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NVIDIA GeForce GTX 1050 Series Pricing Could Surprise

According to a press-deck slide leaked by VideoCardz, NVIDIA could surprise with pricing of its GeForce GTX 1050 and GTX 1050 Ti graphics cards. The GTX 1050 could be offered at $109, cheaper than the previously-rumored $119; while the faster and better-endowed GTX 1050 Ti could be offered at $139, cheaper than the $149 price-tag touted in older articles. Both SKUs, as previously reported, could be available from 25th October, 2016. The leaked slide also confirms specifications of the GTX 1050 to include 640 CUDA cores, and 2 GB of GDDR5 memory, while the GTX 1050 Ti will feature 768 CUDA cores, and double the memory amount, at 4 GB.

Source: VideoCardz

Intel 8000p - The First Consumer-Grade 3D Xpoint Products

The Intel-Micron joint collaboration in the development of what is promised to be the next step in storage technology is inching ever closer to reality. According to Bench Life, which published a leaked specifications list for the upcoming Intel Optane Memory products, the first application for consumer-grade 3D XPoint technology straddles the line between an SSD and system RAM. Intel calls it a "System Accelerator" solution, and it's meant to operate as an intermediate caching solution between a system's RAM and storage. Codenamed "Stony Beach", Intel's 8000p (and entire 3D XPoint-based products) support is still up in the air, but it's expected that only Kaby Lake and subsequent platforms will be compatible with the technology - which, if true, is sure to limit the product's market penetration.

The consumer products will initially sport capacities of either 16GB or 32GB, leveraging the NVMe protocol at PCIe Gen 3.0 x2 bandwidth in the M.2 form-factor. Mirroring NAND technology, the greater capacity solution will sport the highest performance: with the 16GB part coming in at 1400 MB/s read and 300 MB/s write speeds, against the 32 GB's 1600 MB/s and 400 MB/s, respectively. We see similar results in regards to IOPS, with the 16GB solution offering up to 285,000 read and 70,000 write operations per second, against the 32 GB's solution respective 300,000 read and 120,000 write. As usual with new technologies, expect all these metrics to only go up in time.

NVIDIA GeForce GTX 1060 Reference Board Design and Clocks Confirmed

A leaked slide from NVIDIA press-deck for the imminent launch of the GeForce GTX 1060 confirmed the reference board design, which first surfaced in Hong Kong. The slide also reveals clock speeds, and other key specs of the card. While it doesn't reveal the GPU nominal clocks, it mentions that the GPU Boost frequency will be set as high as 1.70 GHz. The memory is clocked at 8 Gbps, which over the GPU's 192-bit GDDR5 interface, puts out 192 GB/s of memory bandwidth.

The chip features 1,280 CUDA cores based on the "Pascal" architecture. The card draws power from a single 6-pin PCIe power connector, its TDP is rated even lower than that of the AMD Radeon RX 480, at 120W (vs. 150W of the RX 480). NVIDIA has been making huge (and successful) performance claims for its "Pascal" GPUs so far. The GTX 1060 is claimed to be faster than the GeForce GTX 980 from the previous generation, and "much faster" than the RX 480, which means that NVIDIA intends to price this card competitively to the RX 480.

Source: VideoCardz

Intel Xeon "Broadwell-EP" Launch by Month's End?

According to a leaked company slide doing rounds on the web, Intel plans to launch its workstation-grade Xeon "Broadwell-EP" processors by March 31, 2016. These chips will be branded under the Xeon E5-2600 V4 series. HP is ready with a workstation based on these chips, the HP Z640, which succeeds the Z620 that's driven by "Haswell-EP" Xeon chips. Dollar-for-Dollar, Intel is positioning the "Broadwell-EP" to offer at least "20% more cores and last-level cache" than "Haswell-EP."

This would mean Intel leveraging the 14 nm process to cram 10-core chips at the price of an 8-core chip from the previous generation, 8-core chips at the price of 6-core ones, and so on. The same slide mentions that "Broadwell-EP" offers, on average, 18% more performance than "Haswell-EP." Intel is also hinting at native support for DDR4-2400 MHz. Haswell-EP supports DDR4-2133 MHz.

Source: AnandTech Forums

MSI GeForce GTX 980 Ti Lightning Pictured

Ahead of its launch, press-shots of the upcoming flagship graphics card of MSI, the OC-series GeForce GTX 980 Ti Lightning, leaked to the web. The pictures reveal a card that MSI threw all its engineering expertise into. It retains the yellow+black design scheme of its predecessors, and is characterized by an even larger Tri-Frozr triple-fan cooling solution. The cooler consists of a large nickel-plated copper base, from which five 8-10 mm thick heat pipes make their way to two dense aluminium fin-stacks, ventilated by a trio of 100 mm spinners.

The cooler only makes up part of this product, a bigger chunk of engineering went into its custom-design 10-layer PCB, with a 15-phase VRM that draws power from a combination of one 6-pin and two 8-pin PCIe power connectors, and a plethora of overclocker-friendly features such as voltage measurement points, dual-BIOS with an LN2-friendly secondary BIOS, the ability to control speeds of individual fans, and more. The MSI GTX 980 Ti ships with a factory-overclock of 1203 MHz core, 1303 MHz GPU Boost, and 7.10 GHz (GDDR5-effective) memory; which certainly isn't the highest factory-OC out of the box, but this is probably MSI's way of inviting users to overclock it to Kingdom come.

Source: VideoCardz

ASUS Readies Radeon R9 Fury STRIX

Here are some of the first pictures of ASUS Radeon R9 Fury STRIX, detailed in no less than AMD's own [leaked] press-deck for the R9 Fury. It appears that only two AIB partners are going to launch the R9 Fury for whatever reason. These are the Sapphire, with its R9 Fury Tri-X card, and ASUS, with its R9 Fury STRIX. ASUS' card features the same new-generation triple-fan DirectCU III cooling solution that made its debut with the GTX 980 Ti STRIX, and is featured on the R9 390X STRIX. This cooler is mated to what appears to be the first custom-design PCB for AMD's "Fiji" silicon (Sapphire's card uses the reference AMD PCB carried over from the R9 Fury X). This card is firmly in the 30 cm-ish territory. Its display output configuration includes a DVI connector, apart from three DisplayPorts, and an HDMI connector. The cooler offers 0 dBA idle. AMD claims that the R9 Fury will offer higher performance than the GeForce GTX 980, and is hence expected to be priced in that range.

Source: Eteknix

AMD Radeon R9 370 Reference Design Board Pictured

Alienware leaked the first images of AMD's upcoming Radeon R9 370 graphics card and R9 390M GPU. The card's design looks a lot like the liquid-cooled Fiji-XT "Radeon Fury" board that's being pictured around these days. If the picture Alienware is from AMD, then it's safe to assume that both the R9 370, and the R9 390M will be based on the 28 nm Curaçao silicon. The only major change here, will be the standard memory amount, which has been bumped to 4 GB from 2 GB, thanks to the 4 Gbit GDDR5 chips that are becoming commonplace. AMD is expected to launch these cards a little later this month. The Curaçao silicon features 1,280 GCN stream processors, 80 TMUs, 32 ROPs, and a 256-bit wide GDDR5 memory interface.

AMD Fiji XT Pictured Some More

In the latest picture leaked of AMD's upcoming flagship graphics card, codenamed "Fiji-XT," we get a final confirmation of the reference-design card's length, particularly its short PCB. Since this card uses a factory-fitted AIO liquid cooling solution, and since the Fiji XT package is effectively smaller than that of Hawaii, with the surrounding memory chips gone (moved to the GPU package as HBM stacks), the PCB is extremely compact, with just the GPU package, and its VRM. Speaking of which, the card draws power from a pair of 8-pin PCIe power connectors. The coolant tubes stick out from the rear of the card, making their way to a 120 x 120 mm radiator, with a single included 120 mm PWM fan. With this card, AMD is doing away with DVI altogether. Connectors will be a mixture of DisplayPort 1.2a and HDMI 2.0.

AMD "Zen" CPU Core Block Diagram Surfaces

As a quick follow up to our older report on AMD's upcoming "Zen" CPU core micro-architecture being a reversion to the monolithic core design, and a departure from its "Bulldozer" multicore module design which isn't exactly flying off the shelves, a leaked company slide provides us the first glimpse into the core design. Zen looks a lot like "Stars," the core design AMD launched with its Phenom series, except it has a lot more muscle, and one could see significant IPC improvements over the current architecture.

To begin with, Zen features monolithic fetch and decode units. On Bulldozer, two cores inside a module featured dedicated decode and integer units with shared floating-point units. On Zen, there's a monolithic decode unit, and single integer and floating points. The integer unit has 6 pipelines, compared to 4 per core on Bulldozer. The floating point unit has two large 256-bit FMAC (fused-multiply accumulate) units, compared to two 128-bit ones on Bulldozer. The core has a dedicated 512 KB L2 cache. This may be much smaller than the 2 MB per module on Bulldozer, but also indicate that the core is able to push through things fast enough to not need cushioning by a cache (much like Intel's Haswell architecture featuring just 256 KB per core). In a typical multi-core Zen chip, the cores will converge at a large last-level cache, which routes data between them to the processor's uncore, which will feature a DDR4 IMC and a PCI-Express 3.0 root complex.
Source: Planet3DNow, Many Thanks to qubit for the tip.

Intel Core i7-5820K Features Fewer PCI-Express Lanes After All

It turns out that our older report suggesting that the most affordable of Intel's new Core i7 "Haswell-E" HEDT processors will feature a slimmer PCI-Express root complex, even if it gives you 6 cores at a [hopefully] sub-$400 price-point, holds true, after all. Intel's wacky approach to its latest HEDT processor lineup was confirmed by leaked manuals of Gigabyte's socket LGA2011-3 motherboards, based on the Intel X99 Express chipset. The manual confirms that while Intel's $500-$750 Core i7-5930K and >$1,000 Core i7-4960X offer bigger 40-lane PCI-Express Gen 3.0 root complexes; the Core i7-5820K features a narrower 28-lane one. This means that multi-GPU configurations on systems running the chip won't be too different from those on LGA1150 "Haswell" platforms.

On motherboards with, say, three PCI-Express 3.0 x16 slots, the i7-5930K and i7-5960X will let you run two slots at full x16 bandwidth, and a third slot at x8. On systems with the i7-5820K, the second slot won't go beyond x8, and the third one will cap out at x4. On boards with four slots, one of them will run out of bandwidth. The trade-off for this narrower PCI-Express interface is the fact that you're getting six "Haswell" cores, twelve logical CPUs enabled with HyperThreading, about 12 MB of L3 cache, and a quad-channel DDR4 memory interface, at a price-point not too far off from the Core i7-4790K. So for enthusiasts with no more than two high-end graphics cards, the i7-5820K could provide an attractive gateway option to Intel's new HEDT platform. You can find the leaked manuals in this thread.

HIS Radeon R9 285 Smiles for the Camera

Here are the first pictures a HIS branded Radeon R9 285, the third in a series of leaked press-shots of cards based on AMD's new performance-segment GPU, designed to take on NVIDIA's bestselling GeForce GTX 760 in not just performance, but also energy-efficiency. The card is based on a new ASIC, codenamed "Tonga," which is rumored to feature a stream processor count identical to one of the variants of "Tahiti," and a 256-bit wide GDDR5 memory interface, holding 2 GB of memory. HIS' card features a compact variant of the company's IceQ X² cooling solution. Its pictures also reveal that the R9 285 "Tonga" will feature XDMA CrossFire, much like the R9 290 series.

Source: VideoCardz

Core i7 "Haswell-E" HEDT Platform Launch Date Revealed

Intel Core i7 "Haswell-E" HEDT (high-end desktop) processors, along with compatible motherboards based on the Intel X99 Express chipset, are expected to launch on September 14, 2014, according to a leaked Intel supply chain document scored by VR-Zone. The Core i7 "Haswell-E" series succeeds current Core i7 "Ivy Bridge-E," and its compatible X79 Express chipset. The new chips will be built in the new LGA2011-3 package (incompatible with current LGA2011), and will be the first client desktop platform to support the new DDR4 system memory standard. The series will include three parts, the six-core Core i7-5820K and i7-4930K; and the eight-core i7-5960X. The three are detailed in our older article, here.

Sources: VR-Zone, Expreview

Inno3D GeForce GT 740 iChill Pictured, Tested

Here are some of the first pictures of an Inno3D branded GeForce GT 740 graphics card, the GT 740 iChill. Based on a custom-design PCB, the card features a strong VRM (by GK107 requirements), which draws power from a 6-pin PCIe power connector. It features 1 GB of GDDR5 memory, across a 128-bit wide memory interface. Confirming that the GT 740 is based on the GK107, the marketing poster leaked to the web reads its ASIC string to be "GK107-425." It's configured with 384 CUDA cores, 32 TMUs, and 16 ROPs. The GPU is clocked at 1100 MHz (a factory-overclock), while the memory runs at 5.20 GHz (GDDR5-effective).

Cooling the 65W TDP GPU is a similarly overkill iChill HerculeZ 2000 cooler, designed in-house by Inno3D, which uses a dense aluminium fin-stack, to which heat drawn from the GPU, is fed by a pair of 8 mm-thick copper heat pipes, and ventilated by a pair of 100 mm fans. The cooler shroud on which the fans are suspended, can be detached, by simply removing six thumb-screws, letting you clean the heatsink underneath, which has been a USP of Inno3D's cooling solutions. Inno3D also put out its own performance numbers for the card, in which it claims the GT 740 iChill to be faster than previous generation GTX 650 (they're both based on the same chip).
Performance graphs follow.

Next-Gen Intel "Alpine Ridge" Thunderbolt Controller Detailed

Intel's upcoming Thunderbolt host controller, codenamed "Alpine Ridge," could allow you to play God with several uncompressed Ultra HD video streams during production, if its leaked specifications hold up. The controller leverages PCI-Express gen 3.0 to double bandwidth of the interface. It will launch around the same time as Intel's next-generation Core "Skylake" processors (some time in 2015), and in a typical implementation, will be wired to the CPU's root-complex, and not that of the PCH. With PCIe 3.0 x4 or PCIe 3.0 x2 links at its disposal, the controller can push data at a staggering 40 Gbps. The link can also ferry DisplayPort, HDMI 2.0, and USB 3.0 data through its link layer. That bandwidth should enable you to plug in up to two Ultra HD displays, apart from your storage array.

The Thunderbolt connector itself will undergo a change with the arrival of Alpine Ridge. It will be slimmer (shorter) than the current connector, at 3 mm (good for Ultrabooks), and there will be adapters for backwards compatibility with older-generation Thunderbolt devices. The connector will be designed to supply up to 100W of power, so Ultrabooks based on it will do away with round DC jacks, and charge up much like tablets and smartphones do. That amount of power should also enable single-cable HDD docks and RAID boxes. There will be two main variants of Alpine Ridge, one that supports two ports over daisy-chaining, and one that supports just a single port.

Source: VR-Zone

2014 Intel Solid State Drives Detailed in Leaked Slides

According to some newly-leaked slides, Intel is planning quite a solid state drive release spree for the second quarter of 2014, one that will see the introduction of three storage solutions - the SSD Pro 2500 Series (codename Temple Star), SSD DC P3500 Series (Pleasantdale) and SSD DC P3700 Series (Fultondale). All three SSD families are going to utilize 20 nm MLC NAND Flash memory, will be available in two form factors and will be backed by a five-year warranty.

$450 Pricing Looking Increasingly Likely for Radeon R9 290

MSRP (before taxes) pricing of AMD's upcoming Radeon R9 290 (non-X) being around $450 is looking increasingly likely. In a string of reports that Japanese publication Hermitage Akihabara published ahead of launches of the R9 290X and the R9 290, in which the publication talked about pricing in the country, a price difference of roughly 18 percent is emerging between the two. Applying that to the $549.99 MSRP of the R9 290X stateside, one can derive a $450 pricing for the R9 290. Granted, local taxation may greatly vary between Japan and other markets, affecting the end-user price, but pre-tax MSRPs can be consistent.

The Radeon R9 290 is expected to launch on the 5th of November, 2013. Based on the same "Hawaii" silicon as the Radeon R9 290X, it features 2,560 Graphics CoreNext stream processors, 160 TMUs, 64 ROPs, and a 512-bit wide GDDR5 memory interface, holding 4 GB of memory. Its core is clocked around 948 MHz, and memory at 5.00 GHz.

Radeon R9 290 Performance Figures Leaked, Beats GTX 780

If these performance numbers posted by credible reviewers at OCUK hold up, then AMD could have a second, more affordable graphics card for you, which outperforms NVIDIA's GeForce GTX 780, at least in synthetic benchmarks. In a brief performance run that spans synthetic tests, which included Unigine Heaven 3.0 at 1080p and 1440p resolutions, with normal level of tessellation; 3DMark 11 (performance preset) and 3DMark Fire Strike (both Normal and Extreme); the card we believe to be R9 290 (name blurred out in the graphs) is consistently faster than the GeForce GTX 780 reference, in the same bench.

Based on the same 28 nm "Hawaii" silicon as the Radeon R9 290X, the R9 290 is its more affordable sibling, featuring 2,560 Graphics CoreNext stream processors, 160 TMUs, 64 ROPs, and a 512-bit wide GDDR5 memory interface, holding 4 GB of memory. It features clock speeds of 947 MHz (core), and 5.00 GHz (memory, GDDR5-effective). There's no word on pricing, but it could be available from the 31st of October, 2013.

Source: Overclockers UK (OCUK)

AMD "Hawaii" Press Sample Boxes Surface

Some time in late September, the 25th to be precise, AMD is flying the press at large over to Hawaii, to unveil its "Volcanic Islands" GPU family, with its flagship part, codenamed "Hawaii." This chip is expected to succeed "Tahiti," on which AMD's top-end Radeon HD 7900 series is based. An poster on ChipHell forums leaked these pictures of a press-package of AMD's flagship Hawaii-based graphics card, which has things going both for and against its credibility.

To begin with, the picture shows an audio CD-type jewel case holding Battlefield 4. Given that the game won't launch until late-October, we find it implausible that its release DVDs will be ready a month in advance. There's also a graphic printed on the box that shows the shore of a volcanic island (where magma meets the ocean) in the background, and an AMD logo in the foreground. The thread also contains a few alleged x-ray shots from a different poster, but we're pretty sure that they're of a motherboard. Nice try.
Sources: ChipHell forums, Expreview

NVIDIA GeForce GTX 760 Specifications Disclosed

The information was sourced and publicized by the crew on Tuesday, confirming some previous leaks and refuting others. The new GeForce GTX 760 employs the same reference design NVIDIA used for its previous generation cards (GTX 670, GTX 660 Ti, GTX 660 and GTX 650 Ti) and is designed to replace the GTX 660 Ti in NVIDIA's current lineup. The card employs a cut down version of the GK 104 GPU, with 1152 CUDA Cores, 96 TMUs and 32 ROPs. With a base clock of 980 Mhz and a boost value of 53 MHz, for a maximum out of the box frequency of 1033 MHz, the new card supports GPU Boost 2.0 which is a temperature controlled feature (the cooler the chip the higher the clocks). Stock memory size will be 2 GB and reference memory clocks were set at 1502 MHz, for a slightly over 6 Ghz effective speed. A 256-bit wide memory bus is employed to offer 192 GB/s of memory bandwidth at stock clocks. TDP is set at 170W for the new card, requiring two 6-pin PCIe connectors

Also relevant to the topic is another piece of information unveiled along with the above mentioned specifications, the fact that the GeForce GTX 760 will complete NVIDIA's portfolio for the coming months. NVIDIA presumably awaiting AMD's move before launching any more GeForce products of its own. AMD, in turn, being expected to bring out the Radeon HD 8000 Sea Islands cards in September.

NVIDIA GeForce GTX 760 Specifications Redux

There are many theories doing rounds about the specifications of NVIDIA's upcoming performance-segment GPU, the GeForce GTX 760. One states that it's largely similar to the GeForce GTX 660 Ti from previous-generation, with higher clock speeds, possibly 7.00 GHz memory, and GPU Boost; while another suggests a completely new core-configuration. According to a GPU-Z screenshot leaked by a ChipHell community member, NVIDIA is attempting to give the GeForce GTX 660 a successor, rather than merely retrofitting the GTX 660 Ti.

According to leaks that surfaced on ChipHell, NVIDIA is configuring a GK104 GPU with just three out of four GPC (graphics processing clusters) enabled, while keeping the memory and raster operations untouched. This approach would give the chip 1,152 CUDA cores, 96 TMUs, 32 ROPs, and a 256-bit wide GDDR5 memory interface. The card in the GPU-Z screenshot features 1072 MHz core, 1111 MHz GPU Boost, and 7.00 GHz memory.

Intel's Desktop Processor Roadmap for H2 2013 to H1 2014 Revealed

According to CPU World staff, who, by appealing to an unnamed secondary source, managed to confirm the validity of an earlier leak, we are now looking at Intel's desktop roadmap for the following twelve months. The slides reveal the Q3 launch of Intel's Ivy Bridge-E chips, the Core i7-4820K, i7-4930K and i7-4960X comprising the lineup. The new Extreme chips will make use of the existing X79 platform. Also in Q3 the Premium line will receive a new product, the Core i7-4771, which we do not know in what way differs from the currently available Core i7-4770, but a judicious appeal to wild speculation could point out an upgraded IGP.

The mid segments will get a platform upgrade in the form of a new H81 chipset, and six new processors, the Core i3-4130, i3-4330, i3-4340, as well as three new Ivy Bridge based Pentium chips, the G3220, G3420 and G3430. Celeron processors are in the pipelines for Q1 2014, while Q2 will follow with the Haswell refresh and the accompanying new platform based on the Z97 and H97 chipsets.

Source: CPU World

AMD's Answer to GeForce GTX 700 Series: Volcanic Islands

GPU buyers can breathe a huge sigh of relief that AMD isn't fixated with next-generation game consoles, and that its late-2013 launch of its next GPU generation is with good reason. The company is building a new GPU micro-architecture from the ground up. Codenamed "Volcanic Islands," with members codenamed after famous islands along the Pacific Ring of Fire, the new GPU family sees AMD rearranging component-hierarchy within the GPU, in a big way.

Over the past three GPU generations that used VLIW5, VLIW4, and Graphics CoreNext SIMD architectures, the component hierarchy was essentially untouched. According to an early block-diagram of one of the GPUs in the series, codenamed "Hawaii," AMD will designate parallel and serial computing units. Serial cores based on either of the two architectures AMD is licensed to use (x86 and ARM), could handle part of the graphics processing load. The stream processors of today make up the GPU's parallel processing machinery.

Corsair Obsidian 350D M-ATX Chassis Pictured

In addition to its latest flagship Obsidian 900D chassis, Corsair plans to launch a new premium micro-ATX gaming PC case this season, the Obsidian 350D (model: CC-9011029-WW). It posed for pictures at various retailers, and some of its press-shots were leaked to the web. Reportedly measuring 450 x 210 x 440 mm, the case will retain the solid matte steel construction with a brushed aluminium front, and a large side acrylic window. Its front-panel features two 5.25-inch drive bays, a pair of USB 3.0 ports, and HD audio jacks.

Internally, the Obsidian 350D doesn't feature any drive cages that can go on to obstruct long graphics cards. Instead, it features two 3.5-inch bays towards its bottom, and what appear to be three 2.5-inch bays towards the top portion, with a gap in between. Ventilation includes two 140 mm fan vents on the top, to which radiators can be latched on to (one 140 mm spinner included), and a rear 120 mm fan (included). The Obsidian 350D should be released some time towards late-April or early-May.

Leaked Slides Reveal Details on Intel Atom 'Bay Trail-T' Platform

As confirmed by some freshly-leaked slides, 2014 will see Intel bring some new guns to the fight with ARM, including Bay Trail-T, the successor of Clover Trail and the first Atom platform to take advantage of the 22 nm manufacturing process.

The star of Bay Trail-T is the Valleyview SoC which will feature four (out-of-order) Silvermont cores clocked at up to 2.1 GHz (delivering up to 60% higher performance than the Clover Trail chip), a two-channel LPDDR3 memory controller, an upgraded video decoder, support for resolutions up to 2560 x 1600 pixels, and a new GPU boasting DirectX 11 capabilities and offering up to a 3x performance boost over Clover Trail.

Devices based on Bay Trail-T are expected to have a standby battery life of 20 days and would last for 11 hours of continuous video playback, before needing to be charged.

Source: Mobile Geeks

Haswell-ULT Processors Could Use 24 MHz BClk, New C-States, and MCM to Cut Power Draw

Going into 2013, Intel's tough balancing act between keeping a low power/thermal envelope, and advancing performance, all while staying on the 22 nm silicon fab process, will be care of its Core "Haswell-ULT" processor. The chip will feature some radical changes to traditional Intel processor design, which will help it achieve its design goals. According to a deck of leaked slides scored by Expreview, Intel plans to use additional C-states that drop the processor's base clock, and redesign the processor package to accommodate the PCH silicon, reducing the board footprint.

To begin with, Haswell-ULT will be designed to support 24 MHz base clock speed, which running in "deep" energy-saving idle states. Modern processors with FSB replacement interconnect technologies such as QuickPath Interconnect and HyperTransport need a base clock to time other components on the processor, and for low-level communications, while a bulk of the data is transported by the primary interconnect. Intel found a way to turn off the 100 MHz base clock signal (which is also used to time the PCI-Express root complex and integrated graphics core), and replace it with a 24 MHz clock, when the processor is idling. As the processor returns to lower (more active) C-states, the 100 MHz base clock is reapplied. The 24 MHz base clock is activated by three new power states, C8, C9, and C10, introduced by Haswell-ULT. The third slide below details what happens to the various components in the new C-states.
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