Eurocom launches the 16" Nightsky ARX516, a cutting-edge laptop that redefines performance, portability, and precision. Designed for professionals, creators, and gamers, the Nightsky ARX516 delivers unmatched power with the latest AMD Ryzen AI 9 HX 370 processor with AMD Radeon 890M iGPU and NVIDIA GeForce RTX 5070 graphics.

"The Nightsky ARX516 is a game-changer for AMD enthusiasts and those who demand a performance class laptop for all of their computing needs including AI computing on the go, in a sleek, portable form factor, with added TPM for security and MIL-STD-810H specs, so the laptop built for heavy duty everyday use and designed to endure everyday wear and tear—even the unintentional kind." said Mark Bialic, Eurocom President. "Whether you're a creative professional, a gamer, or a power user, this laptop is designed to exceed expectations with a powerful combination of AMD Ryzen AI 9 HX 370 processor and NVIDIA GeForce RTX 5070 graphics."

ASRock today introduced the Radeon AI PRO R9700 Creator graphics card. The card is based on the PRO R9700 GPU AMD launched earlier this week, which is targets both the edge AI acceleration and professional visualization markets. The R9700 is based on the 4 nm "Navi 48" silicon, which it maxes out, with all 64 CU being enabled for 4,096 stream processors, 128 AI accelerators, and 64 RT accelerators. A key difference between the RX 9070 XT gaming GPU and the PRO R9700 is memory, with the latter getting 32 GB of it—double the size. This should help with fairly large AI models. The card also uses PCI-Express Gen 5 memory pooling features in workstations with up to four of these.

To make the card capable of exactly this, ASRock designed its PRO R9700 Creator graphics card to have a strictly 2-slot form-factor, with a lateral blower-based cooling solution that has cutouts behind the blower, and clearance of the backplate toward the tail-end, to help with airflow to adjacent cards. The card also implements the 16-pin 12V-2x6 power connector. This is ASRock's second card from this generation to do so, the other being the Radeon RX 9070 XT Taichi. The connector is located at the tail-end of the card, and not the top. This is important, as the card becomes capable of 3U rackmount chassis installations, something not possible with top-oriented power inputs, particularly with the strict cable bending restrictions of 12V-2x6. The card is 27.1 cm long and 11.1 cm tall. Display outputs include four DisplayPort 2.1a.

Just as the RDNA 4 rollout cycle is completing, the rumor mill for the next generation of Radeon GPUs is intensifying. According to @Kepler_L2 on X, a reliable leaker, AMD is equipping its next-generation UDNA-based GPUs with the HDMI 2.2 display protocol, capable of supporting 64 and 80 Gbit/s, meaning that the highest-end bandwidth of 96 Gbit/s (Ultra96) is not expected to arrive until the next generation. The HDMI Forum, the consortium behind the HDMI standard, officially released the HDMI 2.2 specifications in January during CES. The HDMI forum also foresees HDMI 2.2 cables hitting the shelves sometime in Q3 or Q4 of 2025, which means the rollout is near. However, AMD's next-generation GPUs will not utilize its entire feature spectrum in the coming GFX13 GPU architecture.

The HDMI 2.2 update introduces a future-proof Fixed Rate Link architecture that delivers up to 96 Gbps of bandwidth, enabling uncompressed 4K at 240 Hz or 8K at 60 Hz with full 4:4:4 chroma, and paving the way for even higher resolutions, such as 10K and 12K at 120 Hz. It accommodates both uncompressed and visually lossless compressed formats, as well as advanced chroma sampling options. This massive data throughput meets the growing demands of immersive audiovisual experiences from next-generation gaming and augmented and virtual reality to professional light-field displays, large-format digital signage, medical imaging, and machine-vision systems by doubling payload capacity every two to three years. The Ultra96 HDMI cable is designed to handle all HDMI 2.2 features. This cable is accompanied by the new Latency Indication Protocol, which ensures precise lip-sync and audio-video alignment across complex multi-hop setups involving receivers, soundbars, and other downstream devices.

GeForce NOW is throwing open the vault doors to welcome the legendary Borderland series to the cloud. Whether a seasoned Vault Hunter or new to the mayhem of Pandora, prepare to experience the high-octane action and humor that define the series that includes Borderlands Game of the Year Enhanced, Borderlands 2, Borderlands 3 and Borderlands: The Pre-Sequel. Members can explore it all before the highly anticipated Borderlands 4 arrives in the cloud at launch.

In addition, leap into the flames and save the day in the pulse-pounding FBC: Firebreak from Remedy Entertainment on GeForce NOW. It's all part of the 13 new games in the cloud this week, including the latest Genshin Impact update and advanced access for REMATCH. Plus, GeForce NOW's Summer Sale is still in full swing. For a limited time, get 40% off a six-month GeForce NOW Performance membership - perfect for diving into role-playing game favorites like the Borderlands series or any of the 2,200 titles in the platform's cloud gaming library.

KIOXIA America, Inc. today announced the development and prototype demonstration of its new KIOXIA CD9P Series PCIe 5.0 NVMe SSDs. These next-generation drives are the latest SSDs built with KIOXIA's 8th generation BiCS FLASH TLC-based 3D flash memory. KIOXIA BiCS FLASH features CBA (CMOS directly Bonded to Array) technology, a breakthrough architecture that significantly boosts power efficiency, performance, and storage density, while doubling the capacity available per SSD compared with the previous generation model.

As GPU-accelerated AI servers drive up the demands on storage infrastructure, maintaining high throughput, low latency, and consistent performance is critical - including keeping valuable GPUs highly utilized. The KIOXIA CD9P Series is purpose-built for these next-generation environments, delivering the speed and responsiveness required by AI, machine learning, and high-performance computing (HPC) workloads to ensure GPUs stay fed with data and operating at maximum efficiency.

To expand its growing influence in the data center market, NVIDIA recently launched the NVLink Fusion program. This initiative enables select partners to integrate their custom-designed chips into the NVIDIA system framework. For example, a partner can connect its custom CPU to an NVIDIA GPU using the 900 GB/s NVLink-C2C interface. However, this collaboration comes with significant restrictions. Any custom chip must be connected to an NVIDIA product, and the company maintains firm control over the critical software that manages these connections. This means partners cannot create truly independent, mix-and-match systems. NVIDIA retains control over the essential communication controller and PHY layers in the NVLink Fusion, which initializes and manages these links. It also mandates a license for third-party hardware to use its NVLink Switch chips.

In response, a growing coalition of tech giants, including AMD, Google, and Intel, is championing an open-standard alternative. Their UALink Consortium released its 1.0 specification in April 2025, defining a public standard for linking up to 1,024 accelerators from any vendor. While NVIDIA currently offers superior raw bandwidth, UALink represents a move toward greater flexibility and cost efficiency. According to reports, eight companies expressed interest in NVLink Fusion. However, the frustration of working with a communication link with limited visibility results in designs that are not always optimal and efficient. NVIDIA sets these standards from the beginning, so any company willing to work with NVLink Fusion is aware of these limitations from the outset. Cloud hyperscalers, such as AWS, GCP, and Azure, have expressed interest among the reported eight customers, so they might swallow this pill and continue working with NVIDIA to gain access to the IP despite the limited information available.

When storage speed and flexibility matter most, why compromise? Whether you're a creative pro managing massive media libraries, a gamer juggling terabytes of AAA titles, or a developer running virtual environments, your workflow deserves storage that's as fast, flexible, and beautiful as your Mac Mini M4 setup.

Introducing the Satechi USB4 Slim NVMe SSD Enclosure—a high-performance, travel-friendly storage solution designed to unlock the full potential of your device. Inspired by the sleek simplicity of Apple's USB SuperDrive and built for modern pros, this enclosure combines USB4 technology, expandable capacity, and a premium, minimalist design.

GL.iNet, a leader in secure network solutions, is proud to announce the launch of Flint 3 (GL-BE9300), its first tri-band Wi-Fi 7 home router. Engineered for home users, remote workers, gamers, and small offices, Flint 3 delivers next-generation wireless performance with unmatched flexibility, speed, and control.

Next-Generation Wi-Fi 7 Performance
Flint 3 is powered by the latest Wi-Fi 7 technology, supporting Multi-Link Operation (MLO) across 2.4 GHz, 5 GHz, and 6 GHz bands. This dramatically reduces interference and latency by combining multiple wireless channels into a single stable connection. With max speeds of 688 Mbps (2.4 GHz), 2882 Mbps (5 GHz), and 5765 Mbps (6 GHz), Flint 3 ensures responsive, and constant connectivity, even in congested device environments.

Sycom is a Japan-based OEM that specializes in build-to-order (BTO) gaming PCs and components such as graphics cards. Last year, the company released the Silent Master GeForce RTX 40-series "Ada" graphics cards that come with a custom cooling solution that uses an aluminium fin-stack heatsink, and a pair of large 120 mm Noctua case fans for ventilation; and this week, they launched the Silent Master RTX 50-series "Blackwell" graphics card series.

The series includes three models, the RTX 5070 Ti, the RTX 5070, and the RTX 5060 Ti 16 GB. At this point, it's not known if Sycom designed the heatsink or PCB—there's a possibility that these are sourced from a graphics card OEM without the cooler shroud and fans, and topped up with a custom cooler shroud, backplate, and a pair of Noctua-sourced high-end fans. The RTX 5070 Ti and RTX 5070 cards come with larger coolers that use a pair of 120 mm NF-A12x25 (25 mm-thick), while the RTX 5060 Ti 16 GB card comes with a pair of 92 mm NF-A9x14. All three cards lack any form of factory overclock, their main claim to fame is their low noise. Unlike the ASUS Noctua Edition graphics cards, the three cards have relatively well managed card thickness of 3.5-slot or under. All three cards are being sold under the BTO (build to order) model, exclusively in Japan.

Alphacool International GmbH, based in Braunschweig, has been a pioneer in PC water cooling technology for over 20 years. With one of the most comprehensive product portfolios in the industry and over 20 years of experience, Alphacool is now expanding its portfolio with the new Eisblock Aurora Arc B580 Steel Legend + Challenger with Backplate.

The GPU water cooler is precisely tailored to fit the layout of ASRock's Intel Arc B580 Steel Legend and Challenger graphics cards. An updated fin structure, optimized water flow, and an improved jetplate ensure high cooling performance. The chrome-plated copper base offers excellent thermal conductivity and long-lasting durability. Subtle RGB lighting complements the elegant design and provides even illumination.

KOORUI, a rising global monitor brand, has launched the G2741L, a 27-inch gaming monitor equipped with Dual Mode Display, offering two distinct viewing modes in one device. Users can easily switch between a high-refresh-rate mode for smooth gaming and a standard mode tailored for work or daily use. With just one click, the G2741L delivers versatile performance for both play and productivity.

Designed for today's multi-purpose gamers and creators, the KOORUI G2741L features an innovative FHD 320 Hz / UHD 160 Hz Dual Mode, allowing users to switch between ultra-fast refresh rates for competitive gaming and ultra-high-definition resolution for cinematic visuals and creative tasks. No longer must users choose between performance and clarity—they can now have both.

TrendForce's latest investigations reveal that several negative factors weighed on the enterprise SSD market in the first quarter of 2025. These include production challenges for next-gen AI systems and persistent inventory overhang in North America. As a result, major clients significantly scaled back orders, causing the ASP of enterprise SSDs to plunge nearly 20%. This led to QoQ revenue declines for the top five enterprise SSD vendors, reflecting a period of market adjustment.

However, conditions are expected to improve in the second quarter. As shipments of NVIDIA's new chips ramp up, demand for AI infrastructure in North America is rising. Meanwhile, Chinese CSPs are steadily expanding storage capacity in their data centers. Together, these trends are set to reinvigorate the enterprise SSD market, with overall revenue projected to return to positive growth.

AAEON's UP brand (stock code: 6579) today announced the release of two new developer boards based on the new Intel Core 3 processor platform (formerly Twin Lake), the UP TWL and UP TWLS. Those familiar with the UP 710S, released by the company late last year, will no doubt see a pattern emerging with the continuation of the slimmer, more advanced features hosted by the UP TWLS, while the developer community will note the more classic features of the UP TWL, including the return of the Raspberry Pi-compatible 40-pin GPIO that came to be a signature of AAEON's UP Brand portfolio.

Both boards offer a choice of the Intel Core 3 Processor N355, Intel Processor N250, or Intel Processor N150 CPU, the latest in Intel's processing technology focused on low power, energy-efficient performance. However, it is clear from the circuit board design of each that the boards are tailored for different deployment environments, with AAEON slimming down the height of the UP TWLS to just 25.13 mm by placing both its I/O and CPU on the same side.

ASUS today announced the Pro WS Platinum series of power supplies, available in 3000-, 2200- and 1600-watt variants. These heavy-duty PSUs are built to power multiple GeForce RTX 5090 or NVIDIA RTX PRO 6000 graphics cards. Each unit features PCIe connectors upgraded with gold-plated copper pins for cooler operation as well as increased durability and improved power-delivery efficiency. These PSUs also feature dual-ball fan bearings and extruded aluminium heatsinks for long-lasting performance—all in a compact design. Plus, a 10-year warranty offers peace of mind over the long term.

Surprisingly compact but ready for the most powerful workstations
Whether a workstation handles hefty 3D rendering or next-gen AI workloads, these PSUs will deliver the power needed to thrive. The three variants of the ASUS Pro WS Platinum series each provide a different power ceiling, so users can select the one that best suits their needs. The 3000 W model is built to provide rock-solid, stable power delivery for up to four GeForce RTX 5090 graphics cards. The 2200 W model can power up to four GeForce RTX 5080 cards. The 1600 W model provides enough power to support up to two GeForce RTX 5090 graphics cards.

EIZO Corporation (TSE: 6737) today announced the release of the FlexScan EV2740S - a 27-inch 4K UHD (3840 x 2160) resolution monitor designed with energy efficiency in mind. It expands EIZO's lineup of FlexScan 4K UHD monitors and is equipped with features for streamlined operations, offering exceptional support for the increasingly diverse needs of modern business environments.

Previously, EIZO's 27-inch 4K offering for business was limited to the EV2740X - a Premium model. With the introduction of the EV2740S, which delivers essential performance and the sharp clarity of 4K, EIZO broadens its range to provide users with greater flexibility and choice based on their specific needs. The monitor's 4K UHD resolution displays four times more information compared to standard Full HD (1920 x 1080). This allows users to view more information at once on its 27-inch screen, greatly reducing the need to scroll or frequently switch windows.

Alphacool International GmbH from Braunschweig is a pioneer in PC water cooling technology. With one of the industry's most comprehensive product portfolios and over 20 years of experience, Alphacool is now expanding its Enterprise Solutions series with the new ES 1-Slot GPU water cooler for the NVIDIA H200 141 GB - a cooling solution specifically designed for professional use.

The cooler impresses with its compact 1-slot design, making it ideal for use in racks and cases with limited space. The space-saving rear-facing port layout simplifies integration into existing water cooling loops - even under demanding installation conditions. The cooling block is made from high-quality, chrome-plated copper, which is significantly more durable than conventional nickel plating. This combination offers reliable protection against corrosion, scratches, and thermal stress - ideal for continuous 24/7 operation in professional environments.

Intel's presentation at the VLSI Symposium in Japan offered a detailed look at the upcoming Intel 18A process, which is set to enter mass production in the second half of 2025. This node combines Gate-All-Around transistors with the PowerVia backside power delivery network, resulting in a completely new metal stack architecture. By routing power through the rear of the die, Intel has been able to tighten interconnect pitches on critical layers while relaxing spacing on the top layer, improving yield and simplifying fabrication. In standardized power, performance, and area tests on an Arm core sub-block, Intel 18A demonstrated roughly 15% higher performance at the same power draw compared to Intel 3. When operating at 1.1 volts, clock speeds increase by up to 25% without incurring additional energy costs, and at around 0.75 volts, performance can rise by 18%, or power consumption can drop by nearly 40%.

Under the hood, the process features significant cell height reductions: performance‑tuned cells measure 180 nanometers tall, while high‑density designs sit at 160 nanometers, both smaller than their predecessors. The front‑side metal layers have been reduced from between 12 and 19 on Intel 3 to between 11 and 16 on Intel 18A, with three additional rear metal layers added for PowerVia support. Pitches on layers M1 through M10 have been tightened from as much as 60 nanometers down to 32 nanometers before easing again in the upper layers. Low-NA EUV exposure is used on layers M0 through M4, cutting the number of masks required by 44% and simplifying the manufacturing flow. Intel plans to debut 18A in its low‑power "Panther Lake" compute chiplet and the efficiency‑core‑only Clearwater Forest Xeon 7 family. A cost-optimized 17-layer variant, a balanced 21-layer option, and a performance-focused 22-layer configuration will address different market segments.

MSI, a global leader in high-performance computing, is committed to advancing innovation in AI, design, and productivity. MSI proudly introduces the Cubi NUC AI+ 2MG, a groundbreaking mini PC that harnesses the power of Copilot+ PC in an exceptionally compact 0.826-liter form factor. This device is engineered to deliver intelligent computing and seamless AI experiences without sacrificing performance or versatility.

The Cubi NUC AI+ 2MG is equipped with a powerful Neural Processing Unit (NPU) that enables advanced on-device AI capabilities. Users can benefit from features such as Live Captions with Live Translation, Cocreator, Click-to-Do, Recall, and more. These AI tools empower users to work more efficiently, create at a faster pace, and interact with their PCs in a more natural way, all while ensuring smooth multitasking and responsiveness in daily operations.

Razer, the leading global lifestyle brand for gamers, today announced the launch of the Razer Hammerhead V3 Wired Earbuds, a wired audio solution designed to deliver detailed sound, all-day comfort, and broad compatibility across a wide range of gaming devices. Featuring powerful 11 mm dynamic drivers, an ergonomic noise-isolating design, and support for both 3.5 mm and USB-C connections, the Hammerhead V3 is built for users who value versatility and convenience in a compact form.

As gaming and entertainment increasingly span multiple platforms, the Hammerhead V3 Wired Earbuds offer a practical solution for users seeking consistent audio performance—whether at home or on the move. From casual listening to focused gameplay, the gaming earbuds are designed to adapt to a variety of use cases.

Transcend Information, Inc. (Transcend), a global leader in storage and multimedia solutions, proudly announces the launch of its new SSD475P 2.5" solid-state drive, purpose-built for industrial applications and high-performance environments. Featuring Power Loss Protection (PLP) technology, the SSD475P uses built-in capacitors to continue supplying power during unexpected power outages, ensuring data is properly written and significantly reducing the risk of data loss.

The SSD475P is equipped with a SATA III 6 Gb/s interface and 112-layer 3D NAND flash, offering storage capacities of up to 8 TB, combining high-speed access with exceptional capacity. With sustained read/write speeds of up to 560/530 MB/s and a built-in DRAM cache, the drive enhances random access performance and overall endurance. Thanks to its Direct Write firmware, the SSD475P provides outstanding write stability for prolonged, intensive data workloads. It ensures consistent write speeds without throttling, making it ideal for industrial use cases involving frequent access and high write volumes, such as industrial PCs, embedded systems, and data logging devices.

Valve has rolled out a significant upgrade to its in-game performance tools with the June 17 Beta client update. Instead of a simple FPS counter, Steam now offers a full Performance Monitor that tracks frame rate alongside CPU and GPU utilization, clock speeds, temperatures, and memory usage. Players can view real-time graphs for each metric or opt for a pared-down display showing only FPS. The overlay also flags when frame-generation features like DLSS or FSR are active, clearly separating true rendered frames from those created by upscaling technology. This clarity helps gamers understand whether a smooth experience results from extra generated frames or genuine improvements in rendering.

Competitive and detail-focused users will appreciate knowing both the true game-frame counts and upscaled FPS so they can fine-tune settings based on actual performance. If the monitor shows full GPU memory, reducing texture quality becomes an obvious fix, and if CPU usage is maxed out, dialing back physics or draw distance may be the answer. Currently, the Performance Monitor is only available to Steam Beta participants. Valve plans to roll out additional metrics over time and notes that not every feature will be compatible with every system from the start. Anyone curious to try the new tools should switch to the beta client and explore the updated overlay options. Once these features reach full release, millions of PC gamers will have powerful diagnostics at their fingertips, making it easier than ever to balance visual quality with smooth performance.

Keysight Technologies, Inc. announced that it helped AMD accelerate the testing of electrical compliance for PCI Express (PCIe) specification for pre-production AMD server CPUs. By providing early access to beta software, Keysight enabled AMD to develop and test a PCI Express technology-capable server motherboard operating at up to 64 GT/s. The server was shown for the first time at the PCI-SIG Developer's Conference June 11-12 in Santa Clara, CA.

PCIe 6.0 is the latest version of the high-speed interface that connects components inside servers and computers. With speeds of up to 256 GB/s using 16 lanes, PCIe 6.0 is designed to enable faster data transfer, lower latency, and better energy efficiency. These improvements make it a key enabler for the deployment of artificial intelligence (AI) technologies supporting the development of more advanced and efficient AI applications. The performance of PCIe 6.0 over PCIe 5.0 represents a significant improvement and a critical requirement for servers to easily interface with accelerator modules used in AI applications, as well as next-generation deployments of 802.3dj Ethernet communications.

Texas Instruments (TI) today announced its plans to invest more than $60 billion across seven U.S. semiconductor fabs, making this the largest investment in foundational semiconductor manufacturing in U.S. history. Working with the Trump administration and building on the company's nearly 100-year legacy, TI is expanding its U.S. manufacturing capacity to supply the growing need for semiconductors that will advance critical innovations from vehicles to smartphones to data centers. Combined, TI's new manufacturing mega-sites in Texas and Utah will support more than 60,000 U.S. jobs.

"TI is building dependable, low-cost 300 mm capacity at scale to deliver the analog and embedded processing chips that are vital for nearly every type of electronic system," said Haviv Ilan, president and CEO of Texas Instruments. "Leading U.S. companies such as Apple, Ford, Medtronic, NVIDIA and SpaceX rely on TI's world-class technology and manufacturing expertise, and we are honored to work alongside them and the U.S. government to unleash what's next in American innovation."

ASUS is proud to announce that the ProArt P16 (H7606), updated with the latest NVIDIA GeForce RTX 50 Series graphics and paired with the AMD Ryzen AI 9 HX 370 processor (featuring up to 50 TOPS with the AMD XDNA NPU), is now available for purchase at the ASUS Store and Best Buy (H7606WP-PB99T / H7606WP-P16.R95070).

These top-of-the-line components are housed in a premium, compact 16-inch Nano Black chassis. At just 0.59" thin and weighing 4.08lb, ProArt P16 is the ultimate powerhouse for on-the-go creativity, gaming, productivity, and more. It is also a Copilot+ PC and features the ASUS-exclusive StoryCube and MuseTree apps to streamline creativity and accelerate ideas - made possible by the power of fully local AI. StoryCube is a smart, convenient, and powerful digital asset-management tool with AI assistance for scene categorization and clip generation, allowing users to effortlessly manage and export the contents of their file library. MuseTree transforms inspiration into imagery swiftly, allowing users to generate more creativity through simple graphical interactions, while intelligently storing and managing their ideas.

Intel today announced a series of leadership appointments aligned with its focus on strengthening customer relationships and becoming a more engineering-focused company. Greg Ernst, a respected sales leader with more than 20 years of Intel experience, has been named chief revenue officer. In addition, Srinivasan Iyengar, Jean-Didier Allegrucci and Shailendra Desai are joining Intel in key engineering leadership roles.

"We see significant opportunities ahead to strengthen our product offerings and meet the changing needs of our customers," said Lip-Bu Tan, CEO of Intel. "Greg, Srini, J-D and Shailendra are highly accomplished leaders with strong reputations across our ecosystem, and they will each play important roles as we position our business for the future."

AMD FSR 4 sees the introduction of a new AI ML-based upscaler replacing the shader-based one on FSR 3, which greatly improves image quality at every performance tier. The new technology, however, is exclusive to Radeon RX 9000 series GPUs powered by RDNA 4. This is because the AI ML model is designed for the newer high-throughput data formats that the AI accelerators of RDNA 4 GPUs can accelerate, which cuts out the older Radeon RX 7000 series GPUs based on RDNA 3, even the top RX 7900 XTX. The good news is that the modding community is making efforts to get FSR 4 to work on RDNA 3 GPUs. The bad news, however, is that while FSR 4 on RDNA 3 shows a marked improvement in image quality, there is a drop in performance.

Virtual-Cobbler-9930, a game modder, discovered a method to get FSR 4 to work in games such as "Cyberpunk 2077," a title which didn't even see an official implementation of FSR 3.1. For games to support FSR 4 through patches, it's generally expected of them to have FSR 3.1 support. Virtual-Cobbler-9930 found a way to inject FSR using a tool called OptiScaler, so the FSR 3.1 requirement is no longer necessary. By using a command called "WMMA_RDNA3_WORKAROUND," it is possible to activate FSR 4. It's worth noting, though, that the ML-based upscaler of FSR 4 will begin to bear down heavily on an RDNA 3 GPU, which lacks support for many of the high-throughput data sets that RDNA 4 GPUs do. This was confirmed in the "Cyberpunk 2077" test run, where performance was shown dropping from 85 FPS down to 56 FPS using the in-game benchmark tool; while offering image quality improvements. The source link below shows how Virtual-Cobbler-9930 got FSR 4 to work on "Cyberpunk 2077" in depth.

Voicemod, the world leader in real-time AI voice transformation, has launched its Voicemod Key hardware device in Europe. After selling out during its initial launch in the US, the company's new portable dongle brings the full Voicemod experience to consoles for the very first time in Europe.

Voicemod Key allows users to transform their voice live using 200 AI voices and access a soundboard with over 800,000 sounds. It works on the new Nintendo Switch 2, PlayStation and Xbox - bringing real-time voice transformation to platforms which do not natively support audio input applications.

Available today, Scape is designed to provide you with a rich, immersive, and intuitive wireless audio experience. It features custom-tuned drivers, high-resolution connectivity, and customizable EQ presets, delivering high-fidelity sound with effortless clarity and control. Using an integrated switch, you can choose to connect to multiple devices via Bluetooth 5.3 or enjoy ultra-low latency 24-bit/96 kHz wireless audio.

You can also communicate clearly thanks to the detachable microphone with flip-to-mute functionality, Super Wideband clarity and microphone noise cancellation. When it's time to step away, you can simply dock Scape in its magnet-assisted inductive charging stand, where it will recharge for up to 40 hours of continuous use, so it is always ready to pick up and play.

LG Display, the world's leading innovator of display technologies, announced today that it plans to make an investment in new OLED technologies at the trillion-KRW level to enhance its technological competitiveness and growth foundation. The company's board met on June 17 and approved an investment of KRW 1.26 trillion in new OLED technologies to secure a leading position in the display market.

It will focus on infrastructure development, including facilities for applying new OLED technologies. The investment period has been set for approximately two years, from June 17, 2025, to June 30, 2027. This investment is part of LG Display's mid- to long-term capital expenditure (CAPEX) plan, and efforts to improve the company's financial structure will continue independently of it.

GEEKOM, a leading innovator in mini PC technology, is set to release its latest powerhouse, the GEEKOM IT15, setting a new benchmark for compact computing. Designed for professionals and businesses, this ultra-compact mini PC combines high-performance processing, robust stability, and unparalleled connectivity, making it the perfect solution for modern workspaces.

At the heart of the IT15 is Intel's 2nd Gen Core Ultra processor (up to Ultra 9), which delivers enhanced single-core performance and improved energy efficiency. By eliminating Hyper-Threading, the system optimizes pure computing power, ensuring rapid response times and higher productivity. With a turbo clock of up to 5.4 GHz, it effortlessly handles demanding tasks such as video editing, coding, and graphic design. The IT15 also leverages AI-driven performance optimization, enhancing system efficiency for task scheduling, power management, and content creation workflows.

AGON by AOC - the world's leading gaming monitor brand - once more pushes the boundaries of affordable competitive gaming with three new QHD monitors that deliver esports-level refresh rates without the premium price tag. Leading the charge is the groundbreaking AOC GAMING Q25G4SR that achieves an incredible 300 Hz refresh rate in a compact 24.5-inch (62.2 cm) form factor, joined by the 27-inch (68.6 cm) feature-rich Q27G4ZR and the value-focussed Q27G42ZE models, which both deliver a 240 Hz performance with overclocking headroom to 260 Hz.

Compact powerhouse with exceptional clarity and speed
The Q25G4SR stands out as a rare offering in the gaming monitor market, delivering a QHD (2560x1440) resolution in the compact 24.5-inch division. With an impressive pixel density of 119.89 PPI, it is the spiritual successor of the beloved AOC GAMING Q24G2A from the G2 series, providing gamers with a combination of high resolution and compact size that many enthusiasts have been waiting for.

When we heard the news that NVIDIA will be halting shipments to Chinese customers for its GeForce RTX 5090D GPU in Q2, there were some speculations that the company is preparing to make a comeback. Leaving out the Chinese market is a tough decision from a business standpoint, but NVIDIA complies with export regulations imposed by the US administration under Donald Trump. However, the company now plans to keep its presence in China with the release of the export-abiding GeForce "RTX 5090DD" GPU. Carrying a GB202-240 die, it will be a cut-down version with reportedly only 14,080 CUDA cores present, paired with 24 GB of GDDR7 memory.

Chinese gamers will notice a significant difference, but so will anyone trying to acquire these GPUs for non-gaming purposes. As the US administration has banned shipments of high-end chips to China to stop them from training military-grade AI, gaming GPUs have been a target of AI firms. Now, a modified GeForce RTX 5090 DD, which not only cuts with raw compute but also firmware, should be sufficient for gaming. Carrying a PG145 SKU 40 board, the new RTX 5090DD GPU will also feature a modified 384-bit bus for its 24 GB of memory, down from the original RTX 5090D's 512-bit bus.

Update 09:45 UTC: According to one of the most accurate NVIDIA leakers, kopite7kimi, the core count for this GPU is supposed to be 21,760 CUDA cores, with 575 W TDP. The leaker did note that there is some surprise, so NVIDIA has definitely changed something big under the hood to comply with export regulations.

AMD is pleased to announce that the initial devices in the Spartan UltraScale+ cost-optimized family are now in volume production! The three smallest devices, the SU10P, SU25P, and SU35P, are currently available for order with production device support in AMD Vivado Design Suite 2025.1. Built for cost-sensitive edge applications requiring high I/O, low power, and state-of-the-art security features, this new offering in the AMD Cost-Optimized Portfolio brings modernized connectivity, post-quantum cryptography, and more to the proven UltraScale+ portfolio of FPGAs and adaptive SoCs. First production shipments of the three lowest-density devices mark a significant milestone in the availability of proven, small FPGA solutions for the low and mid-range markets.

A Proven Foundation for Fast Time to Market
Engineers looking for cost-optimized, compact FPGAs also want simplicity and a fast time to market. They need programmable logic, high I/O, robust security, and world-class reliability. They also need tools that deliver push-button timing closure and rapid debug capabilities. Above all, they need a low-risk path to market. Built by the industry leader using proven UltraScale+ technology, Spartan UltraScale+ FPGAs deliver exactly that.

ASUS has recently held a charity auction with special edition ROG Astral GeForce RTX 5090 Dhahab Edition graphics card signed by NVIDIA's CEO, Jensen Huang. ASUS managed to raise $24,200, which will go to the TZU CHI USA Foundation, a volunteer-based non-governmental organization providing charitable assistance, medical aid, disaster relief, and educational services, and environmental protection programs to those in need.

The auction period lasted from June 4 to June 13, and showing how tight the race was, the three highest bidders were just $10 apart. As the ROG Astral GeForce RTX 5090 Dhahab OC Edition is quite a rare graphics card and sold exclusively in the Middle East, the one signed by Jensen Huang is quite a catch. Hopefully, it won't end up on eBay.

Microsoft has updated Windows Hello facial recognition to require a compatible color camera, in addition to infrared sensors, for user sign-in. Although this change was announced in April's Patch Tuesday release (KB5055523), many users only noticed the impact when their devices stopped authenticating in dark environments. Previously, Hello relied solely on IR sensors to capture a three-dimensional facial scan, enabling secure logins even in minimal lighting conditions. Microsoft says the new requirement addresses a spoofing vulnerability discovered earlier this year by ensuring that a visible image from the color camera accompanies the IR scan. Early reports have been mixed: some outlets confirm Hello no longer works in darkness, while others find that the glow of a laptop screen can suffice to illuminate the user's face.

A practical workaround involves disabling the color webcam in Device Manager, which forces Hello to revert to IR‑only authentication and restores dark‑room functionality. Disabling the webcam for video calls is not practical for everyone, particularly for those who need to attend mandatory daily meetings, especially in corporate settings. Fortunately, Windows Hello provides alternative sign-in options. Users can choose to sign in with a PIN, password, or fingerprint, all of which allow for quick and secure access without depending on facial recognition in low-light conditions.

QNAP Systems, Inc., a leading computing, networking, and storage solutions innovator, today launched its first 8-port full 10GbE Multi-Gig/Fiber Lite-managed switch, the QSW-L3208-2C6T. Featuring six 10GbE Multi-Gig RJ45 ports and two 10GbE SFP+/RJ45 combo ports, the switch also includes useful features such as LACP, QoS, and VLAN. The QSW-L3208-2C6T enables creators, small offices, and SMBs to build high-performance and reliable networks with flexible management on a budget.

"We've noticed that many creators and SMBs demand stable, high-speed networks without the complexity of full Layer 2 management," said Ronald Hsu, Product Manager of QNAP, adding "the QSW-L3208-2C6T is our first Lite-managed switch, offering just the right amount of management control for users to improve efficiency and troubleshoot quickly with minimal setup."

ASUS Republic of Gamers (ROG) today announced the ROG Astral GeForce RTX 5080 Dhahab CORE OC Edition graphics card, built to take style and performance to new frontiers. With the latest NVIDIA GPU architecture, cutting-edge thermal design and a premium aesthetic, the ROG Astral GeForce RTX 5080 Dhahab CORE OC is built for gamers who want a PC that plays well and looks incredible doing it.

The gold standard of GeForce RTX 5080 performance
The ROG Astral GeForce RTX 5080 Dhahab CORE OC Edition graphics card stands ready to let users reap the benefits of the new Blackwell architecture at the heart of the NVIDIA GeForce RTX 50 Series. This delivers fourth-generation ray tracing cores for incredible performance. Users also get NVIDIA DLSS 4 Super Resolution, Multi-Frame Generation and Ray Reconstruction, which help games run smoothly with graphics cranked up.

RuggON, a global provider of rugged computing solutions, announces the launch of the SOL 7, a groundbreaking 12-inch fully rugged tablet and the first powered by Intel Arrow Lake processors. Designed for high-performance computing in demanding environments, the SOL 7 delivers next-generation AI capabilities, robust durability and seamless connectivity for critical sectors including public safety, automotive applications, warehousing, logistics, and agricultural.

Unmatched AI Performance with Intel Arrow Lake
Powered by the latest the latest Intel Core Ultra 5/7 processor with integrated Intel AI Boost, the SOL 7 enables powerful on-device AI for real-time analytics, image recognition, and rapid decision-making. Equipped with a suite of data capture tools including optional 2D barcode scanner with OCR, NFC reader with FIDO2 security, smart card reader, fingerprint reader and UHF RFID reader, the SOL 7 empowers field professionals to operate smarter, faster, and more securely.

Microsoft has confirmed it's developing a next-gen Xbox console with AMD as Xbox president Sarah Bond shared this news in a 60-second YouTube video promising to offer "an Xbox experience not tied to one store or limited to a single device." Bond announced Microsoft is teaming up with AMD for a "strategic multi-year partnership." This collaboration will involve co-engineering silicon "across a range of devices, including our next-generation Xbox consoles for your living room and your hands." The two companies will also join forces to build the next generation of Xbox Cloud Gaming. Microsoft is making it crystal clear that its next-gen Xbox platform will focus on multiple devices and won't be tied to its own store for games.

"This is all about creating a gaming platform that stays with you so you can enjoy the games you like on different devices wherever you want—giving you an Xbox experience not restricted to one store or linked to a single device," Bond explains. "That's why we're working with the Windows team to make sure Windows becomes the top platform for gaming". This comes right after Microsoft announcement of its partnership with ASUS to roll out two Xbox Ally handhelds in the coming months. These devices will feature a new full-screen Xbox interface running on Windows allowing Xbox Ally devices to access other platforms like Steam.

In a market reshaped by the compute demands of AI, Arteris, Inc. (Nasdaq: AIP), a leading provider of system IP for accelerating semiconductor creation, today announced an expansion of its multi-die solution, delivering a foundational technology for rapid chiplet-based innovation. "In the chiplet era, the need for computational power increasingly exceeds what is available by traditional monolithic die designs," said K. Charles Janac, president and CEO of Arteris. "Arteris is leading the transition into the chiplet era with standards-based, automated and silicon-proven solutions that enable seamless integration across IP cores, chiplets, and SoCs."

Moore's Law, predicting the doubling of transistor count on a chip every two years, is slowing down. As the semiconductor industry accelerates efforts to increase performance and efficiency, especially driven by AI workloads, architectural innovation through multi-die systems has become critical. Arteris' expanded multi-die solution addresses this shift with a suite of enhanced technologies that are purpose-built for scalable and faster time-to-silicon, high-performance computing, and automotive-grade mission-critical designs.

NVIDIA has released the latest version of its GeForce Game Ready drivers, version 576.80 WHQL. The new drivers fix a couple of gaming and general bugs, and are Game Ready drivers which means these bring day-0 support for Remedy Entertainment's co-op multiplayer game, FBC: Firebreak, which includes full ray tracing, DLSS 4 with Multi Frame Generation, DLSS Frame Generation, DLSS Super Resolution, DLSS Ray Reconstruction, and NVIDIA Reflex. It also adds support for REMATCH, coming with DLSS 4 With Multi Frame Generation support, and support for DOOM: The Dark Ages' new update, which adds path tracing and DLSS Ray Reconstruction. The new drivers also add support for 46 new and updated NVIDIA app DLSS overrides, and 4 new Optimal Playable Settings profiles.

NVIDIA also fixed several gaming and general bugs, including stability issues in games like Dune: Awakening, EA Sports FC 25, Clair Obscur: Expedition 33, Marvel Rivals, Gray Zone Warfare, Forza Horizon 5, and others, a well as some general bugs including GeForce RTX 5090 FE acoustic improvements for idle and low loads, and fix for an issue where certain DisplayPort 1.4 monitors may display random black screen flicker when connected to DisplayPort 2.1 graphics card.

DOWNLOAD: NVIDIA GeForce 576.80 Game Ready WHQL

GIGABYTE, the world's leading computer brand, announces the availability of the MO27Q2A QD-OLED gaming monitor, the brand's first QHD 280 Hz OLED display. Featuring a blazing-fast 280 Hz refresh rate, 0.03 ms GtG response time, and VESA ClearMR 15000 certification, the MO27Q2A delivers ultra-smooth motion and competitive speed for next-gen gaming.

Built with a 27" 2560×1440 OLED panel, the MO27Q2A supports DisplayHDR True Black 400, offers 99% DCI-P3 color gamut, Delta E<2 color accuracy, and reaches up to 1000 nits peak brightness with HDR Peak 1000 Mode, delivering stunning contrast and vibrant visuals. The monitor is also G-SYNC Compatible and supports AMD FreeSync Premium Pro, ensuring smooth and tear-free gameplay.

TerraMaster, a leading innovator in storage solutions, proudly announces the launch of D4 SSD, a 4-bay all-flash direct-attached storage (DAS) enclosure designed for media creators, filmmakers, and professionals seeking unparalleled speed and flexibility. With USB4 support delivering up to 40 Gbps bandwidth, the D4 SSD offers exceptional performance and seamless integration with NAS systems, including the forthcoming TerraMaster F4 SSD All-Flash NAS, easily expand the storage space of NAS to meet users' diverse storage needs.

The D4 SSD utilize the USB4 protocol with support for up to 40 Gbps data transfer bandwidth. When equipped with four M.2 SSDs (such as Samsung 990PRO 4 TB) and configured as RAID 0 via macOS Disk Utility, it achieves read/write speeds of up to 3224 MB/s. In single-disk operation, read speeds can reach 1608 MB/s. Fully compatible with Thunderbolt 3/4/5 and USB4/3.2/3.1/3.0 protocols, the D4 SSD offers exceptional cross-platform compatibility.

Marvell Technology, Inc., a leader in data infrastructure semiconductor solutions expanded its custom technology platform with the launch of the industry's first 2 nm custom Static Random Access Memory (SRAM), designed to boost the performance of custom XPUs and devices powering cloud data centers and AI clusters. Combining advanced custom circuitry and software from Marvell with core SRAM and cutting-edge 2 nm process technology, Marvell custom SRAM delivers up to 6 gigabits of high-speed memory while significantly reducing memory power consumption and die area at comparable densities.

Custom SRAM is the latest Marvell innovation designed to enhance memory hierarchy performance within accelerated infrastructure. Marvell previously introduced its CXL technology for integration into custom silicon to add terabytes of memory and supplemental compute capacity to cloud servers and unveiled custom HBM technology that increases memory capacity by up to 33% while reducing the space and power required for dense high-bandwidth memory (HBM) stacks inside XPUs.

Corsair today launched the Multi Frame Pegboard for Platform:4, a smart vertical expansion that clears clutter off your desk and keeps gear within easy reach. Designed to attach seamlessly to the Platform:4 desk, this versatile add-on creates new space for storing, organizing, and displaying everything from streaming hardware to tools and collectibles.

Featuring two pegboards, three adjustable shelves, and 13 included hooks, the Multi Frame Pegboard is all about flexibility. Its sturdy aluminium 3060 T-channel rails follow a universal standard, supporting a wide range of aftermarket accessories. Included t-nuts and adapters make it easy to mount Elgato gear like the Key Light and Flex Arm, or even your own 3D-printed hardware. Horizontal and vertical rails allow hardware to be mounted exactly where it's needed, and shelves can be repositioned to match each user's setup.

AMD today formally launched a slew of new hardware for workstations. These include the new Ryzen Threadripper PRO 9000 "Shimada Peak" line of high core-count processors, and the Radeon AI PRO 9000 line of graphics cards that cover a range of use-cases spanning from edge AI acceleration to professional visualization. The Threadripper 9000 series is based on the "Zen 5" microarchitecture, and "Shimada Peak" is a variant of the "Turin" MCM powering 5th Gen EPYC processors, which comes with workstation-relevant I/O. Meanwhile, the Radeon AI Pro 9000 series is based on the same RDNA 4 graphics architecture powering the Radeon RX 9000 series gaming graphics cards.

The Ryzen Threadripper 9000 series comes with CPU core counts of up to 96-core/192-thread, with an IPC uplift from the "Zen 5" microarchitecture over the previous Threadripper 7000 series "Storm Peak" processors powered by "Zen 4." More than IPC, workstation users should benefit greatly from the architecture's full 512-bit FPU data-path, offering significant increases in performance of applications that leverage the AVX-512 instruction set. AMD also fine-tuned the IOD (I/O die) to support increased memory speeds of DDR5-6400 (native), AMD EXPO profiles, and CKD. With these changes, and minor increases in clock speeds for certain SKUs, AMD is promising a 16% uplift in performance over the Threadripper 7000 series predecessors in workstation benchmarks, and a significant 25% increase in SPEC Workstation AI and ML benchmarks (comparing identical core-counts and frequency).

The developer of the Lossless Scaling utility has released version 3.1, introducing both visual enhancements and significant performance improvements, up to 2x in "Performance Mode" depending on hardware and settings. Although there may be a slight dip in image fidelity, users with older graphics cards or integrated solutions will appreciate the ability to boost frame rates without lowering resolution. In addition to this new mode, the v3.1 update improves timestamp filtering for sharper details during rapid motion and refines border handling to eliminate jagged edges. Ghosting and object flicker have been reduced, and smarter interface detection keeps menus and heads‑up displays stable under scaling. Frame generation is powered by LSFG, while scaling options include LS1, AMD FidelityFX Super Resolution, NVIDIA Image Scaling, Integer Scaling, Nearest Neighbor, xBR, Anime4K, Sharp Bilinear and Bicubic CAS.

Version 3.1 also expands localization support to include Finnish, Georgian, Greek, Norwegian, Slovak, and even the constructed language Toki Pona, reflecting the tool's growing international audience. Developed and maintained by a single creator, Lossless Scaling competes directly with proprietary upscalers, such as NVIDIA DLSS and AMD FSR, without requiring dedicated machine-learning hardware and is offered at a one-time price of $6.99. Its built‑in algorithms are tailored to different content types: LS1 or AMD FSR is recommended for modern games, Integer Scaling or xBR works best for pixel‑art titles, and Anime4K excels with cartoons or anime. For optimal results, users should cap their game at a stable frame rate to provide the utility with sufficient resources to operate and run their titles in windowed mode on Windows 10 version 1903 or later.

A new version of Plasma is here, and it feels even more like /home, as it becomes smoother, friendlier and more helpful. Plasma 6.4 improves on nearly every front, with progress being made in accessibility, color rendering, tablet support, window management, and more. As this is going to be a long read, let's get right into it…

Window Management
Plasma already offers Virtual Desktops to help organize your windows and activities; and customizable Tiles you can stick windows to so they don't overlap, allowing you to see everything important at a glance.

More confirmations regarding the final release of the Intel Arc "Battlemage" B770 GPU have landed, this time with the update of the popular AIDA64 tool. Just days after support for BMG-G31 GPUs, supposedly the SKUs behind the higher-end B770 and B750 models, has landed in the open-source Mesa driver, diagnostic tools are next. In the latest AIDA64 beta version 7.99.7817, FinalWire has added an interesting "GPU information for Intel Battlemage (BMG-G31)" section as a feature update. This means that the tool can now officially recognize Intel's upcoming GPUs and allow users to perform diagnostics. Additionally, the tool also supports the now finalized PCI Express 7.0 controllers and devices, as PCI-SIG has ratified the final specifications of the PCIe Gen 7 standard.

With this confirmation, higher-end Intel Arc B770 and B750 GPUs are getting more credibility for an actual release. We expect to hear more about it in the coming weeks as the rumored Q4 launch nears. Earlier rumors suggest that Intel will pair 32 Xe2 cores for the B770 model with 16 GB of GDDR6 memory on a 256-bit bus. Will Intel satisfy the needs of Arc graphics gamers who have been waiting for a higher-end card remains to be seen. Drop your expectations in the comments, and let us know.

GAMDIAS, a global leader in high-performance gaming hardware, proudly announces the launch of the ATHENA P3, a cutting-edge mid-tower chassis engineered for gamers and PC enthusiasts who demand uncompromising airflow and expansive hardware support. Continuing the legacy of the ATHENA series, the ATHENA P3 features a mesh-dominant front panel with dual solid bar accents, delivering both strong airflow performance and a bold, streamlined design. "Our design philosophy with the ATHENA P3 was to merge premium airflow with visual appeal and builder-friendly features," said Stimson Wang, CEO of GAMDIAS Technology. "This case reflects our pursuit of high-performance computing with seamless aesthetics and thoughtful design elements that elevate any gaming setup."

AIRFLOW-OPTIMIZED DESIGN WITH GAP BRIDGING BRACKET AND HIGH-PERFORMANCE FANS
Built for superior thermal performance, the ATHENA P3 is equipped with three 140 mm PWM ARGB intake fans at the front and a single 140 mm PWM ARGB exhaust fan at the rear, delivering optimized airflow straight out of the box. At the heart of its design is a gap-bridging front bracket, uniquely developed to seal airflow leaks between the mesh panel and the fan mounts—ensuring consistent, focused cooling efficiency. The case also includes a pre-installed 8-port PWM ARGB hub for streamlined control of fans and lighting through motherboard synchronization or the dedicated LED button. A seamless tempered glass side panel offers a clean, unobstructed view of your build, showcasing its cooling power and craftsmanship.

Synopsys, Inc. announced today its ongoing close collaboration with Samsung Foundry to power the next generation of designs for advanced edge AI, HPC, and AI applications. The collaboration between the companies is helping mutual customers achieve successful tape-outs of their complex designs using Synopsys' 3DIC Compiler and Samsung's advanced packaging technologies with fast turnaround time. Mutual customers can improve power, performance and area (PPA) with certified EDA flows for SF2P process, and minimize IP integration risk with the high-quality portfolio of IP on Samsung's most advanced process technologies.

"The adoption of Edge AI applications is driving the need for advancements in semiconductor technologies to enable complex computational tasks, improve efficiency, and expand AI capabilities across various industries and applications," said John Koeter, senior vice president for the Synopsys IP Group. "Together with Samsung Foundry, we're enabling the most advanced AI processors across a broad spectrum of use cases from high-performance AI inference engines for data centers to ultra-efficient Edge AI devices like cameras and drones, all optimized for development on sub-2 nm Samsung Foundry process technologies."

EPOS today announced a new and improved IMPACT 100 Series. A key addition to the expansion of the IMPACT Next Generation portfolio is to include a quality entry-level headset with expectational performance for its cost. Designed to meet the needs of call centric workers with upgraded leatherette earpads, great audio and an ultra-light weight design of just 76 grams for comfortable all-day usage. Coming with a full certification package for leading UC providers, the IMPACT 100 Series provides enterprise grade performance across platforms.

Key features include:

• Professional quality and affordable audio for everyone: Get exceptional value for money with this entry-level headset certified for Microsoft Teams and leading UC platforms.
• Ultra-light design for all-day comfort: The lightest stereo headset in its category at only 76 grams, it features a slim, soft silicone headband and leatherette earpads.

The US Navy Exchange (NEX) store has become a surprising platform for acquiring NVIDIA's RTX 50-series graphics cards at their manufacturer's suggested retail prices. A Reddit user, known as Accomplished-Feed123, shared that by combining various store promotions and credit card rewards, they managed to purchase a GeForce RTX 5090 Founders Edition for just $1,900, which is significantly below the typical retail price. Savvy shoppers have long discovered open‑box electronics and gaming hardware bargains there. On this occasion, the Reddit user noticed several "largeish brown boxes" hidden behind a locked display that usually houses Apple products.

Those boxes contained multiple RTX 5070 and RTX 5080 cards, along with a single RTX 5090, all priced at their suggested MSRPs of $550, $999, and $1,999, respectively. A quick online search of the part numbers confirmed that the top‑end card was indeed the Founders Edition model. After applying applicable discounts and card rewards, Accomplished‑Feed123 walked away, paying only $1,900 out of pocket. Access to NEX is restricted to active and retired military members and their families, operating under the motto "You Serve, You Save." However, many consumers may know someone eligible for these benefits. Other branches of the US armed forces maintain similar exchange stores, though GPU availability and pricing may differ by location.

Leading provider of advanced AI solutions AAEON has released a new addition to its AI Inference Server product line, the MAXER-5100 - the world's first 8L AI inference server equipped with two integrated GPUs. The MAXER-5100's default model comes with the 24 core, 32 thread 14th Generation Intel Core i9 processor 14900K and two onboard NVIDIA RTX 2000 Ada GPUs. Meanwhile, a barebone SKU is available, accommodating up to 65 W CPUs from across the 12th, 13th, and 14th Generation Intel Core processor lines as well as PCIe slots for other compatible GPUs, per project need.

Given the processing power and AI performance the system offers, the MAXER-5100 is primarily positioned as a central server for the management of multiple edge devices, particularly with its Certificate Authority (CA) support granting additional security for smart infrastructure, healthcare, and advanced manufacturing applications. Moreover, the MAXER-5100's use of a zero-trust secure tunnel and onboard TPM 2.0 allows for encrypted data transmission between the server and multiple edge devices, as well implement over-the-air updates and remote diagnostics.

Sharkoon today announced the SKILLER SGK50 S4 Gen 2 series keyboards. With the SKILLER SGK50 S4 Gen 2, our bestselling keyboard has been given an update. The Gen 2 version has everything that our SGK50 series has always had, including hot-swap switches and keycaps, as well as a stylish coiled cable. In addition, the keyboard is now fully customizable using the open-source software VIA and QMK, and there is improved sound thanks to the polycarbonate plate and double-layer silicone damping.

The SKILLER SGK50 S4 Gen 2 is fully designed for gaming, which is why the popular Gateron Yellow linear switches are already pre-installed. Any switch with 3 or 5 pins can be used with the SKILLER SGK50 S4 Gen 2, allowing you to enjoy experimenting with switches to achieve the optimal typing feel. The required hot-swap tools are already included with the keyboard. The SKILLER SGK50 S4 Gen 2 catches the eye with its compact form factor that is 60 percent of a full 3-block keyboard. Nevertheless, thanks to the double assignment of keys for important commands, a layout with full functionality can be relied on.

Intel appears set to retain its familiar 48 PCIe lanes while delivering a significant memory speed boost with the upcoming "Nova Lake‑S" desktop platform. Hardware leakers have shared fresh details indicating that Intel will allocate 24 PCIe 5.0 lanes directly from the CPU, with an additional four DMI Gen 5 lanes connecting to the chipset. The chipset itself will provide eight PCIe 5.0 lanes alongside sixteen PCIe 4.0 lanes, matching the total lane count of current-generation parts. For storage and peripherals, the new platform will support eight SATA 3.0 ports along with a wide assortment of USB options. Fourteen USB 2.0 ports will cover legacy devices, while five USB 3.2 ports at 20 Gbps, 10 at 10 Gbps, and 10 more at 5 Gbps. The CPU's PCIe lanes can be configured in multiple ways to suit different use cases: one 16-lane slot paired with two 4-lane connections, two 8-lane slots plus two additional 4-lane links, or a four-by-four configuration supplemented by two extra 4-lane connections.

Memory support is where Nova Lake‑S will shine. Whereas the current Arrow Lake-S lineup handles DDR5-6400 natively and may reach 9200 MT/s when overclocked, Nova Lake-S will offer 8000 MT/s out of the box in a one-DIMM per channel, single-rank configuration. This enhancement is expected to provide a performance boost for data-intensive tasks and games, where the rumored 52-core top-of-the-line SKU will need all the possible bandwidth to feed so many cores. A new LGA 1954 CPU socket and motherboard design will be required, although it remains unclear whether the improved memory speed stems from a redesigned on-die integrated memory controller or advanced motherboard trace layouts and power delivery systems. Partners have received preliminary specifications, but no engineering samples or motherboard prototypes have appeared in public benchmarks or regulatory filings as of yet.

Gearbox and 2K today opened Borderlands 4 pre-orders, with the rather unexpected $69.99 base game price resulting in a simultaneous sigh of relief following the gaming industry's recent move towards $80 AAA games. Following the pre-order launch, Borderlands 4's Steam page revealed the game's minimum system requirements as a bit of a mixed bag. According to the Steam page, the new looter shooter will only run on an AMD Radeon RX 5700 XT or NVIDIA GeForce RTX 2070, but this seems to largely be related to VRAM, since the minimum requirements also mentions that 8 GB is the minimum VRAM amount. An SSD and an eight-core CPU—listed as the AMD Ryzen 2700X or Intel Core i7-9700—will also be mandatory for Borderlands 4. Even the recommended specifications for Borderlands 4 are rather moderate, with the NVIDIA GeForce RTX 3080 and Radeon RX 6800 XT making the cut.

In addition to the reasonable PC specs, news also broke about an ECHO-4 Collector's Edition, a curious edition to the line-up of special edition bundles for Borderlands 4 that seems to be exclusive to GameStop for now. The Echo-4 Collector's Edition bundle is a host of physical Borderlands 4 memorabilia, including a cloth map of Kairos, an eight-inch Echo-4 figure with LED lights, a Vault symbol necklace, a card with five SHiFT codes for Borderlands 4 golden keys, and four double-sided lithography art prints—all for $149.99. The one glaring omission from the Echo-4 bundle is an actual game key for Borderlands 4. That is clearly labelled as "sold separately" on the GameStop page.

Cadence today announced an expansion of its collaboration with Samsung Foundry, including a new multi-year IP agreement to broaden Cadence memory and interface IP solutions in Samsung Foundry's SF4X, SF5A and SF2P advanced process nodes. Furthering their ongoing technology collaboration, the companies are leveraging Cadence's AI-driven design solutions and Samsung's advanced SF4X, SF4U and SF2P process nodes to deliver high-performance, low-power solutions for AI data center, automotive—including advanced driver-assistance systems (ADAS)—and next-generation RF connectivity applications.

Cadence's AI-driven design solutions and comprehensive portfolio of IP and silicon solutions enhance designers' productivity and accelerate time to market (TTM) for leading-edge SoCs, chiplets and 3D-ICs on advanced Samsung Foundry processes. "We support a full portfolio of IP, subsystems and chiplets on the Samsung Foundry process nodes, and our latest multi-year IP agreement strengthens our ongoing collaboration," said Boyd Phelps, senior vice president and general manager of the Silicon Solutions Group at Cadence. "By combining Cadence's AI-driven design and silicon solutions with Samsung's advanced processes, we're delivering the leading-edge technologies our mutual customers need to innovate and bring their products to market faster."

SHADOW, the Global leader in high-performance cloud computing, is proud to announce the launch of Neo, a brand-new cloud gaming PC offering designed to deliver next-level RTX experiences for gamers, creators, and professionals alike. Neo will officially roll out in Europe and North America starting June 16, 2025.

Building on the success of the company's previous offers, Neo replaces its widely adopted "Boost" tier and delivers major performance leaps—up to 150% more in gaming and 200% more in pro software performance. All existing Boost users are being upgraded to Neo at no additional cost while new users rates will start at $37.99 per month.

As a laptop user, some days you just want more screen space to get more done efficiently. That kind of relatable experience has been sparking innovation for years with the Intel customer engineers who work side-by-side with PC-maker Lenovo in China. Their newest co-engineered laptop design, the Lenovo ThinkBook Plus Gen 6 Rollable, an Intel Core Ultra processor-powered AI PC, goes on sale June 19 with the world's first rollable laptop screen. It's able to vertically expand from 14 inches up to 16.7 inches with either a hand motion or the push of a button. It adds nearly 50% more screen space, all with the power of on-device AI and Microsoft Copilot+.

Everyday Benefits of This AI PC
This laptop minimizes the need for constant scrolling or multiple screens. Excel spreadsheets go from 39 visible lines of information to 66 lines when the screen rolls out. Coders will appreciate the enhanced vertical display that shows more lines. Multitasking and on-the-road presentations are easier as dual 16:9 displays fit on top of each other. And vertical apps like Instagram and TikTok are more easily seen on the portrait display.

Today, 2K and Gearbox Software announced that Borderlands 4 is now available for pre-order. The next installment in the critically and commercially-successful franchise that started a new genre of games will launch worldwide on September 12, 2025 via PlayStation 5 (PS5), Xbox Series X|S, and PC through Steam and the Epic Games Store. It will also be coming to Nintendo Switch 2 later in 2025.

"I've been blown away by how high the team at Gearbox have raised the bar for Borderlands 4," said David Ismailer, President of 2K. "The development team crafted a premium AAA adventure that evolves the series' gameplay and storytelling in new ways, while delivering on the quintessential Borderlands looter-shooter experience fans know and love."

Rumors of Intel's "Nova Lake-S" processors are increasing, meaning that the design is nearing completion. Expected to arrive in the second half of 2026, Nova Lake‑S will offer configurations ranging from mainstream quad‑core models to a flagship with 52 cores. Initial information suggests that Intel will employ a tile-based design, separating LPE cores from P-Cores and E-Cores to optimize flexibility and yield. At the top of the lineup is the rumored Core Ultra 9 model, possibly designated 385K. It will combine 16 P-cores, 32 E-cores, and four LPE-cores for a total of 52 cores, as previously rumored. With a TDP of 150 W, it will be the most powerful SKU Intel prepared for this generation. Below the flagship, Intel appears to be planning a Core Ultra 7 SKU with 14 P-cores, 24 E-cores, and four LPE cores, totaling 42 cores.

The Core Ultra 5 series may include three variants: a 28-core version with eight P-cores, 16 E-cores, and four LPE-cores; a 24-core version with eight P-cores, 12 E-cores, and four LPE-cores; and an 18-core model with six P-cores, eight E-cores, and four LPE-cores. Entry-level Core Ultra 3 parts would feature either a 16-core configuration with four P-cores, eight E-cores, and four LPE-cores, or a 12-core option with four P-cores, four E-cores, and four LPE-cores, both targeting a 65 W power envelope. All desktop SKUs are expected to feature four LPE cores on a separate die, suggesting a multi-tile package similar to Meteor Lake. Power demands will range from 65 W in entry-level segments to 150 W for high-end parts. Intel is reportedly preparing a new LGA 1954 socket even as it readies an Arrow Lake-S refresh for late 2025. Intel has also reportedly designated Xe3 "Celestial" for graphics rendering and Xe4 "Druid" for media and display duties.

MONTECH proudly announces the release of its newest air cooler, the NX400. Built for gamers, creators, and PC performance enthusiasts, the NX400 redefines the single-tower category with a precision-optimized heatsink, a newly developed static pressure fan, and premium features designed for effective thermal control. At the core of the NX400 is its refined heat sink, 52 fins engineered in precise alignment with the heat pipes to optimize airflow efficiency. This high-density structure ensures faster heat dissipation under intense CPU workloads, making it ideal for gaming and workstation-class performance.

Cooling power is further elevated by the newly developed E28 fan, a 28 mm-thick, high-static-pressure fan tuned for air cooling applications. Available in both ARGB and non-RGB versions, the E28 combines strong airflow with reduced turbulence, enabling the NX400 to deliver exceptional cooling. Vibration damping is managed through premium corner-covered footpads, ensuring stable operation and noise reduction even under full fan speeds. Up top, the glossy striped cover brings a sleek, professional finish, adding visual appeal without overpowering in style.

Intel is breathing new life into the Socket LGA1700 platform by giving it its fourth processor model generation, under the Core 100-series branding. These chips are based on the "Bartlett Lake-S" microarchitecture, but are designed to capture value price points. The main target of these chips are the gaming PC crowd. "Bartlett Lake-S" is a derivative of "Raptor Lake" but with the E-core clusters physically absent, and the chips only having "Raptor Cove" P-cores. A marketing slide for a new entry-level chip came to light, the Core 5 120F.

The Intel Core 5 120F is probably being designed for a sub-$150 price-point. The company's marketing material makes it abundantly clear that gamers that want maxed out 1080p AAA gaming experiences are the target audience of this chip. Core 5 120F comes with a 6-core/12-thread CPU, with six "Raptor Cove" P-cores, and no E-cores. The company didn't specify L2 cache size, but these are likely 1.25 MB per core. The six cores share an 18 MB L3 cache. It's highly likely that this particular silicon is physically similar to the "Alder Lake" H0 die, which also lacks any E-core clusters, physically only has six P-cores, and an 18 MB L3 cache. The Core 5 120F ticks at 2.50 GHz base frequency, with a 4.50 GHz maximum boost. It features a 2-channel DDR5 memory interface, supporting DDR5-4800 native memory speed, with support for up to 192 GB memory. The chip comes with 65 W processor base power.

Monitor brand KOORUI proudly presents the 34E6UC, a 34-inch ultra-wide curved display designed to elevate both productivity and entertainment. A 34-inch ultra-wide WQHD curved monitor designed to meet the growing demand for hybrid work tools and immersive digital experiences.

As remote work and home entertainment become popular trends, consumers are seeking display solutions that support seamless multitasking, vivid visuals, and ergonomic comfort. According to IDC, demand for ultra-wide monitors has grown over 15% year-over-year, driven by professionals, gamers, and digital creators.

GAMEMAX, an emerging brand of PC gaming components including gaming cases and power supply units, is proud to unveil the CLAW 360 and CLAW 460, two bold new entries in its desktop case lineup that bring aggressive design, exceptional airflow, and future-proof compatibility to gamers and creators alike. Designed for gamers and creators seeking standout style and serious thermal performance, both models debut the Bold New GAMEMAX Identity—featuring a claw-inspired front panel, exclusive sculpted ventilation mesh, and the all-new GAMEMAX brand logo. The compact CLAW 360 will launch first, followed by the full-sized CLAW 460 in the coming month.

The CLAW 360 is a compact microATX case that doesn't compromise on performance. Supporting GPUs up to 420 mm (NVIDIA 50 Series Ready), 240 mm ATX PSUs, 175 mm air coolers, and 360 mm radiators, it's designed for users who demand high performance in a smaller footprint. With support for up to 12x 120 mm fans and 4 pre-installed ARGB/PWM fans connected to a built-in controller, it delivers superior thermal performance and vivid lighting. The vertical airflow layout ensures efficient cooling even during intense gaming or workloads. The front I/O panel includes a high-speed USB Type-C Gen 2 port and USB 3.0, while an integrated, height-adjustable GPU support bracket prevents sag and adds durability to long-term builds.

BIOSTAR, a leading manufacturer of edge computing solutions, motherboards, graphics cards, and storage devices, is excited to introduce the AI-NONXS Developer Kit, a high-performance edge AI development platform engineered to accelerate edge AI deployment for system integrators and AI software developers. Designed to support NVIDIA Jetson Orin NX and Orin Nano series modules, the AI-NONXS Developer Kit empowers users to efficiently build and deploy AI-powered solutions across a broad range of real-world applications. From smart manufacture, smart retail, and automated warehouses to smart cities, transportation, and smart agriculture, the AI-NONXS provides the computing power, flexibility, and reliability required for advanced edge systems.

The AI-NONXS Developer Kit comes with a comprehensive set of industrial-grade interfaces, including 4 USB 3.2 Gen 2 Type-A ports, 1 Micro-USB port, dual Gigabit Ethernet (1 x 1GbE and 1 x 2.5GbE with optional Power over Ethernet), and RS232/422/485, CANBUS, TPM (opt.), audio Line-Out/MIC-In and Speaker out. It operates within a wide temperature range of -20°C to 60°C and supports a flexible power input range of 12 V to 20 V, ensuring reliable performance in harsh environments. For visual input and expansion capabilities, the kit includes HDMI 2.1 (for Orin NX) or HDMI 1.4 (for Orin Nano), dual MIPI CSI connectors, and three M.2 slots (Key-M, Key-E, and Key-B) for storage, wireless communication, and modular upgrades.

Make your PSU ready for more GPUs—get a free 16-pin to Dual 8-pin Adapter Cable with select MSI Power Supplies. Don't miss out on this exclusive offer! MSI MPG A1250GS PCIE5 and MPG A1000GS PCIE5 are built to handle AI PCs with ease. Advanced thermal solutions ensure cool, stable, and efficient operation, even under heavy loads, giving you the reliability and durability you need for gaming, streaming, or AI-powered tasks. The efficiency of your power supply significantly impacts overall power consumption. The Gold certification stands out as a reliable benchmark for energy efficiency, ensuring that your power supply delivers lower energy consumption and operates at higher efficiency levels.

TrendForce's latest research reveals that despite ongoing macroeconomic challenges, both buyers and sellers remain bullish on the OLED monitor panel market. Following a remarkable 132% YoY growth in 2024, this strong momentum is expected to carry over into 2025. As a result, TrendForce has revised its 2025 OLED monitor panel shipment forecast upward from 2.8 million to 3.4 million units—raising the annual growth rate from 40% to 69%.

While the broader panel market is feeling the strain of the U.S.'s reciprocal tariffs, the OLED monitor segment has been relatively insulated and continues to exhibit strong growth. One key driver is the high acceptance of OLED monitors among gaming enthusiasts, encouraging brands to expand their OLED gaming product lines. In parallel, Korean panel makers are increasingly shifting their focus toward OLED monitors.

AMD began rolling out its latest AGESA ComboAM5 microcode for Socket AM5 platforms, as confirmed by an ASUS BIOS update for its ROG Crosshair X870E Hero motherboard. The company will likely get motherboard vendors and prebuilt OEMs to release BIOS updates with the new AGESA 1.2.0.3e microcode for both AMD 600-series and AMD 800-series chipset motherboards. Version 1.2.0.3e patches a security vulnerability with the firmware TPM (fTPM) component needed to establish a hardware root of trust. This is also a minimum system requirement for Windows 11. The vulnerability discovered by Trusted Computing Group, involves an OOB (out of bounds) read method that could compromise the root of trust.

Interestingly, the ASUS change-log mentions that AGESA 1.2.0.3e introduces support for an "upcoming CPU." We know from older reports that this upcoming CPU is the Ryzen 9000G "Gorgon Point" desktop APU. These processors are based on the 4 nm "Gorgon Point" monolithic silicon, which is a revision of "Strix Point," similar to how "Hawk Point" was to "Phoenix Point." There are no changes to the IP of either the CPU complex, or the iGPU, or even the NPU, but updates to their clock speeds or boosting algorithm. The CPU consists of two CCX, one with four "Zen 5" cores sharing a 16 MB L3 cache; and the other with eight "Zen 5c" cores sharing an 8 MB L3 cache. The iGPU is based on the RDNA 3.5 graphics architecture, and comes with 16 compute units. The NPU is based on XDNA 2, and offers at least 50 AI TOPS, giving the chip Microsoft Copilot+ local acceleration capability. The PCIe complex is Gen 4, and the main PEG interface is narrowed down to PCI-Express 4.0 x8.

On June 10, Taiwan's Ministry of Economic Affairs expanded its list of strategic export-controlled customers to include Huawei and Semiconductor Manufacturing International Corporation (SMIC). The ministry announced that this decision followed a review meeting focused on preventing the proliferation of arms and other national security concerns. Moving forward, any Taiwanese exporter must obtain formal government approval before shipping semiconductors, lithography machines, or related equipment to Huawei or SMIC. TSMC immediately confirmed its full compliance. Company representatives reminded stakeholders that no orders have been fulfilled for Huawei since September 2020 and pledged to enhance internal verification procedures to block any unauthorized transactions. These steps build on one‑billion‑dollar penalty, imposed after investigators determined that two million advanced AI chiplets had been supplied for Huawei's Ascend 910B accelerator without proper clearance.

For Huawei and SMIC, this latest measure compounds the challenges created by existing US export controls, which prohibit both companies from sourcing many US-origin technologies and designs. The two Chinese giants will accelerate efforts to develop domestic alternatives, yet true semiconductor independence remains a distant goal. Designing and building reliable extreme ultraviolet lithography systems demands years of specialized research and highly precise manufacturing capabilities. Scaling production without foreign expertise could introduce costly delays. In response, Chinese research institutes report that the country's first homegrown EUV lithography machines are slated to enter trial production in the third quarter of 2025. Meanwhile, state‑backed partners are racing to develop advanced packaging tools to rival those offered by ASML. Despite these initiatives, experts warn that catching up with global leaders will require substantial time and continued investment.

AMD is looking to introduce the Ryzen 7 9700F 8-core/16-thread processor to target a price-point well under $300, possibly around $250. Naming convention dictates that the processor will lack integrated graphics. Given that AMD hasn't released 65 W variants of its Ryzen 9000 series "Granite Ridge" processors, instead giving the 9700X a 65 W TDP out of the box, but with a motherboard BIOS-based "105 W mode" that improves boost frequency residency, the 9700F will likely have either the same or slightly lower clock speeds than the 9700X, a 65 W TDP, and likely even lack this "105 W mode." The idea for AMD would be to offer a decent alternative to the Core Ultra 5 245K.

The Ryzen 7 9700F will be based on the "Granite Ridge" MCM, with one 4 nm CCD that has eight "Zen 5" CPU cores, each with 1 MB of dedicated L2 cache, and sharing a 32 MB on-die L3 cache. The 9700X comes with 3.80 GHz base frequency that boosts up to 5.50 GHz, so the 9700F either sticks with these clock speeds with a 65 W power limit to offer performance resembling the 9700X out of the box, or a 100 MHz lower boost frequency out of the box, but with unlocked multipliers.

In a joint briefing this week, KAIST's Memory Systems Laboratory and TERA's Interconnection and Packaging group presented a forward-looking roadmap for High Bandwidth Memory (HBM) standards and the accelerator platforms that will employ them. Shared via Wccftech and VideoCardz, the outline covers five successive generations, from HBM4 to HBM8, each promising substantial gains in capacity, bandwidth, and packaging sophistication. First up is HBM4, targeted for a 2026 rollout in AI GPUs and data center accelerators. It will deliver approximately 2 TB/s per stack at an 8 Gbps pin rate over a 2,048-bit interface. Die stacks will reach 12 to 16 layers, yielding 36-48 GB per package with a 75 W power envelope. NVIDIA's upcoming Rubin series and AMD's Instinct MI500 cards are slated to employ HBM4, with Rubin Ultra doubling the number of memory stacks from eight to sixteen and AMD targeting up to 432 GB per device.

Looking to 2029, HBM5 maintains an 8 Gbps speed but doubles the I/O lanes to 4,096 bits, boosting throughput to 4 TB/s per stack. Power rises to 100 W and capacity scales to 80 GB using 16‑high stacks of 40 Gb dies. NVIDIA's tentative Feynman accelerator is expected to be the first HBM5 adopter, packing 400-500 GB of memory into a multi-die package and drawing more than 4,400 W of total power. By 2032, HBM6 will double pin speeds to 16 Gbps and increase bandwidth to 8 TB/s over 4,096 lanes. Stack heights can grow to 20 layers, supporting up to 120 GB per stack at 120 W. Immersion cooling and bumpless copper-copper bonding will become the norm. The roadmap then predicts HBM7 in 2035, which includes 24 Gbps speeds, 8,192-bit interfaces, 24 TB/s throughput, and up to 192 GB per stack at 160 W. NVIDIA is preparing a 15,360 W accelerator to accommodate this monstrous memory.

Welcome to the middle of June and to those that celebrate, happy midsummer. This week is jam crammed full of new releases, kicking off with a large-scale real-time modern warfare tactics game as our major release. If that's too complex for you, then maybe a spot of fishing is more your thing? Alternatively, we have some first-person shooter action from Finland or a new Diablo like game, if action is more of your thing. If that's not it, some 5v5 footie might be more of your cup of tea or how about a laid back MMORPG? Don't forget the other four games that might tickle your fancy, as some of them are quite big releases as well.

Broken Arrow / This week's major release / Thursday 19 June
Broken Arrow is a large-scale real-time modern warfare tactics game that combines the complexity of joint-forces wargaming with action-packed real-time tactics gameplay. Featuring over 300 realistic military units and technologies, each battle offers an immersive experience with endless replayability. Steam link