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SiPearl to Manufacture its 72-Core Rhea HPC SoC at TSMC Facilities

SiPearl has this week announced their collaboration with Open-Silicon Research, the India-based entity of OpenFive, to produce the next-generation SoC designed for HPC purposes. SiPearl is a part of the European Processor Initiative (EPI) team and is responsible for designing the SoC itself that is supposed to be a base for the European exascale supercomputer. In the partnership with Open-Silicon Research, SiPearl expects to get a service that will integrate all the IP blocks and help with the tape out of the chip once it is done. There is a deadline set for the year 2023, however, both companies expect the chip to get shipped by Q4 of 2022.

When it comes to details of the SoC, it is called Rhea and it will be a 72-core Arm ISA based processor with Neoverse Zeus cores interconnected by a mesh. There are going to be 68 mesh network L3 cache slices in between all of the cores. All of that will be manufactured using TSMC's 6 nm extreme ultraviolet lithography (EUV) technology for silicon manufacturing. The Rhea SoC design will utilize 2.5D packaging with many IP blocks stitched together and HBM2E memory present on the die. It is unknown exactly what configuration of HBM2E is going to be present. The system will also see support for DDR5 memory and thus enable two-level system memory by combining HBM and DDR. We are excited to see how the final product looks like and now we wait for more updates on the project.

DigiTimes: DDR3 Prices to Soar 40-50% in 2021

Yes, you are reading that title correctly. Today we got ahold of information that DDR3 prices are going to skyrocket by as much as 40-50% this year! Despite DDR4 being present for seven years (since 2014), which is a lot in the world of tech, DDR3 is still thriving. Used in a wide range of devices like IoT, older servers, and long time running machines that need maintenance for decades. The DDR3 has been manufactured by SK Hynix, Samsung, and Micron, however, as technology moved on, these companies began the migration to the newer DDR4 standard. Even DDR5 exists today and it is currently manufactured.

So why is DDR3 soaring in value? It is because of the increased scarcity of this memory. SK Hynix has stopped the production of 2 Gb modules, leaving only the 4 Gb modules in production. Samsung has cut down the capacity from 60,000 wafers of DDR3 memory modules per month to just 20,000. This has caused the price of 2 Gb and 4 Gb modules to rise already as much as 30%. Despite the age of 14 years, DDR3 is still widely used in many systems. And because of that, the scarcity is making the price of the current memory increase. The price is expected to rise through the whole year and it could reach a 50% increase.

Intel Confirms HBM is Supported on Sapphire Rapids Xeons

Intel has just released its "Architecture Instruction Set Extensions and Future Features Programming Reference" manual, which serves the purpose of providing the developers' information about Intel's upcoming hardware additions which developers can utilize later on. Today, thanks to the @InstLatX64 on Twitter we have information that Intel is bringing on-package High Bandwidth Memory (HBM) solution to its next-generation Sapphire Rapids Xeon processors. Specifically, there are two instructions mentioned: 0220H - HBM command/address parity error and 0221H - HBM data parity error. Both instructions are there to address data errors in HBM so the CPU operates with correct data.

The addition of HBM is just one of the many new technologies Sapphire Rapids brings. The platform is supposedly going to bring many new technologies like an eight-channel DDR5 memory controller enriched with Intel's Data Streaming Accelerator (DSA). To connect to all of the external accelerators, the platform uses PCIe 5.0 protocol paired with CXL 1.1 standard to enable cache coherency in the system. And as a reminder, this would not be the first time we see a server CPU use HBM. Fujitsu has developed an A64FX processor with 48 cores and HBM memory, and it is powering today's most powerful supercomputer - Fugaku. That is showing how much can a processor get improved by adding a faster memory on-board. We are waiting to see how Intel manages to play it out and what we end up seeing on the market when Sapphire Rapids is delivered.

DRAM ASP to Recover from Decline in 1Q21, with Potential for Slight Growth, Says TrendForce

The DRAM market exhibits a healthier and more balanced supply/demand relationship compared with the NAND Flash market because of its oligopolistic structure, according to TrendForce's latest investigations. The percentage distribution of DRAM supply bits by application currently shows that PC DRAM accounts for 13%, server DRAM 34%, mobile DRAM 40%, graphics DRAM 5%, and consumer DRAM (or specialty DRAM) 8%. Looking ahead to 1Q21, the DRAM market by then will have gone through an inventory adjustment period of slightly more than two quarters. Memory buyers will also be more willing to stock up because they want to reduce the risk of future price hikes. Therefore, DRAM prices on the whole will be constrained from falling further. The overall ASP of DRAM products is now forecasted to stay generally flat or slightly up for 1Q21.

Colorful is Preparing DDR4-4000 C14 Memory for Ryzen 5000 Series CPUs

Colorful, a Chinese manufacturer of PC components known for its graphics cards, is apparently preparing a special RAM version for AMD's Ryzen 5000 series CPUs. The new arrival is part of the iGame series that Colorful offers. Thanks to SMZDM forums, we have specifications of the upcoming iGame RAM tuned specifically for Ryzen 5000 series processors. Coming in with all white PCB without a heat spreader, the new Colorful iGame memory features Samsung's B-dies designed for maximum speed and performance. The dies are running at 4000 MT/s with some very strict timings. The memory features C14 (14-14-14-35) timings that are supposed to bring the system latency down and improve performance even further. It is estimated that such a configuration will require 1.5 Volts to power it. While the exact name, launch date, and pricing is unknown, we can only wait and see how Colorful plays it out.

RISC-V Comes to PC: SiFive Introduces HiFive Unmatched Development Board

RISC-V architecture is a relatively new Instruction Set Architecture (ISA) developed at the University of California Berkeley. Starting as a "short, three-month project" the RISC-V ISA is a fifth generation of the Reduced Instruction Set Computing (RISC) ideology. A company working on this technology and helping to grow the ecosystem is SiFive. Today, they announced a big step forward for the ecosystem that will enable developers to make and optimize even more software for this architecture and platform. Called the HiFive Unmatched, the development board represents the first entry of RISC-V ISA to the world of personal computing, with its Mini-ITX form factor and PC-like connectors of power supply and I/O.

The board is home to SiFive's FU740 SoC, a five-core heterogeneous, coherent processor with four SiFive U74 cores, and one SiFive S7 core. This SoC is capable of smooth Linux OS operation, giving the developers a good platform to do their optimizations for. There is 8 GB of onboard DDR4 RAM (unknown frequencies and timing), a MicroSD card slot, and one PCIe 3.0 x4 M.2 slot for system storage. To connect the board to the outside world, you get one Gigabit Ethernet port. For user I/O there are four USB 3.2 Gen 1 Type-A ports (1 Charging port) and one MicroUSB Console port. To power the board, you need a proper power supply with a 24-pin power connector. If you plan to build a PC based on the Unmatched board, you would need a standard ITX case, as it comes in the standard Mini-ITX (170x170 mm) form factor. For more information, please check out SiFive's website.

Intel Alder Lake-S CPU Has Been Pictured

Intel has been preparing the launch of its 10 nm processors for desktop users for some time now, and today we are getting the first pictures of the Alder Lake-S CPU backside. Featuring a package with a size of 37.5×45 mm, the Alder Lake CPU uses more of its area for a pin count increase. Going up from 1200 pins in the LGA1200 socket, the new Alder Lake-S CPU uses 1700 CPU pins, which slots in the LGA1700 socket. In the picture below, there is an engineering sample of the Alder Lake-S CPU, which we see for the first time. While there is no much information about the processor, we know that it will use Intel's 10 nm SuperFin design, paired with hybrid core technology. That means that there will be big (Golden Cove) and little (Gracemont) cores in the design. Other features such as PCIe 5.0 and DDR5 should be present as well. The new CPU generation and LGA1700 motherboards are scheduled to arrive in second half of 2021.

Fujitsu Completes Delivery of Fugaku Supercomputer

Fujitsu has today officially completed the delivery of the Fugaku supercomputer to the Riken scientific research institute of Japan. This is a big accomplishment as the current COVID-19 pandemic has delayed many happenings in the industry. However, Fujitsu managed to play around that and deliver the supercomputer on time. The last of 400 racks needed for the Fugaku supercomputer was delivered today, on May 13th, as it was originally planned. The supercomputer is supposed to be fully operational starting on the physical year of 2021, where the installation and setup will be done before.

As a reminder, the Fugaku is an Arm-based supercomputer consisting out of 150 thousand A64FX CPUs. These CPUs are custom made processors by Fujitsu based on Arm v8.2 ISA, and they feature 48 cores built on TSMC 7 nm node and running above 2 GHz. Packing 8.786 billion transistors, this monster chips use HBM2 memory instead of a regular DDR memory interface. Recently, a prototype of the Fugaku supercomputer was submitted to the Top500 supercomputer list and it came on top for being the most energy-efficient of all, meaning that it will be as energy efficient as it will be fast. Speculations are that it will have around 400 PetaFlops of general compute power for Dual-Precision workloads, however, for the specific artificial intelligence applications, it should achieve ExaFLOP performance target.
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VIPER GAMING Launches New 64GB Kits of High-Performance VIPER 4 BLACKOUT DRAM

VIPER GAMING by PATRIOT, a trademarked brand of PATRIOT and a global leader in performance memory, solid-state drives, and flash storage solutions, today is proud to announce the launch of their 32 GB memory module kits as part of the VIPER 4 BLACKOUT DDR4 PERFORMANCE MEMORY, offering gamers and video content creators the ability to equip their systems with more memory and further extending the potential performance. The VIPER 4 BLACKOUT series modules have long been an excellent choice for enthusiastic builders who are looking for high-speed memory with headroom for performance tweaking and overclocking.

The series was created to be performance-oriented,and with outstanding compatibility across the latest Intel and AMD platforms, the VIPER 4 BLACKOUT series 64 GB kit are available in speeds from 3000 MHz up to 3600 MHz and built from strictly tested memory chips and components on a 10-layer PCB. Each of the 32 GB modules is wrapped by a military-grade aluminium heatspreader with an advanced pin array to maximize efficiency and thermal performance."The VIPER 4 BLACKOUT DRAM is an award-winning series and has been highly recommended by mainstream PC hardware media last year.Influencefrompositive customer feedback from our 16 GB kits encouraged us to expand the VIPER 4 BLACKOUT series to include a much larger 64 GB kit," said Roger Shinmoto, the Vice President of VIPER GAMING by PATRIOT.
Viper 4 Blackout Series DDR4 Viper 4 Blackout Series DDR4 Viper 4 Blackout Series DDR4

XMG APEX 15 is a Laptop with AMD Ryzen 3950X CPU Inside

Have you ever wondered how a laptop with a desktop CPU that has 16 cores and 32 threads would look like on a laptop? Well, today is your lucky day as XMG, a German laptop maker, has decided to launch a laptop that has AMD's latest and greatest desktop CPU - the Ryzen 3950X 16C/32T monster. The 3950X CPU, while featuring a regular TDP of 105 W, has been configured to 65 W in Eco Mode, and it runs anywhere from 2.6 to 4.2 GHz. The CPU also isn't soldered to the motherboard and there is a full AM4 socket, that is capable of housing any 3000 series desktop CPU.

Besides a powerful CPU, there are options for NVIDIA GeForce RTX 2060 or RTX 2070 graphics cards, which drive a 15.6-inch Full HD 144 Hz IPS panel equipped with anti-glare technology. The GPUs are a "Max-P incarnation" as XMG calls it, which presumably means that they are designed for maximum performance i.e. possibly higher boost speeds. Additionally, you can configure the laptop with up to 64 GB of DDR4 2666 MHz RAM. This configuration, containing Ryzen 9 3950X, RTX 2070, 32 GB of RAM and 1 TB NVM, costs around 2631 EUR. For more configuration options, you can check out this website. Availability is supposed to be in 6-8 weeks.
XMG APEX 15 XMG APEX 15 XMG APEX 15 XMG APEX 15

DDR5 Arrives at 4800 MT/s Speeds, First SoCs this Year

Cadence, a fabless semiconductor company focusing on the development of IP solutions and IC design and verification tools, today posted an update regarding their development efforts for the 5th generation of DDR memory which is giving us some insights into the development of a new standard. The new DDR5 standard is supposed to bring better speeds and lower voltages while being more power-efficient. In the Cadence's blog called Breakfast Bytes, one of Cadence's memory experts talked about developments of the new standards and how they are developing the IP for the upcoming SoC solutions. Even though JEDEC, a company developing memory standards, hasn't officially published DDR5 standard specifications, Cadence is working closely with them to ensure that they stay on track and be the first on the market to deliver IP for the new standard.

Marc Greenberg, a Cadence expert for memory solutions was sharing his thoughts in the blog about the DDR5 and how it is progressing. Firstly, he notes that DDR5 is going to feature 4800 MT/s speeds at first. The initial speeds will improve throughout the 12 months when the data transfer rate will increase in the same fashion we have seen with previous generation DDR standards. Mr. Greenberg also shared that the goals of DDR5 are to have larger memory dies while managing latency challenges, same speed DRAM core as DDR4 with a higher speed I/O. He also noted that the goal of the new standard is not the bandwidth, but rather capacity - there should be 24Gb of memory per die initially, while later it should go up to 32Gb. That will allow for 256 GB DIMMs, where each byte can be accessed under 100 ns, making for a very responsive system. Mr. Greenberg also added that this is the year of DDR5, as Cadence is receiving a lot of orders for their 7 nm IP which should go in production systems this year.
Cadence DDR5

Micron to Launch HBM2 Memory This Year

Micron Technologies, in the latest earnings report, announced that they will start shipping High-Bandwidth Memory 2 (HBM2) DRAM. Used for high-performance graphics cards, server processors and all kinds of processors, HBM2 memory is wanted and relatively expensive solution, however, when Micron enters the market of its manufacturing, prices, and the market should adjust for the new player. Previously, only SK-Hynix and Samsung were manufacturing the HBM2 DRAM, however, Micron will join them and they will again form a "big-three" pact that dominates the memory market.

Up until now, Micron used to lay all hopes on its proprietary Hybrid Memory Cube (HMC) DRAM type, which didn't gain much traction from customers and it never really took off. Only a few rare products used it, as Fujitsu SPARC64 XIfx CPU used in Fujitsu PRIMEHPC FX100 supercomputer introduced in 2015. Micron announced to suspend works on HMC in 2018 and decided to devote their efforts to GDDR6 and HBM development. So, as a result, we are seeing that they will launch HBM2 DRAM products sometime this year.
Micron HMC High-Bandwidth Memory

Samsung Announces Industry's First EUV DRAM with Shipment of First Million Modules

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it has successfully shipped one million of the industry's first 10 nm-class (D1x) DDR4 (Double Date Rate 4) DRAM modules based on extreme ultraviolet (EUV) technology. The new EUV-based DRAM modules have completed global customer evaluations, and will open the door to more cutting-edge EUV process nodes for use in premium PC, mobile, enterprise server and datacenter applications.

"With the production of our new EUV-based DRAM, we are demonstrating our full commitment toward providing revolutionary DRAM solutions in support of our global IT customers," said Jung-bae Lee, executive vice president of DRAM Product & Technology at Samsung Electronics. "This major advancement underscores how we will continue contributing to global IT innovation through timely development of leading-edge process technologies and next-generation memory products for the premium memory market."
Samsung EUV DDR4

Micron Samples the Industry's First uMCP Product With LPDDR5 to Increase Performance and Battery Life in 5G Smartphones

Micron Technology, Inc., today announced it began sampling the industry's first universal flash storage (UFS) multichip package (uMCP) with low-power DDR5 (LPDDR5) DRAM. The uMCP provides high-density and low-power storage designed to fit on slim and compact midrange smartphone designs.

Micron's new uMCP5 packaging builds on the company's innovation and leadership in multichip form factors. Micron uMCPs combine low-power DRAM with NAND and an onboard controller, using 40% less space compared to a two-chip solution. This optimized configuration saves power, reduces memory footprint and enables smaller and more agile smartphone designs.
RAM Production

Ampere Computing Uncovers 80 Core "Cloud-Native" Arm Processor

Ampere Computing, a startup focusing on making HPC and processors from cloud applications based on Arm Instruction Set Architecture, today announced the release of a first 80 core "cloud-native" processor based on the Arm ISA. The new Ampere Altra CPU is the company's first 80 core CPU meant for hyper scalers like Amazon AWS, Microsoft Azure, and Google Cloud. Being built on TSMC's 7 nm semiconductor manufacturing process, the Altra is a CPU that is utilizing a monolithic die to achieve maximum performance. Using Arm's v8.2+ instruction set, the CPU is using the Neoverse N1 platform as its core, to be ready for any data center workload needed. It also borrows a few security features from v8.3 and v8.5, namely the hardware mitigations of speculative attacks.

When it comes to the core itself, the CPU is running at 3.0 GHz frequency and has some very interesting specifications. The design of the core is such that it is 4-wide superscalar Out of Order Execution (OoOE), which Ampere refers to as "aggressive" meaning that there is a lot of data throughput going on. The cache levels are structured in a way that there is 64 KB of L1D and L1I cache per core, along with 1 MB of L2 cache per core as well. For system-level cache, there is 32 MB of L3 available to the SoC. All of the caches have Error-correcting code (ECC) built-in, giving the CPU a much-needed feature. There are two 128-bit wide Single Instruction Multiple Data (SIMD) units, which are there to do parallel processing if needed. There is no mention if they implement Arm's Scalable Vector Extensions (SVE) or not.

Europe Readies its First Prototype of Custom HPC Processor

European Processor Initiative (EPI) is a Europe's project to kickstart a homegrown development of custom processors tailored towards different usage models that the European Union might need. The first task of EPI is to create a custom processor for high-performance computing applications like machine learning, and the chip prototypes are already on their way. The EPI chairman of the board Jean-Marc Denis recently spoke to the Next Platform and confirmed some information regarding the processor design goals and the timeframe of launch.

Supposed to be manufactured on TSMC's 6 nm EUV (TSMC N6 EUV) technology, the EPI processor will tape-out at the end of 2020 or the beginning of 2021, and it is going to be heterogeneous. That means that on its 2.5D die, many different IPs will be present. The processor will use a custom ARM CPU, based on a "Zeus" iteration of Neoverese server core, meant for general-purpose computation tasks like running the OS. When it comes to the special-purpose chips, EPI will incorporate a chip named Titan - a RISC-V based processor that uses vector and tensor processing units to compute AI tasks. The Titan will use every new standard for AI processing, including FP32, FP64, INT8, and bfloat16. The system will use HBM memory allocated to the Titan processor, have DDR5 links for the CPU, and feature PCIe 5.0 for the inner connection.

Intel's Frost Canyon NUC 10 Mini PC is now Available

Intel's latest NUC (Next Unit of Computing) series of Mini PCs, based on the 10th generation of Intel "Core" processors, is now available for purchase. Dubbed Frost Canyon, this NUC series is featuring Intel's 10th generation Comet Lake CPUs at its base. All of the available configurations are based around the Intel Core i7-10710U processor, Intel i219-V Gigabit Lan, Bluetooth 5.0 and Intel WiFi 6 AX200 networking module. Configurations are varying by the amount of pre-installed RAM and storage and the option of whatever you want OS pre-installed or not.

The NUC 10 supports up to 64 GB of DDR4 memory, while the storage options include space for one 2.5 inch SSD/HDD in smaller variants or two 2.5 inch SSD/HDD drives in taller variants, with one NVMe M.2 SSD slot available in both versions. Pricing starts at $679 for the base models, while higher-end configurations cost upward of $1,295. Additionally, it is worth pointing out that all CPUs inside the new NUC are configured to run at 25 W of TPD, regardless of the model. This will result in higher performance compared to 15 W versions of processors found in most laptop solutions.

ADATA Launches High-Capacity XPG Hunter DDR4 Modules

ADATA Technology, a leading manufacturer of high-performance DRAM modules, NAND Flash products, and mobile accessories today announces the launch of the XPG Hunter DDR4 memory module. Geared toward PC enthusiasts and gamers, the XPG Hunter delivers all the benefits of DDR4 with remarkable performance and efficiency. It supports XMP 2.0 for easy overclocking and offers great stability, making it ideal for performance seekers - gaming to competitive benchmarking. It comes in U-DIMM and SO-DIMM variants to meet the needs of desktop and notebook users alike.

The XPG Hunter modules are made with high-quality chips selected through a strict filtering process. They are equipped with the finest PCBs and pass rigid reliability and compatibility tests to ensure longevity and rugged durability, which are vital for overclocking, gaming, and extreme benchmarking. The modules deliver high-speed performance of up to 3200 MHz and comes with capacities of 4 GB, 8 GB, 16 GB, or 32 GB to meet the needs of diverse users and budgets.

ChangXin Becomes China's First Domestic DRAM Supplier

ChangXin Memory Technologies, a Chinese startup founded in 2016 that was formerly known as "Innotron Memory", now claims that it has become China's first and only domestic DRAM supplier. Following the announcement that it started production of domestic DRAM chips, ChangXin is now reportedly shipping its first DRAM wafers. With an output of around 20000 wafers per month, the company is currently building LPDDR4, DDR4 8Gbit chips using the "10-nanometer class" node, which is supposed to be 18 or 19 nm size in reality.

The company expects to double its wafer output to 40000 wafers per month sometime around Q2 of 2020 when additional expansion facilities will start production. ChangXin plans to soon open two more manufacturing facilities to start manufacturing even more wafers, in addition to its Fab 1. So far ChangXin has laid-out plans to start manufacturing DRAM technology based on stack capacitor, which is different from the usual trench capacitor technology few companies are pursuing.

ASRock Announces Brand new Mars Series of Mini PCs

The leading global motherboard & graphics card manufacturer, ASRock, a pleasure to launch brand new compact Mini PC - Mars Series. Supports up to Intel Core i5 Quad-Core processor, 32 GB DDR4-2666 MHz, PCIe NVMe M.2 SSD, 2.5-inch hard drive, and wireless connectivity; all implies into 0.7-liter chassis with 26 mm height.

ASRock Mars offers abundant USB devices connectivity, features a total of 7 USB ports, including one Type-C port; In addition, the native SD card reader and dual display outputs to provide more productive and convenience.

Samsung Starts Offering First A-Die Based RAM

Samsung's B die has been widely known as a good, high performance variant of DRAM memory, loved by overclockers because of its ability to get to a high frequency with relatively low timings. However, B die has been discontinued and now Samsung started offering its replacement in form of the newly developed A die manufactured in 1z nm (1z class) lithography process. Despite the lack of technical details surrounding the new die type, Hardwareluxx has received a tip from its reader about new RAM offering that incorporates A die memory.

The M378A4G43AB2-CVF, as it is called in the listing, is a 32 GB, single dimm DDR4 RAM with operating speed of 2933 MHz and CL21-21-21 timings. This particular offer isn't something to be excited about as the frequency is good, but the timings are quite high for that speed. Given that we don't know where the A die is targeted at, we can speculate that its current aim is at mid-tier systems, where the mediocre performance is okay and the system isn't suffering (performance wise) because of it. Nonetheless this find is quite interesting as it gives first hints at what can we expect in therms of future A die DRAM offerings. Remember, it took some time for B die as well to get to the level of performance we have today, so it is entirely possible that A die will improve and try to aim for greater performance level than it currently has.

Micron Commences Volume Production of 1z Nanometer DRAM Process Node

Micron Technology, Inc. (Nasdaq: MU), today announced advancements in DRAM scaling, making Micron the first memory company to begin mass production of 16 Gb DDR4 products using 1z nm process technology

"Development and mass production of the industry's smallest feature size DRAM node are a testament to Micron's world-class engineering and manufacturing capabilities, especially at a time when DRAM scaling is becoming extremely complex," said Scott DeBoer, executive vice president of Technology Development for Micron Technology. "Being first to market strongly positions us to continue offering high-value solutions across a wide portfolio of end customer applications."

Intel Starts Shipping 10 nm Ice Lake CPUs to OEMs

During its second quarter earnings call, Intel announced that it has started shipping of 10th generation "Core" CPUs to OEMs. Making use of 10 nm lithography, the 10th generation of "Core" CPUs, codenamed Ice Lake, were qualified by OEMs earlier in 2019 in order to be integrated into future products. Ice Lake is on track for holiday season 2019, meaning that we can expect products on-shelves by the end of this year. That is exciting news as the 10th generation of Core CPUs is bringing some exciting micro-architectural improvements along with the long awaited and delayed Intel's 10nm manufacturing process node.

The new CPUs are supposed to get around 18% IPC improvement on average when looking at direct comparison to previous generation of Intel CPUs, while being clocked at same frequency. This time, even regular mobile/desktop parts will get AVX512 support, alongside VNNI and Cryptography ISA extensions that are supposed to bring additional security and performance for the ever increasing number of tasks, especially new ones like Neural Network processing. Core configurations will be ranging from dual core i3 to quad core i7, where we will see total of 11 models available.

G.SKILL Announces OC World Cup 2019 Competition

G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory and gaming peripherals, is excited to announce the 6th Annual OC World Cup 2019. The online qualifier competition stage will be held from March 13, 2019 until April 16, 2019 on hwbot.org. The top 9 winners of the online qualifier will be qualified to join the live competition at the G.SKILL booth during Computex 2019 week from May 29th to 31st and compete for a chunk of the $25,000 USD cash prize pool.

With the participation of top overclockers from around the world and carefully designed rules, G.SKILL OC World Cup is considered as one of the most challenging overclocking competition by professional overclockers. The G.SKILL OC World Cup consists of three rounds: Online Qualifier, Live Qualifier, and Grand Final. The top 9 winners of the Online Qualifier will receive eligibility to enter the Live Qualifier stage during Computex 2019 and demonstrate their finest LN2 extreme overclocking skills at the G.SKILL booth.

Samsung Ready with 32GB DDR4 UDIMMs for Desktops, Paving the Way for 16GB Single-Rank

Samsung is ready with a 32 GB DDR4 UDIMM (unbuffered DIMMs) targeted at desktops. Dual-channel kits with these modules could let you max out the 64 GB memory limit of today's mainstream desktop processors, and 128 GB limits of Intel's Core X HEDT processors, with quad-channel kits. AMD's Ryzen Threadripper processors are advertised to support up to 2 TB of memory (including ECC support), so it should finally be possible to pack up to 256 GB of memory on Threadripper-powered machines.

The new M378A4G43MB1-CTD DDR4 UDIMM from Samsung is, unsurprisingly, a dual-rank module (x8 / x16 Organization or up to 2 ranks per DIMM and 2DPC configuration). It ticks at DDR4-2666 at a module voltage of 1.2 V. The module itself won't be much to look at, with a green PCB and bare-naked DRAM chips. It is is currently sampling to PC OEMs. It could also be possible for more popular memory manufacturers to get in touch with Samsung for the DRAM chips that make up this module. A single-rank variant of this module could finally make it possible for AMD Ryzen AM4 machines to have 32 GB of dual-channel memory at acceptably high memory clocks.
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