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Intel Rocket Lake-S Lands on March 15th, Alder Lake-S Uses Enhanced 10 nm SuperFin Process

In the latest round of rumors, we have today received some really interesting news regarding Intel's upcoming lineup of desktop processors. Thanks to HKEPC media, we have information about the launch date of Intel's Rocket Lake-S processor lineup and Alder Lake-S details. Starting with Rocket Lake, Intel did not unveil the exact availability date on these processors. However, thanks to HKEPC, we have information that Rocket Lake is landing in our hands on March 15th. With 500 series chipsets already launched, consumers are now waiting for the processors to arrive as well, so they can pair their new PCIe 4.0 NVMe SSDs with the latest processor generation.

When it comes to the next generation Alder Lake-S design, Intel is reported to use its enhanced 10 nm SuperFin process for the manufacturing of these processors. This would mean that the node is more efficient than the regular 10 nm SuperFin present on Tiger Lake processors, and some improvements like better frequencies are expected. Alder Lake is expected to make use of big.LITTLE core configuration, with small cores being Gracemont designs, and the big cores being Golden Cove designs. The magic of Golden Cove is expected to result in 20% IPC improvement over Willow Cove, which exists today in Tiger Lake designs. Paired with PCIe 5.0 and DDR5 technology, Alder Lake is looking like a compelling upgrade that is arriving in December of this year. Pictured below is the LGA1700 engineering sample of Alder Lake-S processor.

Intel Xe DG1 SDV PCB Pictured, Looks Desolate

Here are some of the first pictures of the Intel Xe DG1 SDV, taken apart to reveal its rather desolate PCB. The Xe DG1 SDV isn't commercially available, but rather distributed by Intel to ISVs, so they can begin optimizing or developing for the Gen12 Xe graphics architecture. The board features a GPU ASIC that's nearly identical to the Iris Xe MAX mobile discrete GPUs, and four LPDDR4 memory chips making up 8 GB of video memory.

The Xe DG1 GPU is based on the Xe LP graphics architecture, and the silicon is built on the 10 nm SuperFin silicon fabrication node. The chip features 96 execution units (768 unified shaders); and apparently makes do with the 75 W power supplied by the PCI-Express slot. A frugal 2-phase VRM powers the GPU. The GPU uses conventional 4-pin PWM to control the fan, which ventilates a simple aluminium mono-block heatsink. Three DisplayPorts and one HDMI 2.1 make up the output configuration. While you won't be able to buy a Xe DG1 SDV in the market (unless an ISV decides to break their NDA and put one up on eBay), Intel has allowed a small number of board partners to develop custom-design cards. ASUS is ready with one. Igor's Lab has more pictures, a list of benchmark fails, and other interesting commentary in the source link below.

Intel "Alder Lake-S" Due for September 2021

2021 is shaping up to be a big year for Intel in the DIY desktop space, with the company preparing to launch not one, but two generations of desktop processors. Having announced them in January, the 11th Gen Core "Rocket Lake-S" desktop processors in the LGA1200 package, will release to market in March, with the company claiming a restoration in gaming performance leadership away from AMD's Ryzen 5000 series. Sources tell Uniko's Hardware that the company will announce its 12th Gen successor, the Core "Alder Lake-S" in September 2021.

"Alder Lake-S" will be Intel's first mainstream desktop processor built on its new 10 nm SuperFin silicon fabrication process. The chip is expected to be a "hybrid" processor, combining an equal number of larger "Golden Cove" cores, and smaller "Gracemont" cores, to offer significantly improved energy efficiency. Built in the new Socket LGA1700 package, "Alder Lake-S" is expected to feature more general-purpose SoC connectivity than LGA1200 chips. It will also herald new platform standards, such as DDR5 memory and possibly even mainstreaming of ATX12VO. The processor will launch alongside new Intel 600-series chipset. AMD's response is expected to be the "Zen 4" microarchitecture, a new silicon built on the 5 nm process, and the new AM5 socket that introduces DDR5 memory support.

Intel Has Fixed its 7 nm Node, But Outsourcing is Still Going to Happen

Intel has today reported its Q4 2020 earnings disclosing full-year revenue with the current CEO Bob Swan, upcoming new CEO Pat Gelsinger, and Omar Ishrak, Chairman of Intel's board. During the call, company officials have talked about Intel's earnings and most importantly, addressing the current problems about the company's manufacturing part - semiconductor foundries. Incoming Intel CEO, Pat Gelsinger, has talked about the state of the 7 nm node, giving shareholders reassurance and a will to remain in such a position. He has made an argument that he has personally reviewed the progress of the "health and recovery of the 7 nm program."

The 7 nm node has been originally delayed by a full year amid the expectations, and as with the 10 nm node, we have believed that it is going to experience similar issues. However, the incoming CEO has reassured everyone that it is very much improving. The new 7 nm node is on track for 2023 delivery, when Intel is expected to compete with the 3 nm node of TSMC. Firstly, Intel will make a debut of the 7 nm node with client processors scheduled for 1H 2023 arrival, with data center models following that. The company leads have confirmed that Intel will stay true to its internal manufacturing, but have stressed that there will still be a need for some outsourcing to happen.

Intel Starts Production of "Ice Lake" Xeons, Ships 11th Gen Core "Rocket Lake-S"

Intel in its FY 2020 + Q4 2020 earnings release revealed two important development milestones from its two core businesses. As part of its Q4 2020 business highlights disclosures, the company revealed that it has commenced mass-production of its next-generation Xeon Scalable "Ice Lake-SP" enterprise processors. These chips implement the "Ice Lake" microarchitecture, with "Sunny Cove" CPU cores that offer higher IPC over "Cascade Lake," and are built on the company's 10 nm silicon fabrication node. Our older article details the 10 nm "Ice Lake-SP" silicon, where each die offers up to 28 cores, and enables Intel to build processors with up to 56 cores using two such dies on multi-chip modules.

Next up, the company states that it has "started shipping" its 11th Gen Core "Rocket Lake-S" desktop processors. "Shipping" in this context could even mean commencement of mass-production, and transfer of inventory down the supply chain, in the build up to a market availability date. At its digital keynote address on the sidelines of the 2021 International CES, Intel revealed many more details of "Rocket Lake-S," including its flagship Core i9-11900K 8-core processor, which it claims retakes the gaming performance lead that the company recently lost to AMD's Ryzen 5000 series. Multiple sources confirmed that these processors should be available only after mid-March, 2021.

Intel Reports Fourth-Quarter and Full-Year 2020 Financial Results

Intel Corporation today reported fourth-quarter and full-year 2020 financial results. The company also announced that its board of directors approved a cash dividend increase of five percent to $1.39 per share on an annual basis. The board declared a quarterly dividend of $0.3475 per share on the company's common stock, which will be payable on March 1 to shareholders of record on February 7.

"We significantly exceeded our expectations for the quarter, capping off our fifth consecutive record year," said Bob Swan, Intel CEO. "Demand for the computing performance Intel delivers remains very strong and our focus on growth opportunities is paying off. It has been an honor to lead this wonderful company, and I am proud of what we have achieved as a team. Intel is in a strong strategic and financial position as we make this leadership transition and take Intel to the next level."

16-Core Intel Alder Lake-S Processor Appears with DDR5 Memory

Intel has just launched its Rocket Lake-S desktop lineup of processors during this year's CES 2021 virtual event. However, the company is under constant pressure from the competition and it seems like it will not stop with that launch for this year. Today, thanks to the popular leaker @momomo_us on Twitter, we have the first SiSoftware entries made from the anonymous Alder Lake-S system. Dubbed a heterogeneous architecture, Alder Lake is supposed to be Intel's first desktop attempt at making big.LITTLE style of processors for general consumers. It is supposed to feature Intel 10 nm Golden Cove CPU "big" cores & Gracemont "small" CPU cores.

The SiSoftware database entry showcases a prototype system that has 16 cores and 32 threads running at the base frequency of 1.8 GHz and a boost speed of 4 GHz. There is 12.5 MB of L2 cache (split into 10 pairs of 1.25 MB) and 30 MB of level-three (L3) cache present on the processor. There is also an Alder Lake-S mobile graphics controller that runs at 1.5 GHz. Intel Xe gen 12.2 graphics is responsible for the video output. When it comes to memory, Alder Lake-S is finally bringing the newest DDR5 standard with a new motherboard chipset and socket called LGA 1700.

Intel Starts Production of 10nm Xeon Scalable Processors

Intel highlighted the company's focus on execution of core products and showcased the company's broader portfolio, in addition to sharing more on what's coming in the year ahead. As part of its disclosures, Intel announced the recent production of its 3rd Gen Intel Xeon Scalable processors (code-named "Ice Lake") with volume ramp taking place during the first quarter of 2021. Intel's 10 nm Xeon Scalable processors feature architectural and platform innovations that boost performance, security and operational efficiency within data centers.

"Today marks a significant milestone for Intel as we continue to accelerate the delivery of our 10 nm products and maintain an intense focus on delivering a predictable cadence of leadership products for our customers," said Navin Shenoy, executive vice president and general manager of the Data Platforms Group at Intel. "Our 3rd Gen Intel Xeon Scalable platform represents a strategic part of our data center strategy and one that we've created alongside some of our biggest customers to enable the data center of tomorrow."

Intel CEO Says Using Competitor's Semiconductor Process in Intel Fabs is an Option

Semiconductor manufacturing is not an easy feat to achieve. Especially if you are constantly chasing the smaller and smaller node. Intel knows this the best. The company has had a smooth transition from other nodes to the smaller ones until the 10 nm node came up. It has brought Intel years of additional delay and tons of cost improving the yields of a node that was seeming broken. Yesterday the company announced the new Tiger Lake-H processors for laptops that are built using the 10 nm process, however, we are questioning whatever Intel can keep up with the semiconductor industry and deliver the newest nodes on time, and with ease. During an interview with Intel's CEO Bob Swan, we can get a glimpse of Intel's plans for the future of semiconductors at the company.

In the interview, Mr. Swan has spoken about the technical side of Intel and how the company plans to utilize its Fabs. The first question everyone was wondering was about the state of 10 nm. The node is doing well as three Fabs are ramping up capacity every day, and more products are expected to arrive on that node. Mr. Swan has also talked about outsourcing chip production, to which he responded by outlining the advantage Intel has with its Fabs. He said that outsourcing is what is giving us shortages like AMD and NVIDIA experience, and Intel had much less problems. Additionally, Mr. Swan was asked about the feasibility of new node development. To that, he responded that there is a possibility that Intel could license its competitor's node and produce it in their Fabs.

Intel Announces Four New Processor Families

In a world where computing is pervasive and intelligence is distributed across every surface - from the cloud to the network to the intelligent edge - Intel today at CES 2021 highlighted how it is driving technology leadership to define the future of computing for people, business and society. To help people navigate through this extraordinary time, Intel introduced new processors for business, education, mobile and gaming computing platforms - all designed to offer the premium PC experiences people deserve, with the most choices and no limits.

"Only Intel has the breadth of products spanning multiple architectures; the large, open ecosystem; sheer scale of manufacturing footprint; and deep technical expertise customers need to unlock opportunities in this era of distributed intelligence," said Intel Executive Vice President Gregory Bryant. "With an intense focus on execution for our core products and across our broader portfolio, we're introducing a series of leadership products at CES with more following throughout the year."

Hedge Fund Urges Intel to Outsource Chip Production: Reuters

Intel is familiar with chip manufacturing problems since the company started the development of a 10 nm silicon semiconductor node. The latest node is coming years late with many IPs getting held back thanks to the inability of the company to produce it. All of Intel's chip production was historically happening at Intel's facilities, however, given the fact that the demand for 14 nm products is exceeding production capability, the company was forced to turn to external foundries like TSMC to compensate for its lack of capacity. TSMC has a contract with Intel to produce silicon for things like chipsets, which is offloading a lot of capacity for the company. Today, thanks to the exclusive information obtained by Reuters, we have information that a certain New York hedge fund, Third Point LLC, is advising the company about the future of its manufacturing.

The hedge fund is reportedly accounting for about one billion USD worth of assets in Intel, thus making it a huge and one influencing shareholder. The Third Point Chief Executive Daniel Loeb wrote a letter to Intel Chairman Omar Ishrak to take immediate action to boost the company's state as a major provider of processors for PCs and data centers. The company has noted that Intel needs to outsource more of its chip production to satisfy the market needs, so it can stay competitive with the industry. The poor performance of Intel has reflected on the company shares, which have declined about 21% this year. This has awoken the shareholders and now we see that they are demanding more aggressiveness from the company and a plan to outsource more of the chip production to partner foundries like TSMC and Samsung. It remains to be seen how Intel responds and what changes are to take place.

Intel Expands 10nm Manufacturing Capacity

In response to incredible customer demand, Intel has doubled its combined 14 nm and 10 nm manufacturing capacity over the past few years. To do this, the company found innovative ways to deliver more output within existing capacity through yield improvement projects and significant investments in capacity expansion. This video recounts that journey, which even included re-purposing existing lab and office space for manufacturing.

"Over the last three years, we have doubled our wafer volume capacity, and that was a significant investment. Moving forward, we're not stopping… We are continuing to invest into factory capacity to ensure we can keep up with the growing needs of our customers," says Keyvan Esfarjani, senior vice president and general manager of Manufacturing and Operations at Intel. The company also ramped its new 10 nm process this year. Intel currently manufactures 10 nm products in high volumes at its Oregon and Arizona sites in the U.S. and its site in Israel.

Intel's Manufacturing Outlook for the Future Doesn't Inspire Confidence in Successful Competition, According to Susquehanna Call

Susquehanna is a global trading firm which has various interests in silicon manufacturing - and part of that interest is naturally materialized in Intel. In a recent group call from the firm, some details on Intel's manufacturing and product design woes came to light, which point towards even more execution slips than we've already seen. During the call, a number of points were broached, including dismal yields for Intel's 10 nm manufacturing process as of its introduction in late 2018 (which is why it never saw mainstream adoption from the company). News that Intel is looking for a new CEO also don't instill confidence on current CEO Bob Swan's capacity to steer the Intel behemoth.

Improved yields on 10 nm are being reported due to deployment of Intel's SuperFin technology, which improved yields to upwards of 50%, but still keeps them under the ones achieved in Intel's 14 nm process; an eye-opening tidbit in that Cannon Lake on 10 nm originally saw yields of only 25% usable chips per wafer; and that backporting Rocket Lake meant Intel had to deal with unfathomably large chips and high power consumption characteristics. And to add insult to injury, there is still not a definite timetable for 7 nm deployment, with delays being expected to be worse than the previously reported 6-12 months. This all paints a somewhat grim picture for Intel's capacity to compete with TSMC-powered AMD in many of its most important markets; the blue giant won't topple, of course, but it's expected that five years from now, we'll be looking at a very different outlook in the market between AMD and Intel. You can check the talked-about points in the call via the transcript after the break. You should still take the transcript with a grain of salt.

Alleged Intel Sapphire Rapids Xeon Processor Image Leaks, Dual-Die Madness Showcased

Today, thanks to the ServeTheHome forum member "111alan", we have the first pictures of the alleged Intel Sapphire Rapids Xeon processor. Pictured is what appears to be a dual-die design similar to Cascade Lake-SP design with 56 cores and 112 threads that uses two dies. The Sapphire Rapids is a 10 nm SuperFin design that allegedly comes even in the dual-die configuration. To host this processor, the motherboard needs an LGA4677 socket with 4677 pins present. The new LGA socket, along with the new 10 nm Sapphire Rapids Xeon processors are set for delivery in 2021 when Intel is expected to launch its new processors and their respective platforms.

The processor pictured is clearly a dual-die design, meaning that Intel used some of its Multi-Chip Package (MCM) technology that uses EMIB to interconnect the silicon using an active interposer. As a reminder, the new 10 nm Sapphire Rapids platform is supposed to bring many new features like a DDR5 memory controller paired with Intel's Data Streaming Accelerator (DSA); a brand new PCIe 5.0 standard protocol with a 32 GT/s data transfer rate, and a CXL 1.1 support for next-generation accelerators. The exact configuration of this processor is unknown, however, it is an engineering sample with a clock frequency of a modest 2.0 GHz.

Intel Ice Lake-SP Processor Spotted with 36 Cores and 3.6 GHz Base Clock

Today, in the latest GeekBench 5 submission by ASUS, we have discovered something rather interesting. Intel's Ice Lake-SP processors were rumored to arrive with up to 28 cores and 56 threads at maximum, on a single chip. That was due to the 10 nm process used to make these chips, with suspicions that the yield of the node was not good enough to make any higher core count parts. Thanks to the GB5 listing, discovered by Leakbench on Twitter, the Intel Ice Lake-SP CPU engineering sample appeared with an amazing 36 cores with 72 threads. This is supposedly Intel's efforts to try and match the 64 cores and 128 threads of AMD's EPYC "Rome" CPUs, which are winning many server applications due to their performance.

The 36C/72T chip was paired with another similar chip in a 2P dual-socket configuration, which made the total core count rise to 72 cores and 144 threads, running inside of Asustek's Y4R-A1-ASUS-G1 server. The system was reporting a clock frequency of 3.6 GHz base speed, which means that the possible boost clocks could be higher. The CPU features a 1.25 MB level two (L2) cache per core (45 MB in total) and 54 MB of unified level three (L3) cache. That makes this CPU core quite an improvement over the past Cooper Lake generation. We are waiting for more information about these CPUs, and we are going to report on it in the coming time.

Intel 11th Generation Core Tiger Lake-H Processor Appears

Intel has launched its Tiger Lake-U lineup of products back in September, with the availability of the first products in October. The launched lineup was part of the "U" variant of ultra-portable devices that stretched only to four core, eight threaded configurations. However, given that the new competitor in mobile space, AMD, has a wide portfolio of offerings that are coming with up to 8C/16T variants, Intel needs a proper response to that. Despite having a better single-threaded performance, the multi-threaded capability of the Ryzen 4000 series is delivering better performance. Thanks to the popular hardware leaker, TUM APISAK, we have the first appearance of Intel's 11th generation Tiger Lake-H processor.

Appearing in Userbenchmark, the processor was tested on a platform codenamed "Insyde TigerLake". The processor was spotted running 8 cores and 16 threads, at the average frequency of 2.75 GHz. This is only an engineering sample, meaning that these clocks do not represent the final frequencies of the processor. As a reminder, Intel's Tiger Lake CPU is a Willow Cove based design manufactured on Intel's 10 nm SuperFin silicon node. We are yet to see the capabilities of the new node and how the chip performs once the reviews arrive.

Intel Alder Lake-S Processor Pictured

Intel has just recently announced its next-generation Rocket Lake-S processor specifications designed to bring improved performance and newer platform technologies like PCIe 4.0. However, we are yet to see the first 10 nm CPU for desktop users. Today, thanks to the sources over at VideoCardz, we have the first look at Intel's next-next-generation processor called Alder Lake. The Alder Lake-S is a platform that brings many of the "firsts" for Intel. It will be the first architecture being built on the company's 10 nm SuperFin architecture. Alongside the new node, the platform will transition to the next-generation of technologies. Rumored are the transitions to PCIe 5.0 and perhaps, most importantly - DDR5.

Another new approach will be Intel's adaptation of Arm's big.LITTLE heterogeneous core structure. The processor will feature a few of the "little" cores for light tasks, and fire up the "big" cores for heavy computing. All of that will require a new socket to house the processor, which is the LGA1700. You can see the new processor below, compared to LGA1200 CPU from the previous generation.

Intel Storms into 1080p Gaming and Creator Markets with Iris Xe MAX Mobile GPUs

Intel today launched its Iris Xe MAX discrete graphics processor for thin-and-light notebooks powered by 11th Gen Core "Tiger Lake" processors. Dell, Acer, and ASUS are launch partners, debuting the chip on their Inspiron 15 7000, Swift 3x, and VivoBook TP470, respectively. The Iris Xe MAX is based on the Xe LP graphics architecture, targeted at compact scale implementations of the Xe SIMD for mainstream consumer graphics. Its most interesting feature is Intel DeepLink, and a powerful media acceleration engine that includes hardware encode acceleration for popular video formats, including HEVC, which should make the Iris Xe MAX a formidable video content production solution on the move.

The Iris Xe MAX is a fully discrete GPU built on Intel's 10 nm SuperFin silicon fabrication process. It features an LPDDR4X dedicated memory interface with 4 GB of memory at 68 GB/s of bandwidth, and uses PCI-Express 4.0 x4 to talk to the processor, but those are just the physical layers. On top of these are what Intel calls Deep Link, an all encompassing hardware abstraction layer that not only enables explicit multi-GPU with the Xe LP iGPU of "Tiger Lake" processors, but also certain implicit multi-GPU functions such as fine-grained division of labor between the dGPU and iGPU to ensure that the right kind of workload is split between the two. Intel referred to this as GameDev Boost, and we detailed it in an older article.

Raja Koduri to Present at Samsung Foundry Forum amid Intel's Outsourcing Efforts

Intel's chief architect and senior vice president of discrete graphics division, Mr. Raja Koduri, is said to be scheduled to present at Samsung Electronics Event day. With a presentation titled "1000X More Compute for AI by 2025", the event is called Samsung Foundry SAFE Forum. It is a global virtual conference designed to be available to everyone. So you might be wondering what is Mr. Koduri doing there. Unless you have been living under a rock, you know about Intel's struggles with node manufacturing. Specifically, the 10 nm node delays that show the company's efforts to deliver a node on time. The same is happening with the 7 nm node that also experienced significant delays.

Intel has a contract to develop an exascale supercomputer at Argonne National Laboratory, called Aurora. That supercomputer is using Intel's CPUs and the company's upcoming Xe GPUs. Since the company has problems with manufacturing and has to deliver the products (it is bound by several contracts) to its contractors and customers, it decided to look at external manufacturers for its products, specifically Xe graphics. Being that Mr. Koduri tweeted an image of him visiting Samsung Giheung Fab in Korea, and now presenting at the Samsung Foundry event, it is possible that Intel will tap Samsung's semiconductor manufacturing process for its Xe GPU efforts and that Samsung will be the contractor in charge.

Intel "Tiger Lake" Based Pentium and Celeron to Feature AVX2, an Instruction the Entry-Level Brands were Deprived Of

Intel's next-generation Pentium Gold and Celeron entry-level processors based on the "Tiger Lake" microarchitecture could finally receive the AVX2 instruction set. Intel had segmented AVX and AVX2 to be exclusive to the Core and Xeon brands, with the Pentium Gold and Celeron products based on the same microarchitectures to artificially lack these instructions.

Intel updated its ARK product information database with entries for "Tiger Lake" based Pentium Gold and Celeron products. The page for the Pentium Gold 7505 and Celeron 6305, mention support for AVX2 besides SSE4. Both are mobile chips with 15 W TDP, and are built on the same 10 nm SuperFin process as the rest of the 11th Gen Core "Tiger Lake" processor family.

Intel Alder Lake-S CPU Has Been Pictured

Intel has been preparing the launch of its 10 nm processors for desktop users for some time now, and today we are getting the first pictures of the Alder Lake-S CPU backside. Featuring a package with a size of 37.5×45 mm, the Alder Lake CPU uses more of its area for a pin count increase. Going up from 1200 pins in the LGA1200 socket, the new Alder Lake-S CPU uses 1700 CPU pins, which slots in the LGA1700 socket. In the picture below, there is an engineering sample of the Alder Lake-S CPU, which we see for the first time. While there is no much information about the processor, we know that it will use Intel's 10 nm SuperFin design, paired with hybrid core technology. That means that there will be big (Golden Cove) and little (Gracemont) cores in the design. Other features such as PCIe 5.0 and DDR5 should be present as well. The new CPU generation and LGA1700 motherboards are scheduled to arrive in second half of 2021.

Intel's 10 nm-Geared Fab 42 Enters Operational Status

Intel has finally sounded the "full steam ahead" whistle for its Fab 42, set in Arizona. Fab 42 has a storied past to it, as Intel started its construction back in 2011. It was actually finished by 2013, and by 2014 all essential infrastructure for semiconductor fabrication was there - except for the fabrication equipment itself. You see, Intel aimed for this factory to produce 450 mm wafers (instead of the industry standard 300 mm) in the 14 nm process. However, back in 2014, Intel wasn't sure about demand for its 14 nm products - and the company was actually planning to debut 10 nm back in 2016, so it sort of made sense. Of course, then came the 10 nm delays, the 14 nm supply issues, and backporting of certain products to other less cutting-edge processes. If only Intel had had a crystal ball.

Alleged Prices of TSMC Silicon Wafers Appear

TSMC, one of the biggest silicon manufacturers in the world, usually doesn't disclose company pricing of the silicon it manufactures and only shares that with its customers. It appears that RetiredEngineer (@chiakokhua on Twitter) got a hold of the pricing of TSMCs wafers on every manufacturing node starting from 90 nm down to 5 nm. That includes a wide portfolio of 65, 40, 28, 20, 16/12, 10, and 7 nm nodes as well. The table shown below includes information dating to April 2020, so it is possible that some things are now different and they surely are. There are a few quite interesting notes from the image, namely the price increase as the node shrinks.

From 90 nm to 20 nm, the price of the wafer didn't increase as much, however, starting from 16/12 nm node(s), TSMC has seen costs per wafer, and other costs increase exponentially. For example, just compare the 10 nm wafer price of $5992 with the price of a 5 nm wafer which costs an amazing $16988. This is more than a 180% price increase in just three years, however, the cost per transistor is down as you get around 229% higher density in that period, making TSMC actually in line with Moore's Law. That is comparing Transistor density (MTr / mm²) of 52.51 million transistors for the 10 nm node and 173 million transistors per mm² of the 5 nm node .

Intel Pentium Silver and Celeron "Jasper Lake" Lineup Detailed

Intel is giving finishing touches to six new Pentium Silver and Celeron "Jasper Lake" entry-level processors. Built on the 10 nm silicon fabrication process, these processors leverage the "Tremont" CPU cores, or the "small" x86-64 cores Intel is deploying on its "Lakefield" Core Hybrid processors. The chips also feature a low-power trim of the company's Gen11 iGPU (same graphics architecture found in "Ice Lake-U" and "Lakefield" processors). The desktop SKUs consist of three parts with TDP rated at 10 W, while the three other mobile SKUs offer 6 W TDP.

The desktop lineup is led by the Pentium Silver J6005, a 4-core/4-thread part with 2.00 GHz clock speeds, up to 3.00 GHz "maximum quad-core burst speed," and 4 MB L2 cache. The Celeron J5105 is next in line, with 2.00 GHz clocks, 2.80 GHz burst speeds, a slightly slower iGPU, and 4 MB L2 cache. At the bottom end of the desktop lineup is the Celeron J4505, a 2-core/2-thread part clocked at 2.00 GHz with 2.90 GHz burst, and 4 MB L2 cache. The mobile lineup is led by the Pentium Silver N6000, a 4-core/4-thread part with 1.10 GHz clocks, 3.10 GHz burst speeds, and 4 MB L2 cache. The Celeron N5100 is right behind, clocked at 1.10 GHz and 2.80 GHz clocks. At the bottom of the stack is the Celeron N4500, a 2-core/2-thread part with 1.10 GHz base and 2.80 GHz burst.
An Intel video presentation on the "Tremont" CPU core architecture follows.

Intel 11th Gen Core "Tiger Lake" Promotional Videos Leak

Promotional videos of Intel 11th Gen Core "Tiger Lake" processors leaked to the web courtesy h0x0d on Twitter. It confirms the new corporate identity of Intel, along with its new logo artistic language. It also confirms the new EVO Powered by Core brand extension, along with a separate case badge for notebooks that use Iris Xe discrete graphics (DG1) in addition to the Xe Gen12 iGPU of "Tiger Lake." Intel has a technology that can get the Xe LP iGPU and dGPU to work in tandem. VideoCardz compiled some interesting frames from the promotional videos, revealing bits such as clock speeds of up to 4.80 GHz (boost), 3.11 GHz (base), the first "Tiger Lake" parts being 4-core/8-thread, the new 10 nm SuperFin transistor, wafer- and die shots of "Tiger Lake" 4c+96EU die, and unless we're mistaken, pictures of a "Tiger Lake" package that uses a DRAM (HBM?) stack on-package, using EMIB. h0x0d also posted videos of the Lenovo Yoga 9i and HP Spectre notebooks based on "Tiger Lake."
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