Monday, September 28th 2020

GLOBALFOUNDRIES Announces New 22FDX+ Platform, Extending FDX Leadership with Specialty Solutions for IoT and 5G Mobility

GLOBALFOUNDRIES (GF ), the world's leading specialty foundry, announced today at its Global Technology Conference the next generation of its FDXTM platform, 22FDX+, to meet the ever-growing need for higher performance and ultra-low power requirements of connected devices. GF's industry-leading 22FDX (22 nm FD-SOI) platform has realized $4.5 billion in design wins, with more than 350 million chips shipped to customers around the world.

GF's new 22FDX+ builds on the company's 22FDX platform, offering a broader set of features that provide high performance, ultra-low power, and specialty features and capabilities for the newest generation of designs. The differentiated offering will further empower customers to create chips that are specifically optimized for Internet of Things (IoT), 5G, automotive, and satellite communications applications.
"Dialog creates highly integrated, energy-efficient SoCs and specialty memory devices optimized for connecting the Internet of Things," said Jalal Bagherli, CEO of Dialog Semiconductor. "GLOBALFOUNDRIES' 22FDX+ platform, with its advanced RF performance, low power capabilities, and comprehensive platform features, is a key enabling technology that allows us to stay at the forefront of our industry for the next generation of these IoT products."

"We are proud to partner with Dialog, and work together to leverage both companies' ultra-low power, high performance RF capabilities, and embedded memory to advance the frontier of connectivity into the ever-growing IoT market," said Mike Hogan, senior vice president and general manager of Automotive, Industrial, and Multi-Market at GF. "The launch of GF's differentiated 22FDX+ platform will strengthen our collaboration with Dialog, and accelerate the incredible advancements in IoT that are already changing our lives."

The first specialty solution to be available on GF's new 22FDX+ platform will be 22FDX RF+. With digital and RF enhancements, the new 22FDX RF+ solution is optimized to boost the performance of front-end-module (FEM) designs. The 22FDX RF+ specialty solution will be available in Q1 2021, and manufactured on GF's state-of-the-art 300 mm production line at Fab 1 in Dresden, Germany.
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12 Comments on GLOBALFOUNDRIES Announces New 22FDX+ Platform, Extending FDX Leadership with Specialty Solutions for IoT and 5G Mobility

#1
bug
"Leadership" and "22nm" right under the article about TSMC laying out plans for 3nm. Brilliant!
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#2
Frick
Fishfaced Nincompoop
bug
"Leadership" and "22nm" right under the article about TSMC laying out plans for 3nm. Brilliant!
Different markets.
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#3
bug
Frick
Different markets.
Yes. Because they can't keep up.
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#4
theoneandonlymrk
bug
Yes. Because they can't keep up.
Neither can Intel, but that doesn't preclude doing business or dominating certain market type's.
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#5
mtcn77
I think they are keen on the forward and back bias of FDX product line. It is a contender in power saving markets such as radio maybe?
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#6
Frick
Fishfaced Nincompoop
bug
Yes. Because they can't keep up.
The majority of microchips made are not cutting edge CPUs and GPUs. NAND, microcontrollers and whatnot os a huge market and you don't have to chase the dieshrink wall to compete. As GloFo demonstrates.
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#7
bug
Frick
The majority of microchips made are not cutting edge CPUs and GPUs. NAND, microcontrollers and whatnot os a huge market and you don't have to chase the dieshrink wall to compete. As GloFo demonstrates.
I know. I was just poking at their use of the term "leadership".
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#8
Oberon
bug
I know. I was just poking at their use of the term "leadership".
"Leadership" can mean many more things in addition to "smallest node."
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#9
bug
Oberon
"Leadership" can mean many more things in addition to "smallest node."
True, but nothing is mentioned in the article, besides 22nm...
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#10
seronx
Oof.. three plus years ago:



2018-2019 product all the way in late 2020. Since, SOITEC still has 12FD wafer in development might be a while till 12FDX. Even more longer for 10FD/7FD wafers to finish before we see 7FDX or what not.
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#11
Chrispy_
Globalfoudries sure are looking like the ball and chain that AMD were wise to ditch. They're even further behind in their production schedule than Intel are with 10nm.
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#12
bug
Chrispy_
Globalfoudries sure are looking like the ball and chain that AMD were wise to ditch. They're even further behind in their production schedule than Intel are with 10nm.
It's hard to judge cause and effect from the outside. Maybe they'd be doing better if AMD kept them around, maybe they would have sunk AMD altogether. You can't really tell.
But like AMD, that bit the bullet during their Bulldozer days, maybe GF can bounce back given time. Especially since 3nm will be hard for everybody to surpass, that may give GF some time to catch up.

Even if they don't ever bounce back, their additional fab capacity is still more than welcome.
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