News Posts matching "Micron"

Return to Keyword Browsing

Micron's Lexar Brand acquired by Longsys

Longsys, a world leader in consumer flash storage, today announced that it has acquired the Lexar trademark and branding rights from Micron Technology, Inc. The Lexar brand has long been recognized as a leading brand for high-performance, high-reliability removable storage solutions for a wide variety of applications, such as the professional photography market. This acquisition provides assurance to existing Lexar customers that the solutions and support they have come to expect from Lexar branded products will continue to be available. Additionally, the market reach and product breadth provided by Longsys promises to expand the Lexar customer experience into new market segments and geographies.

"We are very honored to acquire the Lexar brand," said Huabo Cai, CEO of Longsys Electronics Limited. "Lexar has built a great brand name and our vision is to make it even greater. Existing customers can rest assured that the innovative solutions and excellent support that they have experienced from Lexar will continue. The mission to make Lexar the go-to brand for high-performance removable storage continues, and we will expand upon it to offer even more compelling solutions as the age of wireless and big-data impact the consumer storage markets."

Crucial Announces the BX300 Solid-state Drive

Crucial, a leading global brand of memory and storage upgrades, today announced the availability of a new offering in its solid state drive product portfolio: BX300. It combines Micron 3D NAND with a value-conscious design to deliver the features DIY upgraders and builders are looking for. The new SSD includes 3D MLC NAND in a 2.5-inch form factor drive, and is available in 120GB, 240GB, and 480GB capacities.

Upgrading from a traditional hard drive to a solid state drive has never been easier. The Crucial Advisor tool helps users determine a compatible upgrade based on their system's manufacturer, make, and model. Supporting the BX300 is Crucial's mobile-friendly install guide so users of all technical ability levels are armed with the straightforward, step-by-step information they need to successfully install an SSD. Data migration is also simplified with free access to Acronis True Image HD software.

Graphics Memory Prices Surge 30% in August, Could Affect Graphics Card Prices

The DRAM industry is experiencing an acute shortage of various classes of GDDR memory (graphics DDR), which could affect graphics card prices come Holiday. Supplier quotes for various graphics memory components have risen by as much as 30.8% in August, from an average of USD $6.50 in July, to $8.50. Top graphics memory suppliers Samsung and SK Hynix have committed a bulk of their inventories to manufacturers of servers and mobile handsets, which triggered the price rally. Samsung is the largest supplier of graphics memory, with a 55 percent market-share, followed by SK Hynix at 35 percent, and Micron Technology at 10 percent.

Source: DigiTimes

Micron Announces 9200 Series PCIe NVMe SSDs

Micron Technology, Inc. (Nasdaq: MU) today introduced Micron 9200 Series of NVMe SSDs, the company's latest flagship performance solid-state storage family. The innovative architecture and industry leading performance of Micron 9200 SSDs allows organizations to access data faster and stay one step ahead of the growing diversity of business-critical workloads and surging data demands.

The new Micron 9200 SSD combines the cost-effective capacity of 3D NAND with the proven throughput and response time of the NVM Express (NVMe) protocol. Built from the ground up to remove legacy layers of hard drive interfaces, Micron's second generation of NVMe drives unleashes the speed of solid state nonvolatile memory to maximize data center efficiency for optimal total cost of ownership (TCO).

Micron DRAM Production Facility Closed Due to Contamination

If you didn't already know, semiconductor production plants are some of the most aseptic locations you can usually find deployed around the world (remember those pictures of engineers wearing full-body suits and face masks?) As is often the case with cutting edge technology, there is usually no place for variable conditions; precision-level manufacturing requires the most stable, predictable working and manufacturing conditions that can possibly be achieved. When something goes wrong, say, when the nitrogen gas dispensing system of a major semiconductor manufacturing facility acts up and releases uncalibrated amounts of gas, things can go very wrong, very quickly.

That is exactly what happened with Micron's Fab 2 in Taiwan. Fab 2 was a result of Micron's Inotera acquisition, and production from this fab accounts for around 5.5% of the global DRAM supply (125,000 wafers per month) Due to the nitrogen gas dispenser malfunction, both wafers and equipment were contaminated, which Trendforce says reduced Inotera's production capability by 60,000 wafers. Now, granted, Micron has already officially come out and say that this was all a "minor accident" which "had no impact" on business. However, one has to consider that Fab 2 mainly specializes in production of LPDDR4 memory, which is essentially used in mobile phone environments - Apple being the company's biggest consumer of DRAM chips. With iPhone 8 production supposedly in full swing, if I were Micron, I would certainly prefer to take a bite out of my DRAM supplies than admit production capacity reduction and shortages to such a partner. If Apple were to take its business elsewhere, Micron would be hard-pressed to find another customer of that caliber.

Sources: Trendforce, Reuters

Micron Announces 16 Gbps Memory Speeds Achieved Over GDDR5X

Micron, who has been at the forefront in graphics memory production, has recently announced in a blog post their commitment to achieving ever increasing speeds and performance gains with their products (which isn't all that uncommon.) What this announcement has that better carves it as different and newsworthy, though, is that the company has seemingly achieved 16 Gbps speeds on GDDR5X memory - which up to now, ticked at up to 12Gbps. Some NVIDIA cards you probably know about actually had their GDDR5X memory clocked up to 12.4 Gbps.

The new achievements under GDDR5X will aid the company in better executing their vision for GDDR6 and its speed goals. Micron expects to have functional silicon of their G6 program very soon, being confident they can push products to market on early 2018. GDDR6 will bring some specific differences in regards to GDDR5X, such as dual-channel memory (GDDR5X is single-channel) and the introduction of a FBGA180 ball package with increased pitch, to accommodate these fundamental differences.

Source: Micron

GeIL Unveils AMD Edition Variants of its Entire DDR4 Memory Lineup

It turns out that the EVO X AMD Edition isn't GeIL's only AMD Ryzen-optimized DDR4 memory, with the company unveiling AMD Edition variants of pretty much all its DDR4 memory brands. This includes the EVO Potenza, EVO Spear, EVO Forza, Super Luce, Pristine, and DragonRAM series. Each of these "AMD Edition" branded memory kits has been stability-tested with AMD Ryzen processors, at their advertised clock speeds and timings. They come in a variety of speeds, including DDR4-2400, DDR4-2666, DDR4-2933, DDR4-3200, and DDR4-3466; in densities of 8 GB and 16 GB, making up 16 GB and 32 GB dual-channel kits, respectively.

It's not known if all of these are based on Samsung b-die DRAM chips. AMD spokespersons have publicly stated that Samsung b-die isn't the only DRAM chip needed for high memory clocks on Ryzen processors, and that even with older versions of AGESA, certain memory kits with SK Hynix and Micron DRAM chips are having some success in achieving high memory clocks. AMD is working to improve support for faster DDR4 memory kits through updates to AGESA, which will be dispensed through motherboard vendors to end-users, as motherboard BIOS updates.

Crucial Readies the BX300 Mainstream SSD

Crucial is giving final touches to its next-generation mainstream SATA SSDs, under the BX300 series. A follow-up to its MX300 series, the BX300 series will be launched later this Summer. The drives combine a Marvell-made controller with Micron 3D TLC NAND flash memory, and likely come in capacities of 240 GB, 480 GB, and 960 GB. Crucial will sell these drives only in the 7 mm-thick 2.5-inch form-factor with SATA 6 Gb/s interface, initially. While the company didn't talk about performance, it mentioned that the drives offer "SATA-saturating performance," meaning that at least its sequential reads could be around the 530 MB/s mark (that of the MX300), if not higher. With the BX300, Crucual is launching a new multi-media SSD install tutorial website that's made as simple to understand as possible, so anyone with a screwdriver can replace their HDD with a new SSD.

Micron Announces SolidScale Platform Architecture for NVMe SSDs

Micron Technology, Inc. (Nasdaq:MU) today introduced the Micron SolidScale architecture, an integrated platform that delivers breakthrough low-latency and high performance access to compute and storage. The Micron SolidScale architecture provides customers with the agility to deploy next-generation, cloud-native applications while supporting legacy applications that run the enterprises of today - and tomorrow. From online transaction processing, to virtual platforms and analytics, to machine learning, Micron's innovative architecture not only delivers data quickly due to its extremely high throughput, but it delivers faster time to results because of its unprecedented low latency.

"We estimate that companies using NVMe SSDs deployed in application servers today are on average using less than 50% of their IOPS and capacity. With the new Micron SolidScale architecture, capacity is shared across application servers, unlocking capacity customers have already paid for so that they can do more with less and unleash flash's true performance," said Darren Thomas, vice president, Storage Business Unit, Micron Technology, Inc. "At Micron, we consider the impact of every workload, application and environment as we design the technology, products and systems that allow our customers to deploy applications faster and scale without limits."

BIOSTAR Announces G330 SSDs

BIOSTAR has announced an evolution of their G300 SSDs that it introduced in August 2016. The new, revised G330 series maintains the overall design from the series it supersedes, but upgrades the controller to an SMI 2258 (from an SMI 2256). They're built on Micron's 3D TLC NAND, with a DRAM cache that boosts performance, and come in three different capacities (128, 256 and 512 GB) in a 2.5-inch form factor, with a 6.8 mm height.

The drives feature read speeds up to 565MB/s and write speeds up to 515MB/s over a SATA 6Gb/s interface, and come with a MSRP of $59 for the 128GB model (G330-128GB), $99 for the 256GB model (G330-256GB), and $169 for the 512GB model (G330-512GB).

Source:ETeknix[small]Thanks @P4-630

Amidst Production Woes, Pricing of DDR4 DRAM to Climb 12.5% on 2Q17 - Trendforce

Continuing the trend of previous reports, DRAMeXchange, a division of TrendForce, reports the general price increase in the PC DRAM market is growing larger than anticipated as the already tight supply situation is compounded by quality problems with products made on the leading-edge processes. Based on a preliminary survey of completed contracts for the second quarter, DRAMeXchange estimates that the average contract price of 4GB DDR4 modules will go up by about 12.5% compared with the first quarter, from US$24 to around US$27.

"PC-OEMs that have been negotiating their second-quarter memory contracts initially expected the market supply to expand because Samsung and Micron have begun to produce on the 18 nm and the 17 nm processes, respectively," said Avril Wu, research director of DRAMeXchange. "However, both Samsung and Micron have encountered setbacks related to sampling and yield, so the supply situation remains tight going into the second quarter and PC DRAM prices will continue to rise through this three-month period."

Micron's QuantX-based Products to Ship Late 2017

While Intel has made some definite announcements and product launches of its own take on 3D XPoint technology with its Optane-based professional and consumer products, Micron has been a little late to the party on both. However, recent reports peg Micron's take on the new memory technology, under its QuantX brand, to ship later this year.

Micron is apparently taking a path that differs from Intel's though, in that it's looking to license its 3D Xpoint technology to other storage makers (not currently known which), in SSD or DDR-like formats, according to the company. However, these products will likely first target the enterprise space, with QuantX-based SSDs on the PCI-Express 3.0/NVMe protocols, with capacities of up to 1.4TB. Micron is aligning QuantX with emerging throughput technologies like Gen-Z, which could expand QuantX's reach towards the ARM server market, which has seen increasing interest in recent times.. The QuantX storage and memory will have their own dedicated controllers, sitting close to the CPU for quick data transfers, thus reducing potential bottlenecks.

Source: IT World

PC DRAM Pricing Increased 20% Sep-Oct 2016; Will Continue Rising in 2017 - TrendForce

DRAMeXchange, a division of TrendForce, today reported that the average contract price of 4GB PC DRAM modules increased over 20% between September and October of 2016 (jumping from US$14.5 to US$17.5) as DRAM suppliers completed their fourth-quarter contract negotiations with first-tier PC-OEMs.

These increases come as the result of production capacity gradually shifting from PC-centric DRAM towards mobile and server DRAM, which have seen tremendous growths in demand. In fact, PC DRAM memory accounts for less than 20% of overall DRAM production. The already low inventories of branded device makers go hand in hand with higher-than-expected demand for DRAM-carrying products. And this higher demand comes after the PC DRAM market being severely undersupplied in the second half of 2016. The result: an across-the-board price upturn for all types of DRAM.

PNY Intros the CS1311b Entry-level SSD Series

PNY today introduced the CS1311b line of entry-level SSDs in the 7 mm-thick 2.5-inch form-factor, featuring SATA 6 Gbps interface. Available in capacities of 128 GB and 256 GB, the drives feature 3D TLC-NAND flash memory made by Micron Technology. The 128 GB variant offers sequential transfer speeds of up to 510 MB/s reads with up to 410 MB/s writes, and up to 42,000 IOPS 4K random reads, with up to 82,000 IOPS 4K random writes; while the 256 GB variant is slightly faster, with up to 560 MB/s sequential reads, and up to 510 MB/s writes; with up to 80,000 IOPS 4K random reads, and up to 81,000 IOPS 4K random writes. The drives are backed by 3-year product warranties. Acronis True Image data migration software comes included. The company didn't reveal pricing.

Intel Launches Site Detailing Optane Requirements: Skylake Users Need Not Apply

Microprocessor giant Intel has launched a new page dedicated to its 3D XPoint-based Optane memory solution, a technology that it jointly developed with memory manufacturer Micron back in 2015, and was supposed to be on the market by 2016. The company missed that date; however, the technology is still interesting to enthusiasts and power users alike, due to its promises of both high speed and large capacity, a seemingly unattainable combo in today's markets.

Unfortunately, it seems that any system built around when Optane was announced will not be able to run Optane-based SSDs. In the system requirements section of its page, Intel has indicated that Optane will not run on anything earlier than a Kaby Lake based CPU. No exceptions. Yes, that includes Skylake, Broadwell, and pretty much everything else besides Kaby Lake. You will also need a 200-series chipset or newer.

TrendForce Reports Global DRAM Revenue Jumped 18.2% Sequentially in Q4 2016

Peak season demand and surging prices for DRAM products across different applications resulted in an 18.2% sequential growth in the global DRAM revenue for the final quarter of 2016, reports DRAMeXchange, a division of TrendForce.

Smartphone shipments peaked in the fourth quarter on account of the traditional busy season. Chinese smartphone brands continued to post strong sales while Apple benefitted from the release of iPhone 7. "Rising demand for mobile DRAM kept squeezing the industry's production capacity for PC DRAM," said Avril Wu, research director of DRAMeXchange. "Contract prices of PC DRAM modules increased by more than 30% sequentially on average in the fourth quarter due to insufficient market supply. Server DRAM lagged behind PC and mobile DRAM in terms of price hike during the same period, but it is expected to catch up in the first quarter of this year."

Intel Optane DC P4800X with 3D XPoint Offers 21x Endurance Over MLC NAND

Intel is readying a fleet of new SSDs based on its new 3D XPoint non-volatile memory, a technology that Intel hopes will replace NAND flash in the years to come. The company developed this technology in collaboration with Micron Technology, under its IMFlash Technologies banner. The first Intel SSDs with this memory will be sold under the Optane brand. There are several sub-brands targeting the various market segments (client, enterprise, data-center, etc.), and technical slides of the data-center targeted Optane DC P4800X SSD were leaked to the web.

One of the first Optane DC P4800X SSDs comes in a rather measly capacity of 375 GB. The drive is built in the half-height PCI-Express add-on card (AIC) form-factor, with PCI-Express 3.0 x4 host interface. The drive belts out sequential transfer rates of up to 2400 MB/s reads, with up to 2000 MB/s writes, which may not sound like much given that even TLC NAND flash based PCIe 3.0 x4 drives offer higher transfer rates; until you look at three key metrics - latency, random-access performance, and endurance.

Micron's Outlook for the Future of Memory: GDDR6, QuantX in 2017

After finally reaching mature yields (comparable to those of planar NAND processes), Micron's 32-layer first generation 3D NAND has grown increasingly prominent in the company's NAND output. Now, the company is looking to ramp-up production of their (currently sampling) 64-layer 3D NAND, promising "meaningful output" by the end of December 2017, looking for an 80% increase in total GB per wafer and a 30% decrease in production costs.

When it comes to the graphics subsystem memory, Micron is looking to transition their 20nm production to a "1x nm" (most likely 16nm) node, in a bid to improve cost per GB by around $20, with introduction of 16nm GDDR5 memory to be introduced later this year. However, GDDR5X volume is expected to grow significantly, in a bid to satisfy bandwidth-hungry uses through GPUs (like NVIDIA's GTX 1080 and potentially the upcoming 1080 Ti) and networking, with GDDR6 memory being introduced by the end of 2017 or early 2018. The company is still mum on actual consumer products based on their interpretation of the 3D XPoint products through their QuantX brand, though work is already under way on the second and third generation specifications of this memory, with Micron planning an hitherto unknown (in significance and product type) presence in the consumer market by the end of this year.

NVM Express Elects Facebook and Toshiba to Board

NVM Express, Inc., the organization that developed the NVM Express specification for accessing solid-state drives (SSDs) on a PCI Express (PCIe) bus, today announced the results of its recent board elections. Elected to Promoter positions were Facebook, Micron, Microsoft, Samsung, Seagate, Toshiba, and Western Digital. Facebook and Toshiba are new to the Promoter level, and the others are incumbents. The election winners join existing Promoters Cisco, Dell EMC, Intel, Microsemi, NetApp and Oracle, whose current terms expire at the end of 2017.

Representatives from the 13 Promoter companies form the NVM Express, Inc. Board of Directors, which governs the organization, including setting strategic direction. All Contributor and Promoter member companies are eligible to run for Promoter positions, where there are elections each year for roughly half the positions.

"We're very pleased to welcome Toshiba and Facebook to the NVM Express, Inc. Board, to help shape the future direction of NVM Express technology and the organization," said Amber Huffman, NVM Express President. "In 2016, we marked major milestones, such as publishing the NVM Express over Fabrics specification. We look forward to publishing revision 1.3 in the first half of this year - with much more to come later in 2017."

Micron Technology Announces World's Highest-Capacity Enterprise SATA SSD

Micron Technology, Inc. today introduced the Micron Enterprise 5100 Series SATA solid state drive (SSD) family, enabling future-focused data storage platforms to meet the combined demands of performance, capacity and enterprise-class reliability. Micron's 5100 Series Enterprise SATA SSDs provide IT with an easy migration to bridge the infrastructure divide to tomorrow's all flash data center. With an industry-leading 8-terabyte (TB) capacity, the 5100 Series helps you manage the data deluge created by today's diverse digital universe with performance characteristics perfectly tailored to manage the data tsunami.

"Micron is uniquely positioned to help IT embrace modernization and agility, and leading enterprise and cloud data centers look to Micron for breadth and depth in solid state storage solutions to tame a diverse digital universe," Darren Thomas, vice president of storage at Micron. "Our Micron 5100 Series SATA SSDs featuring FlexPro architecture offer a seamless migration path with enterprise class reliability and proven ROI, ensuring flexibility, continuity and agility for data management today and tomorrow."

Crucial's Ballistix is Now its Own Brand of PC Gaming Hardware

The Ballistix sub-brand of Crucial, Micron Technology's consumer products subsidiary, is now its own brand, and no longer labeled next to Crucial. The Ballistix Gaming brand will now include PC gaming hardware, including memory (RAM), and perhaps even SSDs and gaming peripherals in the future. Ballistix products will be targeted at DIY gaming PC builders and enthusiasts.

Commenting on the story, Crucial stated: "Ballistix is now it's own defined brand, becoming a sibling to Crucial (previously a sub-brand). For more than a decade, Ballistix has injected speed and style into PC gaming in a way that can't be imitated. As the only major brand of gaming memory that builds and tests products from start to finish, Ballistix brings you the proven performance and reliability that pro gamers build with. Ballistix performance memory (RAM) is designed to give the upper hand to gamers, performance enthusiasts, and overclockers."

Intel Readies TLC 3D NAND Flash Based 610P Series PCIe SSD for 2017

Intel is readying a follow-on to its 600P series performance-segment PCIe solid-state drive (SSD) series, with the 610P series. Built in the M.2-2280 form-factor, with PCIe gen 3.0 x4 bus interface, and support for the NVMe protocol, the SSD 610P will be based on TLC 3D NAND flash by IMFlash Technology, the company's joint-venture with Micron Technology. The SSD 610P series will come in capacities of 128 GB, 256 GB, 512 GB, 1 TB, and 2 TB.

The company is also working on a smaller M.2-1620 variant for notebooks and SFF desktops, which will feature a BGA version of the SSD. These are multi-chip modules of NAND flash stacks and SSD controllers bundled into single packages. The BGA variants will come in sizes of 128 GB, 256 GB, and 512 GB. Not much else (performance figures) are known about these drives, except that Intel plans to release these towards Q4 2017 (after September).

Source: Benchlife.info

Tech Industry Leaders Unite, Unveil New High-Perf Server Interconnect Technology

On the heels of the recent Gen-Z interconnect announcement, an aggregate of some of the most recognizable names in the tech industry have once again banded together. This time, it's an effort towards the implementation of a fast, coherent and widely compatible interconnect technology that will pave the way towards tighter integration of ever-more heterogeneous systems.

Technology leaders AMD, Dell EMC, Google, Hewlett Packard Enterprise, IBM, Mellanox Technologies, Micron, NVIDIA and Xilinx announced the new open standard to appropriate fanfare, considering the promises of an up-to 10x performance uplift in datacenter server environments, thus accelerating big-data, machine learning, analytics, and other emerging workloads. The interconnect promises to provide a high-speed pathway towards tighter integration between different types of technology currently making up the heterogeneous server computing's needs, ranging through fixed-purpose accelerators, current and future system memory subsistems, and coherent storage and network controllers.

Industry Leaders Join Forces to Promote New High-Performance Interconnect

A group of leading technology companies today announced the Gen-Z Consortium, an industry alliance working to create and commercialize a new scalable computing interconnect and protocol. This flexible, high-performance memory semantic fabric provides a peer-to-peer interconnect that easily accesses large volumes of data while lowering costs and avoiding today's bottlenecks. The alliance members include AMD, ARM, Cavium Inc., Cray, Dell EMC, Hewlett Packard Enterprise (HPE), Huawei, IBM, IDT, Lenovo, Mellanox Technologies, Micron, Microsemi, Red Hat, Samsung, Seagate, SK hynix, Western Digital Corporation, and Xilinx.

Modern computer systems have been built around the assumption that storage is slow, persistent and reliable, while data in memory is fast but volatile. As new storage class memory technologies emerge that drive the convergence of storage and memory attributes, the programmatic and architectural assumptions that have worked in the past are no longer optimal. The challenges associated with explosive data growth, real-time application demands, the emergence of low latency storage class memory, and demand for rack scale resource pools require a new approach to data access.

Global PCle SSD Market to Grow 33.24% by 2020

Research and Markets has announced the addition of the "Global PCle SSD Market 2016-2020" report to their offering. The report forecast the global peripheral component interconnect express (PCIe) SSD market to grow at a CAGR of 33.24% during the period 2016-2020. The report has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

According to the report, need for managed service data centers will be a key driver for market growth. It is advantageous for an enterprise to operate a colocation facility rather than to build a data center. Data center colocation allows enterprises to rent computing storage, servers, and network. It enables minimal utilization of power and bandwidth and enhances the security of enterprise IT equipment.
Return to Keyword Browsing