Friday, December 11th 2020

Alleged Intel Sapphire Rapids Xeon Processor Image Leaks, Dual-Die Madness Showcased

Today, thanks to the ServeTheHome forum member "111alan", we have the first pictures of the alleged Intel Sapphire Rapids Xeon processor. Pictured is what appears to be a dual-die design similar to Cascade Lake-SP design with 56 cores and 112 threads that uses two dies. The Sapphire Rapids is a 10 nm SuperFin design that allegedly comes even in the dual-die configuration. To host this processor, the motherboard needs an LGA4677 socket with 4677 pins present. The new LGA socket, along with the new 10 nm Sapphire Rapids Xeon processors are set for delivery in 2021 when Intel is expected to launch its new processors and their respective platforms.

The processor pictured is clearly a dual-die design, meaning that Intel used some of its Multi-Chip Package (MCM) technology that uses EMIB to interconnect the silicon using an active interposer. As a reminder, the new 10 nm Sapphire Rapids platform is supposed to bring many new features like a DDR5 memory controller paired with Intel's Data Streaming Accelerator (DSA); a brand new PCIe 5.0 standard protocol with a 32 GT/s data transfer rate, and a CXL 1.1 support for next-generation accelerators. The exact configuration of this processor is unknown, however, it is an engineering sample with a clock frequency of a modest 2.0 GHz.
Source: ServeTheHome Forums
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83 Comments on Alleged Intel Sapphire Rapids Xeon Processor Image Leaks, Dual-Die Madness Showcased

#1
Vya Domus
Still not quite competitive enough with Milan for a 10nm product and Zen 3 Epyc is just months away. Ain't looking good, especially since it's rumored that AMD will remain on 64 core configurations. In other words they think these are no threat.
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#4
R0H1T
deu...Or as Intels marketing department would describe it to their partners: 'glued together cpus'

www.techpowerup.com/235092/intel-says-amd-epyc-processors-glued-together-in-official-slide-deck

... which is a good thing right?!?!

/s
That's what happens when you sniff too much of the competitor's glue :laugh:

On the face of it whatever "interconnect" there's using is perhaps limiting them to just two dies/chiplets right now or maybe it's fundamentally different to IF in it's current form.

You might wanna add this ~ [MEDIA=twitter]1337242960291893248[/MEDIA]
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#5
ZoneDymo
it looks both cool and just massively outdated….
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#6
deu
R0H1TThat's what happens when you sniff too much of the competitor's glue :laugh:

On the face of it whatever "interconnect" there's using is perhaps limiting them to just two dies/chiplets right now or maybe it's fundamentally different to IF in it's current form.

You might wanna add this ~ [MEDIA=twitter]1337242960291893248[/MEDIA]
Well you have a stance until you get a new one... and a new one.... and a.. :D Long story short: Intels marketing given how thing where and have gone have massively doubled down on a sinking ship. Its like they are trying to convince people to go on a cruise on their unsunken ship titanic and stobbon claims that its not still firmly planted on the bottom of the sea
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#7
TheGuruStud
It's more intel FUD that won't release. Where's ice lake :cool: And no one will buy 500W CPUs lol (nor the single die ver).
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#8
fancucker
Lot of negative energy ITT. We need an Intel resurgence to keep AMD pricing in check.
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#9
Sykobee
I think the dies are too far apart, from that other photo, for EMIB.

Also not ruling out four dies here, two under each half, it's Intel's 10nm remember and it's not great for big dies.
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#10
z1n0x
That IHS reminds me of something, but i can't figure it out.
edit: toast press:p
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#11
AusWolf
Intel and their "glued together" AMD processors... :rolleyes: Next time they should think before they speak.

This CPU looks a lot more "glued together" than anything from AMD. Here, even the socket is split into two.
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#12
ARF
Vya DomusStill not quite competitive enough with Milan for a 10nm product and Zen 3 Epyc is just months away. Ain't looking good, especially since it's rumored that AMD will remain on 64 core configurations. In other words they think these are no threat.
Zen 4 should surely have 128-core SKUs?
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#14
HD64G
ARFZen 4 should surely have 128-core SKUs?
Max 96 cores per die most possibly.
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#15
kodorr95
AusWolfThis CPU looks a lot more "glued together" than anything from AMD. Here, even the socket is split into two.
You're joking, right? Even the backside of Epyc looks exactly like that, and the physical socket itself looks similar, "split into two" as you said.
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#16
AusWolf
kodorr95You're joking, right? Even the backside of Epyc looks exactly like that, and the physical socket itself looks similar, "split into two" as you said.
You're right. By Intel's logic, that's why everybody should buy Intel... wait, what? :laugh:
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#17
TumbleGeorge
HD64GMax 96 cores per die most possibly.
Enough to be undertaker of Intel? I don't think that but there may have other opinions.
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#20
Hardware Geek
Intel pulls out their bottle of super glue. But their super glue is amazing.
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#22
Darmok N Jalad
Samsung just did the same recently. They had an ad mocking Apple for pulling the power brick from iPhone 12 boxes, but were just recently found applying for approval to ship Galaxy without a power brick. This corporate tactic must lie somewhere between "Smoke 'em if you got 'em" and "Don't knock it until you try it."
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#23
AnarchoPrimitiv
These products won't be released until the END of 2021 according to the majority of leaks and leakers, so they'll have to compete with AMD's Zen4 on 5nm, meaning AMD will still have the node (and efficiency) advantage, and probably another 20% IPC increase (meaning 40% IPC increase over Zen2). With the smaller 5nm node, I could see AMD putting 96 or 128 cores on their biggest CPUs. Intel should be more competitive by then, but I still see AMD outperforming them, especially considering TSMC's 5nm will be over a year old by then and yields should be high (and there could even be an improved 5nm node by then).
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#24
HansRapad
Vya DomusStill not quite competitive enough with Milan for a 10nm product and Zen 3 Epyc is just months away. Ain't looking good, especially since it's rumored that AMD will remain on 64 core configurations. In other words they think these are no threat.
on server and datacenter market, it's not only about raw horsepower but more about whole ecosystem

Intel has spend so much time on nuturing Xeon platform, that's their core business, even if the performance wasn't the top, the overall feature that they are using and being utilized by their customer cannot be replaced by AMD

so far I haven't see any simillar technology as Optane on Data Center environment from AMD, while optane is kind of janky on Desktop, it being fully utilized on datacenter platform
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#25
R00kie
3rold
The whole Core 2 Quad lineup was dual die
Posted on Reply
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