Industry insiders have disclosed fairly fresh theories about AMD delaying the launch of Radeon RX 9070 GRE graphics cards into the fourth quarter of 2025. Earlier leaks suggested a potential surprise arrival at some point in May (early next month), ahead of rumored wallet-friendly Radeon RX 9060 XT 16 GB and 8 GB models. In another bizarre turn of pre-release events, VideoCardz has acquired promotional shots of two—alleged—PowerColor Radeon RX 9070 GRE 12 GB custom designs. The online news outlet seems to have a strong "inside" connection to a source familiar with goings-on—within or adjacent to—the Taiwanese company.

Familiar images of flagship and entry level cards have emerged from an unnamed figure—reportedly, the manufacturer has reused its existing portfolio of RDNA 4 generation shroud and backplate designs. Curiously, a mid-tier Hellhound GRE card was not included in a recent NDA-busting exchange. VideoCardz believes that the exact same Red Devil enclosure—present on Radeon RX 9070 XT and RX 9070 siblings—is up for repeat business. A significant difference seems to be the reported utilization of two 8-pin power connectors (versus three on the flagship), and a minimum requirement of a 650 W-rated PSU. March-time whispers suggested a forthcoming mass production of board partner Radeon RX 9070 GRE cards; so the sudden appearance of two PowerColor SKUs seems to semi-verify older online claims. VideoCardz posits that AMD is deliberately seeding "incorrect information" within insider knowledge channels.

An unlucky owner of a GIGABYTE AORUS GeForce RTX 5080 MASTER ICE 16 GB graphics card has reported a baffling instance of thermal gel leakage. A forum post—titled: "5080 oh my god thermal problem"—on the Quasar Zone BBS alerted the wider world to this bizarre fault. The South Korean MMORPG enthusiast described circumstances up until the point of critical liquefaction: "it's been exactly a month since I bought it. I use it for (Blizzard's) World of Warcraft. Two hours of use per day. I set up the card with a riser kit. Thermal (material) is crawling out?!" Early 2025 press coverage has largely focused on other types of unwanted high temperature events involving GeForce RTX 50-series cards, but the seeping out of "server-grade thermal conductive gel" compound is something new. As reported by several PC hardware news outlets, GIGABYTE has utilized fancy thermal conductive gel within flagship SKUs—instead of traditional/conventional thermal pads. This gel was placed over the card's VRAM and MOSFET sections; following fairly light usage (as described above) some of this material started to head down—getting ever closer to the unit's PCIe interface.

Assisted by the AORUS RTX 5080 MASTER ICE's vertical orientation, the (apparently) highly deformable, but non-fluid thermal gel was susceptible to the effects of gravity. JC Hyun System Co., Ltd.—GIGABYTE's official domestic importer (for South Korea)—weighed in with a separate bulletin: "we are aware of the thermal gel issue with the GIGABYTE GeForce RTX 50 series, which was first posted on Quasar Zone—(we) are currently discussing the thermal gel issue with GIGABYTE HQ and future customer service regulations. In addition, we sincerely apologize for the confusion caused to many customers who love and use GIGABYTE products due to inaccurate guidance provided to customers who received the products due to unclear customer service regulations regarding the issue that occurred this time. Lastly, when the manufacturer's customer service policy regarding this thermal gel issue is finalized, we will also forward the service policy to CS Innovation so that it can be processed smoothly in accordance with the service policy. We will also provide information through a separate post so that more customers can be aware of the information." As mentioned by Notebookcheck, GIGABYTE uses this special thermal gel solution on other highly expensive custom: "RTX 50-series cards like the GeForce RTX 5090 XTREME WATERFORCE 32G, RTX 5090 MASTER ICE, RTX 5070 Ti MASTER, and others."

A part of AMD's enthusiast fanbase scoffed at the prospect of a rumored Radeon RX 9070 GRE 12 GB model arriving ahead of—officially teased—lower end RDNA 4 options. This new generation's "Great Radeon Edition" seemed to be heading into mass production; according to insider track information. Last week, fairly legitimate specifications leaked out and TechPowerUp's GPU-Z utility was updated with support for this slightly mysterious Navi 48 GPU-based gaming card. Members of the Board Channels forum have heard fresh whispers from industry moles—most likely from AIBs—regarding a possible delay of Team Red's Radeon RX 9070 GRE design. Alleged initial plans suggested an original release at retail; on May 8. Further conjecture points to a revised Q4 2025 launch window—perhaps just before November 11. The same Board Channel report also mentioned an expedited rollout of AMD's Radeon RX 9060 XT cards—earlier theories signalled an early June (aka post-Computex 2025) arrival, but insiders now posit May 18.

An alleged partial close-up capture of the Nintendo Switch 2's chipset has leaked out; courtesy of Kurnal (@Kurnalsalts). This fresh leak is being hyped up as putting an end to all online debate regarding the upcoming hybrid console's technological underpinnings. Despite late 2024/early 2025 reports pointing to a custom NVIDIA "T239" SoC design, certain voices continued to produce conjecture about a more "cutting edge" solution. Surprisingly, Team Green's PR department did issue a statement about the Switch 2 being powered by: "a custom processor featuring an NVIDIA GPU with dedicated RT Cores and Tensor Cores for stunning visuals and AI-driven enhancements."

As expected, Nintendo staffers remained guarded during recent press junkets—in-depth tech talk was deferred in NVIDIA's general direction. Kurnal's sharing of a speculative "T239" partial die shot does not provide any major new revelations or insights—as discussed on the Nintendo Switch 2 Subreddit, tech enthusiasts continue to rely on specification details from the big hack of NVIDIA repositories (three years ago). Newer speculation has focused on Nintendo's choice of foundry—Digital Foundry's Richard Leadbetter continues to express his personal belief that Nintendo has selected a Samsung 8 nm DUV foundry node. In opposition, certain critics have persisted with a 5 nm EUV node process theory.

Mid-way through April, we heard about sanctions affecting shipments of NVIDIA's H20 AI chips into China. Despite (rumored) best efforts made by Jensen Huang and colleagues, the US government has banned the export of Team Green's formerly sanction-conformant design. Similarly, NVIDIA prepared a slightly less potent GPU for gaming applications—exclusively for the Chinese market. Despite sporting a restricted GB202 "Blackwell" GPU die, the GeForce RTX 5090D 32 GB is still a monstrous prospect. According to Chinese PC hardware news sources, Team Green representatives have sent alerts to "all" of its Chinese add-in-card partners (AICs)—early warning signs have indicated a possible cut-off of GB202 GPUs in the near future. A member of the Chiphell forum disclosed some insider knowledge and dismissed unfounded speculation about RTX 5090D cards being replaced by "full fat" RTX 5090 options.

sthuasheng commented on Team Green's alleged bulletin—distributed at some point last week: "the notice only said that the supply of RTX 5090D was suspended, ...this did not mean any sales or transportation ban; it urged everyone not to make any speculations or judgments unless there was an official notice issued at a later date. After this notice was issued, each AIC began to notify agents to suspend sales, because the inventory of 5090D has always been very small, so it is necessary to keep these stocks to observe the subsequent situation and deal with the subsequent after-sales. At the same time, we might as well speculate that each AIC and dealer may also have the intention to stockpile 5090D units and then sell them at an elevated price." BenchLife.info decided to reach out to industry moles, following an absorption of various Chiphell whispers.

Not long after Intel's launch of the Arc Xe2 "Battlemage" B580 12 GB graphics card design, insiders started generating noise about potential spin-offs bound for release in 2025. In theory, the speculated "B580 24 GB" variant could arrive as a workstation-oriented discrete graphics solution—possibly lined up as a next-gen entry within Team Blue's Arc Pro family. Three mysterious BMG (aka "Battlemage") PCI identifiers turned up at the end of January; sending online PC hardware debates into overdrive; one faction believed that Team Blue was readying fabled productivity-focused B-series cards—complete with enlarged pools of GDDR6 VRAM. Apparently, Sparkle's Chinese branch has provided comment on newer rumors—from March, according to VideoCardz. The Taiwanese manufacturer is a key Intel board partner in the field of Arc GPU-based graphics card products—across gaming and professional desktop lines. Unfortunately, the company's head office (in Taiwan) has dismissed "official" claims about a May/June launch of an unnamed 24 GB model. Sparkle's Chinese social media account engaged with members of the PC hardware community, and outlined an "original plan" to release something new within the second quarter of 2025—apparently the incoming card is "still being arranged."

Acer seems to be readying premium tier Radeon RX 9070 XT OC graphics card models for an imminent launch. The brand's Swedish office has sent out mixed messages—as noted by VideoCardz's past weekend coverage—regarding their incoming non-overclocked Nitro SKU. Gaming GPU enthusiasts have often complained about AMD's overcomplicated model nomenclature—in particular, the company's XT, XTX and GRE attachments have caused uncountable headaches. Quite amusingly, Acer Sweden's marketing team got bamboozled by Team Red's model labelling scheme—as evidenced by their recent advertising of a "Nitro Radeon RX 9070 GRE XT 16 Gbit/s graphics card."

VideoCardz reckons that no such SKU exists; employees have rectified this mistake—at the time of writing, Acer Sweden's product page showcases a corrected designation: "Nitro Radeon RX 9070 XT 16 GB graphics card." According to industry moles, AMD and its board partners are working on RDNA 4 generation "Great Radeon Edition" (GRE) cards. Late last week, VideoCardz acquired an alleged Radeon RX 9070 GRE 12 GB specification sheet. Team Red and AIBs seem to be devising a forthcoming retail release in China; possibly by next month. Acer Sweden's inadvertent/bungled leak suggests that GRE-related info is present within internal promo material.

Going back to May 2023, an industry inside report suggested that AMD was planning a new generation Ryzen Threadripper High-End Desktop (HEDT) processor series. At the time, "Shimada Peak" was linked to a possible 2025 launch. Over the ensuing years, shipping manifests have revealed the transfer of various 9000 SKUs between Team Red facilities—starting with a mysterious 96-core prototype. Industry observers have been seeking out newer evidence of AMD's next-gen flagship "Zen 5" Threadripper chip; likely going under a "9995WX" moniker.

Late last week, a fresh leak unearthed a likely sub-flagship SKU: the 9985WX. This alleged 64-core SKU was spotted—by Everest (aka Olrak29)—alongside 9955WX (16-core) and 9945WX (12-core) siblings, in a shipping manifest. As reported on TechPowerUp on March 21, the same source uncovered two other entry-level models: the 9975WX (32-core) and 9965WX (24-core) parts. Unfortunately, Team Red's rumored monstrous 96-core 9995WX processor was not listed within fresh batches of shipping documents. Industry watchdogs expect AMD to repeat its product layout from past generations; spanning from entry-tier 12-core offerings up to the aforementioned 96-core range-topper. The latest leak suggests utilization of the SP6 socket type, and 350 W TDPs (across all product identifiers).

At the tail end of March, an interaction between Tomasz Gawroński (aka GawroskiT) and Jaykihn (jaykihn0) indicated that Intel had abandoned the development of higher-end Arc Xe2 "Battlemage" graphics cards—possibly back in late 2024. Months of silence—since the launch of pleasingly wallet-friendly B580 and B570 models—instilled a sense of unease within segments of the PC gaming hardware community. Many watchdogs assumed that company engineers had simply moved onto devising futuristic Arc Xe3 "Celestial" equivalents. As discovered last week, hopes have been elevated for a potential expansion of Team Blue's "Battlemage" dGPU lineup. Haze2K1 highlighted an intriguing entry within an NBD shipping manifest; a "BMG-G31"-type GPU was transferred "for R&D purposes." Currently, the lower end of Intel's B-card series is populated by discrete solutions based on their smaller "BMG-G21" GPU design.

Tomasz Gawroński spent part of his Easter weekend poring over shipping documents; soon stumbling on an entry that mentioned a mysterious "IBC C32 SKT"—again, listed under "research and development" purposes. In a reply to Gawroński's social media bulletin, miktdt weighed in with a logical theory: "because of the BMG in the text the best I could believe is a reworked/restarted BMG G31. C32 could simply mean cores 32 which is a fully-enabled G31. This makes more sense to me." VideoCardz posits that these leaks do not necessarily signal the revival of fortunes for more potent Arc Xe2 "Battlemage" SKUs; Intel could be shipping "canceled project" prototypes to different locations. Going back to late summer 2023, a "BMG G10" GPU die was spotted by members of the press during a tour of Team Blue's Malaysian test lab. Back then, certain industry insiders believed that the whole "Battlemage" endeavor was going through "development hell." Fast-forward to the present day; OneRaichu reckons that there is still a likelihood of Team Blue's "B770" model turning up at some point in the future.

Apple is reportedly working on two different new-gen Vision mixed reality headset models. As covered on TechPowerUp's news section earlier on in the week, one rumored "more budget-friendly" option could be a lightweight product. Yesterday, Kosutami (@Kosutami_Ito) posited that Apple engineers have realized a thinner design. According to inside information, weight reduction has been achieved through the fitting of select titanium parts—Kosutami highlighted the lighter Vision package's connectors and battery as potential candidates. Industry watchdogs reckon that the rest of this rumored design will rely on (largely) aluminium and plastic pieces. The tipster also teased a "graphite dark blue" colorway; harkening back to iPhone 5's Slate Black aesthetic. A theorized "Vision Air" label has emerged from Kosutami's recent social media post.

Historically, Apple's Air notebook models have consistently launched as lighter/cheaper alternatives to MacBook Pro offerings. Mac specialist and general PC hardware news sites have picked up on additional Kosutami bulletins, going back to late last week. Photos of a speculated "Vision Air" power cable were shared online, last weekend. An initial upload showcased an anodized aluminium "Lightning-style" connector "finished in Apple's distinctive Midnight Blue/Black" colorway. MacRumors inspected a newer set of images, and explained: "the (original) Vision Pro uses a similar connector, except with twelve pins instead of eight, suggesting that the new cable is part of a more significant redesign, at least of the external battery. The audio strap connector appears to be the same design as that of the Vision Pro."

The unannounced Radeon RX 9070 GRE 12 GB graphics card model seems to be next in line within AMD's RDNA 4 range. Despite official presentation material teasing a Q2'25 launch of Radeon RX 9060 Series cards, insiders believe that Team Red will debut an in-between option—possibly before the arrival of Radeon RX 9060 XT 16 GB and 8 GB SKUs. Rumored new-generation "Great Radeon Edition" (GRE) cards are expected to launch as Chinese market exclusives; potentially as a "strategic" gap fill. Local board partner moles have whispered about almost zero replenishments of Radeon RX 9070 (non-XT) 16 GB stock in the region. As reported earlier today, some of VideoCardz's inside sources insist that Radeon RX 9070 GRE cards will—eventually—replace Radeon RX 9070 options. Initial leaks suggested fundamental "step-down" specification pillars: 12 GB of VRAM, a 192-bit memory interface, and a "reduced" "Navi 48" GPU die.

According to fresh claims, the Radeon RX 9070 GRE model could utilize a "Navi 48 XL" GPU variant. VideoCardz reckons that a quarter of the original GPU core count has been shut off; resulting in a total of 3072 stream processors. Comparatively, the Radeon 9070 XT arrived with 4096 SPs. The Radeon 9070 launched with 3584 units. The report delved into alleged core frequency details: "the RX 9070 GRE's clocks will be higher than the RX 9070, reportedly at 2.79 GHz boost, resulting in around 17.1 TFLOPS compared to 18 TFLOPS on the RX 9070...Some custom variants we know of will approach a 3.0 GHz boost clock, so there is definitely room for overclocking." The latest spec sheet leak confirms a 12 GB pool of VRAM, in GDDR6 form—VideoCardz weighed in with some embellishments: "the memory will not be clocked at 20 Gbps, as on (already launched) RX 9070 (XT) and (incoming) RX 9060 XT, but at 18 Gbps. This means that the memory bandwidth will be about 1/3 lower than the RX 9070 (XT) at 432 GB/s." Certain industry observers reckon that AMD will continue to rely on AIBs to produce an all-custom lineup of forthcoming RDNA 4 products. So-called "reference designs" (MBA) have turned up in China, but only in very limited numbers—sold via hazy avenues.

Two weeks ago, unannounced APU model names—"Ryzen AI Z2 Extreme" and "Ryzen Z2 A"—were leaked by Hoang Anh Phu. AMD introduced its Ryzen Z2 series at CES 2025; officially consisting of three options: Z2 Extreme, Z2 and Z2 Go. Technical make up of the two alleged new additions remained a mystery, but watchdog theorizations positioned the rumored "Ryzen AI Z2 Extreme" as the (expanded) lineup's flagship—likely due to the enablement of an integrated XDNA 2 NPU. The vanilla Z2 Extreme APU is a handheld gaming-oriented product; existing as a spin-off from Team Red's "Strix Point" mobile processor design—utilizing Zen 5 and RDNA 3.5 technologies. By similar deduction, the leaked "Ryzen Z2 A" SKU was viewed as a "Hawk Point" (Zen 4 + RDNA 3) processor, possibly with a "switched on" AI aspect. Earlier today Hoang Anh Phu provided a new follow-up claim—this morning's social media post proposes a return to "Van Gogh" pastures.

The not-yet-official "Ryzen Z2 A" APU design could be derived from the Steam Deck's Zen 2 + RDNA 2 package. Valve and AMD's collaboration resulted in the "Van Gogh" custom chip design—also known as "Aerith"—debuting back in 2022. A die shrink—from 7 nm to 6 nm—arrived in the form of Steam Deck OLED's "Sephiroth" chipset (2023). Phu's latest prediction places the "Ryzen Z2 A" closer to the already unveiled Ryzen Z2 Go, graphics technology-wise. As discussed in the past, this entry-level "Phoenix 2" solution sports an RDNA 2 iGPU, albeit paired with Zen 3 processor cores. The Ryzen Z2 Go chipset powers Lenovo's Legion Go S handheld gaming PC—in the near future, this offering will be made available with two different operating system options: Windows 11 or SteamOS. As extrapolated from Phu's fresh prediction, similar-ish lower end devices—prepped with Valve's proprietary OS—could arrive with "Ryzen Z2 A" APUs onboard.

Last year, leakers posited that Xiaomi engineers were working on proprietary new-generation mobile chipset. The giant Chinese technology company has produced proprietary SoC designs in the past—most notably 2017's Pengpai/Surge S1 (blink, and you missed it)—but has largely relied on a wide swatch of Qualcomm solutions for deployment in smartphones. According to a fairly fresh ITHome news report (via a source at Sina Technology), Xiaomi has established a "chip platform department" under the umbrella of its mobile phone product development division. The exact nature of this newly-formed team remains semi-mysterious, and how it intermeshes with current (rumored) proprietary chip design efforts. The megacorporation's speculated "dedicated chip platform department" is said to be working on a "Xuanjie" SoC series.

Qin Muyun—a former senior director of product marketing at Qualcomm—is purported to be the new department's leader. Insiders believe that Muyun will answer directly to Xiaomi's CEO: Lei Jun. Over the past half decade, company engineers have accumulated chip designing experience in multiple lesser technology fields—ITHome lists: "imaging, fast charging, power management, communication, and display" aspects. Xiaomi leadership could be "shaking up" its first-party SoC development projects. Two weeks ago, rumors turned up online regarding a node process downgrade—from 3 nm to 4 nm. Smartphone industry watchdogs reckon that Xiaomi's forthcoming flagship chipset design will perform on the level of Qualcomm's first generation Snapdragon 8 mobile processor (from 2021).

In a video interview conducted by KitGuru's Leo Waldock, a key Intel chip architect has confirmed that his team is working on the "great-grandchild" of "Lion Cove." Ori Lempel—Team Blue's Senior Principal Engineer in Core Design—did not reveal the codename for this distant technology, but industry moles have heard rumblings about "Griffin Cove" being the internal reference/nickname for this futuristic processor core architecture. Intel's current-gen "Lion Cove" core design has turned up within Core Ultra Series 2 "Arrow Lake" and "Lunar Lake" chips. Lempel disclosed a compelling tidbit; his department has finalized its next-gen "Cougar Cove" IP—destined to debut by the "second half of 2025," in Panther Lake mobile processors.

The Team Blue Core Design division seems to be devising far out technologies—in the case of an alleged "Griffin Core" series, three generations ahead—with an eye on regaining ground from a main competitor: AMD. Industry watchdogs have gauged varying levels of Intel's struggles over the past couple of years; most notably in the field of mainstream desktop CPU solutions. As stated to KitGuru, Lempel revealed that his team's setup has evolved into a more advantageous position—namely in becoming "99% process node agnostic." Former company boss—Pat Gelsinger—was the main driver behind an "IDM 2.0 transformation." Lempel elaborated on this topic: "they can be hardened on any process node in terms, of you know, the libraries are there, the analogs are there. The design can synthesize to whichever process node. The optimization is process non-dependent. Because Intel/TSMC processes are all different..."

Earlier in the week, AMD's unannounced Radeon RX 9060 XT graphics card design was linked to a possible public announcement at this year's edition of Computex. Naturally, Team Red has missed an opportunity to take on Team Green with a parallel launch of rival products. Leaks have pointed to the existence of two Radeon RX 9060 XT variants; one with 16 GB of GDDR6 VRAM, and another with an 8 GB pool. The cheaper end of RDNA 4—including a mysterious Radeon RX 9050 model—seems to be geared up to take on NVIDIA's GeForce RTX 5060 Ti, RTX 5060 and RTX 5050 cards. Further rumors have emerged; following initial hints of a formal introduction at an important late Spring event.

Chiphell's chief reviewer and editor reckons that Radeon RX 9060 XT cards will arrive at retail in May. This Chinese PC hardware forum is a notorious source of leaks—around early January, participants were boasting about having extremely early access to Radeon RX 9070 XT samples. In response to this morning's relevant VideoCardz report, Hoang Anh Phu weighed in with a new prediction—AMD and board partners could launch Radeon RX 9060 XT products two weeks after an official reveal at Computex 2025. Team Red is likely mapping out a new pricing strategy, due to NVIDIA's launch of "cheaper than expected" new models. So far, brand-new GeForce RTX 5060 Ti options have received a largely lukewarm welcome. Another Chiphell member has picked up on regional whispers about "starter" price points (including VAT)—reports suggest that the: "(Radeon RX) 9060 XT 8 GB version is 3100 yuan (~$422 USD, and the 16 GB variant is 3500 yuan (~$476 USD)."

Rumors of a forthcoming "Elder Scrolls IV: Oblivion Remake" launch popped up online last month; as predicted by NatetheHate. The veteran leaker—of video games industry inside info—proposed a public unveiling; scheduled in at some point within a March to April window. Since then, data miners have combed through various web presences—including Virtuos' online site. Going back to 2021, leaks suggested that this Chinese contract development house was deeply involved in the reimagining/modernizing of Bethesda's 2006 smash-hit.

Yesterday, Giant Bomb's Jeff Grubb posited that a formal introduction of the alleged "Elder Scrolls IV: Oblivion Remake" will happen "next week." Insiders reckon that the Unreal Engine 5-powered game will launch on "Xbox, PS5, PC, and Game Pass." Virtuos seems to be preparing itself for an imminent announcement; as evidenced by Elder Scrolls fans compiling leaked screenshots and promotional imagery within an Imgur album. Familiar locations and character designs are visible in gameplay captures. One visual "portfolio" grab compares the speculated new version to Bethesda's original build (2006 vs. 2025).

Sony and Microsoft seem to be involved in the development of handheld gaming consoles, but insiders reckon that respective next-generation offerings will not directly compete with each other. Xbox and ASUS have signalled some sort of collaborative ROG Alloy-esque device; potentially releasing later on in 2025. Whispers of a futuristic PlayStation portable model's chipset design emerged mid-way through March; courtesy of Kepler_L2. The notorious leaker has recent history of reporting inside track knowledge of AMD CPU and GPU architectures/technologies. They alleged that Sony and Team Red's collaborative PS6 APU design project had reached a finalized stage of development, possibly around late 2024/early 2025. Returning to March/April events; Kepler_L2 theorized that a "PS6 Portable" would not be capable of surpassing PlayStation 5 (home console) level performance upon launch in 2028.

The mysterious handheld is said to be powered by a "15 W SoC" manufactured on a non-specific 3 nm node process. Elaborating further, they posit that PlayStation's rumored handheld is capable of running PS5 generation games—bandwidth and power restrictions could reduce resolution and frame rates below that of Sony's current-gen system. Kepler_L2 pictures "PS6 Portable" gaming performance being somewhere in-between Xbox Series S and PlayStation 5 (non-Pro). According to rumors, the handheld's chipset is not related or derived from the PS6 home console's internal setup. Kepler_L2 envisioned a mobile SoC with fewer than 40 compute units (CUs)—several media outlets have added their interpretation of this data point; with a sub-36 count. PlayStation 5's GPU aspect consists of 36 CUs, while the Xbox Series S graphics solution makes do with 20 units. Sony's speculated return to portable territories will be welcomed by owners of older handheld models—namely the Vita and PSP. Famously, these portable products struggled to keep up with competing Nintendo devices.

AMD has not publicly announced its Radeon RX 9060 XT 16 GB and 8 GB graphics cards, but board partners have inadvertently "revealed" the existence of forthcoming custom designs. Team Red's RDNA 4 kick-off events did tease a second quarter launch of a Radeon RX 9060 Series cards, but have remained coy since the conclusion of late February celebrations. Over a month ago, VideoCardz cited AIB insider knowledge—regarding early specification details. In this morning's follow-up report, unnamed board partner moles have theorized a possible public unveiling of Radeon RX 9060 XT models: at next month's Computex 2025 trade show. Industry watchdogs believe that Team Red's lower end RDNA 4 are specced to compete closely with Team Green's GeForce RTX 5060 Ti lineup. NVIDIA and involved AIBs are reportedly gearing up for a retail launch this week.

The latest leak suggests AMD's Radeon RX 9060 XT design being readied—as standard—with (reference) game clock frequencies set at 2620 MHz, and boost clocks going up to 3230 MHz. In addition, VideoCardz has heard mutterings about "overclocked variants" boosting up to the 3.3 GHz mark. The much-rumored Navi 44 GPU die could sport 2048 stream processors—half of Navi 48's full SP count. Prior to this week, TechPowerUp's GPU database entry indicated the utilization of a speculative "Navi 48 LE" unit. Now amended, the Radeon RX 9060 XT listing mentions a tentative "Navi 44 XT" variant. Leaked guideline info allegedly specifies 500 W power supplies, as minimum requirements for incoming cards. A 550 W base level could be advised for overclocked/overengineered models. VideoCardz did not see any 16-pin power connected SKUs within leaked material; "most specs" feature 8-pin power connectors.

Over a year ago, hardcore overclocking fanatics celebrated MSI's resurrection of the much missed MPOWER motherboard product line. After a seven-year hiatus, the Taiwanese manufacturer revived this series—beginning with a brand-new Z790MPOWER option. Back then, an exclusive Wccftech news report put a spotlight on the (then) brand-new model's support of Intel Core 12th, 13th, and 14th Gen processors (on LGA 1700/1800). Returning to the present day, MSI seems to be prepping a new MPOWER motherboard model—leaked shots imply a return to an old school color theme (black/yellow, rather than metallic tones). Wccftech has uploaded two close-up teaser images, from a "brief glimpse" preview session. There is evidence of AI upscaling here—despite the presence of anomalies/aberrations, we can see MSI logo and MPOWER branding on attached heatsinks.

Wccftech believes that the proposed "MSI MPOWER AMD series" will be: "a strong and cost-effective design for overclockers. The previous Z790 MPOWER motherboard brought great OC capabilities in an affordable design, offering 8000 MT/s DDR5 support and the new design will be no exception...Starting with the details, the...motherboard will feature an AM5 socket and is likely to leverage the B850E chipset. The new MPOWER motherboard also comes with a microATX form factor." Like last year's edition, MSI has readied the board with two DDR5 DIMM slots—ideal for ardent memory overclocking enthusiasts. This twin-stick setup reportedly supports up to 128 GB capacities. An extra bit of real estate is freed up; thus granting room for an additional M.2 bay. Wccftech did not disclose every tidbit of insider info, but they have hinted about the board's prowess: "it's awesome that we are finally getting an MPOWER motherboard from MSI for AM5 builders. The MPOWER series is great for overclocking and this motherboard should be just as good. We also managed to get information regarding the OC capabilities which are going to rival some of the high-end AM5 offerings as far as memory tuning is concerned."

Over the years, we have witnessed plenty of product leaks via webpages that went live well before they were supposed to. Something similar appears to have happened with Lenovo's Malaysian site, granting us a glimpse at the upcoming ThinkPad P14s Gen 6 powered by up to the full-fat 12-core Ryzen AI 9 HX 370 APU. The leaked product specifications, as listed below, reveal that the P14s will support up to a whopping 96 GB of DDR5-5600 memory, although only with the lower-end Ryzen AI 7 PRO 350 and Ryzen AI 5 PRO 340 variants.

Compared to the previous edition ThinkPad P14s with AMD's Ryzen 7 8840HS APU, the highest-end variant with the Ryzen AI 9 HX 370 will undoubtedly be substantially faster in both single and multicore performance. The Radeon 890M iGPU will also handily outperform the 780M, although the difference is unlikely to be earth-shattering. Like its predecessor, the Gen 6 will continue being available with a 2.8K 120 Hz OLED display, with a higher peak brightness of 500 nits and 100% coverage of the DCI-P3 color gamut. The port selection, as can be expected from a ThinkPad, is plenty admirable, packing dual Thunderbolt 4 (with DisplayPort 1.4), HDMI 2.1, Ethernet, dual USB-A, optional nano sim and smart card reader, as well as a headphone jack.

Last week, PowerColor introduced a Spectral White spin-off of its flagship Red Devil Radeon RX 9070 XT Limited Edition model. According to fresh inside track info, the Taiwanese manufacturer is preparing yet another premium level RDNA 4 option. VideoCardz has detected whispers regarding a speculated "Red Devil Radeon RX 9070 XT Backplate Edition" product; the online publication has a history of sourcing pre-launch details from board partner industry moles.

PowerColor's older Red Devil graphics card products can be customized with swappable backplates—Devil Skin designs are identified as "Intrusive" and "Generative." VideoCardz believes that the alleged "Backplate Edition" card will be based on the brand's regular Red Devil RX 9070 XT model. It is not clear whether this special edition package will be bundled with successors to the two RX 7000 Series-only Devil Skin attachments, but insiders have indicated a current "in production" status of "Backplate Edition" cards.

Late last week, the Chinese ASUS branch started to tease a forthcoming ROG and TUF Gaming x Hatsune Miku collection. Eagle-eyed PC gaming hardware watchdogs spotted an intriguing custom GeForce RTX 5060 Ti 8 GB graphics card model within a messy pile of colorful brand-new products. The manufacturer has teamed up with Crypton Future Media; this collaboration is advertised as bringing "a cybernetic fusion to gaming." Initial announcements focused on peripherals, but shortly thereafter the partners unveiled a Hatsune Miku-themed pre-built system. VideoCardz spent its weekend investigating the mysterious new "RTX 5060 Ti O8G" design. A follow-up article pulled information and imagery from Tony Wu's "world premiere" bilibili video—the general manager of ASUS China showcased various upcoming products, including a relevant white triple-fan graphics card.

According to reports, Wu did not disclose an exact model name—NVIDIA and board partners are expected to make new entrants "official" at some point this week. Wu's demonstration unit was visually matched up to the teased "RTX 5060 Ti O8G" card. Additionally, Wu and colleagues presented the entire Hatsune Miku product line during a major press conference; last Saturday (April 12) in Changsha. Many items have already launched to market, through JD.com. Naturally, pricing and availability details were not mentioned during their "GeForce RTX 5060 Ti 8 GB OC" segment. The factory overclocked "RTX 50-series" card's unique white design is outfitted with a single 8-pin power connector; suggesting a tentative entry level price bracket. The backplate is decorated with mascot illustrations—TechPowerUp and other media outlets have noticed an uptick in "cute girl" drawings turning up on housings and retail packaging. ZOTAC joined in on the fun very recently; as reported last week.

Earlier in the month, keen observers of Team Red activities were taken aback by whispers of a mysterious Radeon RX 9070 GRE GPU. Up until then, many assumed that AMD's engineering team was readying Radeon RX 9060 Series cards for launch in Q2'25. A source in China claimed that the next wave of RDNA 4 would arrive in the shape of a not-yet-official "Great Radeon Edition" (GRE) design; allegedly derived from Team Red's Navi 48 GPU die. Certain groups of skeptics have questioned the validity of this leak; many believe that the speculated Radeon RX 9060 XT model will launch ahead of a rumored GRE sibling.

Late last week, TechPowerUp's GPU-Z utility was updated to version 2.65.0 form—supported hardware lists were populated with several new additions. As highlighted by VideoCardz, the presence of Radeon RX 9070 GRE and NVIDIA GeForce RTX 5060 Ti 16 GB GPUs points to potential imminent releases. In the case of Team Green, lower end "Blackwell" graphics cards are launching this week—as disclosed by insiders. AMD's Radeon RX 9070 GRE 12 GB card is expected to release as a Chinese market exclusive; possibly as a substitute for "difficult to acquire" Radeon RX 9070 16 GB (non-XT) AIB products.

Mid-way through last week, a list of supposed MSI GeForce RTX 5060 Ti 16 GB custom graphic card model names appeared online. Days later, VideoCardz followed up with visual confirmation—covering unannounced INSPIRE and GAMING SKUs. MSI's full lineup of brand-new offerings is expected to be unveiled this week, but the online publication has managed to source pre-launch promo shots from an undisclosed outlet. Previews of retail packaging are absent, but the uploaded images of isolated hardware products look legitimate.

As leaked last week, the board partner's—likely entry level—GeForce RTX 5060 Ti 16G INSPIRE 2X OC model has turned up with a new dual-fan design. TechPowerUp inspected MSI's freshly debuted INSPIRE 3X cards at CES 2025. The manufacturer has gradually populated its custom GeForce RTX 50-series product stack with triple-fan options—the most recent being their GeForce RTX 5070 SKU. The smallest INSPIRE card design seems to feature a single 8-pin power connector—prior to last week, VideoCardz had heard rumors from AIB industry moles about this curious provision. By best guesstimation, the INSPIRE 2X design seems to be 2.3-slots thick. As expected, MSI has outfitted this model with three DisplayPorts (1.2b) and one HDMI (2.1b) port.

According to the latest South Korean semiconductor industry whispers, Samsung's 2 nm GAA node process (aka SF2) development team has hit another pleasing experimental production milestone. An Asia Economy SK news article has sourced insights from inside track players—one unnamed mole posited that: "the 2 nm yield currently under development at Samsung Foundry is much better than previously known...and more positive than the (reportedly abandoned) 3 nm process." A combination of relatively new leadership and a rumored welcoming of first wave High-NA EUV equipment has likely bolstered next-gen efforts, after late 2024's alleged failure of 3 nm prototypes. Leaks from earlier in 2025 indicated SF2 test yields wavering around 20-30%; far from ideal—back then, insider reports suggested that TSMC was well on the way to achieving 60% rates with a competing 2 nm product line. Asia Economy has picked up on mutterings about Samsung's current progress—latest outputs: "have exceeded 40% in the wafer testing stage at a post-processing company."

Industry watchdogs reckon that the South Korean's foundry business is making good progress; perhaps on track to commence speculated mass production by the third quarter of this year—just in time to get finalized flagship "Exynos 2600" mobile chips in the manufacturing pipeline. The Taiwanese rumor mill indicated a major milestone "completion" of TSMC's 2 nm trial phase at some point last month—insiders mentioned excellent yield rates: in the region of 70-80%. Cross-facility mass production could start later this year, but experts propose that the market leader will be implementing price hikes. These "elevated charges" could send loyal TSMC customers in the direction of an alternate source of 2 nm wafers: Samsung. Fresh semicon biz gossip has the likes of Apple, AMD and NVIDIA in the picture.