SK hynix is collaborating with Intel to utilize its Embedded Multi-die Interconnect Bridge (EMIB) 2.5D packaging technology for HBM memory. As SK hynix aims to diversify its supply chain and customers are increasingly considering Intel Foundry, the South Korean memory giant is exploring research and development efforts with Intel on 2.5D packaging technology. Intel's premier 2.5D packaging technology is its EMIB, which interconnects multiple silicon dies using bridges embedded in a packaging substrate. SK hynix is interested in integrating this technology into its HBM memory, presumably to bring its HBM4 memory modules up to standard for EMIB integration, should its AI chip partners choose Intel Foundry for advanced packaging of their next-generation solutions.

We have already covered that small silicon EMIB bridges—available in variants like EMIB-M with embedded MIM capacitors and EMIB-T with TSVs—provide low-cost, high-density shoreline connections ideal for logic-to-logic and logic-to-HBM interfaces. However, until now, SK hynix has been using TSMC and its CoWoS 2.5D packaging technology. As CoWoS is gradually reaching its limits and customers are seeking alternative packaging methods, EMIB is emerging as a strong candidate to continue the scaling of chiplets in many directions beyond the traditional reticle limit of 830 mm² of silicon area.SK hynix manufactures its silicon in-house, but the company doesn't venture into advanced packaging solutions itself. Its most advanced form of packaging is hybrid bonding, which involves stacking silicon directly on top of silicon and using thousands of TSVs to interconnect them. However, the company must take this new package and integrate it into the overall AI accelerator, which combines a dozen of these packages into a single unified package. This is where TSMC's CoWoS has been introduced, and where Intel's EMIB will now continue to play a role. We have no concrete timeline for when the first chips will arrive, but we know that R&D work is in progress, and we hope to see the first results in the coming quarters.