News Posts matching "TDP"

Return to Keyword Browsing

NVIDIA GeForce GTX 1060 Founders Edition PCB Pictured

Here's one of the first pictures of the NVIDIA GeForce GTX 1060 Founders Edition (reference) PCB. The PCB is about 2/3rds the length of the actual card, and despite that, it's pretty barren. Power is drawn from a 6-pin PCIe power connector, however, this connector isn't on the PCB, but is on a receptacle towards the end of the cooler. NVIDIA designed this in response to complaints that on cards with PCB shorter than the cooler, the power connector would be in the middle of the card. It would also block the illuminated GeForce GTX logo along the top.

The 6-pin PCIe power receptacle connects to the card at big solder points. This approach has one downside. If you want to change the cooler (to, say, an aftermarket air cooler), you will have to deal with that ugly cabling. The card uses a simple 3+1 phase VRM to power the GPU, with its TDP rated at just 120W. The GP106 GPU is neighbored by six 8 Gbps GDDR5 memory chips populating its 192-bit memory bus. There's no SLI support. Display outputs include three DisplayPort 1.4, and one each of HDMI 2.0b and DVI.

AMD to Bundle Wraith Cooler with FX-8350 and FX-6350

AMD is reportedly bundling its Wraith stock CPU cooling solution with even more of its desktop CPUs. Some of the newer batches of two of the most selling socket AM3+ chips, the eight-core FX-8350 and the six-core FX-6350, could sell in special packages that include Wraith, likely at a tiny premium over packages with the older cooling solution that are already in circulation.

With a clock-speed ranging between 4.00 GHz to 4.20 GHz, the FX-8350 is one of the most popular FX-series chips. Along with the FX-6350, its TDP is rated at a scorching 125W. The Wraith cooler, which was extensively reviewed with the FX-8370, was generally appreciated by tech-reviewers for being as quiet as some of the more expensive third-party air coolers, and performing better than the older cooler.


Source: Expreview

AMD Offers New Thermal Solutions and Processors for Near-Silent Performance

AMD today launched new thermal solutions, including the flagship AMD Wraith Cooler, as well as the new AMD A10-7860K and new AMD Athlon X4 845 desktop processors. Designed for the consumer who cares about how their desktop PC runs, sounds, and looks, AMD now offers new thermal solutions that generate less than one-tenth the noise of their predecessors -- running at a near-silent 39 decibels, about as quiet as a library.

The new AMD Wraith Cooler combines near-silent operation with unique styling via a sleek fan shroud and LED illumination. Providing superb cooling, the new design delivers 34 percent more airflow and 24 percent more surface area for heat dissipation than its predecessor.

Arctic Unveils the Alpine M1 Passive CPU Cooler for Intel LGA115x

Arctic unveiled a new fan-less CPU cooler for Intel LGA115x sockets, the Alpine M1 Passive. With a rated cooling capacity of 48W (TDP), the cooler is only recommended for dual-core LGA1150 and LGA1151 Core i3, Pentium, Celeron, or energy-efficient Core i5 processors. Its design couldn't get any simpler - a big chunk of aluminium that's ridged to make up fins of the heatsink, with a bulge near the CPU area, with pre-applied thermal paste. Measuring 95 mm x 95 mm x 69 mm (LxDxH), it weighs in at 508 g. Available now, it's priced at 13€. It could prove to be an interesting option for low-power builds that never game.

Source: FanlessTech

Intel Readies a 5.1 GHz Xeon Chip Based on the "Broadwell" Architecture

Intel's first 5-gigahertz CPU will bear an unlikely brand - Xeon. The company's upcoming Xeon E5-2602 V4 quad-core chip based on the 14 nm "Broadwell-EP" silicon, is rumored to ship with a staggering 5.10 GHz clock speed out of the box. Getting there won't be easy for this socket LGA2011v3 chip. Despite being a quad-core chip, with just four out of ten cores on the "Broadwell-EP" silicon bring physically enabled, the chip's TDP is rated at 165W. Other features include 10 MB of L3 cache, and a quad-channel DDR4 memory interface.


Source: MyDrivers

AMD Intros FX-6330 Black Edition Six-core Processor

AMD fleshed out its sub-$150 desktop CPU lineup with the new FX-6330, a socket AM3+ six-core chip based on the 32 nm "Vishera" silicon, which is priced at $109. At this price, it will take on the entry-level Core i3 and Pentium dual-core chips from Intel. This chip offers out of the box clocks of 3.60 GHz, and a maximum TurboCore frequency of 4.20 GHz. Its six cores are spread across three "Piledriver" modules. It features a total of 6 MB of L2, and 8 MB of L3 caches. The integrated memory controller supports dual-channel DDR3-1866 memory. Its TDP is rated at 95W.

Source: PCPop

Intel Core i7 "Broadwell-E" Lineup to Feature Four SKUs

Intel is breaking away from its tradition of three Core i7 HEDT (high-end desktop) processors per generation, capturing price points of $400, $600, and $1000; with its upcoming Core i7 "Broadwell-E" HEDT lineup. According to leaked documents accessed by BenchLife.info, the company is readying four SKUs based on the 14 nm "Broadwell-E" silicon, these include the Core i7-6800K, the Core i7-6850K, the Core i7-6900K, and the Core i7-6950X.

The Core i7-6800K and i7-6850K are six-core chips, with HyperThreading enabling 12 logical CPUs, and 15 MB shared L3 cache. The i7-6800K is clocked at 3.40 GHz, with a 3.60 GHz Turbo Boost frequency. The i7-6850K is a notch above, with 3.60 GHz core, and 3.80 GHz Turbo Boost frequency. The slide doesn't mention if either of the two parts feature a limited PCIe root complex, like the one on the i7-5820K.

Giada Announces F103D Fanless Mini-PC

Giada Technology, an industry leader in Mini PCs, embedded systems and servers for small & medium enterprises, is proud to unveil a compact fan-less mini PC system - the F103D. With a powerful new Intel Baswell Processor and lower power consumption, the F103D primarily targets organizations in industry control applications and will provide a perfect solution for digital signage including electric white boards, outdoor ads, cinema trailers and other types, all in glorious 4K resolution.

The F103D adopts the latest Intel Braswell N3150/N3050/N3000 Processor using the 14nm process technology that is greatly improving data processing performance while reducing the power consumption. (TDP 4-6W), thus offering a well-balanced cost/performance ratio. With the latest Intel HD graphics GPU core, the F103D ensures stunning 4K output for digital signage. The Giada F103D supports Dual Channel Memory with onboard 2GB DDR3 memory for standard use. If more performance is required for e.g. video playback of 4K@30Hz, an additional 2GB DDR3L SO-DIMM is required to guarantee smooth operation.

CRYORIG Releases the C7 Ultra Compact Cooler

PC thermal solution innovation brand CRYORIG is releasing a new addition to it's C Series line up and also it's smallest cooler to date, the C7 compact cooler. First revealed in Computex 2015 the C7 is a low profile cooler with a max height of 47mm. The C7's 47mm height also makes it only 2mm taller than the Intel Stock Heatsink, meaning it will fit in almost all case designs.

Despite it's size the C7 also packs a heavy dose of cooling with a total of 4 high performance heatpipes, phenomenal for it's size. Fitted with a dedicated 92mm 2500rpm PWM fan with CRYORIG's proprietary Quad Air Inlet System for maximum airflow. The C7 effectively provides 25% more cooling capacity than stock heatsinks from Intel/AMD, while being up to 20% lower in noise. It's (W)97x(L)97x(H)47mm dimensions also makes it compatible with the latest 1151/115x Intel boards and AMD offerings, with no interference with PCI-E GPU cards or RAM slots.

GELID Announces Antarctica CPU Cooler

Thermal Solutions specialist GELID Solutions unveils the latest top performance CPU cooler for Intel and AMD CPU. The Antarctica CPU cooler is a product of GELID Solutions GAMER product line.

The Antarctica comes with a 3D optimized heatsink that offers best-in-class thermal performance. The engineers of GELID Solutions especially designed a set of 5 power heat pipes, aluminum fins with improved profiling and an additional smaller heatsink with a copper core. These elements provide exceptional heat transfer from the CPU to the heatsink. Both heatsinks were created using precise software simulation and calculation during the development stage to ensure efficient air flow distribution at the lowest fan speed possible. The result, the Antarctica fully supports heat transfer of TDP 220W being paired with even very low-speed, virtually noiseless fans.

Intel Expands its 6th Gen. Core Processor Lineup

Intel expanded its 6th generation Core "Skylake" processor lineup for the desktop, with seven new models. Built in the LGA1151 package, these chips work on motherboards running the company's 100-series chipset. Besides the overclocker-friendly Core i7-6700K and the i5-6600K already launched, the lineup now includes the i7-6700, i5-6600, i5-6500, i5-6400, i3-6320, i3-6300, and the i3-6100. Of these, the Core i7 and Core i5 models are quad-core, while the Core i3 ones are dual-core.

The Core i7-6700 and i5-6600 are not just different from the i7-6700K and i5-6600K in that they lack unlocked BClk multipliers, they also come with lower clock speeds out of the box. The i7-6700 is clocked at 3.40 GHz with 4.00 GHz max Turbo Boost (i7-6700K offers 4.00 GHz with 4.20 GHz Turbo), while the i5-6600 is clocked at 3.30 GHz, with 3.90 GHz Turbo Boost (i5-6600K offers 3.50 GHz with 3.90 GHz Turbo). The i7-6700 is priced at US $312, while the i5-6600 goes for $213 (single-unit box price).

Intel "Skylake-U" Ultra Low Power CPU Lineup Detailed

Intel's upcoming Core "Skylake-U" low-power processors, for ultra-portable notebooks, tablets, convertibles, and fan-less desktops, is where the fruition of Intel's 14 nm process takes shape. These dual-core chips, spanning all five brand extensions - Core i7, Core i5, Core i3, Pentium, and Celeron, offering TDP as low as 7.5W, and no more than 15W. The lineup is kept slim, with no more than 2 SKUs per extension. All three Core extensions feature Intel HD 520 graphics, clocked around 350 MHz, with 1000 to 1050 MHz boost, while the Pentium and Celeron models feature slimmer HD 510 graphics, ticking at 300/900 MHz.

The lineup is led by the Core i7-6600U and i7-6500U. Besides HyperThreading enabling 4 logical CPUs, these two chips feature 4 MB L3 cache, 1050 MHz iGPU boost frequency, and the highest CPU clock-speeds in the series. The Core i5 chips differ from their Core i7 counterparts with sub-3 GHz CPU clock speeds, 3 MB L3 cache, and maximum iGPU boost frequency of 1000 MHz. The Core i3 parts are almost identical to their Core i5 counterparts, except they lack CPU Turbo Boost. The Pentium processors feature very low CPU core speeds, and are almost identical to Core i3, but feature lower 950 MHz iGPU boost frequency, and 2 MB L3 cache. Celeron parts lack HyperThreading. Some of these parts will launch in 2015, others in 2016. Find the exact clock speeds for each SKU in the table below.

Source: FanlessTech

Intel Debuts its 6th Generation Core Processor Family and Z170 Express Chipset

Intel announced its first 6th generation Core processors, codenamed "Skylake." Built on Intel's swanky new 14 nanometer silicon fab process, and in the new LGA1151 package, these processors bring DDR4 memory to the mainstream, and offer IPC improvements over the previous-generation Core "Haswell" and "Broadwell" processors. Making its debut at Gamescom, Intel is starting its lineup off with two chips that are predominantly targeted at the DIY gaming PC crowd, the Core i7-6700K and the Core i5-6600K quad-core processors. More models in the series will be launched towards the end of this month. The company also announced the Z170 Express chipset.

The Core i7-6700K features a nominal clock speed of 4.00 GHz, with a Turbo Boost frequency of 4.20 GHz. It features 8 MB of L3 cache, and HyperThreading. Its integrated Intel HD 530 graphics ticks at 350 MHz, with 1200 MHz Boost. The Core i5-6600K, on the other hand, features clock speeds of 3.50 GHz, with 3.90 GHz Turbo Boost. It features 6 MB of L3 cache, and lacks HyperThreading. It features the same integrated graphics solution as its bigger sibling. The TDP of both chips are rated at 91W. Both chips feature integrated memory controllers with support for DDR3L-1600 and DDR4-2133. The Core i7-6700K is priced around $350, and the i5-6600K around $243, in 1000-unit tray quantities. The retail packages of both chips will lack a stock cooling solution. The LGA1151 cooler mount will be identical to that of the outgoing LGA1150, so you shouldn't have any problems using your older cooler.

Intel Core i7-5775C and i5-5675C Hit Retail Channel in Early June

Intel's upcoming 5th generation Core processors targeted at PC enthusiasts, the Core i7-5775K, and the Core i5-5675K, will be available in the retail channel on June 1st (NA, EMEA), and June 2nd (APAC). The two were available to the OEM channel since earlier this month. This is when you will be able to buy the two at a ground store, or online, in retail (box) packaging. Built in the LGA1150 package, the two will be compatible with existing Intel 9-series chipset motherboards (with BIOS updates).

Based on the swanky new 14 nm "Broadwell" silicon, the i7-5775C and the i5-5675C are quad-core chips. The i7-5775C offers clock speeds of 3.30 GHz, which spools up to 3.70 GHz with Turbo Boost; and will feature HyperThreading, enabling 8 logical CPUs. The i5-5675C offers 3.10 GHz clocks, with 3.60 GHz Turbo Boost frequencies. Both chips will offer 6 MB of L3 cache, Intel Iris Pro 6200 graphics; and TDP as low as 65W. For this reason, and others, the two won't exactly replace the i7-4790K and i5-4690K from the product stack. The two will ship with unlocked base-clock multipliers, letting you overclock them, and could still make for great buys for premium gaming PC builds.Source: Hermitage Akihabara

95W TDP of "Skylake" Chips Explained by Intel's Big Graphics Push

Intel's Core "Skylake" processor lineup, built on the company's swanky new 14 nanometer fab process, drew heads to its rather high 95W TDP for quad-core parts such as the Core i7-6700K and Core i5-6600K, even though their 22 nm predecessors, such as the i7-4770K and the i5-4670K run cooler, at 84W TDP. A new leaked slide explains the higher TDP. Apparently, Intel is going all-out with its integrated graphics implementation on Core "Skylake" chips, including onboard graphics that leverage eDRAM caches. The company is promising as much as 50% higher integrated graphics performance over "Haswell."

Although the chips have high rated TDP, the overall energy efficiency presents a different story. SoCs based on "Skylake" will draw as much as 60% lower power than "Haswell" based ones, translating into 35% longer HD video playback on portable devices running these chips. Intel's graphics performance push is driven by an almost sudden surge in display resolutions, with standards such as 4K (3840 x 2160) entering mainstream, and 5K (5120 x 2880) entering the enthusiast segment. Intel's design goal is to supply the market with a graphics solution that makes the two resolutions functional on desktop and video, if not gaming.

Source: AnandTech Forums

Desktop OEMs Begin Listing "Broadwell" Chips, "Skylake" Arrives in Q3

Major pre-built desktop manufacturers began listing products driven by 5th generation Core "Broadwell" processors, which are having a brief stint at the markets before being replaced by 6th generation Core "Skylake" processors in Q3-2015. The 5th Generation Core family is led by two parts, the Core i5-5675C, and the Core i7-5775C, both of which come with unlocked base-clock multipliers, are based on Intel's new 14 nanometer silicon fab process, and built in the LGA1150 package, compatible with existing Intel 9-series chipset based motherboards, with BIOS updates.

The Core i5-5675C and i7-5775C aren't exactly successors of the i5-4690K and i7-4790K. The i7-5775C is placed in a product tier Intel calls "P1+," while the i5-5675C is placed in one called "MS2+." The two aren't exactly in the same plane as P1K (eg: i7-4790K) or MS2K (eg: i5-4690K), respectively, and don't qualify as P1 (eg: i7-4790 non-K) or MS2 (eg: i5-4690 non-K). The two still feature unlocked multipliers. This places them somewhere between P1K/MS2K and P1/MS2. Both the i5-5675C and i7-5775C are quad-core chips, and physically feature just 6 MB of L3 cache. The i7-5775C has access to all 6 MB of it, while the i5-5675K features just 4 MB.

Intel "Skylake" to be 6th Generation Core Series, First i7-6700K Benchmarks

Intel's next major CPU architecture, codenamed "Skylake," could be classified as the company's 6th generation Core processor family. It will succeed the brief stint Core "Broadwell" will have at the market, with no major chips for PC enthusiasts to look forward to. The Core i7-6700K appears to be the flagship product based on the Skylake-D silicon, succeeding the i7-4770K and i7-4790K. The Core i5-6600K will succeed the i5-4670K and i5-4690K.

The i7-6700K is a quad-core chip, with HyperThreading enabling 8 logical CPUs. Its nominal clock will be 4.00 GHz, with a rather shallow 4.20 GHz Turbo Boost frequency. It will feature an 8 MB L3 cache, and an integrated memory controller that supports both DDR4 and DDR3 memory types. This makes Skylake a transition point for the mainstream PC market to gradually upgrade to DDR4. You'll have some motherboards with DDR3 memory slots, some with DDR4 slots, and some with both kinds of slots. The resulting large uncore component, and perhaps a bigger integrated GPU, will result in quad-core Skylake parts having TDP rated as high as 95W, higher than current Haswell quad-core parts, with their 88W TDP.

Cryorig Announces the H5 Ultimate CPU Cooler

CRYORIG announces the H5 Ultimate. Based on the acclaimed H5 Universal, CRYORIG has extended the successful Hive Fin base H series line with the CRYORIG H5 Ultimate. The H5 Ultimate features the same award winning features as the original H5 Universal, but with a larger XF140 140mm fan and new jet black heatsink covers. The larger XF140 increases the H5 Ultimate's TDP from 160 to 180watt, putting the proprietary Hive Fin system to work. Together with the acclaimed MultiSeg mounting system, the H5 Ultimate will be the strongest single tower solution CRYORIG has up to date.

"The CRYORIG H5 Ultimate is the natural evolution of the H5 Universal. It follows our strategy of offering two different styles of products for our models. The Universal line focuses on the best compatibility on the market, and the Ultimate line which is about pure performance. The PC DIY Modding and Overclocking crowd is a smart bunch of people who know what they need and want. We at CRYORIG believe that giving extra options and choices ultimately allows for users to find and chose what they need, instead of having the brands choose for them. Choice of customization is key," said Alex W. Co-Founder of CRYORIG.

AMD to Skip 20 nm, Jump Straight to 14 nm with "Arctic Islands" GPU Family

AMD's next-generation GPU family, which it plans to launch some time in 2016, codenamed "Arctic Islands," will see the company skip the 20 nanometer silicon fab process from 28 nm, and jump straight to 14 nm FinFET. Whether the company will stick with TSMC, which is seeing crippling hurdles to implement its 20 nm node for GPU vendors; or hire a new fab, remains to be seen. Intel and Samsung are currently the only fabs with 14 nm nodes that have attained production capacity. Intel is manufacturing its Core "Broadwell" CPUs, while Samsung is manufacturing its Exynos 7 (refresh) SoCs. Intel's joint-venture with Micron Technology, IMFlash, is manufacturing NAND flash chips on 14 nm.

Named after islands in the Arctic circle, and a possible hint at the low TDP of the chips, benefiting from 14 nm, "Arctic Islands" will be led by "Greenland," a large GPU that will implement the company's most advanced stream processor design, and implement HBM2 memory, which offers 57% higher memory bandwidth at just 48% the power consumption of GDDR5. Korean memory manufacturer SK Hynix is ready with its HBM2 chip designs.Source: Expreview

Intel Rolls Out Energy-efficient Core i3-4170T Dual-Core Processor

Intel topped off its value dual-core processor lineup with a new energy-efficient part, the Core i3-4170T. One of the last chips to be based on the 22 nm "Haswell" silicon, this chip offers two cores with HyperThreading enabling four logical CPUs, 3.20 GHz clock speeds, 3 MB, and a TDP of just 35W (standard i3-41xx series feature 54W TDP). The i3-4170T is priced roughly on par with the current series-leading chip, the i3-4160. A little later this month, Intel will unveil the i3-4170, which will be the fastest part in the series, featuring 3.70 GHz clock speeds.

Source: Akiba PC Watch

NVIDIA GeForce GTX TITAN-X Specs Revealed

NVIDIA's GeForce GTX TITAN-X, unveiled last week at GDC 2015, is shaping up to be a beast, on paper. According to an architecture block-diagram of the GM200 silicon leaked to the web, the GTX TITAN-X appears to be maxing out all available components on the 28 nm GM200 silicon, on which it is based. While maintaining the same essential component hierarchy as the GM204, the GM200 (and the GTX TITAN-X) features six graphics processing clusters, holding a total of 3,072 CUDA cores, based on the "Maxwell" architecture.

With "Maxwell" GPUs, TMU count is derived as CUDA core count / 16, giving us a count of 192 TMUs. Other specs include 96 ROPs, and a 384-bit wide GDDR5 memory interface, holding 12 GB of memory, using 24x 4 Gb memory chips. The core is reportedly clocked at 1002 MHz, with a GPU Boost frequency of 1089 MHz. The memory is clocked at 7012 MHz (GDDR5-effective), yielding a memory bandwidth of 336 GB/s. NVIDIA will use a lossless texture-compression technology to improve bandwidth utilization. The chip's TDP is rated at 250W. The card draws power from a combination of 6-pin and 8-pin PCIe power connectors, display outputs include three DisplayPort 1.2, one HDMI 2.0, and one dual-link DVI.

Source: VideoCardz

GIGABYTE Announces a Pair of GeForce GTX 960 4GB Graphics Cards

GIGABYTE rolled out a pair of GeForce GTX 960 graphics cards with 4 GB of onboard memory, the N960WF2OC-4GD (WindForce 2X), and the N960G1 GAMING-4GD (G1.Gaming). The N960WF2OC-4GD features a compact twin-fan WindForce 2X cooling solution, and offers a minor factory-overclock of 1241 MHz core with 1304 MHz GPU Boost (compared to reference speeds of 1216/1279 MHz.) The N960G1 GAMING-4GD, on the other hand, features the company's top of the line WindForce 3X cooling solution, which takes advantage of its meaty heatsink to keep the fans off until a temperature threshold is reached, with the 120W TDP GPU. This card serves up 1266 MHz core, and 1304 MHz GPU Boost. Both cards feature 4 GB of GDDR5 memory, across a 128-bit wide memory bus, clocked at 7.00 GHz (GDDR5-effective).

Intel to Launch Socketed "Broadwell" Processors in mid-2015

Along the sidelines of GDC 2015, Intel offered a few details on how the year could look for its desktop processor lineup. The company is preparing to launch socketed Core "Broadwell" processors in mid-2015 (late Q2 or early Q3), likely in the sidelines of Computex 2015. Broadwell is an optical shrink of "Haswell" to the new 14-nanometer silicon fab process, with a minor feature-set update, much in the same way as "Ivy Bridge" was an optical shrink of "Sandy Bridge" to the 22 nm process.

The socketed Core "Broadwell" chips could come in the LGA1150 package, running on existing 8-series and 9-series chipset motherboards, with BIOS updates. The optical shrink seems to be working wonders for the silicon. Quad-core chips based on "Broadwell" could come with TDP rated as low as 65W (and we're not talking about the energy-efficient "S" or "T" brand extensions here). Some dual-core variants in the series may even be based on the smaller Core M "Broadwell" silicon, which physically features just 2 cores (and isn't a bigger quad-core silicon with two cores disabled in what's a colossal waste of rare-earth metals on a production scale). Some of those dual-core parts could come with TDP rated as low as 28W.Source: TechReport

Intel Core i7 "Broadwell-E" HEDT Chips Arrive in 2016

Intel is beginning to put out the first details of its next high-end desktop (HEDT) processors, internally. Codenamed "Broadwell-E," the company's next Core i7 HEDT chips will be built in the existing LGA2011v3 package, and will be compatible with existing motherboards based on Intel's X99 Express chipset (with BIOS updates). Much like "Ivy Bridge-E" was to "Sandy Bridge-E," these chips will introduce only incremental updates, and nothing major, in terms of architecture.

To begin with, Core i7 "Broadwell-E" will be built in the 14 nanometer silicon fab process, and will feature 6 to 8 cores based on the "Broadwell" micro-architecture. These cores will be cushioned with up to 20 MB of L3 cache. The chip is pin-compatible to "Haswell-E," and so its I/O will be identical, featuring a quad-channel DDR4 integrated memory controller. One difference is that Intel may can the 28-lane PCIe approach with the entry-level part; or at least it doesn't find mention on the slide. If it's true, all parts based on this silicon, will feature 40-lane PCIe interfaces. The TDP of these chips will be rated at 140W. Intel is expected to launch the Core i7 "Broadwell-E" in 2016.

Source: VR-Zone

Eurocom Launches M5 Pro Ultra HD Notebook

Eurocom is launching the thin and light, M5 Pro with a choice NVIDIA GeForce GTX 980M and 970M graphics, 32 GB DDR3-1600 memory, 4 TB storage, a stunning 4k (3840x2160) 15.6" display and an Intel Core i7 4710HQ processor. If there was ever a laptop that could blur the lines between ultraportable and gaming it would be the EUROCOM M5 Pro, powerful enough to run current and future games at ultra with the weight, dimensions and battery life of an ultraportable.

The EUROCOM M5 Pro is Eurocom's newest innovative creation. A lightweight 2.6kg laptop with superb performance. It is powered by the next generation of world's most powerful NVIDIA GeForce GTX 980M and 970M graphics and features a beautiful 4K, 3840-by-2160 pixels display. The EUROCOM M5 Pro is extremely thin and mobile while still offering a stunning 4TB of storage with four physical drives with a combination of traditional SSD/HDD as well as new, innovative M.2 slots. Sleek, slim, super high performance, the M5 is another "little monster" from Eurocom that will blow everybody away, while gaming or doing your corporate bidding.
Return to Keyword Browsing