News Posts matching #HEDT

Return to Keyword Browsing

AMD Ryzen Threadripper 5000 Series Delayed to 2022?

Launch of AMD's upcoming Ryzen Threadripper 5000 series high-end desktop (HEDT) and Threadripper WX workstation processors, is rumored to have been delayed to 2022, according to Greymon55, a reliable source with AMD leaks. Codenamed "Chagall," these processors are compatible with existing sTRX4 and sWRX8 motherboards, based on the AMD TRX40 and AMD WRX80 chipsets, respectively. What's new, is the "Zen 3" microarchitecture.

It remains to be seen if the delay is the result of a last-minute decision by AMD to go with the newer "Zen 3" CCD that comes with 3D Vertical Cache technology, over the conventional "Zen 3" CCD; or some other reason. A 2022 launch would mean that Threadripper 5000 series will be launching around the time when Intel has desktop platforms with DDR5 memory and PCI-Express Gen 5. Threadripper 5000 chips with quad-channel DDR4 memory (four 64-bit wide channels) will be seen offering only comparable memory bandwidth to "Alder Lake" systems with overclocked DDR5 memory (four 40-bit wide channels). AMD is likely to prioritize its next "big" socket for the enterprise segment with EPYC "Genoa," as the company could find itself embattled with Xeon "Sapphire Rapids" processors that come with next-gen I/O.

Intel Sapphire Rapids HEDT Processors & W790 Chipset Rumored to Launch Q3 2022

The Chinese source who published the first images of the Intel LGA1700 socket and Z690 chipset has now revealed some new information regarding the upcoming Alder Lake, Sapphire Rapids-X, and Raptor Lake products. The rumor claims that Intel will launch the W790 Workstation HEDT chipset in Q3 2022 alongside the 13th Generation Sapphire Rapids-X desktop series. This would be the first new HEDT launch from Intel in over 3 years with the previous 10th Gen Cascade Lake processors launching back in April 2019.

The rumor also states that Intel will launch the 13th Generation Raptor Lake desktop processors at the same time as their Sapphire Rapids-X HEDT lineup. There is also a note about Intel releasing the entire 600-series motherboard lineup in 2021 which is contrary to previous rumors which stated that Intel would only make the Z690 chipset available this year. This would be followed by a complete launch of all 12 Generation Alder Lake desktop processors and not just the overclockable K-series. This is the first time we have heard these rumors so while they come from a semi-reliable leaker we would recommend taking them with a healthy dose of skepticism.

AMD Ryzen Threadripper Pro 5945WX and 5995WX Surface

AMD is looking to launch a substantial lineup of HEDT and workstation processors before the end of 2021, based on its latest "Zen 3" microarchitecture. These processors are categorized in two distinct lines—the Ryzen Threadripper 5000X targeting HEDTs, and the Ryzen Threadripper Pro 5000WX targeting workstations. Both are based on different sockets, sTRX4 and sWRX8, respectively, with the latter featuring 8-channel DDR4 memory, compared to the former's 4-channel. Two Ryzen Threadripper Pro 5000WX series chips surfaced on the Milky Way@Home distributed computing database, the 5945WX and 5995WX.

The application identifies the 5945WX as a 12-core/24-thread processor, while the 5995WX is the top-dog 64-core/128-thread part. AMD maintains lower core-count Threadrippers to target the section of the market that seeks I/O capabilities over core-counts (memory bandwidth, a large number of PCIe lanes supporting NVMe RAID or multiple AIC compute accelerators, etc,). The lower core counts also come with higher CPU clock-speeds, benefiting less-parallelized applications. At this point it's not known if the Threadripper 5000 family features the conventional "Zen 3" CCD chiplet, or the new "Zen 3+" chiplets with 64 MB 3D Vertical Cache (3DV cache), but the company is planning to monetize the new chiplet across its EPYC enterprise line as the additional cache benefits certain applications with large streaming data-sets. It's conceivable that the Threadripper Pro series could benefit from 3DV cache, too.

AMD Ryzen Threadripper 5000 "Chagall" Processors Arrive This August in Both sTRX4 and sWRX8 Variants

AMD is preparing to launch the Ryzen Threadripper 5000 "Chagall" HEDT processors in August 2021, according to a MoePC report, confirming a rumor from April 2021. These chips will arrive in core-counts of up to 64, spanning two CPU socket types—sTRX4 (Ryzen Threadripper) and sWRX8 (Ryzen Threadripper PRO), and compatible with existing motherboards that run Ryzen 3000 Threadrippers, requiring a UEFI firmware update. Nearly every retail sTRX4 motherboard we've come across features USB BIOS Flashback, letting you update the firmware of an off-the-shelf motherboard without needing to install a compatible processor.

What's new with the Ryzen Threadripper 5000 is the new "Zen 3" CCDs, which place all 8 CPU cores of the die into a single CCX, sharing a unified 32 MB L3 cache. The I/O is identical to the previous generation, with the sTRX4 chips featuring quad-channel DDR4 interface, and sWRX8 ones featuring 8-channel, both with ECC; and up to 88 PCI-Express Gen 4 lanes. AMD also slightly increased the xGMI2 bandwidth to 18 GT/s, from 16 GT/s on the Ryzen Threadripper 3000 series.

Many Thanks to DeathtoGnomes for the tip.

ASUS and MSI Put out Windows 11 TPM 2.0 Compatible Motherboard and Processor Lists

ASUS and MSI have each put out lists of their motherboards and compatible processors that meet the Windows 11 requirement of a TPM 2.0 spec-compliant trusted platform module, without needing an add-on TPM. ASUS says that its motherboards dating back to the Intel 300-series, and AMD 300-series, and processors compatible with them, meet the requirement, which would mean Intel "Coffee Lake" and forward; and AMD "Zen" and forward. MSI, on the other hand, extends support all the way back to Intel 100-series (when paired with "Kaby Lake" or forward); and AMD 300-series ("Zen" and forward).

For HEDT platforms, both companies support TPM 2.0 on Intel X299, AMD X399, and AMD TRX40. Server- and workstation chipsets from processor generations corresponding to these platforms, will also support Windows 11. Intel and AMD began integrating a firmware TPM with these platforms that met TPM 2.0 specification. Older platforms will require an add-on TPM, which scalpers are selling for upward or $100 these days (normally under $20). The firmware TPM, although present, is usually disabled, and needs to be enabled in the UEFI setup program. In addition, the firmware must be configured for UEFI boot, with Secure Boot enabled, to meet Windows 11 requirements.

Intel Sapphire Rapids HEDT Processors & W790 Chipset Appear in Leaked Roadmap

We haven't seen any new prosumer HEDT processors since AMD launched their Ryzen Threadripper 3000 lineup in early 2020. Intel has had a very weak HEDT offering over the past few years with their 14 nm Cascade Lake processors and X299 chipset where the flagship Core i9-10980XE offered just 18 cores. Intel appears to be preparing to launch an updated HEDT offering in Q2 2022 with 10 nm Sapphire Rapids processors and a new W790 chipset. The new W790 chipset may launch alongside Raptor Lake which is expected to support the Z790 chipset. We still have a while until these products launch with Intel not yet having released their Alder Lake predecessors while AMD is expected to announce Threadripper 5000 in the coming months.

AMD Ryzen 7000 Series "Raphael" Zen 4 Processor IHS Design Gets Leaked

AMD is preparing to switch things up a bit with its upcoming AM5 platform. The new platform is said to bring significant changes to the design of the socket and the CPU package, where we will see some new design choices and decisions. For starters, all of the processors made for the AM5 platform will come in a land grid array (LGA) configuration, very similar to that of Intel. Thanks to the rendering of ExecutableFix, we got to see exactly how will the new LGA design look like. And today, we get to see more details of the AMD's upcoming Raphael processor's integrated heat spreader (IHS) design.

The IHS serves the purpose of spreading the heat away from the die and dissipating it efficiently. However, IHS designs can sometimes be very interesting. According to this rendering from ExecutableFix, AMD's upcoming Raphael design, based on Zen 4 core, will feature a unique IHS design, which can be seen below.

Intel Discontinues 9th Gen Core X Series "Skylake-X" HEDT Processors

Intel issued a product change notification (PCH) announcing the discontinuation of its 9th Gen Core X series "Skylake-X" HEDT processors in the LGA2066 package; in addition to at least 10 Xeon W-2000 series workstation processors that are based on a similar IP. Discontinuation involves several steps, the first of which is the discontinuation announcement, which is dated July 9, 2020. The last orders for these chips will be taken on January 22, 2021, which are non-cancellable and non-returnable (for distributors, end-users are still protected by product warranties and consumer laws regardless of when they buy the processor). The last orders ship before July 9, 2021.

AMD Ryzen Threadripper PRO 3995WX to Debut with a Lenovo Workstation

AMD's 64-core HEDT processor with an 8-channel memory interface, the Ryzen Threadripper PRO 3995WX, could debut in a Lenovo-branded workstation. Lenovo's Workstations division recently tweeted a big workstation announcement for 14th July, 2020, the same day AMD is expected to announce the 3995WX. "A new Lenovo workstation is coming soon, and we aren't going to just change the game. We plan to change the rules," the tweet reads. This is also a major hint as to the availability of the 3995WX. It won't surprise us if the processor will be an OEM-exclusive (if not a Lenovo-exclusive). The Threadripper PRO 3995WX, in addition to the Ryzen PRO feature-set, reportedly features an 8-channel DDR4 memory interface, doubling the memory bandwidth over that of the current retail-channel flagship 3990X.

AMD Ryzen Threadripper PRO 3995WX Processor Pictured: 8-channel DDR4

Here is the first picture of the Ryzen Threadripper PRO 3995WX processor, designed to be part of AMD's HEDT/workstation processor launch for this year. The picture surfaced briefly on the ChipHell forums, before being picked up by HXL (@9550pro) This processor is designed to compete with Intel Xeon W series processors, such as the W-3175X, and is hence located a segment above even the "normal" Threadripper series led by the 64-core/128-thread Threadripper 3990X. Besides certain features exclusive to Ryzen PRO series processors, the killer feature with the 3995WX is a menacing 8-channel DDR4 memory interface, that can handle up to 2 TB of memory with ECC.

The Threadripper PRO 3995X is expected to have a mostly identical I/O to the most expensive EPYC 7662 processor. As a Ryzen-branded chip, it could feature higher clock speeds than its EPYC counterpart. To enable its 8-channel memory, the processor could come with a new socket, likely the sWRX8, and AMD WRX80 chipset, although it wouldn't surprise us if these processors have some form of inter-compatibility with sTRX4 and TRX40 (at limited memory bandwidth and PCIe capabilities, of course). Sources tell VideoCardz that AMD could announce the Ryzen Threadripper PRO series as early as July 14, 2020.

ASRock Rack Intros TRX40D8-2N2T ATX Motherboard for Threadripper-powered Servers

The AMD Ryzen Threadripper HEDT processors support up to 2 TB of quad-channel ECC memory, which means some companies can choose to cut costs by opting for 3rd gen Ryzen Threadrippers over EPYC "Rome" processors, if they're okay with a narrower memory bus. There weren't any server-grade AMD TRX40 chipset motherboards, until ASRock Rack picked up the challenge, with the new TRX40D8-2N2T. This motherboard is designed for high-uptime use, featuring server-grade VRM, networking interfaces, and an ASPEED IPMI+display+iKVM chip.

Built in the ATX form-factor, the TRX40D8-2N2T features one sTRX4 socket supporting 3rd gen Ryzen Threadripper processors (including the 3990X), eight DDR4 DIMM slots supporting up to 256 GB (32 GB per DIMM) of quad-channel DDR4 memory, with or without ECC. Memory speeds of up to DDR4-3200 are supported. The sTRX4 socket is wired to three PCI-Express 4.0 x16 slots and one open-ended PCI-Express 4.0 x8. Storage connectivity includes six SATA 6 Gbps ports, and two M.2-22110 slots with PCI-Express 4.0 x4 wiring. Networking includes two 10 GbE ports driven by an Intel X710-AT2 controller, and two 2.5 GbE ports put out by a pair of Intel i225-LM controllers. The ASPEED AST2500 chip puts out a GbE port and D-Sub (basic display) connector of its own. There's no onboard audio. The company didn't reveal pricing.

ASUS Rolls Out Prime TRX40-PRO S Motherboard

ASUS today rolled out the Prime TRX40-PRO S socket sTRX4 motherboard for 3rd gen Ryzen Threadripper HEDT processors. This board is part of a mini-refresh of the company's sTRX4 product-stack, beginning with the ROG Zenith II Extreme Alpha, the more recent ROG Strix TRX40-XE Gaming, and now the Prime TRX40-PRO S. Launch of the three boards is triggered by the niche of enthusiasts that likes to overclock their Ryzen Threadripper 3990X 64-core/128-thread processors.

While the older Prime TRX40-PRO is perfectly capable of running- or even overclocking the 3990X, the new PRO S is better suited for the task, and comes with bolstered 16-phase CPU VRM with 70 A power stages, same ones found on the original ROG Zenith II Extreme, while the Extreme Alpha has been amped up with 90 A power stages. ASUS upgraded the ROG Strix TRX40-XE Gaming the same way. The board's feature-set is otherwise identical to that of the original Prime TRX40-PRO. The Prime TRX40-PRO S is expected to be priced around the $430-mark.
ASUS PRIME TRX40-PRO S

No Intel "Rocket Lake-S" or "Ice Lake-X" This Year?

A roadmap slide from an Intel Partner Connect presentation suggests that the company's client-segment processor lineup will be unchanged for the rest of 2020, with the company briskly launching its 10th generation "Comet Lake-S" desktop processor lineup through May-June, and "Comet Lake-H" a month prior. The Core X "Cascade Lake-X" processor lineup will continue to lead the company in the high core-count HEDT segment, with no indications of new models, at least none higher than 18 cores.

More importantly, this slide dulls expectations of the company refreshing its desktop process segment just before Holiday 2020 with the 11th generation "Rocket Lake-S" silicon that has next-gen "Willow Cove" CPU cores, Gen12 Xe integrated graphics, and PCIe gen 4.0 connectivity, especially with engineering samples of the chips already hitting the radar. Intel is expected to launch 10 nm "Ice Lake-SP" Xeon enterprise processors in 2020, and there was hope for some of this IP to power Intel's next HEDT platform, the fabled "Ice Lake-X," especially with AMD's "Castle Peak" 3rd gen Threadrippers dominating this segment. While there's little doubt that the slide may have originated from Intel, its context must be studied. Partner Connect is a platform for Intel to interact with its channel partners (distributors, retailers, system integrators, etc), and information about future products is far more restricted on these slides, than presentations intended for large OEMs, motherboard manufacturers, etc. Then again, with the COVID-19 pandemic throwing supply chains off rails, it wouldn't surprise us if this slide spells Gospel.

Distant Blips on the AMD Roadmap Surface: Rembrandt and Raphael

Several future AMD processor codenames across various computing segments surfaced courtesy of an Expreview leak that's largely aligned with information from Komachi Ensaka. It does not account for "Matisse Refresh" that's allegedly coming out in June-July as three gaming-focused Ryzen socket AM4 desktop processors; but roadmap from 2H-2020 going up to 2022 sees many codenames surface. To begin with, the second half of 2020 promises to be as action packed as last year's 7/7 mega launch. Over in the graphics business, the company is expected to debut its DirectX 12 Ultimate-compliant RDNA2 client graphics, and its first CDNA architecture-based compute accelerators. Much of the processor launch cycle is based around the new "Zen 3" microarchitecture.

The server platform debuting in the second half of 2020 is codenamed "Genesis SP3." This will be the final processor architecture for the SP3-class enterprise sockets, as it has DDR4 and PCI-Express gen 4.0 I/O. The EPYC server processor is codenamed "Milan," and combines "Zen 3" chiplets along with an sIOD. EPYC Embedded (FP6 package) processors are codenamed "Grey Hawk."

Linus Torvalds Upgrades to AMD Threadripper After 15 Years with Intel

Linux and Git creator Linus Torvalds revealed that he upgraded to an AMD Ryzen Threadripper 3970X processor powered machine after 15 years of upgrading among Intel processors. This is likely his main machine from which he does pioneering work on the future of Linux and his other creations. His May 24 dated "State of the Kernel" blog post reveals that his hardware upgrade was the most exciting piece of news to share among the community.

"In fact, the biggest excitement this week for me was just that I, upgraded my main machine, and for the first time in about 15 years, my desktop isn't Intel-based. No, I didn't switch to ARM yet, but I'm now rocking an AMD Threadripper 3970x. My 'allmodconfig' test builds are now three times faster than they used to be, which doesn't matter so much right now during the calming down period, but I will most definitely notice the upgrade during the next merge window," he stated. What makes this story big is the fact that the "Zen 2" microarchitecture, and a processor with a similar multi-core architecture to AMD's EPYC enterprise processors, is now being used by the creator of the most popular enterprise operating system.

EK Water Blocks Announces the EK Quantum Momentum TRX40 Monoblock for ASUS ROG Zenith II Extreme Motherboard

EK Water Blocks, the Slovenia-based premium computer liquid cooling gear manufacturer, makes another push into the HEDT market by releasing the world's first Socket sTRX4 based monoblock made for made for the ROG Zenith II Extreme motherboard. This is a complete all-in-one (CPU and motherboard) liquid cooling solution for the ASUS motherboard that is based on AMD TRX40 chipset for AMD Ryzen Threadripper processors. This monoblock is compatible with the ASUS ROG Zenith II Extreme motherboard.

Designed and engineered in cooperation with ASUS, this monoblock uses Velocity sTR4 cooling engine to ensure the proper cooling of the large IHS that hides the spread-out chiplets. This water block directly cools AMD sTR4X type CPU, as well as the voltage regulation module (VRM). This kind of efficient VRM cooling on a TRX40 platform opens up even greater overclocking capabilities. Using a monoblock gets rid of the small fans that can be found on these TRX40 motherboards, hidden under the VRM heatsink grill.

VIA CenTaur CHA NCORE AI CPU Pictured, a Socketed LGA Package

VIA's CenTaur division sprung an unexpected surprise in the CPU industry with its new CHA x86-64 microarchitecture and an on-die NCORE AI co-processor. This would be the first globally-targeted x86 processor launch by a company other than Intel and AMD in close to 7 years, and VIA's first socketed processor in over 15 years. SemiAccurate scored a look at mock-up of the CenTaur CHA NCORE 8-core processor and it turns out that the chip is indeed socketed.

Pictured below, the processor is a flip-chip LGA. We deduce it is socketed looking at its alignment notches and traces for ancillaries on the reverse-side (something BGAs tend to lack). On the other hand, the "contact points" of the package appear to cast shadows, and resemble balls on a BGA package. Topside, we see an integrated heatspreader (IHS), and underneath is a single square die. CenTaur built the CHA NCORE on TSMC's 16 nm FinFET process. The package appears to have quite a high pin-count for a die this size, but that's probably because of its HEDT-rivaling I/O, which includes a quad-channel DDR4 memory interface and 44 PCI-Express gen 3.0 lanes.

Intel Reportedly Looking Into Further Reduction in CPU Pricing for 2020

Intel's policy on CPU pricing has been a strong, definite one for years: no price reductions. Faced with less than admirable competition from a struggling AMD back in its Phenom and especially Bulldozer days, Intel enforced a heavy hand on the market and on CPU pricing. However, a much revitalized AMD and difficulties in the transition to the 10 nm process have left Intel with no other recourse than to cut pricing on its CPUs in order to remain competitive. No uptake of new I/O technologies such as PCIe 4.0 has also taken its toll on Intel's position in the server and HEDT market, which has led to recent price-cuts and tightening of Intel's Xeon line of CPUs - as well as price-cuts in the order of 50% in their Cascade Lake-X processors compared to the previous generation.

DigiTimes, citing industry PC makers, says that Intel is gearing up to keep fighting in the only front it actually can, besides puny core count increases on their heavily-iterated Skylake architecture - pricing. This move comes in a bid to keep its market dominance, which Intel themselves have said - after Zen 2, that is - isn't a priority for the consumer market. You can rest assured that Intel is very, very likely already practicing hefty price reductions for tray-quantity purchases for partners. However, it seems that the company might bring some price cuts on to its upcoming Comet Lake CPUs. The company has always been loathe to reduce pricing on existing inventory, rather choosing to reduce the price on new launches (see the Cascade Lake-X example above), which, arguably, saves Intel's face on claims of only being able to compete on pricing - which lurks dangerously close to Intel being painted as the budget, price-cut alternative to AMD.

AMD CEO To Unveil "Zen 3" Microarchitecture at CES 2020

A prominent Taiwanese newspaper reported that AMD will formally unveil its next-generation "Zen 3" CPU microarchitecture at the 2020 International CES. Company CEO Dr Lisa Su will head an address revealing three key client-segment products under the new 4th generation Ryzen processor family, and the company's 3rd generation EPYC enterprise processor family based on the "Milan" MCM that succeeds "Rome." AMD is keen on developing an HEDT version of "Milan" for the 4th generation Ryzen Threadripper family, codenamed "Genesis Peak."

The bulk of the client-segment will be addressed by two distinct developments, "Vermeer" and "Renoir." The "Vermeer" processor is a client-desktop MCM that succeeds "Matisse," and will implement "Zen 3" chiplets. "Renoir," on the other hand, is expected to be a monolithic APU that combines "Zen 2" CPU cores with an iGPU based on the "Vega" graphics architecture, with updated display- and multimedia-engines from "Navi." The common thread between "Milan," "Genesis Peak," and "Vermeer" is the "Zen 3" chiplet, which AMD will build on the new 7 nm EUV silicon fabrication process at TSMC. AMD stated that "Zen 3" will have IPC increases in line with a new microarchitecture.

AMD Ryzen Threadripper 3980X is a 48-core Monster for When 64 Cores Are Too Many, 32 Too Few

In the press-deck of its 3rd Generation Ryzen Threadripper 3970X/3960X launch, AMD teased its flagship HEDT part for the TRX40 platform, the Ryzen Threadripper 3990X, with a 2020 launch date. It should come as little surprise then, that the core-count gap between the 3970X and the 3990X has an SKU in the middle - the 3980X. This SKU reportedly surfaced in CPU-Z 1.91 code. The 3980X is a 48-core/96-thread monstrosity for when 64 cores are too many, and 32 too few.

Like the 3990X, the 3980X will likely be built with eight "Zen 2" CCDs (chiplets) for optimal IFOP bandwidth utilization and heat-spread. Each CCD will likely be configured with 6 cores (3 per CCX), adding up to 48 cores on the package. Much like the 3990X, clock-speeds of the 3980X remain under the wraps. AMD is expected to launch the two some time in 2020, featuring compatibility with existing AMD TRX40 chipset motherboards. The company could target a sub-$3,000 price-point to make the Xeon W-3175X obsolete both in performance and value.

ADATA XPG Announces Tested Compatibility with Ryzen 9 3950X and 3rd Gen Threadripper

ADATA Technology, a leading manufacturer of high-performance DRAM modules, NAND Flash products, and mobile accessories is pleased to announce that ADATA and XPG DDR4 memory modules are compatible with latest 3rd Gen AMD Ryzen and Ryzen Threadripper HEDT (High-end Desktop) platforms. Whether for creators that demand high-capacity modules or gamers and overclockers seeking high-performance modules, ADATA and XPG offer memory products that meet their specific needs.

ADATA and XPG have always strove to ensure high compatibility of their memory modules through the use of high-quality, rigorously tested IC chips and PCB boards. With the recent launch of AMD's most powerful desktop processors- Ryzen 9 3950X processor with X570 platform and AMD HEDT Ryzen Threadripper 3960X/3970X processor with TRX40 platform, ADATA's and XPG's commitment to high compatibility remains a key consideration, in addition to robust performance and sufficient capacity.

Intel Marketing Claims i5-9600KF Better than 3800X, i3-9350KF Better than 3600X

Intel marketing is at it again, making sweeping performance claims about its embattled 9th generation Core processors against AMD's 3rd generation Ryzen. In a recent press conference in China, the company was shown claiming that its mid-tier 6-core/6-thread Core i5-9600KF is a "better" processor than AMD's 8-core/16-thread Ryzen 7 3800X. This claim is hard to defend with gaming, when even the "slower" 3700X is seen performing within 1% of the i5-9600K (identical CPU specs to the i5-9600KF) at gaming, and 22 percent faster at CPU tests, beating the i9-9900K in quite a few multi-threaded tests.

The marketing slide makes four key claims: 1. that Intel processors are faster in "real-world" use-cases (gaming, home/office, light content-creation), ; 2. that with boost-frequencies reaching 4.60 GHz, the higher IPC of these chips benefit gaming; 3. that the K-series chips easily overclock to 5.00 GHz yielding even more performance; and 4. that Intel processors have "smooth and stable drivers" compared to AMD. As if that wasn't bad enough, the slide claims that the 4-core/4-thread Core i3-9350KF is "better" than the 6-core/12-thread Ryzen 5 3600X, and the entry-level i3-9100F being better than the 6-core/6-thread Ryzen 5 3500. This incident closely follows its September gaffe that sought to sourgrape AMD's HEDT creator performance leadership by discrediting its lead in certain applications by claiming they don't reflect "real world usage." Making Intel's test relevance claims comically wrong was the fact that it used app usage data gathered exclusively from notebooks.

EK Water Blocks Announces sTRX4 Compatibility with EK Velocity sTR4 Series Blocks

The EK Velocity sTR4 series water blocks that are specifically designed for HEDT AMD Ryzen Threadripper processors are compatible with all newly released AMD TRX40 based motherboards equipped with socket sTRX4 which supports Ryzen Threadripper 3000 Series Processors.

With the release of 32 core count HEDT computer processors and potential for even more cores, the requirement for the top of the line cooling has never been bigger. The sTR4 Lineup of EK-Velocity water blocks, designed for the sTR4 socket, is perfectly compatible with the newly released AMD TRX40 motherboards that are using the sTRX4 socket. The only difference between the sTR4 and sTRX40 sockets is the pin layout, thus it has no effect on the cooling performance or the mounting itself.

Dell Calls Out Intel for CPU Shortages Affecting its 2019 Full Year Revenue Forecast

PC major Dell in its quarterly results call blamed Intel for cuts in its revenue forecast for 2019 (full year) sales. "Intel CPU shortages have worsened qtr-over-qtr, impacting our commercial PC and premium consumer PC Q4 forecasted shipments," said Dell COO Jeffrey Clarke. Intel's CPU shortages are caused due to demand in the PC and server markets significantly outpacing supply, and not because Intel is supplying below its capacity. The company increased its capex toward manufacturer by $1 billion YoY, retrofitting its manufacturing facilities to make 14 nm processors, all while juggling resources to execute its 10 nm rollout for high-volume mobile and high-margin server processors.

The company hasn't launched 10 nm desktop or HEDT processors, yet, and is reportedly preparing yet another 14 nm line of processors for these platforms, codenamed "Comet Lake." This microarchitecture has also seen a mobile rollout for mainstream mobile form-factors, while Intel focused 10 nm "Ice Lake" for ultraportables and ultra low-power form-factors. Intel executive VP for sales Michelle Johnston Holthaus recently wrote a letter to its customers (primarily companies like Dell,) informing them that despite their best efforts, demand continues to beat supply, and that they hadn't managed to solve their supply issues.

CORSAIR Offers a Range of High-Performance Components for 3rd Gen AMD Ryzen Threadripper Builds

CORSAIR, a world leader in PC gaming peripherals and enthusiast components, today announced a range of products including liquid CPU coolers, high-frequency DRAM, and efficient power supplies fully tested and validated for compatibility with the new 3rd Generation AMD Ryzen Threadripper high-end desktop processors. With the highest core and thread count on the HEDT market, combined with the lightning-fast PCI-Express 4.0 platform, AMD's most powerful desktop processor can create, composite, render, encode, and deliver with unprecedented multitasking power - and CORSAIR is ready with the widest range of guaranteed-compatible products to help get the best performance out of a new Ryzen Threadripper-based PC.
Return to Keyword Browsing