News Posts matching "Intel"

Return to Keyword Browsing

Intel Launches its Core i7-5000 Series High-end Desktop Platform

Intel launched its next-generation Core i7-5000 series high-end desktop platform, consisting of socket LGA2011-V3 Core i7 processors, and compatible motherboards based on the Intel X99 Express chipset. The platform is an upscaling of the "Haswell" micro-architecture, codenamed "Haswell-E" and targets Ultra HD gamers, media professionals, and PC enthusiasts. The platform begins with the "Haswell-E" silicon, which physically features eight "Haswell" CPU cores, a staggering 20 MB of L3 cache, a quad-channel DDR4 integrated memory controller, and a 40-lane PCI-Express Gen 3.0 root complex. Three SKUs are carved out of this silicon.

The series is led by the Core i7-5960X. Intel's first eight-core processor for the high-end desktop market, this chip features HyperThreading, which enables 16 logical CPUs for the OS to play with, 20 MB of L3 cache, and clock speeds of 3.00 GHz, with 3.50 GHz maximum Turbo Boost. It commands a price of $999. Next up, is the Core i7-5930K. A six-core chip with HyperThreading that enables 12 logical CPUs, this chip features 15 MB of L3 cache, clock speeds of 3.50 GHz with 3.70 GHz maximum Turbo Boost, and a US $583 price-tag. The most affordable chip is the Core i7-5820K. At US $389, it's the cheapest six-core HEDT chip by Intel (at launch). It features 12 MB of L3 cache, and clock speeds of 3.30 GHz, with 3.60 GHz of Turbo Boost. Too good to be true? Not so fast. It features a slimmer 28-lane PCIe root complex, so certain multi-GPU configurations won't run optimally. The Intel X99 Express chipset corrects many of the shortcomings of its predecessor, the X79 Express. It features a meaty storage controller that offers ten SATA 6 Gb/s ports, one or more SATA-Express, and M.2 slots. It also integrates a 6-port USB 3.0 host controller, and two independent 4-port USB 2.0 host controllers.

Intel Announces New Packaging and Test Technologies for Foundry Customers

Intel Corporation today announced two new technologies for Intel Custom Foundry customers that need cost-effective advanced packaging and test technologies. Embedded Multi-die Interconnect Bridge (EMIB), available to 14nm foundry customers, is a breakthrough that enables a lower cost and simpler 2.5D packaging approach for very high density interconnects between heterogeneous dies on a single package. Instead of an expensive silicon interposer with TSV (through silicon via), a small silicon bridge chip is embedded in the package, enabling very high density die-to-die connections only where needed.

Standard flip-chip assembly is used for robust power delivery and to connect high-speed signals directly from chip to the package substrate. EMIB eliminates the need for TSVs and specialized interposer silicon that add complexity and cost. "The EMIB technology enables new on-package functionality that may have been too costly to pursue with previous solutions," said Babak Sabi, Intel vice president and director, Assembly and Test Technology Development.

Intel Core i7 "Haswell-E" Pricing Detailed

Intel will price its next-generation Core i7 "Haswell-E" HEDT processors along expected lines. The lineup will begin with the Core i7-5820K, priced at US $389 - just $50 more than a Core i7-4790K. There are some major trade-offs you need to consider when choosing between the two. The i7-5820K is a six-core chip, but its motherboard and newer, costlier DDR4 memory, will jack up your overall platform costs. The i7-4790K lets you buy a motherboard as cheap as $120, and memory that's as cheap as it gets. It's now confirmed that the i7-5820K features 6 cores, 12 threads enabled by HyperThreading, a quad-channel DDR4 memory interface, and 15 MB of L3 cache, but a narrower 28-lane PCI-Express 3.0 root complex. The chip features TurboBoost frequency of 3.60 GHz.

To use the platform to its fullest, you'd need to part with at least US $583 for a processor. That's what will get you the Core i7-5930K. Also a six-core chip, the i7-5930K features a wider 40-lane PCI-Express 3.0 root complex, letting you set up 3-way and 4-way high-end multi-GPU setups with sufficient bus width for each of the cards running in tandem. The chip features 6 cores, 12 threads, a quad-channel DDR4 IMC, 15 MB of L3 cache, and TurboBoost frequencies of up to 3.70 GHz. Leading the pack is the Core i7-5960X, Intel's first eight-core high-end client CPU. It's priced at a wallet-scorching $999. For close to a grand, you get 8 cores, 16 threads enabled with HyperThreading, a massive 20 MB of L3 cache, a quad-channel DDR4 IMC, and 40 PCI-Express 3.0 lanes. To keep the eight cores within Intel's desired 140W thermal envelope, the company had to go easy on the clocks. It offers TurboBoost frequencies of up to 3.50 GHz. All three chips feature unlocked base-clock multipliers.Source: VideoCardz

G.SKILL Officially Announces Ripjaws 4 Series DDR4 Memory Kits

G.SKILL International Co., Ltd., the leading high performance memory designer and manufacturer, reveals the long awaited next generation Ripjaws 4 series DDR4 memory kits! Featuring all new redesigned heatspreaders in three different colors, high performance frequencies, high capacity, DDR4 quad-channel ready, and ultra low voltages, the Ripjaws 4 series is all the benefits of DDR4 rolled into one sleek package.

With a standard of 2133MHz, DDR4 is the next generation definition of performance. Also available in 2400MHz, 2666MHz, 2800MHz, 3000MHz, and 3200MHz, the starting lineup is continuing where DDR3 left off. With capacities starting at 16GB (4GBx4), 32GB (8GBx4 / 4GBx8) and 64GB (8GBx8), your new X99 platform will have more memory space to do what you need it to do. That's not all! Ripjaws 4 also has an ultra low voltage rating of 1.2V for kits under 2800MHz and 1.35V for 3000/3200MHz.

USB-IF to Demonstrate USB Single-Cable Solution at IDF San Francisco

The USB Implementers Forum (USB-IF) today announced that it will exhibit and present the latest USB developments at Intel Developer Forum (IDF) in San Francisco, September 9-11. At IDF, the USB-IF will host a Technology Community, present technical sessions on the new USB Type-C connector, and host press briefings featuring new technology demonstrations.

JPR Reports AMD Jumps 11% in GPU Shipments in Q2, Intel up 4%, NVIDIA Slips

Jon Peddie Research (JPR), the industry's research and consulting firm for graphics and multimedia, announced estimated graphics chip shipments and suppliers' market share for 2014 2Q.

Graphics chips are without doubt one of the most powerful, exciting, and essential components in tech today: not only does every computer require one (or more), but the technology is entering into major new markets like supercomputers, remote workstations, and simulators almost on a daily basis. New technologies and compute programs are taking advantage of the ability of GPU power to scale. On top of that, PC gaming momentum continues to build. It would be no exaggeration to say that GPUs are becoming the 800-pound gorilla in the room.

Intel and SMS Audio to Supercharge Fitness Wearables

SMS Audio LLC, a premier audio headphone and accessories brand from Curtis "50 Cent" Jackson, together with Intel Corporation announced a collaboration to develop the first heart-pounding personal audio system converging lifestyle and technology innovation for an exceptional fitness experience. The SMS Audio BioSport In-Ear Headphones powered by Intel will bring smart exercise capabilities to athletes of all levels later this year.

With today's announcement, Intel and SMS Audio are merging lifestyle requirements with technology innovation to enhance the fitness experience. The SMS Audio BioSport In-Ear Headphones powered by Intel will extend the recently launched SMS Audio Sport Collection and harness advanced technology features to deliver high-quality audio while gathering actionable data on fitness progress.

Avago Selling LSI's Axxia Networking Business to Intel for $650 Million

Avago Technologies Limited and Intel Corporation today announced the signing of a definitive agreement for Intel to acquire LSI's Axxia Networking Business and related assets for $650 million in cash. The transaction, which has been approved by the boards of directors for both Avago and Intel, is expected to close in the fourth calendar quarter of 2014 upon satisfaction of government approvals and customary closing conditions.

LSI's Axxia Networking Business is being divested from Avago following the recent completion of Avago's acquisition of LSI. The Axxia Networking Business generated revenues of $113 million in calendar 2013 and employs approximately 650 people.

Intel Haswell TSX Erratum as Grave as AMD Barcelona TLB Erratum

Intel's "Haswell" micro-architecture introduced the transactional synchronization extensions (TSX) as part of its upgraded feature-set over its predecessor. The instructions are designed to speed up certain types of multithreaded software, and although it's too new for any major software vendor to implement, some of the more eager independent software developers began experimenting with them, only to discover that TSX is buggy and can cause critical software failures.

The buggy TSX implementation on Core "Haswell" processors was discovered by a developer outside Intel, who reported it to the company, which then labeled it as an erratum (a known design flaw). Intel is addressing the situation by releasing a micro-code update to motherboard manufacturers, who will then release it as a BIOS update to customers. The update disables TSX on affected products (Core and Xeon "Haswell" retail, and "Broadwell-Y" engineering samples).

Lenovo Announces ThinkStation P Series

Lenovo today, at SIGGRAPH 2014 in Vancouver, British Columbia, announced the launch of the ThinkStation P Series, unveiling its vision for the ultimate in desktop workstation performance, reliability and usability. Rebuilt from the ground up, the Lenovo ThinkStation P900, P700 and P500 workstations join the entry-level ThinkStation P300, announced in May 2014, as the most powerful professional-grade desktop workstations available. Now, professionals in engineering, architecture, media and entertainment, oil & gas, medical & science, finance and other industries can arm themselves with workstation technology selected and configured to meet their needs for enhanced productivity and limitless innovation.

"After a period of intensive research, development and testing, we're excited to introduce our next generation workstations to the market, as we truly believe this is the best designed workstation ever," said Victor Rios, vice president and general manager, Workstation, Lenovo. "We built on the advancements delivered in our 30 Series workstations and engineered the P Series with new levels of innovation based on extensive customer feedback. The result for users is optimum performance, outstanding reliability and unparalleled usability that is unlike anything they have experienced."

Intel Details Newest Microarchitecture and 14 Nanometer Manufacturing Process

Intel today disclosed details of its newest microarchitecture that is optimized with Intel's industry-leading 14 nm manufacturing process. Together these technologies will provide high-performance and low-power capabilities to serve a broad array of computing needs and products from the infrastructure of cloud computing and the Internet of Things to personal and mobile computing.

"Intel's integrated model - the combination of our design expertise with the best manufacturing process - makes it possible to deliver better performance and lower power to our customers and to consumers," said Rani Borkar, Intel vice president and general manager of product development. "This new microarchitecture is more than a remarkable technical achievement. It is a demonstration of the importance of our outside-in design philosophy that matches our design to customer requirements."

Intel to Discontinue Five More Ivy Bridge Processors

Intel's Ivy Bridge purge continues as the Santa Clara-based company announced its plans to retire five more chips based on the aging architecture, the Core i3-3110M, i3-3120M, i3-3130M, i3-3217U, i3-3227U. These mobile CPUs were released between Q2 2013 and Q1 2013 and are set to 'survive' until Q2 2015 as May 22nd is the last day of shipments. Intel is still taking orders for these processors but that will stop November 21st.

Intel Declares Quarterly Cash Dividend

Intel Corporation's board of directors has declared a quarterly dividend of 22.5 cents per share (90 cents per share on an annual basis) on the company's common stock. The dividend will be payable on Sept. 1, 2014, to stockholders of record on Aug. 7, 2014.

Intel (NASDAQ:INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world's computing devices. As a leader in corporate responsibility and sustainability, Intel also manufactures the world's first commercially available "conflict-free" microprocessors.

Intel Introduces the Solid-State Drive Pro 2500 Series

Intel Corporation today announced an addition to the Intel Solid-State Drive (SSD) Professional Family: the Intel SSD Pro 2500 Series. This new business-class SSD delivers lower total cost of ownership, security and manageability features, and blazing-fast SSD performance demanded by today's business users.

Intel SSD Pro 2500 Series offers IT departments peace of mind with advanced security features and capabilities designed for businesses ranging from small companies through large IT-managed enterprises. Security and remote manageability features, combined with lower annual failure rates than hard disk drives (HDDs), help to reduce the need for resource-intensive deskside visits.

Intel Outs Six New Haswell-based Entry Level Processors

Intel rolled out six new entry-level socket LGA1150 dual-core processors, based on the "Haswell" micro-architecture. These include four-each under the Pentium and Core i3 brands. Among the Pentium parts are the G3250 (3.20 GHz clocks, 1.10 GHz iGPU, 3 MB L3, 53W TDP, 2c/2t); Pentium G3250T (2.80 GHz clocks, 1.10 GHz iGPU, 3 MB L3, 35W TDP, 2c/2t); Pentium G3450T (2.90 GHz clocks, 1.10 GHz iGPU, 3 MB L3, 35W TDP, 2c/2t); and Pentium G3460 (3.50 GHz clocks, 1.10 GHz iGPU, 3 MB L3, 53W TDP, 2c/2t).

The HyperThreading-enabled Core i3 parts include the Core i3-4160 (3.60 GHz clocks, 1.15 GHz iGPU, 3 MB L3, 54W TDP, 2c/4t); Core i3-4160T (3.10 GHz clocks, 1.15 GHz iGPU, 3 MB L3, 35W TDP, 2c/4t); Core i3-4360T (3.20 GHz clocks, 1.15 GHz iGPU, 4 MB L3, 34W TDP, 2c/4t); and the Core i3-4370 (3.80 GHz clocks, 1.15 GHz iGPU, 4 MB L3, 54W TDP, 2c/4t), which is the fastest dual-core CPU money can buy.

Source: CPU World

Intel Reports Second-Quarter Revenue of $13.8 Billion

Intel Corporation today reported second-quarter revenue of $13.8 billion, operating income of $3.8 billion, net income of $2.8 billion and EPS of $0.55. The company generated approximately $5.5 billion in cash from operations, paid dividends of $1.1 billion, and used $2.1 billion to repurchase 74 million shares of stock.

"Our second-quarter results showed the strength of our strategy to extend the reach of Intel technology from the data center to PCs to the Internet of Things," said Intel CEO Brian Krzanich. "With the ramp of our Baytrail SoC family, we have expanded into new segments such as Chrome-based systems, and we are on track to meet our 40 million unit tablet goal. In addition, we hit an important qualification milestone for our upcoming 14 nm Broadwell product, and expect the first systems to be on shelves during the holidays."

Intel Z77, H77, Z75 and Q75 Chipsets and more Ivy Bridge CPUs Retiring Next Year

Having already planned the discontinuance of a heap of Ivy Bridge processors, Intel has this week confirmed that several supporting chipsets - the Z77, H77, Z75 and Q75, will also be 'going away' in 2015. According to Intel's product change notification the four LGA1155 desktop chipsets will be available for ordering until January 23rd, 2015 and will continue shipping until July 10th.

An identical schedule was also announced for seven Ivy Bridge-based mobile processors, the Celeron 1020M, 1005M, 1000M, 1037U, 1017U, 1007U and 1019Y.

Intel, Samsung, Others Team Up to Drive Seamless Device-to-Device Connectivity

Technology industry leaders Atmel Corporation, Broadcom Corporation, Dell, Intel Corporation, Samsung Electronics Co., Ltd., and Wind River, are joining forces to establish a new industry consortium focused on improving interoperability and defining the connectivity requirements for the billions of devices that will make up the Internet of Things (IoT).

The Open Interconnect Consortium (OIC) is focused on defining a common communications framework based on industry standard technologies to wirelessly connect and intelligently manage the flow of information among personal computing and emerging IoT devices, regardless of form factor, operating system or service provider.

Intel to Manufacture Panasonic System-on-Chips Using 14 nm Process

Intel Corporation today announced that it has entered into a manufacturing agreement with Panasonic Corporation's System LSI Business Division. Intel's custom foundry business will manufacture future Panasonic system-on-chips (SoCs) using Intel's 14 nm low-power manufacturing process.

Panasonic's next-generation SoCs will target audio visual-based equipment markets, and will enable higher levels of performance, power and viewing experience for consumers.

VIA Readying New 64-bit x86 Processor to Take on Intel Bay Trail and AMD Kabini

Only the third active licencee of Intel's x86 machine architecture, VIA Technology, is readying its first x86 processor in years, codenamed Isaiah II. This chip is based on a brand new 64-bit x86 core design by VIA and the engineering team it acquired from Centaur Technology, another erstwhile x86 licencee, and features modern instruction sets such as AVX 2.0. VIA began sampling a quad-core processor based on Isaiah II, which was put to live test by the company, at its InfoComm 2014 booth. It was compared to Intel's "Bay Trail" Atom and AMD's "Kabini" Athlon chips. It turns out that the Isaiah II is pretty good, if it comes out soon enough.

The Isaiah II based quad-core chip, featuring 2.00 GHz clock speeds, and 2 MB of L2 cache, was put through SANDRA. The BGA chip was running on a VIA-made motherboard, with its own VIA VX11H chipset. It was compared to AMD Athlon 5350 (quad-core "Jaguar" with 2.05 GHz clocks), and Intel Atom Z3770 (quad-core "Silvermont" with 2.40 GHz clocks). The results are tabulated below. At 2.00 GHz, armed with the latest multimedia and cryptography instruction-sets, VIA's chip is faster than Intel's in most tests, despite lower clocks. It trades blows - and wins - against AMD's chip, in most tests. VIA is expected to launch the first chips based on Isaiah II in late-August, 2014. VIA is hedging its bets with efficient compact PCs, kiosks, and digital signage, with its new chip.


Sources: 3DCenter.org, ExtraHardware.cz

Intel Showcases Education Solutions for All Kinds of Classrooms at ISTE 2014

Intel Corporation announced that three customers launched products based on its new education-specific product reference designs this week at the International Society for Technology in Education (ISTE) 2014 Conference in Atlanta. Created by Intel Education, these reference designs draw on more than a decade of experience in student learning, providing customers with shorter development time, customization capabilities and the latest technologies, features and software. The three products are the Panasonic 3E*, the CTL Education Chromebook* and the M&A Education Chromebook*.

Designed for active learning and active students, the Panasonic 3E is a tablet that comes with a detachable keyboard to deliver laptop capabilities. Panasonic is the first company to offer Intel's purpose-built 2 in 1 reference design as a device for K-12 students. The Panasonic 3E ships with a comprehensive software bundle of essential K-12 applications that makes learning more active and teachers' lives easier. It also features a thermometer probe, on-board cameras and an add-on lens that turn science and mathematics into hands-on, highly engaging, STEM-centered learning.

Intel Core "Devil's Canyon" Quad-core Processors Begin Shipping

Launched for pre-order on the side-lines of Computex 2014, Intel's flagship quad-core processors for the LGA1150 platform, codenamed "Devil's Canyon," are now shipping from retailers, and can be bought off the shelf on ground stores. Based on the 22 nm "Haswell Refresh" silicon, these chips are designed for overclocking, featuring higher voltage limits, packages designed to tolerate higher voltage, stronger electricals, and an improved thermal interface material between the die and IHS.

The series includes the Core i5-4690K, and the Core i7-4790K. The i5-4690K is clocked at 3.50 GHz, with Turbo Boost frequencies of 3.90 GHz, and features 6 MB of L3 cache. The i7-4790K, on the other hand, is the first Intel Core processor to ship with out of the box clock speed of 4.00 GHz, and Turbo Boost speeds of 4.40 GHz. It features 8 MB of L3 cache, and HyperThreading, which enables eight logical CPUs for the OS to deal with. The i5-4690K is priced at US $250, and the i7-4790K at $350.

Micron Collaborates With Intel to Enhance "Knights Landing"

Micron Technology, Inc. (Nasdaq:MU), one of the world's leading providers of advanced semiconductor solutions, today announced an ongoing collaboration with Intel to deliver an on-package memory solution for Intel's next-generation Xeon Phi processor, codenamed Knights Landing. The memory solution is the result of a long-term effort between the two companies to break down the memory wall, leveraging the fundamental DRAM and stacking technologies also found in Micron's Hybrid Memory Cube products.

"The ecosystem is changing and the importance of scalable on-package memory and memory bandwidth is now coming to light," said Chirag Dekate, Research Manager at IDC. "Memory is at the heart of the solution space which will benefit both big compute and big data. This announcement is a clear validation of how Micron is advancing the role and impact of memory on systems and the value that 3D memory can deliver."

Intel Details Its Next-Gen Xeon Phi Processor

Intel Corporation today announced new details for its next-generation Intel Xeon Phi processors, code-named Knights Landing, which promise to extend the benefits of code modernization investments being made for current generation products. These include a new high-speed fabric that will be integrated on-package and high-bandwidth, on-package memory that combined, promise to accelerate the rate of scientific discovery. Currently memory and fabrics are available as discrete components in servers limiting the performance and density of supercomputers.

The new interconnect technology, called Intel Omni Scale Fabric, is designed to address the requirements of the next generations of high-performance computing (HPC). Intel Omni Scale Fabric will be integrated in the next generation of Intel Xeon Phi processors as well as future general-purpose Intel Xeon processors. This integration along with the fabric's HPC-optimized architecture is designed to address the performance, scalability, reliability, power and density requirements of future HPC deployments. It is designed to balance price and performance for entry-level through extreme-scale deployments.

QNAP Launches High-Performance & Scalable Turbo NAS TS-ECx80U-RP Series

QNAP Systems, Inc. today officially launched four new business-class Turbo NAS models: TS-EC880U-RP, TS-EC1280U-RP, TS-EC1680U-RP, and TS-EC2480U-RP. Delivering high-performance, extreme scalability options and a wide array of applications to drive businesses, these models easily fulfill mission-critical storage needs of businesses, with persistent throughput to balance resource-demanding applications.

Equipped with a Quad-Core Intel Xeon 3.4GHz processor, 4GB DDR3 ECC RAM and with 10GbE-readiness and SSD caching options (including up to two internal mSATA slots), these models are capable of providing up to 3,700 MB/s throughput and 410,000 IOPS to boost the workflow of IOPS-demanding applications such as virtualization and data center deployment. With a scalable design, administrators can gradually expand their total storage to over 680TB raw capacity (depends on models) on demand by connecting multiple QNAP RAID expansion enclosures (REXP-1600U-RP and REXP-1200U-RP). With this flexibility, businesses can be confident that these models will suit their storage requirements both now and in the future.
Return to Keyword Browsing