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IBM Expands Strategic Partnership with Samsung to Include 7nm Chip Manufacturing

IBM today announced an agreement with Samsung to manufacture 7-nanometer (nm) microprocessors for IBM Power Systems , IBM Z and LinuxONE , high-performance computing (HPC) systems, and cloud offerings. The agreement combines Samsung's industry-leading semiconductor manufacturing with IBM's high-performance CPU designs. This combination is being designed to drive unmatched systems performance, including acceleration, memory and I/O bandwidth, encryption and compression speed, as well as system scaling. It positions IBM and Samsung as strategic partners leading the new era of high-performance computing specifically designed for AI.

"At IBM, our first priority is our clients," said John Acocella, Vice President of Enterprise Systems and Technology Development for IBM Systems. "IBM selected Samsung to build our next generation of microprocessors because they share our level of commitment to the performance, reliability, security, and innovation that will position our clients for continued success on the next generation of IBM hardware."

Samsung Introduces the Notebook 9 Pen

Samsung Electronics today announced the new Notebook 9 Pen, a premium 2-in-1 PC with a built-in S Pen that allows users to reach their true creative potential. With its combined style, power, and portability, Notebook 9 Pen is perfect for users who want a device that adapts to the way they work, and need the flexibility to get more high quality work done.

"Choice and creativity go hand in hand, and those who create deserve the flexibility to work the way they want, wherever inspiration strikes," said YoungGyoo Choi, Senior Vice President and Head of the PC Business Team, Mobile Communications Business at Samsung Electronics. "With improved design and performance, along with our Notebook's most advanced S Pen yet, the new Notebook 9 Pen is perfect for contemporary professionals who put especially high demands on their technology."

TrendForce: Shipments of Gaming Monitors Doubled in 2018, Market Share of Curved Models to Surpass 50% in Gaming Sector

The gaming market is one with high gross margins in the vast majority of its product lines - this is easily seen with the number of companies that have just slapped the same aesthetic look and "gaming" branding to otherwise "normal" product lines. One such instance, in particular, is the gaming monitor segment, where increasing perception of more competitiveness with higher refresh-rate monitors has brought about an urge to upgrade in the market - and not the least of which was brought about by games such as PUBG and Fortnite (the former even sparked an upgrade frenzy in China's Internet Cafes as they vied for ever more customers who would get an edge on their store over others that didn't sport these high refresh-rate monitors).

According to TrendForce's report, ASUS is the worldwide sales leader i the gaming monitor segment, followed by Acer, with AOC/Philips coming in a close third. TrendForce reports that the increased demand has seen shipment of gaming-grade (or at least branded) monitors has doubled in 2018 compared to last year, and that a sector that has increased significantly is the one of curved monitors, which has been taken up chiefly by Samsung, bringing it to the fourth spot in the manufacturer race. The curved monitor market has achieved a 50% stake in the whole of the gaming monitor, led chiefly by China's demand.

Samsung Launches The New 860 QVO SSD Starting At $149.99 For The 1 TB Model

Samsung Electronics today unveiled its new consumer solid state drive (SSD) lineup - the Samsung 860 QVO SSD - featuring up to four terabytes (TB) of storage capacity with exceptional speed and reliability. Built on the company's high-density 4-bit multi-level cell (MLC) NAND flash architecture, the 860 QVO makes terabyte capacities more accessible to the masses at approachable price points.

"Today's consumers are using, producing and storing more high-resolution files than ever, including 4K videos and graphics-intensive games, escalating demand for greater capacities and performance in storage devices," said Dr. Mike Mang, vice president of Brand Product Marketing, Memory Business at Samsung Electronics. "Samsung continues to lead the move toward multi-terabyte SSDs with the introduction of the Samsung 860 QVO, delivering fast performance, reliability and value to more consumers around the world."

The New Samsung 860 QVO SSD With QLC NAND Gets Listed Online, Will Be Cheaper Than the Evo family

In October Samsung took the stage on its Tech Day event and announced its SSD roadmap. One of the key elements of that roadmap was the project to launch QLC (quad-level cell) SSDs, and now we've got more information on these products. Several European online retailers -French and Italian- have already listed the new Samsung 860 QVO units, which means their official availability is near us.

The new SSD drives will feature the conventional 2.5-inch format with SATA interface, but the naming scheme changes from EVO or Pro to the new QVO, which stands for "Quality and Value Optimized SSD". Performance goes up to 550/520 MB per second for sequential read/write, and apparently these SSDs will feature 96,000 IOPS read and 89,000 IOPS write. There will be at least three variants: 1 TB (MZ-76Q1T0BW), 2 TB (MZ-76Q2T0BW) and 4 TB (MZ-76Q4T0BW), with prices of 117.50 euros, 225,96 euros and 451,93 euros (VAT excluded) according to those online retailers. Even with taxes included 19% would make 140, 270 and 540 euros), these are cheaper priced than the ones we can find on the Evo family (160, 380 and 850 euros at those storage capacities), for example. Some of these online shops mention December 2018 as the ETA.

DRAM Price-Fix Uncovered in China, 'Massive Evidence' Against Samsung, SK Hynix and Micron

The Chinese State Administration for Market Regulation has been conducting an anti-monopoly investigation of the global Dynamic RAM market. According to an interview of Wu Zenghou (bureau's head) in the Financial Times, this process has found "massive evidence" against the three companies (Samsung, Hynix, and Micron) that are responsible for the vast majority of this segment. "The anti-monopoly investigation into these three companies has made important progress", points out the investigator. On April these three companies were hit with a price-fixing suit on the same matter in the US, and this investigation seems to confirm those reports.

There is even an older precedent, as Samsung and Hynix were fined both by the US Department of Justice in 2005 and by the European Commission in 2010 on price-fixing allegations. The charges now are similar, and if the companies are found guilty, they could face fines of over $2.5 billion. Some analysts suggest this investigation could be part of the trade war between China and the US, with the former trying to get some leverage pushing the Chinese semiconductor company Fujian Jinhua Integrated Circuit as a bigger player on this market. One that, by the way, is being investigated on allegations of misappropriated trade secrets from Micron. Samsung and SK Hynix have accused China DRAM makers of industrial espionage, too.

Samsung Launches First Mobile SoC with AI-Accelerating Matrix Multiplication Cores

Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today announced its latest premium application processor (AP), the Exynos 9 Series 9820, equipped for on-device Artificial Intelligence (AI) applications. The Exynos 9820 features a fourth-generation custom CPU, 2.0-gigabits-per-second (Gbps) LTE Advanced Pro modem, and an enhanced neural processing unit (NPU) to bring new smart experiences to mobile devices.

"As AI-related services expand and their utilization diversify in mobile devices, their processors require higher computational capabilities and efficiency," said Ben Hur, vice president of System LSI marketing at Samsung Electronics. "The AI capabilities in the Exynos 9 Series 9820 will provide a new dimension of performance in smart devices through an integrated NPU, high-performance fourth-generation custom CPU core, 2.0Gbps LTE modem and improved multimedia performance."

G.SKILL Announces DDR4-4266 64GB (8x8GB) and DDR4-4000 128GB (8x16GB) Memory Kits

G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory and gaming peripherals, is excited to announce two world-class extreme speed high capacity memory kits - DDR4-4266 64GB (8x8GB) and DDR4-4000 128GB (8x16GB) for the latest Intel Core X-series processors and X299 motherboards. Both kits are equipped with high performance Samsung B-die ICs and are validated on the ASUS PRIME X299-DELUXE II motherboard with the Intel Core i9-9920X and Core i7-9800X processors, respectively.

Dedicated to developing faster overclocking memory, G.SKILL is bringing 128GB capacity kits to the speed class of DDR4-4000, while maintaining an ultra-efficient CL19-19-19-39 CAS latency and 1.35V low voltage. It is the ultimate memory solution for building a super performance computer combining the highest capacity and extreme speed. This kit will join the G.SKILL Trident Z RGB family and has been validated on the ASUS PRIME X299-DELUXE II motherboard and with the latest Intel Core i7-9800X processor. The following screenshot shows the stress test result: (Note: Please refer to the "Specification" field of the CPU tab for the correct CPU model name.)

SSD the Next Frontier for Cybersecurity: Vulnerabilities Found with Native Encryption

Compared to hard disk drives, the logic that makes solid-state drives (SSDs) tick is far more complex, involving a far more powerful SoC, complete with native storage, and sophisticated firmware that tells the controller where each bit of user data is physically stored across an array of NAND flash chips. Not surprisingly, the more sophisticated you make your SSD firmware, the more security vulnerabilities you leave, as cyber-security researchers at The Radboud University found out.

A research paper draft published by Carlo Meijer and Bernard van Gastel tells us that hardware data encryption technologies built into modern SSDs are easy to bypass and recover protected data, rendering technologies such as TCG Opal useless. Most modern SSDs offer native data encryption, which encrypts data using popular methods such as AES, without posing an overhead for the host machine. "We found that many hardware implementations [of native encryption] have critical security weaknesses, for many models allowing for complete recovery of the data without knowledge of any secret."

Samsung Cuts CAPEX by a Quarter, Calls it an "End of the Chip Boom"

Samsung Electronics Wednesday slashed its capital expenditure (capex) by a quarter, which could significantly reduce its NAND flash chip output, and raise NAND flash prices back to profitability for the company, although not anytime soon. This could herald a rise in SSD prices around this time next year, although they partly contradict analyses that predict further slides in NAND flash prices through 2019, as the advent of 96-layer 3D QLC NAND flash by every major player would add to swelling inventories in the market. If you'll recall, Samsung reportedly desires DRAM prices to remain high and establish current high DRAM prices as a new normal. The company went as far as to further reduce its DRAM output, just so supplies of DRAM in the market remain low. The company remarked that acceleration in NAND flash price-drops signifies an end of the "boom" in NAND flash chip demand that fueled growth over the past two years, as justification to its capex cuts.

New Exemptions To The DMCA Allow Users To Hack And Repair Their Phones (And Their Tractors, too)

You know that iPhone you bought? Or that home appliance? Or that tractor? They're not yours. Not completely, I mean, because if something breaks, you'll have to repair them through the official repair services of the hardware maker. You can try to repair them by yourself, but you'll probably have a lot of trouble doing it or even getting an unofficial technical service to do it. Oh, and until now it even wasn't legal for you to try. Companies such as Apple, Microsoft, Samsung or John Deere have turned repair control into an art form. The DRM they impose on their products is becoming more and more complex, and there are lots of devices that are very complicated to open to try to repair.

Agencies like EFF have long been fighting for the so-called "right to repair" movement to try to fight these kinds of strategies, and these days those efforts have paid off. The Librarian of Congress and US Copyright Office have adopted "exemptions to the to the provision of the Digital Millennium Copyright Act ("DMCA") that prohibits circumvention of technological measures that control access to copyrighted works". This means that from now on, users will be able to hack the software and fix the hardware on (some of) their devices in order to repair or maintain them. The new rules apply to smartphones, "home appliances" and "home systems", but they go beyond there and will allow users to repair cars, tractors and other motorized land vehicles (no boats or planes, though) by modifying their firmware.

NAND Flash Prices May See Further Drops in 2019, DRAM to Remain Flat

Solid-state drives are cheaper than ever, thanks to systematic decline in NAND flash prices owing both to oversupply and increases in densities. NAND flash prices have already declined by 50 percent over 2018, according to a DigiTimes report, and will continue to slide through 2019. ADATA chairman Simon Chen commented that NAND flash makers haven't slowed down capacity expansions, and 2019 could witness an even bigger drop in prices than 2018.

Major NAND flash makers such as IMFlash Technology, SK Hynix, Samsung, Western Digital, Toshiba, have already taped out their 96-layer 3D NAND flash products, which could enter volume production in the first half of 2019. This could impact prices of existing swelling inventories of products based on 64-layer NAND flash. In theory, the 96-layer chips introduce 50 percent increases in densities. Adoption of newer technologies such as QLC (4 bits per cell) will expand densities even further. The same report also projects that DRAM prices could largely remain flat throughout 2019. Most NAND flash makers also happen to make DRAM, and could balance their NAND flash losses with DRAM profits.

Samsung Announces HMD Odyssey+ with a Display Technology That Says Goodbye to Screen Door Effect

Mixed reality headsets seem to present a new opportunity for the Virtual Reality segment, and Samsung has taken advantage of this trend by announcing the new Samsung HMD Odyssey+, a product that stands out for a novelty in its OLED displays that eliminates the screen door effect. This is a visual artifact of displays where the fine lines separating pixels become visible on the screen. This effect hurts the visual experience, but it can also cause dizziness or nausea.

Samsung say they have solved the problem with an innovation called "Anti-Screen Door Effect (Anti-SDE) Display". This technology helps to increased the perceived resolution of the displays, and according to Samsung the user will have a perceived screen density of 1,233 PPI. The actual density is 616 PPI on a conventional AMOLED, but with the new Anti-SDE AMOLED technology that resolution promises to double virtually before our eyes.

Samsung Electronics Starts Production of EUV-based 7nm LPP Process

Samsung Electronics, a world leader in advanced semiconductor technology, today announced that it has completed all process technology development and has started wafer production of its revolutionary process node, 7LPP, the 7-nanometer (nm) LPP (Low Power Plus) with extreme ultraviolet (EUV) lithography technology. The introduction of 7LPP is a clear demonstration of Samsung Foundry's technology roadmap evolution and provides customers with a definite path to 3nm. The commercialization of its newest process node, 7LPP gives customers the ability to build a full range of exciting new products that will push the boundaries of applications such as 5G, Artificial Intelligence, Enterprise and Hyperscale Datacenter, IoT, Automotive, and Networking.

"With the introduction of its EUV process node, Samsung has led a quiet revolution in the semiconductor industry," said Charlie Bae, executive vice president of foundry sales and marketing team at Samsung Electronics. "This fundamental shift in how wafers are manufactured gives our customers the opportunity to significantly improve their products' time to market with superior throughput, reduced layers, and better yields. We're confident that 7LPP will be an optimal choice not only for mobile and HPC, but also for a wide range of cutting-edge applications."

Intel 9th Gen LGA1151 Processors Support Up to 128GB of Memory

Intel's 6-core "Coffee Lake" die was essentially a "Kaby Lake" die with two extra cores, and no physical changes to other components, such as iGPU or uncore. With its new 8-core "Coffee Lake" Refresh silicon, Intel has turned its attention to not just increasing the core-count, but also improving the processor's integrated memory controller, in addition to hardware fixes to certain security vulnerabilities. The 128-bit wide (dual-channel) integrated memory controller now supports up to 128 GB of memory. Intel's current DDR4-capable mainstream desktop processors only support up to 64 GB, as do rival AMD's Ryzen socket AM4 processors.

Support for up to 128 GB explains the emergence of off-spec memory standards such as ASUS' Double Capacity (DC) DIMMs. Samsung is ready with a JEDEC-compliant 32 GB dual-rank UDIMM memory module for client platforms. Introduction of 32 GB UDIMMs also comes amidst reports of DRAM pricing cool-off through 2019, which could make 32 GB dual-channel memory kits consisting of two 16 GB UDIMMs more affordable. The increase in maximum memory amount could also indicate Intel's seriousness to introduce 3D Xpoint-based Optane Persistent Memory modules as alternatives to DRAM-based main memory, with higher capacities compensating for worse latencies and data-rates compared to DRAM.

G.SKILL Also Announces DDR4-4800 16GB (2x8GB) and DDR4-4500 32GB (4x8GB) Kits For Intel Z390 Motherboards

G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory and gaming peripherals, demonstrates two extreme DDR4 RGB specifications on the latest Intel Z390 chipset, including DDR4-4800MHz CL19 16GB (2x8GB) and DDR4-4500MHz CL19 32GB (4x8GB). Both kits are built with high performance Samsung DDR4 B-die ICs and provide the fastest XMP speed of each capacity configuration.

Memory, not smartphones, is what is really working at Samsung

Smartphones or TVs may be Samsung's most popular products, but they are certainly not the most profitable for the company. The South Korea electronics giant has announced its estimates for the third quarter of the year, and that data points to the company achieving the highest operating profit in its entire history. Samsung is set to reach 17.5 trillion won ($15.8 billion), up 20% from the same period last year. Not only that: revenues will also reach a record 65 trillion won ($57.3 billion), almost 5% more than last year.

The surprise of these results lies precisely in the products that have been the main protagonists of these revenues and profits. It wasn't smartphones, and in fact in the second quarter those lost more market share than any other manufacturer with a Galaxy S9 and a Galaxy S9+ whose sales haven't been as good as expected. TVs weren't that succesful either.

Intel At Least 5 Years Behind TSMC and May Never Catch Up: Analyst

Intel's in-house sub-10 nanometer silicon fabrication dreams seem more distant by the day. Raymond James analyst Chris Caso, in an interview with CNBC stated that Intel's 10 nm process development could set the company back by at least 5 years behind TSMC. In its most recent financial results call, Intel revised its 10 nm outlook to reflect that the first 10 nm processors could only come out by the end of 2019. "Intel's biggest strategic problem is their delay on 10nm production - we don't expect a 10nm server chip from Intel for two years," analyst Chris Caso said in a note to clients Tuesday. "10nm delays create a window for competitors, and the window may never again close."

By that time, Intel will have missed several competitive milestones behind TSMC, which is in final stages of quantitatively rolling out its 7 nm process. Caso predicts that by the time Intel goes sub-10 nm (7 nm or something in that nanoscopic ballpark), TSMC and Samsung could each be readying their 5 nm or 3 nm process roll-outs. A Rosenblatt Securities report that came out late-August was even more gloomy about the situation at Intel foundry. It predicted that foundry delays could set the company back "5, 6, or even 7" years behind rivals. Intel is already beginning offload some of its 14 nm manufacturing to TSMC. Meanwhile, AMD is reportedly planning to entirely rely on TSMC to make its future generations of "Zen" processors.

ASUS DDR4 "Double Capacity DIMM" Form-factor a Workaround to Low DRAM Chip Densities

32-gigabyte DDR4 UDIMMs are a reality. Samsung recently announced the development of a 32 GB DDR4 dual-rank UDIMM, using higher density DRAM chips. Those chips, however, are unlikely to be available anytime soon, compounded by Samsung's reported scumbaggery in the making. In the midst of all this, motherboard major ASUS designed its own non-JEDEC UDIMM standard, called "Double Capacity DIMM" or DC DIMM, with the likes of G.Skill and Zadak designing the first models. The utility of these modules is to max out the CPU memory controller's limit despite having fewer memory slots on the motherboard. Possible use-cases include LGA1151 mini-ITX motherboards with just one slot per memory channel (2 slots in all), or certain LGA2066 boards with just four slots (one slot per channel).

There is no word on the memory chip configuration modules, but it's highly likely they are dual-rank. The first DDR4 DC modules could be 32 GB, letting you max out the memory controller limit of 8th gen and 9th gen Core processors with just two modules. ASUS is heavily marketing this standard with its upcoming motherboards based on Intel's Z390 Express chipset, so it remains to be seen if other ASUS motherboards (or other motherboards in general) support the standard. Ironically, the Zadak-made module shown in ASUS marketing materials use DRAM chips made by Samsung.

Samsung To Reduce DRAM Output Growth in Favor of Maintaining Prices, Says Bloomberg

In a bid to head off investor worries of a potential downturn, Samsung is looking to tighten their belts in regards to the manufacturing of DRAM. In particular, this move is preempted by the expectation of DRAM bit growth to be less than 20% year-over-year, with bit growth being the key measurement for gauging market demand based on the amount of memory produced. Considering the semiconductor industry is known for its up and down cycles, Samsung's preemptive move could stabilize or even drive up the cost of memory coming out of not just them but Micron and SK Hynix as well. This would help keep their profits rolling in, just in case a downturn in demand does take place, but it also means PC enthusiasts will have to deal with memory prices remaining roughly the same or possibly climb higher going forward.

Anthea Lai, an analyst for Bloomberg Intelligence, in Hong Kong made note that "If Samsung does cut its DRAM bit growth, it shows the company is happy with the current oligopoly market structure." Elaborating further, he said that "It prefers keeping supply tight and prices high, rather than taking market share and risking lower prices, therefore chances for DRAM prices to stay strong is higher."

Samsung, SK Hynix Slowing Down NAND, DRAM Fab Expansion Plans in Wake of Lower Demand Projections

DigiTimes is reporting plans from both Samsung and SK Hynix to slow down their fabrication capacity expansion plans for NAND and DRAM in wake of lower than expected demand projection for the first half of 2019. This move comes at a time where DRM pricing is still extremely prohibitive due to "higher demand than fabrication capacity output" - and we'd already seen the companies base their fabrication expansions on lower than expected demand increases, as a way to artificially keep pricing for the memory commodity high. NAND is another case - price per GB has been dropping like a rock. And now, the companies want to thwart expected lower demand with lower production values.

Samsung, for one, has reportedly put its plans for additional new production capacity for 1ynm DRAM chips at its fabs in Hwaseong and Pyeongtaek on hold. The chip vendor previously planned to build an additional 30,000 wafers monthly for DRAM memory starting the third quarter of 2018, the sources said - but is now looking to reduce that number to keep pricing from bottoming out. Sk Hynix is also reported to have slowed down its projected production, but details are scarcer on that side of the fence. All in all, it seems that whether there is demand or not, seeing DRAM prices falling to their previous levels is a dream in both name and, not paradoxically, reality.

IDC - Despite Sharp Decline in VR Headset Shipments in Q2 2018, Market Outlook Remains Positive

Worldwide shipments of virtual reality (VR) headsets were down 33.7% year over year in the second quarter of 2018 (2Q18), according to the International Data Corporation (IDC) Worldwide Quarterly Augmented and Virtual Reality Headset Tracker. IDC expects this to be a temporary setback as the VR market finds its legs. The arrival of new products, such as the Oculus Go and HTC Vive Pro, and new brands, combined with the need for greater headset fidelity all point to a positive outlook for the quarters ahead.

Screenless viewers brought a lot of attention to VR in the early days as the entire market was artificially propped up by brands like Samsung, Alcatel, and Google that bundled the headsets with smartphones. However, since then, the screenless viewer category has declined substantially, shrinking from 1 million headsets in 2Q17 to 409,000 in 2Q18. This category was the largest contributor to the decline in shipments for the overall VR headset market.

Samsung Ready with 32GB DDR4 UDIMMs for Desktops, Paving the Way for 16GB Single-Rank

Samsung is ready with a 32 GB DDR4 UDIMM (unbuffered DIMMs) targeted at desktops. Dual-channel kits with these modules could let you max out the 64 GB memory limit of today's mainstream desktop processors, and 128 GB limits of Intel's Core X HEDT processors, with quad-channel kits. AMD's Ryzen Threadripper processors are advertised to support up to 2 TB of memory (including ECC support), so it should finally be possible to pack up to 256 GB of memory on Threadripper-powered machines.

The new M378A4G43MB1-CTD DDR4 UDIMM from Samsung is, unsurprisingly, a dual-rank module (x8 / x16 Organization or up to 2 ranks per DIMM and 2DPC configuration). It ticks at DDR4-2666 at a module voltage of 1.2 V. The module itself won't be much to look at, with a green PCB and bare-naked DRAM chips. It is is currently sampling to PC OEMs. It could also be possible for more popular memory manufacturers to get in touch with Samsung for the DRAM chips that make up this module. A single-rank variant of this module could finally make it possible for AMD Ryzen AM4 machines to have 32 GB of dual-channel memory at acceptably high memory clocks.

Analyst Firm Susquehanna: "Intel Lost its Manufacturing Leadership"

Intel was once the shining star in the semiconductor manufacturing industry, with a perfectly integrated, vertical product design and manufacturing scheme. Intel was one of the few companies in the world to be able to both develop its architectures and gear their manufacturing facilities to their design characteristics, ensuring a perfect marriage of design and manufacturing. However, not all is rosy on that field, as we've seen; AMD itself also was a fully integrated company, but decided to spin-off its manufacturing arm so as to survive - thus creating GLOBALFOUNDRIES.But Intel was seen as many as the leader in semiconductor manufacturing, always at the cutting edge of - well - Moore's Law, named after Intel's founding father Gordon Moore. Now, Mehdi Hosseini, an analyst with Susquehanna, has gone on to say that the blue giant has effectively lost its semiconductor leadership. And it has, in a way, even if its 10 nm (which is in development hell, so to speak) is technically more advanced than some 7 nm implementations waiting to be delivered to market by its competitors. However, there's one area where Intel will stop being able to claim leadership: manufacturing techniques involving EUV (Extreme UltraViolet).

Surging Tech Companies' Inventories Could Spell Trouble for the Industry

Even as we achieve consumerism in scales hitherto unseen, tech companies always want to sell more - there's "always" increased production, there must always be increased, projected demand from customers. However, when demand isn't there, and growth slows down or even stagnates, production takes its time to adjust - and already manufactured products have few opportunities other than going on towards a swelling inventory.

This is what is happening with a myriad of tech companies, such as Apple, Samsung, Xiaomi, Intel, Hon Hai (Foxconn), among others. We could even take a page from our own PC industry and look at NVIDIA's Pascal inventory that is in need of clearing up - and which has resulted in bottoming prices of previous-gen cards as we look towards the new RTX 20-series. Which, coincidentally, have been launched with increased pricing over the previous generation. Perhaps another way of moving old inventory?
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