News Posts matching "Intel"

Return to Keyword Browsing

Realtek Develops New Onboard LAN Chip to Win Back Gamer Crowd

In a bid to regain market share lost to Intel and Killer (Qualcomm) in the DIY motherboard market, particularly with motherboards targeted at online gaming PC builds; Realtek unveiled a new onboard LAN solution called the Realtek Dragon. Intel and Killer have replaced Realtek as a preferred onboard Ethernet chip provider for DIY PC motherboards over the past two generations, as perception of their lower driver overhead, lower latencies, and other advantages spread. Sensing that merely improving drivers for its existing RTL8111 family of PCIe gigabit Ethernet PHY chips won't fix the situation, Realtek sought to give its latest generation an off-beat brand name that it hopes could appeal to the DIY crowd.

At the heart of the Realtek Dragon is the new RTL8118AS, a PCIe gigabit Ethernet PHY, much like the 8111 family. Realtek says it made refinements to the chip over previous generations, which will offer better performance (lower driver overhead) for traffic with small UDP packets, which is how most online multiplayer games work, and lower power consumption than competing solutions, such as the Killer E2200. Realtek even set a new branding for its chip, and will allow motherboard makers to print it on their PCBs, just as they print branding for Killer or Intel onboard LAN solutions. Realtek Dragon will make its debut with certain socket LGA1151 motherboards by ECS.


Source: Anandtech

Intel Announces Leadership Changes

Today Intel Corporation's CEO, Brian Krzanich, announced a series of leadership and organizational changes in a message to employees. Intel President Renée James informed the board that she will be stepping down as President of Intel to pursue an external CEO role. She has agreed to stay at Intel until January in order to transition the Executive Office. In connection with today's news, James today distributed an employee message about her plans.

In addition, other leadership and organizational changes that are being made to streamline operations and better position Intel for growth include: Arvind Sodhani, President of Intel Capital, will retire in January after a distinguished 35-year career with the company. President of Mergers and Acquisitions Wendell Brooks will take an expanded role to also become President of Intel Capital. Merging these teams under one leader will allow clear focus across all investment opportunities for Intel.

On July 1, the Intel Security organization - formerly the independent McAfee division - was formally integrated into Intel operations under the leadership of General Manager Chris Young. This integration will deliver better technologies for our customers and more effective operations that enable Intel Security to advance the state of security across the industry.

Intel to Debut its Core "Skylake" Processors at Gamescom 2015

Intel is expected to debut its 6th generation Core "Skylake" desktop processor family at Gamescom 2015, which will be held in Cologne, Germany, between 5th and 9th August. PC enthusiasts should look forward to two parts in particular, the Core i7-6700K, and the Core i5-6600K. The two quad-core chips will be built in the LGA1151 package, compatible with upcoming motherboards based on Intel's 100-series chipset. Motherboards based on the Intel Z170 Express chipset will allow CPU overclocking. The integrated memory controller of "Skylake" CPUs support both DDR3 and DDR4 memory standards, and should prove to be a transition point between the two.

Following the i7-6700K and i5-6600K with Z170 chipset motherboards, at Gamescom; Intel will launch other parts in the 6th gen. Core processor family between late-August and early-September. Those launches will include i7-6700/6700T, Core i5-6600, 6500, 6400, 6600T, 6500T and 6400T, and H170 and B150 chipsets. Then in late-September, the company will launch the entry-level H110 chipset.

Source: DigiTimes

Samsung Display Introduces First Mirror and Transparent OLED Display Panels

Samsung Display Co., Ltd. unveiled the industry's first Mirror and Transparent OLED display panels in a dazzling state-of-the-art showcase for personalized shopping and informational browsing, held this week at the Hong Kong Convention and Exhibition Centre. The exhibit features the first retail use of advanced commercial OLED panels - a "virtual necklace" display for the world renowned Chow Sang Sang jewelry company.

The new Samsung Display OLED panel technology provides a digital viewing platform for making the consumer purchasing experience more visually engaging. When Samsung's OLED display technology is integrated with Intel Real Sense technology, a visually compelling, interactive closet or "self-modeling" wardrobe is created that can enable consumers to virtually "see" clothes or other retail items from an extremely realistic, customized perspective.

All MSI Z97 and H97 Motherboards Support 5th Gen. Core Processors

MSI, leading in motherboard design, is proud to announce that our Z97 & H97 motherboards fully support the 5th Generation Intel Core processors! With the latest BIOS update, current MSI Z97 & H97 motherboards are completely compatible with the 5th Gen Intel Core processors, and able to unleash your system's full performance.

Committed to ensuring compatibility and performance, the MSI R&D team is making sure you never have to worry about your MSI Z97 & H97 motherboard supporting the latest generation of Intel Core processors. If you want to fully enjoy all the advantages of the 5th Generation Intel Core processors, MSI Z97 & H97 motherboards are definitely your best choice.

Crucial Announces Ballistix DDR4 16GB Memory Modules

Crucial, a leading global brand of memory and storage upgrades, today announced Crucial Ballistix DDR4 16GB performance memory. Ideal for gamers and enthusiasts who deal with content creation, virtual machines, RAM drives, and memory-intensive applications, the new Ballistix modules leverage Micron's new 8Gb DDR4 component technology to offer up the highest density DDR4 memory to date.

Until now, only expensive server systems have been able to reach these memory densities, but with Ballistix DDR4 16GB modules, users can achieve greater densities on high-end desktop systems like the latest Intel X99 platforms. Available across Sport LT, Tactical, and Elite product lines, each module includes Intel XMP 2.0 profiles for easy setup and support.

Intel Leads a New Era of Computing Experiences

Intel Corporation today announced products and solutions that will deliver new user experiences and support the computing ecosystem's expansion into new areas. During the opening keynote address at Computex 2015, Kirk Skaugen, senior vice president and general manager of Intel's Client Computing Group encouraged the Taiwan ecosystem to work together and capture the opportunity to shape the future of computing.

"The power of Moore's Law has enabled incredible computing innovation over the past 50 years and because of it, nearly everything in the future will have the ability to compute and connect," said Skaugen. "Our 30-year history of collaboration with Taiwan has delivered historic innovation to the world, from personal computing to the cloud and data centers. The next 30 years will see even greater innovation as we deliver new computing experiences and bring intelligence and connectivity to the Internet of Things together."

Jim Anderson Joins AMD to Lead Computing and Graphics Business Group

AMD today announced that Jim Anderson (43) has joined the company as senior vice president and general manager of AMD's Computing and Graphics (CG) business group, reporting to President and CEO Dr. Lisa Su. Anderson will be responsible for managing all aspects of strategy, business management, engineering, and sales for AMD's computing and graphics products and solutions.

"Jim's business and technical expertise make him another strong addition to AMD's leadership team," said Dr. Su. "His deep industry knowledge and proven ability to transform businesses to drive profitable growth make him the ideal candidate to lead the Computing and Graphics business."

G.Skill to Host 4th Annual OC World Record Stage at Computex 2015

G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory and solid state storage, is hosting two major extreme overclocking events at Computex 2015 (June 2~6): the OC World Cup 2015 and the OC World Record Stage 2015! 19 world-class overclockers, 5 motherboard vendors, and 3 hardware sponsors - all at the G.SKILL Computex Booth I0608, located at Nangang Exhibition Hall, 1F.

Very special thanks to Intel, Samsung, and Kingpin Cooling for sponsoring the OC World Cup 2015 and the 4th Annual OC World Record Stage extreme overclocking events. "Intel is pleased to be a sponsor of this year's G.SKILL OC World Cup & 4th Annual OC World Record Stage at Computex 2015," says Gregory Bryant, Corporate Vice President and General Manager, Intel Corporation. "Intel processors and chipsets enable mind-blowing experiences and we are glad to be a part of this exciting event."

ZOTAC Announces ZBOX R-Series Mini-PC

ZOTAC International, a global innovator and manufacturer of graphics card and mini PCs, today puts the limelight on the brand new R Series, the new member of the ZBOX mini PC family. This is the small form factor solution that is more than a personal PC with its storage solution and functionalities while providing the same power efficiency and space saving features that users expect from ZBOX.

"This is certainly a breakthrough for both the mini PC and personal computing," explains Tony Wong, CEO, ZOTAC International. "We are adding more functions to elevate the mini PC to a whole new plane while keeping our signature space saving design and power efficiency. This new addition to the mini PC family will open new doors to even more functionalities."

Intel Core i7-5775C and i5-5675C Hit Retail Channel in Early June

Intel's upcoming 5th generation Core processors targeted at PC enthusiasts, the Core i7-5775K, and the Core i5-5675K, will be available in the retail channel on June 1st (NA, EMEA), and June 2nd (APAC). The two were available to the OEM channel since earlier this month. This is when you will be able to buy the two at a ground store, or online, in retail (box) packaging. Built in the LGA1150 package, the two will be compatible with existing Intel 9-series chipset motherboards (with BIOS updates).

Based on the swanky new 14 nm "Broadwell" silicon, the i7-5775C and the i5-5675C are quad-core chips. The i7-5775C offers clock speeds of 3.30 GHz, which spools up to 3.70 GHz with Turbo Boost; and will feature HyperThreading, enabling 8 logical CPUs. The i5-5675C offers 3.10 GHz clocks, with 3.60 GHz Turbo Boost frequencies. Both chips will offer 6 MB of L3 cache, Intel Iris Pro 6200 graphics; and TDP as low as 65W. For this reason, and others, the two won't exactly replace the i7-4790K and i5-4690K from the product stack. The two will ship with unlocked base-clock multipliers, letting you overclock them, and could still make for great buys for premium gaming PC builds.Source: Hermitage Akihabara

Kingston HyperX Achieves Fastest 128GB DDR4 Memory Kit

HyperX, a division of Kingston Technology Company, Inc., the independent world leader in memory products, today announced that it has created the world's fastest DDR4 128GB memory kit running at an astounding 3000MHz. The kit consists of eight 16GB HyperX Predator modules (16GB x 8) motherboard in an eight module, quad-channel configuration along with an MSI X99 MPOWER motherboard in an eight module, quad-channel configuration along with an Intel Core i7 5820K processor.

During Computex en Taipei,HyperX will unleash a high-performance system featuring the upcoming 16GB modules powered by the recently released HyperX Predator M.2 PCIe SSD. The live demo will take place during the HyperX Roadshow Experience from June 4-7, 2015, at the ATT 4 FUN center, in Taipei. More details will be forthcoming about availability and pricing for HyperX Predator 16GB DDR4 modules and kits.

New Intel Chipset Software Adds Support for 100-series Chipset

Without much noise, Intel released the latest version of its Chipset Device software (INF update utility), that driver you install just after OS setup and forget about; which comes with a curious release notes. Version 10.0.27, adds support for three of the year's big buzzwords for PC enthusiasts - Intel 100-series chipsets (notably the Z170 Express chipset), 6th Generation Core "Skylake" processors, and Windows 10. The software comes with driver dates of 5th May, 2015, and given that Z170-driven socket LGA1151 motherboards are already in industry circulation as engineering samples, such as this one, product launches could be quite close. One can expect Z170-driven motherboards to make an appearance at Computex 2015 (early-June). Core "Skylake" processors launch later this year. Windows 10, on the other hand, is expected to launch in July.
DOWNLOAD: Intel Chipset Device Software 10.0.27Source: Intel

Intel Unveils DC S3510 SSDs for the Data Center

Intel quietly announced availability of its DC S3510 SSDs for data centers. Built in the 2.5-inch form-factor, with SATA 6 Gb/s interface, these drives feature SET (standard-endurance technology) MLC NAND flash built by IMFlash Technology, on a 16 nanometer node, which can take in up to 880 TBW. Its controller offers native 256-bit AES encryption. The drive is available in capacities of 80 GB, 120 GB, 240 GB, 480 GB, 800 GB, 1.2 TB, and 1.6 TB. The table below shows sequential and 4K random access performance figures by the company for each model. The drives are backed by 5-year warranties, and are available in the OEM channel. Its target consumers are low-cost dedicated hosting providers.

Intel Announces Xeon E7 v3 Series Processors

Intel Corporation today announced the Intel Xeon processor E7-8800/4800 v3 product families, delivering accelerated business insight through real-time analytics and enhanced performance and reliability for mission-critical computing.

Real-time business intelligence is a top priority for companies across the full spectrum of industries, from healthcare to retail to telecommunications, among others. The need to rapidly extract actionable insight from large volumes of data is driving demand for new technologies for in-memory computing and big data analytics. Considering the current and future demand for in-memory computing, Gartner believes that revenue in this market will exceed $9.5 billion by year-end 2018, and at least 50 percent of large organizations will adopt in-memory computing to enable digital business strategies.

Desktop OEMs Begin Listing "Broadwell" Chips, "Skylake" Arrives in Q3

Major pre-built desktop manufacturers began listing products driven by 5th generation Core "Broadwell" processors, which are having a brief stint at the markets before being replaced by 6th generation Core "Skylake" processors in Q3-2015. The 5th Generation Core family is led by two parts, the Core i5-5675C, and the Core i7-5775C, both of which come with unlocked base-clock multipliers, are based on Intel's new 14 nanometer silicon fab process, and built in the LGA1150 package, compatible with existing Intel 9-series chipset based motherboards, with BIOS updates.

The Core i5-5675C and i7-5775C aren't exactly successors of the i5-4690K and i7-4790K. The i7-5775C is placed in a product tier Intel calls "P1+," while the i5-5675C is placed in one called "MS2+." The two aren't exactly in the same plane as P1K (eg: i7-4790K) or MS2K (eg: i5-4690K), respectively, and don't qualify as P1 (eg: i7-4790 non-K) or MS2 (eg: i5-4690 non-K). The two still feature unlocked multipliers. This places them somewhere between P1K/MS2K and P1/MS2. Both the i5-5675C and i7-5775C are quad-core chips, and physically feature just 6 MB of L3 cache. The i7-5775C has access to all 6 MB of it, while the i5-5675K features just 4 MB.

HP Announces the Next Wave of 2015 Back to School PCs

HP today announced a new family of all-in-one desktop and tower PCs designed to fit beautifully in the home for back to school. The new desktop lineup offers customers power and flexibility to scale for next-level productivity and entertainment.

"The desktop PC continues to be an important form factor for customers who want to get things done and be entertained, but lack style and as a result are often hidden in basements and dens," said Kevin Frost, vice president and general manager, Consumer Personal Systems, HP. "With our 2015 desktop family, we are breathing new life into the category by giving customers more capabilities wrapped in colorful and premium designs that they will be proud to place in kitchens, living rooms and other public spaces in their homes."

ASRock Develops Mini-ITX LGA2011v3 Motherboard with Quad-Channel Memory

They've done it! After building the first LGA2011v3 motherboard in the mini-ITX form-factor, letting you cram up to 8 "Haswell" cores into a lunchbox-sized PC, albeit having to make do with just dual-channel memory; ASRock developed the first mini-ITX motherboard with not just LGA2011v3, but also its full quad-channel memory interface, called the EPC612D4I. There's just one rider, which shouldn't really be a dealbreaker - this is a server-grade motherboard, and is bound to be expensive.

The EPC612D4I achieves its quad-channel memory chops by using smaller DDR4 SO-DIMM slots instead of standard-sized DIMM slots. Availability of aftermarket DDR4 SO-DIMM memory is close to non-existent, but that could change with 6th Generation Core processor notebooks hitting the shelves by Holiday 2015. As an enterprise board, it also supports Xeon E5-1600 V3 and E5-2600 V3 processors.

GIGABYTE Rolls Out the X99-SLI Motherboard

Trying to squeeze revenues from the high-end desktop (HEDT) market to its last drop by saturating it with as many catchy-named models as possible, GIGABYTE launched the X99-SLI socket LGA2011v3 motherboard. This board will likely be priced between $199 and $249, and will compete against the likes of ASUS X99-A and MSI X99S Gaming 7, enabling it to make the most out of the crucial pre-Summer sales season. Built in the standard ATX form-factor, the X99-SLI offers a feature-set that's nearly identical to the company's X99-UD4. It's not a rebrand, because the PCB is different between the two. The X99-SLI could end up being cheaper.

The X99-SLI draws power from a combination of 24-pin ATX and 8-pin EPS power connectors, with an optional 4-pin Molex input to stabilize multiple graphics cards that rely on the PCI-Express slot for power. Power to the CPU is conditioned by a 6-phase VRM. The CPU is wired to eight DDR4 DIMM slots, four on either sides, and four PCI-Express 3.0 x16 slots (x16/NC/x16/NC or x16/NC/x8/x8 or x8/x8/x8/x8 on i7-5930K and i7-5960X; x16/NC/x4 or x8/x8/x4 on i7-5820K), supporting 4-way SLI and CrossFireX. The board supports DDR4-3333 MHz with overclocking.

GIGABYTE Enables Support for Upcoming 5th Gen Intel Core Processors

GIGABYTE TECHNOLOGY Co. Ltd., a leading manufacturer of motherboards and graphics cards is proud to announce their entire line-up of Z97 and H97 motherboards now support the soon-to-launch 5th Generation Intel Core processors.

GIGABYTE engineers have tested and validated all GIGABYTE 9 series motherboards including Z97 and H97 chipset-based motherboards to ensure optimal performance for 5th Generation Intel Core processors. Users wanting to take advantage of all the features of 5th Gen Intel Core processors have to offer at launch, simply need to download the latest UEFI BIOS from the GIGABYTE website.

Intel "Skylake" to be 6th Generation Core Series, First i7-6700K Benchmarks

Intel's next major CPU architecture, codenamed "Skylake," could be classified as the company's 6th generation Core processor family. It will succeed the brief stint Core "Broadwell" will have at the market, with no major chips for PC enthusiasts to look forward to. The Core i7-6700K appears to be the flagship product based on the Skylake-D silicon, succeeding the i7-4770K and i7-4790K. The Core i5-6600K will succeed the i5-4670K and i5-4690K.

The i7-6700K is a quad-core chip, with HyperThreading enabling 8 logical CPUs. Its nominal clock will be 4.00 GHz, with a rather shallow 4.20 GHz Turbo Boost frequency. It will feature an 8 MB L3 cache, and an integrated memory controller that supports both DDR4 and DDR3 memory types. This makes Skylake a transition point for the mainstream PC market to gradually upgrade to DDR4. You'll have some motherboards with DDR3 memory slots, some with DDR4 slots, and some with both kinds of slots. The resulting large uncore component, and perhaps a bigger integrated GPU, will result in quad-core Skylake parts having TDP rated as high as 95W, higher than current Haswell quad-core parts, with their 88W TDP.

First AMD "Zen" Chips to be Quad-Core

Some of the first CPUs and APUs based on AMD's next-generation "Zen" micro-architecture could be quad-core. "Zen" will be AMD's first monolithic core design after a stint with multi-core modules, with its "Bulldozer" architecture. Our older article details what sets Zen apart from its predecessor. As expected, in a multi-core chip, Zen cores share no hardware resources with each other, than a last-level cache (L3 cache), much like Intel's current CPU architecture.

There's just one area where Zen will differ from Haswell. With Haswell, Intel has shown that it can clump any number of cores on a chip, and make them share a proportionately large L3 cache. Haswell-E features 8 cores sharing a 20 MB cache. The Haswell-EX features 18 cores sharing 45 MB of cache. With Zen, however, the scale up stops at 4 cores sharing 8 MB of L3 cache. A set of four cores makes up what AMD calls a "quad-core unit." To be absolutely clear, this is not a module, the cores share no hardware components with each other, besides the L3 cache.

AMD "Zen" CPU Core Block Diagram Surfaces

As a quick follow up to our older report on AMD's upcoming "Zen" CPU core micro-architecture being a reversion to the monolithic core design, and a departure from its "Bulldozer" multicore module design which isn't exactly flying off the shelves, a leaked company slide provides us the first glimpse into the core design. Zen looks a lot like "Stars," the core design AMD launched with its Phenom series, except it has a lot more muscle, and one could see significant IPC improvements over the current architecture.

To begin with, Zen features monolithic fetch and decode units. On Bulldozer, two cores inside a module featured dedicated decode and integer units with shared floating-point units. On Zen, there's a monolithic decode unit, and single integer and floating points. The integer unit has 6 pipelines, compared to 4 per core on Bulldozer. The floating point unit has two large 256-bit FMAC (fused-multiply accumulate) units, compared to two 128-bit ones on Bulldozer. The core has a dedicated 512 KB L2 cache. This may be much smaller than the 2 MB per module on Bulldozer, but also indicate that the core is able to push through things fast enough to not need cushioning by a cache (much like Intel's Haswell architecture featuring just 256 KB per core). In a typical multi-core Zen chip, the cores will converge at a large last-level cache, which routes data between them to the processor's uncore, which will feature a DDR4 IMC and a PCI-Express 3.0 root complex.
Source: Planet3DNow, Many Thanks to qubit for the tip.

AMD to Skip 20 nm, Jump Straight to 14 nm with "Arctic Islands" GPU Family

AMD's next-generation GPU family, which it plans to launch some time in 2016, codenamed "Arctic Islands," will see the company skip the 20 nanometer silicon fab process from 28 nm, and jump straight to 14 nm FinFET. Whether the company will stick with TSMC, which is seeing crippling hurdles to implement its 20 nm node for GPU vendors; or hire a new fab, remains to be seen. Intel and Samsung are currently the only fabs with 14 nm nodes that have attained production capacity. Intel is manufacturing its Core "Broadwell" CPUs, while Samsung is manufacturing its Exynos 7 (refresh) SoCs. Intel's joint-venture with Micron Technology, IMFlash, is manufacturing NAND flash chips on 14 nm.

Named after islands in the Arctic circle, and a possible hint at the low TDP of the chips, benefiting from 14 nm, "Arctic Islands" will be led by "Greenland," a large GPU that will implement the company's most advanced stream processor design, and implement HBM2 memory, which offers 57% higher memory bandwidth at just 48% the power consumption of GDDR5. Korean memory manufacturer SK Hynix is ready with its HBM2 chip designs.Source: Expreview

Intel Compute Stick Now Available

The Intel Compute Stick, a new pocket-sized computer based on a quad-core Intel Atom processor running Windows 8.1 with Bing, is available now through Intel Authorized Dealers for much of the world.

The Intel Compute Stick can transform any HDMI display into an entry computer capable of working with productivity apps, playing local or streamed content, driving basic digital signage or enabling thin clients. It will support Wireless 802.11 b/g/n, a microSD card for expandable memory, MicroUSB power supply and Bluetooth 4.0 for keyboard and mouse.
Return to Keyword Browsing