Intel is seemingly nearing the launch of "Granite Rapids-WS" workstation processors as the latest listings have appeared, found by @momomo_us on X. The listings show the lineup starts with an entry-level Xeon 634 CPU with 48M cache and running 2.7 GHz base speed, priced at roughly $540. However, the lineup tops out at a much higher price point of $8,300 for the flagship Xeon 698X SKU carrying 336 MB of cache and possibly XCC die with 86 cores and 172 threads. We don't have final numbers until the processor officially launches, so core counts will be confirmed once the processors are officially released.

For the W890 workstation platform that hosts these CPUs, Intel chose socket E2 design with 4,710 LGA pins built to support TDP ratings reaching 350 watts. Intel is taking a two-tier approach with distinct "Expert" and "Mainstream" configurations: Expert-class implementations unlock 112 PCIe lanes (96 PCIe 5.0 lanes plus 16 PCIe 4.0 lanes), while the Mainstream tier delivers 80 PCIe 5.0 lanes. Below, you can see the listings showing the price of various CPU SKUs, which we assume are not final MSRPs.

SK hynix Inc. announced today that it has become the first in the industry to complete the Intel Data Center Certified process to apply 256 GB DDR5 RDIMM - a high capacity server module based on 32 Gb fifth-generation 10 nm-class (1b) DRAM - to Intel Xeon 6 platform. As an Intel Data Center Certified system/platform, 256 GB DDR5 RDIMM has completed extensive testing and rigorous validation by Intel's Advanced Data Center Development Laboratory, and is now the industry's first server module verified to provide reliable performance, compatibility and quality when combined with Intel Xeon processors. SK hynix has previously obtained similar validation in January this year for its 16 Gb fourth-generation 10 nm-class (1a) die-based 256 GB product.

By becoming the first in the industry to validate compatibility with Intel's latest server platform, SK hynix is demonstrating technological leadership in high-capacity DDR5 modules. Based on this, the company will expand cooperation with major global data center operators and continue to lead the next-generation memory market in response to rapidly increasing demand from server customers. In this new AI-driven infrastructure environment, memory has emerged as a critical determinant of performance. As AI inference models evolve beyond generating simple response to performing complex logical processes, the volume of data that must be processed in real time is growing exponentially. To manage these massive data sets swiftly and reliably, high-capacity and high-performance memory has become indispensable - driving a sharp increase in market demand.

AEWIN is excited to unveil the BIS-5231 Series, a high-performance 2U general purpose server built on Intel's latest Xeon 6 processors manufactured with Intel 3 process technology. Powered by dual Intel Xeon 6700/6500-series processors with P-cores or E-cores, the BIS-5231 delivers exceptional compute density and scalability. It offers up to eight PCIe Gen 5 expansion slots and twelve storage drive bays with SAS/SATA or NVMe options to meet diverse deployment requirements.

The BIS-5231 Series is equipped with 16 DDR5 RDIMM slots supporting speeds up to 6400 MT/s, two M.2 PCIe Gen 5 slots, two USB 3.1 ports, four RJ45 10GbE ports, and one RJ45 GbE IPMI port without requiring additional PCH needed. The BIS-5231A model provides twelve 3.5-inch LFF drive bays and eight PCIe Gen 5 slots plus an OCP 3.0 slot while the BIS-5231B offers twelve U.2 NVMe drive bays and seven PCIe Gen 5 slots plus an OCP 3.0 slot. The expansion slots are suitable for high-throughput NICs and GPU cards for data-intensive and AI-driven workloads.

AEWIN unveils the BIS-5132-2U, a versatile 2U general-purpose server powered by Intel's latest Xeon 6 processors built on Intel 3 process technology. Featuring a single Intel Xeon 6700/6500-series CPU, the BIS-5132 delivers exceptional compute density with up to 86 P-cores or 144 E-cores for demanding workloads. Designed for scalability, the platform accommodates 12 large form factor (3.5") drive bays and up to 8 PCIe expansion slots address a wide range of deployment scenarios.

2U High-Performance General-Purpose Servers
The BIS-5132-2U features 8x DDR5 RDIMM modules running at speeds up to 6400 MT/s. Leveraging up to 136 PCIe Gen 5 lanes enabled by the Granite Rapids-SP RIS architecture, the system provides up to 8 PCIe expansion slots for flexible configurations including high throughput NICs, storage adapter cards for high-speed NVMe SSDs, and advanced GPU/FPGA accelerators to deliver outstanding I/O performance and scalability.

MSI, a leading global provider of high-performance server solutions, showcases its next-generation computing and AI innovations at SuperComputing 2025 (SC25), Booth #205. MSI introduces its ORv3 rack solution and a comprehensive portfolio of power-efficient, multi-node, and additional AI-optimized platforms built on NVIDIA MGX and desktop NVIDIA DGX, designed for high-density environments and mission-critical workloads. These modular, scalable and rack-scale solutions are engineered for maximum performance, energy efficiency, and flexibility, enabling modern and next-generation data centers to accelerate deployment and scale with ease.

"Through close collaboration with industry leaders AMD, Intel, and NVIDIA, MSI continues to drive innovation across the data center ecosystem," said Danny Hsu, General Manager of the Enterprise Platform Solutions at MSI. "Our goal is to deliver scalable, energy-efficient infrastructure that empowers customers to accelerate AI development and next-generation computing with performance, reliability, and flexibility at scale."

Super Micro Computer, Inc. (SMCI), a Total IT Solution Provider for AI/ML, HPC, Cloud, Storage, and 5G/Edge, will showcase its latest AI Factory, HPC, and liquid-cooled data center innovations at Supercomputing 2025 (SC25) in St. Louis, Missouri. This broad portfolio, ranging from desktop workstations to rack-scale solutions, demonstrates Supermicro's commitment to powering the next generation of high-performance computing, scientific research, and enterprise AI deployments.

"Supermicro continues to lead the industry in delivering complete, next-generation infrastructure solutions in close collaboration with our technology partners," said Charles Liang, president and CEO of Supermicro. "At SC25, we are demonstrating our high-performance DCBBS architecture, direct liquid cooling, and rack-scale innovations, which empower customers to deploy AI and HPC workloads faster, more efficiently, and more sustainably."

ASUS today announced an all-new lineup of enterprise and AI/HPC-optimized storage and infrastructure solutions at Supercomputing 2025 (SC25). Recognizing the escalating demands of scaling AI models and memory-intensive workloads, ASUS storage solutions are now a strategic imperative, critical for sustaining efficient AI data processing and managing rapidly expanding datasets. This launch further solidifies the company's position as a total infrastructure provider, delivering an integrated ecosystem spanning compute, storage, networking, and services. ASUS, through its robust global supply chain and logistical capabilities, ensures consistent, reliable product delivery, establishing itself as a trusted partner for organizations deploying resilient and scalable AI environments.

ASUS delivers a full spectrum of storage solutions across block, file, object, and software-defined systems—ensuring flexibility from edge to cloud, and from enterprise applications to AI and HPC workloads. The portfolio supports storage for Enterprise and AI/HPC needs, providing resilient data foundations and scalable performance for data-driven environments.

MSI, a global leader in high-performance computing, will unveil its next generation of AI computing solutions at Supercomputing 2025 (SC25), held at the America's Center in St. Louis, Missouri. Built on NVIDIA MGX, NVIDIA DGX Station, and NVIDIA DGX Spark reference architectures, the lineup is powered by NVIDIA Hopper GPUs, NVIDIA RTX PRO 6000 Blackwell Server Edition GPUs, NVIDIA Blackwell Ultra GPUs, as well as the Grace Blackwell GB10 Superchip.

Together, these platforms deliver data-center-class performance across diverse AI workloads—from large-scale model training and simulation to edge inferencing and desktop AI development. MSI's AI servers are purpose-built for large language models (LLMs), deep learning, and NVIDIA Omniverse workloads, offering flexible configurations with both Intel Xeon and AMD EPYC processors, supporting up to 600 W GPUs for maximum performance and scalability.

With the exponential rise in AI infrastructure costs and vendor lock-in designs, enterprises are increasingly limited in their ability to scale demanding applications. EnGenius Technologies, a global innovator in intelligent networking and enterprise solutions, is excited to unveil its portfolio of modular data center servers and dedicated AI accelerators at Supercomputing 2025 (Booth #6451), taking place November 16-21 at the America's Center Convention Complex in St. Louis, Missouri.

"Supercomputing 2025 marks a milestone for EnGenius as we expand beyond networking into AI and high-performance computing," said Roger Liu, Executive Vice President at EnGenius Technologies. "Our modular data center total solution delivers the openness, efficiency, and scalability that enterprises need to power next-generation workloads."

Giga Computing, a subsidiary of GIGABYTE Group, announces the worldwide availability of its recently launched GIGABYTE XL44-SX2-AAS1, an NVIDIA RTX PRO Server that integrates NVIDIA RTX PRO 6000 Blackwell Server Edition GPUs, NVIDIA BlueField-3 DPU, NVIDIA ConnectX-8 SuperNICs, and NVIDIA AI Enterprise software. The system unifies compute, networking, and software layers to accelerate the full data-to-AI workflow.

Built on the NVIDIA MGX modular reference design, the XL44-SX2-AAS1 supports up to eight NVIDIA RTX PRO 6000 Blackwell Server Edition GPUs for a total of 768 GB of GDDR7 memory, delivering exceptional throughput for generative AI, 3D rendering, and scientific workloads. Dual Intel Xeon 6700/6500 CPUs, 32x DDR5 DIMMs, and 3+1 redundant 3200 W 80 Plus Titanium power supplies ensure performance and reliability.

Today, Cisco (NASDAQ: CSCO) announced Cisco Unified Edge, an integrated computing platform for distributed AI workloads. From retail stores to healthcare facilities to factory floors, Cisco Unified Edge brings together compute, networking, storage, and security closer to the data for real-time AI inferencing and agentic workloads. This is critical to turning the AI vision into reality, providing the foundational infrastructure needed to support both traditional and AI workloads.

More than half of today's AI pilots are stalling due to infrastructure constraints, highlighting an urgent need for a new decentralized network architecture. The edge is the new AI frontier where it's forecasted that 75 percent of enterprise data will be created and processed this year. As AI workloads fast-track from centralized model training to real-time inference, traditional data centers struggle to accommodate the requirements of AI. AI agents are transforming network traffic from predictable bursts to relentless, high-intensity loads, with agentic AI queries generating up to 25 times more network traffic than a chatbot. Instead of pulling data to and from the data center, AI workloads require models and infrastructure to be closer to where the data is created, and decisions are made.

ASUS today announced the shipment of the XA NB3I-E12 AI server, built on the NVIDIA HGX B300 platform. Delivering next-generation AI performance and reliability, XA NB3I-E12 gives enterprises and cloud-service providers (CSPs) early access to cutting-edge computing capabilities for the AI era. Accelerated by eight NVIDIA Blackwell Ultra GPUs and dual Intel Xeon 6 Scalable processors, ASUS XA NB3I-E12 is engineered for intensive AI workloads. With eight NVIDIA ConnectX-8 InfiniBand SuperNICs, five PCIe expansion slots, 32 DIMMs, 10 NVMe drives, and dual 10 Gb LAN, it transforms data into intelligence for real-world automation. The system is ideal for enterprises and CSPs running large language models (LLMs), research institutions and universities performing scientific computing, and the financial and automotive sectors focused on AI model training and inference.

Intel's Q3 earnings delivered a solid number, but a few interesting things are happening at Intel's Fabs that aren't related to any leading-edge node production. According to Intel CFO David Zinsner, "In Q3, Intel Foundry delivered Intel 10 and 7 volume above expectations," indicating that demand for Intel's products built on these nodes is significantly exceeding supply. Zinsner noted, "Capacity constraints, especially on Intel 10 and Intel 7, limited our ability to fully meet demand in Q3 for both data center and client products," suggesting strong demand for Core and Xeon processors built on these nodes.

Intel first introduced Intel 7 node, previously known as 10 nm Enhanced SuperFin, with 12th Generation "Alder Lake." However, that is now discontinued and Intel continues to ship 13th Generation "Raptor Lake" and 14th Generation Core "Raptor Lake Refresh" client CPUs on the Intel 7 node. For Xeon server chips, the company uses the Intel 7 node for the 4th Generation "Sapphire Rapids," 5th Generation "Emerald Rapids" Xeon Scalable and manufactures the I/O die for the latest "Granite Rapids" Xeon 6, where the compute dies are made on the Intel 3 node. High demand from the gaming sector for 13th and 14th Gen gaming CPUs, along with strong demand for Xeon processors, has created a manufacturing bottleneck. Intel will prioritize delivering data center products first and gaming products second.

Giga Computing, a subsidiary of GIGABYTE and an industry leader in enterprise hardware and advanced cooling solutions, today announced its participation in the OCP Global Summit and the launch of its new GIGABYTE TO86-SD1 based on the NVIDIA HGX B200 platform. Built on the OCP ORv3 standard, the system combines breakthrough performance with an energy-efficient design to meet the demands of large-scale AI training, inference, and HPC workloads. With support for the powerful NVIDIA Blackwell GPU, this next-generation platform empowers enterprises and research organizations to accelerate innovation, scale seamlessly, and unlock new possibilities in AI.

What to Expect at GIGABYTE Booth #A57
The 2025 OCP Global Summit (Oct. 13-16) is the first opportunity to display and introduce this new OCP-based GPU server. The new GIGABYTE TO86 Series is designed to support 8-GPU OAM baseboards that are ideal for their performance and scalability and are used by hyperscalers, sovereign data centers, and specialized AI cloud providers. Also featured at the GIGABYTE booth is the NVIDIA GB300 NVL72 platform, a liquid-cooled, rack-scale design with dense performance in a platform optimized for test-time scaling inference. Alongside this platform for AI factories is the GIGABYTE XL44-SX2, an NVIDIA RTX PRO Server featuring NVIDIA ConnectX-8 SuperNICs. These products are a testament to the breadth of accelerated computing solutions using standardized designs, including ones inspired by OCP.

Today Intel revealed the architectural details for the company's next generation client processor Intel Core Ultra series 3 (code-named Panther Lake) which is expected to begin shipping later this year. Panther Lake is the company's first product built on Intel 18A, the most advanced semiconductor process ever developed and manufactured in the United States.

Intel also previewed Xeon 6+ (code-named Clearwater Forest), its first Intel 18A-based server processor, which is expected to launch in the first half of 2026. Both Panther Lake and Clearwater Forest, as well as multiple generations of products built on Intel 18A, are being manufactured at Fab 52, Intel's new, state-of-the-art factory in Chandler, Arizona - a key milestone as Intel invests in strengthening American technology and manufacturing leadership and building a resilient semiconductor supply chain.

[Editor's note: Our in-depth tech preview article of Panther Lake is now live]

Dell Technologies (NYSE: DELL) announces the new Dell PowerEdge XR8720t designed to transform edge and telecom infrastructure by delivering unprecedented performance and connectivity, especially for Open RAN and Cloud RAN deployments.

Why it matters:
Traditionally, the need for multiserver deployments has hindered the adoption of Cloud RAN and advanced edge computing, burdening organizations with higher costs, operational complexity, space issues and power demands. Inefficiencies and scalability limitations make it difficult to meet the real-time performance needs of next-generation applications.

Avalue Technology Inc., a global leader in industrial computing solutions, proudly announces the launch of the HPS-GNRD4A workstation, designed for high-performance computing (HPC) workloads. Built to meet the demands of enterprise AI training, medical imaging analysis, and high-performance data center operations, the system supports dual Intel Xeon 6 6500P/6700P series processors with up to 350 W TDP per CPU and up to 16 DDR5 6400 MHz RDIMM and 8000 MHz MRDIMM slots, allowing for a maximum memory capacity of 4 TB and providing a stable, high-performance computing environment.

Key Features:

• Flexible Storage and Expansion: The 19-inch 4U rack-mount chassis offers abundant storage and expansion options, including one external 5.25-inch optical drive bay and three front-accessible 2.5-inch drive bays. The system supports up to three double-width GPU cards, high-speed PCIe 5.0, various NVMe/SSD/RAID cards, and other acceleration cards, easily adapting to diverse computing workloads. In addition, the system supports U.2 storage bay expansion, with high-density U.2 SSDs capable of meeting demanding high-performance application requirements.

Today, MLCommons released its latest MLPerf Inference v5.1 benchmarks, showcasing results across 6 key benchmarks for Intel's GPU Systems featuring Intel Xeon with P-cores and Intel Arc Pro B60 graphics, inference workstations code-named Project Battlematrix. In Llama 8B, Intel Arc Pro B60 performance per dollar advantages of up to 1.25x and up to 4x compared to NVIDIA RTX Pro 6000 and L40S respectively. The results underscore the performance and accessibility of an all-Intel platform that addresses emerging AI inference workloads across high-end workstations and edge applications.

"The MLPerf v5.1 results are a powerful validation of Intel's GPU and AI strategy. Our Arc Pro B-Series GPUs with a new inference-optimized software stack let developers and enterprises develop and deploy AI powered applications with inference workstations that are powerful, simple to set up, accessibly priced, and scalable." - Lisa Pearce, Intel corporate vice president and general manager of Software, GPU and NPU IP Group.

Giga Computing, a subsidiary of GIGABYTE Group, today announced the availability of the XL44-SX2-AAS1 server, integrating NVIDIA RTX PRO 6000 Blackwell Server Edition GPUs with the NVIDIA BlueField-3 DPU and NVIDIA ConnectX-8 SuperNICs, this breakthrough platform unifies computing and high-speed data transfer to empower the next generation of enterprise AI.

Breakthrough in Compute and Networking Integration
The XL44-SX2-AAS1 is an NVIDIA RTX PRO Server, combining the NVIDIA Blackwell architecture with the new NVIDIA ConnectX-8 SuperNIC Switch Boards to deliver unprecedented AI performance and interconnect:

• Extreme AI Acceleration: The XL44-SX2-AAS1 is a high-density, high-performance server built on the NVIDIA MGX modular reference design. The system is accelerated by up to eight NVIDIA RTX PRO 6000 Blackwell Server Edition GPUs, each featuring 96 GB of GDDR7 memory, enabling generative AI, 3D rendering, and scientific simulations.

EnGenius Technologies, a global leader in networking solutions, today announced its expansion into the data center server market with the launch of the EAS Series DC-MHS Data Center Servers. This milestone marks EnGenius' entry into the high-performance, AI-driven data center market. The new EAS2210 (2U) and EAS1210 (1U) servers, powered by Intel Xeon 6, are purpose-built to accelerate digital transformation with modular OCP scalability for AI, virtualization, and private cloud workloads.

"The launch of the EAS Series marks a key milestone in EnGenius' vision to embrace AI connectivity," said Roger Liu, EVP at EnGenius Technologies. "Our goal is to help enterprises transform their networks into intelligent systems—capable of learning, adapting, and delivering new value in a rapidly evolving digital world."

Intel used Hot Chips to pull back the curtain on "Clearwater Forest", its next-generation E-core Xeon. The company has paired major architectural upgrades with its newest 18A process and advanced 3D Foveros packaging paired with EMIB. The chip replaces "Sierra Forest" and is built around the new "Darkmont" efficiency cores. Intel says Clearwater Forest will ship in a massive chiplet package using the 18A node for the compute pieces while relying on Foveros Direct 3D for stacking. The company is pitching this design as a showcase of what its foundry and packaging teams can now deliver.

Under the hood, the Darkmont E-core leans heavily on a wider, more parallel front end and a beefed-up out-of-order engine. Intel disclosed a 64 KB instruction cache per core and an expanded decoder that can handle more instructions per cycle than the previous "Crestmont" E-core design. Reorder and allocation structures have evolved, allocation units have been increased, and the out-of-order window has been enlarged to accommodate more in-flight work. Execution resources were also multiplied, with many more execution ports for integer and vector math, allowing the cores to sustain much higher parallel throughput.

Intel Xeon 6 processors with P-cores are now powering the new Amazon Elastic Compute Cloud (EC2) R8i and R8I-flex instances, available on AWS, delivering the highest performance and fastest memory bandwidth among comparable Intel processors in the cloud. The new instances reflect years of collaboration between Intel and AWS, bringing advanced silicon innovations and tightly integrated software optimizations to customers seeking scalable, cost-efficient and high-performance cloud infrastructure.

"The launch of the 8th Generation EC2 instances powered by Intel Xeon 6 is a milestone in our collaboration with AWS," said Ronak Singhal, senior fellow at Intel. "Together, we've built an infrastructure that accelerates AI, enhances memory performance, and simplifies deployment - helping customers achieve faster insights and stronger ROI."

Montage Technology has unveiled the Jintide C6P CPU family, a line of server processors that repurpose Intel's "Granite Rapids" Xeon 6 design with added security and tracking features for the Chinese market. The company stated that the chips are designed for regulated sectors, including government, healthcare, and finance, where hardware-level controls and customizability are most critical. Montage framed the launch as the next step in a long-running collaboration that includes Tsinghua University and a special agreement with Intel, under which Montage can reconfigure and commercialize certain Xeon processors domestically. The C6P family maps to Intel's sixth-generation Xeon Scalable P-core lineup and appears to use Granite Rapids-SP silicon, the same foundation for Intel's Xeon 6700 and 6500 series.

Montage previously released a C6E series based on Sierra Forest E-cores and has now shifted to P-core parts for workloads that prioritize single-thread performance. Promotional images showed a C6787P, which follows Montage's convention of prefixing Intel SKUs with a C. The underlying Xeon 6787P is an 86-core, 172-thread design with roughly 336 MB of L3 cache. Platform features carried over from Granite Rapids include two-socket scalability, eight memory channels with support for high-speed DIMMs, many PCIe 5.0 lanes, and CXL 2.0 compatibility. Montage also states that it has embedded China-specific encryption, decryption, and monitoring capabilities at the chip level to meet local compliance requirements. This likely comes in the form of a nearby chip placed on the CPU package, below the ISH. The company has not yet published detailed specifications, pricing, or certification dates and has not confirmed whether the higher-core Granite Rapids-AP dies will be adapted to the domestic needs.

At OCP APAC 2025 (Booth S04), MSI, a global leader in high-performance server solutions, presents modular server platforms for modern data center needs. The lineup includes AMD DC-MHS servers for 21" ORv3 and 19" EIA racks, built for scalable and energy-efficient cloud infrastructure, and a NVIDIA MGX-based GPU server optimized for high-density AI workloads such as LLM training and inference. These platforms demonstrate how MSI is powering what's next in computing with open, modular, and workload-optimized infrastructure. "Open and modular infrastructure is shaping the future of compute. With OCP-aligned and MGX-based platforms, MSI helps customers reduce complexity, accelerate scale-out, and prepare for the demands of cloud-native and AI-driven environments." - Danny Hsu, General Manager of MSI's Enterprise Platform Solutions

AMD DC-MHS Platforms for Cloud Infrastructure
Powered by a single AMD EPYC 9005 processor and up to 12 DDR5 DIMM slots per node, MSI's DC-MHS open compute and core compute platforms deliver strong compute performance and high memory bandwidth to meet the demands of data-intensive and parallel workloads. Built on the modular OCP DC-MHS architecture and equipped with DC-SCM2 management modules, these systems offer cross-vendor interoperability, streamlined integration, and easier serviceability, ideal for modern, scalable infrastructure in hyperscale and cloud environments.

Avalue Technology Inc., a global leader in industrial computing solutions, proudly announces the release of its latest high-performance server-grade motherboard, HPM-GNRUA, designed to meet the growing demands of AI, data infrastructure, and high-density edge computing. Supporting the newest Intel Xeon 6 processor platform (6500P/6700P) with a TDP of up to 350 W, HPM-GNRUA delivers next-level performance, advanced PCIe Gen 5 expandability, and robust remote management capabilities—making it the ideal backbone for compute-intensive applications.
Designed for Intelligent Infrastructure

Built on a standard ATX form factor, HPM-GNRUA is well-suited for rackmount servers, industrial chassis, and edge data center nodes. It is specifically optimized for AI inference, intelligent factory control, cloud storage management, and 5G MEC platforms. Leveraging the P-Core architecture of Intel Xeon 6, the board provides exceptional compute density and multithreaded processing for latency-sensitive workloads—delivering both stability and flexibility at the edge.