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New Ideas from Lenovo Inspire a PC Refresh this Holiday Season

Lenovo today announced seven new desktops, laptops and tablets across its popular ideacentre and ideapad sub-brands, giving discerning shoppers multiple reasons to upgrade this holiday season. The fresh portfolio of devices include the new ideapad MIIX 700 2-in-1 tablet, new ideacentre AIO 700 desktop and five new laptops - ideapad 300 and 500 and their thinner and lighter cousins ideapad 100S, 300S and 500S.

The new ideacentre AIO 700 desktop delivers up to double the power, screen resolution and memory capacity from its three-year-old previous generation - ideal for watching videos and gaming. In addition to the performance leap, all the new devices boast state-of-the-art Lenovo design, significantly improved portability and the promise of intuitive, new technology like Windows 10 and Intel RealSense Cameras. The new trio of ideapad MIIX 700 2-in-1 tablet, ideacentre AI0 700 desktop and ideapad 500 laptop are all available with optional Intel RealSense Cameras so users can explore, discover and create new and intuitive ways to 3D game, video chat, scan and print through gesture-based computing.

Toshiba Announces World's First 12.5-Inch 4K Ultra HD Convertible Laptop

Toshiba's Digital Products Division (DPD), a division of Toshiba America Information Systems, Inc., today announced the Satellite Radius 12, a compact 2-in-1 laptop designed with expert technologies to best meet the performance demands of today and tomorrow. The world's first 12.5-inch convertible laptop with a 4K Ultra HD display, the Satellite Radius 12 features top-of-the-line screen and sound quality, a sleek, lightweight design and 6th Gen Intel Core processors that deliver maximum mobile performance and excellent battery life.

"Through our deep relationships with our partners at Microsoft, Intel and Technicolor we have designed a top-of-line compact PC that delivers the new gold standard in screen, sound and performance for an unmatched computing experience on Windows 10," said Philip Osako, senior director of product marketing, Toshiba America Information Systems, Inc., Digital Products Division. "The Satellite Radius 12 expertly blends the latest technology into an extremely powerful, yet compact and easy-to-carry PC that is not only versatile, but durable enough to handle a highly mobile lifestyle."

ASUSTOR Launches the World's First Intel Braswell Powered NAS

ASUSTOR Inc., a leading innovator and provider of network storage solutions, has announced the launch of 4 high performance tower model NAS devices.These new models are the first in the world to be equipped with Intel Braswell processors and feature the AS6202T and AS6204T powered by quad-core processors and the AS6102T and AS6104T powered by dual-core processors. Featuring rock-solid design and a wide variety of expansion ports, these new models also feature an AES-NI hardware encryption engine, the latest version of the intuitive ADM operating system, secure data protection mechanisms and energy saving features, providing first-class performance for both work and play and making them the first choice in cloud storage for both prosumer and SMB user segments.

The fast pace of modern emerging technologies and innovation demand high-performance hardware that is flexible in application. ASUSTOR's 62 and 61 series devices all utilize high performance Intel processors and feature a high degree of expandability via a wide range of hardware ports including eSATA, USB 3.0, HDMI, and S/PDIF ports which provide for flexible application possibilities. Additionally, pre-installed dual-channel high speed memory allows for smooth system operation. Users are also able to expand memory up to a maximum of 8GB in order to enhance overall multitasking performance.

Intel Expands its 6th Gen. Core Processor Lineup

Intel expanded its 6th generation Core "Skylake" processor lineup for the desktop, with seven new models. Built in the LGA1151 package, these chips work on motherboards running the company's 100-series chipset. Besides the overclocker-friendly Core i7-6700K and the i5-6600K already launched, the lineup now includes the i7-6700, i5-6600, i5-6500, i5-6400, i3-6320, i3-6300, and the i3-6100. Of these, the Core i7 and Core i5 models are quad-core, while the Core i3 ones are dual-core.

The Core i7-6700 and i5-6600 are not just different from the i7-6700K and i5-6600K in that they lack unlocked BClk multipliers, they also come with lower clock speeds out of the box. The i7-6700 is clocked at 3.40 GHz with 4.00 GHz max Turbo Boost (i7-6700K offers 4.00 GHz with 4.20 GHz Turbo), while the i5-6600 is clocked at 3.30 GHz, with 3.90 GHz Turbo Boost (i5-6600K offers 3.50 GHz with 3.90 GHz Turbo). The i7-6700 is priced at US $312, while the i5-6600 goes for $213 (single-unit box price).

Razer Brings Intel RealSense Camera to VR and Game Streamers

Razer, a world leader in connected devices and software for gamers, is working with Intel to deliver a consumer-ready desktop and VR-enabled camera based on Intel RealSense technology for a wide range of experiential applications.

With Intel RealSense technology incorporated into a new Razer product design, users can expect to enjoy significantly enhanced game broadcasting and VR gaming capabilities. Among the novel features of this technology is automatic background removal, which allows game streamers and video conferencing users to remove or replace backgrounds for a more entertaining and immersive experience.

Intel RealSense Cameras are also capable of 3D scanning, motion and gesture recognition, allowing product designers to bring real-world objects and bodies into virtual spaces easily. Many more features and related applications are anticipated for the Intel RealSense technology-enabled Razer device.

Intel Readies First Consumer SSD Based on 3D Xpoint Memory

Intel plans to launch the first consumer SSD based on its new 3D Xpoint memory technology, a successor to NAND flash which promises exponential gains in performance and capacity, some time in 2016. The Intel-branded drive will be called Intel Optane, will come in modern form-factors such as M.2/NGFF, SATA-Express, PCI-Express (add-on card), and will take advantage of the new NVMe protocol.

Early prototypes of Optane demoed at IDF already offer up to 5.5 times the throughput of NAND flash-based DC P3700 series SSDs, and we're only talking about single-queue performance. Compared to the queue depth of just 32 commands for AHCI, NVMe offers command queue depth of a staggering 65,535 commands. Since Micron Technology is the co-developer of 3D Xpoint, it's likely that we'll also see Micron/Crucial branded drives based on this tech.


Source: The TechReport

Intel Skylake Microarchitecture Detailed

The "Skylake" CPU microarchitecture is as much important to Intel as "Sandy Bridge" was, a few years ago. It allows Intel to facilitate mainstream adoption of the DDR4 memory standard (with DDR3 backwards compatibility encouraging cheap upgrades), and gives users IPC increases over older architectures. While users of Core "Haswell" processors and reasonably fast DDR3 memory will find "Skylake" a hard-sell, it should look appealing to users of much older chips, such as "Lynnfield," and perhaps even "Sandy Bridge."

The "Skylake" core is bigger than "Haswell," owing to wider pipelines, prefetcher improvements, more execution units, a bigger front-end with a higher-capacity branch predictor, cache optimizations, and an update to the way HyperThreading works. The instruction window is nearly 1.5x the size of Sandy Bridge, with an out-of-order execution window size of 224 (vs. 168 on Sandy Bridge), load/store sizes of 72/56 (vs. 64/36 on Sandy Bridge), 97 scheduler entries (vs. 56 on Sandy Bridge), and an allocation queue size of 64/thread (vs. 28/thread). The platform of "Skylake" is similar to that of its predecessor, with four notable changes - an integrated camera ISP with the chipset, DDR4 memory support, double the chipset bus bandwidth (64 Gb/s), and eDRAM support on certain CPU SKUs.

Source: HotHardware

Intel "Skylake" Die Layout Detailed

At the heart of the Core i7-6700K and Core i5-6600K quad-core processors, which made their debut at Gamescom earlier this month, is Intel's swanky new "Skylake-D" silicon, built on its new 14 nanometer silicon fab process. Intel released technical documents that give us a peek into the die layout of this chip. To begin with, the Skylake silicon is tiny, compared to its 22 nm predecessor, the Haswell-D (i7-4770K, i5-4670K, etc).

What also sets this chip apart from its predecessors, going all the way back to "Lynnfield" (and perhaps even "Nehalem,") is that it's a "square" die. The CPU component, made up of four cores based on the "Skylake" micro-architecture, is split into rows of two cores each, sitting across the chip's L3 cache. This is a departure from older layouts, in which a single file of four cores lined one side of the L3 cache. The integrated GPU, Intel's Gen9 iGPU core, takes up nearly as much die area as the CPU component. The uncore component (system agent, IMC, I/O, etc.) takes up the rest of the die. The integrated Gen9 iGPU features 24 execution units (EUs), spread across three EU-subslices of 8 EUs, each. This GPU supports DirectX 12 (feature level 12_1). We'll get you finer micro-architecture details very soon.

Intel Core "Skylake" Processors Start Selling

Retail availability of the two Core "Skylake" SKUs Intel debuted, the Core i7-6700K and Core i5-6600K, begins today. This is when you will be able to pick up a boxed chip off the shelf, or order one online. To help ease the socket confusion, online retailers are selling bundles of these chips with compatible socket LGA1151 motherboards at a nominal discount, some of which include DDR4 memory, depending on the motherboard bundled. On its own, the Core i7-6700K is priced at US $343, while the Core i5-6600K is priced at $250.

The i7-6700K offers clock speeds of 4.00 GHz out of the box, with Turbo Boost frequency of 4.20 GHz. It also offers 8 MB of L3 cache, and HyperThreading, which enables 8 logical CPUs for the OS to address. The Core i5-6600K, on the other hand, offers 3.50 GHz clocks with 3.90 GHz Turbo Boost. It offers 6 MB of L3 cache, and lacks HyperThreading. Both are quad-core chips, with unlocked base-clock multipliers, for overclocking. The retail packages of both chips lack stock cooling solutions, so you need to have an LGA115x-compatible cooler ready. The TDP of both chips is rated at 91W. Intel will put out some of the finer micro-architecture details on the 16th of August, 2015. More Core i5 quad-core SKUs in the series will be released on the 29th of August, 2015. Dual-core Core i3 SKUs will be launched towards the end of September, 2015.

MSI Unveils the Z170A PC Mate Motherboard

MSI, which debuted its socket LGA1151 motherboard lineup with its Gaming series, launched its first mainline LGA1151 board, the Z170A PC Mate. A departure from the MS-7850 common-PCB, which the company used on various Intel 8-series and 9-series chipsets, the Z170A PC Mate features a boarder form, and covers all the platform basics. The board draws power from a combination of 24-pin ATX and 8-pin EPS power connectors, and features a 6-phase CPU VRM. The CPU is wired to four DDR4 DIMM slots, supporting up to 64 GB of dual-channel DDR4 memory, and one PCI-Express 3.0 x16 slot.

Other expansion slots on the Z170A PC Mate include a PCI-Express 3.0 x16 (electrical gen 3.0 x4), wired to the Z170 PCH, three PCI-Express 3.0 x1, and two legacy PCI slots. Storage connectivity includes an M.2 32 Gb/s slot, a SATA-Express 16 Gb/s connector, and six SATA 6 Gb/s ports. Display outputs include one each of DVI, D-Sub, and HDMI 2.0 connectors. USB connectivity includes two USB 3.1 ports (both type-A and on the rear panel), and six USB 3.0 (four on the rear panel, two by header), and four USB 2.0/1.1 ports by header. 6-channel HD audio with ground-layer isolation, and Realtek gigabit Ethernet make for the rest of it. The MSI Z170A PC Mate is priced at US $120.

Intel Skylake De-lidded, Reveals Tiny Die

When Japanese tech publication PC Watch got under the hood (lid) of a Core i7-6700K quad-core processor, what they found was an unexpectedly small silicon, that's shorter in proportion to its width, than previous dies from Intel, such as Haswell-D, and Ivy Bridge-D. It's smaller than even the i7-5775C, despite the same 14 nm process, because of its slimmer integrated graphics core with just 24 execution units (compared to 48 on the i7-5775C), and the lack of an external 128 MB SRAM cache for the iGPU.

The substrate Intel is using on the i7-6700K was found to be slimmer than the one on the i7-4770K, at 0.8 mm thick, compared to 1.1 mm on the latter. The thicker IHS (integrated heatspreader) makes up for the thinner substrate, so it shouldn't cause problems with using your older LGA1150 coolers on the new socket. Intel is using a rather viscous silver-based TIM between the die and the IHS. The die is closer to the center of the IHS than its predecessors were. PC Watch swapped out the stock TIM with Prolimatech PK-3 and Cool Laboratory Liquid Pro, and found some impressive drops in temperatures at stock speed (4.00 GHz) and with a mild overclock (4.60 GHz).


Source: PC Watch

GIGABYTE Unveils BRIX Mini-PC Powered by Celeron N3000 "Braswell" SoC

GIGABYTE unveiled its first BRIX mini-PC that's powered by Intel Celeron N3000 "Braswell" SoC. The 14 nm chip embeds a dual-core CPU based on the "Airmont" micro-architecture, clocked at 1.04 GHz, with a Turbo Boost frequency of 2.08 GHz; and featuring HyperThreading. Also embedded are 1 MB of cache, an 8th generation Intel IGP with 12 execution units, and a dual-channel DDR3L-1600 IMC.

The BRIX measures 56.1 mm x 107.6 mm x 114.4 mm, and is a barebones unit, you'll have to add your own memory and storage. Despite the chip's dual-channel memory interface, BRIX only offers one DDR3L SO-DIMM slot (max 8 GB). Storage connectivity includes an M.2 slot with both PCIe 2.0 x2 and SATA 6 Gb/s wiring, and a 9 mm thick 2.5-inch drive bay with SATA 6 Gb/s. A micro-SD slot is also offered. Network connectivity includes gigabit Ethernet. Display outputs include HDMI and D-Sub. 2-channel HD audio, and four USB 3.0 ports make for the rest of it.

Source: FanlessTech

Intel Debuts its 6th Generation Core Processor Family and Z170 Express Chipset

Intel announced its first 6th generation Core processors, codenamed "Skylake." Built on Intel's swanky new 14 nanometer silicon fab process, and in the new LGA1151 package, these processors bring DDR4 memory to the mainstream, and offer IPC improvements over the previous-generation Core "Haswell" and "Broadwell" processors. Making its debut at Gamescom, Intel is starting its lineup off with two chips that are predominantly targeted at the DIY gaming PC crowd, the Core i7-6700K and the Core i5-6600K quad-core processors. More models in the series will be launched towards the end of this month. The company also announced the Z170 Express chipset.

The Core i7-6700K features a nominal clock speed of 4.00 GHz, with a Turbo Boost frequency of 4.20 GHz. It features 8 MB of L3 cache, and HyperThreading. Its integrated Intel HD 530 graphics ticks at 350 MHz, with 1200 MHz Boost. The Core i5-6600K, on the other hand, features clock speeds of 3.50 GHz, with 3.90 GHz Turbo Boost. It features 6 MB of L3 cache, and lacks HyperThreading. It features the same integrated graphics solution as its bigger sibling. The TDP of both chips are rated at 91W. Both chips feature integrated memory controllers with support for DDR3L-1600 and DDR4-2133. The Core i7-6700K is priced around $350, and the i5-6600K around $243, in 1000-unit tray quantities. The retail packages of both chips will lack a stock cooling solution. The LGA1151 cooler mount will be identical to that of the outgoing LGA1150, so you shouldn't have any problems using your older cooler.

Apple Readies New iMac Desktops for Q3-2015

Apple is readying a new generation of iMac desktops, which it plans to launch in Q3-2015, likely at its September press event. The new Macs are expected to come with faster processors (likely Intel "Skylake,") faster DDR4 memory, and an increase in display resolutions across the board, including a 21.5-inch model with 4K Ultra HD (3840 x 2160 pixels) resolution, besides its 27-inch 5K (5120 x 2880 pixels) model. The display panels in these macs will feature a new LED phosphor material called KSF (K2SiF6:Mn), which improves color saturation. The displays will offer 30-bit (10 bpc) color depth, with the ability to produce 1.07 billion colors.

Intel Core "Skylake" Retail Boxes Surprisingly Colorful

The retail packaging of Intel's 6th generation Core "Skylake" processors in the LGA1151 package, will be surprisingly colorful, and a throwback to the pre-Pentium 4 era, according to spy-shots of the retail boxes of the upcoming Core i7-6700K and Core i5-6600K. What's even more surprising, is that packages of the i7-6700K and i5-6600K, which feature unlocked base-clock multipliers, making them primed for overclocking, do not include stock cooling solutions. Their retail packages resemble those of Intel's Core i7 HEDT processors. In the box, you'll find just the processor, its case-badge, and basic documentation.

Both the Core i7-6700K and Core i5-6600K feature the same integrated graphics SKU - HD Graphics 530. Both feature integrated memory controllers that support both DDR3L and DDR4 memory types. The Core i5 predictably lacks HyperThreading, and only features 6 MB of L3 cache, while the Core i7 features HyperThreading, and the full 8 MB present on the chip. The "Skylake" silicon will be built on the 14 nm process.

EVGA Announces the X99 Micro2 Motherboard

The EVGA X99 Micro2 takes all the great features from the EVGA X99 Micro motherboard, and upgrades it with USB 3.1 Type-C, increased SATA ports, improved layout design + BIOS and refreshed look. The EVGA X99 Micro2 offers a stunning set of features and overclocking support, along with EVGA's new GUI BIOS that focuses on the best overclocking support, functionality, and usability.

Get your PC future proof ready with the EVGA X99 Micro2 motherboard. This motherboard features the next generation USB 3.1 Type-C connector that delivers transfer speeds of up to 10Gb/s for unbelievable performance. Compact mATX form factor at 9.6in x 9.6in, yet still allows for enthusiast features such as SLI, robust SATA 6G expandability, M.2 support, incredible overclocking and more.

Intel and Micron Produce Breakthrough Memory Technology

Intel Corporation and Micron Technology, Inc. today unveiled 3D XPoint technology, a non-volatile memory that has the potential to revolutionize any device, application or service that benefits from fast access to large sets of data. Now in production, 3D XPoint technology is a major breakthrough in memory process technology and the first new memory category since the introduction of NAND flash in 1989.

The explosion of connected devices and digital services is generating massive amounts of new data. To make this data useful, it must be stored and analyzed very quickly, creating challenges for service providers and system builders who must balance cost, power and performance trade-offs when they design memory and storage solutions. 3D XPoint technology combines the performance, density, power, non-volatility and cost advantages of all available memory technologies on the market today. The technology is up to 1,000 times faster and has up to 1,000 times greater endurance3 than NAND, and is 10 times denser than conventional memory.

Skylake iGPU Gets Performance Leap, Incremental Upgrade for CPU Performance

With its 6th generation Core "Skylake" processors, Intel is throwing in everything it's got, into increasing performance of the integrated graphics. This is necessitated not by some newfound urge to compete with entry-discrete GPUs from NVIDIA or AMD, but a rather sudden increase in display resolutions, after nearly a decade of stagnation. Notebook and tablet designers are wanting to cram in higher resolution displays, such as WQHD (2560 x 1440), 4K (3840 x 2160), and beyond, and are finding it impossible to achieve them without discrete graphics. This is what Intel is likely after. The aftereffect of this effort would be that the iGPU will be finally capable of playing some games at 720p or 900p resolutions, with moderate eye-candy. Games such as League of Legends should be fairly playable, even at 1080p. Intel claims that its 9th generation integrated graphics will over a 50% performance increment over the previous generation.

Moving on to CPU, and the performance-increase is a predictable 10-20% single/multi-thread CPU performance, over "Broadwell." This is roughly similar to how "Haswell" bettered "Ivy Bridge," and how "Sandy Bridge" bettered "Lynnfield." Intel will provide platform support on some of its "Skylake-U" ultraportable variants, for much of the modern I/O used by today's tablets and notebooks, which required third-party controllers, and which competing semi-custom SoCs natively offer, such as eMMC 5.0, SDIO 3.0, SATA 6 Gb/s, PCIe gen 3.0, and USB 3.0. Communications are also improved, with 2x 802.11 ac, Bluetooth 4.1, and WiDi 6.0.

Source: FanlessTech

Thecus Announces N5810PRO NAS with Built-in UPS

Many electronic devices, including network-attached storage (NAS), are not designed to have their power supply suddenly cut. Unforeseen circumstances that result in power outages can cause data loss that could set back your business operations significantly.

To prevent such events from occurring with the Thecus N5810PRO, a built-in mini-UPS (Uninterruptible Power Supply) has been included with the unit. The mini-UPS battery provides emergency power if the main power source where to fail. In the event of a power failure the mini-UPS will stand by for approximately 30 seconds (dependent on services in operation). If power is restored within this time frame, the NAS will continue at its normal state. If power has not been restored, the NAS will commence shut down of all operations.

AMD Now Almost Worth A Quarter of What it Paid for ATI

It's been gloomy at the markets in the wake of the European economic crisis. This along with a revised quarterly outlook released by the company, hit AMD very hard over the past week. The AMD stock opened to a stock price of 1.87 down -0.09 or -4.59% at the time of writing this report, which sets the company's market capitalization at $1.53 billion. This is almost a quarter of what AMD paid to acquire ATI Technology, about a decade ago ($5.60 billion). Earlier this month, AMD took a steep fall of -15.59%, seeing its market cap drop by a quarter.

Intel is now worth $140.8 billion (92 times more), and NVIDIA $10.7 billion (7 times more). Among the issues affecting AMD are decline in PC sales and stiff competition. However, reasonably positive earnings put out by Intel disproves AMD's excuse that the market is to blame for bad performance, and the company could slide even further, hitting its all-time-low at the financial markets. The company will host an earnings call later today.
Source: Google Finance

Moore's Law Buckles as Intel's Tick-Tock Cycle Slows Down

Intel co-founder Gordon Moore's claim that transistor counts in microprocessors can be doubled with 2 years, by means of miniaturizing silicon lithography is beginning to buckle. In its latest earnings release, CEO Brian Krzanich said that the company's recent product cycles marked a slowing down of its "tick-tock" product development from 2 years to close to 2.5 years. With the company approaching sub-10 nm scales, it's bound to stay that way.

To keep Moore's Law alive, Intel adopted a product development strategy it calls tick-tock. Think of it as a metronome that give rhythm to the company. Each "tock" marks the arrival of a new micro-architecture, and each "tick" marks its miniaturization to a smaller silicon fab process. Normally, each year is bound to see one of the two in alternation.

Intel Reports Second-Quarter Revenue of $13.2 Billion

Intel Corporation today reported second-quarter revenue of $13.2 billion, operating income of $2.9 billion, net income of $2.7 billion and EPS of 55 cents. The company generated approximately $3.4 billion in cash from operations, paid dividends of $1.1 billion, and used $697 million to repurchase 22 million shares of stock.

"Second-quarter results demonstrate the transformation of our business as growth in data center, memory and IoT accounted for more than 70 percent of our operating profit and helped offset a challenging PC market," said Intel CEO Brian Krzanich. "We continue to be confident in our growth strategy and are focused on innovation and execution. We expect the launches of Skylake, Microsoft's Windows 10 and new OEM systems will bring excitement to client computing in the second half of 2015."

Realtek Develops New Onboard LAN Chip to Win Back Gamer Crowd

In a bid to regain market share lost to Intel and Killer (Qualcomm) in the DIY motherboard market, particularly with motherboards targeted at online gaming PC builds; Realtek unveiled a new onboard LAN solution called the Realtek Dragon. Intel and Killer have replaced Realtek as a preferred onboard Ethernet chip provider for DIY PC motherboards over the past two generations, as perception of their lower driver overhead, lower latencies, and other advantages spread. Sensing that merely improving drivers for its existing RTL8111 family of PCIe gigabit Ethernet PHY chips won't fix the situation, Realtek sought to give its latest generation an off-beat brand name that it hopes could appeal to the DIY crowd.

At the heart of the Realtek Dragon is the new RTL8118AS, a PCIe gigabit Ethernet PHY, much like the 8111 family. Realtek says it made refinements to the chip over previous generations, which will offer better performance (lower driver overhead) for traffic with small UDP packets, which is how most online multiplayer games work, and lower power consumption than competing solutions, such as the Killer E2200. Realtek even set a new branding for its chip, and will allow motherboard makers to print it on their PCBs, just as they print branding for Killer or Intel onboard LAN solutions. Realtek Dragon will make its debut with certain socket LGA1151 motherboards by ECS.


Source: Anandtech

Intel Announces Leadership Changes

Today Intel Corporation's CEO, Brian Krzanich, announced a series of leadership and organizational changes in a message to employees. Intel President Renée James informed the board that she will be stepping down as President of Intel to pursue an external CEO role. She has agreed to stay at Intel until January in order to transition the Executive Office. In connection with today's news, James today distributed an employee message about her plans.

In addition, other leadership and organizational changes that are being made to streamline operations and better position Intel for growth include: Arvind Sodhani, President of Intel Capital, will retire in January after a distinguished 35-year career with the company. President of Mergers and Acquisitions Wendell Brooks will take an expanded role to also become President of Intel Capital. Merging these teams under one leader will allow clear focus across all investment opportunities for Intel.

On July 1, the Intel Security organization - formerly the independent McAfee division - was formally integrated into Intel operations under the leadership of General Manager Chris Young. This integration will deliver better technologies for our customers and more effective operations that enable Intel Security to advance the state of security across the industry.

Intel to Debut its Core "Skylake" Processors at Gamescom 2015

Intel is expected to debut its 6th generation Core "Skylake" desktop processor family at Gamescom 2015, which will be held in Cologne, Germany, between 5th and 9th August. PC enthusiasts should look forward to two parts in particular, the Core i7-6700K, and the Core i5-6600K. The two quad-core chips will be built in the LGA1151 package, compatible with upcoming motherboards based on Intel's 100-series chipset. Motherboards based on the Intel Z170 Express chipset will allow CPU overclocking. The integrated memory controller of "Skylake" CPUs support both DDR3 and DDR4 memory standards, and should prove to be a transition point between the two.

Following the i7-6700K and i5-6600K with Z170 chipset motherboards, at Gamescom; Intel will launch other parts in the 6th gen. Core processor family between late-August and early-September. Those launches will include i7-6700/6700T, Core i5-6600, 6500, 6400, 6600T, 6500T and 6400T, and H170 and B150 chipsets. Then in late-September, the company will launch the entry-level H110 chipset.

Source: DigiTimes
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