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How Intel Plans to Transition Between DDR3 and DDR4 for the Mainstream

The transition between DDR2 and DDR3 system memory types was slower than the one between DDR and DDR2. DDR3 made its mainstream debut with Intel's X38 and P35 Express platforms, at a time when the memory controller was still within the domain of a motherboard chipset, at least in Intel's case. The P35 supported both DDR2 and DDR3 memory types, and motherboard manufacturers made high-end products based on each of the two memory types, with some even supporting both.

Higher module prices posed a real, and higher latencies, posed a less real set of drawbacks to the initial adoption of DDR3. Those, coupled with the limited system bus bandwidth, to take advantage of DDR3. DDR3 only really took off with Nehalem, Intel's first processor with an integrated memory controller (IMC). An IMC, again in Intel's case, meant that the CPU came with memory I/O pins, and could only support one memory type - DDR3. Since then, DDR3 proliferated to the mainstream. Will the story repeat itself during the transition between DDR3 and the new DDR4 memory introduced alongside Intel's Core i7 "Haswell-E" HEDT platform? Not exactly.

ASUS Announces the X99-E WS Workstation Motherboard

ASUS today announced X99-E WS, a new Compact Electronics Bay (CEB) workstation motherboard based on the Intel X99 chipset and with support for four-way multi-GPU setups at full PCI Express 3.0 x16 speed for extreme graphics power. X99-E WS is engineered with premium components for premium efficiency, including an integrated Driver-MOSFET (Dr. MOS), exclusive Beat Thermal Chokes II, ultra-durable 12K capacitors and ProCool power connector. X99-E WS offers industry-leading storage opportunities with onboard M.2 x4 and support for the exclusive ASUS PIKE II (Proprietary I/O Kit Expansion) and ThunderboltEX II expansion cards. It also has many simple, efficient and ASUS-exclusive easy-maintenance tools, including Q-Code Logger and Dr. Power.

G.SKILL Live Demos Extreme DDR4 3333MHz 32GB (4GBx8) and 3200MHz 32GB (8GBx4)

G.SKILL International Co., Ltd., the leading extreme performance memory manufacturer and designer, is excited to feature two extremely high end DDR4 memory at 3333MHz 32GB (4GBx8) and 3200MHz 32GB (8GBx4) during Intel Developer Forum 2014 (IDF 2014). Driven by the newest Intel i7-5960X CPU on the newest ASUS Rampage V Extreme X99 and X99-Deluxe motherboards, the Ripjaws 4 series DDR4 3333MHz 4GBx8 and 3200MHz 8GBx4 memory demonstrates the highest DDR4 speed available in 4GB and 8GB modules, respectively.

"It's very exciting to show the world what we can do with the new DDR4 memory standard for the latest Intel X99 platform. There is no doubt that breaking the 3000MHz memory barrier with ease is the next big thing in desktop performance, effectively doubling bandwidth throughput compared to the previous DDR3 memory standard," says Frank Hung, Product Marketing at G.SKILL.

HGST Unveils Intelligent, Dynamic Storage Solutions to Transform The Data Center

Leveraging its data center storage insights, HGST, a Western Digital company (NASDAQ: WDC), is broadening its scope of innovation to capture new and growing opportunities in data center storage infrastructure. The company today announced six new offerings that will help organizations manage the increasing volume, velocity, variety and longevity of data in today's rapidly evolving data center.

In addition to maintaining its longstanding leadership in storage devices, the new offerings demonstrate HGST's commitment to transform the data center and itself through hardware and software solutions that elevate the value it provides to partners and customers. By creating innovative solutions that shape the emerging categories of Flash fabric solutions and active archive solutions, HGST is driving the data center evolution by helping organizations readily extract the information, knowledge and wisdom that lies within their data.

HGST Extends Development Agreement with Intel For Enterprise SAS SSDs

Enterprise storage leader HGST, a Western Digital company today announced it will extend the use of Intel NAND Flash technology as part of a cooperative agreement with Intel Corporation on Serial Attached SCSI (SAS) solid state drives (SSDs). Since 2008, HGST has successfully worked with Intel to develop industry-leading enterprise-class SAS SSDs for servers, workstations and storage systems. The resulting products have combined HGST's enterprise storage experience with Intel's NAND Flash expertise, and are the foundation for HGST's leading position in SAS SSDs.

Intel's focus and investment in NAND flash memory research and SSD development provides industry-leading advancements in next-generation NAND lithography and offers high-endurance SSD technology. HGST brings proven enterprise storage expertise in SAS design, firmware, reliability, customer qualification and system integration. This combination enables HGST to deliver world-class solutions with the performance, endurance and reliability that enterprise storage customers demand.

Intel Unveils New Dev Tools, Technologies For Tablets, Wearable Devices and PCs

Intel Corporation CEO Brian Krzanich kicked off Intel's annual technical conference with a broad set of computing initiatives and projects showing how the company is moving quickly to enable new market segments where everything is smart and connected. Krzanich and other executives announced new hardware and software developer tools, previewed upcoming Intel technologies and announced new products across several technology segments.

"With our diverse product portfolio and developer tools that span key growth segments, operating systems and form factors, Intel offers hardware and software developers new ways to grow as well as design flexibility," said Brian Krzanich, Intel CEO. "If it's smart and connected, it is best with Intel."

ASUS' Entry Level X99-A LGA2011v3 Motherboard Starts Selling

ASUS' entry-level socket LGA2011-v3 motherboard, the X99-A, began selling. Although announced along with ASUS' mainline flagship, the X99-Deluxe, the X99-A, along with mid-range X99-Pro, weren't available immediately, as the company decided to go in with three flagship LGA2011-v3 products, the ROG Rampage V Extreme and X99-WS being the other two. The X99-A appears to be based on a slightly watered down version of a PCB it shares with the X99-Pro; different from that of the X99-Deluxe. It's targeted at high-end gaming PC and mid-range content-creation builds.

To begin with, the X99-A is built in the standard ATX form-factor. It draws power from a combination of 24-pin ATX and 8-pin EPS connectors. An 8-phase VRM conditions power for the CPU, with a 2+2 phase VRM for the eight DDR4 DIMM slots flanking the CPU socket on either sides. The CPU socket is wired to three PCI-Express 3.0 x16 slots (x16/x16/NC or x16/x8/x8 on i7-5960X and i7-5930K; and x16/NC/NC or x8/x8/NC or x8/x4/x4 on i7-5820K), and a 32 Gb/s M.2 slot, which features a PCI-Express 3.0 x4 physical layer. Other expansion slots include one PCI-Express 2.0 x16 (electrical x4), and two PCI-Express 2.0 x1. The board supports 3-way NVIDIA SLI and AMD CrossFireX.

Crucial Expands DDR4 Server Memory Portfolio

Crucial, a leading global brand of memory and storage upgrades, has expanded its DDR4 memory portfolio with LRDIMM and VLP RDIMM modules. Designed to enable next-generation enterprise environments with increased speed, bandwidth, and energy efficiency, Crucial DDR4 load reduced DIMMs (LRDIMMs) and very low profile registered DIMMS (VLP RDIMMs) are available for immediate purchase through select global channel partners.

By utilising a memory buffer chip that helps reduce the electrical load presented to the memory bus, Crucial DDR4 LRDIMMs allow for more DIMMs per channel and are up to 50 percent more energy efficient and deliver up to 50 percent more memory bandwidth than DDR3 LRDIMMs. Furthermore, by using less voltage and standby current, Crucial DDR4 LRDIMMs transmit power in a more efficient manner to the CPU, allowing for additional power savings and lower total cost of ownership.

BIOSTAR Announces J1800NH2 Motherboard

BIOSTAR has announced the J1800NH2, a mini ITX mainboard with CPU on board, (known as System on a Chip or SoC). These boards are small and efficient using a small form factor with a fan-less embedded CPU, and have low power consumption. It's a small, quiet solution for all manner of industrial applications. The BIOSTAR J1800NH2 is the latest in all-in-one board that takes advantage of the optimized performance of Intel's Bay Trail chipset by delivering a new generation of technology with value-added features and easy integration.

The J1800NH2 board, being in the mini-ITX form factor, is backwards compatible with ATX and micro-ATX form factors. The ITX form factor allows you to build small and energy efficient solutions. The J1800NH2 is a simple, affordable and internet centric computer design in a compact 17x17cm size. It is the ideal solution for an ultra small form factor system and easily used with various chassis makes.

Intel Debuts the Xeon E5-2600/1600 v3 Processor Family

Intel Corporation today introduced the Intel Xeon processor E5-2600/1600 v3 product families to address the requirements of diverse workloads and the rapidly evolving needs of data centers. The new processor families include numerous enhancements that provide performance increases of up to 3x over the previous generation, world-class energy efficiency and enhanced security. To facilitate the explosive demand for software defined infrastructure (SDI), the processors expose key metrics, through telemetry, which enable the infrastructure to deliver services with the best performance, resilience and optimized total cost of ownership.

The processors will be used in servers, workstations, storage and networking infrastructure to power a broad set of workloads such as data analytics, high-performance computing, telecommunications and cloud-based services, as well as back-end processing for the Internet of Things.

Intel Launches the Intel Core M Processor

At IFA, a global trade show for consumer electronics and home appliances, Intel launched the new Intel Core M processor, which will power new 2 in 1 devices from a variety of manufacturers including: Acer, ASUS, Dell, HP, Lenovo and Toshiba. Delivering the optimal blend of mobility and performance, Intel's new processor was purpose-built for amazing performance in the thinnest, fanless ultra-mobile devices. The Intel Core M processor can power razor-thin devices with Intel Core processor-level performance and deliver up to double the battery life when compared to a 4-year-old system.

"We've been on a multi-year mission to address end-user requirements and transform mobile computing," said Kirk Skaugen, senior vice president and general manager of personal computing at Intel Corporation. "The introduction of Core M marks a significant milestone in that journey. Core M is the first of a new product family designed to deliver the promise of one of the world's thinnest laptops and highest performance tablets in a single 2 in 1 device."

HP Unveils Five New Innovative and Stylish Consumer Products for Holiday

HP today announced a new lineup of sleek consumer PCs including, two new powerful HP ENVY x2 detachable PCs designed to deliver a notebook experience for productivity, but quickly transform to a tablet for entertainment and apps; the ultra-portable HP Pavilion x2 detachable PC designed for customers who want to simplify their life with a single device that transforms from tablet to laptop; and two new colorful HP Chromebooks that bring the power of the Chrome OS for a fast, simple, protected internet experience.

"Customers have told us they want devices that offer flexibility and performance while reflecting their personal sense of style," said Mike Nash, vice president, Product Management, Consumer Personal Systems, HP. "The products we are announcing today include innovative designs, vibrant color options, choice of operating system and computing power to enable the way that customers communicate, play and live."

Intel Launches its Core i7-5000 Series High-end Desktop Platform

Intel launched its next-generation Core i7-5000 series high-end desktop platform, consisting of socket LGA2011-V3 Core i7 processors, and compatible motherboards based on the Intel X99 Express chipset. The platform is an upscaling of the "Haswell" micro-architecture, codenamed "Haswell-E" and targets Ultra HD gamers, media professionals, and PC enthusiasts. The platform begins with the "Haswell-E" silicon, which physically features eight "Haswell" CPU cores, a staggering 20 MB of L3 cache, a quad-channel DDR4 integrated memory controller, and a 40-lane PCI-Express Gen 3.0 root complex. Three SKUs are carved out of this silicon.

The series is led by the Core i7-5960X. Intel's first eight-core processor for the high-end desktop market, this chip features HyperThreading, which enables 16 logical CPUs for the OS to play with, 20 MB of L3 cache, and clock speeds of 3.00 GHz, with 3.50 GHz maximum Turbo Boost. It commands a price of $999. Next up, is the Core i7-5930K. A six-core chip with HyperThreading that enables 12 logical CPUs, this chip features 15 MB of L3 cache, clock speeds of 3.50 GHz with 3.70 GHz maximum Turbo Boost, and a US $583 price-tag. The most affordable chip is the Core i7-5820K. At US $389, it's the cheapest six-core HEDT chip by Intel (at launch). It features 12 MB of L3 cache, and clock speeds of 3.30 GHz, with 3.60 GHz of Turbo Boost. Too good to be true? Not so fast. It features a slimmer 28-lane PCIe root complex, so certain multi-GPU configurations won't run optimally. The Intel X99 Express chipset corrects many of the shortcomings of its predecessor, the X79 Express. It features a meaty storage controller that offers ten SATA 6 Gb/s ports, one or more SATA-Express, and M.2 slots. It also integrates a 6-port USB 3.0 host controller, and two independent 4-port USB 2.0 host controllers.

Intel Announces New Packaging and Test Technologies for Foundry Customers

Intel Corporation today announced two new technologies for Intel Custom Foundry customers that need cost-effective advanced packaging and test technologies. Embedded Multi-die Interconnect Bridge (EMIB), available to 14nm foundry customers, is a breakthrough that enables a lower cost and simpler 2.5D packaging approach for very high density interconnects between heterogeneous dies on a single package. Instead of an expensive silicon interposer with TSV (through silicon via), a small silicon bridge chip is embedded in the package, enabling very high density die-to-die connections only where needed.

Standard flip-chip assembly is used for robust power delivery and to connect high-speed signals directly from chip to the package substrate. EMIB eliminates the need for TSVs and specialized interposer silicon that add complexity and cost. "The EMIB technology enables new on-package functionality that may have been too costly to pursue with previous solutions," said Babak Sabi, Intel vice president and director, Assembly and Test Technology Development.

Intel Core i7 "Haswell-E" Pricing Detailed

Intel will price its next-generation Core i7 "Haswell-E" HEDT processors along expected lines. The lineup will begin with the Core i7-5820K, priced at US $389 - just $50 more than a Core i7-4790K. There are some major trade-offs you need to consider when choosing between the two. The i7-5820K is a six-core chip, but its motherboard and newer, costlier DDR4 memory, will jack up your overall platform costs. The i7-4790K lets you buy a motherboard as cheap as $120, and memory that's as cheap as it gets. It's now confirmed that the i7-5820K features 6 cores, 12 threads enabled by HyperThreading, a quad-channel DDR4 memory interface, and 15 MB of L3 cache, but a narrower 28-lane PCI-Express 3.0 root complex. The chip features TurboBoost frequency of 3.60 GHz.

To use the platform to its fullest, you'd need to part with at least US $583 for a processor. That's what will get you the Core i7-5930K. Also a six-core chip, the i7-5930K features a wider 40-lane PCI-Express 3.0 root complex, letting you set up 3-way and 4-way high-end multi-GPU setups with sufficient bus width for each of the cards running in tandem. The chip features 6 cores, 12 threads, a quad-channel DDR4 IMC, 15 MB of L3 cache, and TurboBoost frequencies of up to 3.70 GHz. Leading the pack is the Core i7-5960X, Intel's first eight-core high-end client CPU. It's priced at a wallet-scorching $999. For close to a grand, you get 8 cores, 16 threads enabled with HyperThreading, a massive 20 MB of L3 cache, a quad-channel DDR4 IMC, and 40 PCI-Express 3.0 lanes. To keep the eight cores within Intel's desired 140W thermal envelope, the company had to go easy on the clocks. It offers TurboBoost frequencies of up to 3.50 GHz. All three chips feature unlocked base-clock multipliers.Source: VideoCardz

G.SKILL Officially Announces Ripjaws 4 Series DDR4 Memory Kits

G.SKILL International Co., Ltd., the leading high performance memory designer and manufacturer, reveals the long awaited next generation Ripjaws 4 series DDR4 memory kits! Featuring all new redesigned heatspreaders in three different colors, high performance frequencies, high capacity, DDR4 quad-channel ready, and ultra low voltages, the Ripjaws 4 series is all the benefits of DDR4 rolled into one sleek package.

With a standard of 2133MHz, DDR4 is the next generation definition of performance. Also available in 2400MHz, 2666MHz, 2800MHz, 3000MHz, and 3200MHz, the starting lineup is continuing where DDR3 left off. With capacities starting at 16GB (4GBx4), 32GB (8GBx4 / 4GBx8) and 64GB (8GBx8), your new X99 platform will have more memory space to do what you need it to do. That's not all! Ripjaws 4 also has an ultra low voltage rating of 1.2V for kits under 2800MHz and 1.35V for 3000/3200MHz.

USB-IF to Demonstrate USB Single-Cable Solution at IDF San Francisco

The USB Implementers Forum (USB-IF) today announced that it will exhibit and present the latest USB developments at Intel Developer Forum (IDF) in San Francisco, September 9-11. At IDF, the USB-IF will host a Technology Community, present technical sessions on the new USB Type-C connector, and host press briefings featuring new technology demonstrations.

JPR Reports AMD Jumps 11% in GPU Shipments in Q2, Intel up 4%, NVIDIA Slips

Jon Peddie Research (JPR), the industry's research and consulting firm for graphics and multimedia, announced estimated graphics chip shipments and suppliers' market share for 2014 2Q.

Graphics chips are without doubt one of the most powerful, exciting, and essential components in tech today: not only does every computer require one (or more), but the technology is entering into major new markets like supercomputers, remote workstations, and simulators almost on a daily basis. New technologies and compute programs are taking advantage of the ability of GPU power to scale. On top of that, PC gaming momentum continues to build. It would be no exaggeration to say that GPUs are becoming the 800-pound gorilla in the room.

Intel and SMS Audio to Supercharge Fitness Wearables

SMS Audio LLC, a premier audio headphone and accessories brand from Curtis "50 Cent" Jackson, together with Intel Corporation announced a collaboration to develop the first heart-pounding personal audio system converging lifestyle and technology innovation for an exceptional fitness experience. The SMS Audio BioSport In-Ear Headphones powered by Intel will bring smart exercise capabilities to athletes of all levels later this year.

With today's announcement, Intel and SMS Audio are merging lifestyle requirements with technology innovation to enhance the fitness experience. The SMS Audio BioSport In-Ear Headphones powered by Intel will extend the recently launched SMS Audio Sport Collection and harness advanced technology features to deliver high-quality audio while gathering actionable data on fitness progress.

Avago Selling LSI's Axxia Networking Business to Intel for $650 Million

Avago Technologies Limited and Intel Corporation today announced the signing of a definitive agreement for Intel to acquire LSI's Axxia Networking Business and related assets for $650 million in cash. The transaction, which has been approved by the boards of directors for both Avago and Intel, is expected to close in the fourth calendar quarter of 2014 upon satisfaction of government approvals and customary closing conditions.

LSI's Axxia Networking Business is being divested from Avago following the recent completion of Avago's acquisition of LSI. The Axxia Networking Business generated revenues of $113 million in calendar 2013 and employs approximately 650 people.

Intel Haswell TSX Erratum as Grave as AMD Barcelona TLB Erratum

Intel's "Haswell" micro-architecture introduced the transactional synchronization extensions (TSX) as part of its upgraded feature-set over its predecessor. The instructions are designed to speed up certain types of multithreaded software, and although it's too new for any major software vendor to implement, some of the more eager independent software developers began experimenting with them, only to discover that TSX is buggy and can cause critical software failures.

The buggy TSX implementation on Core "Haswell" processors was discovered by a developer outside Intel, who reported it to the company, which then labeled it as an erratum (a known design flaw). Intel is addressing the situation by releasing a micro-code update to motherboard manufacturers, who will then release it as a BIOS update to customers. The update disables TSX on affected products (Core and Xeon "Haswell" retail, and "Broadwell-Y" engineering samples).

Lenovo Announces ThinkStation P Series

Lenovo today, at SIGGRAPH 2014 in Vancouver, British Columbia, announced the launch of the ThinkStation P Series, unveiling its vision for the ultimate in desktop workstation performance, reliability and usability. Rebuilt from the ground up, the Lenovo ThinkStation P900, P700 and P500 workstations join the entry-level ThinkStation P300, announced in May 2014, as the most powerful professional-grade desktop workstations available. Now, professionals in engineering, architecture, media and entertainment, oil & gas, medical & science, finance and other industries can arm themselves with workstation technology selected and configured to meet their needs for enhanced productivity and limitless innovation.

"After a period of intensive research, development and testing, we're excited to introduce our next generation workstations to the market, as we truly believe this is the best designed workstation ever," said Victor Rios, vice president and general manager, Workstation, Lenovo. "We built on the advancements delivered in our 30 Series workstations and engineered the P Series with new levels of innovation based on extensive customer feedback. The result for users is optimum performance, outstanding reliability and unparalleled usability that is unlike anything they have experienced."

Intel Details Newest Microarchitecture and 14 Nanometer Manufacturing Process

Intel today disclosed details of its newest microarchitecture that is optimized with Intel's industry-leading 14 nm manufacturing process. Together these technologies will provide high-performance and low-power capabilities to serve a broad array of computing needs and products from the infrastructure of cloud computing and the Internet of Things to personal and mobile computing.

"Intel's integrated model - the combination of our design expertise with the best manufacturing process - makes it possible to deliver better performance and lower power to our customers and to consumers," said Rani Borkar, Intel vice president and general manager of product development. "This new microarchitecture is more than a remarkable technical achievement. It is a demonstration of the importance of our outside-in design philosophy that matches our design to customer requirements."

Intel to Discontinue Five More Ivy Bridge Processors

Intel's Ivy Bridge purge continues as the Santa Clara-based company announced its plans to retire five more chips based on the aging architecture, the Core i3-3110M, i3-3120M, i3-3130M, i3-3217U, i3-3227U. These mobile CPUs were released between Q2 2013 and Q1 2013 and are set to 'survive' until Q2 2015 as May 22nd is the last day of shipments. Intel is still taking orders for these processors but that will stop November 21st.

Intel Declares Quarterly Cash Dividend

Intel Corporation's board of directors has declared a quarterly dividend of 22.5 cents per share (90 cents per share on an annual basis) on the company's common stock. The dividend will be payable on Sept. 1, 2014, to stockholders of record on Aug. 7, 2014.

Intel (NASDAQ:INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world's computing devices. As a leader in corporate responsibility and sustainability, Intel also manufactures the world's first commercially available "conflict-free" microprocessors.
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