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Micron Commences Volume Production of 1z Nanometer DRAM Process Node

Micron Technology, Inc. (Nasdaq: MU), today announced advancements in DRAM scaling, making Micron the first memory company to begin mass production of 16 Gb DDR4 products using 1z nm process technology

"Development and mass production of the industry's smallest feature size DRAM node are a testament to Micron's world-class engineering and manufacturing capabilities, especially at a time when DRAM scaling is becoming extremely complex," said Scott DeBoer, executive vice president of Technology Development for Micron Technology. "Being first to market strongly positions us to continue offering high-value solutions across a wide portfolio of end customer applications."

Intel Starts Shipping 10 nm Ice Lake CPUs to OEMs

During its second quarter earnings call, Intel announced that it has started shipping of 10th generation "Core" CPUs to OEMs. Making use of 10 nm lithography, the 10th generation of "Core" CPUs, codenamed Ice Lake, were qualified by OEMs earlier in 2019 in order to be integrated into future products. Ice Lake is on track for holiday season 2019, meaning that we can expect products on-shelves by the end of this year. That is exciting news as the 10th generation of Core CPUs is bringing some exciting micro-architectural improvements along with the long awaited and delayed Intel's 10nm manufacturing process node.

The new CPUs are supposed to get around 18% IPC improvement on average when looking at direct comparison to previous generation of Intel CPUs, while being clocked at same frequency. This time, even regular mobile/desktop parts will get AVX512 support, alongside VNNI and Cryptography ISA extensions that are supposed to bring additional security and performance for the ever increasing number of tasks, especially new ones like Neural Network processing. Core configurations will be ranging from dual core i3 to quad core i7, where we will see total of 11 models available.

G.SKILL Announces OC World Cup 2019 Competition

G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory and gaming peripherals, is excited to announce the 6th Annual OC World Cup 2019. The online qualifier competition stage will be held from March 13, 2019 until April 16, 2019 on hwbot.org. The top 9 winners of the online qualifier will be qualified to join the live competition at the G.SKILL booth during Computex 2019 week from May 29th to 31st and compete for a chunk of the $25,000 USD cash prize pool.

With the participation of top overclockers from around the world and carefully designed rules, G.SKILL OC World Cup is considered as one of the most challenging overclocking competition by professional overclockers. The G.SKILL OC World Cup consists of three rounds: Online Qualifier, Live Qualifier, and Grand Final. The top 9 winners of the Online Qualifier will receive eligibility to enter the Live Qualifier stage during Computex 2019 and demonstrate their finest LN2 extreme overclocking skills at the G.SKILL booth.

Samsung Ready with 32GB DDR4 UDIMMs for Desktops, Paving the Way for 16GB Single-Rank

Samsung is ready with a 32 GB DDR4 UDIMM (unbuffered DIMMs) targeted at desktops. Dual-channel kits with these modules could let you max out the 64 GB memory limit of today's mainstream desktop processors, and 128 GB limits of Intel's Core X HEDT processors, with quad-channel kits. AMD's Ryzen Threadripper processors are advertised to support up to 2 TB of memory (including ECC support), so it should finally be possible to pack up to 256 GB of memory on Threadripper-powered machines.

The new M378A4G43MB1-CTD DDR4 UDIMM from Samsung is, unsurprisingly, a dual-rank module (x8 / x16 Organization or up to 2 ranks per DIMM and 2DPC configuration). It ticks at DDR4-2666 at a module voltage of 1.2 V. The module itself won't be much to look at, with a green PCB and bare-naked DRAM chips. It is is currently sampling to PC OEMs. It could also be possible for more popular memory manufacturers to get in touch with Samsung for the DRAM chips that make up this module. A single-rank variant of this module could finally make it possible for AMD Ryzen AM4 machines to have 32 GB of dual-channel memory at acceptably high memory clocks.

NVIDIA "TU102" RT Core and Tensor Core Counts Revealed

The GeForce RTX 2080 Ti is indeed based on an ASIC codenamed "TU102." NVIDIA was referring to this 775 mm² chip when talking about the 18.5 billion-transistor count in its keynote. The company also provided a breakdown of its various "cores," and a block-diagram. The GPU is still laid out like its predecessors, but each of the 72 streaming multiprocessors (SMs) packs RT cores and Tensor cores in addition to CUDA cores.

The TU102 features six GPCs (graphics processing clusters), which each pack 12 SMs. Each SM packs 64 CUDA cores, 8 Tensor cores, and 1 RT core. Each GPC packs six geometry units. The GPU also packs 288 TMUs and 96 ROPs. The TU102 supports a 384-bit wide GDDR6 memory bus, supporting 14 Gbps memory. There are also two NVLink channels, which NVIDIA plans to later launch as its next-generation multi-GPU technology.

NAND Flash Supply to Improve in 1Q18

DigiTimes, quoting industry sources, reports that NAND flash supply should see improvements from its 4Q17 state in 2018. This likely doesn't come as much of a surprise - 2017 has been a sort of "squeeze" year for NAND and DDR memory manufacturing, with companies increasing production without committing to fully satisfy demand, which in turn translates to longer term higher pricing of memory. Still, those tentative increases to production capabilities should begin to release the memory pricing squeeze during 1Q18, with ASP (average selling price) coming down.

The increase in production and supply doesn't come solely from factory floor expansions, however; there's also been reports of increased yields of 3D NAND fabrication technologies, which should also increase availability in the best way possible for manufacturers.
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