Qualcomm Technologies, Inc. (NASDAQ: QCOM) today announced at its Investor Day, new data center solutions, including the Qualcomm Dragonfly C1000 CPU, Qualcomm High Bandwidth Compute (HBC), Qualcomm Dragonfly AI300 inference accelerator, and connectivity products, together with custom silicon solutions, all engineered to maximize performance per watt and token throughput at lower total cost of ownership. The new platforms highlight Qualcomm Technologies' growing role in building full-stack data center infrastructure optimized for AI, spanning agentic and data-center-class CPUs, AI inference accelerators, high-performance connectivity, and at scale custom silicon solutions. The Qualcomm Dragonfly AI300 joins the previously announced Qualcomm Dragonfly AI200 and AI250 in its data center solutions portfolio with an annual cadence AI accelerator roadmap.

"Agentic AI is driving a significant increase in demand for AI inference in the data center. As these become the dominant workloads, infrastructure has to deliver much higher performance at lower power and cost," said Cristiano Amon, President and CEO, Qualcomm Incorporated. "That plays directly to Qualcomm's strengths, and we're well positioned for this shift. With Qualcomm Dragonfly, we're bringing our high-performance, low-power computing into the data center, with multi-year, multi-generation agreements with leading customers."

Qualcomm Technologies Inc. today announced at Augmented World Expo the Snapdragon Reality Elite Platform, designed to power immersive spatial computing experiences with stunning visual fidelity and deeply integrated on-device AI across a spectrum of form factors. It will power high-performance all-in-one video-see-through (VST) headsets and lightweight tethered optical-see-through (OST).

"XR adoption continues to expand, with more than 60 million devices already in market and growing momentum across industries." said Ziad Asghar, Senior Vice President and General Manager of XR, Wearables and Personal AI. "As more advanced and integrated XR platforms are developed, demand is increasing for XR technologies that deliver higher performance, greater intelligence, and improved power efficiency. Snapdragon Reality Elite is designed to meet those demands with powerful on-device AI, enabling faster, longer-lasting, and more immersive experiences, and reinforcing our leadership in VR and MR as we build purpose-built XR chipsets from the ground up."

TechPowerUp today released the latest version of TechPowerUp GPU-Z, the graphics subsystem information, monitoring, and diagnostics utility for gamers and PC enthusiasts. Version 2.70.0 improves the security of the kernel-mode driver of the application, and you are highly encouraged to update to this latest version. This latest update also adds support for a whole range of new GPUs.

To begin with, support is added for Qualcomm Adreno 741, Snapdragon X2 Elite, Adreno 778G, and Adreno 782G iGPUs. Support is also added for Intel Arc Pro "Battlemage" B70 and B65 graphics cards; the A60 engineering sample, and certain Core "Alder Lake" engineering samples. Over in the NVIDIA front, support is added for NVIDIA RTX 6000D, RTX PRO 500 "Blackwell" Embedded GPU; Tesla V100-DGXS 32 GB; and PG500-216. Graphics card vendor detection has been added for AWES and HKC or Sambada.

DOWNLOAD: TechPowerUp GPU-Z v2.70.0The change-log follows.

At Computex 2026 in Taipei, NVIDIA invited the press to a hands-on walkthrough of the RTX Spark platform, spread across multiple rooms covering gaming, creator, and AI workloads. Everything ran on Microsoft Surface Laptops, and Microsoft was also present—a clear signal that Redmond is fully committed to making Windows on Arm succeed this time around. Microsoft revealed that it has made several kernel-level optimizations to Windows 11 specifically for RTX Spark, changes that notably were never made for Qualcomm's Snapdragon platforms.

At the heart of RTX Spark is the NVIDIA N1X chip, which pairs a 20-core NVIDIA Grace Arm-based CPU with a Blackwell RTX GPU packing 6,144 CUDA cores and 5th Generation Tensor Cores with FP4 math precision, all connected via NVLink-C2C. The chip supports up to 128 GB of LPDDR5X unified memory in a 45-80 W power envelope (H-segment), and NVIDIA claims up to 1 petaFLOP/s of AI compute. A lower-end N1 variant with 5,120 CUDA cores is also planned. RTX Spark is not strictly a laptop platform either—NVIDIA also showed compact desktop mini PCs and the DGX Spark, targeting creators and developers who want the same silicon in a stationary form factor. And, looking at that power envelope, I wouldn't be surprised if N1X (or a variant) eventually ends up in a handheld gaming console—it just makes a lot of sense. A chip like this could also compete with semi-custom AMD chips for the next Xbox or PlayStation.

Radxa today announced that its upcoming AI NAS products, DragonStation and DragonBay, will ship with Fygo OS pre-installed, providing users with a complete private cloud and local AI experience right out of the box. Built on Qualcomm's high-performance computing platform, DragonStation and DragonBay combine powerful hardware with the intelligent software capabilities of Fygo OS, enabling users to securely store, manage, search, and interact with their data while maintaining full ownership and privacy.

As AI workloads increasingly move from the cloud to local infrastructure, users need systems that can not only store data, but also run AI services, process media, and support modern personal and team workflows. DragonStation and DragonBay are designed to meet that need.

Qualcomm Technologies, Inc. today announced the Snapdragon C Platform, a new entry-tier processor designed to make modern personal computing more accessible to students, families, and small businesses. Snapdragon C delivers responsive performance, cool, quiet designs and incredible all-day battery life in entry-tier laptops targeting $300 and up.

Snapdragon C supports smooth web browsing, video streaming, and productivity. It also includes an integrated NPU for AI capabilities in the entry-tier. Snapdragon C is engineered for power efficient everyday computing experiences people rely on in entry-level laptops without sacrificing portability or all-day battery life. The platform is designed for consistent performance of daily workloads in cool, quiet designs.

Every IT leader and partner we work with is navigating the same challenges: AI is changing the demands of how teams work, security threats are growing more sophisticated and agents are changing investment decisions for the future. All under greater scrutiny than ever before. The decisions organizations make now about their PC fleet will determine whether they lead through this transformation or spend years trying to catch up.

Microsoft builds Surface to meet these demands. From silicon to software, Surface hardware brings security, hybrid AI capability and intentional design into one integrated platform, so customers do not have to compromise to meet their business outcomes. For customers and partners charting a path forward, Surface is the foundation that makes the rest of the strategy possible:

With the launch of the Steam Controller now firmly behind us and shipping slowly getting some momentum, gamers have started speculating about the two remaining products in Valve's 2026 hardware line-up: the Steam Machine and Steam Frame. Now, an update to Valve's Proton 11 Beta 3 indicates that Valve has updated FEX, the Arm64-x86 emulator to run traditional x86 games on the Frame's Qualcomm Snapdragon 8 Gen 3 Mobile SoC. The update brings Proton up to FEX-2605, which includes performance improvements for 32- and 64-bit games, improved stability with controllers, and support for newer Qualcomm chipsets.

In addition to the Proton updates, the Steam Frame also now appears on Qualcomm's XR/VR/AR Finder page, where it lists the device's SoC and said that it features "advanced CPU and GPU performance, AI acceleration, and fast connectivity," so there's nothing really of substance there in terms of specifications. It is notable, though, that the Steam Frame is making more and more appearances in the news cycle, thanks to these sorts of updates and the most recent updates to the Steam Store's hardware page. These, along with recent signs that Valve is stocking up US warehouses with both Steam Machine and Frame hardware may be signs that Valve will stick to its original "first half of 2026" launch promises with an imminent launch for the Steam Frame.

Google launched its "Googlebook" laptops yesterday, introducing a new intelligent platform that leverages Gemini AI, succeeding its Chromebook offerings. Initially, it was unclear what hardware Google would use for its upcoming laptop models. However, Intel announced that it has been collaborating with Google on these models, with Intel Core processors at the core of the platform. Google is likely to pair these laptops with Intel's latest Core Series 300 "Wildcat Lake" processors, which the company recently launched. This means that Googlebooks will feature an x86 platform based on Intel processors, with six CPU cores consisting of two "Cougar Cove" P-cores and four LPE "Darkmont" cores. They will also include an NPU 5 with 40 TOPS of INT8 data, an Xe display and media engine, and a GPU with up to two Xe3 cores, all built on Intel's 18A internal node.

However, Intel will not be the exclusive platform provider for Googlebooks. In an exclusive interview with Google VP John Maletis, ChromeUnboxed learned that Google has set strict requirements for its OEM partners, including specifications for CPU, memory, keyboard layout, and storage configurations for its upcoming devices. Since launch partners will also include Qualcomm and MediaTek, we can expect to see Arm-powered Googlebooks as well. Acer, ASUS, Dell, HP, and Lenovo will be participating in the launch of the new Googlebook lineup, with devices reportedly arriving this fall.

Qualcomm Technologies, Inc. today announced the Snapdragon 6 Gen 5 Mobile Platform and Snapdragon 4 Gen 5 Mobile Platform, expanding its portfolio with next-generation capabilities designed for real-world experiences. By focusing on the technologies users rely on most, these platforms strengthen Snapdragon's mobile offerings with stronger performance and extended battery life.

Introducing Snapdragon Smooth Motion UI
Snapdragon 6 Gen 5 and Snapdragon 4 Gen 5 introduce Snapdragon Smooth Motion UI to enhance device interactions with seamless, lag-free navigation. Snapdragon 6 Gen 5 delivers 20% faster app launches and 18% less screen stutter for more immersive and reliable performance. Focused on the essentials, Snapdragon 4 Gen 5 enables smooth, all-day responsiveness with 43% faster app launches and 25% less screen stutter.

Qualcomm Incorporated (NASDAQ: QCOM) today announced results for its fiscal second quarter ended March 29, 2026.

"We are pleased to deliver results in line with our guidance, reflecting solid execution as we navigate a challenging memory environment," said Cristiano Amon, President and CEO of Qualcomm Incorporated. "We are in a period of profound industry transformation—the rise of AI agents is reshaping our roadmap across every platform we develop. We are equally excited by our entry into the data center, where a leading hyperscaler custom silicon engagement is on track for initial shipments later this calendar year. We look forward to providing an update on our growth initiatives, including opportunities in Data Center and Physical AI, at our Investor Day on June 24."

ASUS today announced the availability of two new all-in-one desktop PCs at Best Buy: the ASUS V400 AiO and the ASUS V600 AiO. Designed for families, students, and anyone who wants a large, clutter-free screen without the complexity of a traditional PC setup, both models are now available at Best Buy.

Both feature on-device AI capabilities, vibrant FHD touchscreens with 100% sRGB color accuracy, and a keyboard and mouse included in the box. The V400 is a milestone: the first all-in-one computer powered by the Snapdragon X platform, delivering a 24" display in an ultra-slim, whisper-quiet design. The V600 goes bigger with a 27" screen, a 93% screen-to-body ratio, and a profile that's 25% thinner than its predecessor. With more households sharing devices across remote work, school, and entertainment, an all-in-one offers the screen size and comfort of a desktop with none of the setup complexity.

We've already seen large swathes of the PC hardware market get drastically affected by the ongoing DRAM and general hardware crisis, from Valve's upcoming Steam Machine to pre-built desktop PCs. Now, it seems as though it's Microsoft's turn with its Surface device line-up, which has seen a price increase of anywhere between $200 and $500, depending on the exact model. The price increases mean that the 13-inch Surface Pro with the Qualcomm Snapdragon X SoC, 16 GB of RAM, and 512 GB of storage increases by $300 to $1,499; while the 12-inch Surface Pro with the Snapdragon X, 16 GB RAM, and 256 GB of storage increases from $799 to $1,049; the 13-inch Surface Laptop with the Snapdragon X Plus, 16 GB RAM, and a 256 GB SSD increases from $899 to $1,199; the 13.8-inch Surface Laptop with the same SoC and RAM but 512 GB of storage increases from $1,199 to $1,499; and the Surface Laptop 15-inch with the Snapdragon X Elite SoC, 16 GB of RAM, and 256 GB of SSD storage sees a price hike from $1,499 to $1,599.

Microsoft confirmed in a statement to Windows Central that the price increases were a direct result of the current hardware constraints, with a Microsoft representative stating "Due to recent increases in memory and component costs, Surface is updating pricing on Microsoft.com for its current-generation hardware portfolio. We remain committed to delivering value to customers and partners while upholding our standards for quality and innovation." This news comes just after we reported that DDR4 spot prices have seen a marginal decrease. Microsoft's Surface line-up has never been the best value when it comes to Windows laptops, and they'll likely be an even tougher sell after the price hikes, especially with Apple's recent introduction of the hyper-popular $600 MacBook Neo and with the somewhat limited app and feature support that comes with Qualcomm's Snapdragon SoCs and Windows on Arm.

Yesterday, Qualcomm introduced its Snapdragon X2 Elite series of chips to consumers in partnership with major OEMs like ASUS and HP. On the same day, ASUS released additional laptop models based on Intel and AMD SoCs. However, just a day after some media outlets published their reviews, ASUS increased the prices of its products through its launch partner distributor, Best Buy, significantly affecting some reviewers' conclusions. Reportedly, ASUS raised prices by $100 to $350, depending on the laptop model and configuration, regardless of the platform. This is a substantial change; for example, a $350 increase on a $1,000 model like the Zenbook 14 represents a one-third increase in the device's advertised price. Reviewers, such as those at TechPowerUp, evaluate the model based on its value. If a model is aimed at budget users, the perspective of a budget user is applied, and if a model is aimed at workstation users, a small price increase may not be a dealbreaker. However, in the $1,000 range for a laptop, ASUS is now pushing these laptops into a completely different category.Below is the price change, broken down by model. On the left is the launch pricing listed by ASUS, and on the right is the new pricing from Best Buy as of today.

Continued investment in AI infrastructure by major CSPs, including purchases of GPUs and deployment of in-house ASICs, has driven strong growth among AI-related chip designers, according to TrendForce's latest findings. In 2025, the total revenue of the top 10 fabless IC design houses exceeded US$359.4 billion, up 44% YoY. NVIDIA maintained its leading position, while Broadcom moved up to second place due to increased involvement in AI, overtaking Qualcomm, which continues to depend more heavily on consumer electronics.

Industry leader NVIDIA delivered another year of record revenue, supported by its strong AI chip portfolio and computing ecosystem. The company's fourth quarter revenue from data centers accounted for as much as 90% of its total. Full-year revenue rose 65% YoY to $205.7 billion—the fastest growth among the top players—with its share of total top-ten revenue increasing further to 57%.

Advantech (2395.TW), a global leader in industrial IoT, today announced an expanded collaboration with Qualcomm Technologies, Inc. to accelerate the deployment of generative AI (GenAI) at the edge. This collaboration centers on Advantech adopting the Qualcomm Dragonwing AI on-prem appliance solution, powered by Qualcomm Cloud AI 100 Ultra accelerator into the Advantech SKY-641E3 4U high-performance edge server. By utilizing a specialized PCIe switch backplane, this solution provides the high-bandwidth connectivity required to unlock the full potential of high-density AI inference for enterprise and industrial verticals.
Unmatched Inference Density for Massive Concurrency

Unlike standard dual-slot GPU servers, the SKY-641E3 is architected specifically for maximum inference throughput. By supporting up to 12 single-slot FH/FL accelerators within a single 4U chassis, it offers a superior density-to-footprint ratio. This configuration is optimized for high-concurrency edge workloads, such as city-wide intelligent video analytics or large-scale retail AI agents, allowing for the simultaneous processing of hundreds of real-time data streams without the thermal overhead of power-hungry training GPUs.

Ahead of Embedded World, Arduino announced the upcoming launch of its newest platform to democratize edge AI, Arduino VENTUNO Q. Named after the Italian word for twenty-one, VENTUNO Q builds on the iconic legacy of the popular Arduino UNO family and embodies the company's coming of age as it prepares to celebrate its foundation's 21st anniversary, later this month.

At the Edge of Intelligence: Where AI Takes Action
VENTUNO Q unites high-performance AI compute with deterministic real-time control, enabling systems that don't just interpret the world—they interact with it.
The board builds upon a dual-brain architecture similar to Arduino UNO Q, yet significantly upgrades capabilities leveraging the Qualcomm Dragonwing IQ8 Series for both traditional and generative AI workloads, supported by NPU acceleration delivering up to 40 dense TOPS, as well as a dedicated STM32H5 microcontroller for low-latency actuation and motor control. In addition, VENTUNO Q comes with 16 GB RAM—able to handle concurrent inference and complex multitasking—and an expandable 64 GB of storage.

At MWC 2026, Fibocom unveiled its new 5G SoC Dongle solution series, designed with an all-in-one SoC architecture that integrates high-performance 5G communication, an intelligent operating system, and flexible eSIM/vSIM services. This solution aims to deliver a cost-efficient and scalable 5G terminal option for the global mobile broadband market.

SoC Integration: Redefining 5G Terminal Efficiency
The highlight of Fibocom's 5G SoC Dongle lies in its high-performance SoC-based architecture, offering advantages in performance, cost, intelligent interaction, and application flexibility.

• Performance Leap: Equipped with an octa-core CPU (up to 2.3 GHz) and Adreno 613 GPU, the dongle delivers exceptional data processing power alongside ultra-fast 5G connectivity.
• Cost Efficiency: The SoC's high level of integration minimizes peripheral components and optimizes hardware design. This not only improves production yield but also significantly reduces development and material costs, providing strong pricing competitiveness for operators and enterprise customers.

Qualcomm Technologies, Inc. today announced its industry-leading Wi-Fi 8 portfolio, a key step toward building the connectivity foundation for the AI era. The comprehensive portfolio features the Qualcomm FastConnect 8800 Mobile Connectivity System and five new Qualcomm Dragonwing Networking Platforms. Each is engineered to deliver the connectivity and compute performance required to anchor a new generation of products, leveraging unparalleled intelligence with breakthrough architecture for today's AI demand realities.

"Today's network traffic profile is fundamentally changing as AI-fueled demand requires a re-thinking of the core architecture. Qualcomm Technologies is redefining that architecture to enable AI everywhere," said Gautam Sheoran, Senior Vice President and General Manager, Connectivity, Broadband and Networking, Qualcomm Technologies, Inc. "Next-gen networks and devices not only need to be AI-native, but they need a new breed of intelligent, high performance connectivity. Qualcomm Technologies' Wi-Fi 8 generation of products is the whole package: faster speeds, higher reliability, longer range, and powerful AI."

The head of Intel Foundry, Kevin O'Buckley, is leaving the company to join Qualcomm. He will take on the role of Executive Vice President of Global Operations and Supply Chain at Qualcomm, effective March 2, 2026. At Qualcomm, O'Buckley will oversee global semiconductor operations, including manufacturing engineering, foundry and supplier partnerships, supply chain, and procurement. He joins after less than two years leading Intel Foundry, where he served as Senior Vice President and General Manager of Intel Foundry Services. Previous to joining Intel, O'Buckley was working at IBM, GlobalFoundries, and Marvell. At Qualcomm, he will be responsible for scaling manufacturing partnerships and overseeing how the chip designs transition into volume production.

Intel Foundry will now be led by Naga Chandrasekaran, who steps into an expanded role overseeing both technology development and manufacturing operations. As Chief Technology and Operations Officer and head of Intel Foundry, Chandrasekaran will supervise next-generation process node development, advanced packaging, test technologies, and day-to-day execution across Intel's global fabrication and assembly network. Chandrasekaran previously led front-end process technology development and manufacturing, already overseeing both the Technology Development (TD) organization and the Foundry Manufacturing and Supply Chain (FMSC) group since mid-2024. Navid Shahriari will continue to manage packaging development and operations within Intel Foundry.

Late last October, Qualcomm revealed its AI200 and AI250 chip-based accelerator cards, and racks. Oddly, the company's press material mentioned the utilization of Low-Power DRAM (LPDDR) memory rather than in vogue High Bandwidth tech (HBM)—the latter has quickly become the de facto choice for cutting-edge AI-crunching enterprise platforms. Modern types of LPDDR memory are normally found in portable devices powered by Qualcomm chipsets, but the San Diego-headquartered fabless semiconductor firm seems to be exploring the deployment of LPDDR6X modules in server-grade equipment. According to inside track information—published by The Bell South Korea—Samsung Electronics has reportedly sent prototype LPDDR6X samples of to the House of Snapdragon chips.

One of The Bell's anonymous industry sources opined that this move was a little bit out of the ordinary; given that the LPDDR6 (non-X) standard received official JEDEC certification not that long ago (Q3 2025). The still in-progress Samsung LPDDR6X development project has been linked to Qualcomm's 2027 launch of the AI250 inference-focused server platform. The publication's official contact believes that a tight AI200-series release roadmap has prompted the very early supply of LPDDR6X modules. Last month, rumors emerged about the AI200 and AI250 inference accelerators being sized up with SOCAMM2 in mind. In December, the Samsung Memory Product Planning Team divulged forthcoming branches of non-X tech—most notably that "low-power DRAM technologies such as SOCAMM" are being spun-off from "AI-focused module solution(s) leveraging LPDDR6 architecture."

Microsoft's Windows 11 26H1 update, initially expected to offer only new silicon support without a host of new features, is now dedicated exclusively to new and upcoming Arm-based processors like the Snapdragon X2 Elite/Plus. This marks a significant shift in Windows 11's development path—a first divergence in Windows deployment in the recent timeline, and a first for Windows 11. As a result, regular PC users with x86-64 and older Arm-based platforms will continue to use the Windows 11 25H2 as a feature update. According to the latest Windows IT Pro Blog, "Windows 11, version 26H1 is not a feature update for version 25H2," indicating that a different version will serve as the next feature update for Windows 11, rather than the anticipated 26H1.

Microsoft is concentrating on providing full support for the new Windows-on-Arm platforms, some of which are already available. These platforms include Qualcomm's Snapdragon X2 Elite processors and NVIDIA's N1 and N1x SoCs. This new hardware requires optimization from Microsoft to ensure the best experience on Windows 11, so the company is dedicating most of its efforts for the 26H1 update to this task. Since new silicon requires fine-tuning, such as specific power profiles and hardware optimizations to extract maximum performance, Microsoft is separating Windows 11 into another branch to make sure that servicing and updates are easier, and also that shipping customized power/performance settings doesn't end up corrupting the build for non-Arm CPUs.

As the news cycle approached Christmas (2025), rumors emerged of other smartphone chip manufacturers considering an adoption of Samsung's intriguing "Heat Path Block" (HPB) technology. By the middle of January, the Fixed-focus digital cameras Weibo account surmised HPB being picked up by "many chip manufacturers that commonly use Android chips." Earlier today, a leaked "SM8975" packaging set of schematics seem to show Qualcomm's integration of a Samsung-designed Heat Path Block into a next-gen Snapdragon mobile chipset. The latest finding—again, courtesy of Fixed-focus digital cameras—indicates the speculative Snapdragon 8 Elite Gen 6 Pro model borrowing a key piece of heatsink technology from Samsung's soon-to-be-launched Exynos 2600 SoC.

By the end of last week, multiple news articles claimed that Qualcomm was borrowing the HPB design from an arch-rival. The San Diego, California-headquartered fabless semiconductor specialist's recent flagship processors have enjoyed high placements in terms of benchmark results, but these cutting-edge chips have seemingly hit thermal limit barriers—even when combined with expensive vapor chamber-based cooling solutions. Samsung Foundry's HPB is placed over and in contact with the chipset die, without any blockage (unwantingly) enabled by a layer of DRAM. Instead, the latter aspect is moved to the side (refer to the fourth image below). Reports from late last year mentioned Qualcomm and Apple being the two main (external) frontrunners of HPB adoption, outside of Samsung pioneering the way with its 2-nanometer Exynos 2600 application processor.

HiBy has officially announced the latest member of W Series, the HiBy W4. It is a brand-new DAC/AMP with portable and fashionable design, like an all-around swingman with dual modes, playing back Hi-res music in wired & wireless. With W4's release, HiBy aims to merge the convenience in wireless and high-fidelity in wire together.

To cover the scenarios, HiBy W4 features a flexible design with clip-on and magnetic attachment. Clip it anywhere for on-the-go. And the magnetic design fits to some smartphones or phone cases, used as a "MagSafe" accessory. The Uncharge Mode which is implemented in HiBy Digital Audio Player, isolates power supply from the smartphone, prevents draining phone's battery, and reduces interference. It builds in a 1500mAh battery to ensure a longer playing time.

Qualcomm Incorporated (NASDAQ: QCOM) today announced results for its fiscal first quarter ended December 28, 2025.

"We are pleased to deliver strong quarterly results, with record total company revenues," said Cristiano Amon, President and CEO of Qualcomm Incorporated. "Our momentum across personal, industrial and physical AI is growing, as evidenced by recent product announcements at CES and customer traction. While our near-term handsets outlook is impacted by industry-wide memory supply constraints, we are encouraged by end-consumer demand for premium and high tier smartphones, and remain on track to achieve our fiscal 2029 revenue goals."