News Posts matching "DDR3"

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Team Group Announces Neptune Gaming SO-DIMM Memory

Team Group Inc., the world's leading memory brand, today launched the gaming laptop upgrade memory-Neptune. The global PC market is experiencing a stagnation at this point of time. Gaming has become the essential key to push forward the sustainable development of PC/NB. In this vigorously growing market, Team Group has built the gaming memory Neptune specifically for gamers. With two frequencies DDR3 2133/1600, it ensures both performance and compatibility, providing gamers laptop upgrade and excellent solutions for customized Steam Machine.

Instead of using traditional JEDEC standard, Team Group's all new Neptune gaming laptop memory will go further into the area of gaming with previous experience in developing overclocking memory. DDR3 2133/1600 SO-DIMM is not only created for gaming laptops, but also making it possible to minimize high performance PC. No matter you want to play an epic time traveling adventure game, or battle in the thrilling frontline of a war game, Neptune is able to offer infinite possibilities for upgrading gaming performance under the existing platform.

BIOSTAR Announces Hi-Fi Z170Z5 Combo Motherboard

BIOSTAR's latest Intel based motherboard features a DDR4 + DDR3 combo solution, Super Durable Solid Capacitors, and the BIOSTAR 6+ Experience. With BIOSTAR's enhancements users will enjoy mainboards that have enhancements in these areas of BIOSTAR expertise: Audio+, Video+, Speed+, Protection+, Durability+ and DIY+.

BIOSTAR's latest mainboard, the Hi-Fi Z170Z5 is based on Intel's H170 chipset which is a single-chip design that supports Intel 6th generation socket 1151 Intel Core processors. The Biostar Hi-Fi H170Z5 features support of either DDR3 or DDR4 memory modules with 2-DIMM DDR3L-1866(OC)/1600/1333 for up to a 16G maximum capacity and 2-DIMM DDR4-2133/1866 for up to a 32G maximum capacity.

QNAP Debuts the World's First Unified NAS-SAS Solution

QNAP, Inc. has sprung another surprise on the enterprise storage marketplace with the announcement of the new TVS-ECx80U-SAS-RP unified NAS-SAS storage solution. This new system bridges the gap between all three different types of drives: speedy all-SSD storage, large capacity SATA drives and cost-effective SAS HDD systems.

The new TVS-ECx80U-SAS-RP series marries high-performance 12 Gbps SAS drives with built-in ultra-high performance 256 GB SSD caching. Powered by QNAP's new QTS 4.2 management software along with the new Qtier automated data-tiering technology, the system keeps frequently accessed data readily accessible and infrequently accessed data close at hand in less-costly HDD storage, significantly improving the overall performance while reducing data warehousing costs.

MSI Reveals H170 PRO Series Motherboards

MSI, world leading in motherboard technology, announces its H110 based motherboards are ready to join the PRO Series product line. With new microATX sized models, available in both DDR4 or DDR3 low voltage DRAM solutions, the new MSI PRO Series motherboards completely fulfill small business needs and help to increase productivity greatly. The Windows 10 WHQL certified PRO Series motherboards offer the best in stability, security and reliability and present a plethora of new features and improvements as well as technical ingenuity.

Unique DDR4 Boost technology is designed with optimized traces and fully isolated memory circuitry. This design ensures the memory signals stay pure for optimal performance and stability. MSI M-Cloud is a convenient and secure way of saving personal files in the cloud which simplifies complicated settings with a user friendly interface and is easy to learn. Supports the new Intel Small Business Advantage and Small Business Basics solutions which are unique, customizable solutions that helps improve small businesses data security, maximizes employee productivity and boosts overall office computers' performance.

Arbor Solution Introduces Powerful, Rugged Fanless Box PCs

Arbor Solution introduces its FPC-7800 series of powerful, rugged fanless box computers. The FPC-7800 inherits the features of model FPC-7700, while updating the previous platform with a newer, more efficient Intel chipset. The new series offers a variety of configurations to cater to different expansion requirements, may be used in a variety of environmental conditions, and provides multiple storage options. The unit may also be mounted in a variety of ways.

"With its tremendous flexibility, the FPC-7800 is undoubtedly the flagship of our popular line of box PCs," noted Brian Yurkiw, Arbor Solution vice president. "Including the Intel Q87 chipset and a 4th generation Intel Core processor enhances the unit's manageability and security for the most demanding needs. Following in the footsteps of its predecessor, model FCP-7700, the FCP-7800 is an ideal fanless box computer for applications such as a controller on oil rigs; a control box on an assembly line; a vehicle computer, especially in cold conditions; and a machine vision component, where it excels due to its capability of housing a powerful i7 processor."

ASRock Unveils B150M Combo-G3 Motherboard

ASRock announced the B150M Combo-G, a micro-ATX motherboard that should make your upgrade to the 6th generation Core "Skylake" platform as painless as possible, letting you keep your current DDR3 memory, and upgrade to DDR4 later down the line. The board features two each of DDR3 and DDR4 DIMM slots, letting you use up to 16 GB of DDR3 or up to 32 GB of DDR4 memory. The board draws power from a combination of 24-pin ATX and 8-pin EPS power connectors, conditioning it for the CPU with a simple 7-phase VRM.

Expansion slots on the B150M Combo-G include one each of PCI-Express 3.0 x16, PCI-Express 3.0 x16 (electrical gen 3.0 x4), and PCIe gen 3.0 x1. Storage connectivity includes one SATA-Express 16 Gb/s connector, and six SATA 6 Gb/s. The onboard 6-channel audio solution features ground-layer isolation and electrolytic capacitors. Display outputs include one each of DVI, HDMI, and D-Sub. Six USB 3.0 ports, gigabit Ethernet, and PS/2 combo port make for the rest of it. Expect an $80-ish price point.

BIOSTAR Announces Hi-Fi H170Z3 Motherboard with DDR4 and DDR3 Combo

Biostar's latest Intel H170 chipset board is ready for duty for any scenario and comes with combination support for either DDR3 or DDR4 memory modules to allow for maximum flexibility. The Hi-Fi H170Z3 is the first ever Motherboard to support both DDR3 and DDR4 showing its commitment to innovation and development.

The Hi-Fi H170Z3 is based on Intel's H170 chipset which is a single chip design that supports Intel 6th generation socket 1151 Intel Core processors. With the Intel H170 chipset, the Hi-Fi H170Z3 also has the iGPU function enabled, letting users enjoy the latest in Intel integrated graphics performance.

HyperX Releases Additions to FURY, Impact Line of DRAM

HyperX, a division of Kingston Technology Company, Inc., the independent world leader in memory products, today announced the addition of HyperX FURY DDR3L high-performance, low-voltage DIMMs, as well as brand-new HyperX Impact DDR4 SO-DIMMs.

HyperX FURY DDR3L runs at a low 1.35V, meaning less power consumption and less heat. It is available in 1600MHz and 1866MHz frequencies, and comes in 8GB or 16GB dual-channel kits of two as well as 4GB and 8GB modules featuring a stylish asymmetrical heatspreader in black with black PCB for a stand-out system. HyperX FURY DDR3L is fully Plug-and-Play (PnP) enabled for automatic overclocking out of the box and is perfect for entry-level gamers and enthusiasts who want a cost-efficient upgrade for the 6th Generation Intel Core Processors (former codename Skylake-S) and 100 Series Chipset.

QNAP Launches Thunderbolt NAS TVS-871T

QNAP Systems, Inc. today announced the world's first Thunderbolt 2 Turbo vNAS TVS-871T that features 20Gbps bandwidth, 4K video capable Thunderbolt 2, and compatibility with the Thunderbolt-ready storage expansion enclosures TX-500P and TX-800P. With the high transfer speed of DAS and the convenient accessibility of NAS, the TVS-871T is an extremely flexible and efficient storage solution for creative media professionals looking to streamline large 4K video and design workflows.

"The TVS-871T tackles the most common bottleneck for 4K workflows: I/O speed and storage." said David Tsao, product manager of QNAP. "It provides unmatched performance for high-resolution file storage and I/O-intensive tasks to increase working productivity focusing more on 4K or 3D workflows."

Thecus Launches Next-Gen N7770-10G and N8880U-10G NAS

Thecus Technology Corp. today announced the launch of the next generation 7-bay, N7770-10G and 8-bay, N8880U-10G NAS. The newest additions to Thecus' line of SMB/Enterprise NAS deliver high-performance, resilience, and a wide range of industry-class solutions that are able to handle the rigorous mission critical storage needs of businesses.

"Innovation has been and continues to be at the very pinnacle of our success at Thecus," said Florence Shih, CEO at Thecus Technology Corp. "Today's growing businesses require a complete storage solution that can fulfill day to day operations and adapt to unforeseen circumstances and new innovations. With cutting-edge hardware, a comprehensive set of data management features, and attractive price points, these next generation NAS provide an ideal business storage solution."

Giada USA announces Broadwell Core i5 powered Thin Mini ITX Motherboard

Giada USA, a provider of Micro Servers, Mini-PCs, and embedded motherboards, announces the MG-5200SL Thin M-ini ITX motherboard for digital signage, powered with the latest 14nm sized Broadwell processors. The MG-5200SL boasts a powerful Core i5 CPU with 3MB Cache and speeds up to 2.7GHz for better performance and lower power consumption. A dedicated Nvidia GT730 GPUenables powerful graphics performance, supporting 4K Ultra HD resolution and multiple displays. With rich connectivity and JAHC technology for unmanned operation, the MG-5200SL is ready for the most demanding digital signage applications.

Rather than relying on integrated graphics solutions, the MG-5200SL uses a dedicated Geforce GT730 GPU with 384 CUDA cores for 4K Ultra HD and multi-display capability. 2GB of DDR3 dedicated VRAM ensures memory-complex signage displays run smoothly even when the CPU is busy with data processing. Based on the Intel Thin Mini-ITX standard for All-In-One(AIO) PCs, the MG-5200SL fits the same 6.7"x6.7" footprint as a standard Mini-ITX motherboard yet measures just 0.95"(24mm) tall. This slim form factor allows the MG-5200SL motherboard to not only fit into standard Mini-ITX chassis but also Thin Mini-ITX chassis for a very slim profile. Meeting Intel's AIO standard the MG-5200SL can also be used to power all-in-one PCs with high resolution displays.

Intel Skylake Microarchitecture Detailed

The "Skylake" CPU microarchitecture is as much important to Intel as "Sandy Bridge" was, a few years ago. It allows Intel to facilitate mainstream adoption of the DDR4 memory standard (with DDR3 backwards compatibility encouraging cheap upgrades), and gives users IPC increases over older architectures. While users of Core "Haswell" processors and reasonably fast DDR3 memory will find "Skylake" a hard-sell, it should look appealing to users of much older chips, such as "Lynnfield," and perhaps even "Sandy Bridge."

The "Skylake" core is bigger than "Haswell," owing to wider pipelines, prefetcher improvements, more execution units, a bigger front-end with a higher-capacity branch predictor, cache optimizations, and an update to the way HyperThreading works. The instruction window is nearly 1.5x the size of Sandy Bridge, with an out-of-order execution window size of 224 (vs. 168 on Sandy Bridge), load/store sizes of 72/56 (vs. 64/36 on Sandy Bridge), 97 scheduler entries (vs. 56 on Sandy Bridge), and an allocation queue size of 64/thread (vs. 28/thread). The platform of "Skylake" is similar to that of its predecessor, with four notable changes - an integrated camera ISP with the chipset, DDR4 memory support, double the chipset bus bandwidth (64 Gb/s), and eDRAM support on certain CPU SKUs.

Source: HotHardware

VIA Launches Ruggedized VIA AMOS-3005 Industrial Fanless PC

VIA Technologies, Inc, today announced the VIA AMOS-3005, the latest addition to its market-leading range of rugged and reliable VIA AMOS Series industrial fanless PCs. Combining a sleek ultra-ruggedized chassis with rich internal I/O and wireless connectivity options, the VIA AMOS-3005 is ideally suited for a wide variety of IoT, machine-to-machine, and HMI applications including industrial automation and transportation. The system supports wide operating temperature ranges from -10°C to 60°C as well as a flexible input voltage range of 9V-36V, creating a versatile and highly-reliable solution for even the harshest environments.

"The VIA AMOS 3005 provides the total package of high performance, low power, and rich I/O connectivity required for the most demanding industrial computing usage scenarios," said Richard Brown, VP of International Marketing, VIA Technologies, Inc. "With its support for wide operating temperature and voltage ranges it delivers rock-solid reliability in a highly-robust ultra-compact form factor that had been engineered to withstand the toughest operating conditions."

Thecus Announces N8900PRO 2U Rackmount NAS

Thecus Technology Corp. today announced the expansion of its rackmount NAS line up with the addition of the N8900PRO. Embedded with the Intel Xeon E3-1275 Quad Core 3.4GHz processor, 8 GB DDR3 SDRAM (offered up to 32 GB), and an AES-NI hardware encryption engine, the N8900PRO offers business users with a powerful, full-featured solution for file management, data back-up and protection, along with a comprehensive set of business applications to ensure a highly efficient working environment.

"For businesses in need of a powerful, all-purpose NAS server, the N8900PRO provides a robust hardware platform to handle the rigorous day-to-day operations in the workplace," said Florence Shih, CEO of Thecus Technology Corp. "With the 8-bay, N8900PRO, users are able to deploy a high capacity, cost effective storage solution with ensured data protection and security."

BIOSTAR Announces its Z170 Motherboards

BIOSTAR a leading manufacturer of motherboards and graphics cards is proud to announce the release of its top-end Gaming Z170 series, the Gaming Z170X. Based on Intel's next-gen Skylake processors, this ATX form factor sports a 2GbE LAN capability. The Z170X features onboard USB 3.0with dual front and back connectors forconvenient use. The backward compatible USB 3.1 doubles the data transfer rate from 5Gbps to 10Gbps, making transferring your favorite games, music and movies even faster.

The Gaming Z170X features the Touch OC, exclusively developed by BIOSTAR allowing overclockers to enjoy the best performance from their system with a touch of a finger. Featuring Super Hi-Fi Audio with 30uF 'Golden' plated audio connectors providing excellent signal conductivity and less oxidation giving a crisp and clear sound, perfect for those looking for a studio-grade music experience.

Mushkin Intros ECO2 DDR3L-1600 Memory Module

Mushkin introduced the ECO2, a DDR3L-1600 MHz (PC3L-12800) memory module. Available in 4 GB and 8 GB densities, and coming in single-module, dual-channel, and quad-channel kits, the module ticks at 800 MHz (1600 MHz DDR3-effective), with timings of 9-9-9-24 CR1, and module voltage of 1.35V. DDR3L could play an important role in the transition of mainstream memory standard from DDR3 to DDR4, with the upcoming Intel Core "Skylake" processors, which feature integrated memory controllers that natively support DDR3L-1600 and DDR4-2400 (or DDR4-2666 as some reports suggest). Expect mainstream pricing for these modules.

ADATA Announces Availability of SP600NS34 M.2 SATA SSD

ADATA Technology, a leading manufacturer of high-performance DRAM modules and NAND Flash products, today launches thePremier SP600NS34 M.2 2242SATA 6Gb/s SSD for Ultrabooks and desktop PCs. To meet the latest platform and users' expectations, "slimmer, faster, and power-saving", ADATA's Premier SP600NS34 features multiple functions to enhance efficiency, such as DEVSLP, BCH ECC technology, and Intel Smart Response Technology. If you are seeking a new solution to upgrade your Ultrabook, the Premier SP600NS34 will be a great choice with the best cost-performance ratio.

The Premier SP600NS34 comes in capacities of 128GB and 256GB, and adopts the smallest SSD form factor - M.2 2242, with measurements of only 22 x 42 x 3.5mm. However, the compact size does not sacrifice performance - with the JMicron controller, the sequential read speed of SP600NS34 is up to 550MB/s, and the maximum 4K random read/write performance is up to 75K/77K IOPS. The Premier SP600NS34 supports DEVSLP (Device Sleep) technology, helping to consume less power than traditional idle and prolonging the battery life at the same time.

Intel to Debut its Core "Skylake" Processors at Gamescom 2015

Intel is expected to debut its 6th generation Core "Skylake" desktop processor family at Gamescom 2015, which will be held in Cologne, Germany, between 5th and 9th August. PC enthusiasts should look forward to two parts in particular, the Core i7-6700K, and the Core i5-6600K. The two quad-core chips will be built in the LGA1151 package, compatible with upcoming motherboards based on Intel's 100-series chipset. Motherboards based on the Intel Z170 Express chipset will allow CPU overclocking. The integrated memory controller of "Skylake" CPUs support both DDR3 and DDR4 memory standards, and should prove to be a transition point between the two.

Following the i7-6700K and i5-6600K with Z170 chipset motherboards, at Gamescom; Intel will launch other parts in the 6th gen. Core processor family between late-August and early-September. Those launches will include i7-6700/6700T, Core i5-6600, 6500, 6400, 6600T, 6500T and 6400T, and H170 and B150 chipsets. Then in late-September, the company will launch the entry-level H110 chipset.

Source: DigiTimes

QNAP Introduces Affordable Rack-optimized 4-bay Dual-core NAS

QNAP Systems, Inc. today announced a new 4-bay TS-431U Turbo NAS that offers optimal price/performance in a 1U network storage server chassis for file sharing, backup, synchronization, and more. Featuring an advanced Freescale dual-core 1.2GHz processor and 1GB DDR3 RAM, the TS-431U delivers exceptional multi-tasking performance as a business NAS, enhancing productivity and providing a private cloud for easily and securely accessing data.

"The TS-431U provides an ideal solution for small businesses and workgroups who want high-performance networked storage with low acquisition costs but without compromising reliability and features," said Jason Hsu, product manager of QNAP. The TS-431U is a reliable and affordable yet high-performance network storage solution, providing up to 148 MB/s read and 119 MB/s write throughput with dual Gigabit LAN ports. The TS-431U supports dual IP settings, port-trunking modes and enables users to set up fault tolerance or link aggregation for increased data throughput.

BIOSTAR Also Shows Off Micro-ATX Hi-Fi H170Z3 with Dual Memory Type Support

In addition to the Hi-Fi B150Z5, BIOSTAR unveiled the micro-ATX Hi-Fi H170Z3. Based on the H170 Express chipset, which has the same feature-set as the Z170, minus CPU overclocking and multi-GPU; the Hi-Fi H170Z3 offers a 7-phase CPU VRM, two each of DDR3 and DDR4 memory slots (you can use any one type at a given time), supporting up to 16 GB of dual-DDR3-1600 and up to 32 GB of dual-DDR4-2133; a single PCI-Express 3.0 x16 and PCIe 2.0 x1; two legacy PCI slots; and storage options that include SATA-Express, two SATA 6 Gb/s, and M.2 (10 Gb/s). An 8-channel Hi-Fi onboard audio, gigabit Ethernet, and six USB 3.0 ports, make for the rest of its modern connectivity.

AMD Announces New A-Series Desktop APUs

AMD today introduced the latest addition to its line of desktop A-Series processors, the A10-7870K APU, a refresh to the existing line of processors codenamed "Kaveri". The A10-7870K delivers a best-in-class experience for eSports and online gaming with superior performance, best-in-class efficiency in DirectX 12, and unique features. The new processor also delivers exceptional performance in modern workloads and is designed for the future with Microsoft Windows 10.

The latest iteration of the popular and powerful AMD A-Series APU family provides premium performance and multitasking powered by up to 12 compute cores (4 CPU + 8 GPU). The responsiveness and processing power of the A10-7870K APU enables an immersive user experience on Windows 10 PCs while offering an easy path for PC builders looking to upgrade to discrete-level graphics and faster processing at an afforadable price. The A10-7870K APU is available at e-tail now at a suggested price (SEP) of US $137, and through participating system builders.

Colorful iGame-Z170 Motherboard Pictured

Here is the first picture of Colorful's premium socket LGA1151 motherboard, the iGame-Z170. The company plans to carve out at lease three unique SKUs out of this PCB (second picture below), the iGame-Z170 being the base model. As its name suggests, the board is based on Intel's upcoming Z170 Express chipset, and is designed for 6th generation Core "Skylake" processors. Some variants of this board, such as the iGame-Z170U, will feature DDR4 DIMM slots (up to 64 GB), while others will feature DDR3 (up to 32 GB).

The board offers a pretty decent feature-set, including a 14-phase CPU VRM, two PCI-Express 3.0 x16 slots (electrical x8/x8 when both are populated) wired to the CPU, a third PCI-Express x4 slot wired to the PCH, three other PCI-Express x1 slots; storage connectivity that includes six SATA 6 Gb/s, one SATA-Express, and one M.2 10 Gb/s; two USB 3.1 ports, six USB 3.0 ports, gigabit Ethernet, and a modern onboard audio solution with ground-layer isolation, and audio-grade capacitors. The iGame-Z170 series will launch some time in Q3, 2015. The three will likely be exhibited at Computex 2015, this June.

Desktop OEMs Begin Listing "Broadwell" Chips, "Skylake" Arrives in Q3

Major pre-built desktop manufacturers began listing products driven by 5th generation Core "Broadwell" processors, which are having a brief stint at the markets before being replaced by 6th generation Core "Skylake" processors in Q3-2015. The 5th Generation Core family is led by two parts, the Core i5-5675C, and the Core i7-5775C, both of which come with unlocked base-clock multipliers, are based on Intel's new 14 nanometer silicon fab process, and built in the LGA1150 package, compatible with existing Intel 9-series chipset based motherboards, with BIOS updates.

The Core i5-5675C and i7-5775C aren't exactly successors of the i5-4690K and i7-4790K. The i7-5775C is placed in a product tier Intel calls "P1+," while the i5-5675C is placed in one called "MS2+." The two aren't exactly in the same plane as P1K (eg: i7-4790K) or MS2K (eg: i5-4690K), respectively, and don't qualify as P1 (eg: i7-4790 non-K) or MS2 (eg: i5-4690 non-K). The two still feature unlocked multipliers. This places them somewhere between P1K/MS2K and P1/MS2. Both the i5-5675C and i7-5775C are quad-core chips, and physically feature just 6 MB of L3 cache. The i7-5775C has access to all 6 MB of it, while the i5-5675K features just 4 MB.

AMD Zen-based 8-core Desktop CPU Arrives in 2016, on Socket FM3

In what is a confirmation that AMD has killed socket AM3+ and its 3-chip platform, a leaked slide that's part of a larger press-deck addressing investors, tells us that the company is planning to launch a high-performance desktop processor targeting enthusiasts, based on its next-generation "Zen" architecture, in 2016. Our older articles detail the Zen CPU core design, and the way in which AMD will build multi-core CPUs with it. This processor will be codenamed "Summit Ridge," and will be a CPU, and not an APU as previously reported. In AMD-speak, what sets a CPU apart from an APU is its lack of integrated graphics.

AMD "Summit Ridge" will be an 8-core CPU built on the 14 nanometer silicon fab process. It will feature eight "Zen" cores, with 512 KB of L2 cache per core, 16 MB of L3 cache, with 8 MB shared between two sets of four cores, each; a dual-channel integrated memory controller that likely supports both DDR3 and DDR4 memory types; and an integrated PCI-Express gen 3.0 root complex, with a total of 22 lanes. We can deduce this from the fact that "Summit Ridge" will be built in the same upcoming socket FM3 package, which the company's "Bristol Ridge" Zen-based APU will be built on. "Summit Ridge" will hence be more competitive with Intel's 6th generation Core "Skylake" processors, such as the i7-6700K and i5-6600K, than the company's "Broadwell-E" HEDT platform.

Intel "Skylake" to be 6th Generation Core Series, First i7-6700K Benchmarks

Intel's next major CPU architecture, codenamed "Skylake," could be classified as the company's 6th generation Core processor family. It will succeed the brief stint Core "Broadwell" will have at the market, with no major chips for PC enthusiasts to look forward to. The Core i7-6700K appears to be the flagship product based on the Skylake-D silicon, succeeding the i7-4770K and i7-4790K. The Core i5-6600K will succeed the i5-4670K and i5-4690K.

The i7-6700K is a quad-core chip, with HyperThreading enabling 8 logical CPUs. Its nominal clock will be 4.00 GHz, with a rather shallow 4.20 GHz Turbo Boost frequency. It will feature an 8 MB L3 cache, and an integrated memory controller that supports both DDR4 and DDR3 memory types. This makes Skylake a transition point for the mainstream PC market to gradually upgrade to DDR4. You'll have some motherboards with DDR3 memory slots, some with DDR4 slots, and some with both kinds of slots. The resulting large uncore component, and perhaps a bigger integrated GPU, will result in quad-core Skylake parts having TDP rated as high as 95W, higher than current Haswell quad-core parts, with their 88W TDP.
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