Monday, November 22nd 2021

Samsung Talks DDR6-12800, GDDR7 Development, and HBM3 Volume Production

During Samsung's Tech Day 2021, the company presented some interesting insights about the future of system memory technologies and how it plans to execute its production. Starting with the latest DDR5 standard, the company intends to follow JEDEC documents and offer some overclocking modules that surpass the specification advised by JEDEC. While the DDR5 standard specifies memory modules with 6,400 MT/s, Samsung will develop modules capable of overclocking up to 8,400 MT/s. These are not yet confirmed as they are still in the development phase. However, we can expect to see them in the later life of DDR5 memory.

The company also talked about the DDR6 standard, which is supposedly twice as fast as DDR5. The new DDR6 standard is still in early development, and all we know so far is that the number of memory channels per module is seeing a twofold increase over DDR5 to four channels. The number of memory banks also increases to 64. In addition to DDR6 for desktop and server use cases, the company is also working on Low Power DDR6 (LPDDR6) for mobile applications. While the company's LPDDR5 memory goes into volume production using the 1a-nm process at the beginning of 2022, the LPDDR6 is still in early development. The base speed for DDR6 modules will allegedly arrive at 12,800 MT/s, while overclocking modules will join the party at up to 17,000 MT/s. Mobile-oriented LPDDR6 version is also supposed to come with up to 17,000 MT/s speeds.
Next up, Samsung talked about its memory offerings for graphics, where GDDR and HBM come into play. The new GDDR standard that is supposed to arrive is GDDR6+, which bumps the speed from 18,000 MT/s to 24,000 MT/s. Node of choice for GDDR6+ will be 1z nm, and the Korean giant wants to start manufacturing these modules this month. After this, the company's roadmaps show that the GDDR7 standard will replace GDDR6+ and offer rates of 32,000 MT/s. With GDDR7, there will also be a new feature present called "real-time error protection feature," which is still unknown. Presumably, it is some form of ECC for GDDR or something similar. We are yet to see.

In addition, the company also mentioned that its HBM3 memory will be ready for mass production in the second quarter of 2022, with speeds of 800 GB/s. This memory will target mainly AI applications, and Samsung is working with partners to equip new solutions with HBM3.
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56 Comments on Samsung Talks DDR6-12800, GDDR7 Development, and HBM3 Volume Production

Samy talks DDR6, meanwhile DDR5 RAM modules are nowhere to be find.
Like, inexistent. :banghead:
Posted on Reply
Prima.VeraSamy talks DDR6, meanwhile DDR5 RAM modules are nowhere to be find.
Like, inexistent. :banghead:
Because the engineers doing the design should not be working as long as factories can't manufacture things in droves. Right?
Do you people ever think before posting? :banghead::banghead:
Posted on Reply
TranceHeadDDR4-4200 is faster than DDR5-4200.
Don't be too hasty saying 'never'. In TPU's own tests, DDR5 kit tested was only 3.2% faster than DDR4-3200.
Early adopters get screwed in price and speed.
of course ddr4200 is faster because thats some godly binned sillicon, wait for when 5600 ddr5 kits start coming out at the price of ddr4 3200
Posted on Reply
Yes best binned chips of DDR4 4200 bellow JDEC SPEC 4200 DDR5. Indeed a stick with a set of the best binned chips for DDR4 will beat bellow average DDR5. But if we go that path, if we could had DDR at 4200, it would beat DDR4 by huge margin. That is just not possible.

But this is the end of the road for DDR4, there might be few higher performance kit in the near future, but that won't last and that will just extend slightly the limit of those memory. DDR5 are pretty untapped.

My understanding is to get good high speed memory stick, we need to have a very robust server/laptop/OEM desktop memory market that all use JDEC speed memory kit. They allow for mass production of chips that can be binned higher. Right now, not much use DDR5 except Alder Lake.

Once the Zen 4 Epic get launched and Sapphire rapid, we should see way more high speed kit. DDR5-8400 might become quickly the new DDR4-3200

and DDR5-8400 will completely destroy a DDR4-4200 kit.
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Resident Wat-man
windwhirlTech companies are always planning ahead.
This is how most companies stay alive and grow. Long term plans and strategies to achieve their goals. Even in software where things could change, something like a 2 year roadmap isn't unrealistic. You need to be able to plan ahead so you can convey that to your customers so they can plan ahead, particularly if you're building (or planning on building,) something that they need and are willing to pay you for.
Posted on Reply
windwhirlDoes it matter? Memory has gotten faster and faster, never slower.
I wouldn't say it's faster and might even argue that it's slower atm, it's like a car and a truck moving stuff from point a to b. Even though the car is faster than the truck, the truck requires fewer trips back and forth. It's slower but get the task done quicker. When the loads are car-sized that advantage vanishes.
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