At CES 2026, Cooler Master showed off its latest PC cases from the COSMOS and MasterFrame lines, along with a range of matching add-ons. The high-end COSMOS series now includes the new COSMOS Alpha case. It is built using a modular design, curved aluminium frame and tempered glass side panels. One of its standout features is a sliding motherboard tray, which allows the internal layout to be adjusted for cleaner airflow or liquid-cooling-focused builds. Cooler Master also includes a sliding, adjustable fan bracket that supports multiple fan sizes. COSMOS Alpha can house E-ATX and EEB motherboards in addition to ATX and microATX, graphics cards up to 400 mm long, and power supplies up to 240 mm. Cooling support includes up to 15 fans, with dual pre-installed 200 × 38 mm extra-thick fans, removable dust filters, and radiators up to 420 mm.

Cooler Master also expanded its open-frame MasterFrame lineup with the new MasterFrame 360 series, built around a 360-degree display concept. The series includes three variants: MasterFrame 360 Panorama, a sealed tempered-glass enclosure designed for full visibility and protection; MasterFrame 360 Stage Mirror, an open-frame design with a mirrored base to enhance visual depth; and MasterFrame 360 Stage LCD, which integrates a 15.6-inch display for custom visuals or use as a secondary screen.

Today, on the opening day at CES, Neurable announced it's working with HP Inc.'s HyperX gaming brand to develop an industry-first gaming headset outfitted with neurotechnology. This strategic collaboration demonstrates how AI and neuroscience can work together to help players improve their focus and accuracy by interpreting brain activity in real time.

"We've always been about empowering power players with the best technology to play, and now with our strategic collaboration with Neurable, we look forward to giving more insight into how one's cognitive skills and focus impacts their gameplay to ultimately make them as competitive as possible," said Josephine Tan, Senior Vice President and Division President of Personal Systems Gaming Solutions, HP Inc.

[Editor's note: We updated the article with additional photos. More images follow after the break.]

Today at CES, Intel unveiled Intel Core Ultra Series 3 processors, the first AI PC platform built on Intel 18A process technology that was designed and manufactured in the United States. Powering over 200 designs from leading, global partners, Series 3 will be the most broadly adopted and globally available AI PC platform Intel has ever delivered.

Within the Intel Core Ultra Series 3 mobile lineup, a new class of Intel Core Ultra X9 and X7 processors come packed with the highest performing, integrated Intel Arc graphics. They are purpose-built for multitaskers that handle advanced workloads like gaming, creation and productivity on the go. The top SKUs feature up to 16 CPU cores, 12 Xe -cores and 50 NPU TOPS, delivering up to 60% better multithread performance over 77% faster gaming performance and up to 27 hours of battery life.

NVIDIA DGX SuperPOD is paving the way for large-scale system deployments built on the NVIDIA Rubin platform—the next leap forward in AI computing. At the CES trade show in Las Vegas, NVIDIA today introduced the Rubin platform, comprising six new chips designed to deliver one incredible AI supercomputer, and engineered to accelerate agentic AI, mixture-of-experts (MoE) models and long-context reasoning. The Rubin platform unites six chips—the NVIDIA Vera CPU, Rubin GPU, NVLink 6 Switch, ConnectX-9 SuperNIC, BlueField-4 DPU and Spectrum-6 Ethernet Switch—through an advanced codesign approach that accelerates training and reduces the cost of inference token generation.

DGX SuperPOD remains the foundational design for deploying Rubin-based systems across enterprise and research environments. The NVIDIA DGX platform addresses the entire technology stack—from NVIDIA computing to networking to software—as a single, cohesive system, removing the burden of infrastructure integration and allowing teams to focus on AI innovation and business results. "Rubin arrives at exactly the right moment, as AI computing demand for both training and inference is going through the roof," said Jensen Huang, founder and CEO of NVIDIA.

AI is powering breakthroughs across industries, helping enterprises operate with greater intelligence and speed. As AI factories scale, the next generation of enterprise AI depends on infrastructure that can efficiently manage data, secure every stage of the pipeline and accelerate the core services that move, protect and process information alongside AI workloads.

NVIDIA has expanded the NVIDIA Enterprise AI Factory validated design to include NVIDIA BlueField cybersecurity and infrastructure acceleration capabilities. This accelerates the data center services that keep AI factories running and delivers security that can operate at the same speed as AI. Leading software platforms from NVIDIA BlueField ecosystem partners Armis, Check Point, F5, Fortinet, Palo Alto Networks, Rafay, Red Hat, Spectro Cloud and Trend Micro are now validated as part of NVIDIA Enterprise AI Factory, helping enterprises enhance runtime protection, streamline operations and strengthen the infrastructure that powers AI.

Acer today unveiled four new monitors, including three premium models for gamers and a cutting-edge 6K display for creators, as well as an eco-friendly laser projector for gamers and home cinema fans. The three gaming monitors fulfill gamers' needs for speed and precision to achieve spectacular performance in every gaming match.

These models include the Predator XB273U F6 that features AMD FreeSync Premium and delivers up to 1000 Hz motion clarity, giving competitive players the split-second advantage required to stay ahead in the fastest-paced titles; the Predator X34 F3, delivering 360 Hz speed and outstanding visual quality with a brilliant QD-OLED panel; and the Nitro XV270X P, supporting crystal-clear 5K resolution and up to 330 Hz refresh rates for staying on top of a wide range of esports. The Acer ProDesigner PE320QX monitor for professional creators provides stunning 6K clarity and smooth, high-performance visuals across all major display interfaces. In addition, the Acer Vero HL1820 RGB laser projector features 4K UHD resolution visuals in an eco-friendly design for enjoying both films and gameplay.

At CES 2026, ADATA showed off its latest consumer portable SSD products. The ADATA SR800 is a combination of a portable SSD and a power bank, for smartphones and with USB-C interfaces. The drive features a USB 3.2 Gen 2x2 (20 Gbps) data-interface, and comes in capacities of 1 TB and 2 TB, offering sequential transfer speeds of 2 GB/s. As a power bank, it packs a 5000 mAh battery, and can deliver up to 15 W of power over wire, and 15 W over Qi-compatible wireless. It can latch onto your phone with a magnetic surface, recharge it, while you're moving stuff to its storage.

ADATA Project BulletX is a USB4 portable SSD that comes in a form-factor resembling the SE920, but much smaller. ADATA claims that this is the industry's most compact USB4 SSD. The drive fully saturates 40 Gbps USB4, offering sequential speeds of up to 4 GB/s reads, with up to 3.6 GB/s writes, and comes in capacities ranging from 1 TB to 4 TB. ADATA Project TapSafe is an upcoming secure portable SSD that features NFC smart card-based unlock mechanism, it integrates an NFC reader. The drive features a 20 Gbps USB 3.2 Gen 2x2 interface and comes in capacities of 1 TB and 2 TB, with up to 2 GB/s of sequential transfer speeds.

Acer today introduced its newest lineup of versatile gaming laptops powered by the latest Intel Core Ultra Series 3 processors, paired with NVIDIA GeForce RTX 50 Series Laptop GPUs, delivering great performance, premium graphics, and AI-enabled capabilities across the board. The lineup features the Predator Helios Neo 16S AI, Acer Nitro V 16 AI, and Acer Nitro V 16S AI gaming laptops, offering various processor and design options for every type of gamer. In addition, Acer announced the new Predator Galea 570 gaming headset and the Predator Cestus gaming mouse for a complete premium gaming experience.

Predator Helios Neo 16S AI: Power Meets Portability
Leading the pack, the Predator Helios Neo 16S AI (PHN16S-I51) is equipped with up to an Intel Core Ultra 9 processor 386H and NVIDIA GeForce RTX 5070 Laptop GPU housed in an 18.9 mm slim metal chassis, fusing durability with a premium aesthetic design. Powered by NVIDIA Blackwell, GeForce RTX 50 Series Laptop GPUs bring game-changing capabilities to gamers and creators. Equipped with a massive level of AI horsepower, the RTX 50 Series enables new experiences and next-level graphics fidelity. Multiply performance with NVIDIA DLSS 4 and generates images at unprecedented speed.

ADATA in its 2026 International CES booth showcased its consumer flash and embedded storage products. We begin our tour with a swanky SDXC card based on the SD 8.0 form-factor that implements SD Express, which is physically PCIe Gen 3 x2 and NVMe 1.3, for sequential speeds of up to 1.6 GB/s reads, with up to 1.2 GB/s writes. The card uses an SMI SM2708 controller, and comes in capacities of 512 GB and 1 TB. Next up is the company's latest microSDXC card that's based on the SD 7.1 standard with SD Express PCIe Gen 3 x1 interface, the same SM2708 controller as its larger sibling, and capacities of 256 GB, 512 GB, and 1 TB. On offer is sequential performance of 800 MB/s reads with up to 700 MB/s writes. The card is compatible with Nintendo Switch 2.

We now move into embedded memory products, with the ePOP package eMMC module, the EPOP51C-02G32ATE. This product combines eMMC and LPDDR4X into a single package that sits on top of SoCs. The storage side of it is 32 GB 3D TLC NAND, and the memory side of it is 32 GB LPDDR4X in HS400 mode. The storage offers sequential speeds of up to 190 MB/s reads with up to 115 MB/s sequential writes. The EMMC51C-128GBTE is an exclusive eMMC package that comes in 128 GB capacity, with HS400 DDR capabilities, and sequential speeds of 300 MB/s reads with 260 MB/s writes. The UFS31A-512GATE is a UFS 3.1 storage device that comes in 512 GB capacity, with sequential speeds of 2.2 GB/s reads with 1.9 GB/s writes. The UFS31A-256GATE is its 256 GB variant.

Our tour through the ADATA booth at 2026 CES took us through its datacenter product brand Trusta. We now bring you memory and storage products from its main marquee. Starting things off, we have the DDR5 ECC UDIMM, which comes in speeds of DDR5-6400 and DDR5-7200 using a clock driver, and densities of 16 GB, 32 GB, and 64 GB. It is compatible with the latest server platforms from Intel and AMD. Next up, is the ISSS31AP, a 2.5-inch SATA 6 Gbps SSD designed for industrial PCs, and servers where extreme endurance is called for. The drive comes in various capacities based on NAND flash type, ranging between 480 GB to 1.92 TB for eTLC, 128 GB to 2 TB for 3D TLC, 3.84 TB to 7.68 TB for high-density 3D TLC, and 4 TB to 8 TB for high-density 3D TLC high-endurance.

The IM2P41F4 is an industrial SSD in the M.2-2242 form-factor with Gen 4 NVMe interface, capacities ranging between 256 GB to 2 TB, and impressive sequential speeds of 7 GB/s reads with 6.5 GB/s writes, with high temperature endurance range of -40°C to +85°C. The IM2P52D8P is a modern Gen 5 NVMe industrial SSD with capacities ranging between 256 GB to 8 TB, with sequential transfer speeds of 14.8 GB/s reads with 14 GB/s writes, and the same -40°C to +85°C wide temperature range as its M.2-2242 sibling. The IM2P41B8P is a Gen 4 M.2-2280 drive with wide capacity range between 80 GB and 8 TB, with 7 GB/s max sequential reads, and 6.5 GB/s max sequential writes, and wide temperature range.

This year at CES 2026, MSI proudly unveils a new generation of PC hardware designed to inspire industry professionals and enthusiasts with innovative solutions that make building, upgrading, and personalizing systems more accessible and exciting than ever before. From a new line-up of motherboards, brand new Power Supplies with exclusive features, a flagship triple-sided panoramic chassis paired with a curved OLED display liquid cooler, and two Dual-Tower Air Coolers making their debut, MSI aims to showcase its commitment to pushing boundaries. Let's take a quick look below at what you'll find at MSI's CES 2026 show floor.

Brand New AMD X870(E)/B850 MAX Series Motherboards - Engineered for Maximum Performance
MSI will showcase its latest AMD MAX series motherboards at CES, spanning X870(E) and B850 chipsets to cover a wide range of performance needs. Each MAX model features an integrated OC Engine that enables asynchronous BCLK control for precise frequency tuning, delivering up to 15% higher gaming performance in supported scenarios. Building on MSI's EZ DIY approach, the onboard Direct OC Jumper allows real-time BCLK adjustments directly in the operating system, and the new BCLK Booster adds a simple one-click option for quick overclocking. To support a more feature complete BIOS experience, all MAX motherboards also include an upgraded 64 MB BIOS chip, expanding ROM capacity for current and future AMD processors.

Thermaltake unveiled two new gaming monitors at the CES 2026 show in Las Vegas, including a 27-inch 4K UHD Fast IPS monitor and the 49-inch curved OLED DQHD (5K) monitor with a 240 Hz refresh rate. The star of the show is the gigantic 49-inch curved OLED monitor with 5120x1440 resolution and a 32:9 aspect ratio. It has an MSRP of $899.99 and should come in Q1 2026. It uses an OLED panel with a 240 Hz refresh rate, 0.03 ms response time, and HDR with a DCI-P3 99% color gamut. Furthermore, it is also equipped with a smart KVM switch, comes with a USB Type-C (PD 90 W) port, as well as two HDMI 2.0 and one DisplayPort 1.4 input. It is NVIDIA G-Sync compatible and supports AMD FreeSync.

The 27-inch 4K UHD RGB gaming monitor uses a Fast IPS panel with 1 ms response time and features a dual mode, pushing 160 Hz at 4K or 320 Hz at FHD resolution. It supports HDR400, has two HDMI 2.1 and one DisplayPort 1.4 input, USB Type-C (PD 15 W), RGB ambient lighting that supports Thermaltake's software, and an adjustable stand. It is also NVIDIA G-Sync Compatible and supports AMD FreeSync. This one should also come soon with an MSRP of $339.99.

MSI has unveiled a new lineup of 27-inch displays and all-in-one systems, catering to the demand for high-quality retina-level displays with fast refresh rates. The two high-performance 27-inch 5K monitors feature Rapid IPS panels with a pixel density of 218 PPI. The MAG 271KPD7 is a "Dual Mode" display that can switch between a high-fidelity 5K resolution at 75 Hz and a performance-focused 2K resolution at 300 Hz. It offers a 0.5 ms GtG response time, VESA DisplayHDR 400, and Delta E < 2 color accuracy. Connectivity options include HDMI 2.1, DisplayPort 1.4a, and a USB-C port with 15 W Power Delivery, all supported by G-SYNC compatibility and Display Stream Compression (DSC).

The more premium MPG 271KRAW16 enhances these features with a Mini-LED backlight with 2,304 zones and Quantum Dot technology, achieving a VESA DisplayHDR 1400 rating. Its Dual Mode capabilities are faster, offering 5K at 165 Hz or 2K at 330 Hz. Connectivity is further improved with DisplayPort 2.1 (UHBR13.5) and a USB-C port capable of up to 98 W Power Delivery.

TRUSTA, the enterprise storage brand launched by ADATA this year, showcased its full portfolio of products and solutions at CES 2026. Leading the line is the T7P5 PCIe Gen 5 x4 SSD series, in U.2, E3.5 and E1.5 form factors, offering storage capacities of 1.92 TB, 3.84 TB and 7.68 TB. The series uses 3D eTLC NAND memory and offers read speeds of up to 13,500 MB/s and write speeds of up to 10,400 MB/s, with 4K random IOPS of 3,200 K read / 470 K write.

TRUSTA also showcased solutions using SATA III and PCIe Gen 4 x4 interfaces. The TD5S30 series features 2.5" SATA III SSDs with maximum read/write speeds of 530 / 510 MB/s, 4 K random IOPS of 80 K / 50 K, and capacities of 400 GB, 960 GB, 1.92 TB, 3.84 TB, and 7.68 TB. The TB3S30 series also uses SATA III, this time in M.2 format, with storage capacities from 120 GB to 1.92 TB, read/write speeds of 560 / 490 MB/s, and 4 K random IOPS of 80 K / 70 K.

Thermaltake brought its full Retro series to the CES 2026 show, including new cases, LCD screens, AIO coolers, and keyboards, showing what can be done when you combine modern specifications and features with retro design, and it definitely looks good. The new Thermaltake Retro lineup includes the Retro 260 TG and Retro 360 TG PC cases, which cover microATX and mid-tower form-factors, new retro LCD screens, Retro Ultra ARGB Sync AIO liquid cooler in 240 mm and 360 mm versions that comes with a 3.6-inch retro-style TFT screen, and the RetroCraft keyboard and RetroSwift mouse to complement the setup.

Of course, the star of the show is the Retro 360 TG, a mid-tower chassis with a retro front panel that even features a mockup 3.5-inch floppy disk drive. It is compatible with the Thermaltake 6-inch LCD screen, supports ATX motherboards, has a lower PSU chamber, and supports up to thirteen 120 mm fans and 360 mm AIO at the top and right side. The Retro 260 is a smaller version that is also compatible with the same 6-inch LCD screen kit but supports microATX motherboards and up to twelve 120 mm fans or 280 mm AIO at the top of the case.

MSI showcased a high-capacity dual-CUDIMM platform at its CES 2026 booth, introducing a new approach that emphasizes high memory capacity in a compact form factor. With just two 128 GB DDR5 CUDIMMs, MSI achieves 256 GB of capacity on an Intel Core Ultra 200S series platform. Currently in development, this platform will be part of the MSI MEG family and will support four-rank CUDIMMs, which MSI claims offer 63% higher overclocking performance compared to standard platform alternatives. By using only two memory DIMMs, the board optimizes memory overclocking by reducing the number of traces that can cause cross talk between the DDR5 lanes, which carry signals to and from the CPU.

In partnership with ADATA, MSI is testing four-rank DDR5 CUDIMMs that enable large capacities per memory DIMM. This results in a 128 GB CUDIMM that not only offers substantial capacity but also allows higher overclocks than standard non-clock driven DDR5 DIMMs. While there is no information on the launch date, MSI plans to release these dual-CUDIMM motherboards in the near future, likely when memory prices stabilize and any remaining issues are resolved, allowing consumers to experience high speeds at large capacities. MSI is already experimenting with AMD-based motherboards as well, just like the UNIFY-X X870E motherboard pictured below. It also has two memory DIMM slots for extreme memory OC, but runs an AMD platform. This motherboard is finalized, and will feature 18+2+1 110 A dual rail SPS power delivery, built on the server-grade eight-layer PCB.

In addition to the new full Retro lineup of products, Thermaltake has brought several new power supply units to the CES 2026 show in Las Vegas, including the AX-series 3000 W model, the well-known Toughpower series in both ATX and SFX form factors, and a whole new Golden Track series with a new twist on the modular design. Thermaltake also unveiled its new Dr. Power III Pro, a power supply tester and information hardware device.

The list obviously starts with Thermaltake's two flagship PSUs, the Toughpower i1650 Titanium and the AX 3000W models. The Toughpower i1650 Titanium is a 1650 W PSU with 80 Plus Titanium certification, an option to switch between single- and multi-rail in order to meet various needs, and an option to monitor each output via software. It features Thermaltake's iRGB PLUS, which means it is equipped with a 16.8 million-color, 18-LED RGB fan. It supports a 200 percent power boost, has < 30 mV low ripple noise design and extremely strict < 2% voltage regulation, uses dual-color design for 12V-2x6 connectors, and features low-profile etched flat cables.

At the 2026 International CES show, MSI unveiled its most powerful GPU creation to date: GeForce RTX 5090 Lightning Z GPU. Coming as a fully custom PCB design, the board carries an GB202 GPU of the RTX 5090 with a factory boost clock of 2,730 MHz, and an "Extreme Performance" OC profile of 2,775 MHz. This results in the fastest LN2 GeForce RTX 5090 GPU ever, reaching as high as 3,742 MHz when put thought the hands of professional overclockers. Fully enabling this is the 40-phase VRM design that can provide smooth voltage curve needed to feed the GPU, with a maximum power rating of 800 W out of the box, while the "Extreme" power preset mode gives it a 1000 W power envelope on the 360 mm AIO water cooling. The card is powered by dual 16-pin 12V-2x6 power connectors, each giving the maximum of 600 W.

MSI has used the 28 Gbps Samsung GDDR7 modules, which can be overclocked to 36 Gbps on LN2, and probably at 30+ Gbps on the standard watercooling. In its regular form factor that comes from the factory, MSI has made the GPU appear as a small tablet device with its big screen. All you see is the yellow theme of the card and two tubes connected to the 360 mm radiator that dissipates a kilowatt of heat. In addition to the massive radiator, the GPU is covered in full-copper cold plate that entirely covers the 3 oz copper PCB, cooling the GPU, VRMs, and memory for a true all-in-one cooling. The pictures follow below.

Digital Storm today unveiled two new desktop platforms at CES 2026, Vector and Aventum 5, which showcase two distinct approaches to modern high-end computing: an unapologetically extreme liquid-cooled tower and a dramatically slimmer performance desktop that condenses serious hardware into a compact footprint.

Rethinking High-End Desktops
For the last decade, many high-end desktops have grown bigger, louder, and more power hungry in the race for peak numbers. Vector and Aventum 5 take a different path, focusing on how a PC performs and behaves over hours of rendering, creation, or AI workloads, not just what it hits in a 30-second benchmark run. Both platforms are engineered around modern CPUs from Intel and AMD and graphics options up to NVIDIA RTX 6000 Pro Blackwell.

Audeze has launched its Maxwell 2 Wireless Gaming Headset at CES 2026 and the new model appears to have been given refinements all around. The Maxwell 2 retains the 90 mm planar magnetic drivers, but everything from the headband to the earcups have been upgraded. Starting with the earcups, they're now attached magnetically, making them easier to remove and they've also been given clearer markings inside and a slight redesign. The headband appears to be slightly wider and it now has perforations to keep your head cooler and the attachment points have been refined. The power button appears to have been moved to the side of the left earcup, rather than sitting in the centre of one of the earcups, next to what appears to be a Bluetooth/proprietary dongle switch.The rest of the controls appear to have been kept, but with refined labelling and the Maxwell 2 still features a trusty old 3.5 mm jack and a USB Type-C port for charging and audio.

The weight has sadly gone up by 70 grams, which isn't entirely insignificant for long gaming sessions, yet the battery remains at the same 1800 mAh rating and still offers 80 hours of wireless usage. This also means that the charging times remain the same, i.e. two hours for a full charge. A new addition on the Bluetooth codec side appears to be Auracast, which might not be super useful when gaming, but could be handy when watching TV. LC3, LC3plus, LDAC, AAC and SBC are still supported, as is multipoint support. The microphone also appears to remain the same as the one that shipped with the original Maxwell headset, with a sprinkle of AI noise removal. Audeze has also launched a new app to go with Maxwell 2 and will be offering "skins" to customise the headphones with. Unfortunately the price has also gone up, albeit by just US$20-30 depending on the SKU, which means that the PlayStation version starts at US$329 and the Xbox version is coming in at US$349 and is available to order now.

Today, HP Inc. announced the company's newest innovations powering the work of everyday life with updates to its full HP OmniBook consumer portfolio that deliver passion-ready experiences for consumers to work smarter, look sharper, and lead better. "Today's consumers use their PCs in more ways than ever before to create content, stream entertainment, code, or game. And regardless what hat they may wear at any given point - student by day, entrepreneur or freelancer by night - they all need devices that can keep up with whatever comes their way," said Samuel Chang, Senior Vice President and Division President, Consumer Personal Systems at HP Inc. "Our newest OmniBook, OmniStudio, and Chromebook portfolios deliver our widest range of PCs yet - engineered to power the most demanding types of work while designed to enable whatever consumers love to do."

Powerful Performance Meets Stunning Design
The line between work and personal life has become increasingly blurred. Up to 12.5% of the total global workforce is made up of online gig workers, and people are using their PCs not just for school or personal tasks, but for side hustles, freelancing, and exploring their entrepreneurial spirit. Knowledge workers are using AI more than ever, with a 39% increase year-over-year in daily AI use. And close to half of all knowledge workers are optimistic about work because they believe tech will improve it. The company's newest HP OmniBook Ultra and HP OmniStudio X 27 are designed to take advantage of the latest in AI, delivering Copilot+ experiences to get the work done so you have more time to enjoy what you love.

At CES, Qualcomm Technologies, Inc. announced the Snapdragon X2 Plus platform, the newest entrant to Snapdragon X Series. A bold leap forward, it transforms every click and every moment for modern professionals, aspiring creators and everyday users seeking a fast, responsive and portable device with multi-day battery life. With the launch of Snapdragon X2 Plus, Qualcomm Technologies expands the power of Windows 11 Copilot+ PCs across its Snapdragon X Series with select devices from leading OEMs available for purchase in 1H26.

Consumers set the pace. Snapdragon X2 Plus sets the bar.
Modern professionals, aspiring creators and everyday users expect their PCs to keep up with them-from speed to multi-day battery life to built-in AI features. Designed to surpass their pace, Snapdragon X2 Plus delivers lightning-fast performance and fluid multitasking in sleek, ultraportable Windows 11 Copilot+ PCs. Consumers can shift from data-intensive analysis to creative design or video calls without compromise.

Positioned at the forefront of wireless technology, MediaTek today introduced the Filogic 8000 family at CES 2026. This groundbreaking suite of products will spearhead the Wi-Fi 8 ecosystem, representing MediaTek's leadership in advancing wireless connectivity. This upcoming technology will deliver ultra-high reliability across a diverse array of product categories, including gateways (broadband gateways, enterprise access points) and client solutions (smartphones, laptops, TVs, streaming devices, tablets, and IoT devices), and will enhance a wide variety of AI-driven products and applications.

As more connected devices are introduced, the wireless environment is becoming crowded and prone to interference, resulting in unstable connections and slow response times. Reliable Wi-Fi performance is essential to ensure seamless operation, and Wi-Fi 8 is engineered specifically to meet these requirements, delivering robust connectivity and low-latency responsiveness for demanding scenarios, many of which leverage AI technologies. Users will also benefit from better bandwidth, improved power efficiency and optimized connectivity, all leading to a superior user experience.

Late last year, a myriad of Intel manufacturing partners started teasing next-gen "Panther Lake" processor-based devices. In November, GMKtec—a mini PC specialist—took part in a Team Blue-curated 2025 Technology Innovation and Industry Ecology event. Attendees in China witnessed a debuting of the hardware manufacturer's EVO-T2 model. A product placard boasted that the compact desktop system utilized a "Panther Lake H 12Xe3" mobile processor. This past weekend, freshly released GMKtec marketing material confirms that the EVO-T2 will feature Intel's Core Ultra X9 388H APU; presumably in the best available configuration. Up until the new year, Team Blue and involved parties have not publicly confirmed the nomenclature of forthcoming "Panther Lake-H" SKUs.

Officially, GMKtec's most potent Intel CPU-based package was declared worthy of being the company's centerpiece at their CES 2026 booth. The upcoming flagship 16-core Core Ultra X9 388H APU seems to be positioned to take on AMD's best current-gen "Strix Halo" mobile chip: Ryzen AI Max+ 395. According to a past weekend GMKtec Germany blog entry, EVO-T2 demonstration units will be "running AI tools and high-resolution creative software, showcasing real-world performance" at CES 2026. Additionally, company representatives are set to participate in "joint presentations of Intel-powered Edge AI solutions, highlighting the role of Mini PCs in lightweight intelligent computing scenarios." The EVO-T2 is advertised as offering local execution of multimodal generative AI workloads, with "Panther Lake" enabling significantly enhanced on-device AI performance.

HAVIT, a global consumer tech brand, will debut its SPACE Series at CES 2026, the world's leading tech event. Built on HAVIT's advanced acoustic technology, the SPACE Series aims to create a personal and reassuring space that helps users restore focus, calm, and imagination in a noisy and fast-paced world. "With the SPACE Series, we want every user to enjoy their own comfort zone—where fun and imagination are free to flow," said Yao, brand director at HAVIT.

A Reimagined Audio Lineup for Modern Life
The SPACE Series includes three product forms—over-ear, semi-in-ear, and open-ear clip-on—each engineered with tailored acoustic solutions that adapt naturally to real-world scenes.