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ASML Considers Price Increase for Low-NA EUV, TSMC Unhappy

According to the latest information from the second quarter financial results, ASML is considering raising prices for its Low-NA EUV tools, which is reportedly upsetting its customers. ASML CFO Roger Dassen has noted that the company is looking into price increases for these tools, aligning its pricing strategy with product value. As the company continues to enhance the productivity of its tools, ASML plans to adjust pricing accordingly. The company operates a business unit called Installed Base Management, which focuses on maintaining and improving existing machines. Most of the recent productivity gains have come from ASML's software that operates EUV machines, and the company recently confirmed that:
ASML CFO Roger DassenWhen it comes to Low-NA pricing, of course, you know that we keep on increasing the productivity of the Low-NA tool. Of course, that gives us a pretty strong runway for potential price improvements going forward... Value-based pricing is the concept that we follow within ASML. In the current environment, of course, the value for customers is higher than in other circumstances.

Patriot Memory Announces Viper Steel 5 Infinite DDR5 Memory with Speeds up to 8000 MT/s

Patriot Memory, a global leader in performance memory and storage solutions, today announced the upcoming launch of its Viper Steel 5 Infinite DDR5 memory kit. Designed for high-end gaming, professional content creation, and PC modding, the new series features a patent-pending "Infinite Mirror" RGB light bar alongside tested overclocking speeds reaching up to 8000 MT/s. As the successor to the highly successful Viper Steel 4 series—which established a strong reputation for reliability and performance in the DDR4 era—this new lineup shifts from traditional flat lighting layouts to a 3D optical design engineered to fit standard hardware constraints.

Patent-Pending 3D Lighting Design
Traditional infinite mirror layouts require deep physical layers that cannot fit within the narrow space of standard memory slots. Patriot Memory's design team overcame this limitation by developing a compact, solid-media optical structure. This allows the modules to project a deep 3D tunnel effect and smooth, hot-spot-free RGB lighting. The lighting integrates with proprietary Viper software, SignalRGB, and major motherboard ecosystems, including ASUS, MSI, Gigabyte, and ASRock.

Consumer DRAM Shortages Extend to DDR2 Products with Contract Prices Expected to Continue Rising in 3Q26

TrendForce's latest research reveals that structural tightening in mature-node DRAM supply is forcing consumer DRAM buyers to adopt legacy memory products to secure larger supply allocations. This has triggered a new wave of demand for procuring older-generation DRAM components, driving continued price momentum across legacy products such as DDR2 and DDR3.

Following strong gains in 1Q26, TrendForce estimates DDR2 contract prices will rise by approximately 55-60% in 2Q26, followed by a further 35-40% increase in 3Q26.

YCC Integrates Swarovski Crystal Accents into PC Cases at Computex 2026

YCC (Yeou Chih Corporation) showcased its 2026 gaming chassis lineup at Computex. The company is a Taiwanese OEM/ODM manufacturer established in 1995 having an extensive portfolio of PC cases, industrial rackmount chassis and power supplies. To draw attention, the company integrated genuine Swarovski crystals into a variant of its Slant 460 mid-tower chassis. Moreover, several alternative panel options adorned with these crystal accents were on display for those who can't get enough sparkle. Now going back to the PC cases, the Slant 460 measures 389 × 460 × 235 mm, has front and side tempered glass panels and seven expansion slots. For cooling it can accommodate up to seven 120 mm ARGB fans and two 360 mm radiators (top and bottom).

For ATX builds, YCC introduced the D-Cool series, a 446 × 422 × 285 mm dual-chamber mid-tower with a similar 270-degree view, seven expansion slots, top 360 mm radiator mount and up to no less than eleven 120 mm ARGB fans.

Samsung Display Unveils Full Gaming Display Product Lineup at Computex 2026

Samsung Display announced today that it will showcase a comprehensive gaming display lineup at COMPUTEX 2026, held June 2-5 at Taipei Nangang Exhibition Center in Taiwan. The exhibition will feature 16 of its latest OLED and QD-OLED products optimized for gaming, ranging from 8.8-inch OLED panels for handheld gaming PCs to 49-inch QD-OLED panels for monitors.

Samsung Display will introduce new laptop OLED technologies, including a slim design optimized for gaming laptops, as well as new QD-OLED products for monitors with industry-leading performance, including the world's first 4K 360 Hz QD-OLED monitor. Visitors will also be able to experience the differentiated display performance of Samsung OLED and QD-OLED through a variety of game content and comparative demonstrations.

Team Group to Showcase Quad-Rank CUDIMM ECC CUDIMM, and More at Computex 2026

Global memory and storage technology leader Team Group Inc. is set to showcase its latest innovations at COMPUTEX 2026, taking place from June 2 to 5. Under the themes "100% Secure Your Data, Your Technology!" and "Awaken AI, Drive Evolution," Team Group will spotlight breakthrough advancements at Booth P1225 (TaiNEX 2) and Booth I0407a (TaiNEX 1) of the Taipei Nangang Exhibition Center. Global media and industry partners are warmly invited to visit and witness Team Group's long-term strategic development across the enterprise, industrial, and gaming sectors.

Team Group has remained committed to product innovation and technological advancement, continuously driving the evolution of storage solutions across the industry. Its proprietary "One-Click Data Destruction" mechanism, applied to both industrial-grade and consumer products, has successfully secured invention patents in Taiwan and the United States. Such innovation underscores the company's robust engineering expertise and technological leadership. Leveraging advanced R&D capabilities and internationally recognized certifications, Team Group empowers users worldwide with industry-leading protection for confidential data and reliable data security solutions.

AMD "Zen 7" IP to Use TSMC A14 Node and More Advanced Packaging

AMD is gradually preparing to launch its next-generation "Zen 6" series of processors under the new EPYC "Venice" server CPU family. Meanwhile, development of the "Zen 7" architecture has been ongoing for quite some time, and it seems we are finally learning which manufacturing node AMD will use for this CPU generation. According to Taiwanese media outlet Commercial Times, AMD is reportedly considering TSMC's A14 node, officially utilizing the first angstrom-era node for its products. As readers may recall, AMD recently began high-volume production of its EPYC "Venice" on the 2 nm node, but with the upcoming "Zen 6" architecture. We have covered the advancements that "Zen 6" brings over the current "Zen 5," but the next-generation "Zen 7" is expected to elevate performance to a whole new level, especially with the power and performance enhancements of the new TSMC A14 node.

For "Zen 7" CCD IP codenamed "Grimlock," AMD plans to make its CPU architecture more AI-relevant, allowing future processing workloads to better leverage the processing power of 16 CPU cores per CCD. Among the key features are AVX10 and ACE. AVX10 unifies AVX-512 and AVX2 features to improve performance and compatibility across vector math-heavy workloads. ACE, or Advanced Matrix Extensions for Matrix Manipulation, is an industry-standard matrix math instruction set that could be relevant to a wide range of devices, from smartphones to servers. Other ISA additions with "Zen 7" include FRED (Flexible Return and Event Delivery), which replaces the current device interrupt model to reduce system-level latency. "Zen 7" also implements ChkTag x86 Memory Tagging to counteract various memory-level data vulnerabilities caused by buffer overflows and use-after-free errors.

AMD Announces More Than $10 Billion in Taiwan Ecosystem Investments to Accelerate AI Infrastructure

To meet the growing demand for AI infrastructure, AMD (NASDAQ: AMD) today announced more than $10 billion in investments across the Taiwan ecosystem to expand strategic partnerships and scale advanced packaging manufacturing for next-generation AI infrastructure. Working with strategic partners in Taiwan and globally, AMD is advancing leading-edge silicon, packaging and manufacturing technologies that enable higher performance, greater efficiency and faster deployment of AI systems. These efforts build on AMD's deep ecosystem partnerships and long-standing leadership in chiplet architectures, high-bandwidth memory integration, 3D hybrid bonding and rack-scale system design for next-generation AI infrastructure.

"As AI adoption accelerates, our global customers are rapidly scaling AI infrastructure to meet growing compute demand," said Dr. Lisa Su, Chair and CEO, AMD. "By combining AMD leadership in high-performance computing with the Taiwan ecosystem and our strategic global partners, we are enabling integrated, rack-scale AI infrastructure that helps customers accelerate deployment of next-generation AI systems."

PC Motherboard Sales Face Sharp 25%+ Decline Amid Weak Demand

PC motherboard sales are on track for some of the biggest corrections in recent times as manufacturers struggle with weak demand, according to a DigiTimes report. What began as AI data center expansion quickly started affecting consumer PC DIY endeavors, as severe silicon shortages across the industry drove DRAM and CPU demand so high that prices have increased significantly for DDR4 and DDR5 memory kits, while regular CPUs have also seen a large price increase. In response, PC motherboard makers are caught in the middle of this shortage, seeing their motherboard unit sales revised down significantly. The report notes that all Taiwanese motherboard makers have significantly lowered their 2026 shipment targets, with some experiencing more than a 25% decrease in projected unit sales.

Interestingly, it's not only CPU and memory shortages driving this lowered demand; there are indications that consumers have slowed down their NVIDIA GPU upgrade cycles, which is impacting new motherboard sales. Particularly with the "Blackwell" GPU generation, consumers began purchasing PCIe 5.0 motherboards to achieve the greatest performance increase. However, as these GPUs became rarer and more expensive due to the global DRAM shortage, consumers have become reluctant to upgrade. ASUS is projected to sell about 10 million motherboards in 2026, while MSI and GIGABYTE are now projecting sales of less than 10 million units each. This represents about a 25% yearly decrease from 2025 sales. The worst position is estimated for ASRock, which is expected to see a 30% decrease according to the report.

TSMC Converts Fab 15A to 4 nm Production, 1.4 nm Taichung Site Ahead of Schedule

According to Economic Daily News, TSMC is overhauling Fab 15A in Central Taiwan Science Park, transitioning it from 28/22 nm to 4 nm production. Old equipment is being cleared out and replaced with new tooling, and the total bill (cleanrooms and machinery included) is expected to top NT$100 billion (US$3.16 billion). The displaced 28/22 nm tools aren't going to waste either, heading to TSMC facility in Dresden, Germany, which is ramping toward mass production in 2027 on mature nodes aimed at the automotive and industrial market. Fab 15B stays on 7 nm for now. Further up the process roadmap, TSMC's 1.4 nm fab at the Phase 2 Central Taiwan site in Taichung is coming together faster than planned. Groundwork is mostly completed and construction bidding is expected to start shortly. If things keep moving at this pace, trial production could start as early as Q3 2027, with full mass production following in the second half of 2028.

There are also talks of 1 nm arriving at the Central Taiwan site earlier than previously expected. Worth noting that 1.4 nm isn't part of TSMC's US fab plans at all. Once all four Phase 2 fabs are running at capacity, the Taichung complex is expected to be the single largest production base for AI and HPC chips anywhere in the world. In April, TSMC introduced its A13 (1.3 nm) process at the 2026 North America Technology Symposium as a direct shrink of the previously announced A14 (1.4 nm) node. The new node offers around 6% area reduction, along with improved performance and power efficiency through design-technology co-optimization. The A13 node remains fully backward compatible with A14 design rules to allow easier migration. TSMC A13 node is expected to enter mass production in 2029, one year after A14.

NEO Semiconductor Demonstrates 3D X-DRAM Proof-of-Concept

NEO Semiconductor, a leading innovator in advanced AI and memory technologies, today announced successful proof-of-concept (POC) results for its 3D X-DRAM technology, marking a major milestone toward next-generation, high-density memory solutions for AI and data-centric systems.

The company also announced a new strategic investment led by Stan Shih, Founder and former Chairman and CEO of Acer, and former Board Director of TSMC for over 20 years. As a globally respected technology pioneer and entrepreneur, Mr. Shih's participation reflects strong confidence in NEO's technology and vision, and will support the company's next phase of development.

Starfield Nintendo Switch 2 Launch Potentially Imminent

Starfield has already been out for PC and Xbox for almost three years, recently making an appearance on Sony's PlayStation 5 as well. Now, according to a recent report by Universo Nintendo, it seems as though the game will also get a Nintendo Switch 2 launch in the near future. The report cites a listing from the Taiwan Entertainment Software Rating Information database, revealing that Starfield has been rated for the Nintendo Switch 2 in Taiwan. Bethesda has not yet announced a Switch 2 launch for Starfield, but regulatory leaks, like this Taiwanese rating, are common precursors to game launches.

That said, there's also no indication of a launch date for the Switch 2 version of Starfield, nor do we know what sort of graphical compromises will need to be made to run Bethesda's space adventure, which requires a minimum of an Intel Core i7-6800K or AMD Ryzen 5 2600X, and an NVIDIA GeForce GTX 1070 Ti or AMD Radeon RX 5700 to run on PC. Reports from users on ProtonDB, however, have not had an altogether positive experience, with most reporting getting under 30 FPS, despite running it at the lowest quality settings with FSR 3 enabled and at 50% resolution scale.

Marvel's Guardians of the Galaxy May Come to Nintendo Switch 2 Soon

Following the recent news of the $80 Elden Ring: Tarnished Edition for Switch 2 showing up on Amazon, Gematsu has reported that Marvel's Guardians of the Galaxy 2 may be coming to the Nintendo Switch 2 sooner rather than later, based on a recent age rating by the Taiwan Digital Game Rating Committee. According to a screenshot of the rating, it will be PG-12, and it is explicitly rated for the Nintendo Switch 2.

There is no launch date approved for the game just yet, so, while this is evidence that a launch is incoming, it may still be a while before it's available. Notably, Marvel's Guardians of the Galaxy is already playable on the original Nintendo Switch, but it's a cloud-only title, meaning none of the game is processed locally. The fact that the Switch 2 version is explicitly rated for the Switch 2 suggests that it will not have the same cloud-only limitation, likely as a result of the Switch 2's more powerful internals.
Marvel's Guardians of the Galaxy Cloud Version is currently $59.99 on the Nintendo eShop, but pricing for the new version may be higher, especially for the physical version.

SEMI Projects Double-Digit Growth in Global 300 mm Fab Equipment Spending for 2026 and 2027

Worldwide 300 mm fab equipment spending is expected to increase 18% to $133 billion in 2026 and 14% to $151 billion in 2027, SEMI reported today in its latest 300 mm Fab Outlook. This strong growth reflects surging AI chip demand for data centers and edge devices, as well as the growing commitment to semiconductor self-sufficiency across key regions through localized industrial ecosystems and supply chain restructuring. Looking further out, the report projects investment will continue to increase 3% to $155 billion in 2028 and another 11% to $172 billion in 2029, respectively.

"AI is resetting the scale of semiconductor manufacturing investment," said Ajit Manocha, President and CEO of SEMI. "With global 300 mm fab equipment spending projected to exceed $150 billion in 2027 for the first time, the industry is making historic, sustained commitments to the advanced capacity and resilient supply chains needed to power the AI era."

AMD Joins Intel in Raising PC CPU Prices by Up to 15%

Last week, we reported that Intel is preparing to increase CPU prices by 10% across its client PC sector. However, a new report from Nikkei Asia suggests that AMD is also joining this trend, with plans for a PC CPU price hike as well. Reportedly, AMD Ryzen CPUs could see prices rise by 15% compared to the same time last year, when prices were typically around the MSRP at retailers. Now, as CPU demand has depleted inventories and the focus remains on server and data center CPU production, capacity for the client segment has been significantly reduced, leading to little to no inventory for PC enthusiasts. Large OEMs like HP and Dell are among the first to feel the pressure from the dwindling supply chain and have reported a significant gap between demand and supply for their PC systems.

Nikkei also notes that both AMD and Intel have informed their clients that CPU price increases will take effect by the end of March and into April, which should start to manifest very soon. What used to be a one or two-week wait from order to CPU shipment has now stretched to a process lasting eight to twelve weeks. This means that a CPU batch ordered in April might not arrive until June. This period is expected to be the worst in terms of supply in the second quarter of this year. Even if OEMs are willing to pay extra to secure CPU supply, availability is lacking. The CPU shortage is worsening daily, coinciding with the ongoing memory and storage shortage we are already experiencing.

ASUS Plans 30% PC Price Increase in Taiwan, Other OEMs to Follow

PC pricing in Taiwan may see a significant increase next quarter, as ASUS Joint Technology Systems Division General Manager Yi-Hsiang Liao has announced a planned 30% price hike across the company's entire product line. He explains that the extremely high costs of DRAM and SSD storage, combined with a shortage of CPUs, are driving this increase. ASUS also claims that this issue is not limited to their company, as every Taiwanese PC maker will face similar challenges. Reportedly, ASUS did not comment on whether the price increase will affect overseas markets or remain exclusive to Taiwan. However, it seems likely that rising component costs in Taiwan will also impact Western markets, which have already experienced significant price increases in recent months.
UDN, Machine TranslatedYesterday, ASUS, in partnership with Qualcomm, held a press conference for its new Zenbook A16 laptop. During an interview, Liao Yi-hsiang, General Manager of ASUS United Technology Systems Business, revealed that ASUS has confirmed that PC prices in Taiwan will increase by 25% to 30% or more in the second quarter, with varying increases across different models.

Micron Completes Acquisition of PSMC's Tongluo P5 Site in Taiwan

Micron Technology, Inc. (Nasdaq: MU) today announced it has completed the acquisition and assumed ownership of Powerchip Semiconductor Manufacturing Corporation's (PSMC) P5 site in Tongluo, Miaoli County, Taiwan, under the acquisition agreement previously announced on January 17, 2026.

The new site will complement Micron's existing operations in Taiwan as an extension of the company's vertically integrated mega campus in Taichung, located approximately 15 miles away. The site includes approximately 300,000 square feet of existing 300 mm cleanroom space and will support Micron's efforts to expand supply of leading-edge DRAM products, including HBM, to meet growing AI-driven demand.

Asian Steam Deck OLED Price Increases Likely Separate From Global RAM Situation

It was recently revealed by Komodo Station, Valve's official retail partner for Steam hardware in Korea, Japan, Hong Kong, and Taiwan, that prices for the Steam Deck OLED prices will increase by as much as 17% in March. However, as the storefront explains in the announcement, these price increases are as a result of "increases in logistics costs and increased exchange rate volatility," not as a result of the ongoing memory shortages and price increases. It specifically notes that prices in Hong Kong remain unchanged, which should be a positive indication for western audiences that Steam Deck prices aren't about to skyrocket—yet.

While neither Valve nor Komodo has provided any indication that prices are about to increase for the Steam Deck, it has been revealed that Valve's supply chain is affected by the current memory crisis as much as any other hardware company. The gaming giant recently postponed announcing pricing for the Steam Machine and Steam Frame due to increased uncertainty and skyrocketing memory prices. The Steam Deck may still be somewhat exempt from these price increases because of Valve's pricing structure that follows the typical console model instead of a PC pricing strategy—that is to say that Valve has priced the Steam Deck very competitively in order to attract buyers to its platform and storefront. However, if Valve is already eating the cost of inflated Steam Deck memory and storage costs, it almost seems inevitable that it will eventually have to increase the price of the Steam Deck. Currently, even Nintendo is considering price increases for the Switch 2 after its LPDDR5X cost price increased by as much as 41%.

NVIDIA Beats Apple to Become TSMC's Largest Customer

According to news out of Taiwan, NVIDIA has overtaken Apple, to become TSMC's largest customers based on revenue. Although TSMC never mentions specific customers in its financial reports, but rather goes with terms like "client A" and "client B", NVIDIA CEO Jensen Huang let slip that NVIDIA is now TSMC's "top customer". This would mean that NVIDIA is now client A in TSMC financial reports.

This also means that NVIDIA contributed NT$726.9 billion in revenue for TSMC in 2025, or US$23.2 billion if you prefer, which is over twice that of 2024. That doesn't mean that NVIDIA is producing twice as many chips at TSMC, since the most advanced node always costs more than the previous production node and this most likely includes other services like chip packaging, testing etc. As for client B, also known as Apple, they provided a not insignificant NT$645.1 billion or US$20.5 billion in revenue for TSMC. As a share of TSMC's revenue, NVIDIA stood for 19 percent—up from 12 percent in 2024—and Apple for 17 percent, down from 22 percent in 2024.

DRAM Market Grows 29% in 4Q25, Samsung Regains Top Spot

TrendForce's latest findings reveal that the expansion of AI applications from LLM training to inference has prompted CSPs to broaden data center build-outs beyond AI servers to include general-purpose servers. This shift has extended memory procurement beyond HBM3e, LPDDR5X, and high-capacity RDIMMs to RDIMMs across multiple densities. Aggressive additional orders have driven a sharp increase in conventional DRAM contract prices, lifting total DRAM industry revenue to $53.58 billion in 4Q25, up 29.4% QoQ.

Across segments, buyers have struggled to secure sufficient supply amid a widening supply-demand gap. This has significantly strengthened suppliers' pricing power. Conventional DRAM contract prices rose 45-50% QoQ, while blended contract prices for conventional DRAM and HBM increased 50-55%, marking an accelerated upswing across all product categories.

ASRock Radeon RX 9070 XT Taichi White OC Model Appears in First Review

Over a month ago, ASRock fully presented its brand-new Radeon RX 9070 XT Taichi White OC 16 GB graphics card model. To some surprise, the Taiwanese PC hardware manufacturer has not released a simple pale redecoration of this generation's (RDNA 4) standard gray metallic Taichi SKU. Last week, a sponsored review was published by GDM Japan. So far, only Japanese PC enthusiasts have enjoyed public hands-on experience with the new flagship model. Despite claims of ASRock exhibiting a preview sample at CES 2026, TechPowerUp's ground team did not spot any demo units at the firm's Las Vegas graphics card showcase. The opening section of GDM's write-up mentions several recent domestic promo events, including one held in Tokyo's Akihabara Electric Town. The new model's unique selling point is an integrated 2-inch color LCD screen—officially dubbed "LCD Information Center." As expected, GDM dives deep into this fun feature. They managed to upload custom images and animated content (GIFs) via ASRock's Polychrome SYNC suite. Under normal modes, the small screen can inform users about GPU clocks, fan speeds, and operating temperatures.

The Radeon RX 9070 XT Taichi White OC candidate was hooked up to a test build based on Intel's Core Ultra 9 285K processor and ASRock's "ultra-high-end" Z890 Taichi AQUA motherboard. Performance-wise, the white variant seems to do just as well as its metallic gray sibling. GDM concludes that the latest model only distinguishes itself in terms of aesthetics; mainly through its "striking" white design and integrated screen gimmick. In their analysis of the Taichi White OC's debut review, VideoCardz has highlighted the test subject boosting well beyond the factory-set 3.1 GHz boost clock rating. Months into RDNA 4's lifecycle, only a handful of Team Red board partners had released custom designs overclocked to this level, with only ASRock and Sapphire choosing to implement the controversial 12V-2×6 power connector. Under load, GDM reported the "Navi 48 XTX" GPU boosting up to a maximum of 3296 MHz. Last March, TechPowerUp's W1zzard got his gray Taichi evaluation unit overclocked up to an average of 3213 MHz. We hope that upcoming non-sponsored reviews will provide a clearer picture of the Radeon RX 9070 XT Taichi White OC SKU's capabilities.

Acer Japan Announces Imminent Price Increases for Laptops & Pre-built Desktop PCs

In mid-February, Acer is facing multiple challenges in Europe and Asia. This past weekend, news reports outlined a court-ordered cease and desist ruling that prevents PC and laptop sales in Germany. Last Friday (February 13), the company's Japanese office informed the local customer base about forthcoming price tag changes. Since November 2025, tech companies have wrestled with an extremely constrained supply of vital components. The regional branch's social media account described inevitable hikes: "due to rising prices of major components such as memory and SSDs, Acer will revise the prices of PC products on its official online store starting from February 20, 2026. Purchases at the current prices will be available until February 19. We will continue striving to improve our product value. We appreciate your understanding." The same notification was issued by the firm's gaming brand (Acer Predator/PlayMaster) to local customers. The Taiwanese multinational PC hardware manufacturer's Japanese division did hint about current circumstances not affecting a handful of items; their statement alluded to a non-specific selection of products remaining "unchanged" in terms of asking prices. At the time writing, Acer's other regional operations have not released similar warnings.

TSMC Preparing $100 Billion Package to Add Four More Fabs to Arizona Facility

TSMC is reportedly planning to announce the addition of four new fabs at its Phoenix, Arizona site, known as TSMC Arizona. According to the Financial Times, TSMC will add four additional fab buildings at its Arizona campus, worth about $100 billion, with an official confirmation expected as early as April, just two months from the time of writing. In January, TSMC reportedly purchased additional 900-acres of land directly across the highway from the existing site north of Phoenix, preparing to expand its campus across. That extra production capacity will be supported by an estimated $100 billion of additional funding that TSMC is willing to spend on U.S. soil, despite making additional simultaneous investments back home in Taiwan.

However, many of the deal's specifics are still uncertain. According to Commerce Secretary Howard Lutnick, about $100 billion of those pledges are firm, which means that the total value of TSMC's investment in Arizona will amount to $265 billion. About $165 billion has already been invested in Arizona, and another $100 billion will make this one of the highest ever external investments on U.S. soil. Interestingly, TSMC is not alone in this investment round, as its supply chain partners are expected to contribute about $30 billion of the $100 billion figure, meaning that many more players are gathering funds to form the new supply chain independence.

Scythe & ASUS TUF Gaming Alliance Launch Special Edition Mugen 6 CPU Coolers in Taiwan

Last month, Scythe started to promote two Mugen 6 ASUS TUF ALLIANCE edition models. A handful of social media posts provided an early look at the Japanese PC cooling hardware specialist's slight reworkings of the existing Dual Fan ARGB designs. Throughout mid-to-late January, the staggered release of promotional renders showcased newly co-branded white and black units. Scythe's social media accounts teased the latest Mugen 6 revisions leveraging a few improvements. The powerful proprietary Wonder Tornado 120 mm ARGB fans have been updated with anti-vibration pads, and the main block's aluminium fin-stack sports a different type of coating.

Scythe's Q1 2026 revamp of premium-tier single-tower air coolers has just launched in Taiwan, according to an ITHome news article. Yesterday's report outlines a day one release price tag of NT$1790 (~$57.10 USD). Apart from Scythe's typo-laden online marketing of improved features, the newer SKUs are decorated with familiar military themed TUF Gaming patterns and logos/text. Oddly, there is no actual Scythe branding present on the heatsink or Wonder Tornado fans—we hope that they get a shout-out on the finalized Mugen 6 X ASUS TUF ALLIANCE retail packaging, at least.

SilverStone Presents XE02-AM5B & XE02-TR5B SFF CPU Coolers

SilverStone has quietly expanded its comprehensive range of CPU cooling solutions with a myriad of brand-new designs, across both air and liquid cooling lines. A pair of 2U small form factor server/workstation CPU cooling solutions have gained the most media attention. As expected, the Taiwanese manufacturer has not issued any press material for this pair of freshly introduced AMD-oriented products. The SST-XE02-AM5B cooler's naming scheme clearly states that it is intended for deployment on Team Red's AM5 socket, although SilverStone's specification sheet mentions compatibility with the older AM4 platform. The SST-XE02-TR5B SKU's credentials list support of AMD's sTR5, SP6, TR4, and SP3 socket types.

The newest AM5B and TR5B models share similar traits; mainly a provision of five 6 mm heat-pipes combined with aluminium fins—marketed as offering "excellent heat conducting efficiency"—and a centrally-positioned 60 mm PWM dual ball bearing fan. This fan model's specification sheet lists an RPM range of 2000 to 14,000, a 72.8 CFM maximum airflow rating, and max. air pressure of 47.18 mmH2O. Mean Time To Failure (MTTF) is estimated at 70,000 operational hours. Despite featuring the same fan, the two low-profile SST-XE02 models deviate in terms of CPU TDP ratings—the AM5/AM4 compatible cooler is rated up to 170 W, while the ever so slightly larger/heavier sibling (sTR5/SP6/TR4/SP3) is capable of tempering up to 350 W. Naturally, the more capable unit is tasked with handling (for example) EPYC 8004 and Ryzen Threadripper 7000 processors.
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