Thursday, July 11th 2019

Intel "Comet Lake" Not Before 2020, "Ice Lake-S" Not Before Q3-2020, Roadmap Suggests

Earlier this week, news of Intel's 10th generation Core "Comet Lake" processors did rounds as the company's short-term response to AMD's 3rd generation Ryzen processors. According to slides leaked to the web by Hong Kong-based tech publication XFastest, "Comet Lake" isn't Intel's short-term reaction to "Zen 2," but rather all it has left to launch. These processors won't launch before 2020, the slide suggests, meaning that AMD will enjoy a free rein over the processor market until the turn of the year, including the all-important Holday shopping season.

More importantly, the slide suggests that "Comet Lake" will have a market presence spanning Q1 and Q2 2020, meaning that the 10 nm "Ice Lake" won't arrive on the desktop platform until at least Q3 2020. It's likely that the LGA1200 platform which debuts with "Comet Lake" will extend to "Ice Lake," so consumers aren't forced to buy a new motherboard within a span of six months. The platform diagram put out in another slide junks the idea of an on-package MCM of the processor and PCH dies (which was likely ripped off from the "Ice Lake-Y" MCM platform diagram).
The new platform combines a "Comet Lake" processor with an Intel 400-series PCH, which talk to each other over DMI 3.0, which offers comparable bandwidth PCI-Express 3.0 x4. The AMD "Valhalla" platform implements PCI-Express 4.0 x4 between the SoC and X570 chipset. The platform's main PCI-Express x16 slot will remain gen 3.0.

Intel appears to have put much of its efforts into improving its 14 nanometer node one last time, and increasing core-counts with the introduction of a new 10-core silicon that does away with iGPU. With its "Skylake" core IPC within 5% of that of "Zen 2," and gaming performance leadership still held onto by a hair's breadth, Intel will focus on bolstering multi-thread performance by enabling HyperThreading on even its Core i5 and Core i3 desktop processor models, while providing more cores to the Dollar compared to its 9th generation "Coffee Lake Refresh."

The Core i3 series will be 4-core/8-thread, the Core i5 series 6-core/12-thread, the Core i7 series 8-core/16-thread, and the flagship Core i9 series 10-core/20-thread. Intel will leverage its refined 14 nm node to increase clock-speeds across the board, with its 10-core silicon having a TDP rating of 125 W, and not the 105 W we saw the other day. The Gen 9.5 iGPU on the 4/6/8-core models will be bolstered with more features via software, and be branded under the UHD 700-series.

With its mainstream desktop platform embattled, Intel will try to appease the PC enthusiast crowd by launching a new HEDT (high-end desktop) platform based on "Cascade Lake," codenamed "Glacial Falls," by Q4-2019. The new 14 nm "Cascade Lake-X" processor will be compatible with existing X299 chipset motherboards via a BIOS update, offer CPU core-counts of up to 18, TDP of up to 165 W, and increased performance via higher clock-speeds. It will compete with AMD's existing 2nd generation Ryzen Threadripper family. AMD's plans for a 3rd generation Threadripper based on the "Rome" MCM is on the back-burner even if not dead, with the company focusing on making sure it sells the high-margin 2nd generation EPYC processor in adequate volumes.
Source: XFastest
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98 Comments on Intel "Comet Lake" Not Before 2020, "Ice Lake-S" Not Before Q3-2020, Roadmap Suggests

#1
ShurikN
By the time these launch AMD will be on 7nm EUV with Zen3
Posted on Reply
#2
btarunr
Editor & Senior Moderator
ShurikNBy the time these launch AMD will be on 7nm EUV with Zen3
Zen3 on-track for Computex 2020. They'll use 7 nm EUV to clock those processors to Kingdom Come.
Posted on Reply
#3
ShurikN
btarunrZen3 on-track for Computex 2020. They'll use 7 nm EUV to clock those processors to Kingdom Come.
IO on 7DUV is probably the next logical step, it'll likely be cheap by then.
Posted on Reply
#4
TheLostSwede
News Editor
At 125W Intel TDP, does that mean a liquid cooler will be mandatory?
btarunrZen3 on-track for Computex 2020. They'll use 7 nm EUV to clock those processors to Kingdom Come.
That's no good, no-one likes a DoA CPU...
ShurikNIO on 7DUV is probably the next logical step, it'll likely be cheap by then.
I would think 10nm would be their next I/O die, as it's already known that some parts are not gaining any benefit from being shrunk.
Posted on Reply
#5
xkm1948
X299 re-refresh? Disappointed. Probably comes with all the nerf due to security flaws.

Come on AMD, get your Threadripper 3 out already!
btarunrZen3 on-track for Computex 2020. They'll use 7 nm EUV to clock those processors to Kingdom Come.
Is this real? Oh my. Zen2 level IPC and higher core clock, that would be insane.
Posted on Reply
#6
Wavetrex
So Intel will (may) launch 10-core next year, with availability who knows when, while AMD will have 16 cores this year, and already has 12-core on the mainstream market.
Also, they might be able to refresh these with higher clocks after the 7nm process matures a bit more.

Oh oh oh... and PCI-e 3.0. On YET ANOTHER socket.

Comet Lake mega DOA.
What a joke.
Posted on Reply
#7
TheLostSwede
News Editor
WavetrexSo Intel will (may) launch 10-core next year, with availability who knows when, while AMD will have 16 cores this year, and already has 12-core on the mainstream market.
Also, they might be able to refresh these with higher clocks after the 7nm process matures a bit more.

Oh oh oh... and PCI-e 3.0. On YET ANOTHER socket.

Comet Lake mega DOA.
What a joke.
A bit harsh no? This was kind of expected from Intel.
Posted on Reply
#8
londiste
Intel appears to have put much of its efforts into improving its 14 nanometer node one last time, and increasing core-counts with the introduction of a new 10-core silicon that does away with iGPU.
Source?
Posted on Reply
#9
chodaboy19
At least they increased the number of PCIe lanes.
Posted on Reply
#10
somethinggeneric
It's likely that the LGA1200 platform which debuts with "Comet Lake" will extend to "Ice Lake," so consumers aren't forced to buy a new motherboard within a span of six months.
This is Intel we are talking about here folks....
Posted on Reply
#11
Tomgang
intel has gone from being the choise of choise to be a bit of a joke. Still 14 nm and only 10 core, what a joke. Yes intel will win in gaming, but not by much and still the hedt will stick to 18 core to what like 2000 usd as the current cpu cost and also still pcie gen 3.

This round i will say amd has won. That 16 core ryzen 9 3950X looks like a better choise and the half price of i9 9960X. I can live with gaming performance will be a bit lower than intels cpu.
Posted on Reply
#12
jabbadap
TheLostSwedeAt 125W Intel TDP, does that mean a liquid cooler will be mandatory?

That's no good, no-one likes a DoA CPU...

I would think 10nm would be their next I/O die, as it's already known that some parts are not gaining any benefit from being shrunk.
Dun know, if they continues to use tdp as they are using it now, that is just the tdp for the base clock.
Posted on Reply
#13
HD64G
AMD is already on the lead of CPUs in both raw power, efficiency and vfm and could remain there for at least 2 years. Who knows what happens by then...
Posted on Reply
#14
Manu_PT
How arrogant is Intel? Instead of massively drop the prices on their current offering and stay competitive, they prefer to work yet on a ne socket that won't come in at least 1 year? Meanwhile ryzen 3000 selling like hot cakes through summer, holiday season etc?

Cmon Intel, just drop 9900k to 400€, 9700k to 300€, 9600k to 200€, include good bundles with decent (30€) Air Coolers. Such arrogance.
Posted on Reply
#15
ZoneDymo
LGA1200, a new socket boiiis !
Posted on Reply
#16
efikkan
londisteSource?
I don't know why people keep claiming this. We know that Comet Lake supports integrated graphics, it can be found in Coreboot and there is also support for it in the Linux graphics drivers.
{ PCI_DEVICE_ID_INTEL_CML_S, "CometLake-S (6+2)" },
{ PCI_DEVICE_ID_INTEL_CML_S_10_2, "CometLake-S (10+2)" },
Posted on Reply
#17
oxidized
ZoneDymoLGA1200, a new socket boiiis !
Right the last one was 1151v2 almost 3 years ago...And before that 1151 which is identical, almost 5 years ago...So few years idd :roll:
Posted on Reply
#18
z1n0x
Grab the biscuits boys, we're heading to the milk lake.
Posted on Reply
#19
phanbuey
w00f.

That is a LOOONG time.

But they do have keller in the lab with a working 3d stacked transistor design so Im thinking they;'re going to come out with something huge then.
Posted on Reply
#20
Assimilator
londisteSource?
www.techpowerup.com/257249/intel-10th-generation-core-comet-lake-lineup-detailed
Leading the pack is the Core i9-10900KF, a 10-core/20-thread chip clocked at 4.60 GHz with 5.20 GHz Turbo Boost, 20 MB of shared L3 cache, native support for DDR4-3200, and a TDP of 105 W. Intel's new 10-core die appears to physically lack an iGPU, since none of the other Core i9 10-core models offer integrated graphics. For this reason, all three processor models have the "F" brand extension denoting lack of integrated graphics.
Posted on Reply
#21
Bwaze
Are there any leaks even confirming "Ice Lake S" desktop processors? Didn't leaks from a few months ago show another 14nm series after Comet Lake - Rocket Lake S? Possibly with Willow Cove architecture, so security patches and even bigger IPC uplift than Ice Lake with Sunny Cove architecture, but still 14nm?

Posted on Reply
#22
Unregistered
Expecting a lot more Intel marketing spin the more they fall behind for next good while...
Posted on Edit | Reply
#23
Th3pwn3r
In my 20+ years of cpu building and such I have never seen Intel seem this bad, I don't think I've ever really seen them behind like this....ugh, I'm buying a 3600x more than likely BUT this is not good for anyone really in my opinion.
Posted on Reply
#24
Captain_Tom
btarunrZen3 on-track for Computex 2020. They'll use 7 nm EUV to clock those processors to Kingdom Come.
Posted on Reply
#25
btarunr
Editor & Senior Moderator
ShurikNIO on 7DUV is probably the next logical step, it'll likely be cheap by then.
Well maybe not the ICOD (I/O controller die), but the chipset. Fan-heatsinks make for bad PR. If they can rebuild that chipset on 7 nm DUV with a TDP target of, say, 8W, they can make do with passive cooling.
Posted on Reply
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