options have been limited. It brings together ecosystem integration with the design, materials and performance expected from XPS.

Google's collective effort to introduce a new generation of Gemini-powered laptops, called "Googlebook," has officially launched today. Now available on the Google storefront, Googlebooks are being produced by some of the biggest laptop OEMs, including ASUS, Acer, Dell, HP, and Lenovo. Starting with ASUS, the company has prepared a 14-inch Googlebook 14, powered by the Intel "Panther Lake" Core Ultra Series 3, with 16 GB of RAM and a 512 GB SSD. Acer offers a similarly named Googlebook 14 with comparable specifications, while Lenovo uses the same base but delivers a 15-inch screen. Dell and HP provide Googlebooks in a 14-inch body, powered by Qualcomm's Snapdragon X Elite processors, with 16 GB of memory and 512 GB of storage. Pricing ranges from $899 to $1,299, depending on the manufacturer and specifications.

Generally, Googlebooks follow a consistent philosophy across all models, featuring premium materials like aluminium, magnesium, and carbon fiber instead of traditional plastic. The screens on these models are also higher resolution. A key feature of these laptops is the integration of Android applications and Glowbar, along with Gemini intelligence throughout the operating system experience. Powered by Googlebook OS, the operating system is essentially a desktop version of Android that runs Android applications through the Google Play Store. The OS can run a Linux terminal, and since Android is a heavily modified version of Linux, Linux applications are also supported.

ASUS today announced ASUS Ascent QN10, the world's first AI mini PC featuring an 80 TOPS NPU, redefining AI computing in an ultracompact form factor. Powered by the latest Snapdragon X2 Elite platform with an 18-core Qualcomm Oryon CPU, Ascent QN10 exceeds Copilot+ PC requirements and delivers exceptional performance, responsive AI experiences, and outstanding energy efficiency.

With advanced on-device AI acceleration and enterprise-grade security, ASUS Ascent QN10 enables real-time AI workloads, intelligent content generation, productivity enhancement, and AI-assisted applications directly on the device. Designed for creators, developers, and enterprises, it empowers next-generation intelligent workflows in a compact yet powerful device, making it ideal for edge AI environments.

Valve has opened reservations for the Steam Frame, its standalone VR headset, with pricing starting at $1,059 for the 256 GB model and going up to $1,299 for the 1 TB version. We had already reported back in July that Qualcomm's own chip price hikes were pushing Steam Frame costs upward well before today's reveal. In an interview with Tom's Hardware, Valve engineer Pierre-Loup Griffais walked through why the final price landed where it did. Here's what he said:

"I think as far as memory prices and those kinds of conditions, we're really in it like everyone else. It's an unfortunate situation all around. We wish that gaming hardware was cheaper, but we're definitely trying to be on the cheapest side that we can get despite all those conditions. Even just things like motherboards, copper, anything, even shipping anything worldwide right now is way more expensive than it was last year and two years ago. So every part of the sticker price is affected there."

Samsung and Qualcomm are reportedly forming a 2.1D Packaging Alliance to provide customers with access to advanced chip packaging using bridges that connect silicon dies. Interestingly, Samsung and Qualcomm are developing an organic bridge technology that will serve as the adhesive to hold two chips together. For example, Intel already uses a similar approach with its Embedded Multi-die Interconnect Bridge (EMIB) advanced packaging, but it employs small silicon bridges. The new 2.1D packaging alliance will use organic bridges made from materials commonly found in traditional PCBs, such as organic polymer materials like epoxy and copper wiring, to interconnect multiple chips.

This organic bridge uses redistribution layers (RDL), formed by multiple layers of fine circuitry with extremely small wires and space between them. This makes the technology more similar to PCB manufacturing than silicon manufacturing, enabling packaging densities that closely match modern silicon-based EMIB. Reportedly, Samsung will manufacture this 2.1D package using multiple RDLs packaged inside a flip-chip ball grid array package. Ultimately, the company aims for the organic bridge's line width and spacing to be 1.5 to 2 micrometers each, with via sizes of 4 to 5 micrometers. Die-to-die pattern density is targeted at 500 to 1,000 per millimeter.

Intel is reportedly planning another 10% price increase on PC CPUs in October, according to DIGITIMES. This would be the latest in a string of price hikes made in stages over the past year. The report doesn't specify whether this price increase will affect only desktop CPUs or whether mobile CPUs will also be included. Industry sources cited by the outlet say the goal is to improve gross margin rather than growing market share. That would be especially important, since global PC shipments are expected to dip slightly from 260 million to about 250 million units in 2027, even as prices continue to climb. If Intel can push CPU shipments back up toward 200 million units, DIGITIMES estimates its market share could recover to roughly 78%.

The report also claims Intel is considering ending its low-margin Small Core product line entirely, which could open the door for Qualcomm and MediaTek to expand further into the industrial PC and IoT chip markets that Intel currently leads. On staffing, sources suggest another 5% to 10% of the workforce could be cut, following Intel's trim of its Data Center and AI group in July. Headcount reportedly sits around 75,000 now, though the same sources say Intel plans to keep hiring alongside any cuts, and that its current size is already reasonable.

EarFun, a leading name in audio innovation, today announced the launch of the Wave Pro X, the world's first dual-coaxial headphones with Qualcomm ANC technology and Auracast support. Set to release on 3rd September 2026, the Wave Pro X is defined by two signature innovations: Adaptive Real-time Hybrid ANC, a smarter, more responsive approach to noise cancellation, and DCAA (Dual-Coaxial Acoustic Architecture), an entirely re-engineered driver system built for uncompromising sound quality.

Rocky Deng, Chief Technology Officer at EarFun"The Wave Pro X represents a new benchmark for what wireless headphones can deliver. With Adaptive Hybrid ANC and our new DCAA acoustic architecture working together, we've built a headphone that listens to its environment and responds to it in real time—silencing the world around you while delivering sound with extreme precision."

Today at Lenovo Innovation World at IFA 2026, Lenovo announced the newest additions to the Lenovo Yoga portfolio, including two premium laptops powered by NVIDIA RTX Spark, two pen-first tablets, Lenovo Smart Canvas Concept, and newly released Lenovo Qira features. The additions span high-performance local computing for demanding creative and development workloads, natural interaction across multiple input modes, and connected experiences designed to help ideas move more easily between devices.

Creative work often moves across applications, devices, and ways of interacting. A project might begin as a sketch or a spoken idea, continue through editing, coding, or model development, and involve both individual and collaborative work. The latest Yoga portfolio brings together specialized devices and software experiences designed to support different stages of that process.

Today at Lenovo Innovation World 2026, Lenovo expanded its vision for Personal AI with its latest consumer portfolio of laptops, desktops, and smarter experiences. Together, the distinctive IdeaPad Vibe series and IdeaCentre AIO desktops give consumers a broader range of devices designed to reflect different lifestyles and everyday needs.

"The expectations people have for their PCs are changing," said Jun Ouyang, Senior Vice President & General Manager, Consumer Segment, Lenovo Intelligent Devices Group. "Consumers want technology that fits into their lives, whether they prioritize performance, entertainment, or a device that suits their individual style. Our latest Idea portfolio brings together AI-powered experiences, distinctive design, and greater choice without the premium price."

Today marks the day we see AMD's next-generation RDNA 5 GPU IP inside working silicon, but not in the form you might expect. Thanks to SemiAnalysis's die annotation of the Exynos 2700 SoC from Samsung, we see AMD's new GPU IP shine in a mobile form with the Xclipse 970 GPU. As earlier leaks reported, AMD and Samsung co-developed the Xclipse 970 GPU using AMD RDNA technology and adapted it for mobile. However, the GPU IP has now been upgraded to the latest RDNA 5, making this SoC technically the first RDNA 5-equipped chip that will be shipping. Built on Samsung Foundry's SF2 node, Samsung has designed this SoC with a unique 10-CPU core configuration and a strong GPU to compete with Qualcomm Snapdragon Elite SoCs.

On the CPU front, Samsung uses Arm's off-the-shelf CPU core IP, which includes C2-Ultra and C2-Pro. This setup features a single C2-Ultra big core running at 4.24 GHz, one C2-Ultra running at 3.36 GHz, four C2-Pro cores running at 3.74 GHz, and four C2-Pro cores running at 2.88 GHz, making a total of 10 CPU cores. On the GPU side, the Xclipse 970 packs eight GPU WGPs, each containing two Compute Units. This results in 16 CUs on the GPU front if everything remains the same with RDNA 5 and no changes to the WGP/CU ratio have been made by AMD since the last-generation RDNA 4.

Ahead of IFA, Qualcomm Technologies, Inc. today announced the Qualcomm Dragonwing Q-2390 and IQ-2390 processors, expanding the Dragonwing portfolio with highly integrated platforms designed to make intelligent edge computing more accessible to consumer, commercial and industrial segments. As demand grows for devices that can perceive, analyze and act on data locally, the Dragonwing Q-2390 and IQ-2390 processors are designed to bring AI, vision, connectivity and security to a broader range of connected devices, helping power the next wave of intelligence across homes, businesses, cities and factories.

"AI is creating a fundamental shift in how connected devices are designed and deployed, but many product categories still face barriers around cost, complexity and integration," said Jeff Arnold, VP & GM, Auto Telematics & Industrial & Embedded IoT Consumer and Connectivity, Qualcomm Technologies, Inc. "With the Dragonwing Q-2390 and IQ-2390 processors, we're enabling intelligence to scale across a much broader range of devices, from retail systems, smart appliances and consumer robots to industrial controllers, machine vision systems and critical infrastructure. Together, these platforms help bring advanced edge AI within reach of more customers and more industries than ever before."

Qualcomm Technologies, Inc. and HUMAIN, a PIF company delivering full-stack artificial intelligence (AI) capabilities globally, today launched Horizon Ultra, its next-generation AI PC, at LEAP 2026, unveiling a new personal computing experience designed and powered by the Snapdragon X2 Elite platform.

The launch follows more than 12 months of design and development by HUMAIN with support from Qualcomm Technologies, focused on building a new generation of personal computing centered on AI that runs directly on the device.

Arduino S.r.l., a subsidiary of Qualcomm Technologies, Inc., today opened pre-orders for Arduino VENTUNO Q, its most advanced edge AI platform to date, powered by the Qualcomm Dragonwing IQ8 Series. Now available worldwide, VENTUNO Q was built for developers, prioritizing familiarity and ease of use with the right software, accessories and extensions.

One Board to Sense, Decide, and Act
The VENTUNO Q has a dual-brain architecture, pairing a Dragonwing IQ-8275 processor, delivering up to 40 dense TOPS of AI performance, with 16 GB LPDDR5 memory, 64 GB eMMC and expandable M.2 NVMe storage, alongside a dedicated STM32H5 real-time microcontroller, enabling systems that don't just interpret sensor data but respond to it physically, immediately and offline.

According to Windows Latest, Microsoft's upcoming Windows 11 26H2 is expected to be one of the most uneventful releases in terms of new features. Instead, this release focuses on resetting the support cycles that Microsoft is implementing, rather than introducing major features or overhauls. For those who are not aware, Microsoft has altered its update approach for Windows 11 for some time now. Since Windows 11 24H2, the company has adopted a shared servicing model applied to the Windows 11 24H2 and 25H2 branches. Since late 2024, support and updates have been rolled out across every OS branch, with each new release cycle activating these features rather than leaving them dormant in the kernel. Enablement packages (eKB) are central to this process, as downloading an update essentially involves eKBs that activate certain functionalities.

For instance, on a device running Windows 11 24H2 or 25H2, a simple eKB is needed to upgrade to the latest Windows 11 26H2 version. For older versions like 22H2 and 23H2, which are on an older servicing branch, Windows 11 26H2 will be a full feature update. In terms of new functionality with 26H2, Microsoft's focus is on resetting the support cycle timeline. The 26H2 version will receive regular support for 24 months on Home and Pro versions, while Enterprise and Education versions will receive 36 months of support. Starting from 2026, this support will extend until October 2028 for Home and Pro, and until October 2029 for Enterprise and Education. For those already running Windows 11 24H2 and 25H2 with the latest updates and patches, 26H2 will not introduce any new features.

Qualcomm is finally unveiling the specifications of its entry-level, low-cost Snapdragon C platform. According to the specifications, the platform features up to eight Arm cores for systems expected to start around the $300 mark. In a market where DRAM and NAND Flash are extremely expensive, Qualcomm aims to give students, families, and basic office workers a modern laptop at a low price of just $300. Snapdragon C uses Qualcomm's Kryo CPU architecture, with frequencies reaching up to 3.0 GHz for single-core workloads and 2.0 GHz for multicore scenarios. The chip also includes 2 MB of cache, an integrated Adreno A643 GPU clocked at up to 900 MHz, and surprisingly a Hexagon NPU for lighter AI workloads. Qualcomm supports up to 16 GB of LPDDR4x, LPDDR5, or LPDDR5x memory, along with PCIe 3.0 NVMe storage, UFS 2.2/3.1, and a wide range of connectivity options. Interestingly, LPDDR4x memory might be less expensive compared to the others, which could make a $300 laptop dream feasible.

The company is comparing Snapdragon C against Intel's N250 "Twin Lake" platform and claims significant performance advantages while running on battery. Depending on the workload, Qualcomm reports gains ranging from 24% to 67%, with Cinebench showing the largest differences at 50% faster single-threaded performance and up to 67% better multithreaded performance. Geekbench and Speedometer, which may better represent everyday laptop usage, are also claimed to favor Snapdragon C. Qualcomm's figures also indicate substantially better efficiency, including 106% higher efficiency during Netflix playback, 68% during web browsing, and 74% during Teams video calls. The company promotes this chip for all-day battery life, although real-world runtime will heavily depend on the configuration chosen by each manufacturer.

The MacBook Neo made waves when it launched in early 2026, mostly due to its price and value but also partially due to the fun colors. If a new Windows Latest report, based on exclusive leaks, is to be believed, Lenovo is taking a stab at the fun, affordable laptop category with a new laptop called the IdeaPad Vibe. Pricing and availability are currently unknown, but it is said that the IdeaPad Vibe will target the same budget segment as the MacBook Neo, even though it will likely launch in a very unfavorable market.

The IdeaPad Vibe will reportedly be available with both AMD and Qualcomm Snapdragon Arm CPUs, although the leak didn't reveal which exact CPU models would be present. What is known about the IdeaPad Vibe is that it will be available in seven colors: pink, a mustard yellow, navy blue, silver, burnt orange, mint blue, and sage green. The actual design is reminiscent of a regular Lenovo Yoga device, with a fairly large trackpad, gray rounded keycaps, and a tapered keyboard deck.

In mid-May, Google announced that it is working on bringing its new Googlebook devices to the masses, with a promise to introduce a new operating system featuring integrated Gemini AI across the board. As the company collaborates with multiple OEMs, including Acer, ASUS, Dell, HP, and Lenovo, we have received the first leak of the Lenovo Googlebook 15 model. This model is set to offer a 15-inch experience of Google's upcoming "Aluminium" operating system. Thanks to a leak by Digital Citizen, we can see the first renderings of the Lenovo Googlebook 15, showcasing a sandblasted aluminium casing in a 15-inch body. The device features the traditional Lenovo bezel and overall design, housed in a medium-thickness body.

On the keyboard front, Lenovo has included a small "G" button with the Google icon, reminiscent of the Windows key on standard Windows-based laptops. Two speakers flank the keyboard, and the left side of the unit includes an HDMI port, a USB-C or Thunderbolt port, and a 3.5 mm headphone jack. On the right, there is another USB-C port, a USB Type-A port, and a slot similar to an SD card reader. Specifications such as display resolution, refresh rate, and details about the processor powering this PC are currently unknown, but we expect to learn more when Googlebooks officially launch. Scheduled for release in the fall of this year, we are still months away from the official debut.

Qualcomm Incorporated (NASDAQ: QCOM) today announced results for its fiscal third quarter ended June 28, 2026.

"Despite a challenging memory and supply environment, our third quarter results reflect solid execution of our growth strategy, with quarterly revenues at the high end of guidance," said Cristiano Amon, President and CEO of Qualcomm Incorporated. "We are well positioned to execute on the vision we outlined at our recent Investor Day, with total non-handset revenues growing to $40 billion by fiscal 2029 - nearly double the target we shared in November 2024. In the near term, we expect year-over-year growth in non-handset revenues, including Data Center, to accelerate from 24% in fiscal 2026 to greater than 60% in fiscal 2027 - a significant inflection point in the execution of our growth strategy."

Valve's hardware portfolio has experienced significant pricing fluctuations due to various supply chain changes related to memory, storage, and now processor price hikes. According to Bloomberg, Qualcomm, the main chip supplier for the upcoming Steam Frame VR headset, is increasing its prices by double-digit percentages. This means that Valve's upcoming Steam Frame headset will face an unexpected price increase. Initially, Valve planned to use the Snapdragon 8 Gen 3 processor with 16 GB of unified LPDDR5X RAM and up to 1 TB of storage capacity. However, Bloomberg now confirms that Qualcomm is raising its processor costs for all customers, which is driving up expenses.

For Qualcomm, declining smartphone sales, due to the higher cost of DRAM and NAND Flash, have led to reduced sales of the smartphone SoCs that power these devices. As a result, the company has felt supply chain pressures across multiple sectors and is now attempting to recover by increasing chip prices across the board. The Qualcomm Snapdragon 8 Gen 3 will see a double-digit percentage price increase, meaning anything from 10% and upwards is possible. If the price increase is substantial, combined with limited availability of LPDDR5X memory and SSD storage, the Steam Frame VR headset launch might not align with Valve's original plans.

GIGABYTE formally launched the X870 AORUS Infinity Socket AM5 motherboard for competitive overclockers. The board was part of GIGABYTE's G.Skill Computex Memory OC competition, and was a part of the company's 40th Anniversary showcase. Although built in the ATX form-factor, this board features a layout that's optimized for test benches, and not cases. Most of its key connectors are pointed sideways, such as its 24-pin ATX power input, while there's a conveniently organized onboard control panel with two sets of ISA 80h readouts, and SMD buttons, which include a cold reboot button. The CPU socket is rotated 90° CCW to enable the memory slots to line its top edge.

The board draws power from a combination of one 24-pin ATX, two 8-pin EPS, and an 8-pin PCIe power supplementary input that enables 65 W USB-PD on the type-C ports. The board features an 18+2+2 phase CPU VRM that uses 110 A DrMOS and high-grade tantalum capacitors. This is among the rare few high-end motherboards that use a 10-layer PCB. The CPU socket is wired to two DDR5 DIMM slots in a 1-DIMM per channel topology that's best suited for memory overclocking, particularly tightening memory timings. It is also wired to two M.2 NVMe Gen 5 x4 slots, and two PCI-Express 5.0 x16 slots (x8/x8 Gen 5 when both are populated). The AMD X870 chipset puts out a third M.2 slot, which runs at Gen 4 x4 speed.

Retro handhelds have always held a special place in the hearts of gaming enthusiasts—an enduring symbol of nostalgia and passion. As the retro gaming wave continues to grow, Ayaneo once again brings classic design and modern evolution into a new balance. The next-generation Ayaneo Pocket Micro 2 is officially on its way. Built upon the Ayaneo REMAKE design philosophy, it preserves the spirit of the classic horizontal retro handheld while delivering a comprehensive redesign and upgrade across aesthetics, performance, and control experience. For players who continue to cherish the pixel era and the golden age of handheld gaming, this is more than a new device—it's a revival of memories once thought distant.

Ayaneo Pocket Micro 2 continues Ayaneo's signature minimalist design language, reinterpreting the fusion of classic proportions and modern premium craftsmanship within a compact body. The CNC all-metal frame, combined with layered contours and rounded transitions, creates a fuller and more ergonomic grip while maintaining a lightweight and refined form factor. We've also introduced creative new color options to extend the retro identity—transforming nostalgia from something remembered into something newly expressed.

Yesterday, Qualcomm announced its High Bandwidth Compute (HBC) product, a memory-compute solution hybrid designed to replace traditional High Bandwidth Memory (HBM) and offer greater performance, efficiency, and throughput. HBC utilizes LPDDR memory, stacking them across multiple layers in a 3D vertical space and interconnecting them with through-silicon vias (TSVs). This approach provides better energy efficiency than traditional HBM, which stacks regular DDR in vertical layers, as the low-power DDR (LPDDR) chips consume less power while delivering similar bandwidth and capacity. Qualcomm has successfully stacked multiple LPDDR layers on top of each other, with the base of the HBC being a compute die that performs near-memory computation and offloads some processing from the main processor.

This technique is similar to what HBM4 memory currently does, with the base die being a logic die to better integrate compute solutions underneath for packet tracing and data preparation for entering and exiting HBM. However, Qualcomm aims to achieve higher efficiency and more optimized data movement, with a 6x increase in bandwidth per watt compared to the current HBM specification, likely HBM4. HBC Gen 1 achieved 133 TB/s of bandwidth on the AI250 accelerator card, a 18x increase over the LPDDR5X currently used in the AI200 card from Qualcomm. The company also claims there is a viable roadmap for using HBC across many Qualcomm AI accelerators, with HBC Gen 1 shipping with the AI250 AI accelerator in mid-2027. The next-generation HBC Gen 2 is expected to yield further significant gains in bandwidth.

Qualcomm Technologies, Inc. and Meta today announced a strategic multi-generation collaboration for Qualcomm Technologies to be a supplier for data center CPUs for Meta. Qualcomm Technologies' data center CPU, the Qualcomm Dragonfly C1000, is planned to power Meta's next-generation server fleet, underscoring the growing importance of high-performance, power-efficient compute in large-scale scale-out environments.

Qualcomm Technologies' solutions will be in production starting in the second half of 2028 and future data center capacity expansions. Qualcomm Technologies' platform approach, spanning advanced compute, high-performance connectivity, and system-level optimization, is designed to deliver substantial performance per watt and help reduce total cost of ownership at scale.