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AMD RV670

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RV670
Die Shot
Die Shot
Block Diagram
Block Diagram
AMD's RV670 GPU uses the TeraScale architecture and is made using a 55 nm production process at TSMC. With a die size of 192 mm² and a transistor count of 666 million it is a small chip. RV670 supports DirectX 10.1 (Feature Level 10_1). For GPU compute applications, OpenCL version N/A can be used. It features 320 shading units, 16 texture mapping units and 16 ROPs.
Further reading: R600 Series Instruction Set Architecture

Graphics Processor

Released
Nov 8th, 2007
GPU Name
RV670
Mobile Variant
M88
Codename
Boom
Architecture
TeraScale
Foundry
TSMC
Process Size
55 nm
Transistors
666 million
Density
3.5M / mm²
Die Size
192 mm²
Package
FCBGA-1281

Graphics Features

DirectX
10.1 (10_1)
OpenGL
3.3 (full)
4.0 (partial)
OpenCL
N/A
Vulkan
N/A
Shader Model
4.1
WDDM
1.1
Compute
GFX3
DCE
2.0
UVD
1.0

Render Config

Shading Units
320
TMUs
16
ROPs
16
Compute Units
4
Z-Stencil
32
Vertex Cache
32 KB
Texture Cache
32 KB
Tex L1 Cache
32 KB per 4 SPs
L2 Cache
256 KB
Max. TDP
105 W

All TeraScale GPUs

AMD GPU Architecture History

Graphics cards using the AMD RV670 GPU

Name Chip Memory Shaders TMUs ROPs GPU Clock Memory Clock
AMD FireStream 9170
2 GB 320 16 16 777 MHz 802 MHz

RV670 GPU Notes

Mobile Variant: M88
Codename: Boom
Graphics/Compute: GFX3
Display Core Engine: 2.0
Unified Video Decoder: 1.0
May 8th, 2024 04:55 EDT change timezone

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