Another Ryzen 7 7800X3D has reportedly swollen and burned, while also damaging the ROG Crosshair X670E Hero motherboard in the process. UNIKO's Hardware flagged the case, citing a video posted to Bilibili as the original source. The video shows a Ryzen 7 7800X3D CPU with clear swelling on the underside where it made contact with the CPU socket. There is discoloration on both the CPU and the socket itself. Moreover, the socket pins are warped and damaged in the middle, presumably due to the pressure of the swelling. One peculiar finding is that one of the notches on the CPU socket looks slightly off. Perhaps more importantly, the board's BIOS version wasn't confirmed, which is directly relevant due to AMD's proposed fix.

This kind of failure first showed up in April 2023, when several 7800X3D and 7950X3D chips bulged and took their sockets with them on X670E boards. AMD pinned it on SoC voltage running too high and rolled out AGESA firmware that capped it at 1.30V across AM5 motherboards. This new case might be straightforward if the BIOS hadn't been updated at all. However, even after the BIOS fix, the reports never fully stopped. Just weeks ago, a 7800X3D reportedly burned out on an MSI PRO X870-P WIFI board running the latest BIOS, with EXPO enabled and nothing else touched. We have even seen reports of Ryzen 7 9800X3D CPUs burning in the exact same manner. If you're running a 7800X3D, it's probably worth checking that you're on the latest BIOS and keeping an eye on SoC voltage.

Gigabyte Technology Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, today announced that its full lineup of DDR5 motherboards now supports CXSH (CXMT) chip-based memory, giving consumers more options and greater availability amid an ongoing industry-wide memory shortage. The BIOS optimization enables AM5 800/ 600 series motherboards to run CXSH (CXMT) chip-based memory stably at 8200 MT/s, while Intel 800/ 700 series platforms support CXSH (CXMT) chip-based memory out of the box.

Following AMD's release of AGESA 1.3.0.1c and Gigabyte's own memory optimization technology, AM5 motherboards across both the 800 series and 600 series now support CXSH (CXMT) chip-based memory, including 16 Gb and 24 Gb densities. With this update, Gigabyte AM5 motherboards can now stably run these DIMMs at speeds of up to 8200 MT/s, breaking the previous AM5 platform limitation and giving builders more performance headroom on AMD's platform. Meanwhile, Gigabyte's Intel 800 and 700 series motherboards already support CXSH (CXMT) chip-based memory through their current shipping BIOS, with no additional update required.

AMD backpedaled on its recent decision to remove Transparent Secure Memory Encryption (TSME) feature on its consumer Ryzen processors, which was typically enabled by default. The company had, in April, quietly disabled the feature for Ryzen consumer processors through an AGESA update encapsulated into motherboard firmware updates. The idea probably was to restrict TSME to Ryzen commercial-segment processors, sold under the Ryzen PRO brand, besides Ryzen Threadripper WX workstation processors, and EPYC server processors. For reference, Intel offers a similar feature, TME-MK (Total Memory Encryption-Multi-Key) on even its consumer Core processors, and not just its commercial Core vPro processors.

AMD said that it has decided to restore TSME "based on valuable community feedback," and end-users should expect UEFI firmware updates that restore the feature starting next month (July 2026). TSME is a hardware-based feature that leverages fixed-function hardware on the silicon to encrypt the contents of the memory, providing an additional layer of security. Since AMD shares a common IOD design across its Ryzen consumer and Ryzen PRO commercial product lines, the feature is physically present.

According to an investigation by Ars Technica, AMD has quietly removed a memory encryption feature from its consumer-focused Ryzen processors after years of inclusion. This feature, known as Transparent Secure Memory Encryption (TSME), is used to encrypt a system's memory content and prevent possible physical exploits that unencrypted memory data could be vulnerable to. Reportedly, AMD introduced TSME about a decade ago and began shipping it across all of its processors, including regular Ryzen, professional Ryzen Pro, Threadripper, and EPYC solutions. However, a random test on a Ryzen 7 9700X CPU, which uses "Zen 5" IP, has highlighted the absence of TSME support in consumer chips. In various exchanges between AMD engineers and some security professionals, the investigation led to a single response from AMD stating that "TSME is a security feature only applied to PRO CPUs as part of AMD PRO Technologies."

AMD has reportedly removed the feature quietly without prior notice. Discovering that the feature is missing is incredibly difficult on Windows-based machines, but still possible on Linux-based OS installations. Under a Linux-based OS, checking for firmware security revealed a missing encrypted RAM flag, despite TSME being enabled in the BIOS previously. It turns out that starting with the AGESA 1.2.7.0 build and in future AGESA versions, AMD has systematically removed the feature from its consumer Ryzen processors. After further investigation and inquiries to AMD, there is no information on whether the AGESA firmware is disabling this feature or if newer CPUs will ship with TSME disabled at the silicon level. All we know so far is that the feature is no longer present after years of being included on the consumer side.

Motherboard vendors ASUS and MSI began releasing UEFI firmware updates to their AMD 600-series chipset motherboards that introduce support for AMD EXPO-ULL memory profiles. EXPO-ULL is an SPD extension that simplifies memory settings. While AMD Ryzen 7000 series and Ryzen 9000 series processors are relatively behind Intel in memory clock speeds, there is room for memory vendors to release memory kits with significantly tighter timings within their memory speed classes. An example of an EXPO-ULL profile would be DDR5-6000 with CL26, as opposed to the CL30-36 usually available for this speed.

ASUS began by releasing Beta BIOS 3803 version for its motherboards based on AMD X670E spanning the ROG Crosshair, ROG Strix, ProArt, and TUF Gaming product lines. These include EXPO-ULL support, and AGESA 1.3.0.1b. Meanwhile, MSI released a similar firmware update for its top MEG X670E GODLIIKE motherboard featuring EXPO-ULL support and AGESA 1.3.0.1b. More vendors are expected to catch on, as AMD hasn't restricted EXPO-ULL to any chipset generation.

AMD has officially launched its Extended Profiles for Overclocking (EXPO) version 1.2, which expands support for more memory profiles, CUDIMM, and additional features. With this release, AMD aims to introduce more advanced memory tuning profiles to the "Zen 5" platform and its DDR5 memory types, while full support for EXPO 1.2 features is anticipated with the "Zen 6" processor generation. This means that full CUDIMM support for "Zen 5" tuning is still limited, and only "Zen 6" will offer complete CUDIMM support. EXPO 1.2 works with AMD's AGESA, but since AGESA 1.3.0.1 lacks full CUDIMM DDR5 support, this feature is postponed until the next-generation "Zen 6." Current-generation "Zen 5" CPUs on the AM5 socket may be able to use EXPO 1.2, but they won't fully support the new DDR5 memory with an onboard clock driver, instead relying on traditional memory to perform the task. Notably, popular AMD developer 1usmus mentioned that AMD EXPO 1.2 brings the following changes.

• Support for module geometry.
• Added support for MRDIMM (CUDIMM and CSODIMM are already supported). AGESA 1.3.0.1 still lacks full CUDIMM support; AMD is preparing this for Zen 6.
• New! tREFI, tRRDS, tWR, ULL Enable—Unified Latency Lock and VDDP(V).

MSI is excited to introduce full support for the upcoming AMD Ryzen 9 9950X3D2 Dual Edition processor, built on cutting-edge "Zen 5" architecture and powered by next-generation AMD 3D V-Cache technology. Designed for MSI's AM5 motherboard lineup, this 16-core, 32-thread powerhouse boasts a massive 192 MB L3 cache, up to 5.6 GHz boost clocks, and a 200 W TDP. Whether for intense gaming or heavy content creation, it delivers exceptional speed and efficiency, pushing performance to new heights.

MSI also introduces its new flagship MEG X870E UNIFY-X MAX, built for uncompromising performance. Designed with a specialized 2-DIMM layout and OC Engine, it caters to extreme overclocking enthusiasts seeking maximum potential. A powerful 18+2+1 power phase design (110 A SPS), combined with an advanced cooling solution featuring a Direct Touch Cross Heat-pipe and double-sided EZ M.2 Shield Frozr II, ensures stability under the most demanding conditions. The exclusive Tuning Controller simplifies advanced tuning and CMOS reset, making overclocking accessible even for those new to extreme performance tuning. Fully optimized for AMD Ryzen 9000 Series processors with AMD 3D V-Cache technology, and equipped with Full-Speed Wi-Fi 7 and 5G LAN, it delivers blazing-fast, low-latency connectivity.

GIGABYTE Technology, one of the top global manufacturers of motherboards, graphics cards, and hardware solutions, today announced the release of its new AMD AGESA 1.3.0.0a BIOS, bringing full support and performance optimization for the AMD Ryzen 9 9950X3D2 Dual Edition processor across GIGABYTE's entire AM5 800 Series and 600 Series motherboard lineup.

The Ryzen 9 9950X3D2 Dual Edition processor doubles the L3 cache stacked below the processor cores, delivering a massive leap in data-intensive and latency-sensitive workloads. GIGABYTE's latest BIOS is specifically tuned to unlock the full potential of this expanded cache architecture.

Last autumn, AMD provided an update regarding developmental progress of its openSIL open-source project. According to Raj Kapoor's presentation at last year's OCP Global Summit, the Red Team intends to publish its sixth-generation "Zen 6"-based EPYC "Venice" CPU openSIL sources at some point in 2026. The company's lead firmware architect reiterated that the newer silicon-initialization stack will eventually replace the familiar legacy AGESA firmware line. As of last summer, only one section of AMD's "Zen 5" family has received openSIL support—the EPYC 9005 "Turin" server processor product range. Earlier this week, a 3mbdeb blog entry detailed a compelling experiment that involved the initial "enabling (of) AMD AM5 'Phoenix' support in Coreboot." In the past, this Polish open-source consulting company has experimented with unusual ports of OpenSIL and Coreboot (via the Dasharo distribution). NLnet Foundation funding provided a secure base to start 3mbdeb's Gigabyte MZ33-AR1 porting project, leading to present-day tinkering with MSI's PRO B850-P consumer-grade mainboard design.

Mid-way through their post, they detail a handful of problems, including: "some issues may arise when parsing combo images for AM5 desktop platforms. The desktop images are more complex than server ones. A single PSP (Platform Security Processor) directory may support multiple CPU families, whereas on servers, each CPU family required separate PSP directory. This adds complexity, a need to distinguish PSP directories from each other, and determine the supported CPUs by given directory." So far, the MSI B850-P Pro-based tests have reached a phase of development that is "just enough to (achieve) boot." When outlining a next major milestone, 3mbdeb intends to: "add basic support for desktop AM5 'Phoenix' platform to distinguish mobile CPUs from desktop CPUs in Coreboot. This will serve as a base to cover the differences between the mobile and desktop Phoenix SoCs/APUs." They stress that their 'Phoenix' OpenSIL project is still in a "Proof of Concept" stage, so "not intended for production use." In summary, 3mbdeb's firmware engineer (Michał Żygowski) recommends that external testers wait for the arrival of "exciting" future releases.

ASRock has maintained close and long-term collaboration with AMD, and continues to carefully review recently discussed CPU-related issues across online communities, while optimizing BIOS functionality and further enhancing overall system stability. Following multiple rounds of collaboration, AMD has provided AGESA 1.3.0.0a to improve overall platform compatibility. ASRock has completed the corresponding integration and has released the Beta BIOS version 4.07.AS01, featuring AGESA 1.3.0.0a, on its official website.

The BIOS update includes the following highlights:

• 1. Update AGESA to ComboAM5 PI 1.3.0.0a.
• 2. Optimized Memory Compatibility.
• 3. Resolve a boot failure occurring on certain CPUs.

MSI is pleased to announce support for the upcoming AMD Ryzen 7 9850X3D processor, built on the Zen 5 architecture and powered by the latest AMD 3D V-Cache technology from AMD. Compatible with MSI motherboards supporting AMD's AM5 platform, this processor features 8 cores and 16 threads with a massive 104 MB total cache, delivering boost clock speeds of up to 5.60 GHz with a max TDP of 120 W. Designed for outstanding performance and efficiency, it effortlessly handles the most demanding gaming and content creation workloads, setting a new standard for high-performance computing.

At the same time, we also unveil the new flagship MEG X870E UNIFY-X MAX during CES 2026. It is engineered for ultra-high performance, featuring a specialized 2-DIMM layout and OC Engine for extreme overclocking enthusiasts. It is powered by a robust 18+2+1 power phase (110 A SPS) and cooled by an advanced thermal solution, incorporating a Direct Touch Cross Heat-pipe and double-sided EZ M.2 Shield Frozr II. By fully optimizing for AMD Ryzen 9000 Series Processors with AMD 3D V-Cache Technology, integrating cutting-edge Wi-Fi 7 and 5G LAN to ensure peak efficiency and low-latency connectivity for data-intensive applications, MEG X870E UNIFY-X MAX is ready for the challenge. An exclusive Tuning Controller provides instant, hands-on control for enthusiasts, enabling quick access to overclocking adjustments and CMOS clearing, all with a single press.

Earlier today, ASRock's "AGESA to Combo AM5 1.2.7.1" BIOS update turned up within the official support index. In general, several B650 and B850 chipset-based motherboard models—once updated with the AGESA BIOS 1.2.7.1 stable release—will be blessed with "upcoming CPU compatibility." Recent PC hardware community excitement has been generated by key marketing terms, including "Future CPU Ready" or "Ultimate Compatibility." As of mid-October, ASUS started hinting about forthcoming "Zen 6" processor support, on AM5 platforms. Next-gen mainstream desktop Ryzen CPUs are not expected to arrive until later on in 2026.

Looking at ASRock's latest BIOS release, upcoming support could refer to products that are due for launch in the near future. Around late October, the AGESA 1.2.7.0 beta contained code references to familiar Team Red "Strix Point" (STX) and "Phoenix Point" (PHX) architectures. Unlike nearby rivals, ASRock did not embrace v1.2.7.0—instead today's release jumps to v1.2.7.1. Presumably, the up-to-date revisions pave the way for "Krackan Point" or "Strix Point" desktop APUs on ASRock's slice of B650 and B850 boards. AMD could introduce the "Ryzen 9000G" series at CES 2025, potentially alongside the oft-leaked "Ryzen 7 9850X3D" SKU, and a more mysterious "Ryzen 9 9950X3D2" flagship model.

AMD is gradually releasing the AGESA PI 1.2.8.0 BIOS update, which primarily aims to enhance memory compatibility. However, users who have installed this BIOS version are reportedly facing issues. A member of the Chiphell forum installed the latest AGESA PI 1.2.8.0, hoping for improved system optimizations and memory tuning, only to encounter significant problems. The user is unable to access the CMOS screen, as the system crashes immediately upon each attempt. Furthermore, the computer fails to boot into the operating system, and the system boot repair utility consistently crashes when used.

The distribution of the update appears to have been limited and quietly handled by some manufacturers. MSI published BIOS files for several X870E and B850 models that reference AGESA PI v1.2.8.0, and an AMI BIOS image labelled 7E59v1A65 with a release date of 2025-12-03 and a file size near 15.9 MB lists improved memory compatibility in its release notes. Community tracking shows the new BIOS available only for a few SKUs, including the MPG X870E Edge Ti WiFi, MPG X870E Carbon WiFi and MAG B850M Mortar.

AMD officially confirmed that a hardware defect in the RDSEED instruction on its new Zen 5 processors, cataloged as AMD-SB-7055 and assigned CVE-2025-62626. The company reports that the 16-bit and 32-bit forms of RDSEED can return zero values, which may be mistakenly interpreted as a successful entropy read. The 64-bit form is unaffected. AMD rates the issue as high severity and suggests short-term software workarounds: prioritize using the 64-bit RDSEED path where possible, mask RDSEED from software discovery, or treat a zero return as a failure and retry. Firmware and microcode updates are being rolled out to OEMs. AMD's advisory provides product-family target dates, such as AGESA TurinPI 1.0.0.8 for EPYC 9005, with a target date of November 14, 2025, and consumer families targeted for late November 2025. Users should install vendor BIOS/microcode updates when available and consider regenerating any sensitive keys created on unpatched systems.

RDSEED is a low-level instruction that supplies entropy used for cryptographic keys and other security functions. When it returns predictable values without detection, newly generated keys or nonces may be weaker than intended. According to AMD, the problem affects the 16-bit and 32-bit forms of RDSEED, while the 64-bit form does not appear to be impacted. The company is distributing firmware and platform updates to correct the issue, but until those updates are applied, the recommended interim measures are straightforward: prefer the 64-bit RDSEED path where possible, prevent software from discovering or using the affected RDSEED forms, or treat a zero result as a failure and retry. Once updates become available, users should install them promptly and consider regenerating any sensitive keys created on unpatched systems.

AMD used the Open Compute Project Global Summit in San Jose to provide an update on openSIL, its initiative to replace the legacy AGESA firmware with an open silicon-initialization stack, with timelines for CPUs based on the "Zen 6" IP. Chief Firmware Architect Raj Kapoor presented the latest developments and confirmed that slides and a video of the talk are now available to the public. As part of the update, AMD released the openSIL Firmware Architecture Specification 1.0 and initial platform code for its "Phoenix" client SoCs, marking a shift from proof-of-concept work to wider platform availability. Kapoor also outlined a practical release schedule for future platforms. AMD reiterated that it will initially keep some platform sources under NDA until product launch, then release open-source platform code approximately one quarter after shipping.

According to this schedule, AMD plans to publish the "Venice" 6th Gen EPYC openSIL sources in 2026, suggesting a Venice product launch by Q3 in 2026, and to release the "Medusa" Ryzen CPUs based on "Zen 6" sources in the first half of 2027. The openSIL is designed as a modular, three-part static library written to modern C standards, intended to integrate seamlessly with any x86 host firmware while remaining scalable for different customer needs. Beyond timelines and deliverables, AMD envisioned openSIL as an effort to enhance transparency, speed up integration for hyperscalers, and improve security through auditable code. The project will allow public pull requests, although contributions will be reviewed to protect sensitive microarchitectural IP. This balance between openness and protection was a recurring theme in the presentation, as AMD seeks to open more of its firmware for community collaboration while managing to expose just enough of core design details that drive its CPUs.

We have seen previous rumors claim that AMD would launch Ryzen 9000G series APUs for its AM5 platform sometime soon, although there has been no official announcement from AMD, yet. Most recently, though, data miners combing through AMD's AGESA 1207 code have managed to find evidence of new Krackan Point desktop APUs. Krackan Point has been spotted in MSI BIOS updates with references to the 00B60Fxx microcode, and the changelog for ASUS X870 beta BIOS versions mentions "new APU support," which could only really be Ryzen 9000G. These new APUs are said to be based on Zen 5, but previous leaks said that they would instead be a rehash of the 8000G APUs, making them a Zen 4 refresh. At any rate, it will likely still be a while before launch, since this is the first time the code has been spotted in desktop BIOS versions.

Until now, Krackan Point APUs have been limited to mobile applications, with the AMD Ryzen AI 5 340 and Ryzen AI 7 350 both coming to laptops earlier this year. Until now AM5 owners looking for an APU have been limited to something like the AMD Ryzen 7 8700G, which launched all the way back in January 2024. If the laptop silicon is anything to go by, Krackan Point will bring AMD's RDNA 3.5 to the desktop, although with iGPUs falling short of the powerful Strix Halo 8060S. We will likely see APUs top out at the same Radeon 860M iGPU as the laptop variants, or potentially step up to the Radeon 890M iGPU, where the Ryzen 8000G APUs topped out at the 780M. The 890M would bring 256 more shaders into the mix for a decent performance uplift, although this seems to be a GPU configuration reserved for Strix Point. Current speculation also suggests that CPU core counts will be limited to eight and six cores for the Ryzen 7 and Ryzen 5 CPUs, respectively.

ASRock, a global leader in motherboards, graphics cards, gaming monitors, small form factor PCs, and power supply units, today announced that its AM5 motherboards fully support the newly launched AMD Ryzen processors, delivering broader compatibility and performance for gamers worldwide. The newly introduced AMD Ryzen 9000 Series includes the Ryzen 7 9700F and Ryzen 5 9500F, both without integrated graphics, as well as the Ryzen 5 7400 and 7400F from the Ryzen 7000 Series.

ASRock's AM5 motherboard lineup—including X870E, X870, B850, B840, X670E, B650E, B650, A620A, and A620 chipsets—can fully support the newly launched processors by simply downloading and installing BIOS version 3.30 (AGESA 1.2.0.3e Patch A) or later from the official website. In addition to downloading BIOS updates from the official site, users can also take advantage of BIOS Flashback and Instant Flash for quick and convenient upgrades. ASRock strongly recommends updating to the latest BIOS version to ensure optimal compatibility and performance.

MSI began rolling out UEFI firmware updates for its Socket AM5 motherboard lineup that encapsulate AMD AGESA 1.2.0.3F microcode. This latest version of AGESA comes with support for several new upcoming processor SKUs, including Ryzen 9000F series, which are "Granite Ridge" based chips with integrated graphics disabled; as well as AMD's upcoming Ryzen 9000G series desktop APUs, which are expected to be based on the 4 nm "Krackan Point" monolithic silicon. This chip features a 12-core CPU (4x "Zen 5" + 8x "Zen 5c"), a powerful iGPU based on RDNA 3.5 graphics architecture with up to 16 compute units; and the Ryzen AI XDNA 2 NPU capable of 50 AI TOPS, meeting Microsoft Copilot+ local acceleration requirements.

Besides support for new processors, AGESA 1.2.0.3F is also expected to lend 256 GB platform maximum memory support using four 64 GB DIMMs (2 DIMMs per channel). The firmware carries over many of the fTPM security vulnerability mitigations introduced with AGESA 1.2.0.3, which are recommended for all users. Lastly, MSI introduced several overclocking stability improvements with its latest firmware updates. Grab these updates from the Support section of the product page of your motherboard model on the MSI website.

AMD's openSIL project, a solution for open CPU silicon initialization code aimed at replacing traditional AGESA, has reached another milestone. Back in February, we reported on AMD promising full support for "Turin" and "Phoenix" server and client SoCs. The company initially targeted the end of 2024 for the release of proof-of-concept code, but failed to meet this deadline. A new target was subsequently set for the first half of 2025. As we roll into the second half, AMD openSIL now supports only the EPYC 9005 series Turin server processors, with Phoenix client SoCs still in development. AMD firmware engineers explained: "Currently, the Phoenix openSIL PoC release is still being worked on internally at AMD. We have encountered some delays in obtaining the necessary approvals to open-source the code, which has impacted our timeline. We are actively working to resolve these issues and are making every effort to expedite the process."

The path towards a fully open-source silicon initialization code is difficult, as it can expose many microarchitectural details. These are usually closely protected, as IP from Zen cores is valuable. An AMD engineer also added, "We understand the importance of this project to the open-source community and are committed to delivering it as promised." Nonetheless, the primary goal remains achieving full production readiness with the upcoming Zen 6 architecture. The openSIL project promises to enhance Coreboot support and provide developers with full access to low-level system components.

AMD began rolling out its latest AGESA ComboAM5 microcode for Socket AM5 platforms, as confirmed by an ASUS BIOS update for its ROG Crosshair X870E Hero motherboard. The company will likely get motherboard vendors and prebuilt OEMs to release BIOS updates with the new AGESA 1.2.0.3e microcode for both AMD 600-series and AMD 800-series chipset motherboards. Version 1.2.0.3e patches a security vulnerability with the firmware TPM (fTPM) component needed to establish a hardware root of trust. This is also a minimum system requirement for Windows 11. The vulnerability discovered by Trusted Computing Group, involves an OOB (out of bounds) read method that could compromise the root of trust.

Interestingly, the ASUS change-log mentions that AGESA 1.2.0.3e introduces support for an "upcoming CPU." We know from older reports that this upcoming CPU is the Ryzen 9000G "Gorgon Point" desktop APU. These processors are based on the 4 nm "Gorgon Point" monolithic silicon, which is a revision of "Strix Point," similar to how "Hawk Point" was to "Phoenix Point." There are no changes to the IP of either the CPU complex, or the iGPU, or even the NPU, but updates to their clock speeds or boosting algorithm. The CPU consists of two CCX, one with four "Zen 5" cores sharing a 16 MB L3 cache; and the other with eight "Zen 5c" cores sharing an 8 MB L3 cache. The iGPU is based on the RDNA 3.5 graphics architecture, and comes with 16 compute units. The NPU is based on XDNA 2, and offers at least 50 AI TOPS, giving the chip Microsoft Copilot+ local acceleration capability. The PCIe complex is Gen 4, and the main PEG interface is narrowed down to PCI-Express 4.0 x8.

MSI has released the latest AMD AGESA ComboPI-1.2.0.3e BIOS, supporting all AMD AM5 models, including X870, B850, B840, X670, B650, and A620 chipsets. This update not only adds support for upcoming new CPUs, but also enables all AM5 motherboards to support large-capacity 64 GB x4 DRAM chips. MSI motherboards have been optimized for overclocking large-capacity DRAM—compatible with DRAM chips from Micron, Hynix, and Samsung. Even with four 64 GB DRAM fully installed, the system can still achieve a stable overclocking speed of 6000 MT/s, and even up to 6400 MT/s.

In addition, this update optimizes 2DPC 1R capability and includes overclocking enhancements specifically for Samsung's 4Gx8 chips. AGESA 1.2.0.3e has already been rolled out to selected AM5 800 series models, users are able to find the updated BIOS on the MSI website, and MSI will continue to update the remaining AM5 models as soon as possible. Get ready to enjoy the powerful performance brought by memory overclocking!

Yesterday, ASRock's South Korean office issued a statement regarding problematic hardware pairings; affecting current-gen motherboards and AMD Ryzen 9000 "Granite Ridge" desktop processors. Curiously, the Taiwanese manufacturer's local branch slipped in an intriguing tidbit into its message, addressed to members of the Quasar Zone forum: "ASRock has released a new BIOS version 3.25. This version is based on AMD AGESA 1.2.0.3d, and has been improved to enhance compatibility with next-generation CPUs and optimize PBO (Precision Boost Overdrive) settings to enable more stable system operation." Due to media outlets focusing on an important BIOS update, a major hint was largely ignored. Fortunately, VideoCardz's keen eye was not distracted by current affairs.

According to their evening report (dated June 4), their local contacts have confirmed that there are no misunderstandings when Westerners machine translate ASRock Korea's original statement. Naturally, guess work—about the company's teasing of next-gen processors—will land on two upcoming Team Red product families. VideoCardz quickly eliminated a successive "Zen 6" CPU series, aka "Ryzen 10000." Despite recent leaks, industry watchdogs anticipate (at best) a mid-2026 debut. Given the uptick of semi-official Ryzen 9000G "Gorgon Point" leaks throughout Q2'25, VideoCardz reckons that AMD and mainboard partners are preparing for the arrival of this Zen 5 + RDNA 3.5-based APU series. Industry insiders have proposed a fourth quarter launch window.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, today announced the availability of BIOS updates for its TRX50 motherboard lineup, bringing full support for AMD's latest launched Ryzen Threadripper 9000 series and Ryzen Threadripper PRO 9000 WX-series processors. The new firmware enables users to take full advantage of AMD's cutting-edge TSMC 4 nm processors on GIGABYTE's premium TRX50 platform.

The updated BIOS versions, featuring Combo-AGESA 1.0.0.0 or later version, are now available for download from GIGABYTE's official website. Compatible motherboards include the TRX50 AERO D and TRX50 AI TOP models, both engineered to deliver exceptional performance with the new AMD Ryzen Threadripper 9000 series and Ryzen Threadripper PRO 9000 WX-series processors.

AMD's Ryzen 9 9950X3D processor with 16 cores, 32 threads, and 3D V-Cache is an exceptional content creation and gaming workload machine. However, MSI's proprietary BIOS features reportedly enable substantial performance headroom beyond stock settings. MSI's latest internal testing confirms that specific firmware configurations can deliver up to 14.5% performance improvements in demanding titles like Monster Hunter Wilds. The performance uplift hinges on firmware update, with MSI recommending the installation of chipset driver v7.01.08.129 or higher, which includes the critical AMD Application Compatibility Database driver. Users who update to BIOS versions featuring AGESA 1.2.0.3 or newer may encounter an "Unknown Device" in Device Manager, which can be resolved by installing the AMD Application Compatibility Database driver included in the latest chipset package. When paired with AGESA 1.2.0.3+ BIOS implementations, this configuration yields measurable framerate improvements of approximately 10% in Metro Exodus and 8% in Far Cry 6 at 1080p resolution compared to legacy firmware.

MSI's BIOS feature suite provides several optimization pathways. Memory Try It! delivers pre-configured memory timing profiles, while High-Efficiency Mode optimizes graduated memory bandwidth across four performance tiers. The X3D Gaming Mode modifies core and SMT configurations and provides additional gaming-specific enhancements, though potentially at the expense of multi-threaded application performance. Benchmark data from MSI demonstrates that implementing DDR5-8000 CL38 Memory Try It! profiles alongside "Tighter" High-Efficiency Mode settings and X3D Gaming Mode activation delivers a 14.5% performance uplift in Monster Hunter Wilds compared to baseline DDR5-4800 configurations, and approximately 8% over XMP DDR5-7200 settings. Titles like Shadow of the Tomb Raider and Far Cry 6 both recorded approximately 6% performance gains under similar test conditions. MSI cautions that memory overclocking implementations may impact system stability, while X3D Gaming Mode's thread management modifications could reduce performance in heavily multi-threaded workloads. Performance benefits will necessarily vary based on GPU capabilities and system configuration.

MSI is pleased to announce support for the upcoming AMD Ryzen 9 9950X3D and 9900X3D processors, built on the Zen 5 architecture and featuring AMD's cutting-edge 2nd generation AMD 3D V-Cache technology. This innovative technology is designed to significantly increases the cache size, allowing faster data access and improved performance. Engineered to deliver exceptional performance, these processors meet the demands of even the most intensive gaming and content creation workloads.

At the heart of this experience is the MSI MEG X870E GODLIKE motherboard, which sets a new standard with its innovative design and robust features. The Dynamic Dashboard III, a 3.99-inch full-color LCD, offers real-time hardware monitoring, troubleshooting, BIOS update status, clock display, and personalization options, enhancing user experience and system control. MSI's EZ Link design complements this, streamlining cable management by consolidating the front panel, fan, and RGB headers into the EZ Bridge and EZ Control Hub, ensuring a cleaner build and simplified installation process.