JEDEC Solid State Technology Association, the global leader in standards development for the microelectronics industry, today announced the publication of JESD406-5D: LPDDR5/5X Serial Presence Detect (SPD) Contents standard, an update of the Revision C standard that adds support for calculating recovery time when switching operating modes. JESD406-5D is available for free download from the JEDEC website.

LPDDR5/5X memory devices are capable of supporting two sets of timing parameters: a full speed mode and a reduced speed mode that consumes less power. This feature allows for longer battery life for mobile devices which are a common application for LPDDR5/5X chips and modules and may also be leveraged by data centers as the use of LPDDR5/5X devices grows. The updated JESD406-5 standard documents key parameters for calculating the switching time between fast and low power modes, making the feature more efficient and allowing higher system performance.

SolidRun, a leading developer and manufacturer of high-performance system-on-module (SOM) solutions, single-board computers (SBC) and network edge solutions, announced its new P100 COM Express Type 6 module family, powered by AMD Ryzen AI Embedded P100 processors. Designed for real-world edge deployments where systems don't sit still, the P100 COMx6 series targets mobile platforms as well as harsh, mission-critical environments across industrial automation, transportation, medical systems, and robotics.

"Edge AI is moving out of controlled environments and into the real world, like mobile platforms, harsh industrial sites, and mission-critical deployments where serviceability, and longevity matter as much as raw compute," said Dr. Atai Ziv, CEO of SolidRun. "Our new P100 COM Express Type 6 modules are built to deliver powerful AI performance at the edge while improving the mechanical durability and serviceability product developers need to deploy confidently in demanding environments."

SK hynix has successfully developed new LPDDR6 memory modules with a 16 Gb capacity on the sixth-generation 10 nm node, known as 1c. The South Korean giant has confirmed that mass production of this memory is scheduled for the first half of the year, with the product reaching customers in the second half. Additionally, SK hynix claims that the speed of these LPDDR6 modules exceeds 10.7 Gbps, suggesting that the company is preparing some overclocked versions as well, surpassing the initial speed specifications of this LPDDR6 generation from JEDEC. If the previous International Solid-State Circuits Conference (ISSCC) 2026 show in San Francisco was an indication, SK hynix is preparing modules that will run at speeds of up to 14.4 Gbps, delivering a significant throughput boost over the previous-generation LPDDR5X memory. The company claims a 33% improvement over LPDDR5X, which topped out at 10.7 Gbps, aligning with the 14.4 Gbps figure for LPDDR6.

SK hynix is also expecting significant power efficiency optimizations exceeding 20% thanks to the new technologies enabling LPDDR6 to run. This generation of low-power DDR memory uses a sub-channel structure that allows the memory channels to operate selectively and only process necessary data paths, meaning not all channels need to be engaged when unnecessary. Additionally, LPDDR6 incorporates Dynamic Voltage and Frequency Scaling (DVFS), which optimizes power consumption and performance by dynamically adjusting the voltage/frequency curve depending on the scenario. SK hynix notes that during applications like gaming, DVFS will scale the frequency to achieve maximum bandwidth, while standard applications will see lower frequencies to balance power consumption.

ASUS today announced NUC 16 Pro Mini PC, a compact Copilot+ PC offering versatile AI-accelerated performance to handle a wide range of needs. Powered by up to the latest Intel Core Ultra 9 Series 3 processor and boasting onboard LPDDR5x memory, the NUC 16 Pro delivers up to 1.5X faster 3D graphics processingi, 20% faster performance, and 50% less power consumption over previous-generation NUC models. Built-in Intel WiFi 7 and Bluetooth 6.0 wireless connectivity, along with dual 2.5G LAN ports, make the NUC 16 Pro ideal for hyper-connected workspaces. In addition, select models include fTPM for enterprise-grade security and management.

Next-generation Intel Core Ultra Series 3 processors with built-in Intel Arc GPU
The NUC 16 Pro Mini PC easily tackles AI workloads. Featuring up to an Intel Core Ultra X9 processor with built-in Intel Arc B390 GPU and a 50 TOPS NPU delivering up to 180 Platform TOPS for real-time Edge AI inference and machine learning tasks. This compact Copilot+ PC is an Edge AI-ready system that enables secure, low-latency on-device intelligence to support AI-driven applications for videoconferencing, analytics, language translation, and enhanced team collaboration.

ASUS recently announced the NUC 16 mini PC at CES 2026, with the NUCs confirmed to feature Intel's Panther Lake Core Ultra Series 3 CPUs, LPDDR5X-9600 RAM, and Intel Arc B390 integrated graphics. When the NUC Pro 16 was revealed, pricing and availability were somewhat nebulous, but that information has been partially revealed ahead of launch thanks to @realVictor_M on X.

According to the leaker, who cites what appears to be leaked Chinese press materials, the NUC 16 Pro with the Intel Core Ultra X7, 32 GB of RAM, and 1 TB of NVMe storage will cost RMB 10,999, which converts to roughly $1,600 ($1,591.50 exactly, at the time of writing). Part of this high pricing is likely to be a direct result of the current memory crisis caused by AI center demand, but it should also be noted that international pricing is rarely ever as simple as a currency conversion, so expect prices to be somewhat higher than that $1,600 when the mini PC launches internationally. It's also notable that ASUS originally cited the Intel Core Ultra X9 as the high-end CPU spec for the mini PC, and the pricing cited by the leak is for the X7 version. Currently, the Chinese launch looks to be scheduled for March 11, so an international launch should follow shortly thereafter.

Given the current state of the gaming industry, rumors have started to emerge about the next-gen gaming console launches, with previous rumors claiming that the PlayStation 6 would launch alongside a new standalone PlayStation Portable gaming handheld, and that the PS6 would have less graphical processing power than the upcoming Xbox console. In a new post on YouTube, ubiquitous leaker and industry insider, Moore's Law is Dead, claims that the PS6 Orion—the living room console—will feature 2.5-3× the rasterization performance of the PS5 and 6-12× the ray tracing performance of the PS5, or 3-6× faster ray tracing than the PS5 Pro and roughly twice the raster performance of the PS5 Pro. This is thanks to a significantly faster RDNA 5 GPU with 52-54 CUs running at around 2-3.6 GHz and delivering around 34-40 TFLOPS of theoretical performance.

The leaker also shot down rumors that recently surfaced claiming that the PlayStation 6 may be delayed to as late as 2029 due to the ongoing memory crisis, stating that the nature of memory and APU fabrication contracts make it unlikely that the PS6 will be delayed that long. Instead, we may see a brief period of increased pricing or scarcity at launch. Apparently, according to his sources, Sony has a contract with TSMC to start mass-producing the PS6 as early as Q2 2027. MLID also mentions the AMD "Canis" APU slated to arrive in the PS6 handheld console, claiming that it will feature four Zen 6c cores, two Zen 6 LP cores (for running the operating system), and 16 RDNA 5 CUs running at 1.6-2 GHz with a 15 W total board power, all being fed by LPDDR5X memory over a 192-bit bus. All of this will allegedly be targeting 1080p gameplay with a significantly higher power limit when docked. He also speculates that the handheld will feature "vastly better" ray tracing than the PS5.

In response to memory shortages, PC OEMs are exploring alternative manufacturers and suppliers for this increasingly scarce and valuable resource. Customers now need to make purchasing decisions within an hour or even prepay suppliers to secure DRAM. Recently, Lenovo has started using the Chinese memory supplier CXMT in some of its laptop models. Lenovo is officially rolling out its LPCAMM2 memory to mainstream laptops after introducing it with the ThinkPad P1 Gen 7 back in 2024. LPCAMM2 is a new memory standard that combines the performance of LPDDR5X with the upgradeability of a regular SODIMM. The ThinkBook 16+ is likely Lenovo's first consumer device to feature LPCAMM2, offering up to 32 GB of LPDDR5X-8533 memory, supported by an Intel Core Ultra X7 385H and its Arc B390 iGPU, using the first CXMT memory modules.

Late last year, CXMT introduced its DDR5-8000 and LPDDR5X-10667 memory modules at the 2025 China International Semiconductor Expo. This development has likely encouraged many OEMs to seek alternatives to traditional suppliers like SK Hynix, Samsung, and Micron, whose supply has been very limited outside AI accelerator workloads. Even Apple is reportedly considering partnerships with Chinese semiconductor manufacturers CXMT and YMTC for its upcoming iPhone 18 series and possibly other products like MacBooks and Mac computers. With suppliers such as Kioxia, Samsung, and SK hynix raising prices due to a significant industry shortage, Apple is experiencing pressure on its profit margins while maintaining the same MSRP for its products. To diversify its supply chain, Apple is reportedly looking into sourcing DRAM from CXMT and NAND Flash from YMTC to reduce its reliance on South Korean and Japanese suppliers.

Lenovo has officially launched the ThinkBook 16+ in China, officially kicking off its LPCAMM2 rollout to mainstream laptop after it launched the ThinkPad P1 Gen 7 with the new RAM standard as far back as 2024. LPCAMM2 is a new memory standard that allows all of the performance of LPDDR5X with the upgradeability of a regular SODIMM. The ThinkBook 16+ appears to be Lenovo's first consumer device to feature LPCAMM2, launching with up to 32 GB of LPDDR5X-8533 memory backing up an Intel Core Ultra X7 385H and its Arc B390 iGPU.

Specs for the ThinkBook 14+ are not completely listed on Lenovo China, but the rest of the ThinkBook 16+'s specs impress, featuring Wi-Fi 7, 165 Hz display with 100% DCI-P3 coverage and support for VRR, and a 99.9 Wh battery. The laptop also features 2× Thunderbolt 4 ports, 2× USB 3.2 Gen 1 Type-A ports, and 1× USB 2.0 Type-B port, a 3.5 mm audio combo jack, and a 4-in-1 SD card reader for SD, SDHC, SDXC, and CMMC cards. Lenovo has also equipped the ThinkBook 16+ with a Windows Hello-compatible 1080p webcam with a physical shutter as well as support for Lenovo's Magic Bay accessory ecosystem, which has started expanding to more laptops in 2026. The new ThinkBook series also features Lenovo's pressure-sensitive Forcepad, which also integrates haptic feedback and multitouch support. In China, the ThinkBook 16+ 2026 comes in at RMB 8499 ($1,240) while the ThinkBook 14+ 2026 starts at RMB 8299 ($1,210) with all of the same internal specifications. At the time of writing, though, there is no indication that these laptops will launch outside of China, although another laptop series will likely take their place in international markets.

It was recently revealed by Komodo Station, Valve's official retail partner for Steam hardware in Korea, Japan, Hong Kong, and Taiwan, that prices for the Steam Deck OLED prices will increase by as much as 17% in March. However, as the storefront explains in the announcement, these price increases are as a result of "increases in logistics costs and increased exchange rate volatility," not as a result of the ongoing memory shortages and price increases. It specifically notes that prices in Hong Kong remain unchanged, which should be a positive indication for western audiences that Steam Deck prices aren't about to skyrocket—yet.

While neither Valve nor Komodo has provided any indication that prices are about to increase for the Steam Deck, it has been revealed that Valve's supply chain is affected by the current memory crisis as much as any other hardware company. The gaming giant recently postponed announcing pricing for the Steam Machine and Steam Frame due to increased uncertainty and skyrocketing memory prices. The Steam Deck may still be somewhat exempt from these price increases because of Valve's pricing structure that follows the typical console model instead of a PC pricing strategy—that is to say that Valve has priced the Steam Deck very competitively in order to attract buyers to its platform and storefront. However, if Valve is already eating the cost of inflated Steam Deck memory and storage costs, it almost seems inevitable that it will eventually have to increase the price of the Steam Deck. Currently, even Nintendo is considering price increases for the Switch 2 after its LPDDR5X cost price increased by as much as 41%.

TrendForce's latest findings reveal that the expansion of AI applications from LLM training to inference has prompted CSPs to broaden data center build-outs beyond AI servers to include general-purpose servers. This shift has extended memory procurement beyond HBM3e, LPDDR5X, and high-capacity RDIMMs to RDIMMs across multiple densities. Aggressive additional orders have driven a sharp increase in conventional DRAM contract prices, lifting total DRAM industry revenue to $53.58 billion in 4Q25, up 29.4% QoQ.

Across segments, buyers have struggled to secure sufficient supply amid a widening supply-demand gap. This has significantly strengthened suppliers' pricing power. Conventional DRAM contract prices rose 45-50% QoQ, while blended contract prices for conventional DRAM and HBM increased 50-55%, marking an accelerated upswing across all product categories.

Team Group Inc. today announced its strong return to Embedded World 2026, one of the world's premier events for embedded technologies, following its Embedded Award-winning presence at last year's exhibition. Building on this momentum, Team Group will focus on two core themes, "Edge to Action" and "Military", highlighting AI-driven intelligent applications alongside mission-critical data security solutions for highly sensitive environments.

The showcase will feature a comprehensive portfolio spanning high-performance embedded storage and military-grade physical destruction technologies, demonstrating Team Group's continued commitment to advancing efficiency, stability, and security across industrial and defense-related sectors while delivering end-to-end solutions that seamlessly connect edge computing with real-world deployment. Embedded World 2026 will take place from March 10-12 at the NürnbergMesse Convention Center in Nuremberg, Germany. Team Group cordially invites visitors to Hall 3 / Booth 3-349 to explore its latest embedded breakthroughs designed to enable more precise, trusted, and secure intelligent applications.

According to reports from Chinese local media, Apple is considering partnering with Chinese semiconductor manufacturers CXMT and YMTC for its upcoming iPhone 18 series and potentially other products like MacBooks and Mac computers. With memory and storage suppliers such as Kioxia, Samsung, and SK hynix raising prices due to a significant industry shortage, Apple is experiencing a squeeze on its profit margins while maintaining the same MSRP for its products. To diversify its supply chain, Apple is reportedly exploring the addition of DRAM from CXMT and NAND Flash from YMTC to reduce its dependence on South Korean and Japanese suppliers.

Recently, the U.S. Government's Bureau of Industry and Security reportedly removed CXMT and YMTC from the list of restricted Chinese companies. This move could benefit Apple, which may now utilize products from both firms. CXMT offers LPDDR5X and DDR5 memory, which aligns with Apple's needs for its products. Since Apple's iPhones and M-series SoCs primarily use LPDDR5X memory, CXMT's 12 Gb and 16 Gb LPDDR5X capacities could serve both the smartphone and computer sectors effectively.

A Lenovo product manager on Chinese social media held up what is possibly the highest capacity and highest speed LPCAMM2 module. An LPCAMM2 is a SOCAMM2 module that uses LPDDR5 or LPDDR5X DRAM. It is replaceable, unlike traditional LPDDR implementations that see the DRAM chips hardwired to the notebook's mainboard. Pictured here, is a new Samsung LPCAMM2 that offers 96 GB of density with a speed of LPDDR5X-9600. This speed is natively supported by Core Ultra Series 3 "Panther Lake" mobile processors, or at least the Core Ultra X7 and X9 brand extensions. It not for the acute DRAM supply crisis, the mid-2020s were expected to see a rise in PC mainstream memory densities.

The next major refresh of AMD's Ryzen AI MAX APUs is still far away, but now we are putting together the pieces of the "Medusa Halo" APU puzzle. According to a famous leaker, @Olrak29_ on X, AMD's next-generation "Medusa Halo" APU will be complemented by LPDDR6 memory. This is one of the first LPDDR6 memory SoCs we are learning about, making it unique. Based on previous rumors, the silicon could have a 384-bit bus powering LPDDR6 memory, which would translate into massive bandwidth powering the SoC's new CPU and GPU configuration. This includes up to 24 "Zen 6" CPU cores and 48 RDNA 5/UDNA compute units for the GPU configuration. Paired with the added bandwidth from LPDDR6 memory—which these APUs greatly benefit from—"Medusa Halo" will be one of the best-performing SoCs when it launches.

Interestingly, memory manufacturers like Samsung and Innosilicon are already supplying LPDDR6 modules to customers for validation. Innosilicon's LPDDR6 modules boast an impressive speed of 14.4 Gbps, significantly faster than Samsung's initial modules, which achieve 10.7 Gbps. Innosilicon's modules offer a 1.5x increase in IO speed capability compared to the 9.6 Gbps of LPDDR5X previously available, along with improved efficiency. The latest LPDDR6 also increases the number of bits per byte of IO from 8 to 12. This results in LPDDR6's bandwidth at a single-channel 24-bit I/O speed being double that of LPDDR5X at a 16-bit single-channel. The company is reportedly collaborating with TSMC and Samsung to ensure sufficient production capacity for LPDDR6 IP, while Samsung relies on its own fabs for manufacturing memory.

In an exclusive report for VideoCardz, Intel is reportedly targeting an LPDDR5X memory speed of 8,533 MT/s for its upcoming Core Ultra G3 series of "Panther Lake" chips arriving in the second quarter for handheld gaming devices. After we learned that Intel is imposing certain memory mandates on its OEM partners, it seems like the Core Ultra G3 will face similar mandates from the company to prevent OEMs from "cutting corners" and implementing slower LPDDR5X memory. For the new handheld-tuned Core Ultra G3 and G3 Extreme, that specification is now set to 8,533 MT/s, which is slightly below its flagship "Panther Lake" Core Ultra X SKUs that can support LPDDR5X memory running at 9,600 MT/s.

Presumably, Intel will require OEM partners and makers of the next-generation handheld consoles to use this 8,533 MT/s memory on both SKUs. These chips will feature a 14-core CPU configuration, including two P-Cores, eight E-Cores, and four LPE-Cores. A key selling point of these SoCs is the Arc integrated graphics, with the G3 Extreme offering 12 Xe3 cores and the standard G3 featuring 10 Xe3 cores. The G3 Extreme plans to run the Arc B380 iGPU with 12 Xe3 cores at 2.3 GHz, just 200 MHz below the flagship Core Ultra X9 388H's Arc B390. Essentially, G3 Extreme handhelds can expect gaming performance similar to that of the flagship SKU, albeit with two fewer P-Cores and a slightly lower GPU clock speed. The regular G3 maintains its CPU capabilities, but the GPU is reduced to a 10-core Xe3 IP called Arc B360, with a GPU boost frequency of 2.2 GHz, resulting in a notable decrease in both gaming performance and TDP.

NVIDIA's upcoming "Vera Rubin" AI systems are scheduled for late summer shipping in the form of VR200 NVL72 rack-scale solutions that will power the next generation of AI models. However, not every memory maker of HBM4 qualified for a design win, as Micron has reportedly fallen out of the equation, with only Samsung and SK hynix left to supply the precious HBM4 memory. According to leaked institutional notes from SemiAnalysis, which tracks the supply chain in great detail, SK Hynix will represent about 70% of the HBM4 supply for VR200 NVL72 systems, with Samsung getting the remaining 30% of the supply. For a major memory maker like Micron, there is reportedly zero commitment for the supply of HBM4 memory.

Interestingly, this is not the end of Micron's share of memory in NVIDIA VR200 NVL72 systems. Instead of HBM4, the company will supply LPDDR5X memory for "Vera" CPUs, which can be equipped with up to 1.5 TB of LPDDR5X, making up for the lost share with the HBM4. It is possible that Micron didn't qualify for the significant system upgrade that NVIDIA performed for VR200 NVL72, which went from the initial system target of 13 TB/s in March 2025 to 20.5 TB/s in September. However, at CES 2026, NVIDIA confirmed that the VR200 NVL72 system is now operating at 22 TB/s of bandwidth, marking a nearly 70% increase in system bandwidth, all derived from aggressive memory specification scaling that the company demanded from the memory makers.

According to Nikkei Asia, some of the biggest PC makers like ASUS, Acer, Dell, and HP are exploring alternative memory suppliers amid industry-wide memory shortages, which are forcing PC OEMs to seek supply even from Chinese memory maker CXMT. Late last year, CXMT unveiled its homegrown DDR5-8000 and LPDDR5X-10667 memory modules at the 2025 China International Semiconductor Expo. This has likely prompted many OEMs to start finding alternatives to the traditional triad of SK Hynix, Samsung, and Micron, whose supply has been very limited outside AI accelerator workloads.

CXMT offers 12 Gb and 16 Gb LPDDR5X capacities, while DDR5 scales to 16 Gb and 24 Gb module formats. The 16 Gb DDR5 chips from CXMT measure 67 square millimeters, with a density of 0.239 Gb per square millimeter. The G4 DRAM cells are 20% smaller than CXMT's previous G3 generation. Reportedly, CXMT manufactures these chips using a 16 nm node, which is three years behind Samsung, SK Hynix, and Micron in manufacturing capabilities. However, CXMT is progressing quickly, and its DRAM modules adhere to the official JEDEC specifications and even exceeding the specification, making them ideal for OEM PCs depending on the use case.

Intel is reportedly mandating OEM integrators of the latest "Panther Lake" SoCs to use LPDDR5X memory starting at 7,467 MT/s and beyond, with an interesting software differentiator between adequate speeds or those below. According to Golden Pig Upgrade, LDDR5X memory running below the 7,467 MT/s threshold will force the software to display a generic mark of "Intel (R) Graphics," while configurations with that exact memory speed or higher will display the full name of "Intel (R) Arc (TM) Graphics B390" or "Intel (R) Arc (TM) Graphics B370" marking in Windows 11 Task Manager. Reportedly, Intel is doing this to stop OEMs from cutting corners with their "Panther Lake" laptop configurations, where they could bundle a lower-speed LDDR5X memory out of the Intel specification.

Without the required memory, Intel's Arc B390/B370 iGPUs would likely be left starving for bandwidth, as the whole SoC is being powered by that memory. At higher speeds, memory can do the data transfer faster, resulting in a boost of the overall system performance, and most importantly, the frame rate that these chips can push out. Especially for single-package systems like "Panther Lake" is, faster memory is a great way to get extra performance boost. Intel's flagship SKUs are advertised as capable of running with LPDDR5X memory at speeds up to 9,600 MT/s, which is just below the point where LPDDR5X technology tops out at 10,700 MT/s. Interestingly, there are lots of options from Intel's OEM partners that integrate top-end memory, which is a positive sign for the ecosystem.

TrendForce's latest memory industry survey indicates that persistent AI and data center demands in 1Q26 are further worsening the global memory supply and demand imbalance, thereby increasing suppliers' pricing power. As a result, TrendForce has significantly raised its 1Q26 price forecasts for both DRAM and NAND Flash products. The quarter-over-quarter increase in conventional DRAM contract prices has been revised upward, from a previous estimate of 55-60% to now 90-95%. Similarly, NAND Flash contract prices are now expected to rise from 33-38% to 55-60%. Further upward adjustments may still occur.

TrendForce reports that PC shipments in 4Q25 exceeded expectations, resulting in a widespread shortage of PC DRAM. Even tier-1 PC OEMs with secured allocations from memory suppliers are experiencing declining inventory levels. In a market dominated by sellers, which is driving contract prices higher, PC DRAM prices in 1Q26 are projected to increase by over 100% QoQ, setting a new record for a quarterly surge.

Innosilicon has reportedly started shipping its LPDDR6 memory modules, which offer an impressive speed of 14.4 Gbps. This is significantly faster than Samsung's initial LPDDR6 modules, which achieve data rates of 10.7 Gbps. Innosilicon's modules provide a 1.5x increase in IO speed capability compared to the 9.6 Gbps of LPDDR5X that the company previously offered, and they significantly enhance efficiency. The latest LPDDR6 also increases the number of bits per byte of IO from 8 bits to 12 bits. This results in LPDDR6's bandwidth at a single-channel 24-bit I/O speed being twice that of LPDDR5X at a 16-bit single-channel. The company has reportedly prepared collaborative manufacturing with TSMC and Samsung to secure sufficient capacity for LPDDR6 IP production.

As one of the leading LPDDR6 implementations, this move directly challenges competitors like Samsung, SK Hynix, and Micron, who are also presenting their LPDDR6 solutions to customers but are not eager to ship much of the capacity early in the LPDDR6 lifecycle. Additionally, the JEDEC specification lists LPDDR6 running at a maximum speed of 14.4 Gbps per pin, which Innosilicon has aimed for from the start. This contrasts with Samsung's approach, which has developed 10.7 Gbps LPDDR6 memory on a 12 nm node, peaking at the same speed as its earlier LPDDR5X. However, Samsung emphasizes power efficiency as the main selling point of these early modules, claiming a 21% improvement in energy efficiency over its predecessor. It remains to be seen which IP customers will choose, and the availability of off-the-shelf modules will certainly influence the final decision.

Acemagic unveiled its latest Mini PC lineup at CES 2026, highlighting significant advancements in local AI computing, content creation and gaming performance. Among the key exhibits was Acemagic's flagship Mini PC powered by the AMD Ryzen AI 9 HX 470 processor. Featuring Radeon 890M graphics and an XDNA 2 NPU, the system delivers up to 55 TOPS of AI performance, meeting Copilot+ PC requirements and enabling a wide range of local AI applications. The device also supports OCuLink expansion, PCIe 5.0 storage, dual 2.5 Gb Ethernet and Wi-Fi 7 connectivity, offering flexible performance and high-speed networking options.

For professional users, Acemagic introduced the TANK CENTER M1A PRO+, designed for intensive AI inference and creative workloads. Powered by the AMD Ryzen AI Max+ 395 processor, the system delivers up to 126 TOPS of total AI computing performance. It supports up to 128 GB of LPDDR5x unified memory and features three PCIe 4.0 M.2 slots, providing strong support for large AI models and storage-intensive applications.

ASUS has revealed new ZenBook laptops at CES 2026, but the headline device is its new dual-screen ZenBook Duo, which has received a physical redesign and a spec bump. The new ZenBook Duo, carries the same dual-screen productivity goals as previous generations but features a few refinements to the displays and hinges, a dual battery setup, and a lighter, stronger frame. The new ZenBook Duo UX8407 uses dual 14-inch 3K OLED displays with 144 Hz refresh rates and 1,000 nits claimed peak brightness. The displays are both touch-enabled and support the ASUS Pen 3.0—and consequently other Microsoft Pen Protocol 2.6 styluses—and ASUS claims that together they provide nearly 20 inches of screen real estate. The new chassis is constructed from Ceraluminum, which ASUS claims makes the ZenBook Duo three times more durable and 30% lighter, with the whole package coming in at 1.65 kg. Likewise, the new hinge design is both more compact and tougher, and effectively butts the two displays up against another, reducing the gap between the displays by 70% and eliminating the step so that the displays feel more like a single unit. The ZenBook Duo also includes a detachable trackpad, but the bottom display can also be used as a full-screen virtual keyboard and trackpad.

The new dual-screen laptop splits the 99 Wh battery between the top and bottom cases, and ASUS's battery life testing suggests an 18-hour battery life during video playback on both screens. This stretches to 32 hours of local video playback on a single screen. This battery life is partially thanks to the new Intel Core Ultra Series 3 CPUs that power the ZenBook Duo, which tops out with Intel's flagship mobile Panther Lake CPU, the Core Ultra X9 388H. The new CPU has 16 cores and features the new Intel Arc B390 iGPU, which is supposed to deliver RTX 4050-level performance at much lower power draw. That said, the ZenBook Duo will supposedly run the new Intel CPU at a 45 W TDP, which is only 20.8 W short of the 65.8 W claimed peak Turbo Power for 16-core CPU. The new ZenBook Duo will also offer up to 32 GB LPDDR5X RAM, with a 16 GB option also available. The ZenBook Duo is light on ports, as you might expect from a laptop with such a thin chassis. It features just one USB 3.2 Gen 2 Type-A port, two Thunderbolt 4 ports, and a single HDMI 2.1 port. Although ASUS doesn't mention it on the spec sheet, the ZenBook Duo does also include a 3.5 mm audio jack. ASUS says the 99 Wh batteries, which charge via one of the USB-C ports, charge to 60% in just 49 minutes.

ASUS today announced the all-new ASUS Chromebook CM32 Detachable—the perfect portable companion for study, work and play, with a versatile 2-in-1 design that allows it to transform seamlessly between laptop and tablet. It features a bright and vibrant 12-inch 2.5K 120 Hz touchscreen, Arm -based processor, magnetic stylus with wireless charging, front and world-facing cameras, up to 13-hour battery life, fast Wi-Fi 7 connectivity, and outstanding military-strength durability.

Versatile mobility
ASUS Chromebook CM32 Detachable offers superb versatility for abundant possibilities, with a range of practical accessories. The detachable keyboard—available in White or Dark Grey—allows seamless transition between tablet and laptop modes, making it ideal for learning or productivity. An optional magnetic stand covered with a strong, stain-resistant leatherette material can be set at almost any angle, providing freedom, flexibility and comfort for modern on-the-go lifestyles. There's also an optional magnetic USI 2.0 stylus that charges wirelessly. This enables quick, precise movements for unleashing creativity and productivity, empowering users to take notes, transcribe orders, sketch ideas or capture moments of inspiration quickly, simply and intuitively. In addition, an optional Impact Shield—a ruggedized case that adds an extra layer of durability—is available to provide on-the-go protection from everyday bumps and scrapes.

Acer today introduced its latest Swift AI laptop portfolio, a new generation of Copilot+ PCs on Windows 11 designed to deliver powerful on-device AI capabilities for creators, on-the-go-professionals, and tech-savvy users. The new lineup includes the Swift 16 AI, along with the Swift Edge AI, weighing as light as under 1 kg, and the versatile thin-and-light Swift Go AI in 14- and 16-inch variants.

Each model in the Swift AI series is purpose-built with cutting-edge hardware and complemented with Acer's suite of proprietary AI features. These include productivity enhancements like Acer PurifiedVoice, PurifiedView, and User Sensing, while additional tools for AI-enhanced creativity and entertainment can be downloaded via the Acer Intelligence Space hub. The customizable Acer My Key is a programmable hotkey for launching apps, websites, and Windows 11 features with a single press, providing additional convenience.

At CES 2026, UGREEN showcased its latest models in the NASync line, the iDX6011 and iDX6011 Pro. The company envisions these NAS devices as private cloud appliances for creators, small studios, and home offices. Both models are built around Intel Core Ultra processors and can be equipped with up to 64 GB of LPDDR5x memory and up to 196 TB of pooled storage. Networking is a key focus, featuring dual 10 GbE ports that support link aggregation for up to 20 Gbps of bandwidth. This translates to a theoretical maximum of nearly 2,500 MB/s and provides redundancy if one link fails. The Pro model includes an OCuLink connector and an 8K HDMI output, allowing users to attach an external GPU for local AI acceleration or compute workloads, connect high-speed peripherals, and drive high-resolution monitoring for more demanding projects.

What really distinguishes these units from many consumer NAS boxes is the software layer that runs entirely on the device. A local large language model—Uliya AI Chat—processes natural language queries using a private knowledge base stored offline on the device. No internet connectivity is required, and all AI inferencing is conducted locally with RAG and other data indexing methods. The system can index faces, objects, scenes, and text for image recognition, allowing users to search with simple phrases. The AI Album can retrieve relevant photos based on straightforward descriptions. Audio recordings can be transcribed, translated, and summarized on the device, while an AI file organizer automatically sorts incoming files by type, date, or name. Users can also upload example images to train the system to recognize unique objects.